Substrate processing apparatus and substrate processing method

Abstract

This invention relates to a substrate processing apparatus and a substrate processing method. An embodiment of the substrate processing apparatus according to the invention may include: a substrate cleaning unit configured to clean a substrate; a substrate drying unit configured to dry a substrate; and a transport robot configured to transport the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit may include a substrate processing container having a substrate processing space for accommodating the substrate. A surface temperature measuring sensor for measuring the surface temperature of the substrate processing container may be provided in the transport robot.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Semiconductor devices are typically manufactured using various processes, including photolithography, which forms circuit patterns on a substrate such as a silicon wafer.

[0003] In the manufacturing process of semiconductor devices, various foreign objects such as particles, organic contaminants, and metallic impurities are generated. These foreign objects cause defects on the substrate, thereby directly affecting the yield of semiconductor devices. Therefore, in order to remove foreign objects, a substrate cleaning process is necessary in the manufacturing process of semiconductor devices.

[0004] In order to clean the substrate, a cleaning process of cleaning the substrate with a cleaning agent and a drying process of drying the substrate are performed.

[0005] As a drying process, a supercritical drying process is performed using supercritical fluid to dry the substrate.

[0006] Supercritical fluids possess both gaseous and liquid properties at temperatures above the critical temperature and pressure above the critical pressure. They exhibit excellent diffusivity and water permeability, high solubility, and low surface tension, making them highly effective in the drying process of substrates.

[0007] To perform such a supercritical drying process, a high-temperature supercritical environment needs to be created in the substrate processing container where the substrate is located.

[0008] As a prior art, Patent Document 1 discloses a substrate cleaning apparatus comprising a substrate processing container, a fluid supply unit, a heat-conducting element plate, and a surface temperature measuring sensor. According to Patent Document 1, the surface temperature measuring sensor senses the temperature of the space where the substrate is located.

[0009] As the drying process of the substrate is repeated, the surface temperature of the substrate processing container rises. This rise in surface temperature causes a deviation in the surface temperature distribution of the substrate processing container. This deviation in surface temperature distribution leads to uneven diffusion of the supercritical fluid. Furthermore, this uneven diffusion of the supercritical fluid may cause defects on the substrate.

[0010] (Patent Document 1) Korean Publication No. 10-2011-0080362 (July 13, 2011) Summary of the Invention

[0011] The purpose of this invention is to provide a substrate processing apparatus and a substrate processing method capable of measuring the surface temperature of a substrate processing container and determining whether to transport a substrate into the substrate processing container based on the surface temperature of the substrate processing container.

[0012] The substrate processing apparatus according to an embodiment of the present invention for achieving the above-mentioned objectives may include: a substrate cleaning unit configured to clean a substrate; a substrate drying unit configured to dry a substrate; and a transport robot configured to transport a substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit may include a substrate processing container having a substrate processing space for accommodating the substrate. A surface temperature measuring sensor for measuring the surface temperature of the substrate processing container may be provided in the transport robot.

[0013] Alternatively, the substrate processing apparatus according to an embodiment of the present invention may further include: a control unit that determines whether to transport the substrate into the substrate processing container based on the surface temperature of the substrate processing container measured by a surface temperature measuring sensor.

[0014] The handling robot may include: a first hand configured to transport a substrate out of a substrate drying unit; a second hand configured to transport a substrate into a substrate cleaning unit; and a third hand configured to transport a substrate out of a substrate cleaning unit and into a substrate drying unit, wherein a surface temperature measuring sensor may be disposed on the first hand.

[0015] The first part may include: a substrate mounting member for mounting the substrate; and a guide member configured to protrude from the substrate mounting member and support the side of the substrate, wherein a surface temperature measuring sensor may be installed in a receiving groove recessed in the guide member.

[0016] The substrate processing container may include a first body and a second body that are combined with each other to form a substrate processing space. The first body may have a first corresponding surface facing the second body, and the second body may have a second corresponding surface facing the first corresponding surface of the first body. The surface temperature measuring sensor may be configured to measure the surface temperature of the first corresponding surface or the second corresponding surface.

[0017] Multiple surface temperature sensors can be provided. In the second main body, multiple heating modules can be arranged in a circumferential direction with the center of the second corresponding surface as a reference. The multiple surface temperature sensors can be configured to measure the surface temperature of the second corresponding surface from multiple measurement points arranged on the same circle as the circle in which the multiple heating modules are arranged or on a circle with the same center.

[0018] Yes, the surface temperature sensor is a non-contact temperature sensor.

[0019] According to an embodiment of the present invention, a substrate processing method is used to process a substrate using a substrate processing apparatus. The substrate processing apparatus includes: a substrate cleaning unit configured to clean the substrate; and a substrate drying unit configured to dry the substrate, and includes a substrate processing container for containing the substrate. The substrate processing method includes: (a) a step of measuring the surface temperature of the substrate processing container; (b) a step of determining whether the surface temperature of the substrate processing container exceeds a preset reference temperature range; and (c) a step of transferring the substrate from the substrate cleaning unit to the substrate drying unit when the surface temperature of the substrate processing container is within the preset reference temperature range.

[0020] Alternatively, the substrate processing method according to an embodiment of the present invention may further include: (d) the step of adjusting the temperature of the substrate processing container when the surface temperature of the substrate processing container is not within a preset reference temperature range.

[0021] The substrate processing method according to an embodiment of the present invention may further include: before step (a), detecting whether there is a preliminary substrate in the substrate processing container; when there is a preliminary substrate in the substrate processing container, step (a) may be performed while the preliminary substrate is being transported out of the substrate processing container.

