Driving control circuit, driving control method and display module

Abstract

The application provides a driving control circuit, a driving control method and a display module. The driving control circuit comprises a trigger circuit and a logic control circuit. The output end of the trigger circuit is electrically connected with the input end of the logic control circuit. The output end of the logic control circuit is electrically connected with a plurality of driving chips. The trigger circuit is used for sending a trigger signal to the logic control circuit. The logic control circuit is used for updating stored data state information in response to the trigger signal, generating a control signal according to the updated data state information and sending the control signal to the plurality of driving chips, so as to switch a master chip in the plurality of driving chips. The technical scheme of the application can effectively improve the problem of local overheating.

Description

Technical Field

[0001] The present application relates to a display driving technology, and in particular to a driving control circuit, a driving control method and a display module. Background Art

[0002] Heat generation is a significant and challenging issue for display modules, particularly in automotive applications. For display modules driven by multiple driver ICs, previous designs typically selected one driver IC as the master IC, with the remaining ICs acting as slaves. The master IC handles many functions, such as driving and boosting voltage. The monitored temperature in the area surrounding it is often higher than in other areas, leading to more severe heat generation. This can cause display discrepancies between these areas, impacting the display quality. The materials in these areas are also susceptible to aging and failure. Summary of the Invention

[0003] The embodiments of the present application provide a drive control circuit, a drive control method, and a display module to solve the problems existing in the related art. The technical solutions are as follows:

[0004] In a first aspect, an embodiment of the present application provides a drive control circuit, comprising: a trigger circuit and a logic control circuit;

[0005] The output terminal of the trigger circuit is electrically connected to the input terminal of the logic control circuit;

[0006] The output end of the logic control circuit is electrically connected to the plurality of driver chips;

[0007] The trigger circuit is used to send a trigger signal to the logic control circuit;

[0008] The logic control circuit is used to update the stored data state information in response to the trigger signal, generate a control signal according to the updated data state information, and send the control signal to the multiple driver chips to switch the master chip among the multiple driver chips.

[0009] In a second aspect, an embodiment of the present application provides a display module, comprising: a display panel, a plurality of driver chips, and a drive control circuit provided by any embodiment of the present application;

[0010] A plurality of driver chips are electrically connected to the display panel and are used to drive pixel units in the display panel;

[0011] The drive control circuit is connected to the multiple drive chips and is used to control the switching of the main chip among the multiple drive chips.

[0012] In a third aspect, an embodiment of the present application provides a drive control method, including:

[0013] The trigger circuit sends a trigger signal to the logic control circuit;

[0014] The logic control circuit updates the stored data state information in response to the trigger signal, generates a control signal according to the updated data state information, and sends the control signal to the plurality of driver chips to switch a master chip among the plurality of driver chips.

[0015] The advantages or beneficial effects of the above technical solution include at least:

[0016] Based on the cooperation of the trigger circuit and the logic control circuit, multiple driver chips can be controlled to switch the main chip among the multiple driver chips, so that the main chip is no longer fixed. The monitored temperature of each driver chip area can be more balanced, effectively improving the problem of local overheating, thereby improving the display effect and extending the material life of each driver chip area.

[0017] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0019] Figure 1 A schematic diagram of the structural framework of a display module provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of the structural framework of the drive control circuit provided in an embodiment of the present application;

[0021] Figure 3 A schematic diagram of the structural framework of another drive control circuit provided in an embodiment of the present application;

[0022] Figure 4 A schematic flow chart of a drive control method provided in an embodiment of the present application;

[0023] Figure 5 This is a schematic diagram of the principle of switching the main chip between multiple driver chips in an embodiment of the present application. DETAILED DESCRIPTION

[0024] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0025] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with their meanings in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0026] The following describes in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems with specific embodiments.

[0027] The embodiment of the present application provides a display module, such as Figure 1 As shown, the display module includes: a display panel 110 , a plurality of driving chips 120 and a driving control circuit 130 .

