Time-of-flight module and assembly method thereof, shooting component and terminal

Abstract

The present application discloses a time-of-flight module and its assembly method, shooting component and terminal. The time-of-flight module includes an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket. Wherein: the heat sink includes a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected to the circuit board; the bracket is installed on the second side of the circuit board, and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is installed on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module. The second optical component is installed on the bracket and corresponds to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

Description

Technical Field

[0001] The present application relates to the field of ranging technology, and more specifically, to a time-of-flight module and an assembly method thereof, a shooting component and a terminal. Background Art

[0002] Time of flight (ToF) technology is a technology that measures the time difference between the transmitted signal and the signal reflected by the object, and calculates the distance between the object and the sensor through this time difference. When the time of flight module is working normally, the heat generated by the light source will be transferred to the circuit board, causing the temperature of the circuit board to rise, which may cause the circuit board to malfunction. Summary of the invention

[0003] Embodiments of the present application provide a time-of-flight module, a terminal, and an assembly method of the time-of-flight module.

[0004] The time-of-flight module of the embodiment of the present application includes an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket. Wherein: the heat sink includes a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected to the circuit board; the bracket is installed on the second side of the circuit board, and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is installed on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module. The second optical component is installed on the bracket and corresponds to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0005] The terminal of the embodiment of the present application includes a housing and a time-of-flight module, and the housing is combined with the time-of-flight module. The time-of-flight module includes an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket. Wherein: the heat sink includes a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected to the circuit board; the bracket is installed on the second side of the circuit board, and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is installed on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module. The second optical component is installed on the bracket and corresponds to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0006] The shooting assembly of the embodiment of the present application includes a two-dimensional camera module and a time-of-flight module. The two-dimensional camera module is used to obtain a two-dimensional image, and the time-of-flight module is used to obtain a depth information image. The distance between the center of the sensor of the time-of-flight module and the center of the two-dimensional camera module is less than a second preset distance. The time-of-flight module includes an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket. Among them: the heat sink includes a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected to the circuit board; the bracket is installed on the second side of the circuit board, and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is installed on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module. The second optical component is installed on the bracket and corresponds to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0007] The terminal of the embodiment of the present application includes a housing and a shooting component, and the housing is combined with the shooting component. The shooting component includes a two-dimensional camera module and a time-of-flight module. The two-dimensional camera module is used to obtain a two-dimensional image, and the time-of-flight module is used to obtain a depth information image. The distance between the center of the sensor of the time-of-flight module and the center of the two-dimensional camera module is less than a second preset distance. The time-of-flight module includes an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket. Among them: the heat sink includes a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected to the circuit board; the bracket is installed on the second side of the circuit board, and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board. The first optical component is installed on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module. The second optical component is installed on the bracket and corresponds to the sensor, and is used to receive at least part of the light reflected back by the object and guide the light to the sensor.

[0008] The assembly method of the time-of-flight module of the present application includes: providing a heat sink, the heat sink including a first area and a second area, combining the first side of a circuit board with the first area; arranging a light source in the second area of ​​the heat sink, and installing the sensor to the circuit board, and making the light source and the sensor electrically connected to the circuit board; installing the first optical component on an integrated bracket; installing the bracket with the first optical component installed on the second side of the circuit board, the bracket and the circuit board forming a receiving cavity, so that the sensor and the light source are accommodated in the receiving cavity, and the first optical component corresponds to the light source; and installing the second optical component on the bracket, so that the second optical component corresponds to the sensor.

[0009] The assembly method of the time-of-flight module of the present application includes: providing a heat sink, the heat sink including a first area and a second area, combining the first side of a circuit board with the first area; arranging a light source in the second area of ​​the heat sink, and installing the sensor to the circuit board, and making the light source and the sensor electrically connected to the circuit board; fixing an integrated bracket to the second side of the circuit board, the bracket and the circuit board forming a receiving cavity, so that the sensor and the light source are accommodated in the receiving cavity; and fixing the first optical component and the second optical component on the bracket, so that the first optical component corresponds to the light source, and the second optical component corresponds to the sensor.

[0010] The time-of-flight module and its assembly method, shooting component and terminal in the embodiments of the present application, by setting the light source in the second area of ​​the heat sink in the time-of-flight module, and combining the first area of ​​the heat sink with the circuit board, can avoid the heat generated by the light source from being transferred to the circuit board, compared to directly setting the light source on the circuit board, thereby avoiding the situation where the circuit board cannot work normally due to the increase in temperature of the circuit board.

[0011] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 is a cross-sectional schematic diagram of a three-dimensional structure of a time-of-flight module in certain embodiments of the present application;

[0014] Figure 2 is an exploded schematic diagram of a three-dimensional structure of a time-of-flight module in certain embodiments of the present application;

[0015] Figure 3 and Figure 4 is a schematic diagram of the relationship between the baseline and the moving distance of the light spot in the sensor in a time-of-flight module in certain embodiments of the present application;

[0016] Figure 5 is a schematic diagram of the structure of a time-of-flight module in certain embodiments of the present application;

[0017] Figure 6 Schematic diagram of the structure of the existing time-of-flight module and the time-of-flight module in some embodiments of the present application

[0018] Figure 7 It is a structural schematic diagram of a partial structure of a time-of-flight module in the prior art and a partial structure of a time-of-flight module in certain embodiments of the present application;

[0019] Figure 8 and Fig. 9 is a schematic diagram of the structure of a time-of-flight module in certain embodiments of the present application;

[0020] Fig.10 and Fig.11 is a schematic diagram of electrical connection between a light source and a circuit board in a time-of-flight module in certain embodiments of the present application;

[0021] Fig.12 is a structural schematic diagram of a portion of a time-of-flight module in certain embodiments of the present application;

[0022] Figures 13 to 15 is a schematic structural diagram of a first optical component in a time-of-flight module in certain embodiments of the present application;

[0023] Fig.16 It is a schematic diagram of the relationship between the back focal size of the optical component in the light emission module and the length, width and height of the light emission module;

[0024] Fig.17 and Fig.18 is a schematic structural diagram of a second optical component in a time-of-flight module in certain embodiments of the present application;

[0025] Fig.19 and Fig. 20 is a schematic diagram of the structure of a terminal in some embodiments of the present application;

[0026] Figure 21 to Figure 24 It is a flowchart of the assembly method of the time-of-flight module in certain embodiments of the present application. DETAILED DESCRIPTION

[0027] The following further describes the embodiments of the present application in conjunction with the accompanying drawings. The same or similar reference numerals in the accompanying drawings represent the same or similar elements or elements with the same or similar functions.

[0028] In addition, the embodiments of the present application described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present application and should not be construed as limiting the present application.

