mobile terminals

Abstract

The present application relates to the technical field of electronic products, and in particular to a mobile terminal. The mobile terminal includes a mainboard, a heat dissipation layer, a first bracket, and a housing that are stacked in sequence; wherein a heating element is provided on the mainboard, and the orthographic projection of the heating element on the housing is located within the orthographic projection of the first bracket on the housing; the heat dissipation layer is arranged in contact with the heating element, and the orthographic projection area of the heat dissipation layer on the housing is larger than the orthographic projection area of the first bracket on the housing. In the mobile terminal provided by the present application, the area of the heat dissipation layer is larger than the area of the first bracket. When the heat generated by the heating element is transferred to the heat dissipation layer, the heat dissipation layer disperses the heat, effectively reducing the heat transferred to the first bracket, thereby reducing the temperature at the corresponding position of the housing and the heating element, avoiding the problem of excessively high local temperature of the housing, and improving the user experience.

Description

[0001] This application is a divisional application. The application number of the original application is 202010328027.9, and the original application date is April 23, 2020. The entire content of the original application is incorporated into this application by reference. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a mobile terminal. Background Art

[0003] As a new generation of portable communication devices, mobile terminals have gained widespread popularity due to their small size and diverse functions. With the rapid development of science and technology and the continuous improvement of people's pursuit of living standards, the functions of mobile terminals have been continuously enriched and improved, and the hardware performance has become increasingly higher.

[0004] As hardware performance improves, the signal transmission capability of antennas and the pixels of cameras are also constantly improving. As a result, during the use of mobile terminals, antennas and cameras will generate more heat, causing the temperature of the terminal casing corresponding to the antennas and cameras to be too high, thereby reducing the user experience. Summary of the Invention

[0005] The present application provides a mobile terminal to avoid the problem of excessively high local temperature of a housing.

[0006] In a first aspect, a mobile terminal is provided, comprising a mainboard, a heat dissipation layer, a first bracket and a housing stacked in sequence; wherein:

[0007] A heating element is provided on the mainboard, and the orthographic projection of the heating element on the housing is located within the orthographic projection of the first bracket on the housing;

[0008] The heat dissipation layer is arranged in contact with the heating element, and an orthographic projection area of the heat dissipation layer on the housing is larger than an orthographic projection area of the first bracket on the housing.

[0009] In the mobile terminal provided in the present application, a heating component is provided on the mainboard, a heat dissipation layer is provided on the side of the heating component facing away from the mainboard, and is arranged in contact with the heating component, a first bracket and a housing are sequentially provided on the side of the heat dissipation layer facing away from the mainboard, and the orthographic projection area of the heat dissipation layer on the housing is larger than the orthographic projection area of the first bracket on the housing. During operation of the mobile terminal, the heating component generates heat. Since the heat dissipation layer is arranged in contact with the heating component, the heat generated by the heating component is quickly transferred to the heat dissipation layer by heat conduction. The heat is conducted along the plane where the heat dissipation layer is located in the heat dissipation layer and then transferred to the housing. At the same time, the heat in the heat dissipation layer can also be transferred to the first bracket, and then transferred by the first bracket to the position in the housing corresponding to the first bracket. Since the orthographic projection area of the heat dissipation layer on the housing is larger than the orthographic projection area of the first bracket on the housing, that is, the area of the heat dissipation layer is larger than the area of the first bracket, when the heat generated by the heating element is transferred to the heat dissipation layer, the heat dissipation layer disperses the heat, effectively reducing the heat transferred to the first bracket, thereby reducing the temperature at the position corresponding to the housing and the heating element, avoiding the problem of excessively high local temperature of the housing, and improving the user experience.

[0010] In a possible implementation, at least one of a surface of the first bracket facing the heat dissipation layer and a surface facing away from the heat dissipation layer is provided with a first groove.

[0011] By providing the first groove, the heat transfer efficiency between the heating element and the portion of the housing corresponding to the heating element is reduced.

[0012] In a possible implementation, a plurality of first grooves are provided on a surface of the first bracket facing the heat dissipation layer, and every two adjacent first grooves are provided in parallel; and / or,

[0013] A plurality of first grooves are provided on a surface of the first bracket facing away from the heat dissipation layer, and every two adjacent first grooves are arranged in parallel.

