A vertical coating device

Abstract

The present application provides a vertical coating device, which relates to the field of semiconductor preparation technology, and includes a base, a coating mechanism, and a revolution mechanism rotatably arranged on the base, a carrier plate is arranged on the peripheral wall of the revolution mechanism, and a rotation mechanism for placing a planar substrate is rotatably arranged on the carrier plate, and the rotation plane of the revolution mechanism is perpendicular to the rotation plane of the rotation mechanism. The coating mechanism is arranged on the base and corresponds to the planar substrate, so that the distance between the position point on the surface of the planar substrate and the coating mechanism can be changed through rotation, thereby balancing the difference in the distance between each position point, thereby reducing the lateral dispersion of the coating on the surface of the planar substrate, and improving the uniformity and yield of the product.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a vertical coating device. Background Art

[0002] Magnetron sputtering coating technology is widely used in the optoelectronic field. Its principle is that under vacuum, ions impact the target material under the action of the electric field, causing the target material to sputter and deposit on the surface of the product to be coated, thereby forming a film layer attached to the surface of the product. The characteristics of the film layer or the combined characteristics of the film layer and the product can be used in related fields.

[0003] A vertical coating device is a device using the above technology, such as Figure 1 The top view shown in FIG. 1 shows a centrally placed rotating mechanism 010 and a magnetron sputtering mechanism 040 disposed around the rotating mechanism 010. A plurality of carrier plates 020 are disposed on the peripheral wall of the rotating mechanism 010, and a plurality of planar substrates 030 are disposed on the carrier plates 020. Figure 1 The central axis 012 of the magnetron sputtering device 040 rotates along the rotation direction 011 so that multiple planar substrates 030 can pass through the coating area of ​​the magnetron sputtering device 040 in sequence, and then thin film products can be continuously and stably produced in large quantities.

[0004] However, if Figure 2 As shown, for the planar substrate 030 placed on the rotating mechanism 010, when it rotates in a circle following the rotating mechanism 010, different positions on the surface of the planar substrate 030 along the rotating direction 011 will approach the magnetron sputtering mechanism 040 at different distances, resulting in a large difference in the thickness of the film layer on the surface of the planar substrate 030, which will cause the so-called "lateral dispersion". Moreover, this problem becomes more prominent as the size (lateral) of the substrate increases, seriously affecting the uniformity of the product and reducing the yield. Summary of the invention

[0005] The purpose of the present application is to provide a vertical coating device to address the deficiencies in the above-mentioned prior art, and to improve the problem of lateral dispersion generated when coating a flat substrate surface by setting a rotation mechanism.

[0006] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0007] In one aspect of an embodiment of the present application, a vertical coating device is provided, comprising a base, a coating mechanism and a revolution mechanism rotatably arranged on the base, a carrier plate is arranged on the peripheral wall of the revolution mechanism, a rotation mechanism for placing a planar substrate is rotatably arranged on the carrier plate, the rotation plane of the revolution mechanism is perpendicular to the rotation plane of the rotation mechanism, and the coating mechanism is arranged on the base and corresponds to the planar substrate.

[0008] Optionally, the rotation mechanism includes a first driving member arranged on the carrier, a rotating member and a clamp for clamping the planar substrate, the clamp is rotatably arranged on the carrier through the rotating member, and the first driving member is connected to the clamp via the rotating member, and is used to drive the clamp to rotate to drive the planar substrate to rotate.

[0009] Optionally, the rotating member is a bearing, the outer ring of the bearing is fixedly connected to the carrier plate, the inner ring of the bearing is fixedly connected to the fixture, and the first driving member and the inner ring of the bearing are driven by gears.

[0010] Optionally, a accommodating hole is opened on the carrier plate, the bearing is embedded in the accommodating hole, the outer ring of the bearing is fixedly connected to the inner wall of the accommodating hole, the inner ring of the bearing protrudes from the accommodating hole, and a gear part cooperating with the first driving member is arranged on the outer peripheral wall where the inner ring of the bearing protrudes from the accommodating hole.

