A 3D exposure system and method

Abstract

The application discloses a 3D exposure system and method. The 3D exposure system comprises a first optical engine for generating a first exposure pattern and projecting the first exposure pattern to a first surface of a 3D substrate (700), the first optical engine comprising a DMD device (400) and a maskless projection device (600), a pixel mask pattern generated by the DMD device (400) is input to the maskless projection device (600), and light passing through the maskless projection device (600) is focused on the first surface of the 3D substrate (700) as an exposure beam; wherein the DMD device (400) is arranged obliquely relative to an optical axis of the maskless projection device (600), a focal plane of the light passing through the maskless projection device (600) is an inclined plane, and an inclination angle of the inclined plane relative to the optical axis of the maskless projection device (600) is equal to an inclination angle of the DMD device (400) relative to the optical axis of the maskless projection device (600).

Description

TECHNICAL FIELD

[0001] The present application relates to the field of imaging technology, in particular, the present application relates to the field of digital lithography, more specifically, the present application relates to a novel 3D exposure system and method. BACKGROUND

[0002] In the prior art, a maskless exposure system is used to expose a planar substrate. For example, as shown in FIG. 1, a light beam generated by an exposure light source 100 reaches a light collimation and homogenization device 200 through an optical fiber 110, and then the light subjected to collimation and / or homogenization is emitted by a mirror 500 to a DMD device 300. The DMD device 300 serves as a spatial light modulator. The light generated by the pixel mask pattern generated by the DMD device 300 is input to a maskless projection device 600, and the exposure light beam 900 passing through the maskless projection device 600 is focused onto the upper surface of a planar substrate 750 carried on a carrier plate 800. In this way, maskless lithography of the planar substrate 750 is completed. Figure 1

[0003] However, the above technical solution can only perform maskless lithography on a planar substrate, and cannot achieve maskless lithography on a 3D substrate.

[0004] For example, the development of computer, communication, and consumer electronics products requires the processing of various extraordinary 3D products. More and more expectations are put forward for the production of product patterns. However, the above maskless lithography technology of the prior art cannot be applied to 3D substrates. SUMMARY

[0005] The present application aims to provide a 3D exposure system to achieve lithography on a 3D substrate.

[0006] To achieve the above-mentioned purpose, the present application provides a 3D exposure system, which comprises:

[0007] a first optical engine arranged on the first side of a 3D substrate light source device, for generating a first exposure pattern and projecting the first exposure pattern onto the first surface of the 3D substrate light source device, specifically, the first optical engine comprises a DMD device light source device and a maskless projection device light source device, the DMD device light source device serves as a spatial light modulator, the light generated by the pixel mask pattern generated by the DMD device light source device is input to the maskless projection device light source device, and the light passing through the maskless projection device light source device is focused as an exposure light beam onto the first surface of the 3D substrate light source device,

[0008] a light source device for providing a light source for the first optical engine;

[0009] ​The DMD device light source device is arranged obliquely relative to the optical axis of the maskless projection device light source device, the focal plane of the light of the maskless projection device light source device is an inclined plane, and the inclination angle of the inclined plane relative to the optical axis of the maskless projection device light source device is equal to the inclination angle of the DMD device light source device relative to the optical axis of the maskless projection device light source device.

[0010] Preferably, the inclination angle is arranged in a range less than 90 degrees and greater than or equal to 45 degrees.

[0011] Preferably, the 3D exposure system further comprises a Z-direction moving device for driving the maskless projection device light source device to move in the Z-direction.

[0012] Preferably, the DMD device light source device is divided into at least two DMD regions along the oblique direction thereof, and is respectively used for exposing corresponding number of different height interval parts on the first side of the 3D substrate light source device.

[0013] Preferably, the 3D exposure system comprises a visual recognition device for acquiring positioning information of the 3D substrate light source device on the carrier plate light source device.

[0014] Preferably, the number of DMD device light source devices is multiple, and the DMD device light source devices have different heights and different inclination angles.

[0015] Preferably, the height and / or inclination angle of the DMD device light source device is adjustable.