[0028] Multiple driver chips 120 are electrically connected to the display panel 110 for driving the pixel unit in the display panel 110, which may be composed of multiple sub-pixels, such as RGB (red, green, and blue) sub-pixels; the drive control circuit 130 is connected to the multiple driver chips 120 for controlling the switching of the main chip in the multiple driver chips 120.

[0029] Depending on their functions, the multiple driver chips 120 include master chips and slave chips. There can be at least one master chip, and all other chips are slave chips. The multiple driver chips 120 include at least one of a source driver chip (Source IC) and a gate driver chip (Gate IC). The gate driver chip can be replaced by a GOA (Gate Driver on Array) circuit.

[0030] The number of driver chips 120 can be set according to actual needs. Figure 1 The four driver chips 120 shown, IC1, IC2, IC3 and IC4, are only used as examples and are not limited to these in the present embodiment. Figure 1 In the example, IC1 is the master chip and the other three chips are slave chips. In actual usage scenarios, the number of master chips can be set according to actual needs.

[0031] The position of the driver chip 120 relative to the display panel 110 can be set according to actual needs. Figure 1 The four driver chips 120 shown, IC1 , IC2 , IC3 and IC4 , are located below the display panel 110 . This is only an example and is not limited in the present embodiment.

[0032] The embodiment of the present application provides a driving control circuit 130, such as Figure 2 and Figure 3 As shown, the driving control circuit 130 includes a trigger circuit 131 and a logic control circuit 132 .

[0033] An output terminal of the trigger circuit 131 is electrically connected to an input terminal of the logic control circuit 132 , and an output terminal of the logic control circuit 132 is electrically connected to the plurality of driving chips 120 .

[0034] The trigger circuit 131 is configured to send a trigger signal to the logic control circuit 132 to trigger the logic control circuit 132 to perform a corresponding operation. The logic control circuit 132 is configured to update the currently stored data state information in response to the trigger signal, generate a control signal based on the updated data state information, and send the control signal to the multiple driver chips 120 to switch the master chip among the multiple driver chips 120.

[0035] The trigger circuit 131 and the logic control circuit 132 in the driving control circuit 130 provided in the embodiment of the present application can cooperate with each other to control the multiple driving chips 120 to switch the main chip among the multiple driving chips 120, so that the main chip is no longer fixed. The monitored temperature of each driving chip area (i.e., the peripheral area of ​​the driving chip) can be more balanced, effectively improving the problem of local overheating, thereby improving the display effect and extending the material life of each driving chip area.

[0036] like Figure 3 As shown, the driving control circuit 130 in the embodiment of the present application may further include: a plurality of temperature sensors 133 .

[0037] The temperature sensors 133 are respectively disposed in the peripheral areas of the driver chips 120 ( Figure 3 (not shown) or integrated into multiple driver chips 120. Each temperature sensor 133 is communicatively connected to the input end of the trigger circuit 131, for example, via an I2C (Inter-Integrated Circuit, a two-wire serial bus) or other type of serial bus communication connection, which is not limited in this embodiment of the present application. The scope of the surrounding area can be determined according to actual needs.

[0038] The temperature sensor 133 may be used to monitor the temperature of the corresponding driver chip region and send the monitored temperature to the trigger circuit 131 .

[0039] By providing the temperature sensor 133 , the temperature near each driver chip 120 can be monitored in a timely manner, which is helpful for timely understanding the heating conditions in the area near each driver chip 120 , and taking corresponding intervention or prevention measures according to the heating conditions to avoid overheating.

[0040] Reference Figure 2 and Figure 3 The trigger circuit 131 in the embodiment of the present application includes: a timing controller (Timer Control Register, TCON) or a cycle timing circuit.

[0041] Reference Figure 3 In the case where the trigger circuit 131 includes a timing controller, an input end of the timing controller is communicatively connected to the plurality of temperature sensors 133 , and an output end of the timing controller is electrically connected to the logic control circuit 132 .

[0042] In an optional embodiment, the timing controller can be configured to determine whether the monitored temperature of the master chip region among the plurality of driver chip regions is greater than a preset temperature threshold, and if the monitored temperature is greater than the temperature threshold, send a trigger signal to the logic control circuit 132; otherwise, do not send a trigger signal to the logic control circuit 132. The trigger signal can be a pulse signal.