[0011] Optionally, the revolution mechanism includes a second driving member and a cylinder arranged on the base, the cylinder is rotatable around its own central axis and is arranged on the base, the carrier plate is arranged on the peripheral wall of the cylinder, and the second driving member is connected to the cylinder for driving the cylinder to drive the planar substrate to revolve.

[0012] Optionally, the cylinder is a prismatic cylinder, and there are multiple carrier plates, which are distributed on the side walls of the prismatic cylinder in a one-to-one correspondence.

[0013] Optionally, the coating mechanism is a magnetron sputtering mechanism.

[0014] Optionally, the vertical coating device also includes a correction leaf assembly arranged on the base, which is located between the coating mechanism and the planar substrate and partially covers the coating area of ​​the coating mechanism, and is used to correct the uniformity of the film layer thickness on the planar substrate surface.

[0015] Optionally, the vertical coating device includes a group of correction leaf assemblies, which are distributed on one side of the coating area; or, the vertical coating device includes two groups of correction leaf assemblies, which are distributed on opposite sides of the coating area.

[0016] Optionally, the correction leaf assembly includes a plurality of fingers arranged in the same plane, the plane in which the plurality of fingers are arranged is perpendicular to the rotation plane of the revolution mechanism, and the length of each finger increases outwardly along the rotation center of the rotation mechanism.

[0017] The beneficial effects of this application include:

[0018] The present application provides a vertical coating device, comprising a base, a coating mechanism and a revolution mechanism rotatably arranged on the base, a carrier plate is arranged on the peripheral wall of the revolution mechanism, a rotation mechanism for placing a planar substrate is rotatably arranged on the carrier plate, the rotation plane of the revolution mechanism is perpendicular to the rotation plane of the rotation mechanism, the coating mechanism is arranged on the base and corresponds to the planar substrate, so that the distance between the position point on the surface of the planar substrate and the coating mechanism can be changed through rotation, thereby balancing the difference in the distance between each position point, thereby reducing the lateral dispersion of the coating on the surface of the planar substrate, and improving the uniformity and yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a top view of an existing vertical coating device;

[0021] Figure 2 A schematic diagram of the rotation of a planar substrate in an existing vertical coating device;

[0022] Figure 3 One of the structural schematic diagrams of a vertical coating device provided in an embodiment of the present application;

[0023] Figure 4 One of the schematic diagrams of a planar substrate and a coating area provided in an embodiment of the present application;

[0024] Figure 5 One of the schematic diagrams of a planar substrate coating provided in an embodiment of the present application;

[0025] Figure 6 A cross-sectional view of a carrier plate provided with a rotation mechanism provided in an embodiment of the present application;

[0026] Figure 7 A second schematic diagram of a planar substrate and a coating area provided in an embodiment of the present application;

[0027] Figure 8 A third schematic diagram of a planar substrate and a coating area provided in an embodiment of the present application;

[0028] Fig. 9 A fourth schematic diagram of a planar substrate and a coating area provided in an embodiment of the present application;

[0029] Fig.10A second schematic diagram of a planar substrate coating provided in an embodiment of the present application;

[0030] Fig.11 This is a third schematic diagram of a planar substrate coating provided in an embodiment of the present application.

[0031] Icons: 010-rotation mechanism; 011-rotation direction; 012, 101, 103-central axis; 020, 110-carrier plate; 030, 120-flat substrate; 040-magnetron sputtering mechanism; 100-revolution mechanism; 102, 104-rotation direction; 130-coating mechanism; 131-coating area; 141-outer ring of bearing; 142-inner ring of bearing; 143-driving gear; 150-correction leaf assembly; 160-clamp. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. It should be noted that, in the absence of conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0033] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0034] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] Existing vertical coating devices, such as Figure 1The top view shown in the figure shows that a centrally placed rotating mechanism 010 and a magnetron sputtering mechanism 040 arranged around the rotating mechanism 010 are configured. A plurality of carrier plates 020 are arranged on the peripheral wall of the rotating mechanism 010. A flat substrate 030 to be coated is arranged on each carrier plate 020. The rotating mechanism 010 is rotated along its own central axis 012. Figure 1 The rotation direction 011 in the magnetron sputtering mechanism 040 rotates so that the plurality of planar substrates 030 can sequentially pass through the coating area of ​​the magnetron sputtering mechanism 040 , thereby achieving coating on the surface of the planar substrates 030 .

