Thermosyphon heat sink

Abstract

The application discloses a heat sink, a substrate and a heat dissipation fin. The substrate is divided into a first plate part and a second plate part along a first direction. The first plate part is provided with a first accommodating cavity for accommodating a phase change working medium. A heat dissipation station for mounting a heat source is arranged on the outer surface of the first plate part and corresponds to the first accommodating cavity. The heat dissipation fin is arranged on the second plate part and extends away from the first plate part along a second direction. An air-liquid passage is formed in the heat dissipation fin and is connected with the first accommodating cavity. The first direction is different from the second direction. The technical scheme solves the technical problem that the existing heat sink cannot achieve good heat dissipation effect when dissipating heat of a heat source which needs to extend in a space.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more particularly to a thermosiphon radiator. Background Technology

[0002] Over the past decade, with the rapid development of fields such as communication equipment, supercomputing, data mining, e-commerce, and artificial intelligence, the total demand for heat dissipation has increased dramatically. Device miniaturization has further increased power density, while also exacerbating the need for efficient cooling solutions.

[0003] In existing technologies, thermosiphon radiators can be used to dissipate heat from components with high heat flux density. However, when the location of the heat source requiring heat dissipation is fixed, and the space required for the heat dissipation end (e.g., heat dissipation fins) of the radiator to extend is limited, existing thermosiphon radiators cannot achieve good heat dissipation when dissipating heat sources with limited space for heat dissipation end (e.g., heat dissipation fins), which in turn affects the normal operating environment of the heat source. Summary of the Invention

[0004] Based on this, it is necessary to propose a thermosiphon radiator to address the above problems and solve the technical problem that existing thermosiphon radiators cannot achieve good heat dissipation when the space required for the heat dissipation end (e.g., heat dissipation fins) to extend is limited.

[0005] Therefore, this embodiment of the invention provides a thermosiphon radiator, comprising: a substrate and heat dissipation fins;

[0006] The substrate is divided into a first plate portion and a second plate portion along a first direction. The first plate portion has a first receiving cavity for containing a phase change working fluid. A heat dissipation station for installing a heat source is provided on the outer surface of the first plate portion corresponding to the first receiving cavity. The heat dissipation fins are provided on the second plate portion and extend away from the first plate portion along a second direction. A gas-liquid channel communicating with the first receiving cavity is formed in the heat dissipation fins. The first direction is different from the second direction.

[0007] In some embodiments of the thermosiphon radiator, the first direction is horizontal.

[0008] In some embodiments of the thermosiphon radiator, the second direction is the vertical direction.

[0009] In some embodiments of the thermosiphon radiator, a second receiving cavity is formed within the second plate portion, and the gas-liquid channel, the second receiving cavity, and the first receiving cavity are sequentially connected.

[0010] In some embodiments of the thermosiphon radiator, in the second direction, the bottom surface of the second receiving cavity is on the same plane as the bottom surface of the first receiving cavity, and the second receiving cavity contains a phase change working fluid.

[0011] In some embodiments of the thermosiphon radiator, the cavity formed by the first receiving cavity and the second receiving cavity is L-shaped.

[0012] In some embodiments of the thermosiphon radiator, in the second direction, the bottom height of the second receiving cavity is greater than or equal to the liquid level of the phase change working fluid in the first receiving cavity.

[0013] In some embodiments of the thermosiphon radiator, the second plate is divided into a first part and a second part along a second direction, the first part is connected to the first plate, the second receiving cavity is disposed in the first part, and the heat dissipation fins are disposed in the second part and partially extend to the first part.

[0014] In some embodiments of the thermosiphon radiator, one end of the gas-liquid channel is connected to the second receiving cavity, and the other end extends away from the second receiving cavity. In the second direction, the height of the end of the gas-liquid channel connected to the second receiving cavity is higher than the liquid level of the phase change working fluid in the first receiving cavity.

[0015] In some embodiments of the thermosiphon radiator, the substrate has a first plate surface, the heat dissipation fins are disposed on a portion of the first plate surface located in the second plate portion, and the heat dissipation station is disposed on a portion of the first plate surface located in the first plate portion.