[0043] Based on this method, the timing controller can monitor and analyze the monitored temperature of the main chip area, determine the degree of heat and determine whether to trigger the logic control circuit 132 based on the degree of heat. When the monitored temperature of the main chip area is greater than the temperature threshold, that is, the main chip area is seriously heated, the logic control circuit 132 is triggered in time, which is highly targeted and real-time.

[0044] In another optional embodiment, the timing controller is used to: determine whether the monitored temperature of each driver chip area is greater than a preset temperature threshold; send a first trigger signal to the logic control circuit 132 when the monitored temperature of the master chip area among multiple driver chip areas is greater than the temperature threshold, and the monitored temperatures of the slave chip areas among multiple driver chip areas are less than or equal to the temperature threshold; send a second trigger signal to the logic control circuit 132 when the monitored temperature of the master chip area and the monitored temperature of at least one slave chip area are both greater than the temperature threshold; otherwise, do not send any trigger signal to the logic control circuit 132.

[0045] Based on this method, the timing controller can analyze the monitored temperature of each driver chip area, determine the degree of heat and determine whether to trigger the logic control circuit 132 based on the degree of heat. When only the monitored temperature of the master chip area is greater than the temperature threshold, that is, the master chip area is seriously heated, and when the monitored temperature of the master chip area and the monitored temperature of some slave chip areas are greater than the temperature threshold, that is, the master chip area and some slave chip areas are seriously heated, the logic control circuit 132 is triggered with different trigger signals respectively, which has high targeting and real-time performance, and can enable the logic control circuit 132 to accurately determine the slave chip that can be switched.

[0046] Reference Figure 2 In the case where the trigger circuit 131 includes a cycle timing circuit, the output end of the cycle timing circuit is electrically connected to the input end of the logic control circuit 132. The cycle timing circuit is used to intermittently send a trigger signal to the logic control circuit 132 according to a preset time interval.

[0047] Based on this method, the timing controller can trigger the logic control circuit 132 at a preset time interval. On the basis of ensuring a certain timeliness, there is no need to detect the monitoring temperature of the area near each driver chip, and there is no need to set up a temperature sensor 133, which can reduce hardware costs.

[0048] The logic control circuit 132 in the embodiment of the present application may include a latch or a register. Each driver chip 120 can be electrically connected to the latch or register through a master-slave control pin. The latch or register can cache data status information. After receiving the trigger signal sent by the trigger circuit 131, it can update the cached data status information and generate and output the corresponding control signal.

[0049] The control signal, the first control signal, the second control signal, etc. output by the logic control circuit 132 may include multiple sub-control signals and may be sent to multiple driver chips 120 through multiple connection paths.

[0050] The working principle of the drive control circuit provided in the embodiment of the present application will be described in detail in the subsequent method embodiments.

[0051] The embodiment of the present application provides a drive control method, which can be applied to the drive control circuit provided in the embodiment of the present application, such as Figure 4 As shown, the method includes:

[0052] S401: The trigger circuit sends a trigger signal to the logic control circuit.

[0053] S402 , the logic control circuit updates the stored data state information in response to the trigger signal, generates a control signal according to the updated data state information, and sends the control signal to the plurality of driver chips to switch the master chip among the plurality of driver chips.

[0054] The drive control method provided in the embodiments of this application, based on the coordination of a trigger circuit and a logic control circuit, can control multiple driver chips to switch the master chip among the multiple driver chips, eliminating the need for a fixed master chip. This allows for more balanced temperature monitoring across the driver chip regions, effectively alleviating local overheating issues, thereby improving display quality and extending the material life of each driver chip region.

[0055] In an optional implementation, in step S401, the trigger circuit sends a trigger signal to the logic control circuit, including:

[0056] The timing controller in the trigger circuit responds to the monitored temperature of the temperature sensor 133 corresponding to the main chip among the multiple driver chips received, and determines whether the monitored temperature of the main chip area is greater than the preset temperature threshold. If the monitored temperature of the main chip area is greater than the temperature threshold, a trigger signal is sent to the logic control circuit; otherwise, the timing controller maintains the current state and does not output any trigger signal.