[0029] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] See also Figure 1 and Figure 2, the embodiment of the present application provides a time-of-flight module 100. The time-of-flight module 100 includes an integrated bracket 50, a heat sink 20, a circuit board 10, a light source 30, a sensor 40, and a first optical component 60 and a second optical component 70 fixed to the bracket 50. Among them, the heat sink 20 includes a first area 201 and a second area 202, the first side 11 of the circuit board 10 is combined with the first area 201, the light source 30 is arranged in the second area 202, and the light source 30 and the sensor 40 are both electrically connected to the circuit board 10. The bracket 50 is installed on the second side 12 of the circuit board 10, and forms a receiving cavity 501 with the circuit board 10 that can accommodate the light source 30 and the sensor 40, and the second side 12 of the circuit board 10 is opposite to the first side 11 of the circuit board 10. The first optical component 60 is installed on the bracket 50 and corresponds to the light source 30, and is used to guide the light emitted by the light source 30 to the outside of the time-of-flight module 100. The second optical assembly 70 is mounted on the bracket 50 and corresponds to the sensor 40 , and is configured to receive at least a portion of the light reflected by the object and guide the light to the sensor 40 .

[0031] The time-of-flight module 100 in the present application sets the light source 30 in the second zone 202 of the heat sink 20, and the first zone 201 of the heat sink 20 is combined with the circuit board 10. Compared with directly setting the light source 30 on the circuit board 10, it can prevent the heat generated by the light source 30 from being transferred to the circuit board 10, thereby avoiding the situation where the circuit board 10 cannot work normally due to the increase in temperature of the circuit board 10.

[0032] The following is a further description with reference to the accompanying drawings.

[0033] See also Figure 1 and Figure 2 The time-of-flight module 100 includes an integrated bracket 50, a heat sink 20, a circuit board 10, a light source 30, a sensor 40, a first optical component 60, and a second optical component 70. The sensor 40 and the light source 30 disposed on the heat sink 20 are electrically connected to the circuit board 10. The light source 30 is used to emit light outward, the first optical component 60 is disposed on the bracket 50 and is correspondingly disposed with the light source 30 to guide the light emitted by the light source 30 to the outside of the time-of-flight module 100; the second optical component 70 is disposed on the bracket 50 and is correspondingly disposed with the sensor 40 to guide the received light reflected by the object to the sensor 40, and the sensor 40 is used to convert the received light into an electrical signal.

[0034] Specifically, the heat sink 20 includes a first area 201 and a second area 202, the circuit board 10 includes a first side 11 and a second side 12 opposite to each other, and the first area 201 of the heat sink 20 is combined with the first side 11 of the circuit board 10. The light source 30 is disposed in the second area 202 of the heat sink 20, and the heat sink 20 is used to dissipate the heat from the light source 30. Since the heat sink 20 can dissipate the heat from the light source 30, that is, the heat generated by the light source 30 disposed thereon during normal operation can be dissipated through the heat sink 20, compared to directly dissipating the light source 30 on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10, thereby preventing the circuit board 10 from malfunctioning due to an increase in the temperature of the circuit board 10. It should be noted that in some embodiments, the heat sink 20 can be made of a ceramic material, that is, the heat sink 20 can be a ceramic plate. Of course, the heat sink 20 can also be made of other materials that can dissipate heat, and this is not limited here.

[0035] See also Figure 1 In some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 is less than the first preset distance. This is beneficial for the time-of-flight module 100 to obtain the depth information of the object to be measured. In some embodiments, the first preset distance can be 5mm, that is, the distance between the center of the sensor 40 and the center of the light source 30 is less than 5mm. For example, the distance between the center of the sensor 40 and the center of the light source 30 can be 4mm, 3.5mm, 2mm, etc., which are not limited here. Of course, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 can also be equal to 5mm. Preferably, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 can be 3.6mm. Among them, the distance between the optical centers of the sensor 40 and the light source 30 is defined as the baseline, and the baseline appearing below is also explained in the same way and will not be repeated.

[0036] It should be noted that the time-of-flight module 100 in the embodiment of the present application is based on the time-of-flight technology (ToF) to obtain the depth information of the object to be measured. The time-of-flight technology calculates the depth information of the object to be measured based on the time difference between the emitted light and the light reflected by the object to be measured. Therefore, during the design process, it is hoped that the position of the light spot irradiating the sensor in the receiving end will not change as much as possible, which is conducive to simplifying the design of the sensor readout circuit.

[0037] Since the baseline distance of the time-of-flight module 100 can be shortened in this embodiment, it is helpful for the time-of-flight module 100 to obtain the depth information of the object to be measured. Specifically, when the light is projected and reflected back to the receiving end by the target, it can be received by a certain pixel or several pixels of the sensor 40 in the receiving end. For the same pixel, when the distance between the target object and the module changes, the position where the pixel is finally projected on will also change. For example, Figure 3 As shown, a laser beam is emitted from point D. When the target is at position F, the laser beam is reflected through the focal point C of the receiving end and finally irradiates point A of the image plane (the plane where point AB is located) of the sensor 40; when the target is at position E, it passes through the focal point C of the receiving end lens group (i.e., the second optical component 70) and irradiates point B of the sensor 40. It can be seen that the same laser beam may eventually be received by different areas / pixels of the sensor 40 due to the different distances between the target object and the module. The above-mentioned moving distance difference on the sensor 40 is defined as L disparity The focal length of the receiving end lens (i.e., the second optical component 70) is f, and the distance between the optical center of the light emitting module and the optical center of the light receiving module is the baseline L baseline , the distance between the target object and the laser radar ranging module is L range , the above parameters follow the following relationship: That is, at the receiving end, the focal length f of the lens (i.e., the second optical component 70) and the distance L between the target object and the laser radar ranging module are range Under certain conditions, the moving distance difference L on the sensor 40 disparity With baseline L baseline Assuming the baseline L baseline is 3mm (the typical value of the center distance baseline between the transmitting module and the light receiving module in the existing time-of-flight module 100 is 10mm), the equivalent focal length of the second optical component 70 is 1.63mm, and the size of the pixel in the sensor 40 is 10um. When the distance of the current object to be measured changes, the movement relationship of the light spot on the sensor 40 is as follows: Figure 4 As shown. It can be understood that at the baseline L baseline The influence mainly affects the position of the laser spot for short-distance ranging (such as less than 2m). Since the flight time module 100 calculates the depth information of the object to be measured based on the time difference between the emitted light and the light reflected by the object to be measured, it is hoped that the position of the light spot irradiating the sensor 40 will not change as much as possible during the design process, which is conducive to simplifying the design of the sensor 40 readout circuit. Figure 4It can be seen that when the target distance is 0.3m, when the center distance between the transmitting module and the light receiving module is small (3mm), the spot position only moves about 2.5 pixels, but when the center distance between the transmitting module and the light receiving module is large (10mm), the spot position moves about 8 pixels. Therefore, it can be proved that shortening the baseline distance of the time-of-flight module 100 is beneficial for the time-of-flight module 100 to obtain the depth information of the object to be measured.

[0038] See also Figure 5 In some embodiments, the circuit board 10 is provided with a first through hole 13 penetrating the first side 11 and the second side 12 , and the first through hole 13 corresponds to the second area 202 , so that the light emitted by the light source 30 disposed on the second area 202 can be emitted smoothly.

