A speaker with an integrated FPC and pad and an assembling method thereof

Abstract

The application relates to a loudspeaker with FPC and pad integrated molding and an assembling method thereof, which comprises a lower shell, a diaphragm, a magnetic circuit system, a voice coil and an FPC; the diaphragm and the lower shell constitute a corresponding sound cavity, the FPC is arranged in the sound cavity; the FPC is arranged in an integrated mode with a pad, the FPC is electrically connected with the pad, the lower shell is provided with a pad placement position, the pad is led out from the inside of the sound cavity and fixedly arranged in the pad placement position; the voice coil is electrically connected to the FPC through a voice coil lead line led out by the voice coil. The application changes the structure of a traditional loudspeaker, the FPC is arranged between the diaphragm and the lower shell, the voice coil and the voice coil lead line follow the diaphragm and the FPC to vibrate, and problems such as fatigue and fracture of the voice coil lead line are avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of loudspeakers, in particular to a loudspeaker with FPC and pad integrally formed and an assembling method thereof. BACKGROUND

[0002] A loudspeaker is a transducer that converts electrical signals into sound signals, and the performance of the loudspeaker greatly affects the sound quality. The loudspeaker is the weakest device in the sound equipment, but it is also the most important component for sound effect. A miniature loudspeaker module is provided in portable electronic devices such as portable mobile communication terminal devices, notebook computers, and MP3 players, which converts electrical signals into audio signals.

[0003] The existing loudspeaker has a voice coil following the vibration of a diaphragm, and a voice coil lead wire led out by the voice coil needs to be connected to an FPC or a pad. Therefore, one end of the voice coil lead wire vibrates and the other end does not, causing the voice coil lead wire to be easily fatigued and broken during the operation of the loudspeaker. Meanwhile, the FPC and the pad of the existing loudspeaker are separated, and the FPC needs to be connected to the pad through a welding process.

[0004] In view of the problems existing in the prior art, the present application aims to design a loudspeaker with FPC and pad integrally formed and an assembling method thereof. SUMMARY

[0005] In view of the problems existing in the prior art, the present application aims to design a loudspeaker with FPC and pad integrally formed and an assembling method thereof.

[0006] The technical scheme of the present application is as follows:

[0007] A loudspeaker with FPC and pad integrally formed, comprising a lower shell, a diaphragm, a magnetic circuit system, a voice coil, and an FPC.

[0008] The diaphragm and the lower shell form a corresponding acoustic cavity, and the FPC is arranged in the acoustic cavity.

[0009] The FPC and the pad are integrally formed, the FPC is electrically connected to the pad, the lower shell is provided with a pad placement position, the pad is led out from the inside of the acoustic cavity and fixedly arranged in the pad placement position.

[0010] The voice coil is electrically connected to the FPC through a voice coil lead wire led out therefrom.

[0011] Further, the FPC is hung on the upper end surface of the lower shell, the diaphragm is connected to the upper end surface of the FPC, and the voice coil is fixedly arranged on the lower end surface of the FPC.

[0012] Further, the FPC comprises an outer ring FPC and an inner ring FPC, the outer ring FPC is hung on the upper end surface of the lower shell;

[0013] The outer ring of the diaphragm is fixedly arranged on the upper end surface of the outer ring FPC, and the inner ring of the diaphragm vibrates along with the inner ring FPC.

[0014] Further, the inner ring FPC is provided with a plurality of voice coil connecting parts, and the voice coil is electrically connected to the voice coil connecting part through the voice coil lead-out wire.

[0015] Further, the solder pad is connected to the outer ring FPC, and the solder pad is led out from the outer ring FPC.

[0016] Further, the solder pad placement site is arranged on the lower end surface of the lower shell, and the solder pad is led out from the outer ring FPC and fixedly arranged on the solder pad placement site after being folded.

[0017] Further, the outer ring FPC and the inner ring FPC are electrically connected through a plurality of cantilevers.

[0018] Further, one side of the outer ring FPC, one side of the inner ring FPC and the corresponding cantilever jointly form an S-shaped structure.