[0016] In some embodiments of the thermosiphon radiator, the substrate has opposing first and second plate surfaces; the heat dissipation fins are disposed on a portion of the first plate surface located on the second plate surface, and the heat dissipation station is disposed on a portion of the second plate surface located on the first plate surface; or the heat dissipation fins are disposed on a portion of the second plate surface located on the second plate surface, and the heat dissipation station is disposed on a portion of the first plate surface located on the first plate surface.

[0017] In some embodiments of the thermosiphon radiator, the substrate further includes a third plate portion, which is disposed on the side of the first plate portion opposite to the second plate portion. A third receiving cavity communicating with the first receiving cavity is formed in the third plate portion. The heat dissipation fins are also provided on the third plate portion. The gas-liquid channels in the heat dissipation fins, the third receiving cavity, and the first receiving cavity are sequentially connected.

[0018] In some embodiments of the thermosiphon radiator, the cavity formed by the first receiving cavity, the second receiving cavity, and the third receiving cavity is U-shaped.

[0019] In some embodiments of the thermosiphon radiator, heat dissipation fins are also provided on the surface of the first plate portion away from the heat dissipation station. The heat dissipation fins are L-shaped, and the gas-liquid channels in the heat dissipation fins are connected to the first receiving cavity in the first plate portion.

[0020] In some embodiments of the thermosiphon radiator, a heat sink is also included, which is disposed on any side of the first plate other than the side where the heat sink is located.

[0021] In some embodiments of the thermosiphon radiator, the heat sink is disposed on the side opposite to the side where the heat sink is located on the first plate.

[0022] In some embodiments of the thermosiphon radiator, the heat dissipation element is a blown plate fin or a solid fin.

[0023] The embodiments of the present invention have the following beneficial effects:

[0024] In this invention, the substrate is divided into a first plate portion and a second plate portion along a first direction. The first receiving cavity of the first plate portion is connected to the gas-liquid channel disposed on the heat dissipation fins of the second plate portion. When the phase change working fluid in the first receiving cavity absorbs heat from the heat source and vaporizes, it can flow into the gas-liquid channel to dissipate heat, condense, and liquefy, and then flow back into the first receiving cavity. The heat dissipation station is disposed on the outer surface of the first plate portion corresponding to the first receiving cavity, and the heat dissipation fins are disposed on the second plate portion. Therefore, in the first direction, the heat dissipation fins are misaligned with the heat source. This misalignment allows the heat dissipation fins to be unrestricted by spatial obstruction in the extension direction, and the heat dissipation fins can extend in the second direction away from the first plate portion, thereby increasing the heat exchange area of ​​the heat dissipation fins and improving the heat dissipation efficiency. This technical solution solves the technical problem in the prior art that thermosiphon radiators cannot achieve good heat dissipation effect when the heat dissipation end (e.g., heat dissipation fins) needs to be restricted in the extension direction of the heat source. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] in:

[0027] Figure 1 A schematic diagram of the overall structure of a thermosiphon radiator in one embodiment is shown;

[0028] Figure 2 It shows Figure 1 The right view;

[0029] Figure 3 It shows Figure 1 The main view;

[0030] Figure 4 It shows Figure 1 Top view;

[0031] Figure 5 An exploded view of a thermosiphon radiator in one embodiment is shown;

[0032] Figure 6 An exploded view of a thermosiphon radiator in another embodiment is shown;

[0033] Figure 7 A schematic diagram of the overall structure of a thermosiphon radiator in another embodiment is shown;

[0034] Figure 8 It shows Figure 7 The exploded diagram.