[0057] Correspondingly, in step S402, the logic control circuit can update the stored data status information in response to the trigger signal, generate a corresponding control signal based on the updated data status information, and send the control signal to multiple driver chips, so that the chip type of the master chip in the multiple driver chips is switched to a slave chip, that is, the current master chip is used as a new slave chip, and the chip type of at least one slave chip is updated to a master chip, that is, the current at least one slave chip is used as a new master chip, so that the function of the master chip can be switched from one driver chip to another driver chip.

[0058] Based on this method, the timing controller can analyze the monitored temperature of the main chip area, determine the degree of heat and determine whether to trigger the logic control circuit based on the degree of heat. When the monitored temperature of the main chip area is greater than the temperature threshold, that is, the heat generation in the main chip area is serious, the logic control circuit is triggered in time. When triggered, the logic control circuit can switch the main chip based on control. This process is highly targeted and real-time.

[0059] In another optional implementation, in step S401, the trigger circuit sends a trigger signal to the logic control circuit, including:

[0060] The timing controller in the trigger circuit responds to the monitoring temperatures uploaded by the temperature sensors 133 corresponding to the multiple driver chips, and determines whether the monitoring temperature of each driver chip area is greater than a preset temperature threshold; when the monitoring temperature of the master chip area in the multiple driver chip areas is greater than the temperature threshold, and the monitoring temperatures of the slave chip areas in the multiple driver chip areas are less than or equal to the temperature threshold, a first trigger signal is sent to the logic control circuit; when the monitoring temperature of the master chip area and the monitoring temperature of at least one slave chip area in the multiple driver chip areas are greater than the temperature threshold, a second trigger signal is sent to the logic control circuit; otherwise, the timing controller maintains the current state and does not output any trigger signal.

[0061] Based on this method, the timing controller can analyze the monitored temperature of each driver chip area, determine the degree of heat and determine whether to trigger the logic control circuit based on the degree of heat. When only the monitored temperature of the master chip area is greater than the temperature threshold, that is, the master chip area is seriously heated, and when the monitored temperature of the master chip area and the monitored temperature of some slave chip areas are greater than the temperature threshold, that is, the master chip area and some slave chip areas are seriously heated, the logic control circuit is triggered with different trigger signals respectively, which has high targeting and real-time performance, and can enable the logic control circuit to accurately determine the slave chip that can be switched.

[0062] Correspondingly, in step S402, the logic control circuit may update the stored data status information in response to the first trigger signal, generate a first control signal based on the updated data status information, and send the first control signal to multiple driver chips, so that the chip type of the master chip in the multiple driver chips is updated to a slave chip, and the chip type of at least one slave chip is updated to a master chip; or, the logic control circuit may update the stored data status information in response to the second trigger signal, generate a second control signal based on the updated data status information, and send the second control signal to multiple driver chips, so that the chip type of the master chip in the multiple driver chips is updated to a slave chip, and the chip type of at least one slave chip whose monitored temperature is less than or equal to the temperature threshold is updated to a master chip.

[0063] When triggered by different trigger signals generated based on different heating conditions, the logic control circuit can accurately determine the slave chips available for switch among multiple driver chips, and then select a new master chip target from among the slave chips available for switch. Specifically, when triggered by a first trigger signal, the logic control circuit can select all slave chips as slave chips available for switch. When triggered by a second trigger signal, the logic control circuit can exclude slave chips whose monitored temperatures are greater than a temperature threshold and only select slave chips whose monitored temperatures are less than or equal to the temperature threshold as slave chips available for switch. This narrows the selection range for new master chips and only selects the corresponding chip as the master chip from slave chips that originally had mild heating, avoiding selecting a slave chip that already had severe heating as the new master chip, thereby exacerbating the heating level of the chip.

[0064] In another optional embodiment, in step S401, the trigger circuit sends a trigger signal to the logic control circuit, including:

[0065] The cyclic timing circuit in the trigger circuit intermittently sends a trigger signal to the logic control circuit according to a preset time interval.