[0014] By providing a plurality of first grooves, the heat transfer efficiency between the heating element and the portion of the housing corresponding to the heating element is further reduced.

[0015] In a possible implementation, the first groove includes a first sub-groove and a second sub-groove;

[0016] The first sub-groove is provided on a surface of the first bracket facing the heat dissipation layer, and the second sub-groove is provided on a surface of the first bracket facing away from the heat dissipation layer. The first sub-groove and the second sub-groove are staggered.

[0017] In a possible implementation, the first groove includes a first sub-groove and a second sub-groove;

[0018] The first sub-groove is provided on the surface of the first bracket facing the heat dissipation layer, and the second sub-groove is provided on the surface of the first bracket away from the heat dissipation layer. The orthographic projection of the first sub-groove and the orthographic projection of the second sub-groove on the shell are cross-arranged.

[0019] By setting the first sub-groove, the heat transfer efficiency between the heating element and the first bracket is reduced. By setting the second sub-groove, the heat transfer efficiency between the first bracket and the outer shell is reduced, thereby effectively reducing the temperature at the part of the outer shell corresponding to the heating element and improving the user experience.

[0020] In a possible implementation, a heat insulating material is provided in the first groove.

[0021] By arranging the heat insulating material in the first groove, the heat transfer efficiency between the heating element and the portion of the housing corresponding to the heating element is further reduced, thereby reducing the temperature of the portion of the housing corresponding to the heating element.

[0022] In a possible implementation, a second bracket is further included. The second bracket is arranged on a side of the heat dissipation layer away from the mainboard, and the second bracket is connected to the heat dissipation layer. The orthographic projection of the second bracket on the housing overlaps with the orthographic projection of the heat dissipation layer on the housing.

[0023] By providing the second bracket, the efficiency of heat transfer from the heat dissipation layer to the housing is improved, and the heat dispersion effect of the heat dissipation layer is effectively improved.

[0024] In a possible implementation, at least one of a surface of the second bracket facing the heat dissipation layer and a surface facing away from the heat dissipation layer is provided with a second groove, and a heat conductive material is provided in the second groove.

[0025] By arranging thermal conductive material in both the third sub-groove and the fourth sub-groove, the efficiency of heat transfer from the heat dissipation layer to the shell is effectively improved, and the heat at the heat dissipation layer corresponding to the heating element is further dispersed, thereby reducing the temperature of the corresponding part of the shell corresponding to the heating element.

[0026] In a possible implementation, the thermally conductive material includes at least one of thermally conductive gel, copper foil, and graphite.

[0027] In a possible implementation, the second bracket and the thermally conductive material are integrally formed by injection molding.

[0028] In a possible implementation, the first bracket and the second bracket are an integrated structure.

[0029] In a possible implementation, the heat dissipation layer includes graphite and / or silica gel.

[0030] In the present application, the heat dissipation layer is fitted with the heating element, and the orthographic projection area of the heat dissipation layer on the shell is larger than the orthographic projection area of the first bracket on the shell, so that the heat transferred from the heating element to the heat dissipation layer can not only be transferred in the direction of the heat dissipation layer pointing to the first bracket, but also be transferred along the plane where the heat dissipation layer is located, thereby achieving heat dispersion and effectively reducing the heat transferred to the first bracket, thereby reducing the temperature at the corresponding position of the shell and the heating element, avoiding the problem of excessively high local temperature of the shell, and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A partial exploded view of a mobile terminal provided in an embodiment of the present application;

[0032] Figure 2 A side view of a mobile terminal provided in an embodiment of the present application;

[0033] Figure 3 A schematic structural diagram of a first bracket provided in an embodiment of the present application;

[0034] Figure 4 A schematic structural diagram of another first bracket provided in an embodiment of the present application;

[0035] Figure 5 A schematic structural diagram of another first bracket provided in an embodiment of the present application;

[0036] Figure 6 Schematic diagram of direct connection between the heat dissipation layer and the housing provided in an embodiment of the present application;

[0037] Figure 7 A partial exploded view of another mobile terminal provided in an embodiment of the present application;

[0038] Figure 8 A partial exploded view of another mobile terminal provided in an embodiment of the present application;

[0039] Figure 9 A schematic structural diagram of a second bracket provided in an embodiment of the present application;

[0040] Figure 10 A schematic structural diagram of another second bracket provided in an embodiment of the present application;

[0041] Figure 11 A schematic structural diagram of another second bracket provided in an embodiment of the present application;

[0042] Figure 12 This is a schematic structural diagram of the housing provided in an embodiment of the present application.