[0039] For example, see Figure 5 In some embodiments, the light source 30 is disposed in the second area 202 and is received in the first through hole 13. On the one hand, since the light source 30 is disposed in the second area 202 of the heat sink 20, compared with the light source 30 being directly disposed on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10. On the other hand, since other electronic devices 801 are usually disposed around the light source 30, the electronic devices 801 need to be spaced a certain distance from the light source 30 (e.g., Figure 6 As shown on the left side, the light source 30 is arranged in the second area 202 and accommodated in the first through hole 13, which can shorten the lateral distance between the electronic device 801 and the light source 30 and also avoid the electronic device 801 from contacting the light source 30 (as shown on the left side). Figure 6 As shown on the right side). In this way, the baseline distance of the flight time module 100 can be further shortened while ensuring the normal operation of the flight time module 100. On the other hand, it can be understood that Figure 7 As shown in the middle left figure, when the light source 30 is directly disposed on the second side 12 of the circuit board 10, the light emitted by the light source 30 may directly enter the second optical component 70 and then be directed to the sensor 40, thereby introducing unnecessary stray light. Figure 7 As shown in the figure on the right, since the light source 30 is disposed in the second area 202 and accommodated in the first through hole 13 of the circuit board 10, compared with the case where the light source 30 is directly disposed on the second side 12 of the circuit board 10, the circuit board 10 can block at least part of the light emitted by the light source 30 from entering the second optical component 70, thereby reducing the stray light interference in the time-of-flight module 100, which is beneficial to the accuracy of the time-of-flight module 100 in acquiring the depth information of the object to be measured. On the other hand, since the light source 30 is disposed in the second area 202 and accommodated in the first through hole 13, the overall thickness of the light flight time module 100 can be reduced without changing the spacing between the light source 30 and the first optical component 60.

[0040] For another example, see Figure 8 In some embodiments, the second area 202 includes a protrusion 21 protruding toward the circuit board 10, and the protrusion 21 can be exposed from the second side 12 of the circuit board 10 through the first through hole 13, and the light source 30 is arranged on the side of the protrusion 21 away from the circuit board 10. On the one hand, since the light source 30 is arranged in the second area 202 of the heat sink 20, compared with the light source 30 being directly arranged on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10. On the other hand, since the protrusion 21 can be exposed from the second side 12 of the circuit board 10 through the first through hole 13, the light source 30 is arranged on the side of the protrusion 21 away from the circuit board 10, and there is a height difference between the light source 30 and the second side 12 of the circuit board 10 in the light emitting direction of the light source 30. In this way, by arranging the light source 30 on the side of the protrusion 21 away from the circuit board 10, the electronic device 801 and the light source 30 can be prevented from contacting each other while shortening the lateral distance between the electronic device 801 and the light source 30. That is, by disposing the light source 30 on the side of the protrusion 21 away from the circuit board 10 , the baseline distance of the time of flight module 100 can be further shortened while ensuring the normal operation of the time of flight module 100 .

[0041] It should be noted that, in some embodiments, Fig. 9 As shown, in some embodiments, the area of ​​the circuit board 10 is smaller than the area of ​​the heat sink 20. That is, the circuit board 10 cannot completely cover the heat sink 20, and the portion of the heat sink 20 not covered by the circuit board 10 is the second area 202. In this way, the light emitted by the light source 30 disposed on the second area 202 can be emitted smoothly.

[0042] In some embodiments, see Figure 5 The time-of-flight module 100 further includes an electronic device 801, which is disposed on the second side 12 of the circuit board 10. The distance between the electronic device 801 and the light source 30 is less than a preset threshold. In this way, the lateral distance between the electronic device 801 and the light source 30 can be shortened, and the electronic device 801 can be prevented from contacting the light source 30, thereby shortening the baseline distance of the time-of-flight module 100. The electronic device 801 can be a register for controlling the emission time interval of the light source 30; or, the electronic device 801 can also be a digital-to-analog converter or an analog-to-digital converter, etc., which is not limited here.

[0043] See also Figure 5 , the light source 30 is electrically connected to the circuit board 10, and the circuit board 10 can provide power to the light source 30 so that the light source 30 can emit light. Fig.10 and Fig.11In some embodiments, the light source 30 has a first electrode terminal 31 on the side close to the heat sink 20 and a second electrode terminal 32 on the side away from the heat sink 20. The first electrode terminal 31 and the second electrode terminal 32 are opposite electrodes. For example, the first electrode terminal 31 is an anode and the second electrode terminal 32 is a cathode; or, the first electrode terminal 31 is a cathode and the second electrode terminal 32 is an anode, which is not limited here. The first electrode terminal 31 and the second electrode terminal 32 of the light source 30 are respectively electrically connected to the corresponding electrodes in the circuit board 10, so that the light source 30 is electrically connected to the circuit board 10.

[0044] For example, see Fig.10 In some embodiments, the time-of-flight module 100 may further include a conductive member 81 and a first lead 82. One end of the conductive member 81 is located between the light source 30 and the heat sink 20 and is electrically connected to the first electrode terminal 31, and the other end is located between the circuit board 10 and the heat sink 20 and is electrically connected to the circuit board 10, so that the first electrode terminal 31 of the light source 30 can be electrically connected to the circuit board 10 through the conductive member 81. One end of the first lead 82 is electrically connected to the second electrode terminal 32, and the other end is electrically connected to an electrode located on a side of the circuit board 10 away from the heat sink 20, so that the second electrode terminal 32 of the light source 30 can be electrically connected to the circuit board 10 through the first lead 82. In this way, even if the light source 30 is not directly disposed on the circuit board 10, it can be electrically connected to the circuit board 10 through the conductive member 81 and the first lead 82, so that the circuit board 10 can normally provide power to the light source 30.

[0045] For another example, see Fig.11 In some embodiments, the time-of-flight module 100 may further include a conductive member 81, a first lead 82, and a second lead 83. One end of the conductive member 81 is located between the light source 30 and the heat sink 20, and is electrically connected to the first electrode terminal 31, and the other end is located in the second area 202 of the heat sink 20, and is electrically connected to an electrode located on a side of the circuit board 10 away from the heat sink 20 through the second lead 83. In this way, even if the light source 30 is not directly disposed on the circuit board 10, it can be electrically connected to the circuit board 10 through the conductive member 81 and the first lead 82, so that the circuit board 10 can normally provide power to the light source 30.

