Atomized substrate, slurry for manufacturing atomized substrate, and method for manufacturing atomized substrate

Abstract

An atomizing substrate includes a loose layer and a dense layer, a surface of the loose layer is a liquid permeation surface, a surface of the dense layer is an atomizing surface, a plurality of pore structures are formed in the loose layer and the dense layer, a pore diameter of the pore structure in the loose layer is greater than a pore diameter of the pore structure in the dense layer, a thickness of the loose layer is greater than a thickness of the dense layer, and an atomizing liquid permeates into the atomizing substrate from the liquid permeation surface. The application also includes a slurry for manufacturing the atomizing substrate and a manufacturing method of the atomizing substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of materials and electronic atomization, and in particular to an atomization substrate, a slurry for manufacturing an atomization substrate, and a manufacturing method of an atomization substrate. BACKGROUND

[0002] Existing atomization devices are widely used in the fields of smoking devices and medical atomization, and the key to atomization products lies in the use of atomization cores. Existing atomization cores generally include cotton cores and ceramic cores. The cotton cores are made of organic cotton and have the advantages of high reduction degree, but also have the disadvantages of easy burning and the like. The ceramic cores have the advantages of easy assembly and stable performance, and are more widely used. Both the cotton cores and the ceramic cores have the problem of easy oil leakage. When the pore size of the ceramic core is large, the permeation efficiency of the tobacco oil is high, but the oil is easy to leak. If the pore size is small, the permeation of the tobacco oil is difficult, causing dry burning. Patent application No. 201910740263.9 of the People's Republic of China discloses a ceramic core for solving the above technical problems. The ceramic core is manufactured by using a flow casting process. Specifically, three different ceramic slurries are used to form a green body by layer flow casting, and then sintering is performed to form a three-layer structure with different pore sizes. The pore size of the liquid permeation surface is large to facilitate the rapid permeation of the atomization liquid, and the pore size of the atomization surface is small to prevent large molecules from passing through, thereby achieving the effect of preventing liquid leakage.

[0003] However, the above manufacturing method is complex, requires multiple flow casting processes or increases the slurry coating process, and the uncontrollable factors in the process increase, resulting in a large increase in yield and cost. SUMMARY

[0004] Therefore, it is necessary to provide an atomization substrate with a simple and controllable manufacturing process and performance meeting the requirements, a slurry for manufacturing an atomization substrate, and a manufacturing method of an atomization substrate.

[0005] To solve the above technical problems, the present application provides an atomization substrate, which comprises a loose layer and a dense layer. The surface of the loose layer is a liquid permeation surface, and the surface of the dense layer is an atomization surface. A plurality of pore structures are formed in the loose layer and the dense layer. The pore size of the pore structure in the loose layer is larger than the pore size of the pore structure in the dense layer. The thickness of the loose layer is greater than the thickness of the dense layer. Atomization liquid permeates into the atomization substrate from the liquid permeation surface.

[0006] Preferably, the pore size of the pore structure in the loose layer is between 30-120um, and the pore size of the pore structure in the dense layer is between 10-45um.

[0007] Preferably, the pore size of the pore structure in the loose layer is between 30-80um, and the pore size of the pore structure in the dense layer is between 10-30um.

[0008] Preferably, the pore size of the pore structure in the loose layer is between 40-50um, and the pore size of the pore structure in the dense layer is between 12-30um.

[0009] Preferably, the atomization substrate further comprises a transition layer between the loose layer and the dense layer, and the pore size of the pore structure in the transition layer is between 10-80um.

[0010] Preferably, the thickness of the atomization substrate is 1-3mm, the porosity is 44%-74%, and the thickness of the dense layer is between 0.02-0.3um.

[0011] Preferably, the porosity of the atomization substrate is 53%-60%.

[0012] Preferably, the porosity of the atomization substrate is 60%-65%.

[0013] Preferably, the thickness of the atomization substrate is 2mm.

[0014] To solve the above technical problems, the application further provides a slurry for manufacturing an atomization substrate, comprising the following components: 2-9wt% of a binder, 1-4wt% of a dispersant, 20-30wt% of ceramic powder, 15-26wt% of a pore-forming agent, and 41-47wt% of an organic solvent.

