Transfer device capable of aligning a pattern

Abstract

According to an aspect of the present application, a transfer device capable of aligning a pattern can be provided, including: a first pressing unit supporting a mold in which a pattern and a positioning mark are formed; a second pressing unit supporting a substrate in which resin and a positioning key are formed; and a photographing section identifying the positioning mark and the positioning key, the second pressing unit including a substrate placement section having a support area for supporting a bottom surface of the substrate and formed with a photographing path extending in a vertical direction so that one end portion is disposed in the support area, the photographing section including a lower photographing section identifying one or more of the positioning mark and the positioning key by photographing through the photographing path of the substrate placement section.

Description

TECHNICAL FIELD

[0001] The present invention relates to a transfer apparatus capable of aligning a pattern. BACKGROUND

[0002] Recently, in a display process and a semiconductor process, in order to form a pattern (for example, a structured molding pattern and a mask pattern for etching or evaporation, etc.) on a surface of a substrate (for example, a display panel and a wafer, etc.), a nano imprint lithography process is used.

[0003] The nano imprint lithography process is a technology capable of economically and effectively manufacturing a nano-structure since it can replace a conventional photo lithography process. Specifically, the nano imprint lithography process is a process of transferring a pattern to a resin by pressing a mold in which a nano-scale pattern is formed and a substrate in which the resin is formed to each other using a transfer apparatus. The transfer apparatus used in the nano imprint lithography process performs a process of separating the mold from the substrate after pressing the mold to the substrate.

[0004] On the other hand, in order to transfer a pattern of the mold to the resin of the substrate, it is necessary to press the mold and the substrate to each other while the mold and the substrate are located at a predetermined target position. The conventional transfer apparatus recognizes a positioning mark formed in the mold and a positioning key formed in the substrate by a photographing unit located at an upper side of the mold and the substrate, and thereby locates the mold and the substrate at the target position. However, when the mold is an opaque mold or the positioning key is formed at a lower side of an opaque substrate, the photographing unit included in the conventional transfer apparatus cannot recognize the positioning key formed in the substrate. In other words, when the conventional transfer apparatus cannot pass through between the positioning mark and the positioning key, there is a problem in that the mold and the substrate cannot be moved to the target position since the photographing unit cannot recognize the positioning key formed in the substrate. If the mold and the substrate are pressed to each other without being located at the target position, the pattern is not transferred to the predetermined target position of the resin, and thus a pattern substrate having a poor performance can be manufactured.

[0005] Therefore, there is a need for an apparatus capable of aligning a mold and a substrate to a target position even when the mold is an opaque mold or even when a positioning key is formed at a lower side of an opaque substrate. SUMMARY

[0006] An embodiment of the present application is invented in view of the above-described background, and aims to provide a device that can position a mold and a substrate at a target position by a photographing section even if the mold is an opaque mold or even if a positioning key is formed on the lower side of the opaque substrate.

[0007] In addition, the present application aims to provide a device that can align a horizontal position to position a mold and a substrate at a predetermined target position before transferring a pattern of the mold to a resin of the substrate.

[0008] In addition, the present application aims to provide a device that can accurately transfer a pattern to a predetermined target position of a resin.

[0009] According to an aspect of the present application, a transfer device that can align a pattern can be provided, including: a first pressing unit that supports a mold on which a pattern and a positioning mark are formed; a second pressing unit that supports a substrate on which a resin and a positioning key are formed; and a photographing section that recognizes the positioning mark and the positioning key, the second pressing unit including: a substrate placement section that has a support area for supporting a bottom surface of the substrate and is formed with a photographing path that extends in an up-down direction so that one end portion is disposed in the support area, the photographing section including: a lower photographing section that recognizes any one or more of the positioning mark and the positioning key by photographing through the photographing path of the substrate placement section.

[0010] In addition, a transfer device that can align a pattern can be provided, the photographing section further including: an upper photographing section that recognizes the other one of the positioning key and the positioning mark when the lower photographing section recognizes any one of the positioning key and the positioning mark.

[0011] In addition, a transfer device that can align a pattern can be provided, any one of the first pressing unit and the second pressing unit moves toward the other one, one or more of the first pressing unit and the second pressing unit moves and aligns a horizontal position of the mold and the substrate based on any one or more of the positioning mark and the positioning key recognized by the lower photographing section, and the mold and the substrate that are aligned at the horizontal position are pressed against each other, thereby pressing against each other to transfer the pattern to the resin, the lower photographing section is configured to adjust one or more of a horizontal position, a vertical position, and an angle to direct a field of view angle toward a position at which the positioning mark and the positioning key are formed.

[0012] In addition, a transfer device that can align a pattern can be provided, the lower photographing section is configured to have a first focal distance that recognizes the positioning mark and a second focal distance that recognizes the positioning key, and a focal distance is changed to the first focal distance or the second focal distance.

[0013] Further, a transfer device capable of aligning a pattern can be provided, the positioning mark includes a first positioning mark and a second positioning mark, the positioning key includes a first positioning key corresponding to the first positioning mark and a second positioning key corresponding to the second positioning mark, and the lower photographing section includes a first lower photographing section for recognizing one or more of the first positioning mark and the first positioning key, and a second lower photographing section for recognizing one or more of the second positioning mark and the second positioning key.

[0014] Further, a transfer device capable of aligning a pattern can be provided, the second pressing unit further includes a photographing guide section communicating with one side of the photographing path and connected with the lower photographing section at the other side opposite to the one side, and a reflection section disposed between the photographing path and the photographing guide section, the photographing guide section is arranged in a direction deviated from the up-and-down direction, and the lower photographing section recognizes the positioning key through the reflection section.

[0015] Further, a transfer device capable of aligning a pattern can be provided, the substrate placing section includes a placing section body formed with the photographing path, a shielding window for cutting off the flow of gas in the photographing path, and a shielding member disposed between the shielding window and the placing section body for cutting off the flow of gas between the shielding window and the placing section body.

[0016] Further, a transfer device capable of aligning a pattern can be provided, the placing section body includes an upper placing section provided with the support area and a lower placing section supporting the upper placing section, the photographing path includes a first path section formed in the upper placing section and a second path section formed in the lower placing section, the one or more shielding windows include a first shielding window disposed on the first path section for cutting off the flow of gas inside the first path section and a second shielding window spaced apart from the first shielding window and disposed on the second path section for cutting off the flow of gas inside the second path section, and the one or more shielding members include a first shielding member between the first shielding window and the upper placing section and a second shielding member between the second shielding window and the lower placing section.

[0017] Further, a transfer device capable of aligning a pattern can be provided, the transfer device further includes a position adjustment section for adjusting the horizontal position of the substrate placing section and a lifting section for lifting the position adjustment section, and the lower photographing section moves together with the substrate placing section moved by the position adjustment section and the lifting section.

[0018] Further, a pattern alignable transfer device can be provided, the pattern alignable transfer device further including a control section that performs control for operation of the first pressing unit, the second pressing unit, and the position adjustment section.

[0019] Further, a pattern alignable transfer device can be provided, the pattern alignable transfer device including a first pressing unit that supports a mold on which a pattern is formed, and a second pressing unit that supports a substrate on which a resin is formed, the second pressing unit including a substrate placement section that supports the substrate, a position adjustment section that adjusts a horizontal position of the substrate placement section, and a bellows that, when elongated, contacts one end portion to the first pressing unit to allow a space around the substrate to be sealed from the outside, the position adjustment section adjusting the horizontal position of the substrate placement section in a state in which the one end portion of the bellows contacts the first pressing unit.

[0020] Further, a pattern alignable transfer device can be provided, the second pressing unit further including a bellows moving section that is supported by an outside of the substrate placement section and that is connected to the bellows to elongate and contract the bellows, the bellows moving section including a lift cylinder that includes a shaft and a cylinder actuator that provides a driving force for moving the shaft, a block that is provided to an end portion of the shaft, and a bellows connecting section that supports the block to allow the block to move in a horizontal direction, the bellows connecting section having a placement groove that extends in the horizontal direction to place the block and a receiving groove that extends in a vertical direction to communicate with the placement groove and to surround the shaft with a predetermined gap, the shaft moving in the horizontal direction in the receiving groove when adjusting the horizontal position of the substrate placement section in the state in which the one end portion of the bellows contacts the first pressing unit.

[0021] Further, a pattern alignable transfer device can be provided, the bellows being elastically deformed in the state in which the one end portion of the bellows contacts the first pressing unit to allow the horizontal position of the substrate placement section to be adjusted.

[0022] Further, a pattern alignable transfer device can be provided, the first pressing unit further including a mold clamp that supports an edge portion of the mold, that contacts the one end portion of the bellows when the bellows is in the state in which the one end portion contacts the first pressing unit, a clamp that supports an edge of the mold clamp to fix the mold clamp to the first pressing unit side, and a sealing section that contacts an upper portion of the mold clamp with a lower portion, the clamp including a sliding member that supports the mold clamp from a lower portion, the mold clamp being inserted between the sliding member and the sealing section to be supported by the clamp.

[0023] Further, a transfer device capable of aligning a pattern can be provided, the first pressing unit further including: a mold jig that supports an edge portion of the mold, that is in contact with the one end portion of the bellows when in the contact state, in which a jig sealing member is provided, and a bellows sealing member is provided to the one end portion of the bellows, the jig sealing member and the bellows sealing member being in contact with each other when in the contact state to prevent gas from flowing between the mold jig and the one end portion of the bellows, the jig sealing member and the bellows sealing member having shapes different from each other.

[0024] Further, a transfer device capable of aligning a pattern can be provided, the first pressing unit including: a mold jig that supports an edge portion of the mold, that is in contact with the one end portion of the bellows when in the contact state; a UV-transmitting window that supports the mold and transmits UV; a seal portion that is annularly projected and that is in contact with the mold jig below to be able to seal the periphery of the UV-transmitting window from the outside; and a first exhaust portion for exhausting gas remaining in a space sealed inside the seal portion to the outside when the seal portion seals the space around the UV-transmitting window from the outside.

