A 3D printing runner heat dissipation device based on a sensitive material

Abstract

The application discloses a 3D printing flow channel heat dissipation device based on sensitive material, which is printed on a circuit board by a 3D printing mode; the flow channel heat dissipation device comprises a fluid inlet, an inlet accumulation area, a micro-hole jet area, a chip heat dissipation area, a connecting pipe, an outlet accumulation area and a fluid outlet; coolant flows into the fluid inlet, passes through the inlet accumulation area, is sprayed out by the micro-hole jet area to a chip or an electronic component requiring high heat dissipation in the chip heat dissipation area, and then flows to the outlet accumulation area through the connecting pipe and flows out of the fluid outlet; the outer surface of a fluid area formed by the fluid inlet, the inlet accumulation area, the micro-hole jet area, the outlet accumulation area and the fluid outlet is covered with sensitive material and is used for adjusting heat transfer; the dielectric coolant can be directly contacted with electronic components for heat dissipation, the heat dissipation flow channel is directly printed on the circuit board by the 3D printing mode, and the heat dissipation flow channel has the characteristics of small volume, flexible arrangement and high heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of microelectronic heat dissipation, specifically a 3D-printed heat dissipation device based on sensitive materials. Background Technology

[0002] With the development of the microelectronics field, chip computing power has been greatly improved, and there are more and more high-power power electronic control units and distributed computing units. Correspondingly, the problem of the heat generated by electronic components per unit volume has increased dramatically. Traditional heat sinks often reduce the heat dissipation pressure by increasing the volume, which is contrary to the development of electronic components towards integration and miniaturization. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, the purpose of this invention is to provide a 3D-printed heat dissipation device based on sensitive materials. The heat dissipation device is printed on a circuit board using 3D printing. With customizable arrangement height, it has a smaller size and higher heat dissipation efficiency compared to traditional heat sinks.

[0004] A 3D-printed heat dissipation device based on a sensitive material is disclosed, which is printed onto a circuit board using 3D printing. The heat dissipation device includes a fluid inlet, an inlet accumulation zone, a micro-jet zone, a chip heat dissipation zone, a connecting pipe, an outlet accumulation zone, and a fluid outlet. Coolant flows in through the fluid inlet, passes through the inlet accumulation zone, and is ejected from the micro-jet zone onto the chip or electronic component requiring high heat dissipation in the chip heat dissipation zone. After cooling, the coolant flows through the connecting pipe to the outlet accumulation zone and exits through the fluid outlet. The outer surface of the fluid zone, which consists of the fluid inlet, inlet accumulation zone, micro-jet zone, outlet accumulation zone, and fluid outlet, is covered with a sensitive material for regulating heat transfer.

[0005] The outer surface of the fluid inlet is threaded and connects to the fluid pipe.

[0006] The inlet accumulation zone is equipped with a flow diversion mechanism to ensure that the fluid flows out uniformly from the microporous jet zone.

[0007] The connecting tube is designed to be printed at an angle upwards.

[0008] There are multiple connecting pipes to ensure uniform flow of coolant.

[0009] The outer surface of the fluid outlet is threaded and connects to the fluid pipeline.

[0010] The outer surface of the fluid domain is covered with a sensitive material, which consists of a thermally conductive layer and a sensitive material layer.

[0011] The main component of the sensitive material layer is hexagonal sulfide, which has the characteristic of abrupt change in thermal conductivity with temperature. It acts as a heat insulation layer at low temperatures and accelerates heat dissipation at high temperatures.

[0012] The beneficial effects of this invention are:

[0013] This invention proposes a 3D-printed heat dissipation device based on sensitive materials. Utilizing the characteristic that dielectric coolant can directly contact electronic components for heat dissipation, the heat dissipation channel is directly printed on the circuit board through 3D printing, achieving rapid heat dissipation under high heat flux density and efficient heat distribution. Compared with traditional heat sinks, it has the characteristics of small size, flexible layout, and high heat dissipation efficiency.

[0014] The flow channel is coated with a sensitive material that exhibits abrupt changes in thermal conductivity with temperature. This material acts as an insulation layer at low temperatures and accelerates heat dissipation at high temperatures. By combining multiple materials and 3D printing them into a heat dissipation flow channel, the thermal conductivity can be adjusted with temperature, enabling optimized heat sink design. Attached Figure Description

[0015] Figure 1 This is a perspective view of a 3D-printed flow channel heat dissipation device based on sensitive materials, as described in the present invention.

[0016] Figure 2 This is a schematic diagram of a 3D-printed heat dissipation device based on sensitive materials, as described in the present invention.