[0022] The substrate processing apparatus may include multiple substrate processing containers, steps (a) and (b) may be performed on multiple substrate processing containers, and step (c) may preferentially transport a substrate into a substrate processing container whose surface temperature is within a preset reference temperature range.

[0023] Alternatively, the substrate processing method according to an embodiment of the present invention may further include: a step of adjusting the temperature of substrate processing containers whose surface temperature is not within a preset reference temperature range in a plurality of substrate processing containers.

[0024] The substrate processing apparatus may include a handling robot, which includes a first hand, a second hand, and a third hand. The process of transporting the substrate out of the substrate drying unit can be performed by the first hand, the process of transporting the substrate into the substrate cleaning unit can be performed by the second hand, the process of transporting the substrate out of the substrate cleaning unit and into the substrate drying unit can be performed by the third hand, and the process of measuring the surface temperature of the substrate processing container can be performed by a surface temperature measuring sensor disposed on the first hand.

[0025] According to an embodiment of the present invention, a substrate processing method is used to process a substrate using a substrate processing apparatus. The substrate processing apparatus includes: a substrate cleaning unit configured to clean the substrate; and a substrate drying unit configured to dry the substrate, and includes a substrate processing container for containing the substrate. The substrate processing method includes: (a) a step of removing the substrate from the substrate cleaning unit; (b) a step of measuring the surface temperature of the substrate processing container; (c) a step of determining whether the surface temperature of the substrate processing container exceeds a preset reference temperature range; (d) a step of transferring the substrate to the substrate drying unit when the surface temperature of the substrate processing container is within the preset reference temperature range; and (e) a step of transferring the substrate into the substrate cleaning unit when the surface temperature of the substrate processing container is not within the preset reference temperature range.

[0026] Alternatively, the substrate processing method according to an embodiment of the present invention may further include: (f) the step of adjusting the temperature of the substrate processing container when the surface temperature of the substrate processing container is not within a preset reference temperature range.

[0027] The substrate processing method according to an embodiment of the present invention may further include: before step (a), detecting whether there is a prior substrate in the substrate processing container; when there is a prior substrate in the substrate processing container, step (a) may be performed while the prior substrate is being transported out of the substrate processing container.

[0028] Alternatively, in step (e), a cleaning solution may be supplied to the substrate being transported into the substrate cleaning unit to prevent the surface of the substrate from drying out.

[0029] The substrate processing apparatus may include multiple substrate processing containers, steps (b) and (c) may be performed on multiple substrate processing containers, and step (d) may preferentially transport substrates into substrate processing containers whose surface temperature is within a preset reference temperature range.

[0030] Alternatively, the substrate processing method according to an embodiment of the present invention may further include: a step of adjusting the temperature of substrate processing containers whose surface temperature is not within a preset reference temperature range in a plurality of substrate processing containers.

[0031] The substrate processing apparatus may include a handling robot, which includes a first hand, a second hand, and a third hand. The process of transporting the substrate out of the substrate drying unit can be performed by the first hand, the process of transporting the substrate into the substrate cleaning unit can be performed by the second hand, the process of transporting the substrate out of the substrate cleaning unit and into the substrate drying unit can be performed by the third hand, and the process of measuring the surface temperature of the substrate processing container can be performed by a surface temperature measuring sensor disposed on the first hand.

[0032] According to embodiments of the present invention, a substrate processing apparatus and substrate processing method are provided with a surface temperature measuring sensor that measures the surface temperature of a substrate processing container, which is then mounted on a handling robot. Therefore, the surface temperature measuring sensor can accurately measure the surface temperature of the substrate processing container. This prevents the substrate from being transported into the substrate processing container when the surface temperature exceeds a predetermined temperature range. Consequently, it prevents uneven distribution of supercritical fluid that may occur when the substrate is transported into the substrate processing container when the surface temperature exceeds the predetermined temperature range, thus preventing substrate defects that may result from uneven distribution of supercritical fluid. Attached Figure Description

[0033] Figure 1 This is a schematic diagram illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0034] Figure 2 This is a schematic diagram illustrating the substrate cleaning unit of a substrate processing apparatus according to an embodiment of the present invention.

[0035] Figure 3 as well as Figure 4 This is a schematic diagram illustrating the substrate drying unit of a substrate processing apparatus according to an embodiment of the present invention.

[0036] Figure 5 as well as Figure 6 This is a schematic diagram illustrating the substrate processing container of the substrate drying unit of the substrate processing apparatus according to an embodiment of the present invention.

[0037] Figure 7 This is a schematic diagram illustrating a handling robot of a substrate processing apparatus according to an embodiment of the present invention.

[0038] Figure 8 This is a flowchart illustrating an example of a substrate processing method according to an embodiment of the present invention.

[0039] Figure 9 This is a flowchart illustrating another example of a substrate processing method according to an embodiment of the present invention.

[0040] Figure 10 This is a flowchart illustrating yet another example of a substrate processing method according to an embodiment of the present invention.

[0041] (Explanation of reference numerals in the attached diagram)

[0042] 42: Substrate processing container

[0043] 421: The First Subject

[0044] 422: Second Subject

[0045] 50: Handling robot

[0046] 60: Surface temperature measuring sensor Detailed Implementation

[0047] Hereinafter, with reference to the accompanying drawings, a substrate processing apparatus and a substrate processing method according to embodiments of the present invention will be described.

[0048] First, refer to Figures 1 to 7 This describes a substrate processing apparatus according to an embodiment of the present invention.

[0049] like Figure 1 As shown, the substrate processing apparatus includes an indexing unit 10 and a process processing unit 20.