[0025] Further, a transfer device capable of aligning a pattern can be provided, the second pressing unit further including: a second exhaust portion for exhausting gas remaining in a space sealed inside the bellows to the outside when the bellows seals the space around the substrate from the outside, the first exhaust portion and the second exhaust portion working to prevent a difference between gas pressure inside the seal portion and gas pressure inside the bellows from exceeding a predetermined range.

[0026] Further, a transfer device capable of aligning a pattern can be provided, the transfer device capable of aligning a pattern further including: a control portion that performs control for the operation of the first pressing unit, the second pressing unit, and the positioning portion.

[0027] Further, a method of manufacturing a pattern substrate by pressing a mold in which a pattern and a positioning mark are formed against a substrate in which resin and a positioning key are formed can be provided, the method of manufacturing a pattern substrate including: a photographing step in which a photographing portion photographs the positioning mark formed in the mold and the positioning key formed in the substrate; a first positioning step in which a positioning portion adjusts a horizontal position of the substrate; a sealing step in which a bellows seals a space around the substrate from the outside and exhausts gas remaining in the space around the substrate to the outside; a second positioning step in which the positioning portion adjusts the horizontal position of the substrate again after the sealing step; and a substrate pressing step of pressing the substrate to the mold.

[0028] Further, a method of manufacturing a pattern substrate can be provided, one or more of the first positioning step and the second positioning step being performed multiple times before the substrate pressing step, the photographing step being performed each time the first positioning step and the second positioning step are performed.

[0029] Further, a method of manufacturing a pattern substrate can be provided, further comprising: a lifting step of lifting the positioning portion, the photographing step and the first positioning step being performed multiple times by the lifting step, the photographing step and the first positioning step being performed when the substrate is lifted by a predetermined distance by the lifting step, and the photographing step and the first positioning step being performed again when the substrate is lifted by more than the predetermined distance by the lifting step.

[0030] Further, a method of manufacturing a pattern substrate can be provided, the horizontal movement distance of the substrate moved by the second positioning step being smaller than the horizontal movement distance of the substrate moved by the first positioning step.

[0031] Further, a computer-readable recording medium storing a computer program for performing a method of manufacturing a pattern substrate by pressing a mold formed with a pattern and a positioning mark against a substrate formed with a resin and a positioning key, the computer program being programmed to perform: a storing step of storing image information of the positioning key photographed by a lower photographing portion and the positioning mark photographed by an upper photographing portion in the computer-readable recording medium; a calculating step of calculating position information of the positioning mark and the positioning key based on the image information stored in the computer-readable recording medium; and an outputting step of outputting a command for adjusting the position of the mold or the substrate based on the calculated position information, the calculating step obtaining a path value of the calculated position of the positioning key moving to the calculated position of the positioning mark, the outputting step further outputting a command for adjusting the center position of the image information of the positioning key according to the obtained path value.

[0032] Effects of Invention

[0033] According to embodiments of the present invention, there is an effect of being able to align the horizontal position before transferring the pattern of the mold to the resin of the substrate so that the mold and the substrate are positioned at a predetermined target position.

[0034] Further, there is an effect of being able to accurately transfer the pattern to the predetermined target position of the resin.

[0035] Further, even if the mold is an impermeable mold or a positioning key is formed on the lower side of an impermeable substrate, there is an effect of being able to position the mold and the substrate at a target position by the photographing portion. Attached Figure Description

[0036] Figure 1 This is a perspective view of a transfer apparatus capable of aligning a pattern according to an embodiment of the present invention.

[0037] Figure 2 yes Figure 1 A plan view of the mold.

[0038] Figure 3 yes Figure 1 A bottom view of the substrate.

[0039] Figure 4 It is along Figure 1 The cross-sectional view taken from A-A'.

[0040] Figure 5 It is when the second pressing unit moves along the upward direction. Figure 1 The cross-sectional view taken from A-A'.

[0041] Figure 6 It is along Figure 1 The cross-sectional view taken from B-B'.

[0042] Figure 7 Is when Figure 1 A cross-sectional view taken along B-B' when the camera part is moved to a non-camera position.

[0043] Figure 8 yes Figure 6 A magnified view of B.

[0044] Figure 9 yes Figure 1 Side view.

[0045] Figure 10 It is decomposition Figure 1 An exploded perspective view of the mold support components.

[0046] Figure 11 This is a perspective view showing the clamps moving along the lower side and inserting into the mold fixture.

[0047] Figure 12 It is a perspective view showing the state in which the mold clamp moves into the space between the clamp and the sealing part and is placed in the clamp.

[0048] Figure 13 yes Figure 9 The enlarged view of D shows a perspective view of the mold fixture being moved into the space between the clamp and the sealing part and placed in the clamp.

[0049] Figure 14 This is a front view showing the mold clamp positioned between the clamp and the sealing part so that the mold clamp contacts the sealing part.

[0050] Figure 15 is Figure 4 a magnified view of C of

[0051] Figure 16 is Figure 9 a magnified view of E of

[0052] Figure 17 is a sectional view taken along Figure 16 X-X' of

[0053] Figure 18 is an exploded perspective view of Figure 1

[0054] Figure 19 is a bottom exploded perspective view of Figure 1

[0055] Figure 20 is a flowchart schematically showing a method of manufacturing a pattern substrate according to an embodiment of the present application.

[0056] (Explanation of Reference Numerals)

[0057] 1: transfer device capable of aligning a pattern

[0058] 10: mold

[0059] 11: positioning mark

[0060] 11a: first positioning mark

[0061] 11b: second positioning mark

[0062] 20: substrate

[0063] 21: positioning key

[0064] 21a: first positioning key

[0065] 21b: second positioning key

[0066] 100: first pressing unit

[0067] 110: mold support

[0068] 111: mold clamp

[0069] 111a: clamp sealing member

[0070] 112: clamp

[0071] 112a: sliding member

[0072] 112b: clamp body

[0073] 113: clamp mover ​​

[0074] 114: mover support

[0075] 120: UV-transmitting window

[0076] 130: closed portion

[0077] 140: first exhaust portion

[0078] 150: closed portion sealing member

[0079] 200: second pressing unit

[0080] 210: substrate placement portion

[0081] 210a: imaging path

[0082] 210a-1: first path portion

[0083] 210a-2: second path portion

[0084] 211: placement portion main body

[0085] 211a: upper placement portion

[0086] 211b: lower placement portion

[0087] 213: shielding window

[0088] 213a: first shielding window

[0089] 213b: second shielding window

[0090] 214: shielding member

[0091] 214a: first shielding member

[0092] 214b: second shielding member

[0093] 220: positioning portion

[0094] 221: first adjustment portion

[0095] 222: second adjustment portion

[0096] 223: third adjustment portion

[0097] 230: lifting portion

[0098] 240: bellows

[0099] 241: bellows sealing member

[0100] 250: second exhaust portion

[0101] 260: bellows moving portion

[0102] 261: Lifting cylinder

[0103] 261a: Shaft

[0104] 261b: Cylinder actuator

[0105] 262: Block

[0106] 263: Bellows connection

[0107] 263a: Mounting groove

[0108] 263b: Receiving groove

[0109] 280: Imaging guide

[0110] 290: Reflection

[0111] 300: Imaging

[0112] 310: Upper imaging

[0113] 320: Lower imaging

[0114] 400: UV irradiation

[0115] 500: Drive

[0116] 510: Support

[0117] 520: Support actuator

[0118] 600: Control DETAILED DESCRIPTION

[0119] Hereinafter, a specific embodiment for implementing the technical idea of the present application will be described in detail with reference to the accompanying drawings.

[0120] Also, in explaining the present application, when it is judged that a specific explanation for a related known structure or function can cause the gist of the present application to be obscure, the detailed explanation thereof is omitted.

[0121] In addition, when a certain constituent element is mentioned to be "supported", "flowed into", "discharged", "fixed" by other constituent element, it can be directly supported, flowed into, discharged, fixed by the other constituent element, but it should be understood that other constituent element can exist in the middle.

[0122] The terms used in the present specification are only used to explain specific embodiments, and are not intended to limit the intent of the present application. The singular expression includes the plural expression, unless it is clearly different in the context.

[0123] In addition, terms including numerals such as first, second, and the like can be used in the description of various constituent elements, but the corresponding constituent elements are not limited to such terms. The terms are used only for the purpose of distinguishing one constituent element from other constituent elements.

[0124] The meaning of "include" used in the specification is to specify a certain characteristic, region, integer, step, action, factor, and / or component, and does not exclude the presence or addition of other specific characteristics, regions, integers, steps, actions, factors, components, and / or groups.

[0125] In addition, it is previously clarified that, in the present specification, expressions of upper side, lower side, bottom surface, and the like are described based on the illustration in the drawings, and if the direction of the corresponding object is changed, it can be expressed differently. On the other hand, in the present specification, the left-right direction can be the x-axis direction (x1 is the right side, and x2 is the left side) of Figure 1 , Figure 4 and Figure 5 . In addition, the front-rear direction can be the y-axis direction (y1 is the front side, and y2 is the rear side) of Figure 1 , Figure 6 , Figure 7 and Figure 9 . In addition, the up-down direction can be the z-axis direction (z1 is the upper side, and z2 is the lower side) of Figure 1 , Figure 4 to Figure 7 and Figure 9 . In addition, the θ-axis direction can be a direction in which the z-axis direction of Figure 1 is rotated as a central axis. In addition, the horizontal direction can be one or a combination of the x-axis direction and the y-axis direction. In addition, the horizontal position can be a position on a virtual plane of the x-axis direction and the y-axis direction. In addition, the vertical direction can be the z-axis direction. In addition, the vertical position can be a position on a virtual straight line of the z-axis direction.

