Display device and method of manufacturing the same

Abstract

A display device and a method of manufacturing the same are provided. The method includes preparing a substrate in which an open area and a non-display area surrounding at least a portion of the open area are defined, forming an insulating layer on the substrate, the insulating layer having an opening corresponding to the open area and defining an irradiation area including a first area and a second area in the non-display area, forming a conductive pattern in the irradiation area, the conductive pattern covering the first area and exposing the second area, forming an organic material layer on the insulating layer and the conductive pattern, forming an electrode layer on the organic material layer, and removing the conductive pattern, the organic material layer in the irradiation area, and the electrode layer in the irradiation area by irradiating a laser beam to the irradiation area.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2021-0000986, filed on January 5, 2021, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments of this disclosure relate to a display device and a method of manufacturing the display device. Background Technology

[0003] In recent years, the use of display devices has become more diversified. Furthermore, as the thickness and weight of display devices are decreasing, their applications are expanding.

[0004] Various functions for connecting or linking to display devices have been added, and the area occupied by the display area in these devices has increased. As a method to add various functions while expanding the display area, research is underway to use a portion of the display area to provide functions beyond images. Summary of the Invention

[0005] One or more embodiments of this disclosure relate to a display device having at least one opening in a display area and a method of manufacturing the display device.

[0006] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0007] According to one or more embodiments of the present disclosure, a method of manufacturing a display device includes: preparing a substrate, defining an opening region and a non-display region surrounding (e.g., around) at least a portion of the opening region in the substrate; forming an insulating layer on the substrate, the insulating layer having an opening corresponding to the opening region and defining an irradiation region including a first region and a second region in the non-display region; forming a conductive pattern on the insulating layer in the irradiation region, the conductive pattern covering the first region of the insulating layer and exposing the second region of the insulating layer; forming an organic material layer on the insulating layer and the conductive pattern; forming an electrode layer on the organic material layer; and removing the conductive pattern, the organic material layer in the irradiation region, and the electrode layer in the irradiation region by irradiating the irradiation region of the insulating layer with a laser beam.

[0008] According to the example, the first region may include a plurality of line regions extending in a first direction and spaced apart from each other in a second direction. The second region may include a plurality of spaced regions extending in the first direction and spaced apart from each other in the second direction. The plurality of line regions and the plurality of spaced regions may be arranged alternately along the second direction.

[0009] According to the example, the irradiated area can have a closed curve shape extending in a first direction in a plan view (e.g., on a plane).

[0010] Based on the example, the planar shape of the irradiated area can be circular. The first direction can be the circumferential direction. The second direction can be the radial direction.

[0011] According to the example, the irradiated area can have a closed curve shape extending in a second direction in a plan view (e.g., on a plane).

[0012] Based on the example, the planar shape of the irradiated area can be circular. The second direction can be the circumferential direction. The first direction can be the radial direction.

[0013] As an example, the second region may include multiple point regions surrounded by the first region. The conductive pattern may have multiple openings exposing the multiple point regions.

[0014] According to the example, a display area may also be defined in the substrate. A non-display area may be located between the opening area and the display area. The method of manufacturing a display device may further include: forming a pixel circuit including transistors and capacitors on an insulating layer; forming pixel electrodes disposed in the display area and electrically connected to the pixel circuit; and forming an organic material layer on the pixel electrodes.

[0015] According to the example, pixel electrodes and conductive patterns can be formed using the same process and include the same conductive material.

[0016] According to the example, the step of irradiating an irradiation area of ​​an insulating layer with a laser beam may include: forming a first opening in an organic material layer that exposes at least a portion of the insulating layer; and forming a second opening in an electrode layer corresponding to the first opening.

[0017] According to the example, the method of manufacturing a display device may also include heat treatment of a first region of the insulating layer.

[0018] According to the example, the step of irradiating the irradiation area of ​​the insulating layer with a laser beam can be performed simultaneously (e.g., concurrently) with the step of heat-treating the first area of ​​the insulating layer.

[0019] According to the example, the method of manufacturing a display device may also include forming an encapsulation layer on the electrode layer, the encapsulation layer including an inorganic encapsulation layer and an organic encapsulation layer.

[0020] According to the example, the inorganic encapsulation layer can contact the upper surface of the irradiated area of ​​the insulating layer and the sidewall of the organic material layer, which is formed by removing the organic material layer in the irradiated area.

[0021] According to the example, the method of manufacturing a display device may further include forming a plurality of dams arranged in a non-display area of ​​a substrate, wherein conductive patterns may be arranged between the plurality of dams.

[0022] According to one or more embodiments of this disclosure, a display device includes: a substrate having an opening region, a display region surrounding (e.g., around) at least a portion of the opening region, and a non-display region between the opening region and the display region; an insulating layer on the substrate having an opening corresponding to the opening region and defining a plurality of irradiation regions and a plurality of dam regions in the non-display region; an organic material layer on the insulating layer and exposing at least a portion of each of the plurality of irradiation regions of the insulating layer; and a plurality of dams, respectively disposed in the plurality of dam regions of the insulating layer. The plurality of irradiation regions and the plurality of dam regions extend in a first direction and are arranged alternately to each other along a second direction intersecting the first direction. Each of the plurality of irradiation regions includes a first region and a second region. Through thermal conductivity treatment, the first region has a higher film density than the second region.

[0023] According to the example, each of the plurality of irradiation areas and the plurality of dam areas may have a closed curve shape extending in a first direction in a plan view (e.g., on a plane).

[0024] According to the example, the first region may include multiple line regions extending upward in a third direction and spaced apart from each other in a fourth direction intersecting the third direction. The second region may include multiple spaced regions extending upward in a third direction and spaced apart from each other in a fourth direction. The multiple line regions and the multiple spaced regions may be arranged alternately along the fourth direction.

[0025] According to the example, the second region may include multiple point regions surrounded by the first region.

[0026] According to the example, the insulating layer may have trenches corresponding to the first region.

[0027] These and / or other aspects will become apparent and more readily understood from the following description of embodiments in conjunction with the accompanying drawings.