[0046] See also Fig.10 and Fig.11In some embodiments, in the light emitting direction of the light source 30, the distance between the second electrode terminal 32 and the electrode located on the second side 12 of the circuit board 10 is different from the distance between the two opposite sides of the light source 30. It can be understood that when the side of the light source 30 close to the heat sink 20 is arranged on the same horizontal plane as the second side 12 of the circuit board 10, in the light emitting direction of the light source 30, the distance between the second electrode terminal 32 and the electrode located on the second side 12 of the circuit board 10 must be equal to the distance between the two opposite sides of the light source 30. The second electrode terminal 32 is located at the electrode on the second side 12 of the circuit board 10. If the electrode on the second side 12 of the circuit board 10 is in direct contact with the light source 30 at this time, a short circuit or other faults may easily occur, resulting in the failure of the time of flight module 100 to work properly. Therefore, it is necessary to maintain a certain distance between the electrode on the second side 12 of the circuit board 10 and the light source 30. However, in this embodiment, since the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 in the light emitting direction of the light source 30 is different from the distance between the two opposite sides of the light source 30, the side of the light source 30 close to the heat sink 20 and the second side 12 of the circuit board 10 are not arranged on the same horizontal plane, that is, there is a height difference between the side of the light source 30 close to the heat sink 20 and the second side 12 of the circuit board 10. At this time, even if the lateral distance between the electrode located on the second side 12 of the circuit board 10 and the light source 30 is shortened, the two will not directly contact each other, so that the baseline distance of the time of flight module 100 can be further shortened while ensuring the normal operation of the time of flight module 100.

[0047] It should be noted that, in some embodiments, in the light emitting direction of the light source 30, the distance between the second electrode terminal 32 and the electrode located on the second side 12 of the circuit board 10 is within a preset range. That is, in the light emitting direction of the light source 30, the distance between the side of the light source 30 away from the heat sink 20 and the second side 12 of the circuit board 10 is within a preset range. Gold wire is usually used as the first lead 82, and based on the current process technology, the gold wire has a limit curvature, that is, the curvature of the gold wire cannot be too large. In this embodiment, since the distance between the second electrode terminal 32 and the electrode located on the second side 12 of the circuit board 10 is within a preset range, the curvature of the first lead 82 connecting the second electrode terminal 32 and the electrode located on the second side 12 of the circuit board 10 can be maintained within a certain range, that is, it will not exceed the limit curvature of the gold wire, which is conducive to reducing the difficulty of manufacturing the time of flight module 100.

[0048] See also Figure 1 and Figure 2 In some embodiments, the sensor 40 is mounted on the second side 12 of the circuit board 10 and is electrically connected to the circuit board 10. In particular, see Fig.12In some embodiments, the heat sink 20 further includes a third area 203, and the circuit board 10 further includes a second through hole 14 that penetrates the first side 11 and the second side 12. The sensor 40 is disposed in the third area 203 of the heat sink 20 and is accommodated in the second through hole 14. At this time, the heat sink 20 can also be used to dissipate heat from the sensor 40. Compared with directly arranging the sensor 40 on the circuit board 10, it is possible to prevent the heat generated by the sensor 40 from being transferred to the circuit board 10, thereby increasing the temperature of the circuit board 10 and causing the circuit board 10 to malfunction. It should be noted that even if the sensor 40 is disposed in the heat sink 20, the sensor 40 is still electrically connected to the circuit board 10, and the specific connection method is similar to the method of electrically connecting the light source 30 to the circuit board 10 in the above-mentioned embodiment, which will not be described in detail here.

[0049] See also Figure 1 and Figure 2 The integrated bracket 50 is fixedly mounted on the second side 12 of the circuit board 10, and forms a receiving cavity 501 with the circuit board 10 that can receive the light source 30 and the sensor 40. The first optical component 60 fixed in the bracket 50 can correspond to the light source 30, and the second optical component 70 fixed in the bracket 50 can correspond to the sensor 40. In some embodiments, the number of the receiving cavity 501 can be one, in which case the light source 30 and the sensor 40 are both received in the receiving cavity 501; or, in some embodiments, the number of the receiving cavity 501 can also be two, in which case the light source 30 and the sensor 40 are respectively received in different receiving cavities 501.

[0050] Since in the time-of-flight module 100 of the present application, the first optical component 60 and the second optical component 70 are both fixedly mounted on the integrated bracket 50, compared with the traditional time-of-flight module (the transmitting end and the receiving end each have a separate bracket and a separate circuit board), the structure of the time-of-flight module 100 can be made more compact and the baseline distance of the time-of-flight module 100 can also be shortened.

[0051] Specifically, see Figure 1 and Figure 2 In some embodiments, the integrated bracket 50 includes a first support member 51, a second support member 52, and a connecting assembly 53 connecting the first support member 51 and the second support member 52. The first support member 51 and the second support member 52 are arranged at intervals and are respectively fixed to the second side 12 of the circuit board 10. Among them, the first support member 51 and the second support member 52 can be fixedly connected to the second side 12 of the circuit board 10 through different connection methods. Of course, the first support member 51 and the second support member 52 can also be fixedly connected to the second side 12 of the circuit board 10 through the same connection method, which is not limited here. In addition, the connection method includes but is not limited to bonding, clamping, threaded connection, etc.

[0052] More specifically, the first support member 51 is closer to the light source 30 than the second support member 52. In some embodiments, both the first support member 51 and the second support member 52 are supported on the second side 12 of the circuit board 10. Fig. 9 As shown, in some embodiments, the first support member 51 can be carried on the heat dissipation plate 20 and fixed on the heat dissipation plate 20 , and the second support member 52 can be carried on a side of the circuit board 10 away from the heat dissipation plate 20 .

[0053] Please continue reading Figure 1 and Figure 2 , the connecting component 53 is connected to the first support member 51 and the second support member 52, and the connecting component 53 includes a first mounting hole 531 and a second mounting hole 532. The first mounting hole 531 is used to mount the first optical component 60, and the second mounting hole 532 is used to mount the second optical component 70. For example, the first mounting hole 531 is a through hole whose axis is perpendicular to the circuit board 10 and the heat sink 20, so as to facilitate the propagation of the light beam. The first optical component 60 is arranged in the first mounting hole 531, and the first optical component 60 is fixedly connected to the first mounting hole 531 by an adhesive, and the optical axis of the first optical component 60 coincides with the optical axis of the light source 30, so that the corresponding arrangement of the first optical component and the light source 30 is realized after the bracket 50 and the circuit board 10 are fixedly connected, so that the first optical component 60 can guide the light emitted by the light source 30 to the outside of the flight time module 100. Of course, the first optical component 60 can also be installed and fixed in the first mounting hole 531 in other ways, which is not limited here.

[0054] The second mounting hole 532 is a through hole whose axis is perpendicular to the circuit board 10 to facilitate the propagation of the light beam, and the second optical component 70 is connected to the second mounting hole 532. After the bracket 50 and the circuit board 10 are fixedly connected, the second optical component and the light source 30 can be set correspondingly so that the light reflected back by the object to be measured can be guided to the sensor 40 via the second optical component 70.