[0126] Hereinafter, with reference to the accompanying drawings, a detailed structure of a transfer device 1 capable of aligning a pattern according to an embodiment of the present application will be described.

[0127] Hereinafter, with reference to Figure 1 , Figure 4 and Figure 5 , the transfer device 1 capable of aligning a pattern according to an embodiment of the present application can press the mold 10 and the substrate 20 to each other, thereby pressing each other to transfer a pattern formed in the mold 10 to a resin formed in the substrate 20. Here, the meaning of transferring a pattern to a resin can be the meaning of transferring a pattern (not shown) formed in the mold 10 to a resin formed in the substrate 20. In addition, the meaning of transferring the mold 10 to the substrate 20 can be the meaning of transferring a pattern formed in the mold 10 to a resin formed in the substrate 20.

[0128] In addition, the pattern alignable transfer device 1 can align the relative horizontal positions between the mold 10 and the substrate 20 before transferring the pattern to the resin, so that the mold 10 and the substrate 20 are positioned at target positions. Here, the target positions of the mold 10 and the substrate 20 can mean the horizontal positions of the mold 10 and the substrate 20 in a state where the positioning marks 11 and the positioning keys 21, which will be described later, are arranged to match each other when the mold 10 and the substrate 20 are viewed from the upper side.

[0129] Thus, the pattern alignable transfer device 1 has an effect of aligning the horizontal positions before transferring the pattern of the mold 10 to the resin of the substrate 20, so that the mold 10 and the substrate 20 can be positioned at predetermined target positions. In addition, it has an effect of being able to accurately transfer the pattern to the predetermined target positions of the resin.

[0130] The mold 10 can be supported by the pattern alignable transfer device 1. In addition, the mold 10 can be an impermeable mold of an opaque material, but is not limited thereto. In addition, a pattern of a resin to be transferred to the substrate 20 can be formed on one side of the mold 10.

[0131] Reference Figure 2 The positioning marks 11 can be formed on the mold 10, and the positioning marks 11 serve as a reference for alignment to be positioned at predetermined target positions together with the substrate 20. For example, as the mold 10 is supported by the first pressing unit 100, which will be described later, the pattern can be arranged on the lower side of the mold 10 to face the lower side.

[0132] The positioning marks 11 can be formed on one or more of the lower side and the upper side of the mold 10.

[0133] In addition, the pattern can be formed at a lower side than the positioning marks 11.

[0134] The positioning marks 11 can be provided as a plurality of positioning marks in the mold 10. In addition, the positioning marks 11 can include a first positioning mark 11a and a second positioning mark 11b disposed apart from the first positioning mark 11a.

[0135] The photographing unit 300, which will be described later, can recognize the positioning marks 11 as one or more of the lower side and the upper side of the mold 10 are recognized.

[0136] The substrate 20 can be supported by the pattern alignable transfer device 1. In addition, the substrate 20 can be an impermeable substrate of an opaque material, but is not limited thereto. For example, the impermeable substrate can be a silicon wafer, a metal evaporation wafer, or the like. In addition, a resin to which a pattern is to be transferred can be formed on one side of the substrate 20. In addition, the resin can be formed by being coated on the surface of the substrate 20.

[0137] ReferenceFigure 3 A positioning key 21 can be formed in one or more of the upper side and the lower side of the substrate 20. In addition, resin can be formed at a position higher than the positioning key 21.

[0138] The positioning key 21 can be formed in one or more of the upper side and the lower side of the substrate 20. In addition, resin can be formed at a position higher than the positioning key 21.

[0139] The positioning key 21 can be formed in one or more of the upper side and the lower side of the substrate 20. In addition, resin can be formed at a position higher than the positioning key 21.

[0140] The photographing section 300 described later can recognize the positioning key 21 by recognizing one or more of the upper side and the lower side of the substrate 20.

[0141] The positioning key 21 can be formed in one or more of the upper side and the lower side of the substrate 20. In addition, resin can be formed at a position higher than the positioning key 21.

[0142] The positioning key 21 can be formed in one or more of the upper side and the lower side of the substrate 20. In addition, resin can be formed at a position higher than the positioning key 21.

[0143] Referring to Figure 4 and Figure 5 , the transfer device 1 capable of aligning a pattern can include a first pressing unit 100, a second pressing unit 200, a photographing section 300, a UV irradiation section 400, a driving section 500, and a control section 600.

[0144] The following is a description of the first pressing unit 100.

[0145] The first pressing unit 100 can support the mold 10. Also, the second pressing unit 200 can support the substrate 20. Also, either one of the first pressing unit 100 and the second pressing unit 200 can move toward the other. In other words, either one of the first pressing unit 100 and the second pressing unit 200 can move in a vertical direction. Also, one or more of the first pressing unit 100 and the second pressing unit 200 can align a horizontal position by moving along a horizontal direction based on the positioning mark 11 and the positioning key 21 so that the mold 10 and the substrate 20 are located at a target position. Also, one or more of the first pressing unit 100 and the second pressing unit 200 can be raised and lowered so that the mold 10 and the substrate 20, which are aligned in the horizontal position, are pressed to each other, thereby accurately transferring a pattern to a target position of the resin.

[0146] The first pressing unit 100 includes a mold support 110, a UV transparent window 120, a sealing portion 130, a first exhaust portion 140, a sealing portion sealing member 150, and a support moving portion (not shown).

[0147] Referring again to Figure 6 to Figure 9 The mold support 110 can be provided in order to support the mold 10. For example, the mold 10 can be supported by the mold support 110 so that a pattern faces a lower side.

[0148] The mold support 110 can include a mold clamp 111, a clamp 112, a clamp mover 113, and a mover support 114.

[0149] The mold clamp 111 can support the mold 10. Also, the mold clamp 111 can be partially open so that a central portion of the mold 10 is exposed toward the substrate 20. Here, the central portion of the mold 10 exposed by the mold clamp 111 can mean a portion in which a pattern is formed in the mold 10 or a portion of the mold 10 supported by the UV transparent window 120 described later. Also, the mold clamp 111 can support an edge portion of the mold 10. Accordingly, the mold clamp 111 can fix the mold 10 to be closely attached to the mold clamp 111 by exposing the central portion of the mold 10 and supporting an edge of the mold 10. The mold clamp 111 can be supported between the clamp 112 and the sealing portion 130, and can be slidable to be removed from between the clamp 112 and the sealing portion 130.

[0150] The mold clamp 111 can be provided with a clamp sealing member 111a.

[0151] As Figure 8As shown, the jig sealing member 111a can be disposed on the bottom surface of the mold jig 111 to contact the bellows sealing member 241 disposed on the end portion of the bellows 240 to be described later that contacts the mold jig 111. In addition, the jig sealing member 111a can prevent gas from flowing between the mold jig 111 and the end portion of the bellows 240 by contacting the bellows sealing member 241. In addition, the jig sealing member 111a can include a flat ring that is inserted into a groove formed on the bottom surface of the mold jig 111.

[0152] Referring to Figure 10 to Figure 13 , the clamp 112, the clamp mover 113, and the mover support 114 will be described. Figure 10 is an exploded perspective view of the mold support 110. Figure 11 is a view showing a state in which the clamp 112 is moved downward with the mold jig 111 being slidable to a space between the clamp 112 and the sealing portion 130. Figure 12 is a perspective view showing a state in which the mold jig 111 is placed on the clamp 112 by being moved to the space between the clamp 112 and the sealing portion 130.

[0153] Figure 13 and Figure 14 is a side view and a front view showing a state in which the mold jig 111 is interposed between the clamp 112 and the sealing portion 130 such that the upper surface of the mold jig 111 contacts the sealing portion 130.

[0154] The clamp 112 can support the edge of the mold jig 111 to fix the mold jig 111 to the first pressing unit 100 side.

[0155] The clamp 112 can include a sliding member 112a supporting the mold jig 111 and a clamp body 112b supporting the sliding member 112a.

[0156] The sliding member 112a can be supported by the clamp body 112b in a state in which the sliding member 112a is spaced apart from the sealing portion 130 by a predetermined distance in the vertical direction. Accordingly, a space for inserting the mold jig 111 can be provided between the sliding member 112a and the sealing portion 130.

[0157] The clamp mover 113 can move the clamp 112 in the vertical direction. For example, the clamp mover 113 can be supported by the mover support 114 to move the sliding member 112a and the clamp body 112b in the vertical direction.

[0158] The mover support 114 can support the clamp mover 113 supported by the sealing portion 130. For example, the mover support 114 can be attached to the side surface of the sealing portion 130 to support the clamp mover 113.

[0159] Next, the process in which the mold jig 111 is slid and inserted between the clamp 112 and the seal portion 130 will be described.

[0160] First, as shown in FIG. 6, the clamp mover 113 moves the clamp 112 in the downward direction. If the clamp 112 is moved in the downward direction, the distance between the clamp 112 and the seal portion 130 in the vertical direction becomes larger. Figure 11

[0161] In this state, as shown in FIG. 7, the mold jig 111 is slid from the outside space to the space between the clamp 112 and the seal portion 130 and is placed on the sliding member 112a. In addition, in order to place the mold jig 111 on the clamp 112, the direction of the sliding can be the front and back direction. Figure 12

[0162] Subsequently, as shown in FIG. 8 and FIG. 9, the clamp 112 is moved in the upward direction by the clamp mover 113. If the clamp 112 is moved in the upward direction, the mold jig 111 can be fixed between the clamp 112 and the seal portion 130 so as to be in contact with the seal portion 130 by the upward movement of the clamp 112. Figure 13 Figure 14

[0163] Thus, the mold jig 111 is fixed by the clamp 112 with the edge portion thereof pressed by the seal portion 130, thereby having an effect of preventing arbitrary movement between the clamp 112 and the seal portion 130,

[0164] On the other hand, the process in which the mold jig 111 is removed from between the clamp 112 and the seal portion 130 can be performed in the reverse order of the above-described process in which the mold jig 111 is slid and inserted.