[0019] Further, the lower shell comprises a base and a U-shaped cup, the base comprises a make room step and an outer ring protruding edge arranged on the periphery of the make room step, the shape of the outer ring FPC is the same as the upper end surface of the outer ring protruding edge, the shape of the inner ring FPC is smaller than the inner concave surface of the U-shaped cup, and the make room step is arranged to make room for the vibration path of the cantilever.

[0020] Further provided is an assembling method of a FPC and solder pad integrated loudspeaker, for assembling the FPC and solder pad integrated loudspeaker as described, comprising the following steps:

[0021] The voice coil is fixedly connected to the lower end surface of the FPC, and the voice coil is electrically connected to the FPC;

[0022] The unfolded FPC is arranged on the upper surface of the lower shell;

[0023] The solder pad integrated with the FPC is pulled or stretched to the solder pad placement site, and the solder pad is fixedly connected to the solder pad placement site;

[0024] The diaphragm cover is arranged on the upper end surface of the FPC.

[0025] The advantages of the present application are:

[0026] In this invention, the FPC is disposed inside the sound cavity, and the pads and FPC are integrally formed. The pads are led out from the portion of the FPC located inside the sound cavity and are positioned at the pad placement location. The voice coil is electrically connected to the FPC through its lead wire 401, used to transmit digital signals from the pads to the voice coil.

[0027] This application changes the structure of traditional loudspeakers by placing the FPC between the diaphragm and the lower housing. The voice coil and its lead wires vibrate with the diaphragm and FPC, thus avoiding problems such as voice coil lead wire fatigue and breakage.

[0028] The pad placement position of this application is located on the lower end face of the lower housing. The pad is led out from the outer ring FPC and folded and fixedly placed in the pad placement position. This structure can realize the integral molding of the pad and FPC.

[0029] The assembly method provided in this application reduces the steps required to connect the solder pads and FPC in traditional speaker assembly. The PFC can be directly pulled, stretched, and bent to the solder pad placement position by an operator or mechanical equipment. This improves work efficiency. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the loudspeaker provided by the present invention.

[0031] Figure 2 for Figure 1 B-B sectional view.

[0032] Figure 3 An exploded view of the speaker structure provided by the present invention.

[0033] Figure 4 This is a schematic diagram of the FPC structure.

[0034] Figure 5 This is a schematic diagram of the structure of the speaker with a hidden diaphragm provided by the present invention.

[0035] Figure 6 This is a schematic diagram of the rear structure of the speaker provided by the present invention.

[0036] Figure 7 This is a schematic diagram of the explosion of the FPC, base, and U-cup.

[0037] Figure 8 -11 is a graph showing the experimental data results. Detailed Implementation

[0038] To facilitate understanding by those skilled in the art, the structure of the present invention will now be described in further detail with reference to the accompanying drawings:

[0039] Example 1

[0040] Reference Figure 1 7. A speaker with FPC and pad integrated, comprising: a lower shell 1, a diaphragm 2, a magnetic circuit system 3, a voice coil 4 and an FPC 5;

[0041] The diaphragm 2 and the lower shell 1 form a corresponding sound cavity, and the FPC 5 is arranged in the sound cavity; in this embodiment, the FPC 5 is arranged in the sound cavity as a component for transmitting audio signals, and is connected to an audio signal output point of an external circuit through a pad 6, so that the audio signal is transmitted to the FPC 5 through the pad 6.

[0042] The FPC 5 is integrally formed with the pad 6, the FPC 5 is electrically connected to the pad 6, the lower shell 1 is provided with a pad placement position, and the pad 6 is led out from the inside of the sound cavity and fixedly arranged on the pad placement position; in this embodiment, since the FPC 5 is arranged in the sound cavity, and the pad 6 and the FPC 5 are integrally formed, the pad 6 is led out from the part of the FPC 5 located in the sound cavity, and the led-out pad 6 can be arranged on the pad placement position. The position of the pad placement position can be the lower end face of the lower shell 1, or the upper end face of the lower shell 1, which is not limited here.

