Photoresist molding equipment and photoresist molding method

Abstract

The present invention discloses a photoresist molding device and method, wherein the photoresist molding device includes a pixel plate, a spraying device, and a control device. The present invention utilizes individual pixel electrodes on the pixel plate to adsorb photoresist droplets, allowing the photoresist droplets to adhere to a substrate according to a predetermined pattern. This eliminates the need for exposure and development operations, simplifies the manufacturing process, and eliminates the waste of photoresist material due to etching and development, thereby improving material utilization and overcoming, to a certain extent, the complexity and waste associated with the photoresist molding process in the prior art.

Description

Technical Field

[0001] The present application relates to the display field, and in particular to a photoresist molding device and a photoresist molding method. Background Art

[0002] Traditional photoresist or photoresist forming technology consists of coating, exposure, development, and baking. It is currently widely used in the forming process of photoresist layers such as black matrix layers, various sub-pixel photoresist layers, and photoresist layers, and is a very mature process.

[0003] Although traditional photoresist molding technology is sophisticated, its process is complicated. During the exposure and development process, 2 / 3 of the photoresist is developed away each time it is coated and developed. In addition, a large amount of developer is wasted, resulting in huge waste. Summary of the Invention

[0004] The embodiments of the present application provide a photoresist molding device and a photoresist molding method to overcome the problems of complex and wasteful photoresist molding processes in the prior art.

[0005] An embodiment of the present application provides a photoresist forming device, comprising: a pixel plate, comprising a substrate and a plurality of pixel electrodes, wherein the pixel electrode array is arranged on the substrate to form a pixel electrode array; a spraying device, arranged on a side of the pixel plate where the pixel electrodes are provided, comprising a frame and a plurality of conductive nozzles arranged on the frame, wherein the conductive nozzles are arranged toward the pixel plate; a control device, electrically connected to the pixel plate and the spraying device, respectively, wherein the control device controls the conductive nozzles to spray charged photoresist droplets onto the pixel plate, and at the same time controls the on and off of each pixel electrode on the pixel plate according to a preset pattern, so that the charged photoresist droplets are adsorbed by the pixel plate according to the preset pattern.

[0006] Optionally, the photoresist forming equipment further includes: an oscillation device, which is electrically connected to the control device and, under the control of the control device, forms a vibration wave between the pixel plate and the spraying device to vibrate the charged photoresist droplets.

[0007] Optionally, the oscillation device includes an electromagnetic oscillator, which is arranged between the pixel plate and the spraying device, and generates an alternating electromagnetic field between the pixel plate and the spraying device to form an electromagnetic field wave that causes the charged photoresist droplets to vibrate.

[0008] Optionally, the electromagnetic oscillator includes two oppositely arranged oscillation plates, which are arranged on both sides of the area where the pixel plate is provided with the pixel electrode. An alternating electric field is generated between the two oscillation plates to form an electric field wave that causes the charged photoresist droplet to vibrate.

[0009] Optionally, the oscillation device includes: an ultrasonic oscillator, which is arranged between the pixel plate and the spraying device, and the ultrasonic wave generated by the ultrasonic oscillator propagates between the pixel plate and the spraying device to vibrate the charged photoresist droplets.

[0010] Optionally, the frequency of the vibration wave is between 0.1 kHz and 10 kHz.

[0011] Optionally, the photoresist forming equipment further includes: a heating plate, which is arranged on a side of the pixel plate away from the spraying device.

[0012] Optionally, the photoresist forming equipment also includes: a shell, which is arranged between the pixel plate and the spray device, and is arranged around the periphery of the pixel plate, and the shell, the spray device and the pixel plate together form a closed cavity; an exhaust device, which is connected to the closed cavity to extract the gas in the closed cavity.

[0013] Optionally, the photoresist forming equipment also includes: a braking plate, which is arranged opposite to the pixel plate, located on the side of the spraying device away from the pixel plate, and is electrically connected to the control device by signal. Under the control of the control device, the braking plate generates an electric field between the pixel plate and the pixel plate to prevent the charged photoresist droplets from moving toward the pixel plate.

