Display device

Abstract

A display device includes a driving backplane and a plurality of light-emitting elements. The driving backplane includes a plurality of pixel driving circuits and a conductive layer. The conductive layer has a plurality of conductive patterns, which are electrically connected to the plurality of pixel driving circuits respectively. The plurality of light-emitting elements are electrically connected to the plurality of conductive patterns respectively. The plurality of light-emitting elements include a first light-emitting element and a second light-emitting element. The plurality of conductive patterns include a first conductive pattern and a second conductive pattern, which are electrically connected to the first light-emitting element and the second light-emitting element respectively. A top surface of the first light-emitting element has a first distance from the first conductive pattern. A top surface of the second light-emitting element has a second distance from the second conductive pattern. The second distance is greater than the first distance.

Description

Technical Field

[0001] The present invention relates to a photoelectric device, and in particular to a display device. Background Art

[0002] With the evolution of display technology, high-resolution and thin display devices are favored by the mainstream market. In recent years, due to the breakthrough in the process technology of light-emitting diode (LED) components, micro-LED display devices (Micro-LED display) or millimeter-level LED display devices that can arrange LED components in an array have been developed. They do not require a liquid crystal layer (Liquid crystal) and a color filter (Color filter), which can further reduce the thickness of the display device. In addition, compared with organic light-emitting diode display devices, micro-LED display devices have the advantages of more power saving and longer life.

[0003] In the current production process of micro-LED display devices, a large number of LED components need to be transferred to the driving backplane through mass transfer. A small number of LED components transferred to the driving backplane may be abnormal, and the abnormal LED components need to be removed. Then, the repair LED components are transferred to the driving backplane to complete the repair operation. However, when performing the repair operation, the transferred components that pick up the repair LED components will crush the normal LED components that have been transferred to the driving backplane, affecting the yield of the micro-LED display device. Summary of the invention

[0004] One of the objects of the present invention is to provide a display device that is easily repairable.

[0005] Another object of the present invention is to provide another display device that is also easy to repair.

[0006] A display device according to an embodiment of the present invention includes a driving backplane and a plurality of light-emitting elements. The driving backplane includes a substrate, a plurality of pixel driving circuits disposed on the substrate, and a conductive layer. The conductive layer has a plurality of conductive patterns, wherein the plurality of conductive patterns are electrically connected to the plurality of pixel driving circuits, respectively. A plurality of light-emitting elements are electrically connected to the plurality of conductive patterns, respectively, wherein each light-emitting element has a top surface facing away from the substrate. The plurality of light-emitting elements include a first light-emitting element and a second light-emitting element. The plurality of conductive patterns include a first conductive pattern and a second conductive pattern. The first light-emitting element and the second light-emitting element are electrically connected to the first conductive pattern and the second conductive pattern, respectively. The top surface of the first light-emitting element has a first distance from the first conductive pattern. The top surface of the second light-emitting element has a second distance from the second conductive pattern, and the second distance is greater than the first distance.

[0007] A display device according to another embodiment of the present invention includes a driving backplane and a plurality of light-emitting elements. The driving backplane includes a substrate, a plurality of pixel driving circuits disposed on the substrate, and a pad layer. The pad layer has a plurality of pad groups, wherein the plurality of pad groups are electrically connected to the plurality of pixel driving circuits, respectively. The plurality of light-emitting elements are electrically connected to the plurality of pad groups, respectively. The plurality of light-emitting elements include a first light-emitting element and a second light-emitting element. The plurality of pad groups include a first pad group and a second pad group. The first light-emitting element and the second light-emitting element are electrically connected to the first pad group and the second pad group, respectively. The distance between at least one pad of the second pad group and the substrate is greater than the distance between at least one pad of the first pad group and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figures 1A to 1C A repair process of a display device according to an embodiment of the present invention is shown.

[0009] FIG. 2A to FIG. 2C A repair process of a display device according to an embodiment of the present invention is shown.

[0010] FIG. 3A to FIG. 3C A repair process of a display device according to an embodiment of the present invention is shown.

[0011] FIG. 4A to FIG. 4C A repair process of a display device according to an embodiment of the present invention is shown.

[0012] FIG. 5A to FIG. 5C A repair process of a display device according to an embodiment of the present invention is shown.

[0013] FIG. 6A to FIG. 6C A repair process of a display device according to an embodiment of the present invention is shown.

[0014] 7A to 7C A repair process of a display device according to an embodiment of the present invention is shown.

[0015] FIG. 8A to FIG. 8C A repair process of a display device according to an embodiment of the present invention is shown.