[0043] The voice coil 4 is electrically connected to the FPC 5 through the voice coil lead 401 led out therefrom. In this embodiment, the voice coil 4 is a component for receiving digital signals and cooperating with the magnetic circuit system 3 to generate vibration, and the voice coil 4 receives digital signals from the FPC 5 through the voice coil lead 401.

[0044] The above is the most basic composition of this embodiment. The optimization direction of this embodiment is introduced below.

[0045] Further, the FPC 5 is hung on the upper end face of the lower shell 1, the diaphragm 2 is connected to the upper end face of the FPC 5, and the voice coil 4 is fixedly arranged on the lower end face of the FPC 5. The voice coil 4 can be connected to the lower end face of the FPC 5 by gluing, and the diaphragm 2 can be connected to the upper end face of the FPC by gluing. The traditional speaker is that the diaphragm is hung on the upper end face of the lower shell. This embodiment changes the structure of the traditional speaker, and the FPC 5 is arranged between the diaphragm 2 and the lower shell 1, and the voice coil 4 and the voice coil lead 401 thereof all vibrate with the diaphragm 2 and the FPC 5. Since the voice coil lead is connected between the pad and the voice coil in the traditional structure, one end vibrates and the other end does not move, which causes defects such as easy fatigue and fracture of the voice coil lead. The present application can well avoid this problem.

[0046] Further, the FPC 5 comprises an outer ring FPC 501 and an inner ring FPC 502, the outer ring FPC 501 is hung on the upper end face of the lower shell 1;

[0047] The outer ring of the diaphragm 2 is fixedly arranged on the upper end surface of the outer ring FPC 501, and the inner ring of the diaphragm 2 vibrates with the inner ring FPC 502.

[0048] Further, the inner ring FPC 502 is provided with a plurality of voice coil connecting portions 504, and the voice coil 4 is electrically connected to the voice coil connecting portions 504 through the voice coil lead wires 401 led therefrom.

[0049] Further, the soldering pad 6 is connected to the outer ring FPC 501, and the soldering pad 6 is led from the outer ring FPC 501.

[0050] Further, the soldering pad placement position is arranged on the lower end surface of the lower shell 1, and the soldering pad 6 is fixedly arranged on the soldering pad placement position after being led from the outer ring FPC 501 and being folded. In the embodiment, the soldering pad placement position is arranged on the lower end surface of the lower shell 1, and the FPC 5 is arranged on the upper end surface of the lower shell 1, so that the soldering pad 6 needs to be folded after being led to correspond to the lower end surface of the lower shell 1. In other embodiments, the soldering pad placement position can also be placed at other positions, and the soldering pad 6 can be placed at the position after being led.

[0051] Further, the outer ring FPC 501 and the inner ring FPC 502 are electrically connected through a plurality of cantilevers 503. One side of the outer ring FPC 501, one side of the inner ring FPC 502, and the corresponding cantilever 503 together form an S-shaped structure. In the embodiment, the cantilever 503 is connected between one side of the outer ring FPC 501 and one side of the inner ring FPC 502 in the form of a diagonal line, thereby forming an S-shaped structure. The structure can provide support for the inner ring FPC 502 and also provide an elastic structure for vibration. Under the same displacement, the longer the FPC 5, the smaller the stress of the cantilever 504.

[0052] Further, with reference to Figure 7 , the lower shell 1 includes a base 101 and a U-shaped cup 102, the base 101 includes a let-in step 1011 and an outer ring protrusion 1012 arranged on the periphery of the let-in step 1011, the shape of the outer ring FPC 501 is the same as the upper end surface of the outer ring protrusion 1012, the shape of the inner ring FPC 502 is smaller than the inner concave surface of the U-shaped cup 102, and the let-in step 1011 is arranged to let in the vibration path of the cantilever 503.