[0014] Correspondingly, an embodiment of the present application also provides a photoresist forming method, using the photoresist forming equipment as described above, the method including: controlling the conductive nozzle to spray charged photoresist droplets onto the pixel plate; controlling the on and off of each pixel electrode on the pixel plate according to a preset pattern, so that the charged photoresist droplets are formed on the substrate plate according to the preset pattern, and the substrate plate is arranged on the side of the pixel plate facing the spraying device.

[0015] In the embodiments of the present application, photoresist droplets are adsorbed on the substrate according to their preset pattern by the pixel electrodes on the pixel plate, without the need for exposure and development operations, thereby simplifying the processing technology. At the same time, no photoresist material will be wasted due to etching and development, thereby improving the utilization rate of the material and overcoming, to a certain extent, the problem of complex and wasteful photoresist molding process in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a structural schematic diagram of the photoresist molding equipment shown in the first embodiment of the present application.

[0018] Figure 2 This application Figure 1 The schematic diagram of the structure of the pixel plate of the photoresist molding device is shown.

[0019] Figure 3 This application Figure 1 The schematic diagram of the structure of the spraying device of the photoresist molding equipment is shown.

[0020] Figure 4 It is a structural schematic diagram of the photoresist molding equipment shown in the second embodiment of the present application.

[0021] Figure 5 It is a structural schematic diagram of the photoresist molding equipment shown in the third embodiment of the present application.

[0022] Figure 6 It is a structural schematic diagram of the photoresist molding equipment shown in the fourth embodiment of the present application.

[0023] Figure 7 It is a structural schematic diagram of the photoresist molding equipment shown in the fifth embodiment of the present application.

[0024] Figure 8 It is a flow chart of the photoresist molding method proposed in this application.

[0025] Description of reference numerals:

[0026] 101. Substrate; 100. Pixel plate; 200. Spraying device; 300. Housing; 400. Heating plate; 500. Exhaust device; 600. Braking plate; 700. Oscillation device; 110. Base plate; 120. Pixel electrode; 210. Conductive nozzle; 220. Frame; 310. Enclosed cavity; 710. Ultrasonic oscillator; 720. Electromagnetic oscillator; 721. Powered coil; 722. Oscillation plate. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0028] The present invention provides a photoresist molding device and a packaging method thereof. Detailed descriptions are given below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments.

[0029] The present application provides a photoresist molding device, which is used to form various photoresist layers, such as a black matrix layer and a sub-pixel photoresist layer in a color filter substrate, an adhesive layer and a photoresist layer coated on a metal layer or a semiconductor layer, etc.

[0030] In the examples of this application, please refer to Figure 1 The photoresist molding device includes a pixel plate 100, a spraying device 200, a housing 300, and a control device. The pixel plate 100 and the spraying device 200 are arranged opposite each other. The housing 300 is arranged between the pixel plate 100 and the spraying device 200, surrounding the periphery of the pixel plate 100 and the periphery of the spraying device 200. The two ends are respectively connected and fixed to the pixel plate 100 and the spraying device 200, and together with the pixel plate 100 and the spraying device 200, form a closed cavity 310.

[0031] The control device (not shown in the figure) is respectively connected to the pixel plate 100 and the spraying device 200 via electrical signals, and is used to control the pixel plate 100 and the spraying device 200.

[0032] Please refer to Figure 3 The spraying device 200 includes a frame 220 and a plurality of conductive nozzles 210 . The plurality of conductive nozzles 210 are arranged in a rectangular array on the frame 220 and face the pixel plate 100 .

[0033] Please refer to Figure 2 The pixel plate 100 includes a substrate 110 and a plurality of pixel electrodes 120 . The plurality of pixel electrodes 120 are arranged in an array on a side of the substrate 110 facing the spraying device 200 to form a pixel electrode 120 array.

[0034] During the photoresist forming process, the control device controls the conductive nozzle 210 of the spraying device 200 to spray charged photoresist droplets toward the pixel plate 100. At the same time, the on and off of each pixel electrode 120 on the pixel plate 100 is controlled according to a preset pattern, so that the charged photoresist droplets are adsorbed on the substrate plate 101 arranged on the side of the pixel plate 100 facing the spraying device 200 according to the preset pattern. Finally, after heating and curing, a photoresist layer formed according to the preset pattern can be formed.