[0015] Preferably, the organic solvent is pure NMP (N-methyl pyrrolidone) or NMP containing a small amount of non-solvent water (1-10vt%); the dispersant is one or more of PVP (polyvinyl pyrrolidone), DSP (disodium hydrogen phosphate), and TEOA (triethanolamine); the pore-forming agent comprises one or more of starch, graphite, wood chips, and sucrose; and the binder is one or more of PESF (polyphenyl ether sulfone), PES (polyether sulfone), PVB (polyvinyl butyral), and PMMA (polymethyl methacrylate).

[0016] Preferably, the components of the slurry comprise 2-4wt% of a binder, 1-3wt% of a dispersant, 23-26wt% of ceramic powder, 20-25wt% of a pore-forming agent, and 43-47wt% of an organic solvent.

[0017] Preferably, the slurry comprises 2.9-3.1wt% of polyether sulfone, 1.4-1.6wt% of polyvinyl pyrrolidone, 25-26wt% of ceramic powder, 23-24wt% of graphite powder, and 45-47wt% of N-methyl pyrrolidone.

[0018] Preferably, the slurry comprises 6-9wt% of the binder, 1-2wt% of the dispersant, 27-29wt% of the ceramic powder, 15-19wt% of the pore-forming agent, and 43-45wt% of the organic solvent.

[0019] Preferably, the slurry comprises 7-8wt% of the polyether sulfone, 1.5-1.8wt% of the polyvinylpyrrolidone, 28-29wt% of the ceramic powder, 17-18wt% of the graphite powder, and 44-45wt% of the N-methylpyrrolidone.

[0020] Preferably, the graphite powder is 200-250 mesh graphite powder or 250-300 mesh graphite powder.

[0021] To solve the above technical problems, the application further provides a manufacturing method of an atomization substrate, comprising the following steps:

[0022] S10, preparing a slurry: mixing 2-9wt% of the binder, 1-4wt% of the dispersant, 20-30wt% of the ceramic powder, 15-26wt% of the pore-forming agent, and 41-47wt% of the organic solvent to obtain the slurry after ball milling for more than 5 hours;

[0023] S20, casting: casting the slurry on the carrier plate;

[0024] S30, phase inversion: immersing the carrier plate and the slurry casted thereon in water, the slurry is instantaneously solidified after being immersed in water and a dense layer is formed on the surface of the slurry in contact with the water; the carrier plate and the slurry thereon are soaked in water for not less than 12 hours, during which the organic solvent is replaced by water to form a plurality of gaps and obtain a green body;

[0025] S40, sintering: placing the solidified green body into a special sintering furnace, first keeping the temperature at 550-700℃ for 3-6 hours, then increasing the temperature to 1300-1550℃ for high-temperature sintering for 2.5-5 hours to obtain the atomization substrate; during the sintering process, the pore-forming agent is burnt out to form a porous atomization substrate with a loose layer and a dense layer.

[0026] Preferably, the organic solvent is pure NMP (N-methylpyrrolidone) or NMP containing a small amount of non-solvent water (1-10vt%); the dispersant is one or more of PVP (polyvinylpyrrolidone), DSP (disodium hydrogen phosphate), and TEOA (triethanolamine); the pore-forming agent comprises one or more of starch, graphite, wood chips, and sucrose; and the binder is one or more of PESF (polyphenyl ether sulfone), PES (polyether sulfone), PVB (polyvinyl butyral), and PMMA (polymethyl methacrylate).

[0027] Preferably, the slurry comprises 2.9-3.1 wt% of polyether sulfone, 1.4-1.6 wt% of polyvinylpyrrolidone, 25-26 wt% of ceramic powder, 23-24 wt% of graphite powder, and 45-47 wt% of N-methylpyrrolidone, the graphite powder being 200-250 mesh or 250-300 mesh graphite powder.