[0053] In this embodiment, the upper end surface of the outer ring protrusion 1012 is rectangular, and no recess or allowance is provided. The outer ring FPC 501 is also rectangular in shape, and has the same area, length and width as the outer ring protrusion 1012. This can maximize the area of the FPC 5. Since the FPC 5 serves to connect the voice coil and the diaphragm in this embodiment, a larger area can provide more elastic force. The allowance step 1011 can effectively prevent the FPC 5 from touching other components during vibration, thereby preventing rolling vibration. In existing speakers, the FPC 5 and the solder pad 6 are usually on the same horizontal plane. In order to prevent the FPC 5 from colliding with the solder pad 6 during vibration, the position of the FPC 5 near the solder pad 6 needs to be provided with an allowance. This will sacrifice the area of the FPC 5, thereby reducing the elastic force that the FPC 5 can provide. In this application, the solder pad 6 and the FPC 5 are not on the same horizontal plane, and the FPC 5 is on the upper end surface of the outer ring protrusion 1012. The FPC 5 can be provided with the same area as the outer ring protrusion 1012, or can be considered to be provided with the same area as the maximum cross section of the lower shell.

[0054] Further provided is an assembly method of a speaker with an integrally formed FPC and solder pad, for assembling a speaker with an integrally formed FPC and solder pad as described above, comprising the following steps: It should be noted that the steps of this embodiment can also be performed in no particular order.

[0055] S1, fixedly connecting the voice coil to the lower end surface of the FPC, and electrically connecting the voice coil to the FPC; In this step, the voice coil is fixedly connected to the lower end surface of the inner ring FPC.

[0056] S2, arranging the unfolded FPC on the upper surface of the lower shell; In this step, the FPC and the solder pad are arranged in the same plane in an unfolded state, and the FPC is extended and connected to the solder pad. At this time, the outer ring FPC of the FPC is bonded to the edge of the upper end surface of the lower shell.

[0057] S3, pulling or stretching the solder pad integrally formed on the FPC to the solder pad placement position, and fixedly connecting the solder pad to the solder pad placement position; In this embodiment, the FPC is arranged on the upper end surface of the lower shell, and the solder pad placement position is arranged on the lower end surface of the lower shell. Therefore, the solder pad needs to be pulled from the upper end surface of the lower shell and then folded, and a fold is pressed out along the outer edge of the lower shell. After folding, the solder pad is placed on the solder pad placement position, and the solder pad is fixedly connected or welded to the solder pad placement position.

[0058] S4, arranging the diaphragm cover on the upper end surface of the FPC.

[0059] Experimental data

[0060] The loudspeaker provided in the above embodiment one is used to make sound simulation, reference Figure 8 -11, wherein Figure 8 is a sound simulation data graph of the loudspeaker provided in the above embodiment one, the shape of the outer ring FPC is the same as the upper end surface of the outer ring convex edge, Figure 9 is a sound simulation data graph of the loudspeaker without FPC arranged between the diaphragm and the lower shell, Figure 10 is a sound simulation data graph of the loudspeaker provided in the above embodiment one and only shows the experimental data of the FPC and the voice coil, Figure 11 is a sound simulation data graph of the loudspeaker without FPC arranged between the diaphragm and the lower shell and only shows the voice coil. It can be seen that the maximum displacement of the sound simulation of the loudspeaker provided in the above embodiment one is 3.1mm, and the maximum displacement of the sound simulation of the loudspeaker without FPC arranged between the diaphragm and the lower shell is 3.7mm. Through the structure of the FPC and the solder pad being integrally formed, the connecting line of the FPC and the solder pad is arranged on the outer side of the lower shell, the space of the structure originally arranged with the connecting line in the lower shell is released, the area of the FPC is as large as possible to be the same as the area of the upper end surface of the lower shell and the diaphragm, the diaphragm is maximally supported and elastically acted, the deviation of the diaphragm in the sound production process is reduced, and the sound production effect is improved.

[0061] Through the above steps, the method reduces the process of connecting the solder pad and the FPC in the traditional loudspeaker assembly process, and directly pulls, stretches and bends the connection between the PFC and the solder pad to the solder pad placement position by the operator or the mechanical equipment. The working efficiency is improved.

