An LED packaging structure and a display panel

Abstract

The present application discloses an LED packaging structure and a display panel. The LED packaging structure includes: a housing, comprising a bottom plate and side walls disposed on the bottom plate, the bottom plate and the side walls forming a groove; a quantum dot layer disposed on the bottom plate within the groove; a bracket disposed above the groove; and an LED chip disposed on a surface of the bracket facing the groove, with the light-emitting direction of the LED chip facing the quantum dot layer. In the present application, the LED chip is inversely disposed above the groove, and the quantum dot layer is disposed within the groove. The distance between the LED chip and the quantum dot layer is relatively far. The light emitted by the LED chip is converted by the quantum dot layer and then reflected by the bottom plate, and exits from the side of the LED chip away from the quantum dot layer. The light of the LED chip passes through the quantum dot layer twice, so the phenomenon of fluorescence quenching will not occur, which can improve the luminous efficiency of the LED packaging structure and reduce the blue light component in the light emitted by the LED packaging structure.

Description

Technical Field

[0001] This application relates to the field of displays, and particularly to an LED packaging structure and a display panel. Background Art

[0002] Since the quantum dot TV was launched on the market, it has received extensive praise. Due to the many excellent properties of quantum dot materials, the new LCD display panel combining LCD (liquid crystal display panel) and quantum dot backlight has excellent display effects such as wide color gamut, high color saturation, and color purity. Its color and display quality are approaching or even exceeding that of OLED displays (organic light-emitting display panels). Therefore, in order to manufacture display panels with high display effects, quantum dot LEDs (combining quantum dot materials with micro light-emitting diodes) have been widely studied.

[0003] However, currently, the preparation of quantum dot LEDs only uses quantum dot materials to replace traditional phosphors and fill them into the lamp beads. However, this method still requires a large amount of quantum dot materials, and due to the limitations of filling technology, it is easy to form aggregates of quantum dots locally, resulting in fluorescence quenching, which affects the luminous efficiency. At the same time, since most quantum dot LEDs need to be excited by blue LEDs, it brings greater blue light hazards, and currently, there is no effective preparation scheme for high-power quantum dot LEDs. Summary of the Invention

[0004] The embodiments of this application provide an LED packaging structure and a display panel, which can solve the problems of low luminous efficiency, high blue light content, and low power existing in current quantum dot LEDs.

[0005] The embodiments of this application provide an LED packaging structure, including:

[0006] A housing, including a bottom plate and a side wall provided on the bottom plate, the bottom plate and the side wall forming a groove;

[0007] A quantum dot layer, provided on the bottom plate within the groove;

[0008] A bracket, provided above the groove;

[0009] An LED chip, provided on one surface of the bracket facing the groove, and the light-emitting direction of the LED chip faces the quantum dot layer.

[0010] Optionally, in some embodiments of this application, it further includes:

[0011] A lens, provided on the side of the bracket away from the groove, and the lens is connected to the side wall.

[0012] Optionally, in some embodiments of this application, it further includes:

[0013] A packaging adhesive, the packaging adhesive is at least disposed in the groove and covers the quantum dot layer.

[0014] Optionally, in some embodiments of the present application, the area of the bottom plate in the groove is larger than the area of the orthographic projection of the bracket on the bottom plate in the groove.

[0015] Optionally, in some embodiments of the present application, the outer contour of the lens away from the groove and the inner contour of the lens close to the groove are both arc-shaped.

[0016] Optionally, in some embodiments of the present application, the bracket includes a first end portion and a second end portion that are arc-shaped, and an intermediate portion connected between the first end portion and the second end portion. The intermediate portion is a plane, and the LED chip is disposed on the intermediate portion.

[0017] Optionally, in some embodiments of the present application, the material of the bracket includes at least one of copper, copper alloy, aluminum, and aluminum alloy.

[0018] Optionally, in some embodiments of the present application, the materials of the bottom plate and the side wall include ceramics and metals.

