Substrate storage and alignment device in a substrate bonding apparatus for bonding substrates and substrates

Abstract

Embodiments of the present invention provide a substrate storage and alignment device in a substrate bonding apparatus that can efficiently utilize space. A substrate storage and alignment device in a substrate bonding apparatus that bonds substrates and substrates according to embodiments of the present invention includes a front end buffer including a front end storage slot for temporarily storing a substrate and a front end opening portion through which a transport robot that transports the substrate from the front end storage slot is movable, and a front end aligner formed to be stacked above the front end buffer to align the substrate by rotating the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate storage and alignment device in a substrate bonding apparatus for bonding substrates and substrates. BACKGROUND

[0002] A semiconductor (or display) manufacturing process, as a process for manufacturing semiconductor elements on a substrate (e.g., a wafer), includes, for example, exposure, evaporation, etching, ion implantation, cleaning, etc. As a method for connecting between chips formed by a semiconductor manufacturing process, a TSV (Through Silicon Via) process is introduced, in which chips are electrically connected by through electrodes.

[0003] On the other hand, for the TSV process, W2W (Wafer-to-Wafer) bonding can be performed in which substrates and substrates are bonded to each other, and a substrate bonding apparatus for bonding substrates and substrates can be provided. A device layout structure for efficiently performing the transport and processing of substrates in such a substrate bonding apparatus is being studied. SUMMARY

[0004] Therefore, an embodiment of the present application provides a substrate storage and alignment device in a substrate bonding apparatus that can efficiently make the most of space.

[0005] The problems to be solved by the present application are not limited to the above-mentioned, and other problems to be solved not mentioned can be clearly understood by those skilled in the art from the following description.

[0006] A substrate storage and alignment device in a substrate bonding apparatus for bonding substrates and substrates according to an embodiment of the present application includes: a front end buffer including a front end storage slot for temporarily storing a substrate and a front end opening portion through which a transport robot for transporting the substrate from the front end storage slot can move; and a front end aligner formed to be stacked above the front end buffer to align the substrate by rotating the substrate.

[0007] According to an embodiment of the present application, the front end storage slot includes a front end buffer support member provided in a vertical direction as a plurality and for supporting the substrate below.

[0008] According to an embodiment of the present application, the front end opening portion can include: a first front end opening portion for the entry and exit of an EFEM (Equipment Front End Module) transport robot for transporting the substrate from an EFEM that loads the substrate in the substrate bonding apparatus to the front end storage slot; and a second front end opening portion for the entry and exit of a main transport robot for transporting the substrate from the front end storage slot to the front end aligner.

[0009] According to an embodiment of the present application, the front end aligner includes a front end alignment checking section checking an alignment state of the substrate, and a front end rotation driving section rotationally driving the substrate according to the alignment state of the substrate.

[0010] According to an embodiment of the present application, the front end alignment checking section can check whether a notch portion of the substrate is aligned in a specific direction before plasma processing of the substrate, and the front end rotation driving section can rotate the substrate so that the notch portion of the substrate is directed to the specific direction.

[0011] According to an embodiment of the present application, the front end alignment checking section can check whether a bonded substrate is aligned in a specific direction before bonding inspection of the bonded substrate, and the front end rotation driving section can rotate the substrate so that the bonded substrate is aligned in the specific direction.

[0012] According to another embodiment of the present application, a substrate storage and alignment apparatus for bonding substrates and a substrate bonding apparatus including the same includes a back end buffer including a back end storage slot for temporarily storing a substrate and a back end opening portion through which a transport robot for transporting the substrate from the back end storage slot is movable, a back end aligner formed to be stacked above the back end buffer to align the substrate by rotating the substrate, and a cooling member formed to be stacked below the back end buffer to cool a bonded substrate.

[0013] According to an embodiment of the present application, the back end storage slot can include back end buffer support members provided in a vertical direction as a plurality of members to support the substrate below.

[0014] According to an embodiment of the present application, the back end opening portion can include a first back end opening portion through which a main transport robot for transporting a substrate to be plasma-processed in the substrate bonding apparatus is movable in and out of the back end storage slot, and a second back end opening portion formed to be opposite to the first back end opening portion and through which a flip transport robot for flipping the substrate to be plasma-processed from the back end storage slot is movable in and out.