[0043] Reference numerals:

[0044] 1-mainboard; 2-heating element; 3-heat dissipation layer; 4-first bracket; 41-first groove; 411-first sub-groove; 412-second sub-groove; 5-housing; 6-second bracket; 61-second groove; 611-third sub-groove; 612-fourth sub-groove. DETAILED DESCRIPTION

[0045] The terms used in the following embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0046] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0047] It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described based on the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also be indirectly connected to the other element "on" or "under" through an intermediate element.

[0048] In order to improve and enrich the functions of mobile terminals, the performance of hardware in mobile terminals in the prior art is getting higher and higher. The higher the performance of the hardware, the more serious the heat generation. For example, the antenna and camera have a more serious heat generation situation.

[0049] As the signal transmission capability of the antenna and the pixel of the camera continue to improve, the antenna and the camera will generate more heat during the use of the mobile terminal, causing the temperature of the terminal housing 5 corresponding to the antenna and the camera to be too high, thereby reducing the user experience.

[0050] In view of this, an embodiment of the present application provides a mobile terminal that can solve the above technical problems.

[0051] Figure 1 A partial exploded view of a mobile terminal provided in an embodiment of the present application is shown. Figure 2 This is a side view of the mobile terminal provided in the embodiment of the present application. Figures 1 to 2As shown, in an embodiment of the present application, a mobile terminal is provided, which includes a mainboard 1, a heat dissipation layer 3, a first bracket 4 and a shell 5 which are stacked in sequence; wherein, a heating element 2 is provided on the mainboard 1, and the orthographic projection of the heating element 2 on the shell 5 is located within the orthographic projection of the first bracket 4 on the shell 5; the heat dissipation layer 3 is arranged in contact with the heating element 2, and the area of the orthographic projection of the heat dissipation layer 3 on the shell 5 is larger than the area of the orthographic projection of the first bracket 4 on the shell 5.

[0052] In the mobile terminal provided in the embodiment of the present application, a heating component is provided on the mainboard 1, and the heat dissipation layer 3 is provided on the side of the heating component away from the mainboard 1 and is arranged in contact with the heating component. The side of the heat dissipation layer 3 away from the mainboard 1 is provided with a first bracket 4 and a shell 5 in sequence, and the positive projection area of the heat dissipation layer 3 on the shell 5 is larger than the positive projection area of the first bracket 4 on the shell 5. During the operation of the mobile terminal, the heating component generates heat. Since the heat dissipation layer 3 is arranged in contact with the heating component, the heat generated by the heating component is quickly conducted to the heat dissipation layer 3 by heat conduction. The heat is conducted in the heat dissipation layer 3 along the plane where the heat dissipation layer 3 is located, wherein part of the heat is transferred in a direction away from the first bracket 4 and transferred to other parts of the mobile terminal (such as the shell 5) by heat radiation or heat conduction to achieve heat dissipation; at the same time, the heat in the heat dissipation layer 3 can also be transferred to the first bracket 4, and then transferred by the first bracket 4 to the position in the shell 5 corresponding to the first bracket 4. Since the orthographic projection area of the heat dissipation layer 3 on the housing 5 is larger than the orthographic projection area of the first bracket 4 on the housing 5, that is, the area of the heat dissipation layer 3 is larger than the area of the first bracket 4, when the heat generated by the heating element 2 is transferred to the heat dissipation layer 3, the heat dissipation layer 3 disperses the heat, effectively reducing the amount of heat transferred to the first bracket 4, thereby reducing the temperature at the corresponding position of the housing 5 and the heating element 2, avoiding the problem of excessively high local temperature of the housing 5, and improving the user experience.

[0053] In addition, in the embodiment of the present application, by arranging the heat dissipation layer 3, the first bracket 4 and the outer shell 5 in sequence on the side of the heat-generating component away from the mainboard 1, the structure is simple, which is conducive to realizing the lightweight and thinness of the mobile terminal; and the heat dissipation layer 3, the first bracket 4 and the outer shell 5 are arranged in different levels, which effectively avoids the interference problem between the heat dissipation layer 3, the first bracket 4 and the outer shell 5, and reduces the difficulty of preparing the mobile terminal.