[0050] The index unit 10 includes an unloading port 11 and a transfer rack 12.

[0051] The unloading port 11, the conveyor 12, and the process handling unit 20 are arranged in a row. The direction in which the unloading port 11, the conveyor 12, and the process handling unit 20 are arranged is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-axis direction is defined as the Y-axis direction. And the direction perpendicular to the XY plane, which includes both the X-axis and Y-axis directions, is defined as the Z-axis direction.

[0052] A carrier 13 containing a substrate is placed in the unloading port 11. Multiple unloading ports 11 are provided. The multiple unloading ports 11 are arranged in a row along the Y-axis. A front-opening unified pod (FOUP) can be used as the carrier 13.

[0053] The process unit 20 includes a buffer module 21, a transport chamber 22, a first process chamber 23, a second process chamber 24, and a control unit (not shown) configured to control the substrate processing process.

[0054] The process unit 20 may include a plurality of first process chambers 23 and a plurality of second process chambers 24. The substrate may be processed simultaneously or sequentially in the plurality of first process chambers 23 and the plurality of second process chambers 24.

[0055] The transport chamber 22 is configured such that its length direction is parallel to the X-axis direction.

[0056] A buffer module 21 is disposed between the conveyor frame 12 and the transport chamber 22. The substrates transported between the transport chamber 22 and the conveyor frame 12 wait in the buffer module 21.

[0057] The conveyor 12 moves the load between the carrier 13 and the buffer module 21, which are placed in the unloading port 11. An index track 14 and an indexing robot 15 are provided in the conveyor 12.

[0058] The indexing robot 15 is mounted on the indexing track 14 and moves linearly along the indexing track 14 in the Y-axis direction. The indexing robot 15 is configured to transport a substrate from the process processing unit 20 to the carrier 13 and from the carrier 13 to the process processing unit 20.

[0059] The first process chamber 23 and the second process chamber 24 can be configured to perform processes sequentially on a substrate.

[0060] Liquid treatment processes such as cleaning, rinsing, and displacement processes can be performed within the first process chamber 23. Displacement processes can be performed using organic solvents. Isopropanol (IPA) can be used as an organic solvent.

[0061] A substrate cleaning unit 30 is provided in the first process chamber 23.

[0062] like Figure 2 As shown, the substrate cleaning unit 30 includes a recycling container 31, a rotating head 32, a lifting module 33, and a spraying module 34.

[0063] The recycling container 31 provides space for cleaning the substrate S. The recycling container 31 is configured to recover the agent supplied to the substrate S. If the agent is supplied to the substrate S while the substrate S is rotated by the rotating head 32, the agent is uniformly dispersed on the substrate S and then scattered from the substrate S. At this time, the scattered agent can be recovered into the recycling container 31.

[0064] The rotating head 32 is disposed inside the recycling container 31. The rotating head 32 serves to support the substrate S and rotate it.

[0065] The lifting module 33 is configured to allow the recycling container 31 to move linearly in the up-down direction. This up-down movement of the recycling container 31 adjusts its relative height to the rotating head 32.

[0066] The spraying module 34 is configured to supply processing liquid to the substrate S. Multiple spraying modules 34 can be provided. When multiple spraying modules 34 are provided, different processing liquids can be supplied through multiple spraying modules 34.

[0067] A drying process for the substrate can be performed in the second process chamber 24. The drying process can be performed using a supercritical fluid. Carbon dioxide can be used as the supercritical fluid. The supercritical fluid serves to remove foreign matter remaining between the fine circuit patterns formed on the substrate.

[0068] A substrate drying unit 40 for performing a drying process on a substrate is provided in the second process chamber 24.

[0069] like Figure 3 as well as Figure 4As shown, the substrate drying unit 40 is configured to dry the substrate S containing residual organic solvent. The substrate drying unit 40 can use a supercritical fluid to dry the substrate S.

[0070] The substrate drying unit 40 includes a housing 41, a substrate processing container 42, a lifting module 43, a heating module 44, a blocking module 45, an exhaust module 46, a fluid supply module 47, a clamping module 48, and a moving module 49.

[0071] Inside the housing 41, a substrate processing container 42, a lifting module 43, a heating module 44, and a blocking module 45 are configured.

[0072] A substrate processing space 428 for accommodating the substrate S is provided inside the substrate processing container 42. The substrate processing container 42 includes a first body 421 and a second body 422.

[0073] The first body 421 and the second body 422 are combined with each other, thereby sealing the substrate processing space 428.

[0074] The first body 421 has a bottom surface (a first corresponding surface 425 facing the second body 422). The first corresponding surface 425 of the first body 421 is formed as a step. The center of the first corresponding surface 425 of the first body 421 is located lower than the edge. For example, the first body 421 can be formed into a generally cylindrical shape. The first body 421 can be raised or lowered relative to the second body 422 by a lifting module 43.

[0075] A first fluid supply path 423 and a first fluid discharge path 429 are formed in the first body 421. Supercritical fluid can be supplied to the substrate processing space 428 through the first fluid supply path 423.

[0076] The second body 422 is combined with the first body 421 to form a substrate processing space 428. The second body 422 is located above the first body 421.

[0077] The second body 422 has a second corresponding surface 426 on its upper surface (facing the first corresponding surface 425 of the first body 421). The second corresponding surface 426 of the second body 422 can be formed in a shape where the center is higher than the edge. For example, the second body 422 can be provided in a generally cylindrical shape.

[0078] A second fluid supply path 424 is formed in the second body 422. Supercritical fluid can be supplied to the substrate processing space 428 through the second fluid supply path 424.