[0165] Referring again to FIG. 10, Figure 6 to Figure 8 the UV-transmitting window 120 can be configured so as to transmit UV irradiated from the UV irradiation portion 400. In addition, the bottom surface of the UV-transmitting window 120 can support the mold 10. In addition, the UV-transmitting window 120 can be surrounded by the seal portion 130 to be cut off from the outside.

[0166] The seal portion 130 can seal the periphery of the UV-transmitting window 120 from the outside. In other words, the seal portion 130 is provided so as to surround the UV-transmitting window 120, thereby being able to cut off the UV-transmitting window 120 from the outside. In addition, the lower portion of the seal portion 130 can be in contact with the mold jig 111. For example, the seal portion 130 can be a ring shape protruding in part to be in contact with the mold jig 111.

[0167] ​​​​The closed portion 130 can be provided as a portion of the closed portion 130 and is spaced apart from the UV transmission window 120. Thus, a predetermined spaced apart space S can be formed between the closed portion 130 and the UV transmission window 120. In addition, the spaced apart space S can be communicated with the first exhaust portion 140. In addition, when the lower portion of the closed portion 130 contacts the upper portion of the mold jig 111, the gas remaining in the inner side of the spaced apart space S can be exhausted to the outside through the first exhaust portion 140. In addition, the lower portion of the closed portion 130 contacts the upper portion of the mold jig 111 so that the spaced apart space S is closed. Thus, as the closed portion 130 contacts the upper portion of the mold jig 111, the air of the spaced apart space S can be exhausted while preventing the air from flowing in from the outside, and thus, the spaced apart space S can be formed in a vacuum state.

[0168] Thus, based on the spaced apart space S being formed in a vacuum state, the inflow of air to the substrate 20 can be cut off, and thus, it has an effect that the surroundings of the UV transmission window 120 can be more effectively sealed with respect to the outside.

[0169] The first exhaust portion 140 can exhaust the gas between the UV transmission window 120 and the closed portion 130 to the outside. In other words, when the closed portion 130 seals the space around the UV transmission window 120 with respect to the outside, the first exhaust portion 140 can exhaust the gas remaining in the inner side of the spaced apart space S to the outside. In addition, the first exhaust portion 140 can include a nozzle exposed at the inner circumferential surface of the closed portion 130.

[0170] The closed portion sealing member 150 can cut off the inflow of gas between the mold jig 111 and the closed portion 130. In addition, the closed portion sealing member 150 can be located between the mold jig 111 and the closed portion 130. In addition, the closed portion sealing member 150 can include an elastic ring embedded in a groove formed along the upper portion in the bottom surface of the closed portion 130.

[0171] The support member moving portion (not shown) can move the mold support member 110 in the horizontal direction so that the center position of the mold 10 is moved in the horizontal direction. For example, when the substrate 20 has a relatively larger area than the mold 10, the support member moving portion can move the mold support member 110 to move the mold 10 from one point to another point on the upper side of the substrate 20, and sequentially transfer the pattern of the mold 10 to the substrate 20 having a larger area than the mold 10 in a partial region.

[0172] The following is a description of the second pressing unit 200.

[0173] Referring to Figure 4 and Figure 5 , the second pressing unit 200 can support the substrate 20 and adjust the position of the substrate 20. In other words, the second pressing unit 200 can align the horizontal position of the substrate 20.

[0174] The second pressing unit 200 can approach the substrate 20 toward the mold 10. In other words, the second pressing unit 200 can move the substrate 20 in the vertical direction.

[0175] The second pressing unit 200 can include a substrate placing portion 210, a positioning portion 220, a lifting portion 230, a bellows 240, a second exhaust portion 250, a bellows moving portion 260, a photographing guide portion 280, and a reflection portion 290.

[0176] Referring to FIG. 15 again, the substrate placing portion 210 can provide a portion for placing the substrate 20. In addition, the substrate placing portion 210 can have a support area for supporting the lower side of the substrate 20. In addition, a photographing path 210a extending in the vertical direction can be formed in the substrate placing portion 210 so that one end portion is disposed at the support area.

[0177] The photographing path 210a can include a first path portion 210a-1 and a second path portion 210a-2 on the lower side than the first path portion 210a-1. In addition, the lower photographing portion 320 can recognize the positioning key 21 of the substrate 20 described later through the photographing path 210a.

[0178] The substrate placing portion 210 can include a placing portion body 211, a shielding window 213, and a shielding member 214.

[0179] The placing portion body 211 can support the substrate 20. In addition, the photographing path 210a can be formed in the placing portion body 211. In addition, the placing portion body 211 can be supported by the positioning portion 220 shown in FIG. 15. Figure 5

[0180] The placing portion body 211 can include an upper placing portion 211a and a lower placing portion 211b.

[0181] The upper placing portion 211a is disposed on the upper side than the lower placing portion 211b and has a support area for supporting the substrate 20. In addition, the upper placing portion 211a can form the first path portion 210a-1. In addition, the first path portion 210a-1 can pass through the upper placing portion 211a in the vertical direction. In addition, one end portion of the first path portion 210a-1 can be provided at the support area of the upper placing portion 211a.

[0182] The lower placing portion 211b can support the upper placing portion 211a. In addition, the second path portion 210a-2 can be formed in the lower placing portion 211b. In addition, the second path portion 210a-2 can pass through the lower placing portion 211b in the vertical direction. In addition, the second path portion 210a-2 can be connected with the first path portion 210a-1 and not communicated with the first path portion 210a-1 through the shielding window 213. ​

[0183] The shielding window 213 can cut off the flow of gas in the photographing path 210a. In addition, the shielding window 213 can include a first shielding window 213a and a second shielding window 213b.

[0184] The first shielding window 213a can cut off the inflow of gas between the upper placement portion 211a and the lower placement portion 211b inside the first path portion 210a-1. In addition, the first shielding window 213a can be disposed in the first path portion 210a-1.

[0185] The second shielding window 213b can cut off the inflow of gas between the upper placement portion 211a and the lower placement portion 211b inside the second path portion 210a-2. In addition, the second shielding window 213b can be spaced apart from the first shielding window 213a in the up-and-down direction and disposed in the second path portion 210a-2. In other words, the first shielding window 213a and the second shielding window 213b can be disposed spaced apart from each other.

[0186] As such, based on the first shielding window 213a and the second shielding window 213b being disposed spaced apart from each other, it is possible to prevent damage between them, having an effect of helping to maintain the level of the placement portion main body 211. In addition, since the first shielding window 213a and the second shielding window 213b are spaced apart from each other without being in contact with each other, even if the position of the upper placement portion 211a with respect to the lower placement portion 211b is adjusted or shaken due to the movement of the placement portion main body 211 in order to align the level of the placement portion main body 211, it has an effect of preventing one or more of the first shielding window 213a and the second shielding window 213b from being worn due to friction.

[0187] The shielding member 214 can cut off the flow of gas between the shielding window 213 and the placement portion main body 211. In addition, the shielding member 214 can be disposed between the shielding window 213 and the placement portion main body 211. In addition, the horizontal direction length of the shielding member 214 can be formed to be greater than the horizontal direction length of the photographing path 210a. In other words, with the center of the photographing path 210a as a reference, the radius of the shielding member 214 can be formed to be greater than the radius of the photographing path 210a of the portion adjacent to the shielding member 214.

[0188] As such, it has an effect that since the shielding member 214 is formed to be large, it does not interfere with the photographing path 210a, it is possible to greatly secure the level at which the photographing space through the shielding window 213 is the same as the width of the photographing path 210a while sealing between the shielding member 214 and the placement portion main body 211.

[0189] The shielding member 214 can include a first shielding member 214a and a second shielding member 214b.

[0190] The first blocking member 214a can prevent gas from flowing between the first blocking window 213a and the first path portion 210a-1. In addition, the first blocking member 214a can be disposed between the first blocking window 213a and the upper seating portion 211a. In addition, the first blocking member 214a can include an elastic ring formed along the circumference of the first blocking window 213a.

[0191] The second blocking member 214b can prevent gas from flowing between the second blocking window 213b and the second path portion 210a-2. In addition, the second blocking member 214b can be disposed between the second blocking window 213b and the lower seating portion 211b. In addition, the second blocking member 214b can include an elastic ring formed along the circumference of the second blocking window 213b.

[0192] Referring to Figure 4 to Figure 7 and Figure 9 The positioning portion 220 can adjust the horizontal position of the substrate seating portion 210. For example, the positioning portion 220 can move the substrate seating portion 210 in the front-rear direction and the left-right direction (horizontal direction), and can rotate the substrate seating portion 210. Thus, the positioning portion 220 can align the mold 10 and the substrate 20 to be positioned at a target position by adjusting the position of the substrate seating portion 210. In addition, when one end portion of the bellows 240 contacts the first pressing unit 100, i.e., in a contact state, the positioning portion 220 can readjust the horizontal position of the substrate seating portion 210.

[0193] The positioning portion 220 can be an alignment stage. For example, the positioning portion 220 can be an xyθ stage that forms movement work in the x-axis direction, the y-axis direction, and the θ-axis direction by independent work of a plurality of modules (i.e., movement work in the x-axis direction, the y-axis direction, and the θ-axis direction is formed by independent work of each module that moves in the x-axis direction, the y-axis direction, and the θ-axis direction). As another example, the positioning portion 220 can be an uvw stage that forms movement work in the x direction, the Y direction, and the θ direction by cooperative work of a plurality of modules (i.e., movement work in the x direction, the Y direction, and the θ direction is formed by work combination of each module that moves in the u-axis, the v-axis, and the w-axis).