[0036] However, if Figure 2 As shown, for the planar substrate 030 placed on the carrier 020, when it follows the rotating mechanism 010 to make a circular rotation, different positions on the surface of the planar substrate 030 along the rotating direction 011 will approach the magnetron sputtering mechanism 040 at different distances. In other words, when the position point gradually moves from the center point o on the planar substrate 030 to the edge point b or the edge point a, the rotation radius of the position point gradually increases, for example Figure 2 The rotation radius of the middle edge point b and the edge point a are both greater than the rotation radius of the center point o. Therefore, for edge point a, edge point b and center point o, edge point a and edge point b are closer to the magnetron sputtering mechanism 040. Therefore, during the coating process, the thickness of the coating layer at edge point a and edge point b will be greater than the thickness of the coating layer at center point o, so that the surface of the coating on the plane substrate 030 forms a thick and thin wavy surface in the direction of the line connecting edge point b, center point o and edge point a, so that the thickness of the film layer on the surface of the plane substrate 030 is relatively different, that is, it causes the so-called "lateral dispersion". Moreover, this problem becomes more prominent as the size (lateral) of the substrate increases, seriously affecting the uniformity of the product and reducing the yield. For example, for an 8-inch 940nm narrowband filter product, the lateral dispersion may be close to 10nm, which does not meet the requirements of subsequent packaging.

[0037] In one aspect of the embodiments of the present application, a vertical coating device is provided, such as Figure 3 As shown, it includes a base (not shown in the figure), a coating mechanism 130 and a revolution mechanism 100, wherein the revolution mechanism 100 is rotatably arranged on the base, a carrier plate 110 is arranged on the peripheral wall of the revolution mechanism 100, a rotation mechanism (not shown in the figure) is rotatably arranged on the carrier plate 110, and the rotation mechanism is used to place a flat substrate 120, and the coating mechanism 130 is arranged on the base and is located at the periphery of the entire revolution mechanism 100, thereby, during the rotation of the revolution mechanism 100, the carrier plate 110 arranged on the side wall of the revolution mechanism 100 can drive the flat substrate 120 on the rotation mechanism to pass through the coating area 131 of the coating mechanism 130, so as to realize the coating of the flat substrate 120.

[0038] like Figure 3 As shown, since the rotation mechanism and the carrier plate 110 are both arranged on the revolution mechanism 100, and the revolution mechanism 100 can realize rotation relative to the base, the planar substrate 120 arranged on the rotation mechanism can firstly realize revolution following the revolution mechanism 100, and on this basis, since the rotation mechanism can realize rotation relative to the carrier plate 110, and the carrier plate 110 is arranged on the revolution mechanism 100, the planar substrate 120 arranged on the rotation mechanism can also realize rotation following the rotation mechanism, and the rotation plane of the revolution mechanism 100 and the rotation plane of the rotation mechanism are arranged to be perpendicular to each other, for example Figure 3 In the figure, the revolution mechanism 100 rotates around its own central axis 101 along the rotation direction 102, and the rotation mechanism rotates around its own central axis 103 along the rotation direction 104. Usually, when the planar substrate 120 is placed, the center of the planar substrate 120 is located on the rotation axis of the rotation mechanism.