[0015] According to an embodiment of the present application, the back end aligner includes a back end alignment checking section checking an alignment state of the substrate, and a back end rotation driving section rotationally driving the substrate according to the alignment state of the substrate.

[0016] According to an embodiment of the present application, the back end alignment checking section can check whether the substrate is aligned in a specific direction before bonding processing of the substrate, and the back end rotation driving section can rotate the substrate so that the substrate is directed to the specific direction.

[0017] According to an embodiment of the present application, the substrate storage and alignment apparatus can further include a thickness checking unit positioned above the back end aligner to measure a thickness of the substrate.

[0018] A substrate bonding apparatus for bonding a substrate and a substrate according to an embodiment of the present application includes an EFEM (Equipment Front End Module) to load the substrate, an EFEM transfer robot to transfer the substrate from the EFEM, a front end substrate storage and alignment module to temporarily store the substrate transferred by the EFEM transfer robot and to align the substrate for subsequent processing, a main transfer robot to transfer the substrate from the front end substrate storage and alignment module, a plasma processing module to perform plasma processing on the substrate, a back end substrate storage and alignment module to temporarily store the substrate subjected to the plasma processing and to align the substrate for subsequent processing, a flip transfer robot to transfer the substrate temporarily stored in the back end substrate storage and alignment module after flipping, a bonding module to perform bonding between the substrate and the substrate, and a bonding inspection module to inspect a bonding state between the substrate and the substrate. The front end substrate storage and alignment module can include a front end buffer including a front end storage slot to temporarily store the substrate and a front end opening portion through which the EFEM transfer robot and the main transfer robot can move from the front end storage slot, and a front end aligner formed to be stacked above the front end buffer to align the substrate by rotating the substrate.

[0019] According to an embodiment of the present application, the front end opening portion can include a first front end opening portion for the EFEM transfer robot to enter and exit, and a second front end opening portion for the main transfer robot to enter and exit.

[0020] According to an embodiment of the present application, the main transfer robot can support the substrate through the second front end opening portion and transfer the substrate to the front end aligner, the front end aligner aligning a notch portion of the substrate in a specific direction for the plasma processing, and the main transfer robot transferring the aligned substrate to the plasma processing module.

[0021] According to an embodiment of the present application, the back-end substrate storage and alignment module can include a back-end buffer including a back-end storage slot for temporarily storing a substrate and a back-end opening portion through which the main transport robot and the flip transport robot can move from the back-end storage slot, a back-end aligner formed to be stacked above the back-end buffer to align the substrate by rotating the substrate, a cooling member formed to be stacked below the back-end buffer to cool the bonded substrate, and a thickness inspection portion located above the back-end aligner to measure the thickness of the substrate.

[0022] According to an embodiment of the present application, the main transport robot can transport the substrate supported from the plasma processing module to the back-end aligner, the back-end aligner can align the substrate in a direction corresponding to the bonding module, the flip transport robot can transport the flipped substrate to the bonding module, and the bonded substrate can be transported to the cooling member.

[0023] According to an embodiment of the present application, the main transport robot can transport the bonded substrate from the cooling member to the front-end aligner, and the front-end aligner can align the bonded substrate in a specific direction.

[0024] According to an embodiment of the present application, the main transport robot can transport the bonded substrate aligned by the front-end aligner to a bonding inspection module, and the bonding inspection module can perform bonding inspection on the bonded substrate.

[0025] According to an embodiment of the present application, the main transport robot can transport the bonded substrate on which the bonding inspection is performed to the front-end buffer, the EFEM transport robot can transport the bonded substrate stored in the front-end buffer to the EFEM, and the EFEM can discharge the bonded substrate.

[0026] According to an embodiment of the present application, a buffer for temporarily storing a substrate and an aligner for aligning a substrate are stacked in a vertical direction, thereby effectively utilizing the space in a substrate bonding apparatus.

[0027] The effects of the present application are not limited to the above-mentioned, and other effects not mentioned can be clearly understood by those skilled in the art from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 The structure of a substrate bonding apparatus and a substrate transport path are shown.

[0029] Figure 2 and Figure 3 The configuration of a substrate storage and alignment apparatus according to an embodiment of the present application is shown.

[0030] Figure 4 A configuration of a substrate storage and alignment device according to another embodiment of the present application is shown.

[0031] Figure 5 and Figure 6 A substrate transport path for bonding between substrates is shown. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily practice the present application. The present application can be implemented in various different ways, and is not limited to the embodiments described herein.