[0028] These general and specific embodiments can be implemented using systems, methods, software (e.g., computer programs) or combinations thereof. Attached Figure Description

[0029] The above and other aspects and features of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 This is a perspective view of an electronic device according to an embodiment;

[0031] Figure 2 It is along Figure 1 A cross-sectional view of the electronic device taken by line I-I';

[0032] Figure 3 This is a plan view of a display device according to an embodiment;

[0033] Figure 4 This is an equivalent circuit diagram of a pixel of a display device according to an embodiment;

[0034] Figure 5A This is an enlarged plan view of a portion of the display device according to an embodiment;

[0035] Figure 5B yes Figure 5A An enlarged plan view of a portion;

[0036] Figure 6A It is along Figure 5A A cross-sectional view of a portion of the display device, taken by line II-II';

[0037] Figure 6B yes Figure 6A An enlarged plan view of a portion;

[0038] Figure 7 This is an enlarged cross-sectional view of a display device according to another embodiment;

[0039] Figure 8 This is an enlarged plan view of a display device according to another embodiment;

[0040] Figure 9 This is an enlarged plan view of a display device according to another embodiment;

[0041] Figure 10 This is an enlarged plan view of a display device according to another embodiment;

[0042] Figures 11A to 11D These are cross-sectional views showing a method of manufacturing a display device according to an embodiment;

[0043] Figure 12 This is an enlarged plan view of the conductive pattern according to an embodiment;

[0044] Figure 13 This is an enlarged plan view of the conductive pattern according to another embodiment;

[0045] Figure 14 It is an enlarged plan view of a conductive pattern according to another embodiment; and

[0046] Figure 15 This is an enlarged plan view of the conductive pattern according to another embodiment. Detailed Implementation

[0047] Referring now to embodiments in detail, examples of which are shown in the accompanying drawings. The same reference numerals throughout denote the same elements. In this regard, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to explain aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0048] Because this disclosure can have various modified embodiments, certain embodiments are shown in the accompanying drawings and described in the detailed description. The advantages and features of this disclosure, and methods of implementation thereof, will be elucidated by referring to the following embodiments described with reference to the accompanying drawings. However, this disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0049] In the following description, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. The same reference numerals are used to denote the same elements, and repeated descriptions thereof will be omitted.

[0050] It will be understood that while the terms “first,” “second,” etc., may be used here to describe various elements, these elements should not be limited by these terms.

[0051] As used herein, unless the context clearly indicates otherwise, the singular forms “a (kind)” and “the” are also intended to include the plural forms.

[0052] It will also be understood that the terms “comprising,” “including,” and / or variations thereof, as used herein, indicate the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0053] Furthermore, when describing embodiments of this disclosure, the use of "may" indicates "one or more embodiments of this disclosure".

[0054] It will be understood that when an element is referred to as being "on" another element, "connected to" or "joined to" another element, it can be directly on, directly connected to or directly joined to the other element, or there may be one or more intermediary elements. When an element is referred to as being "directly on" another element, "directly connected to" or "directly joined to" another element, there are no intermediary elements.

[0055] In the accompanying drawings, for clarity, the relative dimensions of elements, layers, and regions may be exaggerated and / or simplified. For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” “upper,” “bottom,” and “top” may be used herein to describe the relationship of one element or feature as shown in the drawings to another element or feature. It will be understood that spatial relative terms are intended to include different orientations of the device in use or operation other than those depicted in the drawings. For example, if the device in the drawings is rotated, an element described as “below” or “under” another element or feature will then be oriented as “above” or “above” said other element or feature. Thus, the term “below” can encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0056] It will be understood that when a layer, region, or component is referred to as being “formed on” another layer, region, or component, it can be formed directly or indirectly on said other layer, region, or component. That is, for example, an intermediary layer, region, or component may exist.

[0057] For ease of explanation, the dimensions of the elements in the accompanying drawings may be exaggerated. In other words, since the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0058] When an embodiment can be implemented differently, a particular process sequence can be performed in a different order than that described. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0059] In the specification, the term "A and / or B" refers to A or B, or the case of A and B. In the specification, the term "at least one of A and B" refers to A or B, or the case of A and B.

[0060] It will be understood that when a layer, region, or component is connected to another part, the layer, region, or component can be directly connected to said part, and / or there may be an intermediary layer, region, or component that allows the layer, region, or component to be indirectly connected to said part. For example, when a layer, region, or component is electrically connected to another part, the layer, region, or component can be directly electrically connected to said part, and / or can be indirectly connected to said part through another layer, region, or component.

[0061] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0062] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0063] Figure 1 This is a perspective view of electronic device 1 according to an embodiment.

[0064] Reference Figure 1 Electronic device 1 is a device for displaying moving or still images and can be used as a display screen for various products (such as televisions, laptops, monitors, billboards and Internet of Things (IoT) devices) and portable electronic devices (such as mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices and ultra-mobile PCs (UMPCs)).

[0065] Additionally, the electronic device 1 according to the embodiment can be used in wearable devices such as smartwatches, smartwatch phones, glasses displays, and head-mounted displays (HMDs).

[0066] According to another embodiment, the electronic device 1 can be used as a vehicle's dashboard, a central information display (CID) on the vehicle's central dashboard or central instrument panel, an interior mirror display replacing the vehicle's side mirrors, and a display screen on the rear surface of the front seats as an entertainment system for the rear seats of the vehicle. Figure 1 In this context, for ease of description, the electronic device 1 according to the embodiment is used as a smartphone.

[0067] In a plan view (e.g., on a plane defined by the ±x and ±y directions), electronic device 1 can be formed in a rectangular shape. For example, as Figure 1As shown, electronic device 1 can have a rectangular planar shape with a short side in the ±x direction and a long side in the ±y direction. The corner where the short side in the ±x direction and the long side in the ±y direction intersect can be rounded (e.g., curved) to have a certain curvature, or it can be formed as a right angle. The planar shape of electronic device 1 is not limited to a rectangular shape, and electronic device 1 can be formed in another polygonal shape, elliptical shape, or irregular shape.

[0068] Electronic device 1 may include an opening region OA and a display region DA surrounding (e.g., at least partially surrounding) the opening region OA. Electronic device 1 may include a non-display region NDA between the opening region OA and the display region DA, and a peripheral region PA surrounding (e.g., at least partially surrounding) the display region DA.