[0039] Combination Figure 4 As shown, for ease of understanding, the revolution of the planar substrate 120 can be planarized. Thus, when the planar substrate 120 revolves, the planar substrate 120 enters the coating area 131 from the left side of the coating area 131 and leaves the coating area 131 from the right side of the coating area 131. While the planar substrate 120 revolves, it also rotates (for example, Figure 4 The rotation plane of the revolution and the rotation plane of the rotation are perpendicular to each other, so that the same position point on the plane substrate 120 will move from left to right in the coating area 131, and will also rotate, so that the position point originally located on the surface of the plane substrate 120 far from the coating mechanism 130 can be moved to a position closer to the coating mechanism 130 through the rotation. Similarly, the position point originally located on the surface of the plane substrate 120 close to the coating mechanism 130 can be moved to a position closer to the coating mechanism 130 through the rotation. 130, for example, position point C which is originally far away from the coating mechanism 130 can be moved to the position of position point A which is originally close to the coating mechanism 130 by self-rotation, so that position point A which is originally close to the coating mechanism 130 can be moved to a position farther away from the coating mechanism 130 by self-rotation. In other words, the distance between the surface point of the planar substrate 120 and the coating mechanism 130 can be changed by self-rotation, so as to balance the difference in the distance between each point, thereby reducing the lateral dispersion of the coating on the surface of the planar substrate 120 and improving the uniformity and yield of the product.

[0040] It should be understood that the aforementioned implementation (i.e., rotation plus revolution) can reduce the difference in the coating between the various positions on the surface of the planar substrate 120 distributed on the same circle with the rotation axis of the rotation mechanism as the center. For example, please refer to Figure 4As shown, position point O, position point A, position point B and position point C are all located on the surface of the planar substrate 120, wherein position point A, position point B and position point C rotate with position point O as the center during rotation, and position point A, position point B and position point C are on the same circumference with position point O as the center. Compared with the existing film layer distribution on the surface of the planar substrate 120 after only revolution coating (the position point on the line connecting position point O and position point C is the farthest from the coating mechanism 130 and the film layer thickness is the thinnest, and position point A and position point B are the closest to the coating mechanism 130 and the film layer thickness is the thickest, therefore, The overall film layer forms a thick and thin wavy surface in the direction of the line connecting position B, position point O and position point A). The present application reduces the difference in the distance between position point C and position point A or position point C and position point B from the coating mechanism 130 through rotation, so that the difference in film thickness at position point C and position point A or B is reduced. Similarly, the difference in other position points distributed on the circumference of position point C can also be reduced. In other words, the coating difference between the position points distributed on the same circumference with the rotation center as the center can be reduced, thereby improving the uniformity of the film layer on the surface of the existing planar substrate 120.

[0041] In some embodiments, the planar substrate 120 placed on the rotation mechanism in the present application may be a circular substrate, a square substrate, a triangular substrate, etc., and the present application does not impose any limitation thereto.

[0042] For further explanation of the embodiments of the present application, please refer to Figure 5 , taking the planar substrate 120 as a circular substrate as an example, the position point A and the position point B are both edge points of the substrate and are both located on the same circumference with the position point O as the center. Figure 5 The spiral line in is the planar motion trajectory of the position point A during the rotation and revolution process. When the width of the coating area 131 is L, the distance of OA is r, and L = 2πr, Figure 5 In (a), the circular substrate rotates with a period of one revolution, just when the position point O passes through L. Figure 5 In (b), the circular substrate rotates, and the period is the distance that the position point O passes through L after two revolutions. When L is other values, the above relationship can also be used for conversion.

[0043] Depend on Figure 5 From (a) to (b), it can be seen that as the rotation speed increases, position point A can pass through the coating area 131 more times, so that the difference between the positions on the same circumference can be made smaller, thereby achieving more uniform deposition. Of course, due to the stability of the mechanism, the vibration of the carrier 110, the bearing capacity of the rotation mechanism during rotation, the reliability of the thin film deposition and the flat substrate 120, etc., too fast a rotation speed will also have a negative impact. Therefore, a suitable rotation speed can be reasonably selected according to actual needs.