[0016] The reference numerals are as follows:

[0017] 10, 10', 10A, 10A', 10B, 10B', 10C, 10C', 10D, 10D', 10E, 10E', 10F, 10F', 10G, 10G': display device

[0018] 100, 100G: drive backplane

[0019] 110: Base

[0020] 120, 150: dielectric layer

[0021] 121: Flat part

[0022] 122:convex part

[0023] 130: Conductive layer

[0024] 131, 132: Conductive pattern

[0025] 140: pad layer

[0026] 140a: pad

[0027] 141, 142: pad group

[0028] 210: first type semiconductor layer

[0029] 220: Second type semiconductor layer

[0030] 230: Active layer

[0031] 240: Electrode

[0032] 250: Conductive bump

[0033] 260: Color conversion pattern

[0034] 260a, 270a, Da, LEDa: top surface

[0035] 270: Translucent pattern

[0036] 300: Encapsulation layer

[0037] A1, A2, B1, B2: Distance

[0038] D: Bare chip

[0039] D1: First distance

[0040] D2: Second distance

[0041] LED, LED1, LED2: light emitting element

[0042] SPC: Pixel driver circuit

[0043] T2: Second transistor

[0044] T2a: First end

[0045] T2b: Second end

[0046] T2c: Control terminal

[0047] T210-1, T210-2, T230-1, T230-2, T240-1, T240-2, T250-1, T250-2, T260, T260-1, T260-2, T270: thickness DETAILED DESCRIPTION

[0048] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0049] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to another element, or an intermediate element may also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connection" may refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning unless explicitly defined as such herein.

[0051] Figures 1A to 1C A repair process of a display device according to an embodiment of the present invention is shown.

[0052] Please refer to Figure 1A The display device 10 includes a driving backplane 100. The driving backplane 100 includes a substrate 110. For example, in this embodiment, the substrate 110 may be made of glass, quartz, organic polymer, or other applicable materials.

[0053] The display device 10 further includes a plurality of pixel driving circuits SPC disposed on the substrate 110. For example, in the present embodiment, each pixel driving circuit SPC may include a data line (not shown), a scan line (not shown), a power line (not shown), a common line (not shown), a first transistor (not shown), a second transistor T2, and a capacitor (not shown), wherein a first end of the first transistor is electrically connected to the data line, a control end of the first transistor is electrically connected to the scan line, a second end of the first transistor is electrically connected to a control end T2c of the second transistor T2, a first end T2a of the second transistor T2 is electrically connected to the power line, and the capacitor is electrically connected to the second end of the first transistor and the first end T2a of the second transistor T2; but the present invention is not limited thereto.

[0054] The driving backplane 100 further includes a conductive layer 130 having a plurality of conductive patterns 131, 132, wherein the plurality of conductive patterns 131, 132 are electrically connected to a plurality of pixel driving circuits SPC, respectively. For example, in the present embodiment, each of the plurality of conductive patterns 131, 132 may be electrically connected to a second end T2b of a second transistor T2 of a corresponding pixel driving circuit SPC, but the present invention is not limited thereto.

[0055] In this embodiment, the conductive layer 130 is, for example, a transparent conductive layer including metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, other suitable oxides, or a stacked layer of at least two of the above, but the invention is not limited thereto.

[0056] The driving backplane 100 further includes a pad layer 140 having a plurality of pad groups 141, 142. The plurality of pad groups 141, 142 are electrically connected to a plurality of pixel driving circuits SPC, respectively. Each pad group 141, 142 includes a plurality of pads 140a, one pad 140a of each pad group 141, 142 is electrically connected to a corresponding one of the plurality of conductive patterns 131, 132, and another pad 140a of each pad group 141, 142 is electrically connected to a common line (not shown) of a corresponding pixel driving circuit SPC.

[0057] In the present embodiment, the conductive layer 130 may be disposed on a plurality of pixel driving circuits SPC; the driving backplane 100 may further include a dielectric layer 120 disposed between the conductive layer 130 and the plurality of pixel driving circuits SPC. In the present embodiment, the pad layer 140 is disposed on the conductive layer 130, and the driving backplane 100 may further include another dielectric layer 150 disposed between the pad layer 140 and the conductive layer 130. In the present embodiment, the material of the dielectric layers 120 and 150 may be an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof.

[0058] The display device 10 further includes a plurality of light emitting elements LED, wherein each light emitting element LED has a top surface LEDa facing away from the substrate 110. In the present embodiment, each light emitting element LED includes a bare chip D, a plurality of electrodes 240, and a plurality of conductive bumps 250. The bare chip D includes a first-type semiconductor layer 210, a second-type semiconductor layer 220, and an active layer 230 disposed between the first-type semiconductor layer 210 and the second-type semiconductor layer 220. The plurality of electrodes 240 are electrically connected to the first-type semiconductor layer 210 and the second-type semiconductor layer 220, respectively, and the plurality of conductive bumps 250 are electrically connected to the plurality of electrodes 240, respectively. The plurality of conductive bumps 250 of each light emitting element LED are electrically connected to the plurality of pads 140a of a corresponding pad group 141 or 142, respectively.