[0019] Optionally, in some embodiments of the present application, the bottom plate further includes an extension portion extending outward away from the side wall.

[0020] Correspondingly, an embodiment of the present application further provides a display panel, including the LED packaging structure described in any one of the above.

[0021] In an embodiment of the present application, an LED packaging structure and a display panel are provided. The LED packaging structure includes: a housing, including a bottom plate and a side wall disposed on the bottom plate, the bottom plate and the side wall form a groove; a quantum dot layer, disposed on the bottom plate in the groove; a bracket, disposed above the groove; an LED chip, disposed on a surface of the bracket facing the groove, and the light emitting direction of the LED chip faces the quantum dot layer. In the present application, by disposing the LED chip upside down above the groove and the quantum dot layer in the groove, the distance between the LED chip and the quantum dot layer is relatively far. The light emitted by the LED chip is converted by the quantum dot layer and then reflected by the bottom plate, and exits from the side of the LED chip away from the quantum dot layer. The light of the LED chip passes through the quantum dot layer twice, so the phenomenon of fluorescence quenching will not occur, which can improve the light emitting efficiency of the LED packaging structure, reduce the blue light component in the light emitted by the LED packaging structure, and at the same time, the heat generated by the LED chip can be dissipated through the bracket, which helps to manufacture high-power quantum dot LEDs. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0023] Figure 1 The first three-dimensional structure diagram of an LED packaging structure provided by an embodiment of the present application;

[0024] Figure 2 The second three-dimensional structure diagram of an LED packaging structure provided by an embodiment of the present application;

[0025] Figure 3 The exploded view of the second three-dimensional structure of an LED packaging structure provided by an embodiment of the present application. Specific embodiments

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the orientation terms such as "upper" and "lower" usually refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0027] An embodiment of the present application provides an LED packaging structure, including: a housing, including a bottom plate and a side wall provided on the bottom plate, the bottom plate and the side wall form a groove; a quantum dot layer, provided on the bottom plate in the groove; a bracket, provided above the groove; an LED chip, provided on one surface of the bracket facing the groove, and the light-emitting direction of the LED chip faces the quantum dot layer. An embodiment of the present application also provides a display panel including the foregoing LED packaging structure. The following will be described in detail respectively. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0028] Embodiment 1

[0029] Please refer to Figure 1 , Figure 1 which is the first three-dimensional structure diagram of an LED packaging structure 100 provided by an embodiment of the present application.

[0030] An embodiment of the present application provides an LED packaging structure 100, and the LED packaging structure 100 includes a housing 10, a quantum dot layer 20, a bracket 30, and an LED chip 40. The housing 10 includes a bottom plate 11 and a side wall 12 provided on the bottom plate 11, and the bottom plate 11 and the side wall 12 form a groove 13; the quantum dot layer 20 is provided on the bottom plate 11 within the groove 13; the bracket 30 is provided above the groove 13; the LED chip 40 is provided on a surface of the bracket 30 facing the groove 13, and the light-emitting direction of the LED chip 40 faces the quantum dot layer 20.

[0031] Specifically, the housing 10 includes a bottom plate 11 and a side wall 12 provided on the bottom plate 11, and the bottom plate 11 and the side wall 12 form a concave space, that is, the bottom plate 11 and the side wall 12 form a groove 13.

[0032] Specifically, the quantum dot layer 20 is provided on the bottom plate 11 within the groove 13, and can be formed by dropping quantum dot materials on the bottom plate 11, or can be formed by spin coating or other methods to form the quantum dot layer 20.

[0033] Specifically, first, the materials of the quantum dot layer 20 are dropped, and then the quantum dot layer 20 is prepared by spin coating, thereby ensuring the high dispersibility of the quantum dot materials and avoiding the aggregation of the materials.