[0044] In some embodiments, Figure 6 As shown, the self-rotation mechanism includes a first driving member (not shown) disposed on the carrier 110, a rotating member and a clamp 160, wherein the clamp 160 is rotatably disposed on the carrier 110 via the rotating member, and the first driving member is drivingly connected to the clamp 160 via the rotating member, thereby, under the drive of the first driving member, the rotating member is driven to make the clamp 160 rotate relative to the carrier 110, thereby realizing the self-rotation of the planar substrate 120 loaded on the clamp 160. It should be understood that the clamp 160 in the present application can not only realize the clamping of the planar substrate 120, but also realize the unloading of the planar substrate 120.

[0045] In some embodiments, please continue to refer to Figure 6 The rotating part is a bearing, and the bearing can be a vacuum oil-free bearing to meet the requirements of vacuum coating. The outer ring 141 of the bearing is fixedly connected to the carrier plate 110, the inner ring 142 of the bearing is fixedly connected to the fixture 160, and the first driving member and the inner ring 142 of the bearing are driven by gears, so that the first driving member can drive the flat substrate 120 on the fixture 160 to achieve relatively stable rotation through the bearing. It should be understood that the first driving member in the present application can be a servo motor with adjustable speed.

[0046] In some embodiments, please continue to refer to Figure 6 , a receiving hole is provided on the carrier plate 110, and the bearing can be embedded in the receiving hole, so that the bearing can be accommodated by using the carrier plate 110, so that the present application can achieve the above effect by making a small improvement on the existing vertical coating device, effectively reducing the production cost. Figure 6 , the outer ring 141 of the bearing can be fixedly connected to the inner wall of the accommodating hole. In order to facilitate the driving connection between the first driving member and the inner ring 142 of the bearing, the inner ring 142 of the bearing can be extended along the axial direction of the accommodating hole so that the inner ring 142 of the bearing protrudes from the accommodating hole. As a result, the outer peripheral wall of the protruding part of the inner ring 142 of the bearing is exposed. Therefore, a gear part can be provided on the outer peripheral wall of the inner ring of the bearing protruding from the accommodating hole. At the same time, a driving gear 143 is provided on the driving shaft of the first driving member, and the driving gear 143 is meshed with the gear part for transmission.

[0047] In some embodiments, Figure 3As shown, the revolution mechanism 100 includes a second driving member (not shown in the figure) and a cylinder body arranged on the base. The cylinder body is arranged on the base and rotates around its own central axis 101. The carrier plate 110 is arranged on the peripheral wall of the cylinder body. The second driving member is connected to the cylinder body for driving. When the second driving member drives the cylinder body to rotate around its own central axis 101 along the rotation direction 102, it will drive the plane substrate 120 to realize revolution through the carrier plate 110 and the rotation mechanism, that is, the rotation axis of the revolution of the plane substrate 120 is the central axis 101.

[0048] In some embodiments, the cylinder can be in various forms such as a cylindrical cylinder, a prismatic cylinder, etc., for example Figure 3 As shown, the cylinder is a prismatic cylinder, and a hexagonal prismatic cylinder. Since its peripheral wall has six side walls, six carriers 110 can be provided. The six carriers 110 are distributed one by one on the side walls of the prismatic cylinder, thereby realizing continuous, large-scale and stable production of thin film products through the aforementioned implementation.

[0049] In some embodiments, the coating mechanism 130 is a magnetron sputtering mechanism, an evaporation mechanism, etc. Taking the magnetron sputtering mechanism as an example, it can include multiple components such as a target head, a target material, a magnetic field, and an electric field, so that when the electrons bombard the target material, the sputtered target material is deposited on the surface of the planar substrate 120. It should be understood that the present application does not limit the number of coating mechanisms 130, which can be multiple distributed around the periphery of the revolution mechanism 100, so as to achieve a higher rate of coating and improve production efficiency.