[0079] A substrate support portion 427 is provided in the second corresponding surface 426 of the second main body 422. The substrate support portion 427 serves to support the substrate S within the substrate processing space 428. The substrate S has a processing surface (the upper surface of the substrate S) and a non-processing surface (the lower surface of the substrate S). The substrate S is supported by the substrate support portion 427 such that the processing surface faces the second main body 422 and the non-processing surface faces the first main body 421.

[0080] The lifting module 43 raises or lowers the first main body 421 to adjust the relative position between the first main body 421 and the second main body 422. The lifting module 43 raises the first main body 421, allowing the first main body 421 and the second main body 422 to be close together (see reference). Figure 4 The lifting module 43 lowers the first body 421, thereby separating the first body 421 and the second body 422 from each other (see reference). Figure 3 ).

[0081] The heating module 44 is configured to heat the substrate processing space 428. The heating module 44 heats the supercritical fluid supplied to the substrate processing space 428 to above the critical temperature and maintains the supercritical fluid in a supercritical state. The heating module 44 can be configured as a heater. The heating module 44 can be disposed within the second body 422. For example, the heating module 44 can be inserted into a groove formed in the second body 422.

[0082] like Figure 5 as well as Figure 6 As shown, multiple heating modules 44 can be arranged circumferentially with reference to the center of the second corresponding surface 426 of the second body 422. Multiple heating modules 44 can be arranged on a circle with reference to the center of the second corresponding surface 426 of the second body 422. Multiple heating modules 44 can be arranged at uniform intervals. Therefore, multiple heating modules 44 can uniformly heat the substrate processing space 428.

[0083] On the other hand, a temperature sensor 441 may be provided within the second body 422. For example, the temperature sensor 441 may be inserted into a slot formed in the second body 422.

[0084] The control unit controls the heating module 44 based on the temperature measured by the temperature sensor 441, thereby adjusting the temperature within the substrate processing space 428.

[0085] The blocking module 45 prevents the supercritical fluid supplied from the first fluid supply path 423 from being directly supplied to the unprocessed surface of the substrate S. For example, the blocking module 45 may include a blocking plate.

[0086] The exhaust module 46 is configured to discharge process byproducts present in the substrate processing space 428.

[0087] The fluid supply module 47 is configured to supply supercritical fluid to the substrate processing space 428. The supercritical fluid is supplied in a supercritical state through critical temperature and critical pressure. The fluid supply module 47 may include multiple supply lines.

[0088] The clamping module 48 is configured to fix the first main body 421 and the second main body 422. For example... Figure 2 As shown, the first body 421 and the second body 422 can be fixed by the clamping module 48 when the first body 421 and the second body 422 are in close contact with each other. The clamping module 48 includes a first clamping member 481 and a second clamping member 482 configured to be in close contact with the first body 421 and the second body 422.

[0089] The movable module 49 can be configured to move the first clamping member 481 and the second clamping member 482. The first clamping member 481 and the second clamping member 482 can be fixed to the first body 421 and the second body 422 (see reference) by moving the movable module 49 adjacent to each other. Figure 4 The first clamping member 481 and the second clamping member 482 can release the first body 421 and the second body 422 by moving the moving module 49 apart from each other (see reference). Figure 3 ).

[0090] On the other hand, in the transport chamber 22, the substrate is transported between the buffer module 21, the first process chamber 23, and the second process chamber 24.

[0091] like Figure 1 As shown, a guide rail 221 and a handling robot 50 are installed inside the handling chamber 22.

[0092] The guide rail 221 is configured such that its length direction is parallel to the X-axis direction. The handling robot 50 is mounted on the guide rail 221. The handling robot 50 moves linearly along the guide rail 221 in the X-axis direction.

[0093] like Figure 3 As shown, the handling robot 50 performs the function of transporting the substrate S into the substrate processing space 428 of the substrate drying unit 40 and mounting it on the substrate support 427. In addition, the handling robot 50 performs the function of transporting the substrate S out of the substrate support 427 of the substrate drying unit 40.

[0094] like Figure 7 As shown, the handling robot 50 may include multiple hands 51, 52, and 53.

[0095] The multiple hands 51, 52, and 53 may include a first hand 51, a second hand 52, and a third hand 53.

[0096] The first hand part 51, the second hand part 52, and the third hand part 53 can be arranged in a vertical line. The first hand part 51 is arranged on the top layer, and the third hand part 53 is arranged on the bottom layer. The second hand part 52 is arranged between the first hand part 51 and the third hand part 53. The first hand part 51, the second hand part 52, and the third hand part 53 can move independently.

[0097] The first hand part 51, the second hand part 52, and the third hand part 53 have a substrate mounting component 54, a first guide component 55, and a second guide component 56.

[0098] The substrate S is placed in the substrate mounting member 54. The substrate mounting member 54 can support the substrate S in a horizontal state. The substrate mounting member 54 can be formed in the shape of a plate.

[0099] The first guide member 55 and the second guide member 56 protrude from the substrate mounting member 54. The first guide member 55 and the second guide member 56 support the side of the substrate S. The first guide member 55 and the second guide member 56 prevent the substrate S from detaching from the substrate mounting member 54.

[0100] The first hand 51 can be used to remove the substrate S, which has been processed in the second process chamber 24, from the second process chamber 24. That is, the first hand 51 can be used to remove the substrate S from the substrate processing space 428 of the substrate drying unit 40.

[0101] The second hand 52 can be used to transport the substrate S into the first process chamber 23. That is, the second hand 52 can be used to mount the substrate S on the rotating head 32 of the substrate cleaning unit 30.