[0069] The opening area OA can be located inside the display area DA. In an embodiment, such as... Figure 1 As shown, the opening area OA can be located on the upper left side or the upper left side of the display area DA. Optionally, the opening area OA can be arranged differently in a suitable manner, such as in the center of the display area DA or on the upper right side of the display area DA. In the plan view of this specification, "left," "right," "top," and "bottom" indicate the directions when viewed from the vertical direction of the electronic device 1. For example, "left" refers to the -x direction, "right" refers to the +x direction, "top" refers to the +y direction, and "bottom" refers to the -y direction. Figure 1 In this embodiment, an opening area OA is arranged, but in another embodiment, multiple opening areas OA can be set.

[0070] Figure 2 It is along Figure 1 A cross-sectional view of electronic device 1 taken by line I-I'.

[0071] Reference Figure 2 The electronic device 1 may include a display device 10 and a component 70 arranged in an opening region OA of the display device 10. The display device 10 and the component 70 may be housed in a housing HS.

[0072] The display device 10 may include a display element layer 20, an input sensing layer 40, an optical function layer 50, and a cover window 60.

[0073] Display element layer 20 may include display elements (or light-emitting elements) that emit light to display images. The display elements may include light-emitting diodes (such as organic light-emitting diodes including an organic light-emitting layer).

[0074] In another embodiment, the light-emitting diode (LED) may be an inorganic LED comprising inorganic materials. An inorganic LED may include a PN junction diode comprising an inorganic semiconductor base material. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons are injected, and the energy generated by the recombination of holes and electrons is converted into light energy to emit light of a specific color. Inorganic LEDs may have a width of several micrometers to several hundred micrometers, and in some embodiments, they may be referred to as microLEDs. In another embodiment, the display element layer 20 may include a quantum dot LED.

[0075] In other words, the light-emitting layer of the display element layer 20 may include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, and / or inorganic materials and quantum dots.

[0076] The input sensing layer 40 can obtain coordinate information based on external input (e.g., a touch event). The input sensing layer 40 may include sensing electrodes (or touch electrodes) and traces connected to the sensing electrodes. The input sensing layer 40 may be located on the display element layer 20. The input sensing layer 40 may use a mutual capacitance method and / or a self-capacitance method to detect external input.

[0077] The input sensing layer 40 can be formed on the display element layer 20 (e.g., directly on the display element layer 20), or it can be formed separately and then bonded to the display element layer 20 by an adhesive layer (OCA) such as an optically clear adhesive. For example, the input sensing layer 40 can be formed sequentially after the process of forming the display element layer 20, in which case the adhesive layer may not be between the input sensing layer 40 and the display element layer 20. Although Figure 2 The diagram shows an input sensing layer 40 located between the display element layer 20 and the optical functional layer 50. However, in another embodiment, the optical functional layer 50 may be located between the display element layer 20 and the input sensing layer 40. In another embodiment, the input sensing layer 40 may be located on the optical functional layer 50.

[0078] The optical functional layer 50 may include an anti-reflective layer. The anti-reflective layer reduces the reflectivity of light (e.g., external light) incident on the display device 10 from the outside through the cover window 60. The anti-reflective layer may include a retarder and a polarizer. The retarder may be film-type (e.g., a film) or liquid crystal coating-type (e.g., a liquid crystal coating). The polarizer may also be film-type (e.g., a film) or liquid crystal coating-type (e.g., a liquid crystal coating). Film-type polarizers may include stretched synthetic resin films, and liquid crystal coating-type polarizers may include liquid crystals arranged in a specific configuration.

[0079] In another embodiment, the antireflective layer may include a black matrix and color filters. The color filters can be arranged considering the color of light emitted from each of the light-emitting diodes in the display element layer 20. In another embodiment, the antireflective layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer on respective layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can destructively interfere (e.g., destructively interfere with each other), thus reducing external light reflectivity.

[0080] The optical functional layer 50 may include a lens layer. The lens layer may improve the luminous efficiency of light emitted from the display element layer 20, or may reduce color deviation. The lens layer may include a layer having a concave lens shape or a convex lens shape, and / or may include multiple layers having different refractive indices. The optical functional layer 50 may include all or any one of the aforementioned anti-reflective layer and lens layer.

[0081] The display device 10 may include an opening 10H comprising a first opening 20H, a second opening 40H, and / or a third opening 50H. In this regard, Figure 2 The display element layer 20, the input sensing layer 40 and the optical function layer 50 are shown to each include a first opening to a third opening (first opening 20H, second opening 40H and third opening 50H), and the first opening 20H, the second opening 40H and the third opening 50H are stacked on top of each other.

[0082] The first opening 20H can penetrate from the upper surface of the display element layer 20 to its bottom surface, the second opening 40H can penetrate from the upper surface of the input sensing layer 40 to its bottom surface, and the third opening 50H can penetrate from the upper surface of the optical functional layer 50 to its bottom surface. For example, the first opening 20H can extend through the display element layer 20, the second opening 40H can extend through the input sensing layer 40, and the third opening 50H can extend through the optical functional layer 50.

[0083] The first opening 20H, the second opening 40H, and the third opening 50H of opening 10H can be stacked on top of each other in the opening region OA. Two or more of the first opening 20H, the second opening 40H, and the third opening 50H can have the same size (or diameter) as each other. As another example, the size (or diameter) of the first opening 20H, the second opening 40H, and the third opening 50H can be different from each other.

[0084] In another embodiment, at least one of the display element layer 20, the input sensing layer 40, and the optical functional layer 50 may not include an opening. For example, any one or both of the display element layer 20, the input sensing layer 40, and the optical functional layer 50 may not include an opening.

[0085] Cover window 60 may be on optical functional layer 50. Cover window 60 may be bonded to optical functional layer 50 via an adhesive layer OCA between cover window 60 and optical functional layer 50. Cover window 60 may include glass or plastic materials. Plastic materials may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate.

[0086] Covering window 60 may include a flexible window. For example, covering window 60 may include a polyimide window or an ultra-thin glass window.