[0028] Preferably, the pore size of the pore structure in the loose layer of the atomized substrate is 40-59 um, the pore size of the pore structure in the dense layer is 12-36 um, the thickness of the atomized substrate is 1-3 mm, the thickness of the dense layer is 0.02-0.3 um, and the porosity of the atomized substrate is 60-65%.

[0029] Preferably, the slurry comprises 7-8 wt% of polyether sulfone, 1.5-1.8 wt% of polyvinylpyrrolidone, 28-29 wt% of ceramic powder, 17-18 wt% of graphite powder, and 44-45 wt% of N-methylpyrrolidone, the graphite powder being 200-250 mesh or 250-300 mesh graphite powder.

[0030] Preferably, the pore size of the pore structure in the loose layer of the atomized substrate is 40-59 um, the pore size of the pore structure in the dense layer is 12-36 um, the thickness of the atomized substrate is 1-3 mm, the thickness of the dense layer is 0.02-0.3 um, and the porosity of the atomized substrate is 53-57%.

[0031] Preferably, the surface of the loose layer of the atomized substrate is a liquid permeation surface, and the surface of the dense layer is an atomization surface, and the surface of the loose layer is not in contact with water to form the dense layer when the surface of the loose layer is attached to the carrier plate at the moment of phase inversion into water.

[0032] Preferably, during the sintering process of step S40, the gaps formed by the displacement of the organic solvent by water shrink and interact with the spaces left after the pore-forming agent is burned to form the pore structure in the atomized substrate.

[0033] Preferably, in step S20, the casting speed is 10-45 cm / min, the forming thickness is 2 mm, and the carrier plate is a glass plate.

[0034] The present application uses a slurry formula and the concept of phase inversion casting in the manufacturing method, and only one casting forming is needed to manufacture an atomized substrate with a dense layer and a loose layer, greatly simplifying the manufacturing process, reducing the cost, and improving the process controllability compared with the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0035] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0036] Figure 1 A schematic diagram of the layered structure of the atomized substrate of the present application;

[0037] Figure 2 A scanning electron microscope (SEM) image of the cross section of the atomized substrate of the present application;

[0038] Figure 3 A light transmission experiment result image of the first side of the atomized substrate of the present application;

[0039] Figure 4 A light transmission experiment result image of the second side of the atomized substrate of the present application;

[0040] Figure 5 A scanning electron microscope (SEM) image of the surface of the dense layer of the atomized substrate of the present application;

[0041] Figure 6 A scanning electron microscope (SEM) image of the surface of the loose layer of the atomized substrate of the present application;

[0042] Figure 7 A magnified image of the cross section of the green body of the atomized substrate of the present application. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described below in conjunction with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0044] Reference should be made to Figure 1The cross-sectional schematic diagram of the atomization substrate of the present application is shown, the atomization substrate of the present application comprises a loose layer 11, a dense layer 12 and a transition layer 13 between the loose layer 11 and the dense layer 12. The outer surface of the loose layer 11 serves as a liquid infiltration surface, and the outer surface of the dense layer 12 serves as an atomization surface. There are several directly or indirectly connected pore structures inside the atomization substrate, and the atomized liquid can penetrate from the liquid infiltration surface to the side of the atomization surface through the pore structure. The thickness of the atomization substrate is 1-4mm, the thickness of the dense layer 12 is 0.02-0.3um, the thickness of the transition layer 13 cannot be accurately defined, and there is no direct correlation between the thickness of the dense layer 12 and the overall thickness of the atomization substrate, that is, the thickness of the dense layer 12 does not change with the thickness of the atomization substrate. The pore size of the loose layer 11 is between 30-120um, the pore size of the dense layer 12 is between 10-45um, and the pore size of the transition layer 13 is between 10-80um; it should be noted that the pore size in the atomization substrate is an irregular pore, and the pore size at different positions of the same pore structure is different, and the pore size extends vertically or horizontally or in a zigzag manner. The zigzag extension means that the same pore structure has both vertical and horizontal extensions. The overall porosity of the atomization substrate of the present application is between 44%-74%. The porosity of the loose layer 11 is greater than the porosity of the dense layer 12.