[0102] The third hand part 53 can be used to transport the substrate S, which has been processed in the first process chamber 23, into the second process chamber 24. That is, after the substrate S is transported out of the rotating head 32 of the substrate cleaning unit 30, the third hand part 53 can be used to transport the substrate S into the substrate support part 427 of the substrate drying unit 40. At this time, the third hand part 53 can be used to transport the substrate S coated with organic solvent from the substrate cleaning unit 30 into the substrate drying unit 40.

[0103] The processes of transporting substrate S into the first process chamber 23, transporting substrate S out of the first process chamber 23, transporting substrate S into the second process chamber 24, and transporting substrate S out of the second process chamber 24 can be performed simultaneously or sequentially by the first hand unit 51, the second hand unit 52, and the third hand unit 53. Therefore, the processes of transporting substrate S into the first process chamber 23, transporting substrate S out of the first process chamber 23, transporting substrate S into the second process chamber 24, and transporting substrate S out of the second process chamber 24 can be performed quickly and efficiently.

[0104] On the other hand, the present invention is not limited to a handling robot having three hands. The present invention can also be applied to a handling robot having a single hand, a handling robot having two hands, or a handling robot having four or more hands.

[0105] During the process of drying the substrate S in the substrate drying unit 40, the surface temperatures of the first body 421 and the second body 422 increase. That is, the temperature of the supercritical fluid supplied to the substrate processing space 428 is higher than the set temperature of the substrate processing space 428, so the surface temperature of the substrate processing container 42 (i.e., the surface temperature of the first body 421 and the surface temperature of the second body 422) increases.

[0106] If the surface temperature of the substrate processing container 42 increases, the supercritical fluid diffuses unevenly, thus causing defects on the substrate S.

[0107] On the other hand, the substrate drying unit 40 includes a temperature sensor 441. However, the temperature sensor 441 is disposed inside the second body 422 of the substrate processing container 42, therefore there is a positional difference T (refer to) between the position of the temperature sensor 441 and the position of the second corresponding surface 426 of the second body 422. Figure 3 Due to this positional difference T, the temperature sensor 441 cannot accurately measure the surface temperature of the second corresponding surface 426.

[0108] Therefore, in order to prevent defects in the substrate S caused by an increase in the surface temperature of the substrate processing container 42, a surface temperature measuring sensor 60 can be installed in the handling robot 50 (see reference). Figure 7 ).

[0109] The surface temperature sensor 60 can be mounted on the first handpiece 51. The surface temperature sensor 60 can be a non-contact temperature sensor. The non-contact temperature sensor can be an infrared sensor that measures the infrared emissivity from an object. The surface temperature sensor 60 can be a non-contact temperature sensor with automatic focus adjustment.

[0110] Multiple surface temperature measuring sensors 60 can be installed in the first hand part 51.

[0111] As an example, such as Figure 5 As shown, the plurality of surface temperature measuring sensors 60 can be configured to measure the surface temperature of the second corresponding surface 426 of the second body 422 from a plurality of measuring points M arranged on a circle having the same center (concentricity) as the circle in which the plurality of heating modules 44 are arranged. For this purpose, the plurality of surface temperature measuring sensors 60 can be arranged on a circle concentric with the circle in which the plurality of heating modules 44 are arranged.

[0112] As another example, such as Figure 6As shown, the plurality of surface temperature measuring sensors 60 can be configured to measure the surface temperature of the second corresponding surface 426 of the second body 422 from a plurality of measuring points M arranged on the same circle as the circle on which the plurality of heating modules 44 are arranged. For this purpose, the plurality of surface temperature measuring sensors 60 can be arranged on the same circle as the circle on which the plurality of heating modules 44 are arranged.

[0113] Thus, the multiple surface temperature measuring sensors 60 are configured to measure the surface temperature of the second corresponding surface 426 of the second body 422 from multiple measuring points M corresponding to the positions of the multiple heating modules 44, thereby enabling more accurate measurement of the surface temperature of the second corresponding surface 426 of the second body 422.

[0114] On the other hand, when the handling robot 50 has a single hand, a surface temperature measuring sensor 60 can be installed on that single hand. When the handling robot 50 has two or four or more hands, the surface temperature measuring sensor 60 can be installed on the uppermost hand.

[0115] On the other hand, the surface temperature measuring sensor 60 can be configured to measure not only the second corresponding surface 426 of the second body 422 but also the surface temperature of the first corresponding surface 425 of the first body 421. That is, the surface temperature measuring sensor 60 can be configured to measure the surface temperature of either the first corresponding surface 425 or the second corresponding surface 426, or to measure the surface temperature of both the first corresponding surface 425 and the second corresponding surface 426.

[0116] The surface temperature sensor 60 is connected to the control unit. The control unit can determine whether to transport the substrate into the substrate processing container 42 based on the surface temperature of the substrate processing container 42 measured by the surface temperature sensor 60.

[0117] In addition, when the surface temperature of the substrate processing container 42 measured by the surface temperature measuring sensor 60 is less than the preset reference temperature range, the control unit controls the heating module 44 to heat the substrate processing space 428.

[0118] In addition, when the surface temperature of the substrate processing container 42 detected by the surface temperature measuring sensor 60 exceeds the preset reference temperature, the control unit can prevent the heating module 44 from heating the substrate processing space 428.

[0119] Here, the preset temperature range is a temperature range suitable for the characteristics of the substrate S. The preset temperature range can be obtained as follows: with the substrate S located inside the substrate processing container 42, while changing the surface temperature of the substrate processing container 42, it is measured whether a defect occurs in the substrate S, and the temperature at which no defect occurs in the substrate S is measured. The preset temperature range can be obtained from the average or deviation of multiple temperature measurements.