[0035] In the embodiment of the present application, the pixel electrodes 120 on the pixel plate 100 adsorb photoresist droplets, so that the photoresist droplets are adsorbed on the substrate plate 101 according to their preset pattern, without the need for exposure and development operations, thereby simplifying the processing technology. At the same time, no photoresist material will be wasted due to etching and development, thereby improving the utilization rate of the material and overcoming, to a certain extent, the problem of complex and wasteful photoresist molding process in the prior art.

[0036] The shell 300 is used to connect the sprinkler device and the pixel plate 100. At the same time, the shell 300, the sprinkler device 200 and the pixel plate 100 are together surrounded to form a closed cavity 310, which can block the charged photoresist droplets sprayed by the sprinkler device 200, limiting their movement within the closed cavity 310, and preventing them from being sprayed to areas outside the pixel plate 100.

[0037] In some embodiments of the present application, the photoresist molding equipment further includes an oscillation device 700 .

[0038] The oscillation device 700 is electrically connected to the control device, and under the control of the control device, a vibration wave is formed between the pixel plate 100 and the spraying device 200 to vibrate the charged photoresist droplets. Under the influence of the vibration wave, the charged photoresist droplets are broken into a plurality of smaller droplets, so that the charged photoresist droplets can be more evenly adsorbed on the substrate plate 101, so that the thickness tolerance of the photoresist layer can be controlled within a more precise range. The vibration frequency of the vibration wave emitted by the oscillation device 700 is generally between 0.1kHz and 10kHz to ensure that there is sufficient energy to break the charged photoresist droplets during the vibration. The vibration wave can be in various forms, such as sound waves, electromagnetic field waves, etc. For its specific implementation, please refer to the following embodiments.

[0039] In some embodiments of this application, please continue to refer to Figure 1The oscillator 700 is an ultrasonic oscillator 710, which is disposed between the pixel plate 100 and the spraying device 200. The ultrasonic oscillator 710 can be connected to and fixed on the inner wall of the housing 300, or on the outer wall of the housing 300, or can be fixed to the frame 220 of the spraying device 200. The ultrasonic oscillator 710 can generate ultrasonic waves in the closed cavity 310. The charged photoresist droplets vibrate under the influence of the ultrasonic waves in the alternating magnetic field, breaking into multiple smaller droplets.

[0040] In some embodiments of this application, please refer to Figures 4 to 7 The oscillation device 700 is an electromagnetic oscillator 720, which can generate an alternating electric field or an alternating magnetic field between the pixel plate 100 and the spraying device 200. The direction of the alternating electric field or the alternating magnetic field is generally parallel to the pixel plate 100 to ensure that the charged photoresist droplets vibrate in a direction parallel to the pixel plate 100, thereby preventing the charged photoresist droplets from prematurely adhering to the substrate plate 101 above the pixel plate 100 during the vibration process, resulting in waste.

[0041] Please refer to Figure 5 The electromagnetic oscillator 720 can be a powered coil 721, formed by winding a powered wire around the outside of the pixel plate 100 and the spray device 200, with its axis parallel to the pixel plate 100. When a high-frequency alternating current (AC) between 0.1kHz and 10kHz is applied to the powered coil 721, an alternating magnetic field parallel to the pixel plate 100 is generated inside the coil. In this alternating magnetic field, the charged photoresist droplets vibrate under the influence of the Lorentz force, breaking into multiple smaller droplets.

[0042] Please refer to Figure 6 The energized coil 721 can also be formed by a spirally extending energized wire wrapped around the outside of the pixel plate 100 and the spray device 200, with its axis parallel to the pixel plate 100. When a high-frequency alternating current of 0.1kHz to 10kHz is applied to the energized coil 721, an alternating electric field parallel to the pixel plate 100 is formed inside the coil. In this alternating electric field, the charged photoresist droplets vibrate under the influence of the electric field force, breaking into multiple smaller droplets.