[0045] Further preferably, the pore size of the loose layer 11 is between 40-80um, and the pore size of the dense layer 12 is between 12-36um. The size of the pore size needs to meet the penetration of the atomized liquid and ensure that the wrapped section does not easily leak liquid, and the size of the pore size is related to the formula of the atomization substrate and the related parameters of the manufacturing process, which will be described in detail later in this article.

[0046] Further preferably, the pore size of the loose layer 11 is between 40-50um, and the pore size of the dense layer 12 is between 12-32um.

[0047] The atomization substrate of the present application generally has a heating element 14 on the surface of the dense layer 12, which generates heat to promote the heating and atomization of the atomized liquid in the atomization substrate and generate aerosol. The heating element 14 can be fixed on the surface of the dense layer 12 by screen printing, or it can be purchased and manufactured inside the atomization substrate.

[0048] Figure 2 The cross-sectional electron microscope image of the atomization substrate of the present application is shown, which can be seen that the dense layer 12 on the lower side of the cross section, the loose layer 11 and the transition layer 13 on the upper side. However, the boundaries of each layer are not accurately distinguished.

[0049] Figure 3 、 Figure 4 The light transmission experiment of the atomization substrate of the present application is shown,Figure 3 The dense layer 12 of the atomization substrate is directly opposite the light, and the effect diagram observed from the loose layer 11 side is shown; Figure 4 The loose layer 11 of the atomization substrate is directly opposite the light, and the effect diagram observed from the dense layer 12 side is shown. From the above two effect diagrams, it can be clearly distinguished that Figure 3 The light spot shown presents several light spots, that is, the light from the hole structure on the loose layer 11 side transmits and forms several light spots, and Figure 4 The light spot presents a blurred uniformity, that is, the light does not present obvious light spots when it transmits through the dense layer 12, that is, the dense layer 12 has no holes or the holes are too thin, and the light transmits and does not present obvious differences. Figure 3 、 Figure 4 The experimental environment of the light transmission experiment shown is consistent, and the strong light source can be at a certain distance from the atomization substrate, and preferably directly adheres to the surface of the atomization substrate.

[0050] Figure 5 、 Figure 6 The electron microscope scanning diagrams of the dense layer 12 and the loose layer 11 of the atomization substrate of the present application are shown, and the effect diagrams of the dense layer 12 at 600 times magnification and the loose layer 11 at 400 times magnification are shown. Most of the pore size structures generally meet the range described above, because the manufacturing process cannot guarantee that all pore sizes are within the specified range, and there are very few small differences.

[0051] When the atomization substrate of the present application is applied to an atomization product, such as the application of the People's Republic of China No. 202110430799.8 patent in the field of electronic cigarettes, the hole structure in the loose layer of the atomization substrate has a large pore size, which is beneficial for the atomization liquid to penetrate from the loose layer 11 to the inside of the atomization substrate; and the hole structure in the dense layer has a small pore size, which can prevent the atomization liquid from continuing to penetrate downward, thereby avoiding oil leakage. And the pore size of the loose layer, after wrapping the cross section with sealing silica gel, will not cause the atomization liquid to leak from the cross section.

[0052] The manufacturing method of the atomization substrate of the present application includes the following steps:

[0053] S10, preparing a slurry;

[0054] In this step, the slurry includes the following components by mass component: 2-9wt% of a binder, 1-4wt% of a dispersing agent, 20-30wt% of a ceramic powder, 15-26wt% of a pore-forming agent, and 41-47wt% of an organic solvent.

[0055] wt% of dispersant, 23-26wt% of ceramic powder, 20-25wt% of pore-forming agent and 43-47wt% of organic solvent; further preferably, the slurry comprises 3wt% of binder, 1.5wt% of dispersant, 25.7wt% of ceramic powder, 23.5wt% of pore-forming agent and 46.3wt% of organic solvent. The porosity of the atomizing substrate manufactured by using the present embodiment is greater than 60%, preferably 60-65%.