[0034] Specifically, the quantum dot layer 20 may include green quantum dots, red quantum dots, or the quantum dot layer 20 may include white light quantum dots, but is not limited thereto.

[0035] Specifically, the LED chip 40 (light-emitting diode chip) may be a blue light LED chip, but is not limited thereto.

[0036] Specifically, one LED chip or multiple LED chips may be provided on the bracket 30, and the number of LED chips is set according to the power requirement of the LED packaging structure.

[0037] Specifically, taking the LED chip 40 as a blue light LED chip and the quantum dot layer 20 as green quantum dots as an example to illustrate the light-emitting process of the LED packaging structure of this embodiment, the LED chip emits blue light towards the quantum dot layer 20, the blue light is converted into green light by the quantum dot layer 20, the green light is reflected by the bottom plate 11, and the green light reflected by the bottom plate 11 and part of the blue light emitted by the LED chip that has not been converted pass through the quantum dot layer 20 again, so that the blue light emitted by the LED chip is fully converted into green light, reducing the blue light content in the finally emitted light of the LED packaging structure. The green light after passing through the quantum dot layer 20 again exits from around the bracket 30, and the finally emitted light direction of the LED packaging structure is towards the direction away from the bottom plate 11 of the bracket 30.

[0038] Specifically, the functions of the groove 13 include accommodating the quantum dot layer 20.

[0039] In this embodiment, by arranging the LED chip 40 upside down above the groove 13 and arranging the quantum dot layer 20 in the groove 13, the light emitted by the LED chip 40 is converted by the quantum dot layer 20 and then reflected by the bottom plate 11. The light reflected by the bottom plate 11 passes through the quantum dot layer 20 again, so that the light emitted by the LED chip can be fully converted. Therefore, the luminous efficiency of the LED structure can be improved, the blue light content can be reduced, and the LED chip is arranged far away from the quantum dot layer 20, and the thickness of the quantum dot layer 20 can be set very thin, so that the quantum dot materials are no longer aggregated, and the phenomenon of fluorescence quenching can be avoided, further improving the luminous efficiency of the LED packaging structure. At the same time, the heat generated by the LED chip can be dissipated through the bracket, which helps to manufacture high-power quantum dot LEDs.

[0040] In this embodiment, the LED packaging structure 100 has a simple structure and is very easy to process and produce modularly.

[0041] Embodiment Two

[0042] This embodiment is the same as or similar to the above embodiment, and the difference lies in further describing the characteristics of the LED packaging structure.

[0043] Please refer to Figure 2 and Figure 3 , Figure 2 which is the second three-dimensional structure schematic diagram of an LED packaging structure 100 provided by an embodiment of the present application; Figure 3 which is the exploded view or disassembly schematic diagram of the second three-dimensional structure of an LED packaging structure 100 provided by an embodiment of the present application. Figure 2 The difference from Figure 1 is that Figure 2 the LED packaging structure in

[0044] also includes a lens 50.

[0045] Specifically, the lens 50 is arranged on the side of the bracket 30 away from the groove 13, and the lens 50 is connected to the side wall 12.

[0046] Specifically, the lens 50 can uniformly adjust the light output direction of the LED packaging structure, thereby improving the light output efficiency in the required light output direction.

[0047] Specifically, the lens 50 is connected to the side wall 12, and the lens 50 and the side wall 12 enclose a cavity, which can play a role in protecting the quantum dot layer 20 and the LED chip 40.

[0048] Specifically, the bracket 30 and the lens 50 can be adhered to the side wall 12 by glue or the like, and can also be fixed to the side wall 12 by other means.

[0049] In some embodiments, the outer contour of the lens 50 away from the groove 13 and the inner contour of the lens 50 close to the groove 13 are both arc-shaped.

[0050] Specifically, further, the shape of the lens 50 can be semi-circular or semi-elliptical. The semi-circular or semi-elliptical lens 50 can achieve a relatively large light-emitting angle, so as to be used as a light source for the backlight in the display panel.