[0016] Preferably, the 3D exposure system further comprises:

[0017] a second optical engine arranged on the second side of the 3D substrate light source device for generating a second exposure pattern and projecting the second exposure pattern to the second side of the 3D substrate light source device, specifically, the second optical engine comprises a second DMD device and a second maskless projection device, the second DMD device is used as a spatial light modulator, the pixel mask pattern generated by the second DMD device is input to the second maskless projection device, and the light of the second maskless projection device is focused to the second side of the 3D substrate light source device as an exposure beam,

[0018] a second light source device for providing light source for the second optical engine;

[0019] The second DMD device is arranged obliquely relative to the optical axis of the second maskless projection device, the focal plane of the light of the second maskless projection device is an inclined plane, and the inclination angle of the inclined plane relative to the optical axis of the second maskless projection device is equal to the inclination angle of the second DMD device relative to the optical axis of the second maskless projection device.

[0020] The application further provides a 3D exposure method for exposing a 3D substrate light source device by using the 3D exposure system.

[0021] Preferably, the 3D exposure method comprises the following steps:

[0022] A loading step of loading a 3D substrate light source device on a carrier plate light source device, one side of the 3D substrate light source device being provided with a three-dimensional structure with different heights, and the three-dimensional structure being provided with exposed ink or photosensitive glue;

[0023] A region division step of dividing the one side of the 3D substrate into at least two sub-regions according to the different heights, and correspondingly, dividing the DMD device light source device into at least two DMD regions according to the different heights, one sub-region of the 3D substrate corresponding to one DMD region of the DMD device light source device, so that the pixel mask pattern generated by the DMD region is within the required focal depth range on the corresponding sub-region of the 3D substrate after being focused by the maskless projection device light source device.

[0024] The 3D exposure system and method can expose or photoetch a 3D substrate. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a schematic diagram of an existing exposure system.

[0026] Figure 2 is a schematic diagram of a 3D exposure system according to an embodiment of the application.

[0027] Figure 3 is a partial view of Figure 2 .

[0028] Reference signs:

[0029] 100 Exposure light source 430 Third DMD region 110 Optical fiber 710 First inclined surface 200 Light collimation homogenization device 720 Second inclined surface 300 DMD device 711 First sub-inclined surface 400 DMD device 712 Second sub-inclined surface 500 Mirror 713 Third sub-inclined surface 600 Maskless projection device 724 Fourth sub-inclined surface 700 3D substrate 725 Fifth sub-inclined surface 750 Planar substrate 726 Sixth sub-inclined surface 800 Carrier plate 910 First exposure light beam 900 Exposure light beam 920 Second exposure light beam 410 First DMD region 930 Third exposure light beam 420 Second DMD region DETAILED DESCRIPTION

[0030] In the drawings, the same or similar notations are used to indicate the same or similar elements or elements having the same or similar functions. The embodiments of the application are described in detail below with reference to the drawings.

[0031] In the description of the present invention, the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the scope of protection of the present invention.

[0032] like Figure 2 As shown, a 3D exposure system according to one embodiment of the present invention includes: a first optical engine and a light source device. The light source device is used to provide light to the first optical engine. The light source device includes, for example, an exposure light source 100, an optical fiber 110, and a light collimation and homogenization device 200. The exposure light source 100 provides, for example, UV light to expose a 3D substrate 700 coated with a photosensitive material such as photoresist. Light emitted by the exposure light source 100 enters the light collimation and homogenization device 200 through the optical fiber 110, thereby collimating and / or homogenizing the light emitted by the exposure light source 100.

[0033] The 3D substrate 700 is relative to the conventional planar substrate 750. The 3D substrate 700 has a 3D contour to be photoetched, so the 3D substrate in the present invention can also be called a 3D component to be photoetched. The shape and structure of the 3D substrate 700 are not limited to Figure 2 The shape and structure shown.

[0034] The first optical engine is disposed on the first side of the 3D substrate 700 ( Figure 2 The upper side or the lower side is used to generate a first exposure pattern and project the first exposure pattern onto the first surface of the 3D substrate 700 ( Figure 2 Specifically, the first optical engine includes a DMD device 400 and a maskless projection device 600. The DMD device 400 functions as a spatial light modulator. Light generated by a pixel mask pattern generated by the DMD device 400 is input to the maskless projection device 600. The light passing through the maskless projection device 600 is focused as an exposure beam onto the first surface of the 3D substrate 700.

[0035] See also Figure 2 The DMD device 400 is tilted relative to the optical axis of the maskless projection apparatus 600. Thus, the focal plane of light reflected from the DMD device 400 after passing through the maskless projection apparatus 600 is an inclined surface. The tilt angle of the inclined surface relative to the optical axis of the maskless projection apparatus 600 is equal to the tilt angle of the DMD device 400 relative to the optical axis of the maskless projection apparatus 600.