[0056] wt% of dispersant, 27-29wt% of ceramic powder, 15-19wt% of pore-forming agent and 43-45wt% of organic solvent; further preferably, the slurry comprises 7.5wt% of binder, 1.7wt% of dispersant, 28.7wt% of ceramic powder, 17.3wt% of pore-forming agent and 44.8wt% of organic solvent. The porosity of the atomizing substrate manufactured by using the present embodiment is less than 60%, preferably 53-57%.

[0057] wherein the ceramic powder comprises one or more of alumina, silica, titania, kaolin, calcium carbonate, silicon carbide, talc, feldspar, cordierite, diatomite; the organic solvent is pure NMP (N-methyl pyrrolidone) or NMP containing a small amount of non-solvent water (1-10vt%); the dispersant is one or more of PVP (polyvinyl pyrrolidone), DSP (disodium hydrogen phosphate), TEOA (triethanolamine); the pore-forming agent comprises one or more of starch, graphite, wood chips, sucrose; the binder is one or more of PESF (polyphenyl ether sulfone), PES (polyether sulfone), PVB (polyvinyl butyral), PMMA (polymethyl methacrylate).

[0058] wherein the ceramic powder comprises one or more of alumina, silica, titania, kaolin, calcium carbonate, silicon carbide, talc, feldspar, cordierite, diatomite; the organic solvent is pure NMP (N-methyl pyrrolidone) or NMP containing a small amount of non-solvent water (1-10vt%); the dispersant is one or more of PVP (polyvinyl pyrrolidone), DSP (disodium hydrogen phosphate), TEOA (triethanolamine); the pore-forming agent comprises one or more of starch, graphite, wood chips, sucrose; the binder is one or more of PESF (polyphenyl ether sulfone), PES (polyether sulfone), PVB (polyvinyl butyral), PMMA (polymethyl methacrylate).

[0059] In the present step, the binder, ceramic powder, pore-forming agent, dispersant and organic solvent are mixed in a predetermined proportion and then ball-milled to obtain the slurry. The ball-milling time is greater than 5 hours. The binder can be added before or after the ball-milling stirring.

[0060] S20, casting molding;

[0061] In the present step, the prepared slurry is cast molded on the carrier plate at a casting speed of 10-45cm / min and a molding thickness of 1-3mm. The carrier plate is a glass plate or other plate with smooth surface.

[0062] S30, phase inversion;

[0063] The slurry cast on the carrier plate is put into water with the carrier plate, and the slurry is instantaneously solidified after being put into water and forms the dense layer 12 on the surface of the slurry in contact with water, which can be understood as a film coating; the slurry is soaked in water for no less than 12 hours, and in the soaking process, the organic solvent is replaced by water to obtain a green body and form a plurality of gaps (the actual section view is shown in Figure 7 The green body does not generate a dense layer when contacting the side surface of the carrier plate.

[0064] S40, slice demolding;

[0065] This step cuts the obtained green body according to the set size, and the green body of the specified size is obtained after demolding on the demolding table. This step is an optional step.

[0066] S50, sintering forming;

[0067] The solidified ceramic green body is put into a special sintering furnace, first kept at a temperature of 550-700 ℃ for 3-6 hours, and then heated to a high temperature of 1300-1550 ℃ for sintering for 2.5-5 hours to obtain the atomization substrate of the present application. In the sintering process, the pore-forming agent is burned and removed, and the gaps are shrunk, and finally the aforementioned porous structure is formed. The pore size in the dense layer 12 (i.e. the film coating) is smaller than the pore size of the loose layer 11.

[0068] The atomization substrate, the atomization substrate manufacturing method and the atomization device of the present application can form the dense layer 12 and the loose layer 11 on the vertical two sides of the atomization substrate respectively through one-time cast forming. Compared with the atomization substrate prepared by multiple times of cast forming with different formulations to obtain different pore sizes, the process of the present application is simpler and more practical, the manufacturing period is lower, the manufacturing cost is lower, and the process controllability of the product is higher.

[0069] The present application will be further described in detail through specific embodiments.