[0033] For the sake of clarity, portions unrelated to the description are omitted, and the same reference numerals are applied throughout the entire description to the same or similar constituent elements.

[0034] In addition, in the plurality of embodiments, the same reference numerals are used to only describe representative embodiments with respect to the constituent elements having the same structure, and only the structure different from the representative embodiment is described in the remaining other embodiments.

[0035] In the entire description, when it is stated that a certain part is "connected" (or "coupled") to another part, it is not only the case of "directly connected" (or "directly coupled"), but also the case of "indirectly connected" (or "indirectly coupled") with other parts interposed therebetween. In addition, when it is stated that a certain part "includes" a certain constituent element, it means that other constituent elements can be further included, rather than excluding other constituent elements, unless otherwise specifically noted.

[0036] Unless otherwise defined differently, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those skilled in the art to which the present application pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art, and should not be ideally or excessively interpreted unless otherwise clearly defined in the present application.

[0037] Figure 1 A configuration of a substrate bonding apparatus and a substrate transport path are shown. The substrate bonding apparatus according to an embodiment of the present application is an apparatus that receives a substrate (a first substrate) and a substrate (a second substrate), and outputs a bonded substrate by bonding the first substrate and the second substrate to each other.

[0038] A substrate bonding apparatus for bonding substrates according to an embodiment of the present application includes an EFEM (Equipment Front End Module) 10 loading substrates, an EFEM transfer robot 20 transferring the substrates from the EFEM 10, a front-end substrate storage and alignment module 30 temporarily storing the substrates transferred by the EFEM transfer robot 20 and aligning the substrates for subsequent processing, a main transfer robot 40 transferring the substrates from the front-end substrate storage and alignment module 30, a plasma processing module 50 performing plasma processing on the substrates, a back-end substrate storage and alignment module 60 temporarily storing the substrates processed by the plasma processing and aligning the substrates for subsequent processing, a flip transfer robot 70 flipping and transferring the substrates temporarily stored in the back-end substrate storage and alignment module 60, a bonding module 80 performing bonding between the substrates, and a bonding inspection module 90 inspecting a bonding state between the substrates. In addition, the substrate bonding apparatus can further include a hydrophilization processing module 45 for processing a surface of a substrate before plasma processing to be hydrophilic.

[0039] On the other hand, the front-end substrate storage and alignment module 30 and the back-end substrate storage and alignment module 60 need to properly perform the storage and alignment functions while using a minimum amount of space. Therefore, an embodiment of the present application provides a substrate storage and alignment device capable of effectively using space by minimizing the use area.

[0040] Figure 2 and Figure 3 A configuration of a substrate storage and alignment device according to an embodiment of the present application is shown. Figure 2 and Figure 3 The substrate storage and alignment device of Figure 1 the front-end substrate storage and alignment module 30. Figure 2 is a perspective view of a substrate storage and alignment device, Figure 3 corresponds to a substrate storage and alignment device viewed from above.

[0041] The substrate storage and alignment device (the front-end substrate storage and alignment module 30) includes a front-end buffer 310 including a front-end storage slot 311 for temporarily storing a substrate and front-end opening portions 312A, 312B in which a transfer robot 20, 30 is movable to transfer the substrate from the front-end storage slot 311, and a front-end aligner 320 formed to be stacked above the front-end buffer 310 to align the substrate by rotating the substrate. As Figure 2 and Figure 3As shown, the front end buffer 310 for temporarily storing the substrate and the front end aligner 320 for performing alignment for processing the substrate are arranged in a stacked state with each other. Thus, an apparatus for storing and aligning the substrate with a minimum space can be provided inside the substrate bonding apparatus.

[0042] The front end storage slot 311 includes front end buffer support members provided in a vertical direction as a plurality and for supporting the substrate from below. As shown, the front end buffer support members can include support pins for supporting the substrate at 3 points and support shafts on which the support pins are provided. In addition, a substrate detection portion for checking whether the substrate is seated on the front end buffer support members can be provided to the front end buffer support members. Figure 2

[0043] The front end opening portions 312A, 312B include a first front end opening portion 312A for the EFEM transport robot 20 that transports the substrate from the EFEM 10 in which the substrate is loaded in the substrate bonding apparatus to the front end storage slot 311 to go in and out, and a second front end opening portion 312B for the main transport robot 40 that transports the substrate from the front end storage slot to the front end aligner 320 to go in and out. That is, the EFEM transport robot 20 can receive the substrate from the EFEM 10 and transfer the substrate to the front end storage slot through the first front end opening portion 312A, and the main transport robot 40 can receive the substrate from the front end storage slot through the second front end opening portion 312B and transport the substrate to the front end aligner 320.