[0054] The heating element 2 is an antenna or a camera module, or may be other heating devices.

[0055] The heat dissipation layer 3 is made of a thermally conductive material. In the embodiment of the present application, the heat dissipation layer 3 may include graphite and / or silica gel.

[0056] The heat dissipation layer 3 is made of a heat-conducting material, which is beneficial for heat conduction within the heat dissipation layer 3 , thereby improving the heat dispersion effect.

[0057] Figure 3 A schematic structural diagram of a first bracket provided in an embodiment of the present application; Figure 4 This is a schematic diagram of the structure of another first bracket provided in an embodiment of the present application. Figures 3 and 4 As shown, in some embodiments, at least one of the surface of the first bracket 4 facing the heat dissipation layer 3 and the surface facing away from the heat dissipation layer 3 is provided with a first groove 41. In addition, the surface of the first bracket 4 facing the heat dissipation layer 3 is provided with multiple first grooves 41, and each adjacent two first grooves 41 are arranged in parallel, and / or the surface of the first bracket 4 facing away from the heat dissipation layer 3 is provided with multiple first grooves 41, and each adjacent two first grooves 41 are arranged in parallel. Figure 3 As shown, a plurality of first grooves 41 are evenly arranged on one surface of the first bracket 4, and every two adjacent first grooves are arranged in parallel. Figure 4 As shown, first grooves 41 are provided on two opposite surfaces of the first bracket 4 , a plurality of first grooves 41 are evenly provided on each surface, and every two adjacent first grooves 41 are provided in parallel.

[0058] In the above-mentioned first bracket 4, a first groove 41 is provided on the side of the first bracket 4 facing the heat dissipation layer 3. At the position of the heat dissipation layer 3 corresponding to the first groove 41, the heat transfer method between the heat dissipation layer 3 and the first bracket 4 is thermal radiation; a first groove 41 is provided on the side of the first bracket 4 facing away from the heat dissipation layer 3. At the position of the housing 5 corresponding to the first groove 41, the heat transfer method between the first bracket 4 and the housing 5 is thermal radiation. Since the heat transfer efficiency of thermal radiation is lower than the heat transfer efficiency of thermal conduction, the provision of the first groove 41 reduces the heat transfer efficiency between the heating element 2 and the portion of the housing 5 corresponding to the heating element 2. The heat in the heat dissipation layer 3 is transferred in the heat dissipation layer 3 and transferred to the portion of the housing 5 that does not correspond to the heating element 2 by thermal conduction, thereby improving the heat dispersion efficiency of the heat dissipation layer 3 and effectively reducing the heat at the portion of the housing 5 corresponding to the heating element 2.

[0059] The first groove 41 includes a first sub-groove 411 and a second sub-groove 412. The first sub-groove 411 and the second sub-groove 412 include the following Figure 4 and Figure 5 Two setting methods.

[0060] like Figure 4 As shown, in some embodiments, a plurality of first sub-grooves 411 are provided on the surface of the first bracket 4 facing the heat dissipation layer 3, and each adjacent first sub-grooves 411 are arranged in parallel, and a plurality of second sub-grooves 412 are provided on the surface of the first bracket 4 facing away from the heat dissipation layer 3, and each adjacent second sub-grooves 412 are arranged in parallel, and the first sub-grooves 411 and the second sub-grooves 412 are staggered.

[0061] The first sub-groove 411 is provided on the side of the first bracket 4 facing the heat dissipation layer 3, and the second sub-groove 412 is provided on the edge of the first bracket 4 facing away from the heat dissipation layer 3. By providing the first sub-groove 411, the heat transfer method between the heat dissipation layer 3 and the first bracket 4 at the position corresponding to the first sub-groove 411 is thermal radiation; by providing the second sub-groove 412, the heat transfer method between the first bracket 4 and the housing 5 at the position corresponding to the second sub-groove 412 is thermal radiation. Because the heat transfer efficiency of thermal radiation is lower than that of thermal conduction, the provision of the first sub-groove 411 reduces the heat transfer efficiency between the heating element 2 and the first bracket 4, and the provision of the second sub-groove 412 reduces the heat transfer efficiency between the first bracket 4 and the housing 5, thereby effectively reducing the temperature at the portion of the housing 5 corresponding to the heating element 2 and improving the user experience.