[0120] Alternatively, receiving grooves 551 and 561 of predetermined depth can be formed in the first guide member 55 and the second guide member 56 of the first hand portion 51, and the surface temperature measuring sensor 60 can be installed in the receiving grooves 551 and 561. Therefore, during the process of the first hand portion 51 transporting the substrate S, the surface temperature measuring sensor 60 does not come into contact with the substrate S. Thus, damage to the substrate S or the surface temperature measuring sensor 60 that may occur when the substrate S and the surface temperature measuring sensor 60 come into contact can be prevented.

[0121] Below, refer to Figure 8 An example of a substrate processing method according to an embodiment of the present invention will be described.

[0122] First, the third hand 53 of the handling robot 50 moves toward the substrate cleaning unit 30 in the first process chamber 23 and transports the substrate S (subsequent substrate S) that has been processed by the substrate cleaning unit 30 out of the substrate cleaning unit 30 (S10).

[0123] Furthermore, the control unit detects whether a preliminary substrate S (S11) exists in the substrate processing container 42 of the substrate drying unit 40 in the second process chamber 24.

[0124] If a preceding substrate S is present in the substrate processing container 42 of the substrate drying unit 40 (S12), the substrate S cannot be transported into the substrate processing container 42. Therefore, the first hand 51 of the handling robot 50 transports the preceding substrate S out of the substrate processing container 42 (S13).

[0125] During the process of the first hand 51 of the handling robot 50 carrying out the pilot substrate S, the surface temperature of the substrate processing container 42 can be measured by the surface temperature measuring sensor 60 provided on the first hand 51 (S13).

[0126] On the other hand, if there is no preceding substrate S in the substrate processing container 42 (S12), the first hand 51 of the handling robot 50 moves toward the substrate drying unit 40 to measure the surface temperature of the substrate processing container 42 (S14).

[0127] Furthermore, the control unit determines whether the measured surface temperature of the substrate processing container 42 is within the reference temperature range (S16).

[0128] If the measured surface temperature of the substrate processing container 42 is within the reference temperature range (S16), the third hand 53 of the handling robot 50 transports the subsequent substrate S into the substrate processing container 42 (S17). Thus, the process of drying the substrate S is performed in the substrate processing container 42 of the substrate drying unit 40.

[0129] On the other hand, if the measured surface temperature of the substrate processing container 42 is not within the reference temperature range (S16), that is, when the surface temperature of the substrate processing container 42 is less than or exceeds the preset temperature range, the process of adjusting the internal temperature of the substrate processing container 42 can be performed (S15).

[0130] As one example, during the process of adjusting the internal temperature of the substrate processing container 42, the first hand 51 can remain inside the substrate processing container 42. As another example, during the process of adjusting the internal temperature of the substrate processing container 42, the first hand 51 can move from the substrate processing container 42 to the outside and be located outside the substrate processing container 42.

[0131] If the process of adjusting the internal temperature of the substrate processing container 42 is completed, the process of measuring the surface temperature of the substrate processing container 42 using the surface temperature measuring sensor 60 installed in the first hand part 51 is repeated (S14).

[0132] At this time, when the surface temperature of the substrate processing container 42 is less than or exceeds the preset temperature range, the process of adjusting the internal temperature of the substrate processing container 42 can be repeated (S15).

[0133] On the other hand, when the surface temperature of the substrate processing container 42 is within a preset temperature range, the third hand 53 of the handling robot 50 moves into the substrate processing container 42 and transports the substrate S into the substrate processing container 42.

[0134] Therefore, processing can be performed on substrate S within a temperature range appropriately set for substrate S.

[0135] Below, refer to Figure 9 To illustrate another example of the substrate processing method according to an embodiment of the present invention.

[0136] First, the third hand 53 of the handling robot 50 moves toward the substrate cleaning unit 30 in the first process chamber 23 and transports the substrate S, which has been processed by the substrate cleaning unit 30, out of the substrate cleaning unit 30 (S20).

[0137] Furthermore, the first hand 51 of the handling robot 50 moves toward the substrate drying unit 40 to measure the surface temperature of the substrate processing container 42 (S21).

[0138] Furthermore, the control unit determines whether the measured surface temperature of the substrate processing container 42 is within the reference temperature range (S22).

[0139] If the measured surface temperature of the substrate processing container 42 is within the reference temperature range (S16), the third hand 53 of the handling robot 50 transports the substrate S into the substrate processing container 42 (S29). Thus, the process of drying the substrate S is performed in the substrate processing container 42 of the substrate drying unit 40.

[0140] On the other hand, if the measured surface temperature of the substrate processing container 42 is not within the reference temperature range (S22), that is, when the surface temperature of the substrate processing container 42 is less than or exceeds the preset temperature range, the third hand 53 of the handling robot 50 re-transports the substrate S to the substrate cleaning unit 30 (S23). A drying prevention process can be performed on the substrate S that has been re-transported to the substrate cleaning unit 30 (S24). In the drying prevention process, a chemical solution can be sprayed onto the substrate S, thereby preventing the surface of the substrate S from drying out.

[0141] Thus, when the measured surface temperature of the substrate processing container 42 is not within the reference temperature range, the substrate S can be transported into the substrate cleaning unit 30 instead of the substrate drying unit 40, thereby preventing the surface of the substrate S from drying.

[0142] During this process, the internal temperature of the substrate processing container 42 can be adjusted (S25).