[0044] The front end aligner 320 includes a front end alignment check portion 321 that checks an alignment state of the substrate and a front end rotation driving portion 322 that rotationally drives the substrate according to the alignment state of the substrate.

[0045] The main transport robot 40 can receive the substrate from the front end storage slot and transport it to the front end aligner 320 in order to align a notch portion of the substrate in a desired direction before transporting the substrate to the plasma processing module 50. According to an embodiment, the front end alignment check portion 321 checks whether the notch portion of the substrate is aligned in a specific direction before plasma processing of the substrate, and the front end rotation driving portion 322 rotates the substrate so that the notch portion of the substrate faces the specific direction. If the alignment of the substrate is completed, the main transport robot 40 can receive the substrate from the front end aligner 320 and transport it to the plasma processing module 50 (or the hydrophilization processing module 45).

[0046] ​In addition, the main transport robot 40 can receive the bonded substrate from the rear-end substrate storage and alignment module 60 and transport it toward the front-end aligner 320. The front-end alignment inspection unit 321 can inspect whether the bonded substrate is aligned in a specific direction before inspecting the bonding of the bonded substrate, and the front-end rotation driving unit 322 can rotate the substrate so that the bonded substrate is aligned in a specific form. If the alignment of the substrate is completed, the main transport robot 40 can receive the bonded substrate and transport it toward the solder inspection module 90.

[0047] Figure 4 A configuration of a substrate storage and alignment apparatus according to another embodiment of the present application is shown. Figure 4 The substrate storage and alignment apparatus can correspond to Figure 1 the rear-end substrate storage and alignment module 60. Figure 4 A rear-end substrate storage and alignment module 60 is shown as viewed from the side.

[0048] The substrate storage and alignment apparatus (the rear-end substrate storage and alignment module 60) includes a rear-end buffer 610 including a rear-end storage slot 611 for temporarily storing a substrate and a rear-end opening 612 through which a transport robot 40, 70 for transporting the substrate from the rear-end storage slot 611 is movable, a rear-end aligner 620 formed to be stacked above the rear-end buffer 610 to align the substrate by rotating the substrate, and a cooling member 630 formed to be stacked below the rear-end buffer 610 to cool the bonded substrate. As shown in Figure 4 The rear-end aligner 620, the rear-end buffer 610, and the cooling member 630 are configured to be stacked with each other. Thus, the apparatus for storing and aligning the substrate with a minimum space can be provided inside the substrate bonding apparatus.

[0049] The rear-end storage slot 611 includes a rear-end buffer support member provided in a vertical direction as a plurality of members and supporting the substrate below. As shown in Figure 4 The rear-end buffer support member can include a support pin for supporting the substrate at three points and a support shaft on which the support pin is disposed. In addition, a substrate detection unit for inspecting whether the substrate is seated on the rear-end buffer support member can be provided to the rear-end buffer support member.

[0050] The rear-end opening 612 includes a first rear-end opening 612A through which the main transport robot 40 for transporting the substrate to be plasma-processed in the substrate bonding apparatus is in and out of the rear-end storage slot 611, and a second rear-end opening 612B formed to be opposite to the first rear-end opening 612A and through which the flip transport robot 70 for flipping the substrate to be plasma-processed from the rear-end storage slot 611 is in and out.

[0051] The back end aligner 620 includes a back end alignment checking section 621 that checks the alignment state of the substrate, and a back end rotation driving section 622 that rotationally drives the substrate according to the alignment state of the substrate. The back end alignment checking section 621 can check whether the substrate is aligned in a specific direction before the bonding process of the substrate, and the back end rotation driving section 622 can rotate the substrate so that the substrate faces the specific direction. The substrate on which the surface treatment is performed by the hydrophilization processing module 45 and the plasma processing module 50 is transported to the back end substrate storage and alignment module 60 by the main transport robot 40, and is aligned and stored in the back end substrate storage and alignment module 60.