[0035] Explanation of key component symbols:

[0036] 100. Thermosiphon radiator; 10. Substrate; 10a. First plate surface; 10b. Second plate surface; 11. First plate portion; 111. First receiving cavity; 112. Heat dissipation station; 12. Second plate portion; 121. First part; 1211. Second receiving cavity; 122. Second part; 13. Third plate portion; 131. Third receiving cavity; 20. Heat source; 30. Heat dissipation fins; 31. Gas-liquid channel; 40. Heat dissipation component; 50. Phase change working fluid. Detailed Implementation

[0037] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0038] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] See Figures 1-5 In this embodiment of the invention, a thermosiphon radiator 100 is provided. The thermosiphon radiator 100 cools heat-generating components through heat conduction, convection and phase change heat transfer of the phase change working fluid 50, such as the central processing unit and chips of power electronic devices, to ensure that the power electronic devices operate stably within the rated temperature range.

[0041] In addition, the direction of extension of the heat dissipation end of the radiator, i.e. the direction of extension of the heat dissipation fins in this embodiment, includes directly above the heat source, above the side, etc. As long as there is an obstruction whose projection in the vertical direction overlaps with the heat source, the extension direction of the heat dissipation end of the radiator can be considered to be obstructed.

[0042] To address the aforementioned technical problems, this embodiment provides a thermosiphon radiator, wherein, referring to... Figure 1-4 The heat sink includes a substrate 10 and heat dissipation fins 30; the substrate 10 is along a first direction (horizontal direction). Figure 2 The X-direction shown is divided into a first plate portion 11 and a second plate portion 12. The first plate portion 11 has a function for housing the phase change working medium 50 (see [reference]). Figure 5 The first receiving cavity 111; a heat dissipation station 112 for mounting a heat source 20 is provided on the outer surface of the first plate portion 11 corresponding to the first receiving cavity 111; heat dissipation fins 30 are provided on the second plate portion 12 and extend away from the first plate portion 11 along the second direction, and a gas-liquid channel 31 communicating with the first receiving cavity 111 is formed in the heat dissipation fins 30. It should be noted that when the phase change working fluid 50 in the first receiving cavity 111 absorbs the heat from the heat source 20 on the heat dissipation station 112 and is heated and vaporized, it can flow into the gas-liquid channel 31 to dissipate heat and condense and liquefy. The liquefied phase change working fluid 50 flows back into the first receiving cavity 111 along the gas-liquid channel 31.

[0043] In a preferred embodiment, the first direction and the second direction are perpendicular to each other. The first direction is... Figure 2 or Figure 7 The X direction shown is the second direction. Figure 2 or Figure 7 The Y direction is shown in the diagram. Of course, Figure 2 or Figure 7The X and Y directions refer to the horizontal and vertical directions, respectively. This only applies to the case where the substrate 10 is placed vertically. It can be understood that when the substrate 10 is placed in other states, the first and second directions will change accordingly. For example, when the substrate 10 is placed at an angle relative to the horizontal plane and the bottom surface of the substrate 10 is at a certain angle to the horizontal plane, the first direction is also at a certain angle to the horizontal plane, and the second direction is at a certain angle to the vertical plane.

[0044] In this invention, the substrate 10 is divided into a first plate portion 11 and a second plate portion 12 along a first direction (horizontal direction). The first receiving cavity 111 of the first plate portion 11 is connected to the gas-liquid channel 31 provided on the heat dissipation fins 30 of the second plate portion 12. This allows the phase change working fluid 50 in the first receiving cavity 111 to absorb heat from the heat source 20 and vaporize, then flow into the gas-liquid channel 31 to dissipate heat, condense, and liquefy, and flow back into the first receiving cavity 111. The heat dissipation station 112 is disposed on the outer surface of the first plate portion 11 corresponding to the first receiving cavity 111, and the heat dissipation fins 30 are disposed on the second plate portion 12. Therefore, in the first direction, the heat dissipation fins 30 and the heat source 20 are misaligned. The misalignment allows the heat dissipation fins 30 to be unrestricted by the space above the heat source 20, that is, the heat dissipation fins 30 can extend away from the first plate portion 11 in the second direction (vertical direction), thereby increasing the heat exchange area of ​​the heat dissipation fins 30 and improving the heat dissipation efficiency. This technical solution solves the technical problem that the thermosiphon radiator 100 in the prior art cannot achieve a good heat dissipation effect when dissipating heat from the heat source 20 whose heat dissipation end (e.g., heat dissipation fins) needs to be extended in a restricted direction.