[0059] The plurality of light emitting elements LED are respectively electrically connected to the plurality of conductive patterns 131, 132. Specifically, in the present embodiment, the plurality of light emitting elements LED are respectively electrically connected to the plurality of pad groups 141, 142, and the plurality of pad groups 141, 142 are respectively electrically connected to the plurality of conductive patterns 131, 132. In the present embodiment, the light emitting element LED may include a micro light emitting diode (μLED), but the present invention is not limited thereto.

[0060] Please refer to Figure 1A and Figure 1B In this embodiment, the display device 10 can be tested to detect whether the light-emitting element LED that has been transferred to the driving backplane 100 is normal. The normal light-emitting element LED (i.e., the first light-emitting element LED1) will be retained on the driving backplane 100, and the abnormal light-emitting element (not shown) will be removed. After that, the repair light-emitting element LED (i.e., the second light-emitting element LED2) is transferred to the driving backplane 100 and the repair light-emitting element LED is electrically connected to the driving backplane 100.

[0061] It is worth noting that in the present embodiment, compared with the normal light-emitting element LED (i.e., the first light-emitting element LED1) retained on the driving backplane 100, the repair light-emitting element LED (i.e., the second light-emitting element LED2) further includes a color conversion pattern 260, wherein the color conversion pattern 260 of the second light-emitting element LED2 is arranged on the bare chip D of the second light-emitting element LED2.

[0062] When the repairing second light-emitting element LED2 is transferred to the driving backplane 100 by using the transfer element 1, since the second light-emitting element LED2 itself has the color conversion pattern 260, when the transfer element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transfer element 1 is not easy to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0063] Please refer to Figure 1B and Figure 1CAfter completing the above-mentioned repairing action, a packaging layer 300 can be formed on the driving backplane 100 to cover the first light-emitting element LED1 and the second light-emitting element LED2, and the repaired display device 10' is completed. The multiple light-emitting elements LED of the display device 10' include the first light-emitting element LED1 and the second light-emitting element LED2. The multiple conductive patterns 131 and 132 of the driving backplane 100 of the display device 10' include the first conductive pattern 131 and the second conductive pattern 132, the first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively, the top surface LEDa of the first light-emitting element LED1 has a first distance D1 with the first conductive pattern 131, the top surface LEDa of the second light-emitting element LED2 has a second distance D2 with the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0064] In the present embodiment, the die D of the first light-emitting element LED1 has a top surface LEDa of the first light-emitting element LED1, and the top surface Da of the die D of the first light-emitting element LED1 is at a first distance D1 from the first conductive pattern 131. The second light-emitting element LED2 includes the die D and a color conversion pattern 260, and the color conversion pattern 260 of the second light-emitting element LED2 is disposed on the die D of the second light-emitting element LED2. The color conversion pattern 260 of the second light-emitting element LED2 has a top surface LEDa of the second light-emitting element LED2, and the top surface 260a of the color conversion pattern 260 of the second light-emitting element LED2 is at a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface 260a of the color conversion pattern 260 of the second light-emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface Da of the bare chip D of the first light-emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface LEDa of the first light-emitting element LED1 and the top surface 260a of the color conversion pattern 260 of the second light-emitting element LED2 are in direct contact with the packaging layer 300.

[0065] It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

[0066] FIG. 2A to FIG. 2C A repair process of a display device according to an embodiment of the present invention is shown.

[0067] FIG. 2A to FIG. 2C The display device 10A, 10A′ and Figures 1A to 1C The display devices 10 and 10' are similar, and the difference between the two is that: FIG. 2A to FIG. 2CThe light emitting element LED and Figures 1A to 1C The light emitting elements LED are different.

[0068] Please refer to Figure 2A Specifically, in this embodiment, the first light-emitting element LED that is normally retained on the driving backplane 100 includes a bare chip D and a color conversion pattern 260, wherein the color conversion pattern 260 of the first light-emitting element LED1 is arranged on the bare chip D of the first light-emitting element LED1; the second light-emitting element LED2 for repair includes a bare chip D and a light-transmitting pattern 270, wherein the light-transmitting pattern 270 of the second light-emitting element LED2 is arranged on the bare chip D of the second light-emitting element LED2.