[0052] In addition, the substrate storage and alignment apparatus (the back end substrate storage and alignment module 60) can further include a thickness checking section 640 that measures the thickness of the substrate above the back end aligner 620. The thickness checking section 640 can measure the thickness of the substrate when the substrate is aligned, and the thickness information of the substrate can be used for the degree of pressure and positioning when the substrate is bonded. For example, the main transport robot 40 transports the substrate on which the plasma treatment is performed to the back end aligner 620, and the substrate is subjected to the alignment and the thickness checking. When the alignment and the thickness checking are completed, the main transport robot 40 transports the substrate to the back end storage slot 611 through the first back end opening section 612A, and the flip transport robot 70 receives the substrate through the second back end opening section 612B and transports the substrate to the bonding module 80.

[0053] When the substrates are bonded, one substrate can be positioned above and the other substrate can be positioned below, and the bonding can be performed by pressing the substrate above downward. In this case, the substrate to be positioned above can be disposed in an inverted state, and the flip transport robot 70 can flip the substrate to be positioned above and position the substrate on the upper chuck.

[0054] Figure 5 and Figure 6 A substrate transport path for bonding between substrates is shown. Figure 5 A path in which each substrate is transported before the substrates are bonded is shown, Figure 6 A path in which the substrates bonded to each other by the bonding process are transported is shown.

[0055] As previously described, the substrate bonding apparatus includes: an EFEM 10, which loads a substrate; an EFEM transfer robot 20, which transfers the substrate from the EFEM 10; a front-end substrate storage and alignment module 30, which temporarily stores the substrate transferred by the EFEM transfer robot 20 and aligns the substrate for subsequent processing; a main transfer robot 40, which transfers the substrate from the front-end substrate storage and alignment module 30; a plasma processing module 50, which performs plasma processing on the substrate; a back-end substrate storage and alignment module 60, which temporarily stores the substrate subjected to the plasma processing and aligns the substrate for subsequent processing; a flip transfer robot 70, which transfers the substrate temporarily stored in the back-end substrate storage and alignment module 60 after flipping the substrate; a bonding module 80, which performs bonding between the substrate and a substrate; and a bonding inspection module 90, which inspects a bonding state between the substrate and the substrate. In addition, the substrate bonding apparatus can further include a hydrophilization processing module 45 for processing a surface of the substrate before plasma processing to be hydrophilic.

[0056] Referring to Figure 5 , the substrate loaded into the EFEM 10 is transferred to the front-end substrate storage and alignment module 30 by the EFEM transfer robot 20. As described with reference to Figure 2 and Figure 3 , the front-end substrate storage and alignment module 30 includes: a front-end buffer 310 including front-end storage slots 311 for temporarily storing the substrate and front-end opening portions 312A, 312B through which the EFEM transfer robot 20 and the main transfer robot 40 can move from the front-end storage slots 311; and a front-end aligner 320 formed to be stacked above the front-end buffer 310 to align the substrate by rotating the substrate.

[0057] The front-end opening portions 312A, 312B include: a first front-end opening portion 312A for entry and exit of the EFEM transfer robot 20; and a second front-end opening portion 312B for entry and exit of the main transfer robot 40.

[0058] It can be that the main transfer robot 40 supports the substrate through the second front-end opening portion 312B and transfers the substrate to the front-end aligner 320, the front-end aligner 320 aligns a cut portion of the substrate in a specific direction for plasma processing, and the main transfer robot 40 transfers the aligned substrate to the hydrophilization processing module 45 and the plasma processing module 50.

[0059] The substrates that have undergone hydrophilization and plasma treatment are transported to the rear substrate storage and alignment module 60 via the main transport robot 40. The rear substrate storage and alignment module 60 includes: a rear buffer 610, including a rear storage slot 611 for temporary storage of the substrate and a rear opening through which the main transport robot 40 and the flip transport robot 70 can move to transport the substrate from the rear storage slot 611; a rear calibrator 620, which is stacked on top of the rear buffer 610 to align the substrates by rotating the substrates; a cooling unit 630, which is stacked below the rear buffer 610 to cool the bonded substrates; and a thickness inspection unit 640, located above the rear calibrator 620 to measure the thickness of the substrates.

[0060] Alternatively, the main conveying robot 40 can transport the substrate from the plasma processing module 50 to the rear calibrator 620, the rear calibrator 620 can align the substrate with the welding module 80, the flipping conveying robot 70 can flip the substrate and transport it to the welding module 80, and the substrate to be joined can be transported to the cooling component 630.