[0062] It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unitary claim, several of the apparatuses mentioned in the above description can be implemented by the same item of hardware. The use of the words "first", "second" and "third" does not imply any order. These words are used to name the elements.

[0063] Although preferred embodiments of the application have been described, a person of ordinary skill in the art, once aware of the basic inventive concept, can make additional changes and modifications to the embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the application.

[0064] Obviously, various modifications and changes are possible in the present application without departing from the spirit and scope of the application. Accordingly, it is intended that all claims encompass such modifications and changes as fall within the scope of the application.

[0065] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through intermediate medium, can be internal communication of two elements or interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0066] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0067] The above is only the preferred embodiment of the present application, and any equivalent changes and modifications made within the scope of the patent application of the present application shall be within the scope of the present application.

Claims

1. An FPC and pad integrally formed speaker, characterized by: Comprise: Lower shell, diaphragm, magnetic circuit system, voice coil and FPC; The diaphragm and the lower shell constitute a corresponding sound cavity, and the FPC is arranged in the sound cavity; The FPC is integrally formed with the solder pad, the FPC is electrically connected with the solder pad, the lower shell is provided with a solder pad placement position, and the solder pad is led out from the inside of the sound cavity and fixedly arranged on the solder pad placement position; The voice coil is electrically connected to the FPC through the voice coil lead-out wire led out therefrom; The FPC includes an outer ring FPC and an inner ring FPC, the outer ring FPC and the inner ring FPC are electrically connected through a plurality of suspension arms, the solder pad is connected to the outer ring FPC, the solder pad is led out from the outer ring FPC, the solder pad placement position is arranged on the lower end surface of the lower shell, and the solder pad is led out from the outer ring FPC and fixedly arranged on the solder pad placement position after being folded; The inner ring FPC is provided with a plurality of voice coil connecting parts, the voice coil lead-out wire led out therefrom is electrically connected to the voice coil connecting part, and the voice coil connecting part is arranged at a rectangular corner of the inner ring FPC. The upper end surface of the outer ring protruding edge is rectangular, and no concave or accommodation is arranged, the outer ring FPC has the same shape as the outer ring protruding edge, and the outer ring FPC and the outer ring protruding edge are rectangular with equal area, length and width.

2. The FPC and pad integrally formed speaker of claim 1, wherein: The FPC is hung on the upper end surface of the lower shell, the diaphragm is connected to the upper end surface of the FPC, and the voice coil is fixedly arranged on the lower end surface of the FPC.

3. The FPC and pad integrally formed speaker of claim 2, wherein: The outer ring FPC is hung on the upper end surface of the lower shell; The outer ring of the diaphragm is fixedly arranged on the upper end surface of the outer ring PFC, and the inner ring of the diaphragm vibrates with the inner ring FPC.

4. The FPC and pad integrally formed speaker of claim 1, wherein: The side of the outer ring FPC, the side of the inner ring FPC and the corresponding suspension arm jointly constitute an S-shaped structure.

5. The FPC and pad integrally formed speaker of claim 1, wherein: The lower shell comprises a base and a U cup, the base comprises an accommodation step and an outer ring protruding edge arranged on the periphery of the accommodation step, the shape of the outer ring FPC is the same as the upper end surface of the outer ring protruding edge, the shape of the inner ring FPC is smaller than the concave surface of the U cup, and the accommodation step accommodates the vibration path of the suspension arm.

6. An assembling method of the FPC and pad integrated loudspeaker, used for assembling the FPC and pad integrated loudspeaker as claimed in any one of claims 1-5, characterized in that: The steps include: The voice coil is fixedly connected to the lower end surface of the FPC, the voice coil is electrically connected to the FPC, and the voice coil lead-out wire is led out to the voice coil connecting part of the rectangular corner of the inner ring FPC; The unfolded FPC is arranged on the upper surface of the lower shell; The solder pad integrally formed on the FPC is pulled or stretched to the solder pad placement position, and the solder pad is fixedly connected to the solder pad placement position; The diaphragm cover is arranged on the upper end surface of the FPC.

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