Heat dissipation fins, thermosiphon heat sinks, and multidimensional heat dissipation devices
By implementing flow guide sections with obtuse angles and support members, the heat dissipation fins address poor medium flow in thermosiphon radiators, enhancing heat dissipation performance through optimized fluid circulation.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- グアンドン エンヴィクール テクノロジー カンパニーリミテッド
- Filing Date
- 2024-05-16
- Publication Date
- 2026-06-25
AI Technical Summary
Existing thermosiphon radiators face poor working medium flow due to the lack of flow guiding structures, leading to inadequate heat dissipation performance.
The introduction of flow guide sections with obtuse angles and support members in the heat dissipation fins and chambers to guide the flow of gaseous and liquid working media, enhancing their circulation within the thermosiphon radiator system.
Improves the flow efficiency of working media, resulting in enhanced heat dissipation performance by facilitating quicker gas entry into and liquid exit from the gas-liquid chamber, thereby improving the overall radiator's heat dissipation capabilities.
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