[0143] As one example, during the process of adjusting the internal temperature of the substrate processing container 42, the first hand 51 can remain inside the substrate processing container 42. As another example, during the process of adjusting the internal temperature of the substrate processing container 42, the first hand 51 can move from the substrate processing container 42 to the outside and be located outside the substrate processing container 42.

[0144] If the process of adjusting the internal temperature of the substrate processing container 42 is completed, the process of measuring the surface temperature of the substrate processing container 42 using the surface temperature measuring sensor 60 installed in the first hand part 51 can be repeated (S26).

[0145] At this time, when the surface temperature of the substrate processing container 42 is less than or exceeds the preset temperature range, the process of adjusting the internal temperature of the substrate processing container 42 can be repeated (S25).

[0146] On the other hand, when the surface temperature of the substrate processing container 42 is within a preset temperature range, the third hand 53 of the handling robot 50 moves toward the substrate cleaning unit 30 in the drying prevention process and transports the substrate S out of the substrate cleaning unit 30 (S28).

[0147] Furthermore, the third hand 53 of the handling robot 50 moves into the substrate processing container 42 of the substrate drying unit 40 and transports the substrate S into the substrate processing container 42.

[0148] Therefore, processing can be performed on substrate S within a temperature range appropriately set for substrate S.

[0149] Below, refer to Figure 10 To illustrate yet another example of the substrate processing method according to an embodiment of the present invention.

[0150] First, the third hand 53 of the handling robot 50 moves toward the substrate cleaning unit 30 in the first process chamber 23 and transports the substrate S, which has been processed by the substrate cleaning unit 30, out of the substrate cleaning unit 30 (S30).

[0151] Furthermore, the first hand 51 of the handling robot 50 moves toward the substrate processing container 42 of the multiple substrate drying unit 40, and measures the surface temperature of the multiple substrate processing container 42 by the surface temperature measuring sensor 60 (S31).

[0152] Furthermore, the control unit determines whether there is a substrate drying unit 40 (S32) whose measured temperature is within the reference temperature range.

[0153] When a substrate drying unit 40 with a measured temperature within the reference temperature range is present, the third hand 53 of the handling robot 50 moves preferentially toward the substrate processing container 42 of the substrate drying unit 40 with a measured temperature within the reference temperature range and transports the substrate S toward the substrate processing container 42 (S33).

[0154] When there is no substrate drying unit 40 whose measured temperature is within the reference temperature range, a process (S34) can be performed to adjust the internal temperature of the substrate processing container 42 of the multiple substrate drying units 40.

[0155] If the process of adjusting the internal temperature of the substrate processing container 42 is completed, the process of measuring the surface temperature of the multiple substrate processing containers 42 using the surface temperature measuring sensor 60 installed in the first hand part 51 is repeated (S31).

[0156] At this time, when the surface temperature of the substrate processing container 42 is less than or exceeds the preset temperature range, the process of adjusting the internal temperature of the substrate processing container 42 can be repeated.

[0157] On the other hand, when the surface temperature of the substrate processing container 42 is within a preset temperature range, the third hand 53 of the handling robot 50 moves into the substrate processing container 42 and transports the substrate S into the substrate processing container 42.

[0158] Therefore, processing can be performed on substrate S within a temperature range appropriately set for substrate S.

[0159] On the other hand, refer to Figures 8 to 10The substrate processing methods described in the embodiments of the present invention can be combined with each other.

[0160] Based on the substrate processing apparatus and substrate processing method according to embodiments of the present invention, a surface temperature measuring sensor 60 configured to measure the surface temperature of the substrate processing container 42 is provided on the handling robot 50. Therefore, the surface temperature measuring sensor 60 can accurately measure the surface temperature of the substrate processing container 42. This prevents the substrate S from being transported into the substrate processing container 42 when the surface temperature of the substrate processing container 42 exceeds a predetermined temperature range. Therefore, it prevents non-uniform distribution of supercritical fluid that may occur when the substrate S is transported into the substrate processing container 42 when the surface temperature of the substrate processing container 42 exceeds the predetermined temperature range, thereby preventing defects in the substrate S that may occur due to non-uniform distribution of supercritical fluid.

[0161] Preferred embodiments of the invention have been illustrated, but the scope of the invention is not limited to such specific embodiments, and appropriate modifications may be made within the scope set forth in the claims.

Claims

1. A substrate processing apparatus characterized by comprising: comprises: a substrate cleaning unit configured to clean a substrate; a substrate drying unit configured to dry the substrate, including a substrate processing container that houses the substrate; a transfer robot including: a first hand that has a surface temperature measurement sensor that measures a surface temperature of the substrate processing container and transports a substrate out of the substrate drying unit; a second hand that transports a substrate into the substrate cleaning unit; and a third hand that transports a substrate out of the substrate cleaning unit and into the substrate drying unit; and a control unit that determines whether to transport a substrate transported out of the substrate cleaning unit by the third hand into the substrate drying unit based on the surface temperature of the substrate processing container measured when the first hand moves to the substrate drying unit.

2. The substrate processing apparatus according to claim 1, wherein the first hand includes: a substrate placement member on which the substrate is placed; and a guide member configured to protrude from the substrate placement member to support a side surface of the substrate, the surface temperature measurement sensor is installed in a housing groove recessed in the guide member.

3. The substrate processing apparatus according to claim 1, wherein the substrate processing container includes a first body and a second body that join to each other to form the substrate processing space, the first body has a first corresponding surface that faces the second body, the second body has a second corresponding surface that faces the first corresponding surface of the first body, the surface temperature measurement sensor is configured to measure a surface temperature of the first corresponding surface or the second corresponding surface.