[0194] The positioning portion 220 can be located on the upper side of the lifting portion 230 and be lifted by the lifting portion 230.

[0195] The positioning portion 220 can include a first adjustment portion 221, a second adjustment portion 222, and a third adjustment portion 223.

[0196] The first adjustment section 221, the second adjustment section 222, and the third adjustment section 223 can be respective modules that move along the u-axis, the v-axis, and the w-axis of the uvw stage that adjusts the horizontal position of the substrate placement section 210. In addition, even in a state in which one end portion of the bellows 240 contacts the first pressing unit 100, the first adjustment section 221, the second adjustment section 222, and the third adjustment section 223 can move the substrate placement section 210 along the front-back direction (y-axis direction), can move along the left-right direction (x-axis direction), and can be rotated.

[0197] Thus, the effect of being able to align the mold 10 and the substrate 20 in the target position can be obtained by the adjustment section 220 adjusting the horizontal position of the substrate placement section 210 based on the positioning mark 11 and the positioning key 21. In addition, when the bellows 240 is in the contact state, by adjusting the horizontal position of the substrate 20 again, the effect of being able to more accurately adjust the relative position between the mold 10 and the substrate 20 can be obtained.

[0198] The lifting section 230 can lift and lower the substrate placement section 210. For example, the lifting section 230 can move the substrate placement section 210 in a direction perpendicular to the floor surface. In addition, the lifting section 230 can lift and lower the substrate placement section 210, thereby bringing the substrate 20 closer to or away from the first pressing unit 100. In addition, the lifting section 230 can move the substrate 20 toward the first pressing unit 100, thereby pressing the substrate 20 to the mold 10.

[0199] The bellows 240 can be configured to seal the space around the substrate 20 from the outside. In other words, the bellows 240 can seal the space around the substrate 20 from the outside by elongating.

[0200] The bellows 240 can have a plurality of folded portions in order to be able to stretch and contract toward the first pressing unit 100 when pressing the mold 10 and the substrate 20. In addition, the bellows 240 can be provided so that one end portion can stretch and contract toward the first pressing unit 100 and the other end portion is supported to the substrate placement section 210. For example, the bellows 240 can be elongated toward the first pressing unit 100, and at this time, the upper end portion of the bellows 240 can contact the first pressing unit 100. Thus, when the bellows 240 is in the state of contacting the first pressing unit 100, the substrate 20 can be cut off from the outside. As another example, the elongated bellows 240 can be contracted again. Thus, when the bellows 240 is in the state of being contracted toward the substrate 20, the substrate 20 can be exposed to the outside.

[0201] The bellows 240 can be elastically deformed in the contact state to allow adjustment of the horizontal position of the substrate placement section 210.

[0202] As shown in FIG. 15, a bellows sealing member 241 can be provided at one end portion of the bellows 240.

[0203] When the bellows 240 is in the contact state, in order to prevent gas from flowing into between the mold clamp 111 and the one end portion of the bellows 240, the bellows sealing member 241 can contact the clamp sealing member 111a. Also, the bellows sealing member 241 and the clamp sealing member 111a can be formed in different shapes from each other, and have different frictional forces from each other. Thus, since the bellows sealing member 241 and the clamp sealing member 111a are formed in different shapes from each other and have different frictional forces from each other, the substrate seating portion 210 can be horizontally moved when the bellows 240 is in the contact state, so that the one end portion of the bellows 240 also slides in the mold clamp 111. For example, the bellows sealing member 241 can include an O-ring which is inserted into a groove formed in the one end portion (e.g., the upper end portion) of the bellows 240.

[0204] Thus, there is an effect of preventing the bellows 240 from being excessively elastically deformed while preventing gas from flowing in by the bellows sealing member 241 sliding in a state of contacting the clamp sealing member 111a through the adjustment portion 220 when the bellows 240 is in the contact state.

[0205] When the bellows 240 seals the space around the substrate 20 with respect to the outside, the second exhaust portion 250 can exhaust gas remaining in the space sealed inside the bellows 240 to the outside. Also, the second exhaust portion 250 exhausts gas remaining in the space sealed inside the bellows 240 to the outside, so that the space around the substrate 20 can be maintained in a vacuum state. Also, the second exhaust portion 250 can include a nozzle exposed inside the bellows 240.

[0206] The first exhaust portion 140 and the second exhaust portion 250 can perform a work of preventing a difference between the gas pressure inside the sealing portion 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range.

[0207] Thus, the difference between the gas pressure inside the sealing portion 130 and the gas pressure inside the bellows 240 is prevented from exceeding a predetermined range to prevent a difference in pressure applied to the upper side and the lower side of the mold 10 from exceeding a predetermined range, and thus finally has an effect of preventing the mold 10 from being bent.

[0208] Referring to Figure 16 to Figure 19 , the bellows moving portion 260 can be supported by the outside of the substrate seating portion 210, and connected to the bellows 240 to elongate or contract the bellows 240. In other words, the bellows moving portion 260 can convert the bellows 240 into the contact state or the contracted state.

[0209] The bellows moving portion 260 can include a lift cylinder 261, a block 262, and a bellows connecting portion 263.

[0210] The lift cylinder 261 can include a shaft 261a and a cylinder actuator 261b that provides a driving force for moving the shaft 261a in the up-and-down direction.

[0211] The lift cylinder 261 can be supported by the outside of the substrate placing portion 210. In other words, the lift cylinder 261 can be supported by the outside of the lower placing portion 211b.

[0212] The block 262 can be provided at the end of the shaft 261a and move together with the shaft 261a.

[0213] The bellows connection portion 263 can support the block 262 to allow the block 262 to move in the horizontal direction. In addition, in the bellows connection portion 263, a placing groove 263a that extends in the horizontal direction to place the block 262 and a receiving groove 263b that extends in the up-and-down direction to communicate with the lower side of the placing groove 263a and surround the shaft 261a by a predetermined gap can be formed. For example, the predetermined gap of the receiving groove 263b can be 0.4 mm or more and 0.5 mm or less. In addition, when adjusting the horizontal position of the substrate placing portion 210 in the contact state of the bellows 240, the shaft 261a can move in the horizontal direction in the receiving groove 263b. In other words, in the contact state, the substrate placing portion 210 is horizontally moved to below the predetermined gap by the positioning portion 220.

[0214] Referring again to Figure 15 , one side of the photographing guide portion 280 can communicate with the photographing path 210a, and the other side opposite to the one side is connected to the lower photographing portion 320 described later. In addition, at least a part of the photographing guide portion 280 can be located at a lower side than the substrate placing portion 210. In addition, the photographing guide portion 280 can be arranged in a direction that is deviated from the up-and-down direction. For example, the photographing guide portion 280 can be formed in a direction that is perpendicular to the direction in which the photographing path 210a is formed. In addition, the lower photographing portion 320 described later can photograph the lower side of the substrate 20 through the photographing guide portion 280 and the photographing path 210a.

[0215] The photographing guide portion 280 can include a reflection portion 290 for the lower photographing portion 320 described later to effectively recognize the lower side of the substrate 20 at the inner side of the photographing guide portion 280.

[0216] The reflection part 290 can be configured between the photographing guide part 280 and the photographing path 210a to reflect an image of the positioning mark 11, so as to be incident to the lower photographing part 320 described later. For example, the reflection part 290 can be a mirror capable of reflecting light. As a more detailed example, the reflection part 290 can reflect light emitted along the photographing path 210a to be emitted along the photographing guide part 280. Thus, even if the photographing path 210a and the photographing guide part 280 are configured to be offset from each other, the reflection part 290 can reflect an image of the positioning key 21 to enable the lower photographing part 320 described later to recognize the positioning key 21. In other words, the lower photographing part 320 described later can recognize the positioning key 21 through the reflection part 290.

[0217] The following is a description of the photographing part 300.

[0218] The photographing part 300 can recognize the positioning mark 11 of the mold 10 and the positioning key 21 of the substrate 20. For example, the photographing part 300 can be a camera that photographs the positioning mark 11 and the positioning key 21. In addition, the photographing part 300 can recognize the positioning mark 11 and the positioning key 21 at the same time, or recognize one of the positioning mark 11 and the positioning key 21 first and recognize the other based on this. Thus, the error of the relative target position between the positioning mark 11 and the positioning key 21 can be confirmed by recognizing the positions of the positioning mark 11 and the positioning key 21 through the photographing part 300.

[0219] Thus, the photographing part 300 recognizes the relative positions between the first positioning mark 11a and the first positioning key 21a and between the second positioning mark 11b and the second positioning key 21b, thereby having an effect that the photographing part 300 complementarily recognizes the positions to be able to more accurately recognize whether the mold 10 and the substrate 20 are positioned at the target positions.

[0220] The photographing part 300 is configured to adjust one or more of a horizontal position, a vertical position, and an angle so that a field of view is directed toward a position where the positioning mark 11 and the positioning key 21 are formed.

[0221] The photographing part 300 can be configured to have a first focal length to recognize the positioning mark 11 and a second focal length to recognize the positioning key 21, and the focal length is changed to the first focal length or the second focal length. For example, the focal length of the photographing part 300 can be configured to be changed from the first focal length to the second focal length after recognizing the positioning mark 11 in order to recognize the positioning key 21.

[0222] Based on recognizing the positioning mark 11 and the positioning key 21 of the photographing part 300, one or more of the first pressing unit 100 and the second pressing unit 200 moves to be able to align the horizontal positions of the mold 10 and the substrate 20.

[0223] The photographing part 300 can include an upper photographing part 310 and a lower photographing part 320.

[0224] The upper photographing part 310 can recognize one or more of the positioning mark 11 and the positioning key 21. For example, when the mold 10 is formed of a material that is not transparent so that light cannot pass between the positioning mark 11 and the positioning key 21, the upper photographing part 310 can recognize the positioning mark 11 of the mold 10. As another example, when the mold 10 is formed of a material that is transparent so that light passes between the positioning mark 11 and the positioning key 21, the upper photographing part 310 can recognize all of the positioning mark 11 and the positioning key 21.