[0087] The opening area OA can be a component area (e.g., a sensor area, a camera area, a speaker area, etc.) in which components 70 for adding various suitable functions to the electronic device 1 are located. The components 70 can be arranged to overlap with the opening 10H of the display device 10.

[0088] Component 70 may include electronic components. For example, component 70 may be an electronic component that uses light or sound. For example, electronic components may include a light-using sensor (such as an infrared sensor), a camera that captures images by receiving light, a sensor that outputs and detects light or sound to measure distance or identify fingerprints, a small light that outputs light, and a speaker that outputs sound, etc.

[0089] Electronic components that use light can utilize light of various suitable wavelengths, such as visible light, infrared light, and ultraviolet light. The opening region OA can be a transmission area through which light and / or sound emitted from component 70 or traveling from the outside toward the electronic component can pass.

[0090] In another embodiment, when the electronic device 1 is used as a smartwatch or a vehicle dashboard, component 70 may be a member including a clock hand or a pointer indicating certain information (e.g., vehicle speed, etc.). In this case, with Figure 2 As shown, the cover window 60 may include an opening located in the opening region OA, allowing the pointer-shaped component 70 to be exposed to the outside. However, this disclosure is not limited thereto. For example, even when the electronic device 1 includes a component 70 such as a speaker, the cover window 60 may include an opening corresponding to the opening region OA.

[0091] Figure 3 This is a plan view of the display device 10 according to an embodiment.

[0092] Reference Figure 3The display device 10 may include an opening area OA, a display area DA, a non-display area NDA, and a peripheral area PA. The display device 10 may include a plurality of pixels PX arranged in the display area DA, and may display an image using light (e.g., red, green, and / or blue light) emitted from a light-emitting diode in each of the pixels PX.

[0093] Since the display device 10 includes a substrate 100, it can be said that the substrate 100 includes (or defines) an opening area OA, a display area DA, a non-display area NDA, and a peripheral area PA.

[0094] Each of the light-emitting diodes in a pixel PX may include the following, as will be referred to below. Figure 4 The organic light-emitting diode (OLED) is described, and each OLED can be connected (e.g., electrically connected) to a pixel circuit PC. Figure 4 The light-emitting diodes shown include organic light-emitting diodes (OLEDs), but as another embodiment, as described above, the display device 10 may include the inorganic light-emitting diodes described above, instead of organic light-emitting diodes (OLEDs).

[0095] The non-display area NDA may surround (e.g., encircle) at least a portion of the opening area OA. The non-display area NDA is the region in which no display element, such as an organic light-emitting diode (OLED), is disposed. Traces providing signals to pixels PX disposed around the opening area OA may pass through the non-display area NDA. For example, as... Figure 3 As shown, the data line DL and / or the scan line SL traverse the display area DA in the ±y direction and / or the ±x direction, but a portion of the data line DL and / or a portion of the scan line SL can bypass the opening area OA by extending along the edge of the opening 10H formed in the opening area OA of the display device 10 through the non-display area NDA.

[0096] A scan driver 2100 that provides a scan signal to each pixel PX, a data driver 2200 that provides a data signal to each pixel PX, and a driver that provides a drive voltage ELVDD (e.g., see...) Figure 4 ) and common voltage ELVSS (for example, see Figure 4 The first and second main power lines can be arranged in the peripheral area PA.

[0097] Figure 3The data driver 2200 is shown adjacent to one side of the substrate 100. According to another embodiment, the data driver 2200 may be on a printed circuit board that is connected (e.g., electrically connected) to a pad (or “soldering pad”) on or at one side of the display device 10. The printed circuit board may be flexible, and a portion of the printed circuit board may be bent to lie below or facing the rear surface of the substrate 100.

[0098] Figure 4 This is an equivalent circuit diagram of a pixel PX of the display device 10 according to an embodiment.

[0099] Reference Figure 4 The pixel PX may include a pixel circuit PC connected to the scan line SL and the data line DL, and an organic light-emitting diode (OLED) connected to the pixel circuit PC.

[0100] The pixel circuit PC may include a driving transistor T1, a scanning transistor T2, and a storage capacitor Cst. The driving transistor T1 and the scanning transistor T2 may be thin-film transistors.

[0101] The scan transistor T2 is connected to the scan line SL and the data line DL, and can transmit the data voltage Dm input through the data line DL to the drive transistor T1 in sync with the scan signal Sn input through the scan line SL.

[0102] The storage capacitor Cst is connected to the scan transistor T2 and the drive voltage line PL, and can store the voltage corresponding to the difference between the data voltage Dm received from the scan transistor T2 and the drive voltage ELVDD supplied to the drive voltage line PL.

[0103] The driving transistor T1 is connected to the driving voltage line PL and the storage capacitor Cst, and can control the magnitude of the driving current flowing from the driving voltage line PL through the organic light-emitting diode (OLED) in response to the voltage value stored in the storage capacitor Cst. The OLED can emit light with a brightness or luminance corresponding to the magnitude of the driving current.

[0104] Reference Figure 4 An example in which the pixel circuit PC includes two transistors and one storage capacitor has been described, but this disclosure is not limited thereto. For example, the pixel circuit PC may include three or more transistors and / or two or more storage capacitors. In an embodiment, the pixel circuit PC may include seven transistors and one storage capacitor.

[0105] Figure 5A This is an enlarged plan view of a portion of the display device 10 according to an embodiment. Figure 5B yes Figure 5AA magnified plan view of a portion of it. More detailed... Figure 5A This is an enlarged view of the opening area OA of the display device 10 and the periphery of the opening area OA. Figure 5B This is an enlarged view of a portion of the irradiated area IR of the non-display area NDA.

[0106] Reference Figure 5A The display device 10 may include an opening region OA, a display region DA surrounding (e.g., around) the opening region OA, and a non-display region NDA between the opening region OA and the display region DA. Figure 5A In the diagram, the display area DA is shown as surrounding (e.g., around) the entire outer edge of the opening area OA, but the display area DA may surround (e.g., around) a portion of the outer edge of the opening area OA. That is, the display area DA may surround (e.g., around) at least a portion of the opening area OA.