[0062] In addition, the above-mentioned first sub-groove 411 and second sub-groove 412 are staggered. It can be understood that, in the orthographic projection of the first bracket 4 on the shell 5, an orthographic projection of the second sub-groove 412 is projected between every two adjacent orthographic projections of the first sub-groove 411, and the orthographic projection of the first sub-groove 411 does not overlap with the orthographic projection of the second sub-groove 412, thereby ensuring the strength of the first bracket 4 and preventing the first bracket 4 from deformation.

[0063] Figure 5 This is a structural diagram of another first bracket 4 provided in the embodiment of the present application. Figure 5 As shown, in other embodiments, a first sub-groove 411 is provided on the surface of the first bracket 4 facing the heat dissipation layer 3, and a second sub-groove 412 is provided on the surface of the first bracket 4 facing away from the heat dissipation layer 3, and the orthographic projection of the first sub-groove 411 on the outer shell 5 and the orthographic projection of the second sub-groove 412 on the outer shell 5 are cross-arranged.

[0064] The first sub-grooves 411 and the second sub-grooves 412 are arranged crosswise to ensure the strength of the first bracket 4 and prevent deformation of the first bracket 4. In the embodiment of the present application, the orthographic projection of the first sub-grooves 411 on the housing 5 and the orthographic projection of the second sub-grooves 412 on the housing 5 are perpendicular, thereby facilitating the preparation of the first bracket 4 and ensuring equal strength at all locations of the first bracket 4.

[0065] In some embodiments, a heat insulating material is disposed in the first groove 41 .

[0066] In order to further reduce the heat transfer efficiency between the heating element 2 and the portion of the housing 5 corresponding to the heating element 2, a heat insulating material can be provided in the first groove 41. The heat transfer speed through the heat insulating material is significantly reduced, thereby reducing the temperature at the portion of the housing 5 corresponding to the heating element 2.

[0067] The above-mentioned heat insulation material can be selected from one or more of glass fiber, asbestos and rock wool.

[0068] In some embodiments, a portion of the heat dissipation layer 3 away from the first bracket 4 is directly or indirectly connected to the housing 5. The heat dissipation layer 3 may be a flat structure or an irregular structure. Therefore, the heat dissipation layer 3, except for the portion in contact with the first bracket 4, may be partially or completely connected to the housing 5. The connection methods include the following: Figure 6 Direct connection shown and Figure 7 Indirect connection method shown.

[0069] Figure 6 This is a schematic diagram of the direct connection between the heat dissipation layer and the housing provided in the embodiment of the present application. When the heat dissipation layer is a flexible structure or a non-flat structure, the heat dissipation layer can be directly connected to the housing to achieve heat dissipation. Specifically, Figure 6 As shown, when the heat dissipation layer has a flexible structure, it can bend toward the housing, allowing area B of the heat dissipation layer to directly mate with area A of the housing, thereby directly connecting the heat dissipation layer 3 to the housing 5. Alternatively, when the heat dissipation layer has a non-flat structure, after assembly, area B of the heat dissipation layer can directly mate with area A of the housing. After heat is transferred to area B of the heat dissipation layer, it is directly conducted through area B to area A, achieving heat transfer from the heat dissipation layer to the housing.

[0070] Figure 7 This is a partial exploded view of another mobile terminal provided in an embodiment of the present application. Figure 7 As shown, a second bracket 6 is provided on the side of the heat dissipation layer 3 facing away from the mainboard 1, and the second bracket 6 is connected to the heat dissipation layer 3, thereby achieving an indirect connection between the heat dissipation layer 3 and the housing 5. The orthographic projection of the second bracket 6 on the housing 5 overlaps with the orthographic projection of the heat dissipation layer 3 on the housing 5. For example, the orthographic projection of the second bracket 6 on the housing 5 can be completely within the orthographic projection of the heat dissipation layer 3 on the housing 5, or the orthographic projection of the second bracket 6 on the housing 5 can be partially within the orthographic projection of the heat dissipation layer 3 on the housing 5.