[0225] The upper photographing part 310 can move in a horizontal direction between a photographing position and a non-photographing position in order to recognize one or more of the positioning mark 11 and the positioning key 21. For example, the upper photographing part 310 can move to a photographing position for recognizing one or more of the positioning mark 11 and the positioning key 21. Here, as shown in FIG. 2, the photographing position can mean that the upper photographing part 310 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 in order to recognize the positioning mark 11 and the positioning key 21. Figure 6 As another example, the upper photographing part 310 can move to a non-photographing position in which the positioning mark 11 and the positioning key 21 are not recognized. Here, as shown in FIG. 3, the non-photographing position can mean that the upper photographing part 310 is disposed at a position apart from the photographing position, i.e., the predetermined position on the upper side of the mold 10 and the substrate 20, in a horizontal direction in order not to recognize the positioning mark 11 and the positioning key 21. Figure 7 As another example, the upper photographing part 310 can move to a non-photographing position in which the positioning mark 11 and the positioning key 21 are not recognized. Here, as shown in FIG. 3, the non-photographing position can mean that the upper photographing part 310 is disposed at a position apart from the photographing position, i.e., the predetermined position on the upper side of the mold 10 and the substrate 20, in a horizontal direction in order not to recognize the positioning mark 11 and the positioning key 21.

[0226] The upper photographing part 310 can be formed in a plurality. In addition, the upper photographing part 310 can include a first upper photographing part and a second upper photographing part. In addition, the first upper photographing part can recognize one or more of the first positioning mark 11a and the first positioning key 21a. In addition, the second upper photographing part can recognize one or more of the second positioning mark 11b and the second positioning key 21b.

[0227] The lower photographing part 320 can photograph through the photographing path 210a of the substrate placing part 210 in order to recognize one or more of the positioning mark 11 and the positioning key 21. In addition, when the upper photographing part 310 recognizes any one of the positioning mark 11 and the positioning key 21, the lower photographing part 320 can recognize the other through the photographing path 210a of the substrate placing part 210. For example, when the substrate 20 is formed of a material that is not transparent so that light cannot pass between the positioning mark 11 and the positioning key 21, the positioning key 21 of the substrate 20 can be recognized. As another example, when the substrate 20 is formed of a material that is transparent so that light passes between the positioning mark 11 and the positioning key 21, the lower photographing part 320 can recognize all of the positioning mark 11 and the positioning key 21 through the photographing path 210a.

[0228] As shown in FIG. 4, the lower photographing part 320 can include a first lower photographing part 320a and a second lower photographing part 320b.Figure 5 As shown in FIG. 3, the lower photographing unit 320 can be disposed at a lower side than the upper photographing unit 310 and connected to the second pressing unit 200. For example, the lower photographing unit 320 can be connected to a lower side of the substrate placing unit 210. Accordingly, if the substrate placing unit 210 moves through the positioning unit 220 and the lifting unit 230, the lower photographing unit 320 can move together. In other words, if the mold 10 moves horizontally or the mold 10 moves vertically, the lower photographing unit 320 can move together.

[0229] The lower photographing unit 320 can be formed in plural. In addition, the lower photographing unit 320 can include a first lower photographing unit and a second lower photographing unit. In addition, the first lower photographing unit can recognize one or more of the first positioning mark 11a and the first positioning key 21a. In addition, the second lower photographing unit can recognize one or more of the second positioning mark 11b and the second positioning key 21b.

[0230] In the above, it is described that the photographing unit 300 includes the upper photographing unit 310 and the lower photographing unit 320, but the concept of the present application is not limited thereto, and the photographing unit 300 can include only one of the upper photographing unit 310 and the lower photographing unit 320. For example, when only one of the upper photographing unit 310 and the lower photographing unit 320 is included, the included one can recognize all of the positioning mark 11 and the positioning key 21. As another example, when all of the upper photographing unit 310 and the lower photographing unit 320 are included, it can be that the upper photographing unit 310 recognizes one of the positioning mark 11 and the positioning key 21, and the lower photographing unit 320 recognizes the other.

[0231] As such, even if the mold 10 is an impermeable mold or the positioning key 21 is formed at a lower side of an impermeable substrate, it has an effect that the mold 10 and the substrate 20 can be positioned at a target position by the photographing unit 300.

[0232] Hereinafter, a description will be made about the UV irradiation unit 400.

[0233] The UV irradiation unit 400 can irradiate UV to the resin in order to cure the resin formed at the substrate 20.

[0234] The UV irradiation unit 400 can move in a horizontal direction between an irradiation position and a non-irradiation position in order to irradiate UV to the resin. For example, the UV irradiation unit 400 can move to the irradiation position for irradiating UV to the resin. Here, as shown in FIG. 4, the UV irradiation unit 400 can include a first UV irradiation unit 410 and a second UV irradiation unit 420. Figure 7As shown, the irradiation position can mean that the UV irradiation section 400 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 in order to irradiate UV to the resin. Further, the irradiation position can mean a state in which the second pressing unit 200 is raised toward the first pressing unit 100. As another example, the UV irradiation section 400 can be moved to a non-irradiation position for not irradiating UV. Here, as shown, the non-irradiation position can mean that the UV irradiation section 400 is disposed apart from the irradiation position, that is, the predetermined position on the upper side of the mold 10 and the substrate 20 in order not to irradiate UV to the resin. Further, the non-irradiation position can mean that the UV irradiation section 400 is disposed apart from the irradiation position in the horizontal direction. Figure 6 As shown, the non-irradiation position can mean that the UV irradiation section 400 is disposed apart from the irradiation position, that is, the predetermined position on the upper side of the mold 10 and the substrate 20 in order not to irradiate UV to the resin. Further, the non-irradiation position can mean that the UV irradiation section 400 is disposed apart from the irradiation position in the horizontal direction.

[0235] The UV irradiation section 400 and the upper imaging section 310 can be disposed apart in the horizontal direction. Further, the UV irradiation section 400 and the upper imaging section 310 can be located on the upper side of the first pressing unit 100.

[0236] The following is a description of the driving section 500.

[0237] Referring again to Figure 1 , Figure 4 , Figure 6 , Figure 7 , Figure 9 and Figure 18 , the driving section 500 can move the upper imaging section 310 in the horizontal direction between the imaging position and the non-imaging position. Further, the driving section 500 can move the UV irradiation section 400 in the horizontal direction between the irradiation position and the non-irradiation position.

[0238] The driving section 500 can include a support body 510 and a support body actuator 520.

[0239] The support body 510 can support the upper imaging section 310 and the UV irradiation section 400. Further, the support body 510 can be configured such that if the support body 510 moves horizontally, the upper imaging section 310 and the UV irradiation section 400 move horizontally together.

[0240] The support body actuator 520 can move the upper imaging section 310 and the UV irradiation section 400 in the horizontal direction by moving the support body 510 in the horizontal direction. For example, the support body actuator 520 can move the upper imaging section 310 to the imaging position to cause the upper imaging section 310 to recognize one or more of the positioning marks 11 and the positioning keys 21. In this case, the support body actuator 520 can move the UV irradiation section 400 to the non-irradiation position. As another example, the support body actuator 520 can move the UV irradiation section 400 to the imaging position to cause the UV irradiation section 400 to irradiate UV to the resin. In this case, the support body actuator 520 can move the upper imaging section 310 to the non-imaging position.

[0241] The support body actuator 520 can include a ball screw motor, and the support body 510 can be moved in a horizontal direction by driving of the ball screw motor. In addition, the upper photographing part 310 can be selectively moved to a photographing position by the support body actuator 520 or the UV irradiation part 400 can be selectively moved to an irradiation position by the support body actuator 520. In addition, the support body actuator 520 can selectively move the upper photographing part 310 to the photographing position or move the UV irradiation part 400 to the irradiation position, and thus the upper photographing part 310 and the UV irradiation part 400 can operate without interference with each other in a state in which they are disposed at predetermined positions on the upper side of the mold 10 and the substrate 20, respectively.

[0242] The following is a description of the control part 600.

[0243] The control part 600 can control the operation of the first pressing unit 100, the second pressing unit 200, the photographing part 300, the UV irradiation part 400, and the driving part 500.

[0244] The control part 600 can control either one of the first pressing unit 100 and the second pressing unit 200 to move toward the other. In other words, the control part 600 can drive one or more of the first pressing unit 100 and the second pressing unit 200 in order to bring the mold 10 and the substrate 20 close to each other. For example, the control part 600 can control the lifting part 230 of the second pressing unit 200 in order to lift and lower the substrate 20.

[0245] The control part 600 can control the photographing part 300 to recognize the positioning mark 11 and the positioning key 21. In other words, the control part 600 can control one or more of the upper photographing part 310 and the lower photographing part 320 to recognize the positioning mark 11 and the positioning key 21. For example, when light passes between the positioning mark 11 and the positioning key 21, the upper photographing part 310 or the lower photographing part 320 can recognize all of the positioning mark 11 and the positioning key 21, and thus the control part 600 controls the first pressing unit 100 and the second pressing unit 200. As another example, when light does not pass between the positioning mark 11 and the positioning key 21, the upper photographing part 310 can recognize the positioning mark 11 and the lower photographing part 320 can recognize the positioning key 21, and thus the control part 600 controls the first pressing unit 100 and the second pressing unit 200.

[0246] The control part 600 can control the positioning part 220 to adjust the horizontal position of the substrate placing part 210. In addition, the control part 600 can control one or more of the first adjustment part 221, the second adjustment part 222, and the third adjustment part 223 in order to adjust the horizontal position of the substrate 20.