[0050] Through the above-mentioned implementation, the coating differentiation between the positions distributed on the same circumference with the rotation center as the center can be reduced, thereby improving the uniformity of the film layer on the surface of the existing planar substrate 120. However, it only improves the uniformity of the film layer at each position on the same circumference, and the improvement between the positions on adjacent circumferences is not obvious. Therefore, the surface of the film layer of the planar substrate 120 after coating is an inverted cone, for example Figure 4 As shown, the concentric circles with the position point O as the center, as the radius increases, the film thickness on the concentric circles is also thicker, thereby forming an inverted cone-shaped film surface. In view of this, the present application sets a correction leaf assembly 150 on the base to improve the difference in film thickness on two adjacent concentric circles, thereby effectively reducing the difference in film thickness at different positions on the surface of the planar substrate 120, further improving the uniformity of the film on the surface of the planar substrate 120, so that the film surface on the planar substrate 120 is relatively flat, improving the uniformity and yield of the product. The following will be further explained in conjunction with the accompanying drawings:

[0051] Reference Figure 3 , Figures 7 to 9The vertical coating device also includes a correction leaf assembly 150 arranged on the base. The correction leaf assembly 150 is located between the coating mechanism 130 and the planar substrate 120 and partially covers the coating area 131 of the coating mechanism 130. When the correction leaf assembly 150 covers the coating area 131, it can be adjusted according to the distribution of the film thickness on the planar substrate 120. For example, more areas can be covered at positions where the film thickness is originally thicker, and less areas can be covered at positions where the film thickness is originally thinner, so as to correct the uniformity of the film thickness on the surface of the planar substrate 120.

[0052] For example, refer to Figure 8 As shown, two concentric circles with position point O as the center on the surface of the planar substrate 120 respectively have position point D and position point E. The circumference with position point D is correspondingly covered by the first finger 152, and the circumference with position point E is correspondingly covered by the second finger 153. Since the circumference with position point D is closer to the coating mechanism 130 than the circumference with position point E, the film thickness at the circumference with position point D is greater than the film thickness at the circumference with position point E. Therefore, the length of the first finger 152 can be made greater than the length of the second finger 153, thereby reducing the difference in film thickness at the circumference with position point D and the film thickness at the circumference with position point E, achieving a reduction in the difference in film thickness at different circumferences, further improving the uniformity of the film layer on the surface of the planar substrate 120, thereby making the film layer surface on the planar substrate 120 smoother, and improving the uniformity and yield of the product.

[0053] Reference Figure 8 As shown, the correction leaf assembly 150 includes a plurality of fingers arranged in the same plane, and the plane in which the plurality of fingers are arranged is perpendicular to the rotation plane of the revolution mechanism 100. In view of the self-rotation of the planar substrate 120, as the radius of the concentric circles with the position point O as the center increases, the film thickness on the concentric circles is also thicker, thereby forming an inverted cone-shaped film surface. Therefore, the length W of each finger can be increased successively along the rotation center of the rotation mechanism outward. In other words, as the radius increases with the position point O as the center, the length W of the finger also increases.

[0054] It should be understood that the width H and number of the fingers can be adaptively set according to the uniformity of the final film layer. For example, when the width H of the fingers is narrower and the number of fingers is greater, the thickness uniformity of the film layer finally formed on the surface of the planar substrate 120 is better.

[0055] Of course, when the size of the planar substrate 120 is smaller, the width H of the corresponding finger strips should also be adaptively reduced.

[0056] Reference Figure 8 and Fig.10As shown, from the cycloid calculation formula, it can be known that the position of a point D on the circumference when it moves on the plane substrate 120 is a function of the radius r of the circumference. Through calculation, it can be known that: when the circle moves one circle (that is, the center O passes 2πr), the path traveled by the point D (a, b) on the circumference is 4 times the diameter of the circle, that is, 8 times r, where a = r (θ-sinθ), b = (1-cosθ).