[0051] Specifically, further, the lens 50 can include a lens body 51 and a lens internal space 52. The lens body 51 encloses the lens internal space 52, and the lens internal space 52 can facilitate the setting of some parts of the bracket 30, for example, facilitate the setting of the middle part 33 of the bracket 30.

[0052] In some embodiments, the LED packaging structure 100 further includes a packaging adhesive 60. The packaging adhesive 60 is at least disposed in the groove 13 and covers the quantum dot layer 20.

[0053] Specifically, the packaging adhesive 60 is disposed in the groove 13, or the packaging adhesive 60 is disposed in the cavity formed by the lens 50 and the housing 10. The packaging adhesive 60 can protect the quantum dot layer 20 and the LED chip 40, and prevent dust, water vapor, etc. from invading the quantum dot layer 20 and the LED chip 40.

[0054] Specifically, the functions of the packaging adhesive 60 further include internally refracting the light emitted by the LED chip towards the quantum dot layer 20, and internally refracting the outgoing light of the LED packaging structure reflected by the bottom plate 11, which can improve the light-emitting efficiency and color effect of the LED.

[0055] In some embodiments, the area of the bottom plate 11 in the groove 13 is larger than the area of the orthographic projection of the bracket 30 on the bottom plate 11 in the groove 13.

[0056] Specifically, the final light-emitting direction of the LED packaging structure is to emit light from around the bracket 30 or from the lens 50. Therefore, the bracket 30 cannot cover the groove 13. Therefore, it is necessary to set a bracket 30 with a smaller area to avoid excessive occlusion of the bracket 30 on the light-emitting path of the LED packaging structure.

[0057] The LED packaging structure of this embodiment also has the beneficial effects of the LED packaging structure in the above embodiments, which will not be elaborated here.

[0058] Embodiment III

[0059] This embodiment is the same as or similar to the above embodiment, and the difference lies in further describing the characteristics of the LED packaging structure.

[0060] In some embodiments, the bracket 30 includes a first end 31 and a second end 32 that are arc-shaped, and an intermediate portion 33 connected between the first end 31 and the second end 32. The intermediate portion 33 is planar, and the LED chip 40 is disposed on the intermediate portion 33.

[0061] Specifically, in order to facilitate the setting of the LED chip, the intermediate portion 33 of the bracket 30 is set to be planar, and the LED chip is disposed on the surface of the intermediate portion 33 facing the quantum dot layer 20.

[0062] Specifically, both the first end 31 and the second end 32 are arc-shaped, which can facilitate the setting of the bracket 30 on the housing 10 and make the distance between the LED chip and the quantum dot layer 20 relatively far.

[0063] In some embodiments, the material of the bracket 30 includes at least one of copper, copper alloy, aluminum, and aluminum alloy.

[0064] Specifically, the bracket 30 needs to dissipate heat from the LED chip. Therefore, the bracket is made of a heat-dissipating material, and the bracket can be made of heat-dissipating metals, alloys, heat-dissipating plastics, etc.

[0065] In some embodiments, the materials of the bottom plate 11 and the side wall 12 include ceramics and metals.

[0066] Specifically, in some embodiments, the bottom plate 11 and the side wall 12 may be an integrally formed structure, which is not limited herein.

[0067] Specifically, the bottom plate 11 can reflect the light emitted by the LED chip and / or the light converted by the quantum dot layer 20.

[0068] Specifically, further, in order to improve the reflectivity and light extraction efficiency, a reflective layer may be provided between the quantum dot layer 20 and the bottom plate 11, and the reflective layer may be a reflective material such as aluminum or silver.

[0069] In some embodiments, the bottom plate 11 further includes an extension portion 111 protruding from the side wall 12.