[0036] It should be noted that, in the present application, the DMD device 400 is arranged obliquely (not vertically) relative to the optical axis of the maskless projection device 600, which means that the DMD device 400 as a whole is arranged obliquely relative to the optical axis of the maskless projection device 600, rather than that some of the micromirror units of the DMD device 400 are arranged obliquely.

[0037] The oblique angle can be set as required, for example, it can be set in the range of less than 90 degrees and less than or equal to 75 degrees. The oblique angle of the DMD device 400 determines the range of the variation of the focal plane height. That is, the oblique angle of the DMD device 400 can be determined according to the surface relief height difference of the 3D substrate to be processed, so that the focal plane height difference of the light generated by the DMD device 400 is greater than the surface relief height difference of the 3D substrate.

[0038] In this way, the light reflected from the DMD device 400 will have different focal plane positions with different heights after passing through the maskless projection device 600. In other words, different regions of the DMD device 400 will correspond to different focal plane heights. Thus, the surface of the corresponding height position of the relief 3D substrate can be subjected to photolithography.

[0039] The above-mentioned system of the present application can be used for photolithography for 3D profiles, and can be used as a high-resolution digital pattern exposure system for 3D complex patterns with continuous relief and large height difference in a small range of millimeter and micrometer levels. A high-resolution digital pattern exposure system for 3D complex patterns with continuous relief and large height difference in a small range of millimeter and micrometer levels can also be realized by combining multiple optical groups.

[0040] The above-mentioned system of the present application has the advantages of fast scanning exposure speed, convenient and fast use, very wide application range, and can realize the production of various electronic product circuit patterns such as circuit boards, 5G antennas, optoelectronic displays, chips and packaging, and can also meet the production needs of high-speed mass production of decoration industry, precision machining industry, 3D printing, mechanical casting mold and other industries.

[0041] In one embodiment, the number of DMD devices 400 is multiple, and has different heights and different inclinations. Thus, the photolithography of complex 3D substrates can be realized by the combination of the multiple DMD devices 400. Further, in the multiple DMD devices 400, at least one DMD device 400 is arranged vertically relative to the optical axis of the maskless projection device 600, for photolithography of the local horizontal region of the 3D substrate.

[0042] In an alternative embodiment, the height and / or the oblique angle of one or more DMD devices 400 is adjustable. Thus, it is adapted to larger range of relief height and more complex three-dimensional structure.

[0043] Specifically, in order to expose the relief surface of the 3D substrate, the DMD device 400 is divided into at least two DMD regions along its tilt direction, respectively for exposing the corresponding number of different height interval parts of the first side of the 3D substrate 700.

[0044] Referring to Figure 2 and Figure 3 , the example 3D substrate 700 has a plurality of reliefs. In Figure 2 , a first slope 710 and a second slope 720 are marked. As Figure 3 indicated, according to the different heights, the first slope 710 is divided into a first sub-slope 711, a second sub-slope 712 and a third sub-slope 713. The second slope 720 is divided into a fourth sub-slope 724, a fifth sub-slope 725 and a sixth sub-slope 726. Among them, the first sub-slope 711 and the sixth sub-slope 726 have the same height range; the second sub-slope 712 and the fifth sub-slope 725 have the same height range; the third sub-slope 713 and the sixth sub-slope 726 have the same height range.

[0045] Correspondingly, as Figure 2 indicated, the DMD device 400 is also divided into three regions along its tilt direction: a first DMD region 410, a second DMD region 420 and a third DMD region 430. The height of the first DMD region 410, the second DMD region 420 and the third DMD region 430 gradually increases, and the height of the corresponding focal plane also increases accordingly. Thus, the first DMD region 410 corresponds to expose the first sub-slope 711 and the sixth sub-slope 726; the second DMD region 420 corresponds to expose the second sub-slope 712 and the fifth sub-slope 725; the third DMD region 430 corresponds to expose the third sub-slope 713 and the sixth sub-slope 726. That is, the DMD device (400) is divided into at least two DMD regions along its tilt direction, respectively for exposing the corresponding number of different height interval parts of the first side of the 3D substrate (700).