[0057] According to the theoretical calculation, if Fig.11 As shown, if any point in the circular plane substrate 120 except the center is regarded as a point on the concentric circle of the center, then the path traveled by point E is 8r E , the path that point D travels is 8r D Therefore, the corrected leaf group takes the straight line through the center O as the central axis of symmetry, such as Figure 8 As shown, the length difference M between the first finger 152 corresponding to point D and the second finger 153 at point E is r D :r E , and the same applies to other points in the circle. Similarly, planar substrates 120 of other shapes can also be processed similarly.

[0058] Optional, such as Figure 7 As shown, the vertical coating device includes a set of correction leaf assemblies 150 , and the set of correction leaf assemblies 150 are distributed on one side of the coating area 131 .

[0059] Optional, such as Figure 8 As shown, the vertical coating device includes two sets of correction leaf assemblies 150 , and the two sets of correction leaf assemblies 150 are distributed on opposite sides of the coating area 131 .

[0060] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A vertical coating device, characterized in that: The invention comprises a base, a coating mechanism and a revolution mechanism rotatably arranged on the base, a carrier plate is arranged on the peripheral wall of the revolution mechanism, a rotation mechanism for placing a planar substrate is rotatably arranged on the carrier plate, a rotation plane of the revolution mechanism is perpendicular to a rotation plane of the rotation mechanism, and the coating mechanism is arranged on the base and corresponds to the planar substrate; The vertical coating device further comprises a correction leaf assembly disposed on the base, the correction leaf assembly being located between the coating mechanism and the planar substrate and partially covering the coating area of ​​the coating mechanism, and being used to correct the uniformity of the film thickness on the planar substrate surface; The correction leaf assembly comprises a plurality of fingers arranged in the same plane, the plane in which the plurality of fingers are arranged is perpendicular to the rotation plane of the revolution mechanism, and the length of each finger increases outwardly along the rotation center of the rotation mechanism; The length difference between adjacent fingers satisfies: M=r1:r2, wherein M is the length difference between adjacent fingers, r1 is the rotation radius of the corresponding circle of one finger on the plane substrate, and r2 is the rotation radius of the corresponding circle of another finger on the plane substrate.

2. The vertical coating device according to claim 1, characterized in that: The rotation mechanism includes a first driving member, a rotating member and a clamp for clamping the planar substrate, which is arranged on the carrier plate. The clamp is rotatably arranged on the carrier plate by the rotating member. The first driving member is connected to the clamp via the rotating member and is used to drive the clamp to rotate to drive the planar substrate to rotate.

3. The vertical coating device according to claim 2, characterized in that: The rotating member is a bearing, the outer ring of the bearing is fixedly connected to the carrier plate, the inner ring of the bearing is fixedly connected to the fixture, and the first driving member and the inner ring of the bearing are driven by gears.

4. The vertical coating device according to claim 3, characterized in that: A receiving hole is provided on the carrier plate, the bearing is embedded in the receiving hole, the outer ring of the bearing is fixedly connected to the inner wall of the receiving hole, the inner ring of the bearing protrudes from the receiving hole, and a gear part cooperating with the first driving member is provided on the outer peripheral wall where the inner ring of the bearing protrudes from the receiving hole.

5. The vertical coating device according to claim 1, characterized in that: The revolution mechanism includes a second driving member and a cylinder arranged on the base. The cylinder is arranged on the base and rotates around its own central axis. The carrier is arranged on the peripheral wall of the cylinder. The second driving member is drivingly connected to the cylinder and is used to drive the cylinder to drive the planar substrate to revolve.

6. The vertical coating device according to claim 5, characterized in that: The cylinder is a prismatic cylinder, and there are a plurality of carrier plates, which are distributed on the side walls of the prismatic cylinder in a one-to-one correspondence.

7. The vertical coating device according to claim 1, characterized in that: The coating mechanism is a magnetron sputtering mechanism.

8. The vertical coating device according to claim 1, characterized in that: The vertical coating device includes a group of the correction leaf assemblies, and the group of the correction leaf assemblies is distributed on one side of the coating area; or, the vertical coating device includes two groups of correction leaf assemblies, and the two groups of correction leaf assemblies are distributed on opposite sides of the coating area.

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