[0071] By providing the second bracket 6 and connecting the second bracket 6 to the heat dissipation layer 3, an indirect connection between the heat dissipation layer 3 and the housing 5 is achieved. The heat dissipation layer 3 can transfer heat to the second bracket 6 by heat conduction, and then the second bracket 6 transfers the heat to the housing 5, thereby achieving heat dissipation.

[0072] like Figure 7 As shown, the second bracket 6 can adopt a plate-like structure. The material of the second bracket 6 includes a thermally conductive material with good thermal conductivity. The heat dissipation layer 3 is connected to the second bracket 6, and the heat in the heat dissipation layer 3 can be transferred to the shell 5 through the second bracket 6.

[0073] By providing the second bracket 6, the efficiency of heat transfer from the heat dissipation layer 3 to the shell 5 is improved. At the same time, by providing the first groove 41 on the first bracket 4, the heat transfer efficiency between the first bracket 4 and the shell 5 is reduced, thereby effectively improving the heat dispersion effect of the heat dissipation layer 3.

[0074] Figure 12 This is a schematic diagram of the structure of the housing 5 provided in the embodiment of the present application. Figure 12 As shown, Figure 12 For example, the area represented by the dashed box C in the figure corresponds to the first bracket 4, and the area represented by the dashed box D corresponds to the second bracket 6. Heat generated by the heating element 2 is primarily dissipated through areas C and D, reducing the temperature in area C and improving the user experience. Furthermore, area D can be selected from an area with low user touch frequency, ensuring a better user experience when dissipating heat through area D.

[0075] Furthermore, the heat generated by the heating element 2 is mainly dissipated through the C and D areas, which increases the heat dissipation area, improves the heat dissipation efficiency, and effectively prevents the high temperature in the mobile terminal from damaging the service life of the electronic components, thereby protecting the electronic components.

[0076] Figure 8 This is a partial exploded view of another mobile terminal provided in an embodiment of the present application. Figure 9 This is a schematic diagram of the structure of a second bracket provided in an embodiment of the present application. Figures 8 to 9 As shown, in order to further improve the heat dissipation effect of the heat dissipation layer 3, in some embodiments, at least one of the surfaces of the second bracket 6 facing the heat dissipation layer 3 and the surface facing away from the heat dissipation layer 3 is provided with a second groove 61, as shown in FIG. Figure 8 As shown, in the second bracket 6, two opposite surfaces are provided with second grooves 61; Figure 9 As shown, a second groove 61 is provided on one surface of the second bracket 6 , and a heat conducting material is provided in the second groove 61 .

[0077] A second groove 61 is provided on at least one surface of the second bracket 6, and the second groove 61 is filled with a heat-conducting material, so as to further improve the heat transfer efficiency of the second bracket 6 and reduce the heat transferred from the first bracket 4 to the housing 5, thereby further reducing the temperature of the portion of the housing 5 corresponding to the heating element 2, thereby improving the user experience.

[0078] When setting the second bracket 6, an area with a low user touch frequency is selected in the above-mentioned housing 5, and the position of the second bracket 6 is set corresponding to the area with a low touch frequency to reduce the impact of heat dissipation of the heating element 2 on user use.

[0079] Figure 10This is a schematic diagram of the structure of another second bracket provided in an embodiment of the present application. Figures 8 to 10 As shown, in some embodiments, the second groove 61 includes a third sub-groove 611 and a fourth sub-groove 612, the third sub-groove 611 is provided on the side of the second bracket 6 facing the heat dissipation layer 3, and the fourth sub-groove 612 is provided on the side of the second bracket 6 facing away from the heat dissipation layer 3, and thermal conductive material is provided in both the third sub-groove 611 and the fourth sub-groove 612.

[0080] The third sub-groove 611 and the fourth sub-groove can be arranged in a staggered manner or in a cross-arranged manner. Figure 10 As shown, the third sub-groove 611 and the fourth sub-groove 612 are staggered. Figure 11 As shown, the orthographic projection of the third sub-groove 611 on the housing 5 and the orthographic projection of the fourth sub-groove 612 on the housing 5 are arranged crosswise, thereby realizing the cross arrangement of the third sub-groove 611 and the fourth sub-groove 612.