[0046] Although in the above-mentioned embodiment, the example 3D substrate has a relief in the form of a slope, the present application can also be applied to a wave-shaped relief, or other regular or irregular reliefs. As long as the reliefs on the 3D substrate are divided into corresponding regions according to the relief degree, and the DMD device 400 is divided into corresponding regions according to the division of the regions on the 3D substrate, and the regions on the 3D substrate are corresponded to the corresponding DMD regions on the DMD device 400, and the regions on the 3D substrate are exposed by the corresponding DMD regions on the DMD device 400.

[0047] The 3D exposure system comprises a bearing plate and a visual recognition device. The bearing plate is used to bear a plurality of three-dimensional structure products (i.e. 3D substrates) which have been sprayed with exposure ink or photosensitive glue. A plurality of smaller three-dimensional structure products can be simultaneously borne on the bearing plate 800 for exposure processing, so as to improve processing efficiency.

[0048] The visual recognition device is used to obtain positioning information of the three-dimensional structure products on the bearing plate 800. For example, the visual recognition system takes an edge position image or a positioning image of the three-dimensional structure products, so as to expose the products to a required position.

[0049] In an alternative embodiment, the 3D exposure system comprises a Z-direction moving device which is used to drive the maskless projection device 600 to move in the Z direction, so as to improve the processing capacity for 3D substrates with large relief.

[0050] In order to perform double-sided 3D exposure, a 3D exposure system of an embodiment not shown in the drawings of the present application further comprises, on the basis of the foregoing device:

[0051] a second optical engine which is arranged at a second side of the 3D substrate (700) and is used to generate a second exposure pattern and project the second exposure pattern to a second surface of the 3D substrate (700), and specifically, the second optical engine comprises a second DMD device and a second maskless projection device, the second DMD device is used as a spatial light modulator, pixel mask patterns generated by the second DMD device are input to the second maskless projection device, and light passing through the second maskless projection device is focused to the second surface of the 3D substrate (700) as an exposure light beam,

[0052] a second light source device which is used to provide a light source for the second optical engine;

[0053] wherein the second DMD device is arranged to be inclined relative to an optical axis of the second maskless projection device, a focal plane of the light passing through the second maskless projection device is an inclined plane, and an inclination angle of the inclined plane relative to the optical axis of the second maskless projection device is equal to an inclination angle of the second DMD device relative to the optical axis of the second maskless projection device.

[0054] In order to improve the automatic processing capacity for complex 3D substrates, in an embodiment, the 3D exposure system comprises an exposure pattern segmentation and exposure focus simulation device which is capable of automatically generating an electronic pattern according to the exposure size of each three-dimensional structure product, dividing the surface of each three-dimensional structure product into a plurality of segmentation areas and determining the exposure focus of each segmentation area, and segmenting the electronic pattern to form a new area electronic pattern according to the size and position of each segmentation area.

[0055] In one embodiment, the 3D exposure system comprises an exposure electronic pattern generating device which fills the area electronic pattern to the corresponding partitioned area on the corresponding three-dimensional structure product and forms the exposure pattern.

[0056] In one embodiment, the 3D exposure system comprises a dynamic electronic mask generating device which corrects the position and angle of the exposure pattern on the three-dimensional structure product according to the positioning information so that the position of each exposure pattern is consistent with the actual position on the corresponding three-dimensional structure product and generates the dynamic electronic mask.

[0057] The 3D exposure method according to one embodiment of the present application exposes the 3D substrate 700 using the 3D exposure system as described above.

[0058] The 3D exposure method comprises the following steps, for example:

[0059] A loading step of loading the 3D substrate 700 on the carrier plate 800, one side of the 3D substrate 700 having different height three-dimensional structures and the three-dimensional structures having been exposed to exposure ink or photosensitive glue;

[0060] An area partitioning step of partitioning the one side of the 3D substrate into at least two sub-areas according to the different heights; correspondingly, partitioning the DMD device 400 into at least two DMD areas according to the different heights, one sub-area of the 3D substrate corresponding to one DMD area of the DMD device 400, so that the pixel mask pattern generated by the DMD area is within the required focal depth range on the corresponding sub-area of the 3D substrate after being focused by the maskless projection device 600.