[0066] In one example, a cyclic timing circuit may begin timing when the display module is illuminated and periodically send a pulse signal to the logic control circuit as a trigger signal, triggering the logic control circuit to perform a corresponding operation, such as updating data status information stored by the logic control circuit. The interval can be set according to actual needs.

[0067] Based on this method, the timing controller can trigger the logic control circuit at a preset time interval. On the basis of ensuring a certain timeliness, there is no need to detect the temperature of the area near each driver chip, and there is no need to set up a temperature sensor 133, which can reduce hardware costs.

[0068] Correspondingly, in step S402, the logic control circuit can update the stored data status information in response to the trigger signal, generate a corresponding control signal based on the updated data status information, and send the control signal to multiple driver chips, so that the chip type of the master chip in the multiple driver chips is switched to a slave chip, and the chip type of at least one slave chip is updated to a master chip.

[0069] The data status information in the embodiment of the present application can be a status code that represents the data status. For the combination of different chip types of multiple driver chips, multiple data states can be set, and multiple status codes can be set accordingly, so that the multiple status codes have a one-to-one correspondence with the multiple combinations of chip types.

[0070] by Figure 2 and Figure 3Taking the driver chip and its chip type (master chip or slave chip) shown in FIG. 1 as an example, the chip type combination corresponding to the status code 1000 can be IC1 as the master chip and the other three chips as slave chips, that is, Figure 2 and Figure 3 The chip type combination shown in the figure; the chip type corresponding to the status code 0100 (not shown in the figure) may be IC2 as the master chip and the other three chips as slave chips; the chip type corresponding to the status code 0010 (not shown in the figure) may be IC3 as the master chip and the other three chips as slave chips; the chip type corresponding to the status code 0001 (not shown in the figure) may be IC4 as the master chip and the other three chips as slave chips.

[0071] In actual usage scenarios, if there are more driver chips, the corresponding relationship between status codes and chip type combinations can be set according to the above rules. The status code position corresponding to the master chip is set to 1, and the status code position corresponding to the slave chip is set to 0. If there are more than two master chips, the status code positions of more than two can be set to 1, and the remaining status code positions can be set to 0.

[0072] In an embodiment of the present application, when the chip type of at least one current slave chip is switched to a master chip, the specific number of the at least one slave chip can be determined based on the number of current master chips. If there is only one current master chip, one slave chip will be used as the new master chip. If there are more than two current master chips, the same number of slave chips can be used as new master chips.

[0073] The current master chip as a slave chip and at least one of the current slave chips as a new master chip can be executed synchronously, so that the current slave chips do not include the new slave chip switched by the current master chip.

[0074] The drive control method provided in the embodiment of the present application can be executed multiple times to achieve multiple switching of the master chip. The switching can be performed in sequence according to a certain order, thereby achieving cyclic switching of the master chip, so that each driver chip has the opportunity to serve as the master chip. For example, an order can be set for multiple driver chips in advance. Each time the master chip is switched, the next available slave chip can be switched to the master chip according to the set order. The available slave chips can include all slave chips in the multiple driver chips, or only slave chips whose monitored temperature is less than or equal to the temperature threshold.

[0075] Figure 5 The principle of switching the main chip is shown below. Figure 3 and Figure 5 An optional implementation of the drive control method provided in the embodiment of the present application is introduced as follows using a specific example:

[0076] Assume the initial state is Figure 3As shown, the status code cached by the logic control circuit 132 is 1000, IC1 is the master chip, IC2 to IC4 are all slave chips, and the temperature sensor 133 integrated on each driver chip 120 collects the temperature near each driver chip 120 in real time as the monitoring temperature of each driver chip area.