[0107] The display device 10 may include an insulating layer 201. The insulating layer 201 may be on a substrate 100. The insulating layer 201 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, and / or silicon oxide, and may include a single layer or multiple layers comprising the aforementioned inorganic insulating material. The insulating layer 201 may have an opening 201H corresponding to the opening region OA.

[0108] In an embodiment, the display device 10 may include a plurality of illumination regions IR and a plurality of dam regions DR in the non-display region NDA. Similarly, the insulating layer 201 may include a plurality of illumination regions IR and a plurality of dam regions DR in the non-display region NDA. As described below Figure 11B As shown, the irradiation area IR can be the area irradiated by the laser beam.

[0109] Figure 5A The diagram shows that the corresponding width of the irradiation area IR is the same as the corresponding width of the dam area DR, but as another example, the corresponding width of the irradiation area IR and the corresponding width of the dam area DR can be different from each other.

[0110] in addition, Figure 5A Three illumination regions IR and three dam regions DR are shown in the non-display area NDA, but the number of illumination regions IR and dam regions DR can be appropriately varied. For example, the number of illumination regions IR and the number of dam regions DR can be different from each other. For example, the illumination regions IR can be further defined in the insulating layer 201 between the third dam region DR3 and the opening region OA, such that four illumination regions IR and three dam regions DR can be included in the non-display area NDA. Therefore, in this embodiment, each of the plurality of dam regions DR can be between adjacent illumination regions IR.

[0111] The irradiation area IR and the dam area DR can be in the first direction DIR1 (e.g., see...). Figure 5B The irradiation area IR and the dam area DR can both have a closed curve shape extending along the first direction DIR1 in the plan view. For example, as... Figure 5A As shown, the planar shape of the irradiation area IR and the planar shape of the dam area DR can be circular (e.g., annular). In this case, the first direction DIR1 can be the circumferential direction. Figure 5A The planar shapes of the irradiation area IR and the dam area DR are shown in circular shapes, but the planar shapes of the irradiation area IR and the dam area DR can be formed in polygonal, elliptical, or irregular shapes.

[0112] The irradiation area IR and the dam area DR can be along the second direction DIR2 (e.g., see...). Figure 5B They are arranged alternately. When the planar shape of the irradiation area IR and the planar shape of the dam area DR are circular, the second direction DIR2 can be radial. For example, as... Figure 5A As shown, a first dam region DR1, which is one of the dam regions DR, can be located between two adjacent first irradiation regions IR1 and IR2 in the second direction DIR2 within the irradiation region IR. A second dam region DR2, which is one of the dam regions DR, can be located between two adjacent second irradiation regions IR2 and IR3 in the second direction DIR2 within the irradiation region IR. A third dam region DR3, which is one of the dam regions DR, can be located between the third irradiation region IR3 and the opening region OA. In an embodiment, the irradiation region IR and the dam region DR can be spaced apart from each other in the second direction DIR2.

[0113] Refer to a portion of the magnified IR area of ​​the irradiation region. Figure 5B The irradiation area IR may include a first area AR1 and a second area AR2. In this case, the first area AR1 may be a heat conduction treatment area. Due to heat conduction treatment or thermal conductivity treatment, the first area AR1 (e.g., the portion of insulating layer 201 corresponding to the first area AR1) may have different physical and / or chemical properties than the second area AR2 (e.g., the portion of insulating layer 201 corresponding to the second area AR2). For example, the amount of hydrogen gas, the amount of carbon gas, or the film density of the first area AR1 may differ from the amount of hydrogen gas, the amount of carbon gas, or the film density of the second area AR2.

[0114] In this embodiment, since the first region AR1 is a heat conduction processing region, the amount of hydrogen gas in the first region AR1 can be less than the amount of hydrogen gas in the second region AR2. Optionally, the amount of carbon gas in the first region AR1 can be less than the amount of carbon gas in the second region AR2.

[0115] In another embodiment, due to heat conduction processing, the first region AR1 can have a higher film density than the second region AR2. In this case, the insulating layer 201 can have a partially high film density and can effectively block impurities or foreign matter introduced from the outside.

[0116] As will be described below Figure 11A As shown, the conductive pattern CP can be arranged in the first region AR1, but may not be arranged in the second region AR2. A laser beam can be irradiated or guided to the irradiation region IR, and the laser beam penetrating the insulating layer 201 can reach the conductive pattern CP in the first region AR1. Heat can be transferred through the conductive pattern CP heated by the laser beam to the first region AR1 of the insulating layer 201 that is in contact with the conductive pattern CP. In other words, the first region AR1 of the insulating layer 201 can receive heat radiated by the laser beam and heat conducted by the conductive pattern CP.

[0117] On the other hand, since the conductive pattern CP is not disposed in the second region AR2 on the insulating layer 201, the second region AR2 of the insulating layer 201 does not receive the heat conducted due to the conductive pattern CP. Therefore, the first region AR1 (e.g., the portion of the insulating layer 201 corresponding to the first region AR1) that has undergone heat conduction treatment by the heated conductive pattern CP may have different physical and / or chemical properties than the second region AR2 (e.g., the portion of the insulating layer 201 corresponding to the second region AR2).

[0118] In an embodiment, the first region AR1 may include multiple line regions LA, and the second region AR2 may include multiple interval regions SA.

[0119] Line regions LA may extend along the first direction DIR1 and may be arranged to be separated from or spaced apart from each other along the second direction DIR2. Spacer regions SA may extend along the first direction DIR1 and may be arranged to be separated from or spaced apart from each other along the second direction DIR2. Line regions LA and spacer regions SA may be arranged alternately along the second direction DIR2.

[0120] As described above, when the planar shape of the irradiation area IR is circular, the planar shapes of the first region AR1 and the second region AR2 forming the irradiation area IR can also be circular. In this case, the first direction DIR1 can be the circumferential direction, and the second direction DIR2 can be the radial direction.