[0043] Please refer to Figure 4The electromagnetic oscillator 720 can also be two oppositely positioned oscillating plates 722, which are located on either side of the pixel electrode 120 array and can be connected and fixed to the inner wall of the housing 300 or the outer wall of the housing 300. When a high-frequency alternating current of 0.1kHz to 10kHz is applied to the two oscillating plates 722, an alternating electric field parallel to the pixel plate 100 is formed between the two oscillating plates 722. In the alternating electric field, the charged photoresist droplets vibrate under the influence of the electric field force, breaking into multiple smaller droplets.

[0044] In some embodiments of the present application, the above-mentioned photoresist shaping equipment further includes a heating plate 400 and an exhaust device 500. The heating plate 400 is disposed on the side of the pixel plate 100 facing away from the spraying device 200. After the spraying device 200 has finished spraying the charged photoresist droplets and all the charged photoresist droplets are adsorbed on the substrate plate 101, the charged photoresist droplets on the substrate plate 101 can be heated and cured by the heating plate 400 to form a photoresist layer shaped according to a predetermined pattern.

[0045] The exhaust device 500 is mounted on the housing 300 or the frame 220 of the spray device 200 and communicates with the sealed cavity 310. During the heat-curing process, a large amount of solvent vapor is generated within the sealed cavity 310. The exhaust device 500 extracts this gas to prevent it from cooling into a liquid and dissolving the photoresist layer, thereby damaging the photoresist layer.

[0046] Please refer to Figure 7 In some embodiments of the present application, the photoresist forming device further includes a brake plate 600. The brake plate 600 is disposed opposite to the pixel plate 100, located on the side of the spraying device 200 away from the pixel plate 100, and is electrically connected to the control device.

[0047] The braking plate 600 is used to generate a blocking electric field between the braking plate 600 and the pixel plate 100 under the control of the control device. The blocking electric field can block the charged photoresist droplets from moving toward the pixel plate 100.

[0048] For example, in one embodiment, the above-mentioned pixel plate 100, spray device 200 and brake plate 600 are all arranged horizontally. The negatively charged photoresist droplets sprayed by the spray device 200 will fall toward the pixel plate 100 under the action of gravity, that is, the charged photoresist droplets are always affected by gravity during the process of moving toward the pixel plate 100. The vertical upward braking electric field formed between the brake plate 600 and the pixel plate 100 can offset the influence of the gravity of the charged photoresist droplets themselves, so that the charged photoresist droplets are balanced in the vertical direction. At the same time, for the area where the charged photoresist droplets need to fall, the control device can control the corresponding pixel electrode 120 to be positively charged, forming an upward electric field in the corresponding area, so that the charged photoresist droplets are adsorbed by the corresponding pixel electrode 120.

[0049] In another embodiment, the above-mentioned pixel plate 100, spraying device 200 and brake plate 600 are all arranged vertically. In this embodiment, the gravity of the negatively charged photoresist droplets can be balanced by the electric field formed between the two oscillation plates 722. At this time, in the direction of movement toward the pixel plate 100, the negatively charged photoresist droplets have a certain initial velocity, and the braking electric field formed between the brake plate 600 and the pixel plate 100, which is directed from the pixel plate 100 to the brake plate 600, can offset the initial velocity of the negatively charged droplets, so that the charged photoresist droplets are stationary in the horizontal direction. At the same time, for the area where the charged photoresist droplets need to fall, the control device can control the corresponding pixel electrode 120 to be positively charged, forming an upward electric field in the corresponding area, so that the charged photoresist droplets are adsorbed by the corresponding pixel electrode 120.

[0050] Please refer to Figure 8 The present application also proposes a photoresist molding method, using the photoresist molding device as described above, the method comprising:

[0051] Step S100: controlling the conductive nozzle to spray charged photoresist droplets onto the pixel plate.

[0052] In step S200 , the on and off of each pixel electrode on the pixel plate is controlled according to a preset pattern, so that the charged photoresist droplets are formed on a substrate plate according to the preset pattern. The substrate plate is arranged on the side of the pixel plate facing the spraying device.