[0077] During the first switching process, the timing controller (TCON) obtains temperature data near the master chip IC1 collected by the temperature sensor 133 corresponding to the master chip IC1. Based on the temperature data, the timing controller can determine whether the monitored temperature of the master chip IC1 is greater than a preset temperature threshold. If the monitored temperature of the master chip IC1 is greater than the temperature threshold, it may cause local overheating. The timing controller sends a pulse signal to the logic control circuit 132. Under the control of the pulse signal, the logic control circuit 132 updates the cached status code 1000 to 0100 and outputs a control signal corresponding to 0100 to the four driver chips 120. Under the control of the control signal, the chip type of IC1 is switched from master chip to slave chip, and the chip type of IC2 is switched from slave chip to master chip, thereby switching the master chip from IC1 to IC2, and IC3 and IC4 maintain the current chip type (slave chip) unchanged. If the monitored temperature of the master chip IC1 is less than or equal to the temperature threshold, the timing controller does not output a pulse signal, the logic control circuit 132 is not triggered and does not output a control signal, and the four driver chips 120 maintain the current chip type.

[0078] During the second switching process, the timing controller obtains the temperature data near the main chip IC2 collected by the temperature sensor 133 corresponding to the main chip IC2. Based on the temperature data, the timing controller can determine whether the monitored temperature of the main chip IC2 is greater than the preset temperature threshold; if the monitored temperature of the main chip IC2 is greater than the temperature threshold, it may cause local overheating. The timing controller sends a pulse signal to the logic control circuit 132. Under the control of the pulse signal, the logic control circuit 132 updates the cached status code 0100 to 0010 and outputs the control signal corresponding to 0010 to the four driver chips. Under the control of the control signal, the chip type of IC2 is updated from the master chip to the slave chip, and the chip type of IC3 is updated from the slave chip to the master chip, thereby switching the main chip from IC2 to IC3, and IC1 and IC4 maintain the current chip type (slave chip) unchanged; if the monitored temperature of the main chip IC2 is less than or equal to the temperature threshold, the timing controller does not output a pulse signal, the logic control circuit 132 is not triggered and does not output a control signal, and the four driver chips 120 maintain the current chip type.

[0079] The third and fourth switching processes are similar to the first and second switching processes and will not be described in detail. After the first three switching processes, the four driver chips 120 can take turns serving as the master chip. Each driver chip 120 will work as the master chip for a period of time to achieve a balanced heating effect, effectively improving the problem of localized overheating in the master chip area when the master chip is fixed. After the fourth switching process, IC1 becomes the master chip again, and the next round of cyclic switching can begin.

[0080] In the description of this specification, the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials, or characteristics described may be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification, as well as features of different embodiments or examples, unless they are mutually inconsistent.

[0081] The terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present application.

[0082] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0083] It should be further understood that the term "comprising" as used in this specification refers to the features, integers, steps, operations, elements and / or components stated, but does not exclude the existence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. The term "and / or" as used herein includes all or any unit and all combinations of one or more associated listed items.

[0084] Those skilled in the art will appreciate that the steps, measures, and schemes in the various operations, methods, and processes discussed in this application may be interchanged, modified, combined, or deleted. Furthermore, other steps, measures, and schemes in the various operations, methods, and processes discussed in this application may also be interchanged, modified, rearranged, decomposed, combined, or deleted. Furthermore, steps, measures, and schemes in the prior art that are similar to those disclosed in this application may also be interchanged, modified, rearranged, decomposed, combined, or deleted.

[0085] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0086] In this specification, "electrically connected" includes components connected together via an element having some electrical function. This "element having some electrical function" is not particularly limited as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0087] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0088] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the contents of this application.