[0121] Figure 5B The diagram illustrates a first region AR1 and a second region AR2 of an illumination region IR, each comprising a line region LA extending along a first direction DIR1 and a spacer region SA, respectively. However, this is merely an embodiment, and the shapes of the first region AR1 and the second region AR2 of the illumination region IR can be suitably modified. For example, the extending direction of the first region AR1 may differ from the extending direction of the second region AR2, or the first region AR1 may surround (e.g., encircle) the second region AR2. (Refer to...) Figures 8 to 10 The specific implementation method is described below.

[0122] At the same time, refer to again Figure 5A Multiple dam DAMs can be arranged separately within the dam area DR. For example, such as... Figure 5A As shown, the first dam DAM1 can be in the first dam area DR1, the second dam DAM2 can be in the second dam area DR2, and the third dam DAM3 can be in the third dam area DR3. Figure 5A Three dam DAMs are shown in the non-display area NDA, but the number of dam DAMs in the non-display area NDA can be changed appropriately.

[0123] Figure 6A It is along Figure 5A A cross-sectional view of a portion of the display device 10, taken by line II-II'. Figure 6B It is shown schematically. Figure 6A Enlarged plan view of part III.

[0124] For ease of description, Figure 6A By omitting the optical functional layer 50 in the display device 10 (for example, see...) Figure 2 ) and cover window 60 (for example, see Figure 2 The diagram shows a display element layer 20 and an input sensing layer 40 on the display element layer 20. The display element layer 20 includes light-emitting diodes disposed on the substrate 100 to correspond to the display area DA, and in this regard, Figure 6A An organic light-emitting diode (OLED) is shown.

[0125] The display device 10 may include an opening 10H in the opening region OA. The opening 10H may have the shape of a through hole penetrating the upper and lower surfaces of the display device 10.

[0126] The inclusion of an opening 10H in the opening region OA of the display device 10 can indicate that multiple layers included in the display device 10 also include openings in the opening region OA. The substrate 100 may include an opening 100H in the opening region OA, and the opening 100H of the substrate 100 has the shape of a through-hole penetrating the upper and lower surfaces of the substrate 100. Similarly, the insulating layer 201 on the substrate 100 may include an opening 201H in the opening region OA, and the opening 201H of the insulating layer 201 has the shape of a through-hole penetrating the upper and lower surfaces of the insulating layer 201. The display element layer 20, which includes layers disposed on the substrate 100, may include a first opening 20H with a through-hole shape located in the opening region OA, and the input sensing layer 40 may include a second opening 40H with a through-hole shape located in the opening region OA. In embodiments, the opening 10H may include opening 100H, opening 201H, first opening 20H, and / or second opening 40H.

[0127] Figure 6A The substrate 100, insulating layer 201, display element layer 20 and input sensing layer 40 are shown to each include an opening located in the opening region OA, but at least one of the substrate 100, insulating layer 201, display element layer 20 and input sensing layer 40 may not include an opening.

[0128] In the embodiments, as referred to above Figure 5A As described, the insulating layer 201 may include an irradiation area IR and a dam area DR in the non-display area NDA. Each of the irradiation areas IR is the area irradiated thereby by a laser beam during the manufacture of the display device 10, and may include a first area AR1 and a second area AR2. The dam area DR may be arranged in the dam area DR.

[0129] The display device 10 may include an organic material layer 222o and a second electrode 223 (e.g., an electrode layer). The organic material layer 222o may be disposed on an insulating layer 201, and the second electrode 223 may be disposed on the organic material layer 222o. In this case, the organic material layer 222o may have a first opening 222oh that exposes at least a portion of each of the irradiation regions IR of the insulating layer 201. The second electrode 223 may have a second opening 223oh that corresponds to the first opening 222oh. The first opening 222oh and the second opening 223oh may be stacked on top of each other (e.g., in the thickness direction of the insulating layer 201).

[0130] In the following text, it will be based on Figure 6A and Figure 6B The stacking order shown is described in more detail for the display device 10 according to an embodiment.

[0131] First, watch Figure 6AThe display area DA, the pixel circuit PC can be on the substrate 100, and the organic light-emitting diode OLED can be on the pixel circuit PC and / or connected to the pixel circuit PC.

[0132] The substrate 100 may comprise a glass material or a polymer resin. For example, the polymer resin may comprise polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 comprising the polymer resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure comprising a layer containing the aforementioned polymer resin and an inorganic layer.

[0133] The insulating layer 201 may be on the upper surface of the substrate 100. The insulating layer 201 may include a buffer layer, a barrier layer, or a combination of both. The insulating layer 201 may prevent or substantially prevent impurities from penetrating into the semiconductor layer Act of the thin-film transistor (TFT). The insulating layer 201 may include inorganic insulating materials such as silicon nitride, silicon oxynitride, and silicon oxide, and may comprise a single layer or multiple layers containing the aforementioned inorganic insulating materials.

[0134] The pixel circuit PC can be located on the insulating layer 201. The pixel circuit PC includes a thin-film transistor (TFT) and a storage capacitor Cst. The thin-film transistor (TFT) can include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. Figure 6A The illustration shows a top-gate transistor in which the gate electrode GE is above the semiconductor layer Act and the gate insulating layer 203 is between the gate electrode GE and the semiconductor layer Act. However, according to another embodiment, the thin-film transistor (TFT) can also be a bottom-gate transistor.

[0135] The semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may be formed as a single layer or multiple layers comprising the above materials.

[0136] The gate insulating layer 203 between the semiconductor layer Act and the gate electrode GE may include inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and hafnium oxide. The gate insulating layer 203 may include a single layer or multiple layers containing the above materials.

[0137] The source electrode SE and drain electrode DE may include conductive materials (e.g., materials with good conductivity). The source electrode SE and drain electrode DE may include conductive materials comprising Mo, Al, Cu, or Ti, and may be formed as a single layer or multiple layers comprising the aforementioned materials. In embodiments, the source electrode SE and drain electrode DE may include multiple layers such as Ti layers, Al layers, and Ti layers (Ti / Al / Ti).