[0069] It is worth noting that the thickness T270 of the light-transmitting pattern 270 of the second light-emitting element LED2 is greater than the thickness T260 of the color conversion pattern 260 of the first light-emitting element LED1. Figure 2A and Figure 2B Therefore, when the transposition element 1 is used to transpose the repair second light-emitting element LED2 onto the driving backplane 100, since the light-transmitting pattern 270 of the second light-emitting element LED2 is thicker, when the transposition element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transposition element 1 is not easy to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0070] Please refer to Figure 2C , the multiple light-emitting elements LED of the repaired display device 10A' include a first light-emitting element LED1 and a second light-emitting element LED2. The multiple conductive patterns 131, 132 of the driving backplane 100 of the display device 10A' include a first conductive pattern 131 and a second conductive pattern 132, the first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively, the top surface LEDa of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, the top surface LEDa of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0071] In the present embodiment, the light-transmitting pattern 270 of the second light-emitting element LED2 has the top surface LEDa of the second light-emitting element LED, the color conversion pattern 260 of the first light-emitting element LED1 has the top surface LEDa of the first light-emitting element LED1, the top surface 260a of the color conversion pattern 260 of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, and the top surface 270a of the light-transmitting pattern 270 of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface 270a of the light-transmitting pattern 270 of the second light-emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface 260a of the color conversion pattern 260 of the first light-emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface 260a of the color conversion pattern 260 of the first light-emitting element LED1 and the top surface 260a of the light-transmitting pattern 270 of the second light-emitting element LED2 are in direct contact with the packaging layer 300.

[0072] For example, in the present embodiment, the bare chip D of the first light-emitting element LED1 and the bare chip D of the second light-emitting element LED2 are both used to emit the same first color light (for example, blue light), the color conversion pattern 260 of the first light-emitting element LED1 is used to convert the first color light (for example, blue light) into the second color light (for example, red light or green light), and the light-transmitting pattern 270 of the second light-emitting element LED2 allows the first color light (for example, blue light) to pass through without converting the color of the first color light, but the present invention is not limited to this.

[0073] FIG. 3A to FIG. 3C A repair process of a display device according to an embodiment of the present invention is shown.

[0074] FIG. 3A to FIG. 3C The display device 10B, 10B′ and Figures 1A to 1C The display devices 10 and 10' are similar, and the difference between the two is that: FIG. 3A to FIG. 3C Multiple light emitting elements LED and Figures 1A to 1C The multiple light emitting elements LED are different.

[0075] Please refer to Figure 3A Specifically, in this embodiment, the first light-emitting element LED that is normally retained on the driving backplane 100 includes a bare chip D and a color conversion pattern 260, wherein the color conversion pattern 260 of the first light-emitting element LED1 is arranged on the bare chip D of the first light-emitting element LED1; the second light-emitting element LED2 for repair also includes a bare chip D and a color conversion pattern 260, wherein the color conversion pattern 260 of the second light-emitting element LED2 is arranged on the bare chip D of the second light-emitting element LED2.

[0076] It is worth noting that the thickness T260-2 of the color conversion pattern 260 of the second light emitting element LED2 for repair is greater than the thickness T260-1 of the color conversion pattern 260 of the first light emitting element LED1. Figure 3A and Figure 3B Therefore, when the repair second light-emitting element LED2 is transferred to the driving backplane 100 using the transfer element 1, since the color conversion pattern 260 of the second light-emitting element LED2 is thicker, when the transfer element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transfer element 1 is not easy to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0077] Please refer to Figure 3C , the multiple light-emitting elements LED of the repaired display device 10B' include a first light-emitting element LED1 and a second light-emitting element LED2. The multiple conductive patterns 131, 132 of the driving backplane 100 of the display device 10' include a first conductive pattern 131 and a second conductive pattern 132, the first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively, the top surface LEDa of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, the top surface LEDa of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0078] In this embodiment, the color conversion pattern 260 of the second light-emitting element LED2 has a top surface LEDa of the second light-emitting element LED, the color conversion pattern 260 of the first light-emitting element LED1 has a top surface LEDa of the first light-emitting element LED1, the top surface 260a of the color conversion pattern 260 of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, and the top surface 260a of the color conversion pattern 260 of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface 260 a of the color conversion pattern 260 of the second light-emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface 260 a of the color conversion pattern 260 of the bare die D of the first light-emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface 260 a of the color conversion pattern 260 of the first light-emitting element LED1 and the top surface 260 a of the color conversion pattern 260 of the second light-emitting element LED2 are in direct contact with the packaging layer 300.