4. The substrate processing apparatus according to claim 3, wherein a plurality of surface temperature measurement sensors are provided, a plurality of heating modules are arranged in a circumferential direction with a center of the second corresponding surface as a reference in the second body, the plurality of surface temperature measurement sensors are configured to measure a surface temperature of the second corresponding surface from a plurality of measurement points arranged on a same circle as a circle in which the plurality of heating modules are arranged or a circle having a same center.

5. The substrate processing apparatus according to claim 1, wherein the surface temperature measurement sensor is a non-contact temperature sensor.

6. A substrate processing method characterized by, A substrate processing method using a substrate processing apparatus including a substrate cleaning unit configured to clean a substrate, a substrate drying unit configured to dry the substrate, and a transfer robot having a plurality of hands that transport a substrate, the substrate processing method includes: (a) a step of measuring a surface temperature of a substrate processing container by moving a hand that transports a substrate out of the substrate drying unit among the plurality of hands of the transfer robot to the substrate drying unit; (b) a step of determining whether the surface temperature of the substrate processing container exceeds a reference temperature range set in advance; and (c) a step of transporting a substrate into the substrate drying unit by the hand that transports a substrate out of the substrate drying unit among the plurality of hands of the transfer robot when the surface temperature of the substrate processing container is determined to be within the reference temperature range. (c) when the surface temperature of the substrate processing container is within the preset reference temperature range, the hand of the plurality of hands of the transfer robot that carries the substrate between the substrate cleaning unit and the substrate drying unit transfers the substrate from the substrate cleaning unit to the substrate drying unit.

7. The substrate processing method according to claim 6, wherein the substrate processing method further comprises: (d) when the surface temperature of the substrate processing container is not within the preset reference temperature range, adjusting the temperature of the substrate processing container.

8. The substrate processing method according to claim 6, wherein the substrate processing method further comprises: before the (a) step, detecting whether a preceding substrate is present in the substrate processing container, when the preceding substrate is present in the substrate processing container, the (a) step is performed while the preceding substrate is being carried out of the substrate processing container.

9. The substrate processing method according to claim 6, wherein the substrate processing apparatus includes a plurality of substrate processing containers, the (a) step and the (b) step are performed for the plurality of substrate processing containers, the (c) step preferentially carries the substrate into the substrate processing container whose surface temperature is within the preset reference temperature range among the plurality of substrate processing containers.

10. The substrate processing method according to claim 9, wherein the substrate processing method further comprises: adjusting the temperature of the substrate processing container whose surface temperature is not within the preset reference temperature range among the plurality of substrate processing containers.

11. The substrate processing method according to any one of claims 6 to 10, wherein the substrate processing apparatus includes a transfer robot including a first hand, a second hand, and a third hand, carrying the substrate out of the substrate drying unit is performed by the first hand, carrying the substrate into the substrate cleaning unit is performed by the second hand, carrying the substrate out of the substrate cleaning unit and carrying the substrate into the substrate drying unit are performed by the third hand, measuring the surface temperature of the substrate processing container is performed by a surface temperature measurement sensor provided to the first hand.

12. A substrate processing method, characterized by, A substrate processing apparatus includes a substrate cleaning unit configured to clean a substrate, a substrate drying unit configured to dry the substrate and including a substrate processing container that accommodates the substrate, and a transfer robot including a first hand that carries the substrate out of the substrate drying unit and has a surface temperature measurement sensor that measures a surface temperature of the substrate processing container, a second hand that carries the substrate into the substrate cleaning unit, and a third hand that carries the substrate out of the substrate cleaning unit and into the substrate drying unit. The substrate processing method includes: (a) a step in which the third hand of the transfer robot carries the substrate out of the substrate cleaning unit, (b) a step in which the second hand of the transfer robot carries the substrate into the substrate cleaning unit, and (c) a step in which the first hand of the transfer robot carries the substrate out of the substrate drying unit. (b) moving the first hand of the transfer robot toward the substrate drying unit to measure the surface temperature of the substrate processing container; (c) determining whether the surface temperature of the substrate processing container is outside a predetermined reference temperature range; (d) when the surface temperature of the substrate processing container is within the predetermined reference temperature range, the third hand transfers the substrate to the substrate drying unit; and (e) when the surface temperature of the substrate processing container is outside the predetermined reference temperature range, the third hand transfers the substrate to the substrate cleaning unit.

13. The substrate processing method according to claim 12, wherein the substrate processing method further comprises: (f) when the surface temperature of the substrate processing container is outside the predetermined reference temperature range, adjusting the temperature of the substrate processing container.

14. The substrate processing method according to claim 12, wherein the substrate processing method further comprises: before the (a) step or the (b) step, a step of detecting whether a preceding substrate is present in the substrate processing container, when the preceding substrate is present in the substrate processing container, the first hand performs the (b) step while transferring the preceding substrate from the substrate processing container.

15. The substrate processing method according to claim 12, wherein in the (e) step, a chemical liquid is supplied to the substrate transferred to the substrate cleaning unit to prevent drying of the surface of the substrate.

16. The substrate processing method according to claim 12, wherein the substrate processing apparatus includes a plurality of substrate processing containers, the (b) step and the (c) step are performed for the plurality of substrate processing containers, the (d) step preferentially transfers the substrate to the substrate processing containers whose surface temperature is within the predetermined reference temperature range.

17. The substrate processing method according to claim 16, wherein the substrate processing method further comprises: a step of adjusting the temperature of the substrate processing containers whose surface temperature is outside the predetermined reference temperature range. ​ ​ ​ ​ ​

Images