[0017] Figure 3 This is a schematic diagram of the flow channel domain of a 3D-printed flow channel heat dissipation device based on sensitive materials, as described in the present invention.

[0018] Figure 4 This is a schematic diagram of the flow channel material of a 3D-printed flow channel heat dissipation device based on sensitive materials, as described in the present invention.

[0019] Figure 5 This is a schematic diagram of the thermal conductivity characteristics of the sensitive material described in the device of the present invention.

[0020] Figure 6 This is a geometric model diagram of a 5G component in an application example.

[0021] In the figure: fluid inlet 1, inlet accumulation area 2, microporous jet area 3, chip heat dissipation area 4, connecting pipe 5, outlet accumulation area 6, fluid outlet 7, thermally conductive layer 1.1, sensitive material layer 1.2. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] like Figure 1The illustrated 3D-printed heat dissipation device based on a sensitive material utilizes the property that a dielectric coolant can directly contact electronic components for heat dissipation. The heat dissipation channels are directly printed onto the circuit board using 3D printing. Compared with traditional heat sinks, it features smaller size, more flexible layout, and higher heat dissipation efficiency. The channels are coated with a sensitive material, which exhibits abrupt changes in thermal conductivity with temperature, acting as an insulation layer at low temperatures and accelerating heat dissipation at high temperatures.

[0024] like Figure 1 As shown, a 3D printing flow channel heat dissipation device based on sensitive materials includes a fluid inlet 1, an inlet accumulation zone 2, a micro-perforated jet zone 3, a chip heat dissipation zone 4, a connecting pipe 5, an outlet accumulation zone 6, and a fluid outlet 7. Coolant flows in through the fluid inlet 1, passes through the inlet accumulation zone 2, and is sprayed out through the micro-perforated jet zone 3 onto the chip in the chip heat dissipation zone 4. After cooling the chip, it flows through the connecting pipe 5 to the outlet accumulation zone 6 and flows out through the fluid outlet 7.

[0025] Figure 3 The material arrangement diagram of the present invention shows that a sensitive material layer 1.2 is arranged outside the thermally conductive layer 1.1. By utilizing the property of the sensitive material that changes abruptly in thermal conductivity, the thermal conductivity can be controlled to change with temperature. Figure 4 The thermal conductivity characteristic curve of one of the sensitive materials, hexagonal sulfide, shows that its thermal conductivity is low in the low-temperature region, which realizes the heat preservation characteristics of the radiator; in the high-temperature region, its thermal conductivity increases abruptly, which accelerates heat dissipation and realizes self-regulating heat dissipation with temperature changes.

[0026] The outer surface of the fluid inlet 1 is threaded and connects to the fluid pipeline. Its purpose is to seal and fix it to prevent fluid leakage.

[0027] The inlet accumulation zone 2 has a flow-diverting mechanism to ensure that fluid flows out uniformly from the microporous jet zone 3.

[0028] The chip heat dissipation zone 4 is used to place chips or electronic components that require high heat dissipation. The specific placement and sealing method can be designed according to the shape of the part that needs heat dissipation.

[0029] The connecting pipe 5 is designed to be printed at an angle upward, the purpose of which is to allow the heat dissipation zone 4 to accumulate fluid so that the heat dissipation component can fully contact the fluid.

[0030] The multiple connecting pipes 5 ensure uniform flow of coolant and improve heat dissipation efficiency.

[0031] The outer surface of the fluid outlet 7 is threaded and is connected to the fluid pipeline.

[0032] The fluid domain is divided into a thermally conductive layer 1.1 and a sensitive material layer 1.2. The thermally conductive layer 1.1 is printed with a metal with high thermal conductivity, which can quickly remove the heat flow in the coolant.

[0033] The sensitive material layer 1.2 is printed from a material with variable thermal conductivity (such as hexagonal sulfide), which has the characteristic that the thermal conductivity changes abruptly with temperature. It can act as a heat insulation layer at low temperatures and accelerate heat dissipation at high temperatures.

[0034] Application Examples

[0035] This invention can be applied to the heat dissipation design of 5G base stations: In recent years, with the global deployment of 5G base stations, base stations account for approximately 80% of the power consumption in the mobile internet process. Furthermore, the dense deployment of 5G base stations results in even higher energy consumption. From a thermal management design perspective, the increased heat density per unit area of ​​the base station exacerbates the difficulty of thermal management. Real-world test data from major operators in recent years shows that 5G base stations consume 2.5 to 4 times more power than 4G base stations. The high heat density of the heat-generating components in 5G base stations means that if heat cannot be dissipated quickly, it will significantly affect communication efficiency and lifespan. Traditional heat sinks reduce heat dissipation pressure by increasing their size, which contradicts the trend towards integration and miniaturization of electronic components.