[0045] In some embodiments, the second plate portion 12 is provided with a cavity or flow channel that connects the first receiving cavity 111 and the gas-liquid channel 31, so that the gaseous phase change working medium 50 flows to the gas-liquid channel 31 and the liquid phase change working medium 50 flows back to the first receiving cavity 111.

[0046] Specifically, please refer to Figure 2-6 A second receiving cavity 1211 is formed within the second plate portion 12, and the gas-liquid channel 31, the second receiving cavity 1211, and the first receiving cavity 111 are sequentially connected. This ensures that the gaseous phase change working fluid 50 formed by heating and evaporation can quickly diffuse through the second receiving cavity 1211 into the gas-liquid channel 31 of the heat dissipation fins 30, while providing sufficient reflux space for the liquid phase change working fluid 50 formed by condensation in the gas-liquid channel 31.

[0047] It should be noted that multiple heat dissipation fins 30 can be provided, and each heat dissipation fin 30 has a gas-liquid channel 31 formed within it. In this technical solution, the gas-liquid channel 31 of each heat dissipation fin 30 can be connected to the first receiving cavity 111, for example, through the second receiving cavity 1211 of the second plate portion 12 connected to the first receiving cavity 111. Thus, heat can be quickly transferred to each heat dissipation fin 30 through the phase change heat transfer of the phase change working fluid 50 and the diffusion motion of vapor, and then released into the environment through natural convection heat transfer or strong convection. Since phase change heat transfer can achieve a large heat exchange under a small temperature difference, and vapor diffusion is very rapid, the temperature difference between the heat source 20 and the heat dissipation fin 30 assembly is very small, which greatly reduces the thermal resistance from the heat source 20 to the heat dissipation fin 30 assembly and improves the heat dissipation efficiency of the thermosiphon radiator 100 for the heat source 20 directly above or where the space above is limited.

[0048] In one embodiment, please refer to Figure 6 In the second direction (e.g., the vertical direction), the bottom surface of the second receiving cavity 1211 is on the same plane as the bottom surface of the first receiving cavity 111. Therefore, the phase change working fluid 50 in the first receiving cavity 111 can flow into the second receiving cavity 1211, meaning that the second receiving cavity 1211 also contains the phase change working fluid 50. When the heat source 20 is arranged on the heat dissipation station 112 and contacts the first plate portion 11 for heat conduction, the phase change working fluid 50 is heated and can flow between the first receiving cavity 111 and the second receiving cavity 1211 to transfer heat. At the same time, the liquid phase change working fluid 50 is heated and evaporates into a gaseous phase change working fluid 50, which can diffuse into the gas-liquid channel 31 of the heat dissipation fins 30. The gaseous phase change working fluid 50 releases heat and condenses into a liquid phase change working fluid 50 in the gas-liquid channel 31 and flows back into the second receiving cavity 1211. Based on the connectivity between the first receiving cavity 111 and the second receiving cavity 1211, it continues to receive heat from the heat source 20.

[0049] In one embodiment, please refer to Figure 5The cavity formed by the first receiving cavity 111 and the second receiving cavity 1211 is L-shaped. At this time, the bottom surfaces of the first receiving cavity 111 and the second receiving cavity 1211 may not be on the same plane, and in the second direction, the height of the bottom surface of the second receiving cavity 1211 is greater than the height of the bottom surface of the first receiving cavity 111. Of course, the bottom surface of the second receiving cavity 1211 may be inclined towards the first receiving cavity 111, that is, the height of the end of the bottom surface of the second receiving cavity 1211 away from the first receiving cavity 111 in the second direction is greater than the height of the end closer to the first receiving cavity 111. This facilitates the return of the liquid phase change working fluid to the first receiving cavity 111 to continue absorbing heat, thereby improving the connectivity between the first receiving cavity 111 and the second receiving cavity 1211. This allows for better flow of the phase change working fluid 50 between the first receiving cavity 111 and the second receiving cavity 1211, further improving heat dissipation efficiency. Furthermore, in the second direction, the bottom height of the second receiving cavity 1211 is greater than or equal to the liquid level of the phase change working medium 50 in the first receiving cavity 111, so as to prevent the phase change working medium 50 in the first receiving cavity 111 from flowing into the gas-liquid channel 31 of the heat dissipation fins 30 through the second receiving cavity 1211, thereby preventing the heat exchange area of ​​the heat dissipation fins 30 from being affected.