[0089] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this application, and such modifications or substitutions should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A drive control circuit, characterized in that: include: trigger circuit, logic control circuit and multiple temperature sensors; The output end of the trigger circuit is electrically connected to the input end of the logic control circuit; The output end of the logic control circuit is electrically connected to a plurality of driver chips; The plurality of temperature sensors are respectively arranged in the peripheral areas of the plurality of driver chips, or are respectively integrated on the plurality of driver chips; each temperature sensor is communicatively connected to the input end of the trigger circuit; the temperature sensor is used to monitor the temperature of the corresponding driver chip area and send the monitored temperature to the trigger circuit; The trigger circuit is used to send a trigger signal to the logic control circuit based on the monitored temperature; The logic control circuit is configured to update the stored data state information in response to the trigger signal, generate a control signal according to the updated data state information, and send the control signal to the plurality of driver chips to switch a master chip among the plurality of driver chips; The trigger circuit includes a timing controller, an input end of the timing controller is communicatively connected to the plurality of temperature sensors, and an output end of the timing controller is electrically connected to the logic control circuit; The timing controller is configured to: determine whether the monitored temperature of each driver chip region is greater than a preset temperature threshold; send a first trigger signal to the logic control circuit when the monitored temperature of the master chip region in the multiple driver chip regions is greater than the temperature threshold and the monitored temperatures of the slave chip regions in the multiple driver chip regions are all less than or equal to the temperature threshold; and send a second trigger signal to the logic control circuit when the monitored temperature of the master chip region and the monitored temperature of at least one slave chip region are both greater than the temperature threshold; The logic control circuit is used to update the stored data status information in response to the first trigger signal, generate a first control signal based on the updated data status information, and send the first control signal to the multiple driver chips, so that the chip type of the master chip among the multiple driver chips is updated to a slave chip, and the chip type of at least one slave chip is updated to a master chip; or, the logic control circuit is used to update the stored data status information in response to the second trigger signal, generate a second control signal based on the updated data status information, and send the second control signal to the multiple driver chips, so that the chip type of the master chip among the multiple driver chips is updated to a slave chip, and the chip type of at least one slave chip whose monitored temperature is less than or equal to the temperature threshold is updated to a master chip.

2. The drive control circuit according to claim 1, wherein: The trigger circuit includes: a cycle timing circuit; The output end of the cycle timing circuit is electrically connected to the input end of the logic control circuit; The cycle timing circuit is used to intermittently send a trigger signal to the logic control circuit according to a preset time interval.

3. A display module, characterized in that: include: A display panel, a plurality of driver chips, and a driver control circuit according to claim 1 or 2; The plurality of driving chips are electrically connected to the display panel and are used to drive pixel units in the display panel; The driving control circuit is connected to the multiple driving chips and is used to control the switching of the master chip among the multiple driving chips.

4. A drive control method, characterized in that: include: The trigger circuit sends a trigger signal to the logic control circuit based on the temperature of the corresponding driver chip area monitored by the temperature sensor; The logic control circuit updates the stored data state information in response to the trigger signal, generates a control signal according to the updated data state information, and sends the control signal to the plurality of driver chips to switch the master chip among the plurality of driver chips; The trigger circuit sends a trigger signal to the logic control circuit based on the temperature of the corresponding driver chip area monitored by the temperature sensor, including: The timing controller in the trigger circuit determines whether the monitored temperature of each driver chip area is greater than a preset temperature threshold in response to the monitored temperatures uploaded by the temperature sensors corresponding to the multiple driver chips; sending a first trigger signal to the logic control circuit when the monitored temperature of the master chip region in the plurality of driver chip regions is greater than the temperature threshold and the monitored temperatures of the slave chip regions in the plurality of driver chip regions are all less than or equal to the temperature threshold; sending a second trigger signal to the logic control circuit when the monitored temperature of the master chip region and the monitored temperature of at least one slave chip region in the plurality of driver chip regions are both greater than the temperature threshold; The logic control circuit updates the stored data state information in response to the trigger signal, generates a control signal according to the updated data state information, and sends the control signal to the plurality of driver chips to switch the master chip among the plurality of driver chips, including: The logic control circuit updates the stored data state information in response to the first trigger signal, generates a first control signal according to the updated data state information, and sends the first control signal to the plurality of driver chips, so that the chip type of the master chip among the plurality of driver chips is updated to a slave chip, and the chip type of at least one slave chip is updated to a master chip; Alternatively, the logic control circuit updates the stored data status information in response to the second trigger signal, generates a second control signal based on the updated data status information, and sends the second control signal to the multiple driver chips, so that the chip type of the master chip among the multiple driver chips is updated to a slave chip, and the chip type of at least one slave chip whose monitored temperature is less than or equal to the temperature threshold is updated to a master chip.

5. The driving control method according to claim 4, characterized in that: The trigger circuit sends a trigger signal to the logic control circuit, comprising: The cyclic timing circuit in the trigger circuit intermittently sends a trigger signal to the logic control circuit according to a preset time interval.

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