[0055] It should be noted that, in some embodiments, the time-of-flight module 100 further includes a filter 84, which is disposed between the second optical component 70 and the sensor 40, and is used to filter light outside a predetermined wavelength range. Specifically, in some embodiments, the second mounting hole 532 includes a first cavity 5321 and a second cavity 5322 that are connected, and after the bracket 50 and the circuit board 10 are fixedly connected, the first cavity 5321 is closer to the circuit board 10 than the second cavity 5322. The second optical component 70 is installed in the second cavity 5322, and the filter 84 is installed in the first cavity 5321, so that the light reflected back by the object to be measured passes through the second optical component 70 and the filter 84 in sequence and then enters the sensor 40.

[0056] In some embodiments, the light emitted by the light source 30 forms a planar pattern. For example, the light source 30 includes a plurality of light emitting elements (not shown), each of which is capable of emitting a light beam, and the light beams emitted by the plurality of light emitting elements form a planar pattern. Figure 1 and Figures 13 to 15 , the first optical component 60 may include a diffractive optical element 61. The diffractive optical element 61 is provided with an integrated microstructure 611, which can collimate a plane pattern and replicate the plane pattern to emit a speckle pattern out of the time-of-flight module 100. Since the integrated microstructure 611 on the diffractive optical element 61 can collimate a plane pattern and replicate the plane pattern to emit a speckle pattern, compared with using different optical elements to respectively realize the collimation and replication functions, the time-of-flight module 100 of the present application can reduce the volume of the time-of-flight module 100 and reduce the manufacturing cost of the time-of-flight module 100 without affecting the optical effect of projecting the speckle image.

[0057] In addition, while keeping the distance between the first optical component 60 and the circuit board 10 unchanged, the light source 30 is disposed in the second area of ​​the heat dissipation plate 20 and in the first through hole 13 (eg, Figure 5 When the light source 30 is directly disposed on the second side 12 of the circuit board 10, the first optical component 60 needs to have a larger back focus. In addition, the electronic components 801 and gold wires around the light source 30 also cause the back focus of the first optical component 60 to become larger. Fig.16 It can be understood that the larger the back focus of the first optical component 60, the larger the volume of the light emission module composed of the light source 30 and the first optical component 60, and thus the larger the volume of the time-of-flight module 100. In this embodiment, an integrated microstructure 611 is used to realize the functions of a traditional lens group and a diffractive element at the same time, so that the space of the light emission module can be released to the maximum extent, which is very helpful for compressing the baseline of the time-of-flight module 100. That is, the integrated microstructure 611 on the diffractive optical element 61 can collimate the plane pattern and replicate the plane pattern to emit a speckle pattern. Compared with using different optical elements to realize the collimation and replication functions respectively, the baseline of the time-of-flight module 100 can be further shortened.

[0058] Specifically, the integrated microstructure 611 can be formed by the fusion of a virtual phase-based first microstructure and a virtual second microstructure. Among them, the first microstructure is used to collimate the light, and the second microstructure is used to replicate the light spot formed by the received light. For example, in some embodiments, the first microstructure is a microstructure of a diffraction lens or a microstructure of a super lens with n steps, where n is greater than or equal to 2. In this way, the first microstructure can be used to collimate the light. For another example, in some embodiments, the second microstructure is a diffraction microstructure based on a grating or a diffraction microstructure based on a super lens. In this way, the second microstructure can be used to replicate the light spot formed by the received light.

[0059] For further information, see Fig.13 and Fig.14 , the diffractive optical element 61 includes a first surface 6101 and a second surface 6102 facing each other, wherein the first surface 6101 faces the light source 30, and the second surface 6102 is away from the light source 30. That is, the light emitted by the light source 30 will enter the first surface 6101 of the diffractive optical element 61 and then be emitted from the second surface of the diffractive optical element 61. The integrated microstructure 611 can be arranged on the first surface 6101 and / or the second surface 6102 of the diffractive optical element 61. For example, see Fig.13 In some embodiments, the integrated microstructure 611 can be disposed on the first surface 6101 of the diffractive optical element 61, which is more conducive to preventing the integrated microstructure 611 from being scratched and preventing moisture and dust from entering the integrated microstructure 611, thereby extending the service life of the time of flight module 100. For another example, see Fig.14 In some embodiments, the integrated microstructure 611 may also be disposed on the second surface 6102 of the diffractive optical element 61. Since strong light directly incident on the integrated microstructure 611 may cause glare, and the stray light is relatively strong, which will affect the detection accuracy of the time-of-flight module 100. Therefore, in this embodiment, the integrated microstructure 611 is disposed on the second surface 6102 away from the light source 30, which can reduce the volume of the time-of-flight module 100 while avoiding glare and reducing stray light, which is beneficial to improving the detection accuracy of the time-of-flight module 100. Of course, in some embodiments, the integrated microstructure 611 is disposed on both opposite sides of the diffractive optical element 61, which is not limited here.

[0060] See also Fig.15In some embodiments, the diffractive optical element 61 includes a first layer 612 and a second layer 613, and the first layer 612 is closer to the light source 30 than the second layer 613. The integrated microstructure 611 is located in a sealed cavity 614 formed by the first layer 612 and the second layer 613. Since the integrated microstructure 611 is contained in the sealed cavity 614, it is possible to prevent moisture and dust from entering the integrated microstructure 611, which is beneficial to extending the service life of the time of flight module 100. It should be noted that the first layer 612 and the second layer 613 of the diffractive optical element 61 can be made of plastic. Of course, the first layer 612 and the second layer 613 of the diffractive optical element 61 can also be made of other waterproof and dustproof materials, which are not limited here.

[0061] In some embodiments, fillers 615 (such as Fig.13 As shown). In this way, on the one hand, it is possible to prevent moisture and dust from entering the gaps between the integrated microstructures 611, thereby extending the service life of the time-of-flight module 100; on the other hand, it is possible to prevent the light beam emitted by the light source 30 from directly entering the human eye through the gaps between the integrated microstructures 611, thereby improving the safety of the time-of-flight module 100. It should be noted that, in some embodiments, the filler may include organic matter or silicon dioxide.

[0062] See also Fig.17 and Fig.18 In some embodiments, the second optical component 70 includes a phase lens 71, which is used to receive at least part of the light reflected by the object and adjust the phase of the light emitted from the phase lens 71 to the sensor 40. Since the phase lens 71 capable of adjusting the phase of the light is provided to replace the traditional refractive lens group in this embodiment, the volume of the time-of-flight module 100 can be reduced, and the illumination of the light reaching the sensor 40 can be increased, which is beneficial for the sensor 40 to receive the light, so as to improve the detection accuracy of the time-of-flight module 100.

[0063] It should be noted that, in some embodiments, the illumination of the light reaching the sensor 40 through the phase lens 71 is greater than or equal to 98%. Specifically, the phase lens 71 includes a substrate 711 and a phase microstructure 712 disposed on the substrate 711. The phase structure is used to adjust the phase of the light emitted from the phase lens 71 to the sensor 40.