[0138] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2 stacked on top of each other, with a first interlayer insulating layer 205 between the lower electrode CE1 and the upper electrode CE2. The storage capacitor Cst may be stacked with a thin-film transistor (TFT). In this regard, Figure 6A The diagram illustrates the use of the gate electrode GE of a thin-film transistor (TFT) as the lower electrode CE1 of a storage capacitor Cst. In another embodiment, the storage capacitor Cst may not be stacked with the TFT, and the gate electrode GE of the TFT and the lower electrode CE1 of the storage capacitor Cst may be formed separately. The storage capacitor Cst may be covered by a second interlayer insulating layer 207.

[0139] The lower electrode CE1 and / or upper electrode CE2 of the storage capacitor Cst may include a conductive material containing Mo, Al, Cu or Ti, and may be formed as a single layer or multiple layers including the above materials.

[0140] The first interlayer insulation layer 205 and the second interlayer insulation layer 207 may comprise inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, or hafnium oxide. The first interlayer insulation layer 205 and the second interlayer insulation layer 207 may comprise a single layer or multiple layers containing the aforementioned materials. Optionally, the first interlayer insulation layer 205 and the second interlayer insulation layer 207 may comprise organic insulating materials. Organic insulating materials may comprise general-purpose polymers (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives including phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof.

[0141] The pixel circuit PC, including a thin-film transistor (TFT) and a storage capacitor (Cst), can be covered by a first intermediate insulating layer 209 (e.g., a first organic insulating layer) between the pixel circuit PC and the first electrode 221 (or pixel electrode) described below. The first intermediate insulating layer 209 may include an approximately flat top surface.

[0142] The first electrode 221 can be on the pixel circuit PC. The first electrode 221 can be arranged for each pixel, and the first electrode 221 can be connected (e.g., electrically connected) to the pixel circuit PC. For example, as... Figure 6AAs shown, the contact metal layer CM can be located between the thin-film transistor TFT and the first electrode 221. The contact metal layer CM can be connected to the thin-film transistor TFT through contact holes formed in the first intermediate insulating layer 209, and the first electrode 221 can be connected to the contact metal layer CM through contact holes formed in the second intermediate insulating layer 211 (e.g., a second organic insulating layer) on the contact metal layer CM. The contact metal layer CM can include a conductive material comprising Mo, Al, Cu, or Ti, and can be formed as a single layer or multiple layers comprising the above materials. In an embodiment, the contact metal layer CM can include a Ti / Al / Ti multilayer.

[0143] The first intermediate insulating layer 209 and the second intermediate insulating layer 211 may comprise organic insulating materials such as general-purpose polymers (such as PMMA or PS), polymer derivatives including phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and / or blends thereof. In an embodiment, the first intermediate insulating layer 209 and the second intermediate insulating layer 211 may comprise polyimide.

[0144] Figure 6A The diagram shows a contact metal layer CM between the first intermediate insulating layer 209 and the second intermediate insulating layer 211, which connects (e.g., electrically connects) the pixel circuit PC to the first electrode 221. However, in another embodiment, the contact metal layer CM can be omitted. In this case, the thin-film transistor (TFT) of the pixel circuit PC can be directly connected to the first electrode 221, and one of the first intermediate insulating layer 209 and the second intermediate insulating layer 211 can be omitted. For example, an intermediate insulating layer can be between the pixel circuit PC and the first electrode 221, and the first electrode 221 can be connected to the thin-film transistor (TFT) of the pixel circuit PC through said intermediate insulating layer.

[0145] The first electrode 221 may be formed on the second intermediate insulating layer 211. The first electrode 221 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or zinc aluminum oxide (AZO). In another embodiment, the first electrode 221 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof or a mixture thereof. In another embodiment, the first electrode 221 may also include a film formed of ITO, IZO, ZnO, or In2O3 above and / or below the aforementioned reflective layer. In embodiments, the first electrode 221 may have a three-layer structure of ITO / Ag / ITO.

[0146] An upper insulating layer 215 may be formed on the first electrode 221. The upper insulating layer 215 may include an opening exposing the upper surface of the first electrode 221 and may cover the edge of the first electrode 221. The upper insulating layer 215 may be a pixel defining layer defining a pixel. For example, the width of the opening of the upper insulating layer 215 exposing the upper surface of the first electrode 221 may correspond to the width of the light-emitting area from which light is emitted or the width of a pixel.

[0147] The upper insulating layer 215 may include an organic insulating material. For example, the upper insulating layer 215 may include organic insulating materials such as general polymers (such as PMMA or PS), polymer derivatives including phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof.

[0148] Spacer 217 may be formed on upper insulating layer 215. Spacer 217 may include organic insulating material. Spacer 217 may include the same material as upper insulating layer 215 and may be formed together (or simultaneously) in the same masking process.

[0149] The intermediate layer 222 includes a light-emitting layer 222b. The light-emitting layer 222b may include a polymeric organic material or a low-molecular-weight organic material that emits light of a specific color. The intermediate layer 222 may include functional layers. The functional layers may include a first functional layer 222a disposed below the light-emitting layer 222b and / or a second functional layer 222c disposed above the light-emitting layer 222b.

[0150] The first functional layer 222a may include a single layer or multiple layers. For example, the first functional layer 222a may include a hole injection layer (HIL) and / or a hole transport layer (HTL).

[0151] The second functional layer 222c may include a single layer or multiple layers. The second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0152] At least one organic material layer 222o (hereinafter referred to as an organic material layer) (e.g., a first functional layer 222a and / or a second functional layer 222c) included in the intermediate layer 222 can be formed to cover the display area DA (e.g., to completely cover the display area DA). In the display area DA, light-emitting layers 222b of different colors can be arranged to be separated from each other or spaced apart, depending on the color of the corresponding pixel. However, the first functional layer 222a and / or the second functional layer 222c can be formed to completely cover the display area DA. Each of the first functional layer 222a and the second functional layer 222c can be shared by multiple pixels arranged in the display area DA. Therefore, each of the first functional layer 222a and the second functional layer 222c can be formed to cover multiple first electrodes 221.