[0061] The specific steps of the 3D exposure method according to one alternative embodiment of the present application comprise, for example:

[0062] a. carrier plate positioning,

[0063] b. loading the three-dimensional structure product on the carrier plate,

[0064] c. reading the positioning data, obtaining the positioning information of the three-dimensional structure product on the carrier plate by the visual recognition system,

[0065] d. storing the positioning information, storing the positioning information of the three-dimensional structure product on the carrier plate obtained in the above step into the system database,

[0066] e. reading the positioning information, reading the positioning information of the three-dimensional structure product on the carrier plate from the system database,

[0067] f. reading the pattern filling position, exposure position and exposure focal point information in the exposure pattern,

[0068] g. Generating a dynamic electron mask, the dynamic electron mask generation system corrects the filling position and the tilt angle of the exposure pattern, generates a dynamic electron mask, the 3D pattern software processing system processes the 3D pattern to be exposed digitally to form a pattern unit matched with the application, and divides the pattern to be exposed into the required exposure unit, which can be matched to different partition areas of a single DMD or different partition areas of multiple DMDs, and further, the exposure unit can be specifically allocated to each pixel point in different areas, and each pixel point can be independently controlled

[0069] h. 3D pattern optical processing unit system, one or more digital light processing DMD devices are adjusted in structure, the adjustment includes rotation or tilt or translation of the height of one or more DMD optical devices, side shift and other preprocessing, to form a unit or unit array of a pattern digital exposure optical system matched with the product, to achieve high-low uneven complex 3D topography pattern exposure of 3D products with any height difference and any topography

[0070] i. 3D exposure execution, the pattern unit converted by the 3D pattern software processing system in item b is sent to the 3D pattern optical processing unit system in item c after conversion, and the real-time exposure pattern is sent by the optical processing system, and is projected onto the different heights and slopes of the 3D topography of the product placed on the precision moving platform in item a after magnification or microprojection by the optical combination lens, to perform pattern exposure and photosensitivity on the photosensitive glue or photosensitive dry film on the product.

[0071] The 3D exposure system and method of the embodiment of the application is particularly suitable for high-resolution digital pattern exposure of 3D complex patterns with continuous undulations and large height differences in a small range of millimeters and micrometers, and can also realize a high-resolution digital pattern exposure system for 3D complex patterns with continuous undulations and large height differences in a small range of millimeters or even micrometers through multiple optical group combinations.

[0072] The 3D exposure system and method of the embodiment of the application has the advantages of fast scanning exposure speed, convenient and fast use, very wide application range, and can realize various electronic product circuit pattern manufacturing industries such as circuit boards, 5G antennas, optoelectronic displays, chips and packaging, and can also meet the production needs of high-speed mass production of multiple industries such as decoration industry, precision machining industry, 3D printing and mechanical casting mold.

[0073] The 3D exposure system and method of the embodiment of the application also has the following advantages:

[0074] The intelligent and digital regional division of 3D graphics can make the graphics of different height differences in each region within the focus depth range of the best focus point in exposure, and can complete the exposure of all high-resolution graphics of different heights at one time, and achieve the same precision and resolution as planar exposure.

[0075] The regional exposure management of different heights can be performed on a single DMD, or multiple DMDs can be combined, and each DMD is at a different height position, so that the product graphic exposure of super large area, arbitrary height difference, arbitrary depth of field requirement, and arbitrary angle can be realized, and the implementation of fine exposure of graphics is not limited.

[0076] The exposure function of multiple small pieces of a carrier plate can also be used, as long as the position information of the small pieces of the 3D product of the carrier plate is read, data sharing and unified management are achieved, and the exposure production efficiency can be effectively improved.

[0077] Since the partition regions of the DMD devices at different exposure heights are physically separated and can be controlled individually, the dynamic electronic mask moving scanning exposure is adopted, the position accuracy of the exposure graphics of different height differences and the ultra-high resolution of the graphics can be ensured at one time, and the same precision as planar lithography is achieved.

[0078] The exposure method for preparing high-precision line graphics on a three-dimensional body according to another embodiment of the present application comprises the following specific features.

[0079] a. A precision moving platform is used, for example, a micron-level and nanometer-level positioning accuracy moving platform is used to move the 3D substrate and / or the DMD device, and a professional software control system, a hardware control system matched with the 3D exposure method of the present application, and a platform software and hardware control system matched with the present application are correspondingly provided.

[0080] b. A 3D graphic software processing system is used, after the 3D graphics to be exposed are digitally processed, a graphic unit matched with the present application is formed, and the graphics to be exposed are divided into exposure units required, the exposure units can be matched with different partition regions of a single DMD or different partition regions of multiple DMDs, and further, the exposure units can be specifically allocated to each pixel point in different regions, and each pixel point can be independently controlled.