[0079] For example, in the present embodiment, the bare chip D of the first light-emitting element LED1 and the bare chip D of the second light-emitting element LED2 are both used to emit the same first color light (e.g., blue light), the color conversion pattern 260 of the first light-emitting element LED1 is used to convert the first color light (e.g., blue light) into the second color light (e.g., red light), and the color conversion pattern 260 of the second light-emitting element LED2 is used to convert the first color light (e.g., blue light) into the third color light (e.g., green light), but the present invention is not limited to this.

[0080] FIG. 4A to FIG. 4C A repair process of a display device according to an embodiment of the present invention is shown.

[0081] FIG. 4A to FIG. 4C The display device 10C, 10C′ and Figures 1A to 1C The display devices 10 and 10' are similar, and the difference between the two is that: FIG. 4A to FIG. 4C Multiple light emitting elements LED and Figures 1A to 1C The multiple light emitting elements LED are different.

[0082] Please refer to Figure 4A Specifically, in this embodiment, the thickness T250-2 of at least one of the plurality of conductive bumps 250 of the second light emitting element LED2 is greater than the thickness T250-1 of at least one of the plurality of conductive bumps 250 of the first light emitting element LED1. Figure 4A and Figure 4B Therefore, when the transposition element 1 is used to transpose the repaired second light-emitting element LED2 onto the driving backplane 100, since the conductive bump 250 of the second light-emitting element LED2 is thicker, when the transposition element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transposition element 1 is not easy to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0083] Please refer to Figure 4C , the multiple light-emitting elements LED of the repaired display device 10C' include a first light-emitting element LED1 and a second light-emitting element LED2. The multiple conductive patterns 131, 132 of the driving backplane 100 of the display device 10C' include a first conductive pattern 131 and a second conductive pattern 132, the first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively, the top surface LEDa of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, the top surface LEDa of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0084] In the present embodiment, the die D of the second light emitting element LED2 has the top surface LEDa of the second light emitting element LED, the die D of the first light emitting element LED1 has the top surface LEDa of the first light emitting element LED1, the top surface Da of the die D of the first light emitting element LED1 has a first distance D1 from the first conductive pattern 131, and the top surface Da of the die D of the second light emitting element LED2 has a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface Da of the die D of the second light emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface Da of the die D of the first light emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface Da of the die D of the first light emitting element LED1 and the top surface Da of the die D of the second light emitting element LED2 are in direct contact with the packaging layer 300.

[0085] FIG. 5A to FIG. 5C A repair process of a display device according to an embodiment of the present invention is shown.

[0086] FIG. 5A to FIG. 5C The display device 10D, 10D′ and Figures 1A to 1C The display devices 10 and 10' are similar, and the difference between the two is that: FIG. 5A to FIG. 5C Multiple light emitting elements LED and Figures 1A to 1C The multiple light emitting elements LED are different.

[0087] Please refer to Figure 5A Specifically, in this embodiment, the thickness T210-2 of the first-type semiconductor layer 210 of the second light-emitting element LED2 is greater than the thickness T210-1 of the first-type semiconductor layer 210 of the first light-emitting element LED1. Figure 5A and Figure 5B Therefore, when the repairing second light emitting element LED2 is transferred to the driving backplane 100 by using the transfer element 1, since the first type semiconductor layer 210 of the second light emitting element LED2 is thicker, when the transfer element 1 is pressed down to connect the second light emitting element LED2 to the driving backplane 100, the transfer element 1 is not easy to crush the normal first light emitting element LED1 retained on the driving backplane 100.

[0088] Please refer to Figure 5C, the multiple light-emitting elements LED of the repaired display device 10D' include a first light-emitting element LED1 and a second light-emitting element LED2. The multiple conductive patterns 131, 132 of the driving backplane 100 of the display device 10D' include a first conductive pattern 131 and a second conductive pattern 132, the first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively, the top surface LEDa of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, the top surface LEDa of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0089] In the present embodiment, the die D of the second light emitting element LED2 has the top surface LEDa of the second light emitting element LED, the die D of the first light emitting element LED1 has the top surface LEDa of the first light emitting element LED1, the top surface Da of the die D of the first light emitting element LED1 has a first distance D1 from the first conductive pattern 131, and the top surface Da of the die D of the second light emitting element LED2 has a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface Da of the die D of the second light emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface Da of the die D of the first light emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface Da of the die D of the first light emitting element LED1 and the top surface Da of the die D of the second light emitting element LED2 are in direct contact with the packaging layer 300.

[0090] FIG. 6A to FIG. 6C A repair process of a display device according to an embodiment of the present invention is shown.

[0091] FIG. 6A to FIG. 6C The display device 10E, 10E' and Figures 1A to 1C The display devices 10 and 10' are similar, and the difference between the two is that: FIG. 6A to FIG. 6C Multiple light emitting elements LED and Figures 1A to 1C The multiple light emitting elements LED are different.