[0050] In one embodiment, see Figure 2 The second plate portion 12 is divided into a first portion 121 and a second portion 122 along a second direction. The first portion 121 is connected to the first plate portion 11. A second receiving cavity 1211 is disposed in the first portion 121. Heat dissipation fins 30 are disposed in the second portion 122 and partially extend into the first portion 121. The first direction is the same as the vertical direction of the substrate 10. In this embodiment, the first direction is the Z direction shown in the figure.

[0051] In one embodiment, reference is made to... Figure 5 One end of the gas-liquid channel 31 is connected to the second receiving cavity 1211, and the other end extends away from the second receiving cavity 1211. In the second direction, the height of the end of the gas-liquid channel 31 connected to the second receiving cavity 1211 is higher than the liquid level of the phase change working medium 50 in the first receiving cavity 111, so as to prevent the liquid phase change working medium 50 in the first receiving cavity 111 from flowing into the gas-liquid channel 31 of the heat dissipation fins 30 and affecting the flow and heat dissipation of the gas phase change working medium 50.

[0052] In one embodiment, the substrate 10 has a first plate surface 10a, heat dissipation fins 30 are disposed on a portion of the first plate surface 10a located in the second plate portion 12 (not shown), and heat dissipation stations 112 are disposed on a portion of the first plate surface 10a located in the first plate portion 11 (not shown). By disposing of both the heat dissipation fins 30 and the heat dissipation stations 112 on the first plate surface 10a of the substrate 10, the heat dissipation function of the heat sink can be maintained when the space on the side opposite to the first plate surface 10a is obstructed, thus broadening its applicability.

[0053] In another embodiment, refer to Figure 4-5 The substrate 10 has opposing first plate surfaces 10a and second plate surfaces 10b. Heat dissipation fins 30 are disposed on a portion of the first plate surface 10a located in the second plate portion 12, and heat dissipation stations 112 are disposed on a portion of the second plate surface 10b located in the first plate portion 11; or heat dissipation fins 30 are disposed on a portion of the second plate surface 10b located in the second plate portion 12, and heat dissipation stations 112 are disposed on a portion of the first plate surface 10a located in the first plate portion 11. By distributing the heat dissipation fins 30 and the heat dissipation stations 112 separately on opposing first plate surfaces 10a and second plate surfaces 10b of the substrate 10, the heat source 20 and the heat dissipation fins 30 are avoided from being located on the same side of the substrate 10, reducing the interference of heat from the heat source 20 on the heat dissipation of the heat dissipation fins 30, and ensuring the heat exchange efficiency between the heat dissipation fins 30 and the environment.

[0054] See Figure 7 and Figure 8 In another embodiment, the substrate 10 further includes a third plate portion 13, which is disposed on the side of the first plate portion 11 opposite to the second plate portion 12. A third receiving cavity 131 communicating with the first receiving cavity 111 is formed within the third plate portion 13. Heat dissipation fins 30 are also provided on the third plate portion 13, and the gas-liquid channels 31, the third receiving cavity 131, and the first receiving cavity 111 within the heat dissipation fins 30 are sequentially connected. Therefore, heat dissipation fins 30 are provided above both sides of the heat source 20 to increase the number and area of ​​the heat dissipation fins 30, further solving the technical problem that the thermosiphon radiator 100 cannot achieve good heat dissipation effect when dissipating heat from the heat source 20 where the upper space is limited, thereby significantly improving the heat dissipation efficiency of the thermosiphon radiator 100.