[0081] c. A 3D graphic optical processing unit system is used, one or more digital light processing DMD devices are adjusted in structure, the adjustment includes rotation or inclination or up-down height translation or side shift of one or more DMD optical devices, and the like, a unit or unit array of a graphic digital exposure optical system matched with the product is formed, so as to achieve the exposure of complex 3D topographic graphics of arbitrary height difference, arbitrary topography, and uneven 3D topography.

[0082] d. In the 3D exposure execution, the graphic unit converted by the 3D graphics software processing system is sent to the 3D graphics optical processing unit system after conversion, the real-time exposure graphics are sent by the optical processing system, and the 3D topography of the product to be exposed on the precision moving platform is projected on different heights and various slopes of the 3D topography of the product to be exposed after magnification or microprojection by the optical combination lens, so as to expose the photosensitive glue or photosensitive dry film on the product (3D substrate) to form a pattern. The precision moving platform drives the product to move at high speed and high precision in a step-by-step scanning mode, and the whole pattern on the product is exposed and imaged by moving scanning, so as to complete the 3D pattern exposure of the whole pattern on the product.

[0083] e. Software conversion and graphic segmentation algorithm of the required 3D exposure pattern

[0084] f. 3D exposure focus simulation system: the system can automatically generate electronic graphics according to the exposure size of each three-dimensional structure product, and through calculation, each surface of each three-dimensional structure product to be exposed is segmented into a plurality of segmentation areas and the exposure focus of each segmentation area is determined, and the electronic graphics are segmented to form new area electronic graphics according to the size and position of each segmentation area;

[0085] g. Exposure electronic graphics generation system

[0086] h. Dynamic electronic mask generation system: according to the position and inclination angle of the exposure pattern on the three-dimensional structure product, the position of each exposure pattern is corrected to be consistent with the actual position of the required exposure area of the three-dimensional structure product, and a dynamic electronic mask is generated.

[0087] i. Maskless lithography system: using laser maskless exposure technology to perform 3D lithography according to the dynamic electronic mask.

[0088] The product to be exposed on the precision moving platform can be a complex 3D topography pattern with any height difference and any topography. Different region division and DMD region division are performed for different 3D topographies, or different processes and technologies are used. For example:

[0089] (1) For the product 3D topography height within a certain height range, for example, the topography of the product is below 5mm, and the exposure line width / line spacing resolution is above 10um, the pattern exposure of the product can be completed at one time by using the present application; for the above range, a plurality of DMDs can be used to realize one-time exposure of the product pattern.

[0090] (2) For the product 3D topography height difference is large, the present application is set to low-cost single DMD for multi-step exposure, and the pattern is exposed by superposition and alignment to complete the 3D pattern exposure of the product

[0091] (3) For product 3D topography resolution requirements are high to sub-micron, nanometer level and (1), (2) can not be single scan exposure complete, using the present application to exposure engine optical components upgrade, further improve the resolution, according to product requirements can be completed one-time product super high resolution pattern exposure; or is layered alignment multiple exposure to achieve super high resolution, height difference big complex 3D graphics; or use multiple different height different tilt DMD exposure, each DMD can be adjusted in different height of different tilt angle to achieve one-time exposure complete

[0092] (4) For product 3D topography has no slope vertical structure, front light can not reach the vertical structure side, can use the present application to single DMD partial pixel area light out, and through the optical lens 45° or other angle inclined surface reflection to achieve vertical structure side, complete 3D vertical side surface pattern exposure, also can use multiple DMD pixel area combination or cooperation to complete the vertical structure side pattern exposure, further, single DMD tilt after DMD pixel partition, different height area pixel array is used for exposure 3D product different height slope photosensitive adhesive exposure, in addition, a part of the area is reflected by 45° or other angle inclined surface to reach the vertical structure side, to the area which the front light can not directly reach for pattern exposure, further, also can be through multiple DMD different pixel area partition, multiple DMD cooperation to complete the above complex pattern exposure

[0093] (5) For product as spherical body or cylinder, cone and other difficult to do single direction optical exposure processing, can use clamp to do uniform speed rotation or acceleration rotation, using the present application digital three-dimensional exposure system, for uniform speed rotation, do uniform speed three-dimensional spherical surface, cylindrical surface, conical surface exposure, for acceleration rotation can also be accelerated digital three-dimensional drawing exposure, further, also can be through single DMD pixel partition exposure cooperation or multiple DMD different pixel area partition cooperation to complete the above product pattern exposure.