[0064] More specifically, the substrate 711 includes a first surface 7111 and a second surface 7112 that are opposite to each other, and the first surface 7111 is farther away from the sensor 40 than the second surface 7112. The phase microstructure 712 can be disposed on the first surface 7111 and / or the second surface 7112 of the substrate 711. For example, see Fig.17In some embodiments, the phase microstructure 712 may be disposed on the first surface 7111 of the substrate 711. Since the phase microstructure 712 adjusts the phase of the light emitted from the phase lens 71 to the sensor 40, compared with the light directly passing through the lens and then emitted to the sensor 40, the illumination of the light reaching the image sensor can be improved. For another example, see Fig.18 In some embodiments, the phase microstructure 712 may also be disposed on the second surface 7112 of the substrate 711. Since strong light directly incident on the behavior microstructure may cause glare, and the stray light is relatively strong, it is not conducive to the sensor 40 receiving light, thereby affecting the detection accuracy of the time-of-flight module 100. Therefore, in this embodiment, the phase microstructure 712 is disposed on the second surface 7112 of the substrate 711. Compared with the microstructure disposed on the first surface 71111 of the substrate 711, it can improve the illumination of the light reaching the sensor 40 while avoiding glare and reducing stray light, which is beneficial for the sensor 40 to receive light, so as to improve the detection accuracy of the time-of-flight module 100. Of course, in some embodiments, the opposite sides of the substrate 711 may be provided with phase microstructures 712, which is not limited here.

[0065] It should be noted that, in some embodiments, the phase-type lens 71 is a plane phase lens, and the phase microstructure 712 includes a nano-microstructure; or, in some embodiments, the phase-type lens 71 is a Fresnel lens, and the phase microstructure 712 includes a ring-shaped Fresnel microstructure, which is not limited here.

[0066] See also Fig.19 The embodiment of the present application also provides a terminal 1000. The terminal 1000 includes a housing 200 and a flight time module 100 described in any one of the above embodiments, and the flight time module 100 is combined with the housing 200. It should be noted that the terminal 1000 can be a mobile phone, a computer, a tablet computer, a smart watch, a smart wearable device, etc., which is not limited here.

[0067] The terminal 1000 in the present application, by setting the light source 30 in the second zone 202 of the heat sink 20 in the time-of-flight module 100, and combining the first zone 201 of the heat sink 20 with the circuit board 10, can avoid the heat generated by the light source 30 from being transferred to the circuit board 10, compared to directly setting the light source 30 on the circuit board 10, thereby avoiding the situation where the circuit board 10 cannot work normally due to the increase in temperature of the circuit board 10.

[0068] See also Fig. 20, the embodiment of the present application also provides a shooting component 300. The shooting component 300 includes a two-dimensional camera module 301 and the time-of-flight module 100 described in any one of the above embodiments. The two-dimensional camera module 301 is used to obtain a two-dimensional image, and the time-of-flight module 100 is used to obtain a depth information image. The distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is less than the second preset distance. Since the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is less than the second preset distance, the field of view of the time-of-flight module 100 can be close to the field of view of the two-dimensional camera module 301, which is conducive to the shooting component 300 to simultaneously obtain a two-dimensional image and a depth information image under the same field of view. Among them, the two-dimensional camera module 301 can be a color camera module, and the two-dimensional image obtained at this time is a color image; or the two-dimensional camera module 301 can also be a black and white camera module, and the two-dimensional image obtained at this time is a black and white image, which is not limited here.

[0069] It should be noted that, in some embodiments, the second preset distance may be 2 cm. That is, the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is less than 2 cm. For example, the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 may be 1.8 cm, 1.3 cm, 1 cm, 0.8 cm, etc., which are not limited here. Of course, in some embodiments, the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 may also be 2 cm. Preferably, in some embodiments, the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is 1.5 cm, so that the field of view of the time-of-flight module 100 can be kept close to the field of view of the two-dimensional camera module 301, and a certain distance can be maintained between the time-of-flight module 100 and the two-dimensional camera module 301, so as to avoid the temperature generated by the time-of-flight module 100 during the engineering process affecting the normal operation of the two-dimensional camera module 301.

[0070] In some embodiments, when the shooting component 300 is working, the temperature of the time-of-flight module 100 is less than a preset temperature. In some embodiments, the preset temperature may be 60°C. That is, when the shooting component 300 is working, the temperature of the time-of-flight module 100 is less than 60°C. For example, when the shooting component 300 is working, the temperature of the time-of-flight module 100 may be 55°C, 50°C, 48°C, 45°C, 42°C, 35°C, 30°C, etc. Since the temperature of the time-of-flight module 100 is less than the preset temperature, it is possible to avoid the temperature of the time-of-flight module 100 being too high, thereby affecting the normal operation of the components arranged around it (such as the two-dimensional camera module 301). Preferably, in some embodiments, when the shooting component 300 is working, the temperature of the time-of-flight module 100 is stabilized at about 45°C.

[0071] See also Fig. 20 The embodiment of the present application also provides a terminal 1000. The terminal 1000 includes a housing 200 and a shooting component 300 described in any one of the above embodiments, and the shooting component 300 is combined with the housing 200. It should be noted that the terminal 1000 can be a mobile phone, a computer, a tablet computer, a smart watch, a smart wearable device, etc., which is not limited here.

[0072] The terminal 1000 in the present application sets the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 to be less than the second preset distance in the shooting component 300. In this way, the field of view of the time-of-flight module 100 and the field of view of the two-dimensional camera module 301 can be close, which is conducive to the terminal 1000 to simultaneously obtain the two-dimensional image and the depth information image in the same field of view.

[0073] See also Figure 1 , Figure 2 and Fig.21 The embodiment of the present application also provides an assembly method of a time-of-flight module 100. The assembly method includes:

[0074] 011: Provide a heat dissipation plate 20, the heat dissipation plate 20 includes a first area 201 and a second area 202, and the first side 11 of the circuit board 10 is combined with the first area 201;

[0075] 012: The light source 30 is disposed in the second area 202 of the heat dissipation plate 20, and the sensor 40 is mounted on the circuit board 10, and both the light source 30 and the sensor 40 are electrically connected to the circuit board 10;

[0076] 013: Install the first optical component 60 on the integrated bracket 50;

[0077] 014: Install the bracket 50 with the first optical component 60 on the second side 12 of the circuit board 10, the bracket 50 and the circuit board 10 form a receiving cavity 501, so that the sensor 40 and the light source 30 are received in the receiving cavity 501, and the first optical component 60 corresponds to the light source 30; and

[0078] 015: Install the second optical assembly 70 on the bracket 50 so that the second optical assembly 70 corresponds to the sensor 40.

[0079] The assembly method of the time-of-flight module 100 in the present application can prevent the heat generated by the light source 30 from being transferred to the circuit board 10 by disposing the light source 30 in the second zone 202 of the heat sink 20 and combining the first zone 201 of the heat sink 20 with the circuit board 10, thereby avoiding the situation where the circuit board 10 cannot work normally due to the increase in temperature of the circuit board 10.

