Measurement method and measurement device

By using a combination of reflective elements and detectors in the lithography equipment, the problem of substrate feature alignment in low-k1 lithography was solved, enabling higher precision measurement and control, and improving the stability of the lithography equipment and the accuracy of pattern reproduction.

CN114651214BActive Publication Date: 2026-06-30ASML NETHERLANDS BV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ASML NETHERLANDS BV
Filing Date
2020-10-20
Publication Date
2026-06-30

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Abstract

Apparatus and method for measuring one or more parameters of a substrate (300) using source radiation emitted from a radiation source (100) and directed onto the substrate (300). The apparatus includes at least one reflective element (710a) and at least one detector (720, 721). The at least one reflective element is configured to receive reflected radiation generated by reflection of the source radiation from the substrate, and also to reflect the reflected radiation into additional reflected radiation. The at least one detector is configured to measure the additional reflected radiation to determine at least the alignment of the source radiation and / or the substrate.
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