[0070] Example 1

[0071] The atomization substrate is prepared by using the present embodiment;

[0072] S1, preparing a slurry: 6-9wt% of polyether sulfone, 1-2wt% of polyvinylpyrrolidone, 27-29wt% of ceramic powder, 15-19wt% of graphite powder and 43-45wt% of N-methyl pyrrolidone are mixed and ball milled to obtain a slurry (preferably, 7.5wt% of polyether sulfone, 1.7wt% of polyvinylpyrrolidone, 28.7wt% of ceramic powder, 17.3wt% of graphite powder and 44.8wt% of N-methyl pyrrolidone are mixed and ball milled to obtain a slurry.

[0073] S2, Casting: The slurry is cast on a glass plate at a casting speed of 15 cm / min and a forming thickness of 2 mm.

[0074] S3, Phase inversion: The slurry cast on the carrier plate is solidified with the carrier plate in water to form a green body.

[0075] S4, Sintering: The solidified green body is placed in a special sintering furnace, first kept at a temperature of 550°C for 3 hours, then heated to a high temperature of 1300-1550°C for 2.5 hours, and finally formed to obtain the atomization substrate of the present application.

[0076] The porosity of the atomization substrate manufactured in this embodiment 1 is less than 60%, preferably 53-57%. The scanning electron microscope data of the atomization substrates obtained in this embodiment 1 using different sizes of graphite powder and different sintering temperatures are shown in the following table:

[0077]

[0078] Table 1

[0079] In this embodiment 1, the atomization test is carried out according to the obtained atomization substrate, and the 200-250 mesh graphite powder scheme and the 250-300 mesh graphite powder scheme are extracted for testing. The test data results are shown in Table 2 below, wherein TPM represents the proportion of smoke per mouth.

[0080]

[0081] Table 2

[0082] From the test results, the test effect of using 250-300 mesh graphite powder is better, which is the preferred scheme. Except for the dry burning related to the heating body 14, there are also individual problems with the number of mouths and TPM, which can be solved as the process continues to mature and control.

[0083] Embodiment 2

[0084] The atomization substrate is prepared by using this embodiment;

[0085] S1, Preparation of slurry: 2-4wt% of polyether sulfone, 1-3wt% of polyvinylpyrrolidone, 23-26wt% of ceramic powder, 20-25wt% of graphite powder and 43-47wt% of N-methyl pyrrolidone are mixed and ball milled to prepare a slurry (preferably the components are 3wt% of polyether sulfone, 1.5wt% of polyvinylpyrrolidone, 25.7wt% of ceramic powder, 23.5wt% of graphite powder and 46.3wt% of N-methyl pyrrolidone are mixed and ball milled to prepare a slurry. The graphite powder selected is 100-150 mesh graphite powder.

[0086] S2, Casting: The slurry is cast on a glass plate, the casting speed is 15 cm / min, and the forming thickness is 2 mm.

[0087] S3, Phase inversion: The slurry cast on the carrier plate is cured in water with the carrier plate to form a green body.

[0088] S4, Sintering: The cured green body is placed in a special sintering furnace, first kept at a temperature of 550°C for 3 hours, then heated to a high temperature of 1300-1550°C for sintering for 2.5 hours, and finally formed to obtain the atomization substrate of the application.

[0089] The atomization substrate manufactured in this embodiment is analyzed by scanning electron microscopy. Under the same environment, i.e., the same pore-forming agent and sintering temperature, the pore diameter of the loose layer 11 is substantially consistent with the pore diameter of the dense layer 12, but the porosity is less than 60%. The components of this embodiment are a formula for reducing porosity, and reducing porosity can better improve the strength and hardness of the atomization substrate. The porosity is preferably 53-57%.

[0090] The application also includes an atomization device, the atomization substrate is applied to the atomization device, the atomization device includes a power supply system connected to the heating body 14, a liquid storage cavity, and the atomization substrate enclosing the liquid storage cavity. The dense layer 12 of the atomization substrate is provided with the heating body 14, the atomization liquid of the liquid storage cavity penetrates into the atomization substrate from the surface of the loose layer, the dense layer 12 prevents the atomization liquid from continuing to penetrate downward, the heating body 14 generates heat to heat the atomization substrate and atomize the atomization liquid in the atomization substrate to generate aerosol.