[0055] In one embodiment, reference is made to... Figure 7-8 The cavity formed by the first receiving cavity 111, the second receiving cavity 1211, and the third receiving cavity 131 is U-shaped. Therefore, this embodiment further extends the heat dissipation fins 30 in the horizontal direction and ensures the fluidity of the phase change working medium 50 between the first receiving cavity 111, the second receiving cavity 1211, and the third receiving cavity 131, thereby further improving the heat dissipation efficiency.

[0056] The relative positional relationship between the bottom surface of the third receiving cavity 131 and the bottom surface of the first receiving cavity 111, the positional relationship between the height of the top surface of the third receiving cavity 131 and the liquid level of the phase change working fluid 50 in the first receiving cavity 111, and the arrangement positional relationship between the heat dissipation fins 30 and the third receiving cavity 131 on the third plate portion 13 can be referred to the description of the second receiving cavity 1211 and the heat dissipation fins 30 on the second plate portion 12 described above, and will not be repeated here.

[0057] In one embodiment, the thermosiphon radiator 100 further includes a heat sink 40, which is disposed on any side of the first plate portion 11 except for the side where the heat dissipation station 112 is located. That is, the heat received by the phase change working fluid 50 can be dissipated not only through steam but also through thermal conduction via the heat sink 40.

[0058] In one embodiment, reference is made to... Figure 1-6 The heat sink 40 is disposed on the side opposite to the side where the heat sink 112 is located on the first plate 11. This ensures that the heat sink 40 is not affected by the heat from the heat source 20, thereby guaranteeing the heat transfer efficiency of the heat sink 40 to the phase change working fluid 50.

[0059] In some specific embodiments, the heat sink 40 is a blown plate fin or a solid fin.

[0060] In some specific embodiments, refer to Figure 3-4 The projection of the first receiving cavity 111 onto the first plate surface 10a at least partially overlaps with the projection of the heat sink 40 onto the first plate surface 10a. Through heat conduction between the heat sink 40 and the first plate portion 11, the heat exchange area is increased, thereby improving the heat dissipation capacity of the thermosiphon radiator 100.

[0061] In some specific embodiments, refer to Figure 5-6 The projection of the heat source 20 on the first plate surface 10a is located within the projection of the phase change working medium 50 in the first receiving cavity 111 on the first plate surface 10a. Therefore, the heat source 20 disposed on the heat dissipation station 112 can be fully covered by the phase change working medium 50 in the first receiving cavity 111, preventing the heat source 20 and the substrate 10 from burning out.

[0062] In one embodiment, reference is made to... Figure 2 In the second direction, the first part 121 of the second plate 12 is higher than the first plate 11, so that the liquid phase change working medium 50 in the gas-liquid channel 31 can flow back into the first receiving cavity 111 under the action of gravity.

[0063] In some specific embodiments, refer to Figure 2 , Figure 5-6 In the second direction, the liquid level of the phase change working medium 50 is greater than the height of the heat source 20. Therefore, even if part of the phase change working medium 50 is heated and evaporates into gas, the remaining phase change working medium 50 in the first containment cavity 111 covers the entire heat source 20, ensuring sufficient contact between the phase change working medium 50 and the heat source 20, and improving the heat dissipation efficiency of the thermosiphon radiator 100.

[0064] In some other embodiments, instead of using the heat sink 40, heat sink fins 30 can be provided at the location of the heat sink 40. Specifically, the heat sink fins 30 are provided on the surface of the first plate portion 11 away from the heat dissipation station 112. The heat sink fins 30 are L-shaped, and the gas-liquid channel 31 in the heat sink fins 30 is connected to the first receiving cavity 111 in the first plate portion 11. In this way, when the space above the heat source 20 is blocked, the heat dissipation effect of the thermosiphon radiator 100 can be improved by increasing the heat sink fins 30 to bypass the obstacle and then extend upward.

[0065] It should be noted that, in the case of obstructed space above the heat source 20, heat dissipation fins 30 can be arranged around the substrate 10 except for the location of the heat source 20 to dissipate heat, and good heat dissipation effect can be achieved.