[0094] The above-mentioned exposure method for preparing high-precision line pattern on three-dimensional body provided by the embodiment of the present application is described in detail, and the principle and implementation mode of the present application are described by using specific examples in this paper. The above-mentioned embodiment is only used to help understand the method of the present application and its core idea. Meanwhile, for the general technical personnel in this field, the specific implementation mode and application range of the present application will be changed according to the idea of the present application. In summary, the content of the present description should not be understood as the limitation of the present application.

[0095] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the same. Those skilled in the art should understand that the technical solutions described in the foregoing embodiments can be modified, or some technical features thereof can be replaced by equivalent ones; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A 3D exposure system, characterized by, Comprise: A first optical engine arranged on a first side of a 3D substrate (700) for generating a first exposure pattern and projecting the first exposure pattern to a first surface of the 3D substrate (700), specifically, the first optical engine comprises a DMD device (400) and a maskless projection device (600), the DMD device (400) is used as a spatial light modulator, the light generated by the pixel mask pattern generated by the DMD device (400) is input to the maskless projection device (600), and the light passing through the maskless projection device (600) is focused on the first surface of the 3D substrate (700) as an exposure beam, A light source device for providing a light source for the first optical engine; Wherein the DMD device (400) is arranged obliquely relative to the optical axis of the maskless projection device (600), the focal plane of the light passing through the maskless projection device (600) is an inclined plane, and the inclination angle of the inclined plane relative to the optical axis of the maskless projection device (600) is equal to the inclination angle of the DMD device (400) relative to the optical axis of the maskless projection device (600). The DMD device (400) is divided into at least two DMD regions along its oblique direction, which are respectively used for exposing different height interval parts on the first side of the 3D substrate (700) to ensure that different height interval parts are within the focal depth range of the best focus point in one-time exposure.

2. The 3D exposure system of claim 1, wherein, The inclination angle is set to be less than 90 degrees and greater than or equal to 45 degrees.

3. The 3D exposure system of claim 1, wherein, Further comprising a Z-direction moving device for driving the maskless projection device (600) to move in the Z-direction.

4. The 3D exposure system of claim 3, wherein, The 3D exposure system comprises a visual recognition device for acquiring positioning information of the 3D substrate (700) on a carrier plate (800).

5. The 3D exposure system of claim 1, wherein, The number of DMD devices (400) is multiple, and the DMD devices (400) have different heights and different inclination angles.

6. The 3D exposure system of claim 1, wherein, The height and / or inclination angle of the DMD device (400) is adjustable.

7. The 3D exposure system of any of claims 1-6, wherein, The 3D exposure system further comprises: A second optical engine arranged on a second side of a 3D substrate (700) for generating a second exposure pattern and projecting the second exposure pattern to a second surface of the 3D substrate (700), specifically, the second optical engine comprises a second DMD device and a second maskless projection device, the second DMD device is used as a spatial light modulator, the light generated by the pixel mask pattern generated by the second DMD device is input to the second maskless projection device, and the light passing through the second maskless projection device is focused on the second surface of the 3D substrate (700) as an exposure beam, A second light source device for providing a light source for the second optical engine; Wherein the second DMD device is arranged obliquely relative to the optical axis of the second maskless projection device, the focal plane of the light passing through the second maskless projection device is an inclined plane, and the inclination angle of the inclined plane relative to the optical axis of the second maskless projection device is equal to the inclination angle of the second DMD device relative to the optical axis of the second maskless projection device.

8. A 3D exposure method, characterized by, The 3D exposure method exposes a 3D substrate (700) by using the 3D exposure system according to any one of claims 1-7.

9. The 3D exposure method of claim 8, wherein, The method comprises the following steps: a loading step, loading a 3D substrate (700) on a carrier plate (800), one side of the 3D substrate (700) having a three-dimensional structure with different heights, and the three-dimensional structure having been sprayed with exposure ink or photosensitive glue; a region segmentation step, segmenting the one side of the 3D substrate into at least two sub-regions according to the different heights; correspondingly, segmenting the DMD device (400) into at least two DMD regions according to the different heights, one sub-region of the 3D substrate corresponding to one DMD region of the DMD device (400), so that the pixel mask pattern generated by the DMD region is within the required focal depth range on the corresponding sub-region of the 3D substrate after being focused by the maskless projection device (600).

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