[0080] Specifically, firstly, the first area 201 of the heat sink 20 is combined with the first side 11 of the circuit board 10. The heat sink 20 may be fixed to the first side 11 of the circuit board 10 by gluing. After the sensor 40 is mounted on the circuit board 10 and the light source 30 is mounted on the second area 202 of the heat sink 20, the light source 30 and the sensor 40 may be electrically connected to the circuit board 10 by a gold wire binding process. The first optical component 60 is mounted on the integrated bracket 50, for example, the first optical component 60 is mounted in the first mounting hole 531 of the bracket 50.

[0081] Subsequently, the bracket 50 with the first optical component 60 installed is installed on the second side 12 of the circuit board 10 provided with the sensor 40 and the light source 30, and the bracket 50 and the circuit board 10 form a receiving cavity 501 so that the sensor 40 and the light source 30 are accommodated in the receiving cavity 501, and the first optical component 60 corresponds to the light source 30.

[0082] For example, in some embodiments, the first optical component 60 mounted on the bracket 50 is aligned with the light source 30 provided on the heat sink 20 through an alignment process (Active Alignment, AA process), and after the alignment is completed, the bracket 50 is fixed to the second side 12 of the circuit board 10, and the bracket 50 and the circuit board 10 form a receiving cavity 501, so that the sensor 40 and the light source 30 are accommodated in the receiving cavity 501, and the first optical component 60 corresponds to the light source 30. It should be noted that, in some embodiments, the first optical component assembly and the light source 30 are aligned through an alignment process, and the relative position between the first optical component 60 and the light source 30 is gradually adjusted, so that the first optical component 60 and the light source 30 are gradually close to being arranged directly opposite. After adjusting the relative position between the first optical component 60 and the light source 30 to meet the alignment accuracy of the first optical component 60 and the light source 30, the bracket 50 is fixed to the circuit board 10 to ensure the stability of the connection.

[0083] After the first optical assembly 60 is installed, the second optical assembly 70 is installed on the bracket 50 so that the second optical assembly 70 corresponds to the sensor 40. For example, in some embodiments, the second optical assembly 70 is aligned with the sensor 40 disposed on the circuit board 10 through an alignment process, and after the alignment is completed, the second optical assembly 70 is installed in the second mounting hole 532 of the bracket 50 so that the second optical assembly 70 corresponds to the sensor 40.

[0084] In some embodiments, before step 014: mounting the bracket 50 with the first optical component 60 mounted on the second side 12 of the circuit board 10, the assembly method further includes: mounting a filter 84 in the second mounting hole 532 of the bracket 50, the filter 84 being used to filter light outside a predetermined wavelength range. Specifically, in some embodiments, before mounting the bracket 50 with the first optical component 60 mounted on the second side 12 of the circuit board 10, the filter 84 may also be mounted in the second mounting hole 532 of the bracket 50, and then the bracket 50 with the first optical component 60 and the filter 84 mounted on the second side 12 of the circuit board 10 is mounted. The filter 84 may be mounted before or after the first optical component 60 is mounted, and this is not limited here.

[0085] See also Figure 1 , Figure 2 and Fig. 22 The embodiment of the present application also provides an assembly method of a time of flight module 100. The assembly method includes:

[0086] 021: Provide a heat dissipation plate 20, the heat dissipation plate 20 includes a first area 201 and a second area 202, and combine the first side 11 of the circuit board 10 with the first area 201;

[0087] 022: The light source 30 is disposed in the second area 202 of the heat dissipation plate 20, and the sensor 40 is mounted on the circuit board 10, and both the light source 30 and the sensor 40 are electrically connected to the circuit board 10;

[0088] 023: Fix the integrated bracket 50 to the second side 12 of the circuit board 10. The bracket 50 and the circuit board 10 form a receiving cavity 501 so that the sensor 40 and the light source 30 are received in the receiving cavity 501;

[0089] 024: Fix the first optical component 60 and the second optical component 70 on the bracket 50 so that the first optical component 60 corresponds to the light source 30 and the second optical component 70 corresponds to the sensor 40.

[0090] The assembly method of the time-of-flight module 100 in the present application can prevent the heat generated by the light source 30 from being transferred to the circuit board 10 by disposing the light source 30 in the second zone 202 of the heat sink 20 and combining the first zone 201 of the heat sink 20 with the circuit board 10, thereby avoiding the situation where the circuit board 10 cannot work normally due to the increase in temperature of the circuit board 10.

[0091] Specifically, firstly, the first area 201 of the heat sink 20 is combined with the first side 11 of the circuit board 10. The heat sink 20 may be fixed to the first side 11 of the circuit board 10 by gluing. After the sensor 40 is mounted on the circuit board 10, the light source 30 is mounted on the heat sink 20 and accommodated in the first through hole 13, and then the light source 30 and the sensor 40 are electrically connected to the circuit board 10 by a gold wire binding process. Subsequently, the bracket 50 is fixedly mounted on the circuit board 10 provided with the sensor 40 and the light source 30, and the bracket 50 and the circuit board 10 form a receiving cavity 501, so that the sensor 40 and the light source 30 are accommodated in the receiving cavity 501.

[0092] After the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical component 60 and the second optical component 70 are fixed on the bracket 50 so that the first optical component 60 corresponds to the light source 30, and the second optical component 70 corresponds to the sensor 40. Fig.23 In some embodiments, step 024: fixing the first optical component 60 and the second optical component 70 on the bracket 50 includes:

[0093] 0241: Fix the first optical component 60 to the bracket 50 after alignment through an alignment process, so that the first optical component 60 corresponds to the light source 30; and

[0094] 0242: The second optical component 70 is aligned and fixed to the bracket 50 through an alignment process so that the second optical component 70 corresponds to the sensor 40.

[0095] For example, after the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical component 60 and the light source 30 are first aligned through an alignment process, and the first optical component 60 is fixed in the first mounting hole 531 of the bracket 50 after the alignment is completed, so that the first optical component 60 corresponds to the light source 30. Subsequently, the second optical component 70 and the sensor 40 are aligned through an alignment process, and the second optical component 70 is fixed in the second mounting hole 532 of the bracket 50 after the alignment is completed, so that the second optical component 70 corresponds to the sensor 40. Since the first optical component 60 and the second optical component 70 are respectively mounted to the bracket 50 after the alignment process, the first optical component 60 and the second optical component 70 can be installed without providing two fixtures on the machine for implementing the alignment process. Of course, in some embodiments, the second optical component 70 can also be installed first, and then the first optical component 60 is installed, which is not limited here.

[0096] See also Figure 1 , Figure 2 and Fig.24 In some embodiments, step 024: fixing the first optical component 60 and the second optical component 70 on the bracket 50, further includes:

[0097] 0243: The first optical component 60 and the second optical component 70 are simultaneously aligned and fixed to the bracket 50 through an alignment process, so that the first optical component 60 corresponds to the light source 30, and the second optical component 70 corresponds to the sensor 40.