[0247] The control section 600 can control the driving section 500 so that the UV irradiation section 400 is located at the irradiation position in order to irradiate UV to the resin, and the control section 600 can control the driving section 500 so that the photographing section 300 moves to the non-photographing position. In addition, the control section 600 can control the driving section 500 so that the upper photographing section 310 is located at the photographing position and the UV irradiation section 400 moves to the non-irradiation position in order for the photographing section 300 to recognize the positioning mark 11 and the positioning key 21.

[0248] On the other hand, when the mold 10 is horizontally moved by the positioning section 220, the control section 600 can control so that the photographing section 300 continuously recognizes the positioning mark 11 and the positioning key 21. For example, when the substrate placing section 210 is horizontally moved, the upper photographing section 310 continuously recognizes the positioning mark 11 by being fixed to the upper side of the mold 10. As another example, the lower photographing section 320 can continuously recognize the positioning key 21 by being fixed to the lower side of the substrate placing section 210 and being horizontally moved together with the substrate placing section 210. In this way, during the continuous recognition of the positioning mark 11 and the positioning key 21, the control section 600 can control the positioning section 220 so that the positioning mark 11 and the positioning key 21 are quickly moved to the target positions.

[0249] The control section 600 can control the lifting section 230, the photographing section 300, and the positioning section 220 so that, when the substrate 20 is lifted by the lifting section 230 to a predetermined distance, the photographing section 300 recognizes the positioning mark 11 and the positioning key 21, and the positioning section 220 adjusts the horizontal position of the substrate placing section 210. In addition, the control section 600 can control the positioning section 220, the lifting section 230, and the photographing section 300 so that, when the substrate 20 is lifted by the lifting section 230 more than the predetermined distance, the photographing section 300 re-recognizes the positioning mark 11 and the positioning key 21, and the positioning section 220 re-adjusts the horizontal position of the substrate placing section 210.

[0250] When the bellows 240 is in the contact state, the control section 600 can control the positioning section 220 in order to re-adjust the horizontal position of the substrate placing section 210. In addition, the control section 600 can control the positioning section 220 so that, when compared to the first adjustment of the horizontal position of the substrate placing section 210, the horizontal position of the substrate placing section 210 is adjusted within a smaller movement range when the bellows 240 is in the contact state. In other words, when the bellows 240 is in the contact state, the control section 600 can control the positioning section 220 so that the substrate placing section 210 moves within a small movement range. In addition, the range in which the substrate placing section 210 can move when the bellows 240 is in the contact state is below the predetermined gap of the housing groove 263b, and thus the small movement range can also be below the predetermined gap of the housing groove 263b. For example, the small movement range can be 0.5 mm or less.

[0251] When the bellows 240 is in the contact state, an effect of readjusting the horizontal position of the substrate placing portion 210 by the control portion 600 is explained. Even if the positioning portion 220 adjusts the horizontal position of the substrate placing portion 210 so that the mold 10 and the substrate 20 are disposed at the target position, when one end portion of the bellows 240 contacts the first pressing unit 100, the position of the substrate placing portion 210 can be changed within a predetermined range.

[0252] Thus, when the bellows 240 is in the contact state, the control portion 600 has an effect of being able to accurately adjust the positions of the mold 10 and the substrate 20 by readjusting the horizontal position of the substrate placing portion 210 again.

[0253] If the mold 10 and the substrate 20 are pressed, the control portion 600 can control the driving portion 500 so that the UV irradiation portion 400 is located at the irradiation position in order to irradiate UV to the resin, and the upper photographing portion 310 is moved to the non-photographing position. In addition, the control portion 600 can control the UV irradiation portion 400 so that the UV irradiation portion 400 irradiates UV to the resin in order to cure the resin of the substrate 20.

[0254] Hereinafter, with reference to Figure 20 , a method of pressing the mold 10 in which the pattern and the positioning mark 11 are formed and the substrate 20 in which the resin and the positioning key 21 are formed to manufacture the pattern substrate according to an embodiment of the present application (S10) is explained. Here, the so-called "pattern substrate" is defined as the substrate 20 in which the pattern of the mold 10 is transferred to the resin of the substrate 20.

[0255] The method of manufacturing the pattern substrate (S10) can produce the substrate 20 in which the pattern is transferred. In addition, in the method of manufacturing the pattern substrate (S10), the mold 10 in which the pattern and the positioning mark 11 are formed and the substrate 20 in which the resin and the positioning key 21 are formed can be pressed to transfer the pattern to the resin.

[0256] The method of manufacturing the pattern substrate (S10) can include a clamp 112 fixing step (S100), a moving step (S200), a lifting step (S300), a photographing step (S400), a first positioning step (S500), a sealing step (S600), a second positioning step (S700), a substrate pressing step (S800), a curing step (S900), a sealing release step (S1000), a lowering step (S1100), and a clamp release step (S1200).

[0257] In the clamp fixing step (S100), the mold clamp 111 can be fixed to the first pressing unit 100 side by the clamp 112. In addition, the mold clamp 111 can be supported in the clamp 112, and the mold 10 can be placed in the mold clamp 111. In addition, the clamp fixing step (S100) can be performed before the photographing step (S400).

[0258] In the moving step (S200), the mold 10 and the upper photographing portion 310 can be moved along the horizontal direction.

[0259] The moving step (S200) can include a mold horizontal moving step (S210) and a photographing portion moving step (S220).

[0260] In the mold horizontal moving step (S210), the center position of the mold support 110 for supporting the mold 10 can be moved along the horizontal direction. In other words, in the mold horizontal moving step (S210), the mold 10 can be moved by moving the mold support 110 along the horizontal direction to arrange the mold 10 at a predetermined position on the upper side of the substrate 20. In addition, the mold horizontal moving step (S210) can be performed before the photographing step (S400).

[0261] In the photographing portion moving step (S220), the upper photographing portion 310 can be moved to a photographing position for recognizing the positioning mark 11 and the positioning key 21. In addition, in the photographing portion moving step (S220), the upper photographing portion 310 can be moved along the horizontal direction by the driving portion 500. In addition, the photographing portion moving step (S220) can be performed before the photographing step (S400), and can be performed simultaneously or separately from the mold horizontal moving step (S210).

[0262] In the lifting step (S300), the positioning portion 220 can be lifted by the lifting portion 230, and the substrate 20 can be brought close to the first pressing unit 100.

[0263] In the photographing step (S400), the photographing portion 300 can photograph the positioning mark 11 formed in the mold 10 and the positioning key 21 formed in the substrate 20. In addition, in the photographing step (S400), the photographing portion 300 can recognize the positioning mark 11 and the positioning key 21, and the control portion 600 can determine whether the mold 10 and the substrate 20 are located at the target position based on the image photographed by the photographing portion 300.

[0264] In the first positioning step (S500), the positioning section 220 can adjust the horizontal position of the substrate 20. In addition, in the first positioning step (S500), the control section 600 can adjust the horizontal position of the substrate 20 so that the positioning mark 11 is positioned between the positioning keys 21, on the basis of the positions of the positioning mark 11 and the positioning keys 21 recognized in the photographing step (S400).

[0265] The photographing step (S400) and the first positioning step (S500) can be performed when the substrate 20 is raised by a predetermined distance in the lifting step (S300). In addition, the photographing step (S400) and the first positioning step (S500) can be performed again when the substrate 20 is raised by more than the predetermined distance by the lifting step (S300).

[0266] In the sealing step (S600), the space around the substrate 20 can be sealed with respect to the outside by the bellows 240, and the gas remaining in the space around the substrate 20 can be exhausted to the outside by the second exhaust section 250. In addition, in the sealing step (S600), the bellows 240 can provide the contact state in which the bellows 260 is elongated to contact the mold jig 111. In addition, the space around the UV transmission window 120 can be sealed with respect to the outside by the sealing section 130, and the gas remaining in the space around the UV transmission window 120 can be exhausted to the outside by the first exhaust section 140. In addition, the sealing step (S600) can be performed after the first positioning step (S500) and before the second positioning step (S700).

[0267] In the second positioning step (S700), the positioning section 220 can readjust the horizontal position of the substrate 20 after the sealing step (S600). The horizontal movement distance of the substrate 20 moved by the second positioning step (S700) can be below a predetermined gap between the shaft 261a and the housing groove 263b therearound. In addition, the horizontal movement distance of the substrate 20 moved by the second positioning step (S700) can be smaller than the horizontal movement distance of the substrate 20 moved by the first positioning step (S500).

[0268] The second positioning step (S700) can be performed a plurality of times before the substrate pressing step (S800), and the photographing step (S400) can be performed each time the second positioning step (S700) is performed. In addition, the positioning section 220 can adjust the horizontal position of the substrate 20 by the second positioning step (S700), and the bellows 240 can be elastically deformed in the contact state.

[0269] In the substrate pressing step (S700), the mold 10 can be pressed against the substrate 20 by the lifting section 230 raising the positioning section 220. At this time, the pattern formed in the mold 10 can be transferred to the resin formed in the substrate 20.

[0270] In the curing step (S900), the resin of the substrate 20 can be cured by the UV irradiation section 400 irradiating the UV to the resin.

[0271] The curing step (S900) can include a UV irradiation section moving step (S910) and a UV irradiation step (S920).

[0272] In the UV irradiation section moving step (S910), the UV irradiation section 400 can be moved to an irradiation position for irradiating the UV to the resin. In addition, the UV irradiation section moving step (S910) can be executed after the substrate pressing step (S800).

[0273] In the UV irradiation step (S920), the UV irradiation section 400 can irradiate the UV to the resin. Thus, in the UV irradiation step (S920), the resin can be cured by irradiating the UV to the resin.