[0092] Please refer to Fig. 6A Specifically, in this embodiment, the thickness T230-2 of the active layer 230 of the second light emitting element LED1 for repair is greater than the thickness T230-1 of the active layer 230 of the first light emitting element LED1. Fig. 6A and Figure 6BTherefore, when the transposition element 1 is used to transpose the repaired second light-emitting element LED2 onto the driving backplane 100, since the active layer 230 of the second light-emitting element LED2 is thicker, when the transposition element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transposition element 1 is not easy to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0093] Please refer to Figure 6C The multiple light-emitting elements LED of the repaired display device 10E' include a first light-emitting element LED1 and a second light-emitting element LED2. The multiple conductive patterns 131 and 132 of the driving backplane 100 of the display device 10E' include a first conductive pattern 131 and a second conductive pattern 132. The first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively. The top surface LEDa of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131. The top surface LEDa of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0094] In the present embodiment, the die D of the second light emitting element LED2 has the top surface LEDa of the second light emitting element LED, the die D of the first light emitting element LED1 has the top surface LEDa of the first light emitting element LED1, the top surface Da of the die D of the first light emitting element LED1 has a first distance D1 from the first conductive pattern 131, and the top surface Da of the die D of the second light emitting element LED2 has a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface Da of the die D of the second light emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface Da of the die D of the first light emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface Da of the die D of the first light emitting element LED1 and the top surface Da of the die D of the second light emitting element LED2 are in direct contact with the packaging layer 300.

[0095] 7A to 7C A repair process of a display device according to an embodiment of the present invention is shown.

[0096] 7A to 7C The display device 10F, 10F' and Figures 1A to 1C The display devices 10 and 10' are similar, and the difference between the two is that: 7A to 7C Multiple light emitting elements LED and Figures 1A to 1C The multiple light emitting elements LED are different.

[0097] Please refer to Fig. 7ASpecifically, in this embodiment, the thickness T240-2 of at least one of the electrodes 240 of the second light-emitting element LED for repair is greater than the thickness T240-1 of at least one of the electrodes 240 of the first light-emitting element LED1. Fig. 7A and Figure 7B Therefore, when the transposition element 1 is used to transpose the repair second light-emitting element LED2 onto the driving backplane 100, since the electrode 240 of the second light-emitting element LED2 is thicker, when the transposition element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transposition element 1 is not easy to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0098] Please refer to Figure 7C , the multiple light-emitting elements LED of the repaired display device 10F' include a first light-emitting element LED1 and a second light-emitting element LED2. The multiple conductive patterns 131, 132 of the driving backplane 100 of the display device 10F' include a first conductive pattern 131 and a second conductive pattern 132, the first light-emitting element LED1 and the second light-emitting element LED2 are electrically connected to the first conductive pattern 131 and the second conductive pattern 132, respectively, the top surface LEDa of the first light-emitting element LED1 has a first distance D1 from the first conductive pattern 131, the top surface LEDa of the second light-emitting element LED2 has a second distance D2 from the second conductive pattern 132, and the second distance D2 is greater than the first distance D1.

[0099] In the present embodiment, the die D of the second light emitting element LED2 has the top surface LEDa of the second light emitting element LED, the die D of the first light emitting element LED1 has the top surface LEDa of the first light emitting element LED1, the top surface Da of the die D of the first light emitting element LED1 has a first distance D1 from the first conductive pattern 131, and the top surface Da of the die D of the second light emitting element LED2 has a second distance D2 from the second conductive pattern 132. That is, in the present embodiment, the distance between the top surface Da of the die D of the second light emitting element LED2 and the second conductive pattern 132 (i.e., the second distance D2) is greater than the distance between the top surface Da of the die D of the first light emitting element LED1 and the first conductive pattern 131 (i.e., the first distance D1), wherein the top surface Da of the die D of the first light emitting element LED1 and the top surface Da of the die D of the second light emitting element LED2 are in direct contact with the packaging layer 300.

[0100] The aforementioned Figures 1A to 1C , FIG. 2A to FIG. 2C , FIG. 3A to FIG. 3C , FIG. 4A to FIG. 4C , FIG. 5A to FIG. 5C , FIG. 6A to FIG. 6C and 7A to 7C The second light emitting element LED2 can be used for on-site repair or off-site repair.

[0101] FIG. 8A to FIG. 8C A repair process of a display device according to an embodiment of the present invention is shown.