[0091] The atomization substrate and the manufacturing method of the application can manufacture an atomization substrate with a dense layer 12 and a loose layer 11 by one-time casting. Compared with the prior art, the manufacturing process is greatly simplified, the cost is reduced, and the process controllability is improved.

[0092] The technical features of the above embodiments can be combined in any way. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the description.

[0093] The above embodiments only express the preferred embodiments of the application, which are described in detail and specifically, but should not be construed as limiting the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the application, a number of modifications and improvements can be made, which are within the scope of the application. Therefore, the protection scope of the patent of the application should be subject to the appended claims.

Claims

1. An atomized substrate, characterized by, The porous layer is a liquid permeation surface, and the dense layer is a atomization surface, and the porous layer and the dense layer are internally formed with a plurality of pore structures, the pore diameter of the pore structure in the porous layer is greater than the pore diameter of the pore structure in the dense layer, and the thickness of the porous layer is greater than the thickness of the dense layer, and the atomization liquid is permeated into the atomization substrate from the liquid permeation surface; The porous layer and the dense layer of the atomization substrate are formed by once flow casting, water replacement and sintering; the slurry is flow casted on a bearing plate with a smooth surface during flow casting; The slurry for manufacturing the atomization substrate comprises the following components: 2-9wt% of a binder, 1-4wt% of a dispersant, 20-30wt% of ceramic powder, 15-26wt% of a pore forming agent and 41-47wt% of an organic solvent; The pore diameter of the pore structure in the porous layer is between 40-50um, and the pore diameter of the pore structure in the dense layer is between 12-30um; The atomization substrate further comprises a transition layer between the porous layer and the dense layer, and the pore diameter of the pore structure in the transition layer is between 10-80um.

2. The atomizing substrate of claim 1, wherein The thickness of the atomization substrate is 1-3mm, the porosity is 44%-74%, and the thickness of the dense layer is between 0.02-0.3um.

3. The atomizing substrate of claim 2, wherein The porosity of the atomization substrate is 53%-60%.

4. The atomizing substrate of claim 2, wherein The porosity of the atomization substrate is 60%-65%.

5. The atomizing substrate of claim 2, wherein The thickness of the atomization substrate is 2mm.

6. A slurry for manufacturing an atomizing substrate for manufacturing the atomizing substrate according to any one of claims 1 to 5, characterized by, The slurry comprises the following components: 2-9wt% of a binder, 1-4wt% of a dispersant, 20-30wt% of ceramic powder, 15-26wt% of a pore forming agent and 41-47wt% of an organic solvent.

7. The slurry for manufacturing an atomizing substrate according to claim 6, wherein The organic solvent is pure NMP or NMP containing 1-10vt% of non-solvent water; the dispersant is one or several of PVP, DSP and TEOA; the pore forming agent comprises one or several of starch, graphite, wood chips and sucrose; and the binder is one or several of PESF, PES, PVB and PMMA.

8. The slurry for manufacturing an atomizing substrate according to claim 7, wherein The components of the slurry comprise 2-4wt% of a binder, 1-3wt% of a dispersant, 23-26wt% of ceramic powder, 20-25wt% of a pore forming agent and 43-47wt% of an organic solvent.

9. The slurry for manufacturing an atomizing substrate according to claim 8, wherein The slurry comprises 2.9-3.1wt% of polyether sulfone, 1.4-1.6wt% of polyvinylpyrrolidone, 25-26wt% of ceramic powder, 23-24wt% of graphite powder and 45-47wt% of N-methyl pyrrolidone.

10. The slurry for manufacturing an atomizing substrate according to claim 7, wherein The slurry comprises 6-9wt% of a binder, 1-2wt% of a dispersant, 27-29wt% of ceramic powder, 15-19wt% of a pore forming agent and 43-45wt% of an organic solvent.

11. The slurry for manufacturing an atomizing substrate according to claim 10, wherein The slurry comprises 7-8wt% of polyether sulfone, 1.5-1.8wt% of polyvinylpyrrolidone, 28-29wt% of ceramic powder, 17-18wt% of graphite powder and 44-45wt% of N-methyl pyrrolidone.