[0274] In the seal release step (S1000), a gas can be caused to flow into a space around the substrate 20, and the space around the substrate 20 can be opened to the outside. In addition, the bellows 240 can be contracted by the seal release step (S1000). In addition, a gas can be caused to flow into a space around the UV transmission window 120. In addition, the seal release step (S1000) can be executed after the substrate pressing step (S800).

[0275] In the lowering step (S1100), the positioning section 220 can be caused to lower by the lifting section 230, and the positioning section 220 can be separated from the first pressing unit 100.

[0276] In the clamp release step (S1200), the clamp 112 can be released from the first pressing unit 100 side. It can be that the mold clamp 111 in which the mold 10 is placed is supported in the clamp 112.

[0277] On the other hand, in the lowering step (S1100), the substrate 20 can or can not be separated from the mold 10. For example, the substrate 20 can be separated from the mold 10 by lowering the substrate 20 together with the positioning section 220. As another example, in a state in which the substrate 20 is pressed against the mold 10, the positioning section 220 is lowered, and in the transfer device 1 in which the pattern can be aligned, the separation of the substrate 20 from the mold 10 can be executed by being transferred to another separation device. At this time, the mold 10 and the substrate 20 pressed by the mold 10 can be placed in the mold clamp 111 in the clamp release step (S1200).

[0278] On the other hand, the method of manufacturing a pattern substrate (S10) according to an embodiment of the present application can be implemented in the form of a computer program for executing the same, and stored in a computer-readable recording medium. The computer-readable recording medium can include program commands, data files, data structures, etc. individually or in combination. The program commands recorded in the computer-readable recording medium can be specifically designed and configured for the embodiment, or known and available to a computer software technician. Examples of the computer-readable recording medium include magnetic media such as a hard disk, a floppy disk, and a magnetic tape, optical media such as a CD-ROM and a DVD, a floptical disk, and a hardware device specifically configured to store the program commands and execute the same, such as a read-only memory (ROM), a random access memory (RAM), a flash memory, etc.

[0279] For example, the computer program stored in the computer-readable recording medium can be programmed to perform the storing step, the calculating step, and the outputting step.

[0280] In the storing step, the image information of the positioning mark 11 and the positioning key 21 photographed by the photographing unit 300 can be stored in the computer-readable recording medium.

[0281] In the calculating step, the position information of the positioning mark 11 and the positioning key 21 can be calculated based on the image information stored in the computer-readable recording medium. For example, the calculated position information can be an error value related to the target position between the positioning mark 11 and the positioning key 21.

[0282] In the outputting step, the action command for adjusting the position of the mold 10 or the substrate 20 can be outputted based on the calculated position information. In addition, it can be previously determined whether the mold 10 and the substrate 20 are located at the target position based on the position information calculated before the action command is outputted, and it can be determined whether to output the action command for adjusting the position of the mold 10 or the substrate 20 based on the determined information. Here, the determination of whether to be located at the target position can be determined in various ways.

[0283] On the other hand, the operation step can operate a path value from the position of the positioning key 21 operated from the image information of the positioning key 21 photographed by the lower photographing section 320 to the position of the positioning mark 11 operated from the image information of the positioning mark 11 photographed by the upper photographing section 310, and the output step can output the action command of the adjustment position based on the operated path value from the central position of the image information of the positioning key 21 photographed by the lower photographing section 320. In other words, the lower photographing section 320 is fixed to the lower side of the substrate placing section 210 and moves horizontally with the substrate placing section 210, and the relative position of the central position of the image information and the positioning mark 11 does not change even if the substrate placing section 210 moves horizontally. Such a central position of the image information of the positioning mark 11 can be the central position of the mold 10 shown in FIG. 10. In addition, the central position of the image information of the positioning key 21 can be the central position of the substrate 20 shown in FIG. 11. Figure 2 Figure 3

[0284] The above-described embodiments of the present application are merely illustrative and the present application is not limited thereto, and should be construed as having the broadest scope based on the technical concept disclosed in the present specification. A person skilled in the art can combine / replace the disclosed embodiments to implement a pattern of a shape not mentioned, but it still does not exceed the scope of the present application. In addition thereto, a person skilled in the art can easily make changes or modifications to the disclosed embodiments based on the present specification, and such changes or modifications are obviously within the scope of the present application.​​

Claims

1. A transfer device capable of aligning a pattern, wherein, Comprising: a first pressing unit that supports a mold in which a pattern is formed; and a second pressing unit that supports a substrate in which a resin is formed, the second pressing unit including: a substrate placement portion that supports the substrate; a positioning portion that adjusts a horizontal position of the substrate placement portion; a bellows that, when elongated, contacts one end portion to the first pressing unit to enable a space around the substrate to be sealed from the outside; and a bellows moving portion that is supported by the outside of the substrate placement portion and that, in connection with the bellows, elongates and contracts the bellows, the positioning portion adjusting the horizontal position of the substrate placement portion in a state in which one end portion of the bellows contacts the first pressing unit, the bellows moving portion including: a lift cylinder that includes a shaft and a cylinder actuator that provides a driving force for moving the shaft; a block that is provided to an end portion of the shaft; and a bellows connection portion that supports the block to allow the block to move in a horizontal direction, a placement groove that extends in the horizontal direction to place the block and a receiving groove that extends in a vertical direction to communicate with the placement groove and surround the shaft with a predetermined gap are formed in the bellows connection portion, the shaft moving in the horizontal direction in the receiving groove when the horizontal position of the substrate placement portion is adjusted in the state.

2. The pattern alignable transfer device according to claim 1, wherein the bellows is elastically deformed in the state to allow the horizontal position of the substrate placement portion to be adjusted.

3. The pattern alignable transfer device according to claim 1, wherein the first pressing unit further includes: a mold clamp that supports an edge portion of the mold and that, when the bellows is in the state, contacts one end portion of the bellows; a clamp that supports an edge of the mold clamp to fix the mold clamp to the first pressing unit side; and a sealing portion that contacts an upper portion of the mold clamp with a lower portion, the clamp includes a sliding member that supports the mold clamp from a lower portion, the mold clamp is inserted between the sliding member and the sealing portion to be supported by the clamp.

4. The pattern alignable transfer device according to claim 1, wherein the first pressing unit further includes: a mold clamp that supports an edge portion of the mold and that, when in the state, contacts one end portion of the bellows, a clamp sealing member is provided in the mold clamp, a bellows sealing member is provided to one end portion of the bellows, the clamp sealing member and the bellows sealing member contact each other to prevent gas from flowing between the mold clamp and one end portion of the bellows when in the state, the clamp sealing member and the bellows sealing member have different shapes from each other.

5. The pattern alignable transfer device according to claim 1, wherein the first pressing unit includes: a mold clamp that supports an edge portion of the mold and that, when in the state, contacts one end portion of the bellows; a UV-transmitting window that supports the mold and that transmits UV. ​ a sealing portion that is annularly projected and contacts the mold jig below to seal a space around the UV-transmitting window from the outside; and a first exhaust portion that exhausts gas remaining in the space sealed in the inside of the sealing portion to the outside when the sealing portion seals the space around the UV-transmitting window from the outside.

6. The pattern alignable transfer device according to claim 5, wherein the second pressing unit further includes: a second exhaust portion that exhausts gas remaining in the space sealed in the inside of the bellows to the outside when the bellows seals the space around the substrate from the outside, the first exhaust portion and the second exhaust portion work to prevent a difference between a gas pressure in the inside of the sealing portion and a gas pressure in the inside of the bellows from exceeding a predetermined range.

7. The pattern alignable transfer device according to any one of claims 1 to 6, wherein the pattern alignable transfer device further includes: a control portion that performs control of operations of the first pressing unit, the second pressing unit, and the positioning portion.

8. A method of manufacturing a pattern substrate by pressing a substrate on which a resin and a positioning key are formed against a mold on which a pattern and a positioning mark are formed, wherein the method of manufacturing a pattern substrate includes: a photographing step of photographing the positioning mark formed in the mold and the positioning key formed in the substrate by a photographing portion; a first positioning step of adjusting a horizontal position of the substrate placed in a substrate placing portion by a positioning portion; a sealing step of sealing a space around the substrate from the outside by a bellows that contacts the first pressing unit at one end portion when the bellows is elongated, elongating the bellows by a bellows moving portion supported by an outer surface of the substrate placing portion and connected to the bellows, and exhausting gas remaining in the space around the substrate to the outside; a second positioning step of adjusting the horizontal position of the substrate again by the positioning portion after the sealing step; a substrate pressing step of pressing the substrate against the mold, the bellows moving portion includes: a lift cylinder including a shaft and a cylinder actuator that supplies a driving force for moving the shaft; a block provided at an end portion of the shaft; and a bellows connecting portion that supports the block to allow the block to move in a horizontal direction, a placing groove that extends in a horizontal direction to place the block and a receiving groove that extends in a vertical direction to communicate with the placing groove and surround the shaft with a predetermined gap are formed in the bellows connecting portion, the shaft moves in the horizontal direction in the receiving groove when the horizontal position of the substrate placing portion is adjusted in the contact state.

9. The method of manufacturing a pattern substrate according to claim 8, wherein one or more of the first positioning step and the second positioning step are performed a plurality of times before the substrate pressing step, the photographing step is performed each time the first positioning step and the second positioning step are performed.

10. The method of manufacturing a pattern substrate according to claim 8, wherein The method of manufacturing a pattern substrate further includes: a lifting step in which the lifting section causes the positioning section to be lifted, the lifting step, the photographing step, and the first positioning step are performed a plurality of times, the photographing step and the first positioning step are performed when the substrate is lifted by a predetermined distance by the lifting step, and the photographing step and the first positioning step are performed again when the substrate is lifted by more than the predetermined distance by the lifting step.

11. The method of manufacturing a pattern substrate according to claim 8, wherein, a horizontal movement distance by which the substrate is moved by the second positioning step is smaller than a horizontal movement distance by which the substrate is moved by the first positioning step.

Images