[0102] FIG. 8A to FIG. 8C The display device 10G and Figures 1A to 1C The display device 10 is similar to the display device 10, and the difference between the two is: FIG. 8A to FIG. 8C The driving backplane 100G of the embodiment is Figures 1A to 1C The driving backplane 100 of the embodiment is different.

[0103] Please refer to Fig. 8A Specifically, in this embodiment, the dielectric layer 120 of the driving backplane 100G is disposed between the pad layer 140 and the substrate 110. In particular, the dielectric layer 120 includes a flat portion 121 and a convex portion 122 protruding from the flat portion 121. In this embodiment, the area where the flat portion 121 of the driving backplane 100F is located is used to set the first light-emitting element LED1 that is first transferred to the driving backplane 100F, and the area where the convex portion 122 of the driving backplane 100F is located is used for off-site repair.

[0104] Please refer to Fig. 8A , the display device 10G can be tested to detect whether the light-emitting element LED that has been transferred to the driving backplane 100G is normal. The normal light-emitting element LED (i.e., the first light-emitting element LED1) will be retained on the driving backplane 100G, and the abnormal light-emitting element (not shown) will be removed. After that, the repair light-emitting element LED (i.e., the second light-emitting element LED2) is transferred to the driving backplane 100G and the repair light-emitting element LED is electrically connected to the driving backplane 100.

[0105] It is worth noting that in the present embodiment, the second light-emitting element LED2 for repair is transferred to the protrusion 122 of the dielectric layer 120. Therefore, when the transfer element 1 is pressed down to connect the second light-emitting element LED2 to the driving backplane 100, the transfer element 1 is not likely to crush the normal first light-emitting element LED1 retained on the driving backplane 100.

[0106] Please refer to Figure 8B and Figure 8C After the above repairing operation is completed, the encapsulation layer 300 can be driven to form on the back plate 100G to cover the first light emitting element LED1 and the second light emitting element LED2, and the repaired display device 10G' is completed. Figure 8C, the repairing second light emitting element LED2 of the display device 10G' overlaps the convex portion 122 of the dielectric layer 120, and the first light emitting element LED1 of the display device 10G' overlaps the flat portion 121 of the dielectric layer 120. The multiple light emitting elements LED of the display device 10G' include a first light emitting element LED1 and a second light emitting element LED2. The multiple pad groups 141 and 142 of the display device 10G' include a first pad group 141 and a second pad group 142, the first light emitting element LED1 and the second light emitting element LED2 are electrically connected to the first pad group 141 and the second pad group 142, respectively, and the distance A2 between at least one pad 140a of the second pad group 142 and the substrate 110 is greater than the distance A1 between at least one pad 140a of the first pad group 141 and the substrate 110.

[0107] In this embodiment, the dielectric layer 120 having the convex portion 122 may be selectively located between the conductive layer 130 and the plurality of pixel driving circuits SPC, the second conductive pattern 132 may be located on the convex portion 122 of the dielectric layer 120, the first conductive pattern 132 may be located on the flat portion 121 of the dielectric layer 120, and the distance B2 between the second conductive pattern 132 and the substrate 110 may be greater than the distance B1 between the first conductive pattern 131 and the substrate 110, but the present invention is not limited thereto. In other embodiments, other film layers (e.g., dielectric layer 150) may also be used to form the convex portion of the second light-emitting element LED2 for remote repair.

Claims

1. A display device, comprising: A drive backplane, comprising: a base; A plurality of pixel driving circuits are disposed on the substrate; and a conductive layer having a plurality of conductive patterns, wherein the plurality of conductive patterns are electrically connected to the plurality of pixel driving circuits respectively; and A plurality of light-emitting elements, respectively electrically connected to the plurality of conductive patterns, wherein each light-emitting element has a top surface facing away from the substrate; The plurality of light-emitting elements include a first light-emitting element and a second light-emitting element, the plurality of conductive patterns include a first conductive pattern and a second conductive pattern, the first light-emitting element and the second light-emitting element are electrically connected to the first conductive pattern and the second conductive pattern, respectively, the top surface of the first light-emitting element has a first distance from the first conductive pattern, the top surface of the second light-emitting element has a second distance from the second conductive pattern, and the second distance is greater than the first distance; Each light emitting element includes a first type semiconductor layer, a second type semiconductor layer and an active layer arranged between the first type semiconductor layer and the second type semiconductor layer; the thickness of at least one layer of the second light emitting element is greater than the thickness of the corresponding layer of the first light emitting element.