[0098] For example, after the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical component 60 and the second optical component 70 are simultaneously aligned and fixed to the bracket 50 through an alignment process, so that the first optical component 60 corresponds to the light source 30, and the second optical component 70 corresponds to the sensor 40. Since the first optical component 60 and the second optical component 70 are aligned and installed at the same time, compared with the alignment and installation of the non-legacy optical component and the second optical component 70 separately, the success rate of the optical path alignment can be improved.

[0099] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0100] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, unless otherwise clearly and specifically defined.

[0101] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A time-of-flight module, characterized in that: The invention comprises an integrated bracket, a heat sink, a circuit board, a light source, a sensor, and a first optical component and a second optical component fixed to the bracket, wherein the circuit board is provided with a first through hole penetrating the first side and the second side of the circuit board, and the area of ​​the circuit board is smaller than the area of ​​the heat sink, wherein: The heat dissipation plate includes a first area and a second area, the first through hole corresponds to the second area, the first side of the circuit board is combined with the first area, the second area includes a protrusion protruding toward the circuit board, the protrusion passes through the first through hole and can be exposed from the second side of the circuit board, the light source is arranged on a side of the protrusion away from the circuit board, and the light source and the sensor are both electrically connected to the circuit board; The bracket is installed on the second side of the circuit board and forms a receiving cavity with the circuit board that can accommodate the light source and the sensor, and the second side of the circuit board is opposite to the first side of the circuit board; The first optical component is mounted on the bracket and corresponds to the light source, and is used to guide the light emitted by the light source to the outside of the time-of-flight module; The second optical component is mounted on the bracket and corresponds to the sensor, and is used to receive at least a portion of the light reflected by the object and guide the light to the sensor.

2. The time-of-flight module according to claim 1, characterized in that: The distance between the center of the sensor and the center of the light source is less than a first preset distance.

3. The time-of-flight module according to claim 1, characterized in that: The light source has a first electrode end on a side close to the heat sink, and has a second electrode end on a side away from the heat sink. The time-of-flight module further includes: a conductive member, one end of which is located between the light source and the heat sink and electrically connected to the first electrode end, and the other end of which is located between the circuit board and the heat sink and electrically connected to the circuit board; and A first lead, one end of which is electrically connected to the second electrode terminal, and the other end of which is electrically connected to the electrode located on the second side of the circuit board.

4. The time-of-flight module according to claim 1, characterized in that: The light source has a first electrode end on a side close to the heat sink, and has a second electrode end on a side away from the heat sink. The time-of-flight module further includes: a conductive member, one end of which is located between the light source and the heat sink and electrically connected to the first electrode end, and the other end of which is located in the second area of ​​the heat sink and electrically connected to the electrode located on the second side of the circuit board through a second lead; and A first lead, one end of which is electrically connected to the second electrode terminal, and the other end of which is electrically connected to the electrode located on the second side of the circuit board.

5. The time-of-flight module according to claim 3 or 4, characterized in that: In the light emitting direction of the light source, the distance between the second electrode terminal and the electrode located on the second side of the circuit board is different from the distance between the two sides opposite to the light source.

6. The time-of-flight module according to claim 1, characterized in that: The sensor is mounted on the second side of the circuit board; or The heat dissipation plate further includes a third area. The circuit board is provided with a second through hole penetrating the first side and the second side. The second through hole corresponds to the third area. The sensor is arranged in the third area and accommodated in the second through hole.

7. The time-of-flight module according to claim 1, characterized in that: The bracket includes a first support member, a second support member, and a connecting component connecting the first support member and the second support member, wherein the first support member and the second support member are respectively fixed to the second side of the circuit board, and the connecting component includes: A first mounting hole, used for mounting the first optical component; and The second mounting hole is used to mount the second optical component.

8. The time-of-flight module according to claim 1, characterized in that: The light emitted by the light source forms a planar pattern, and the first optical component includes: A diffractive optical element is provided with an integrated microstructure, wherein the integrated microstructure is capable of collimating the planar pattern and replicating the planar pattern to emit a speckle pattern outside the time-of-flight module.

9. The time-of-flight module according to claim 1, characterized in that: The second optical component comprises: A phase type lens is used to receive at least part of the light reflected by the object and adjust the phase of the light emitted from the phase type lens to the sensor.

10. A terminal, characterized in that: include: case; and The time-of-flight module according to any one of claims 1 to 9, wherein the housing is combined with the time-of-flight module.

11. A shooting component, characterized in that: include: A two-dimensional camera module, used for acquiring two-dimensional images; and The time-of-flight module according to any one of claims 1 to 9 is used to obtain a depth information image, and the distance between the center of the sensor of the time-of-flight module and the center of the two-dimensional camera module is less than a second preset distance.

12. The shooting assembly according to claim 11, characterized in that: When the shooting component is working, the temperature of the flight time module is lower than a preset temperature.

13. A terminal, characterized in that: include: case; and The shooting assembly according to claim 11 or 12, wherein the shell is combined with the shooting assembly.

14. A method for assembling a time-of-flight module, characterized in that: include: A heat sink is provided, the heat sink comprising a first area and a second area, the second area comprising a protrusion protruding toward a circuit board, the protrusion passing through a first through hole of the circuit board and being able to be exposed from a second side of the circuit board, so as to combine the first side of the circuit board with the first area; The light source is arranged on a side of the protrusion away from the circuit board, and the sensor is mounted on the circuit board, and the light source and the sensor are electrically connected to the circuit board; Mounting the first optical component on the integrated bracket; The bracket with the first optical component mounted thereon is mounted on the second side of the circuit board, the bracket and the circuit board form a receiving cavity, so that the sensor and the light source are accommodated in the receiving cavity, and the first optical component corresponds to the light source; and The second optical component is mounted on the bracket so that the second optical component corresponds to the sensor.

15. A method for assembling a time-of-flight module, characterized in that include: A heat sink is provided, the heat sink comprising a first area and a second area, the second area comprising a protrusion protruding toward a circuit board, the protrusion passing through a first through hole of the circuit board and being able to be exposed from a second side of the circuit board, so as to combine the first side of the circuit board with the first area; The light source is arranged on a side of the protrusion away from the circuit board, and the sensor is mounted on the circuit board, and the light source and the sensor are electrically connected to the circuit board; Fixing an integrated bracket to the second side of the circuit board, wherein the bracket and the circuit board form a receiving cavity so that the sensor and the light source are received in the receiving cavity; A first optical component and a second optical component are fixed on the bracket so that the first optical component corresponds to the light source and the second optical component corresponds to the sensor.

16. The assembly method according to claim 15, characterized in that: The method of fixing the first optical component and the second optical component on the bracket includes: Fixing the first optical component to the bracket after aligning the first optical component through an alignment process, so that the first optical component corresponds to the light source; and The second optical component is aligned and fixed to the bracket through an alignment process, so that the second optical component corresponds to the sensor.

17. The assembly method according to claim 15, characterized in that: The method of fixing the first optical component and the second optical component on the bracket includes: The first optical component and the second optical component are simultaneously aligned and fixed to the bracket through an alignment process, so that the first optical component corresponds to the light source, and the second optical component corresponds to the sensor.

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