12. The slurry for manufacturing an atomizing substrate according to claim 9 or 11, wherein The graphite powder is 200-250 mesh graphite powder or 250-300 mesh graphite powder.

13. A method of manufacturing an atomized substrate, characterized by, The method comprises the following steps: S10, preparing a slurry: mixing 2-9 wt% of a binder, 1-4 wt% of a dispersant, 20-30 wt% of ceramic powder, 15-26 wt% of a pore-forming agent, and 41-47 wt% of an organic solvent, and obtaining the slurry after ball milling for more than 5 hours; S20, casting forming: casting the slurry on a carrier plate; S30, phase inversion: immersing the carrier plate and the slurry casted thereon in water, the slurry is instantaneously solidified after being immersed in water and a dense layer is formed on the surface of the slurry in contact with water; the carrier plate and the slurry thereon are soaked in water for not less than 12 hours, during which the organic solvent is replaced by water to form a plurality of gaps and obtain a green body; S40, sintering forming: placing the solidified green body into a special sintering furnace, first keeping the temperature at 550-700°C for 3-6 hours, then increasing the temperature to 1300-1550°C for high-temperature sintering for 2.5-5 hours to obtain an atomization substrate, and during the sintering process, the pore-forming agent is burned out to form a porous atomization substrate with a loose layer and a dense layer.

14. The method of claim 13, wherein the atomizing substrate is manufactured by The organic solvent is pure NMP or NMP containing 1-10 vol% of non-solvent water; the dispersant is one or more of PVP, DSP, and TEOA; the pore-forming agent includes one or more of starch, graphite, wood chips, and sucrose; and the binder is one or more of PESF, PES, PVB, and PMMA.

15. The method of claim 14, wherein the atomizing substrate is manufactured by The slurry comprises 2.9-3.1 wt% of polyether sulfone, 1.4-1.6 wt% of polyvinylpyrrolidone, 25-26 wt% of ceramic powder, 23-24 wt% of graphite powder, and 45-47 wt% of N-methylpyrrolidone, and the graphite powder is 200-250 mesh or 250-300 mesh graphite powder.

16. The method of claim 15, wherein the atomizing substrate is manufactured by The pore size of the pore structure in the loose layer of the atomization substrate is 40-59 um, the pore size of the pore structure in the dense layer is 12-36 um, the thickness of the atomization substrate is 1-3 mm, the thickness of the dense layer is 0.02-0.3 um, and the porosity of the atomization substrate is 60-65%.

17. The method of claim 16, wherein the atomizing substrate is manufactured by The slurry comprises 7-8 wt% of polyether sulfone, 1.5-1.8 wt% of polyvinylpyrrolidone, 28-29 wt% of ceramic powder, 17-18 wt% of graphite powder, and 44-45 wt% of N-methylpyrrolidone, and the graphite powder is 200-250 mesh or 250-300 mesh graphite powder.

18. The method of claim 17, wherein the atomizing substrate is manufactured by The pore size of the pore structure in the loose layer of the atomization substrate is 40-59 um, the pore size of the pore structure in the dense layer is 12-36 um, the thickness of the atomization substrate is 1-3 mm, the thickness of the dense layer is 0.02-0.3 um, and the porosity of the atomization substrate is 53-57%.

19. The method of manufacturing an atomizing substrate according to claim 16 or 18, wherein The surface of the loose layer of the atomization substrate is a liquid permeation surface, the surface of the dense layer is an atomization surface, and the surface of the loose layer is not in contact with water by adhering to the carrier plate at the moment of phase inversion into water.

20. The method of claim 13 or 16 or 18, wherein In the sintering process of step S40, the gaps formed by the displacement of the organic solvent by water shrink and interact with the spaces left after the pore-forming agent is burned off to form the pore structure within the atomized substrate.

21. The method of claim 13, wherein In step S20, the casting speed is 10-45 cm / min, the forming thickness is 2 mm, and the carrier plate is a glass plate.

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