2. The display device as claimed in claim 1, wherein the first light-emitting element comprises a bare die, the bare die of the first light-emitting element has the top surface of the first light-emitting element, and the top surface of the bare die of the first light-emitting element is at the first distance from the first conductive pattern; the second light-emitting element comprises a bare die and a color conversion pattern, the color conversion pattern of the second light-emitting element is disposed on the bare die of the second light-emitting element, the color conversion pattern of the second light-emitting element has the top surface of the second light-emitting element, and the top surface of the color conversion pattern of the second light-emitting element is at the second distance from the second conductive pattern.

3. The display device as claimed in claim 1, wherein the first light-emitting element comprises a bare die and a color conversion pattern, the color conversion pattern of the first light-emitting element is disposed on the bare die of the first light-emitting element, the color conversion pattern of the first light-emitting element has the top surface of the first light-emitting element, and the top surface of the color conversion pattern of the first light-emitting element is at the first distance from the first conductive pattern; the second light-emitting element comprises a bare die and a color conversion pattern, the color conversion pattern of the second light-emitting element is disposed on the bare die of the second light-emitting element, the color conversion pattern of the second light-emitting element has the top surface of the second light-emitting element, and the top surface of the color conversion pattern of the second light-emitting element is at the second distance from the second conductive pattern; the thickness of the color conversion pattern of the second light-emitting element is greater than the thickness of the color conversion pattern of the first light-emitting element.

4. The display device as claimed in claim 1, wherein the first light-emitting element comprises a bare die and a color conversion pattern, the color conversion pattern of the first light-emitting element is disposed on the bare die of the first light-emitting element, the color conversion pattern of the first light-emitting element has the top surface of the first light-emitting element, and the top surface of the color conversion pattern of the first light-emitting element has the first distance from the first conductive pattern; the second light-emitting element comprises a bare die and a light-transmitting pattern, the light-transmitting pattern of the second light-emitting element is disposed on the bare die of the second light-emitting element, the light-transmitting pattern of the second light-emitting element has the top surface of the second light-emitting element, and the top surface of the light-transmitting pattern of the second light-emitting element has the second distance from the second conductive pattern; the thickness of the light-transmitting pattern of the second light-emitting element is greater than the thickness of the color conversion pattern of the first light-emitting element.

5. A display device as described in claim 1, wherein each light-emitting element includes a first-type semiconductor layer, a second-type semiconductor layer, an active layer arranged between the first-type semiconductor layer and the second-type semiconductor layer, a plurality of electrodes electrically connected to the first-type semiconductor layer and the second-type semiconductor layer, and a plurality of conductive bumps electrically connected to the plurality of electrodes, respectively; the thickness of at least one of the plurality of conductive bumps of the second light-emitting element is greater than the thickness of at least one of the plurality of conductive bumps of the first light-emitting element. 6 . The display device as claimed in claim 1 , wherein a thickness of the first-type semiconductor layer of the second light-emitting element is greater than a thickness of the first-type semiconductor layer of the first light-emitting element. 7 . The display device as claimed in claim 1 , wherein a thickness of the active layer of the second light emitting element is greater than a thickness of the active layer of the first light emitting element.

8. A display device as described in claim 1, wherein each light-emitting element further includes a plurality of electrodes electrically connected to the first-type semiconductor layer and the second-type semiconductor layer respectively; the thickness of at least one of the plurality of electrodes of the second light-emitting element is greater than the thickness of at least one of the plurality of electrodes of the first light-emitting element.

9. A display device, comprising: A drive backplane, comprising: a base; A plurality of pixel driving circuits are disposed on the substrate; and a pad layer having a plurality of pad groups, wherein the plurality of pad groups are electrically connected to the plurality of pixel driving circuits respectively; and A plurality of light-emitting elements are electrically connected to the plurality of pad groups respectively; The plurality of light-emitting elements include a first light-emitting element and a second light-emitting element, the plurality of pad groups include a first pad group and a second pad group, the first light-emitting element and the second light-emitting element are electrically connected to the first pad group and the second pad group, respectively, and the distance between at least one pad of the second pad group and the substrate is greater than the distance between at least one pad of the first pad group and the substrate; A dielectric layer is disposed between the pad layer and the substrate, wherein the dielectric layer includes a convex portion overlapping the second light emitting element and a flat portion overlapping the first light emitting element.

10. The display device as claimed in claim 9, wherein the driving backplane further comprises: a conductive layer having a plurality of conductive patterns, wherein the plurality of conductive patterns are electrically connected to the plurality of pixel driving circuits respectively, and the plurality of pad groups are electrically connected to the plurality of conductive patterns respectively; The plurality of conductive patterns include a first conductive pattern and a second conductive pattern. The first pad group and the second pad group are electrically connected to the first conductive pattern and the second conductive pattern respectively. The distance between the second conductive pattern and the substrate is greater than the distance between the first conductive pattern and the substrate.

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