[0036] By utilizing additive manufacturing technology, the flow channel is innovatively printed directly onto the surface of the heat-generating chip. The dielectric coolant can directly contact the electronic components to efficiently remove heat from the heat source. The variable thermal conductivity of the sensitive material can act as an insulation layer at low temperatures and accelerate heat dissipation at high temperatures, making the invention adaptable to a wider temperature range and ensuring the efficient operation of electronic components even in extreme environments.

[0037] In obtaining geometric models of 5G components (such as...) Figure 6 Following this, the design, layout, and installation are carried out according to its specific form. Fluid inlet 1 connects to a cooling pipe, and a pump device guides the coolant into the inlet accumulation zone 2. A flow-diverting mechanism within this zone ensures the fluid flows uniformly out of the micro-jet zone 3. The chip heat dissipation zone 4 houses the high-heat-generating components of the 5G device. Coolant is uniformly sprayed into the micro-jet zone 3 for efficient heat dissipation on the chip. Connecting pipes 5 are printed with an upward-sloping design, allowing the coolant in the heat dissipation zone 4 to accumulate on the chip, thus ensuring full contact between the chip and the fluid. The high-temperature coolant flows uniformly out through multiple connecting pipes 5 to the annular outlet accumulation zone 6, and then out through the fluid outlet 7. The fluid zone is divided into a thermally conductive layer 1.1 and a sensitive material layer 1.2. The thermally conductive layer 1.1 is printed from a metal with high thermal conductivity, which can quickly dissipate heat from the coolant. The sensitive material layer 1.2 is printed from a material with variable thermal conductivity (such as hexagonal sulfide), which has the characteristic of abrupt changes in thermal conductivity with temperature. It can act as an insulation layer at low temperatures and accelerate heat dissipation at high temperatures.

[0038] This invention can control the high heat field of 5G base stations within a reasonable temperature range, reducing power consumption, extending lifespan, and enabling them to adapt to a wider temperature range. The characteristics of additive manufacturing provide conditions for its miniaturization, integration, and precision manufacturing, while achieving high material utilization, aligning with the green development strategy.

[0039] The embodiments described above can be further combined or replaced, and these embodiments are merely descriptions of preferred embodiments of the present invention, not limitations on the concept and scope of the present invention. Various changes and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the inventive concept are all within the protection scope of the present invention. The protection scope of the present invention is given by the appended claims and any equivalents.

Claims

1. A 3D-printed heat dissipation device based on a sensitive material, characterized in that: A flow channel heat dissipation device is printed on a circuit board using 3D printing. The flow channel heat dissipation device includes a fluid inlet (1), an inlet accumulation area (2), a micro-jet flow area (3), a chip heat dissipation area (4), a connecting pipe (5), an outlet accumulation area (6), and a fluid outlet (7). Coolant flows in from the fluid inlet (1), passes through the inlet accumulation area (2), and is sprayed out from the micro-jet flow area (3) onto the chip or electronic component requiring high heat dissipation in the chip heat dissipation area (4). After cooling, it flows through the connecting pipe (5) to the outlet accumulation area (6) and flows out from the fluid outlet (7). The outer surface of the fluid area, which is composed of the fluid inlet (1), the inlet accumulation area (2), the micro-jet flow area (3), the outlet accumulation area (6), and the fluid outlet (7), is covered with a sensitive material for regulating heat transfer. The outer surface of the fluid domain is covered with a sensitive material, which is divided into a thermally conductive layer (1.1) and a sensitive material layer (1.2). The main component of the sensitive material layer (1.2) is hexagonal sulfide, which has the characteristic that the thermal conductivity changes abruptly with temperature. It acts as a heat insulation layer at low temperatures and accelerates heat dissipation at high temperatures.

2. The 3D-printed heat dissipation device based on sensitive materials according to claim 1, characterized in that: The outer surface of the fluid inlet (1) is threaded and is connected to the fluid pipe.

3. The 3D-printed heat dissipation device based on sensitive materials according to claim 1, characterized in that: The inlet accumulation zone (2) is equipped with a flow diversion mechanism to enable fluid to flow out uniformly from the microporous jet zone (3).

4. The 3D-printed heat dissipation device based on sensitive materials according to claim 1, characterized in that: The connecting tube (5) is designed to be printed at an angle upwards.

5. A 3D-printed heat dissipation device based on a sensitive material according to claim 1, characterized in that: There are multiple connecting pipes (5) to ensure uniform flow of coolant.

6. The 3D-printed heat dissipation device based on sensitive materials according to claim 1, characterized in that: The outer surface of the fluid outlet (7) is threaded and connected to the fluid pipe.

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