[0053] In an embodiment of the present application, the conductive nozzle 210 is first controlled to spray charged photoresist droplets onto the pixel plate 100, and at the same time, the on and off of each pixel electrode 120 on the pixel plate 100 is controlled according to the preset pattern formed as needed. The charged photoresist droplets are adsorbed on the substrate plate 101 by the pixel electrodes 120 according to the preset pattern, and finally the substrate plate 101 is heated to cure the charged photoresist droplets to form a photoresist layer consistent with the preset pattern.

[0054] This photoresist molding solution can be applied to the processing of various color resist layers, such as the molding of color filter plates and the molding of photoresists before chip processing. This photoresist molding solution is simple to process, eliminating the etching and developing steps used in the prior art. No photoresist material is wasted during etching and developing, improving material utilization and, to a certain extent, overcoming the complex and wasteful photoresist molding process found in the prior art.

[0055] The above is a detailed introduction to a photoresist molding device and its packaging method provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A photoresist molding device, characterized in that: The photoresist molding equipment includes: A pixel plate, comprising a substrate and a plurality of pixel electrodes, wherein the pixel electrode plate is arranged on the substrate to form a pixel electrode array; A spraying device is provided on a side of the pixel plate where the pixel electrode is provided, comprising a frame and a plurality of conductive spray heads provided on the frame, wherein the conductive spray heads are provided toward the pixel plate; A control device is electrically connected to the pixel plate and the spraying device, respectively. The control device controls the conductive nozzle to spray charged photoresist droplets onto the pixel plate, and at the same time controls the on and off of each pixel electrode on the pixel plate according to a preset pattern, so that the charged photoresist droplets are adsorbed by the pixel plate according to the preset pattern.

2. The photoresist molding device according to claim 1, wherein: The photoresist molding equipment also includes: The oscillation device is electrically connected to the control device and, under the control of the control device, forms a vibration wave between the pixel plate and the spraying device to vibrate the charged photoresist droplets.

3. The photoresist molding device according to claim 2, wherein: The oscillation device includes an electromagnetic oscillator, which is arranged between the pixel plate and the spraying device and generates an alternating electromagnetic field between the pixel plate and the spraying device to form an electromagnetic field wave that causes the charged photoresist droplets to vibrate.

4. The photoresist molding device according to claim 3, wherein: The electromagnetic oscillator includes two oppositely arranged oscillating plates, which are arranged on both sides of the pixel electrode array. An alternating electric field is generated between the two oscillating plates to form an electric field wave that causes the charged photoresist droplet to vibrate.

5. The photoresist molding device according to claim 2, wherein: The oscillation device comprises: The ultrasonic oscillator is arranged between the pixel plate and the spraying device. The ultrasonic wave generated by the ultrasonic oscillator is propagated between the pixel plate and the spraying device to vibrate the charged photoresist droplets.

6. The photoresist molding equipment according to claim 3, wherein: The frequency of the vibration wave is between 0.1 kHz and 10 kHz.

7. The photoresist molding equipment according to claim 1, wherein: The photoresist molding equipment also includes: The heating plate is arranged on a side of the pixel plate away from the spraying device.

8. The photoresist molding equipment according to claim 1, wherein: The photoresist molding equipment also includes: A housing is disposed between the pixel plate and the spraying device and surrounds the periphery of the pixel plate, wherein the housing, the spraying device, and the pixel plate together surround and form a closed cavity; The exhaust device is connected to the closed cavity and is used to extract the gas in the closed cavity.

9. The photoresist molding equipment according to claim 1, wherein: The photoresist molding equipment also includes: The braking plate is arranged opposite to the pixel plate, located on the side of the spraying device away from the pixel plate, and is electrically connected to the control device. Under the control of the control device, the braking plate generates an electric field between the pixel plate and the pixel plate to prevent the charged photoresist droplets from moving toward the pixel plate.

10. A photoresist molding method, characterized in that: Using the photoresist molding device according to any one of claims 1 to 9, the method comprises: Controlling the conductive nozzle to spray charged photoresist droplets onto the pixel plate; The on and off of each pixel electrode on the pixel plate is controlled according to a preset pattern, so that the charged photoresist droplets are formed on a substrate plate according to the preset pattern. The substrate plate is arranged on the side of the pixel plate facing the spraying device.

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