[0081] The placement of thermally conductive material in the third sub-groove 611 can improve the efficiency of heat transfer from the heat dissipation layer 3 to the second bracket 6. The placement of thermally conductive material in the fourth sub-groove 612 can also improve the efficiency of heat transfer from the second bracket 6 to the housing 5. Therefore, by placing thermally conductive material in both the third sub-groove 611 and the fourth sub-groove 612, the efficiency of heat transfer from the heat dissipation layer 3 to the housing 5 is effectively improved, further dissipating the heat at the heat dissipation layer 3 corresponding to the heating element 2, thereby reducing the temperature of the portion of the housing 5 corresponding to the heating element 2.

[0082] The thermal conductive material may be made of one or more of thermal conductive gel, copper foil, and graphite.

[0083] The second bracket 6 and the thermal conductive material may be integrally formed by a two-color injection molding process, or the thermal conductive material may be filled into the second groove 61 after the second bracket 6 is manufactured.

[0084] In some embodiments, the first bracket 4 and the second bracket 6 are an integrated structure.

[0085] Since the first bracket 4 and the second bracket 6 are both brackets for supporting and protecting electronic components in the mobile terminal, the first bracket 4 and the second bracket 6 are an integrated structure or a split structure, which can be selected according to the specific structure in the mobile terminal and is not limited here.

[0086] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A mobile terminal, characterized in that: It includes a mainboard, a heat dissipation layer, a first bracket and a shell stacked in sequence, wherein the first bracket is a structure independent of the shell and the heat dissipation layer; wherein, A heating element is provided on the main board; The heat dissipation layer is disposed in contact with the heating element, and an orthographic projection of the heat dissipation layer on the housing is larger than an orthographic projection of the first bracket on the housing. The orthographic projection of the first bracket on the housing overlaps with the orthographic projection of the heat dissipation layer on the housing, and heat in the heat dissipation layer can be transferred to the first bracket, and then transferred from the first bracket to a position on the housing corresponding to the first bracket. The mobile terminal further includes a second bracket, the second bracket being a separate structure from the first bracket, the second bracket being arranged on a side of the heat dissipation layer facing away from the mainboard, at least one of a surface of the second bracket facing the heat dissipation layer and a surface facing away from the heat dissipation layer being provided with a second groove, a heat conductive material being provided in the second groove, so that at least part of the heat in the heat dissipation layer can be transferred to the second bracket, and then transferred by the second bracket to a position on the housing that does not correspond to the heating element; The first surface of the first bracket faces the heat dissipation layer, and the second surface of the first bracket faces away from the heat dissipation layer. The first surface of the first bracket is provided with a first sub-groove, and the second surface of the first bracket is provided with a second sub-groove. The first sub-groove and the second sub-groove are staggered, and the orthographic projection of the first sub-groove on the outer shell and the orthographic projection of the second sub-groove on the outer shell do not overlap or are cross-arranged.

2. The mobile terminal according to claim 1, wherein: The first surface of the first bracket is provided with a plurality of first sub-grooves, and every two adjacent first sub-grooves are arranged in parallel; and / or, The second surface of the first bracket is provided with a plurality of first sub-grooves, and every two adjacent first sub-grooves are arranged in parallel.

3. The mobile terminal according to claim 1 or 2, characterized in that: A heat insulating material is provided in the first sub-groove.

4. The mobile terminal according to claim 1, wherein: The second bracket is arranged in contact with the heat dissipation layer, and the orthographic projection of the second bracket on the housing overlaps with the orthographic projection of the heat dissipation layer on the housing.

5. The mobile terminal according to claim 1, wherein: The thermally conductive material includes at least one of thermally conductive gel, copper foil, and graphite. The mobile terminal according to claim 5, wherein: The second bracket and the heat conductive material are integrally formed by injection molding.

7. The mobile terminal according to any one of claims 1-2, 4-6, characterized in that: The heat dissipation layer includes graphite and / or silica gel.

8. The mobile terminal according to any one of claims 1-2, 4-6, characterized in that: A portion of the heat dissipation layer away from the first bracket is directly or indirectly connected to the housing.

9. The mobile terminal according to any one of claims 1-2, 4-6, characterized in that: The orthographic projection of the heating element on the housing is located within the orthographic projection of the first bracket on the housing.

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