[0070] Specifically, setting the bottom plate 11 to further include an extension portion 111 protruding from the side wall 12, or the area of the bottom plate 11 being larger than the orthographic projection of the side wall 12 on the bottom plate 11, or the bottom plate 11 covering the orthographic projection of the side wall 12 on the bottom plate 11 can facilitate the setting of the LED packaging structure in the display panel and facilitate the fixed setting of the LED packaging structure.

[0071] The LED packaging structure of this embodiment also has the beneficial effects of the LED packaging structure in the above embodiments, which will not be elaborated herein.

[0072] It should be noted that in the LED packaging structure in the above embodiments, the LED chip may have a first electrode and a second electrode, and an insulating layer and traces may be provided on the bracket 30 to input an electrical signal to the LED chip, which is not limited herein.

[0073] It should be noted that in the LED packaging structure in the above embodiments, the bracket 30 is schematically shown as an arched bracket, and the arched bracket 30 is fixed on the side wall 12, but the shape of the bracket 30 is not limited thereto, as long as it is convenient for arranging the LED chip and for the final light emission of the LED packaging structure.

[0074] Embodiment 4

[0075] This embodiment provides a display panel, and the display panel includes the LED packaging structure of any one of the above embodiments.

[0076] Specifically, this embodiment provides a display panel, and the display panel includes the LED packaging structure 100 of any one of the above embodiments. The packaging structure 100 is used as a light source in the backlight of the display panel, or the LED packaging structure 100 is used as a display pixel of the display panel, which is not limited herein.

[0077] Specifically, the packaging structure 100 is used as a light source in the backlight of the display panel. Since the LED structure 100 has the beneficial effects of high luminous efficiency, low blue light content, good heat dissipation effect, and the ability to manufacture high-power LED packaging structures, the display panel has the advantages of high brightness, low blue light content, good heat dissipation effect, etc.

[0078] Specifically, the display panel body may be a liquid crystal display panel, and the type of the liquid crystal display panel is not limited herein. For example, the liquid crystal display panel may be a vertically aligned liquid crystal display panel (VA mode liquid crystal display panel), an in-plane switching liquid crystal display panel (FFS mode or IPS mode liquid crystal display panel), a twisted nematic liquid crystal display panel (TN mode liquid crystal display panel).

[0079] The above has introduced in detail an LED packaging structure and a display panel provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. An LED packaging structure, characterized in that, it includes: A housing, including a bottom plate and a side wall provided on the bottom plate, and the bottom plate and the side wall form a groove; A quantum dot layer, provided on the bottom plate within the groove; A bracket, provided above the groove; An LED chip, provided on one surface of the bracket facing the groove, and the light-emitting direction of the LED chip faces the quantum dot layer; A lens, provided on the side of the bracket away from the groove, and the lens is connected to the side wall; The area of the bottom plate within the groove is larger than the area of the orthographic projection of the bracket on the bottom plate within the groove.

2. The LED packaging structure according to claim 1, characterized in that, it further includes: A packaging adhesive, which is at least provided within the groove and covers the quantum dot layer.

3. The LED packaging structure according to claim 1, characterized in that, The outer contour of the lens away from the groove and the inner contour close to the groove are both arc-shaped.

4. The LED packaging structure according to any one of claims 1 to 3, characterized in that, The bracket includes a first end portion and a second end portion that are arc-shaped, and an intermediate portion connected between the first end portion and the second end portion. The intermediate portion is a plane, and the LED chip is provided on the intermediate portion.

5. The LED packaging structure according to any one of claims 1 to 3, characterized in that, The material of the bracket includes at least one of copper, copper alloy, aluminum, and aluminum alloy.

6. The LED packaging structure according to any one of claims 1 to 3, characterized in that, The materials of the bottom plate and the side wall include ceramics and metals.

7. The LED packaging structure according to claim 1, characterized in that, The bottom plate further includes an extension portion that extends outward away from the side wall.

8. A display panel, characterized in that, it includes the LED packaging structure according to any one of claims 1 to 7.

Images