[0066] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A thermosiphon heat spreader, characterized by, include: Substrate and heat sink fins; The substrate is divided into a first plate portion and a second plate portion along a first direction. The first plate portion has a first receiving cavity for containing a phase change working fluid. A heat dissipation station for mounting a heat source is provided on the outer surface of the first plate portion at a position corresponding to the first receiving cavity. The heat dissipation fins are provided on the second plate portion and extend away from the first plate portion along a second direction. A gas-liquid channel communicating with the first receiving cavity is formed in the heat dissipation fins. The first direction is different from the second direction. The first direction is a horizontal direction. A second receiving cavity is formed within the second plate portion, and the gas-liquid channel, the second receiving cavity, and the first receiving cavity are sequentially connected; The second direction is the vertical direction.

2. The thermosiphon heat spreader of claim 1, wherein, In the second direction, the bottom surface of the second receiving cavity is on the same plane as the bottom surface of the first receiving cavity, and the second receiving cavity contains a phase change working fluid.

3. The thermosiphon heat spreader of claim 1, wherein, The cavity formed by the first receiving cavity and the second receiving cavity is L-shaped.

4. The thermosiphon heat spreader of claim 1, wherein, In the second direction, the bottom height of the second receiving cavity is greater than or equal to the liquid level of the phase change working fluid in the first receiving cavity.

5. The thermosiphon heat spreader of claim 1, wherein, The second plate is divided into a first part and a second part along a second direction. The first part is connected to the first plate. The second receiving cavity is disposed in the first part. The heat dissipation fins are disposed in the second part and extend partially into the first part.

6. The thermosiphon heat spreader of claim 1, wherein, One end of the gas-liquid channel is connected to the second receiving cavity, and the other end extends away from the second receiving cavity. In the second direction, the height of the end of the gas-liquid channel connected to the second receiving cavity is higher than the liquid level of the phase change working fluid in the first receiving cavity.

7. The thermosiphon heat spreader of any of claims 1-6, wherein, The substrate has a first plate surface, the heat dissipation fins are disposed on a portion of the first plate surface located in the second plate portion, and the heat dissipation station is disposed on a portion of the first plate surface located in the first plate portion.

8. The thermosiphon heat spreader of any of claims 1-6, wherein, The substrate has a first plate surface and a second plate surface opposite to each other; the heat dissipation fins are disposed on a portion of the first plate surface located on the second plate surface, and the heat dissipation station is disposed on a portion of the second plate surface located on the first plate surface; or the heat dissipation fins are disposed on a portion of the second plate surface located on the second plate surface, and the heat dissipation station is disposed on a portion of the first plate surface located on the first plate surface.

9. The thermosiphon heat spreader of claim 7, wherein, The substrate further includes a third plate portion, which is disposed on the side of the first plate portion opposite to the second plate portion. A third receiving cavity communicating with the first receiving cavity is formed in the third plate portion. The heat dissipation fins are also provided on the third plate portion. The gas-liquid channel in the heat dissipation fins, the third receiving cavity and the first receiving cavity are sequentially connected.

10. The thermosiphon heat spreader of claim 9, wherein, The cavity formed by the first receiving cavity, the second receiving cavity, and the third receiving cavity is U-shaped.

11. The thermosiphon heat spreader of claim 7, wherein, The heat dissipation fins are also provided on the surface of the first plate portion away from the heat dissipation station. The heat dissipation fins are L-shaped, and the gas-liquid channels in the heat dissipation fins are connected to the first receiving cavity in the first plate portion.

12. The thermosiphon heat spreader of claim 7, wherein, Further included is a heat dissipating member provided on either side of the first plate portion other than the side on which the heat dissipating station is provided.

13. The thermosiphon heat spreader of claim 12, wherein, The heat dissipating member is provided on the other side of the first plate portion opposite the side on which the heat dissipating station is provided.

14. The thermosiphon heat spreader of claim 12, wherein, The heat dissipating member is a blown plate fin or a solid fin.

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