[0061] After that, as Figure 6 As shown, the substrates to be bonded are aligned by the front-end calibrator 320 of the front-end substrate storage and alignment module 30 and then transported to the soldering inspection module 90 for bonding inspection. In addition, the substrates that have completed the bonding inspection are stored in the front-end buffer 310 of the front-end substrate storage and alignment module 30, and then transported to the EFEM 10 by the EFEM transport robot 20.

[0062] That is, the main conveying robot 40 conveys the substrate to be joined, which is aligned by the front-end calibrator 320, to the welding inspection module 90, and the welding inspection module 90 performs a joining inspection on the substrate to be joined.

[0063] Subsequently, the main transport robot 40 may transport the joined substrates, after the joining inspection, to the front buffer 310, and the EFEM transport robot 20 may transport the joined substrates held in the front buffer 310 to the EFEM 10, whereby the EFEM 10 discharges the joined substrates. The joined substrates may also be discharged by a transport vehicle (e.g., OHT) located outside the substrate joining equipment or by an operator. Alternatively, another substrate may be fed in by an OHT or an operator.

[0064] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0065] Therefore, the inventive concept should not be limited to the described embodiments, but all its equivalents and modifications, which are within the scope of the appended claims, belong to the inventive concept.

Claims

1. A substrate bonding apparatus for bonding substrates, comprising: an EFEM loading the substrates; an EFEM transfer robot transferring the substrates from the EFEM; a front-end substrate storage and alignment module temporarily storing and aligning the substrates transferred by the EFEM transfer robot for subsequent processing; a main transfer robot transferring the substrates from the front-end substrate storage and alignment module; a plasma processing module performing plasma processing on the substrates; a back-end substrate storage and alignment module temporarily storing and aligning the substrates processed by plasma; a flip transfer robot picking up and transferring the substrates temporarily stored in the back-end substrate storage and alignment module after flipping the substrates; a bonding module receiving the substrates from the flip transfer robot and performing bonding between the substrates to form bonded substrates; and a bonding inspection module inspecting the bonding between the substrates, the front-end substrate storage and alignment module comprising: a front-end buffer including front-end storage slots for temporarily storing the substrates and a front-end opening through which the EFEM transfer robot and the main transfer robot can move from the front-end storage slots; and a front-end aligner formed above the front-end buffer to align the substrates by rotating the substrates, the back-end substrate storage and alignment module comprising: a back-end buffer including back-end storage slots for temporarily storing the substrates and a back-end opening through which the main transfer robot and the flip transfer robot can move from the back-end storage slots; and a back-end aligner formed above the back-end buffer to align the substrates by rotating the substrates. 2.The substrate bonding apparatus according to claim 1, wherein the front-end opening comprises: a first front-end opening for the EFEM transfer robot; and a second front-end opening for the main transfer robot. 3.The substrate bonding apparatus according to claim 2, wherein the main transfer robot supports the substrates and transfers the substrates to the front-end aligner through the second front-end opening, the front-end aligner aligns a notch of the substrates in a specific direction for the plasma processing, the main transfer robot transfers the aligned substrates to the plasma processing module. 4.The substrate bonding apparatus according to claim 1, wherein the back-end substrate storage and alignment module comprises: a cooling member formed below the back-end buffer for cooling the bonded substrates; and a thickness inspection portion located above the back-end aligner to measure a thickness of the substrates. 5.The substrate bonding apparatus according to claim 4, wherein the main transfer robot supports the substrates from the plasma processing module and transfers the substrates to the back-end aligner, the back-end aligner aligns the substrates for the bonding module, ​ The flipping transport robot transports the flipped substrate toward the welding module, and transports the bonded substrate toward the cooling member.

6. The substrate bonding apparatus according to claim 5, wherein the main transport robot transports the bonded substrate from the cooling member toward the front end aligner, the front end aligner aligns the bonded substrate in a specific direction.

7. The substrate bonding apparatus according to claim 6, wherein the main transport robot transports the bonded substrate aligned by the front end aligner toward a welding inspection module, the welding inspection module performs bonding inspection on the bonded substrate.

8. The substrate bonding apparatus according to claim 7, wherein the main transport robot transports the bonded substrate after the bonding inspection is performed toward the front end buffer, the EFEM transport robot transports the bonded substrate stored in the front end buffer toward the EFEM, the EFEM discharges the bonded substrate.

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