[0153] The second electrode 223 may include a conductive material with low work function. For example, the second electrode 223 may include a (semi-)transparent layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca), or alloys thereof. Optionally, the second electrode 223 may also include a layer such as ITO, IZO, ZnO, or In2O3 on a (semi-)transparent layer comprising the above-mentioned materials. In embodiments, the second electrode 223 may include Ag and / or Mg. The second electrode 223 may be formed to cover the display area DA (e.g., to cover the entire display area DA). The second electrode 223 may be a common layer and may cover multiple first electrodes 221. The second electrode 223 and the functional layer, which may serve as a common layer covering the display area DA (e.g., to cover the entire display area DA), may have different thicknesses than each other. The thickness of the second electrode 223 may be smaller than the thickness of the organic material layer 222o (e.g., a stack of the first functional layer 222a and the second functional layer 222c) included in the intermediate layer 222.

[0154] An organic light-emitting diode (OLED) comprising a first electrode 221, an intermediate layer 222, and a second electrode 223 is covered by an encapsulation layer 300. The encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 6A The encapsulation layer 300 is shown to include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. In another embodiment, the number of organic encapsulation layers, the number of inorganic encapsulation layers, and the stacking order can be varied in a suitable manner.

[0155] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise one or more inorganic materials selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise a single layer or multiple layers containing the aforementioned materials. The organic encapsulation layer 320 may comprise a polymeric material. Examples of polymeric materials may include acrylic resins (such as polymethyl methacrylate and polyacrylic acid), epoxy resins, polyimide, or polyethylene. In embodiments, the organic encapsulation layer 320 may comprise an acrylate polymer.

[0156] The materials of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can be different from each other. For example, the first inorganic encapsulation layer 310 may include silicon oxynitride, and the second inorganic encapsulation layer 330 may include silicon nitride. The thicknesses of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can also be different from each other. The thickness of the first inorganic encapsulation layer 310 can be greater than the thickness of the second inorganic encapsulation layer 330. Optionally, the thickness of the second inorganic encapsulation layer 330 can be greater than the thickness of the first inorganic encapsulation layer 310, or the thickness of the first inorganic encapsulation layer 310 can be the same as the thickness of the second inorganic encapsulation layer 330.

[0157] The input sensing layer 40 may be on the package layer 300. The input sensing layer 40 may include a first input insulating layer 41a and 41b, a first conductive layer CML1, a second input insulating layer 43, a second conductive layer CML2, and a third input insulating layer 45.

[0158] The first input insulating layers 41a and 41b may include a first sub-insulating layer 41a and a second sub-insulating layer 41b. The first sub-insulating layer 41a and the second sub-insulating layer 41b may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon oxynitride.

[0159] The first conductive layer CML1 and the second conductive layer CML2 may include conductive materials, such as corresponding metals. For example, the first conductive layer CML1 and the second conductive layer CML2 may include Mo, Al, Cu, or Ti, and may be formed as a single layer or multiple layers including the above materials. In an embodiment, each of the first conductive layer CML1 and the second conductive layer CML2 may have a structure in which Ti layers, Al layers, and Ti layers are stacked sequentially (Ti / Al / Ti). The conductive materials of the first conductive layer CML1 and the second conductive layer CML2 may be the same as or different from each other.

[0160] The first conductive layer CML1 and / or the second conductive layer CML2 may include a plurality of touch electrodes for sensing touch input. In one embodiment, the input sensing layer 40 may include touch electrodes extending in the ±x direction and touch electrodes extending in the ±y direction in a plan view. The touch electrodes may sense input using a mutual capacitance method and may be disposed in the first conductive layer CML1 and / or the second conductive layer CML2. In another embodiment, the touch electrodes may sense input using a self-capacitance method and may be disposed in either the first conductive layer CML1 or the second conductive layer CML2.

[0161] The second input insulating layer 43 may be located between the first conductive layer CML1 and the second conductive layer CML2. The second input insulating layer 43 may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon oxynitride.

[0162] The third input insulating layer 45 may include an organic insulating material. For example, the third input insulating layer 45 may include a polymeric material. The polymeric material may be transparent. For example, the third input insulating layer 45 may include silicone resin, acrylic resin, epoxy resin, polyimide, or polyethylene, etc.

[0163] Figure 6A The diagram shows an input sensing layer 40 comprising a first conductive layer CML1 and a second conductive layer CML2. However, in another embodiment, the input sensing layer 40 may include either the first conductive layer CML1 or the second conductive layer CML2.

[0164] Next, watch Figure 6A For the non-display area NDA, the first intermediate insulating layer 209 and the second intermediate insulating layer 211 may extend into the non-display area NDA. For example, the first intermediate insulating layer 209 and the second intermediate insulating layer 211 may extend into the non-display area NDA, but may be separate from or spaced apart from the first dam DAM1. Similarly, each of the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 may extend into the non-display area NDA, but may be separate from or spaced apart from the first dam DAM1.

[0165] In this configuration, the first intermediate insulating layer 209 may extend further toward the first dam DAM1 than the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207, and may cover the edges of each of the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207. The second intermediate insulating layer 211 may extend further toward the first dam DAM1 than the first intermediate insulating layer 209 to cover the edge of the first intermediate insulating layer 209.

[0166] Figure 6A Each of the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 is shown extending into the non-display region NDA, but separated from or spaced apart from the first dam DAM1. However, as another example, the insulating layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, and / or the second interlayer insulating layer 207 may be arranged to cover the non-display region NDA (e.g., to cover the entire non-display region NDA).

[0167] In the non-display area NDA, the bypass portion DL-C of the data line can be on the first intermediate insulating layer 209 and the second interlayer insulating layer 207, respectively. Figure 6A The bypass portion DL-C of the data line on the first intermediate insulating layer 209 and the bypass portion DL-C of the data line on the second interlayer insulating layer 207 shown above are the same as those referenced above. Figure 3 The portion of the data line DL described is located in the non-display area NDA (along...) Figure 3 The curved part of the opening area OA in the middle corresponds to this.

[0168] As above Figure 5A As described herein, in the non-display area NDA, the insulating layer 201 may include an irradiation area IR and a dam area DR. The irradiation area IR and the dam area DR may be arranged alternately.

[0169] Each of the irradiated regions IR may include a first region AR1 and a second region AR2. Due to heat conduction treatment or thermal conductivity treatment, the first region AR1 (e.g., the portion of insulating layer 201 corresponding to the first region AR1) may have different physical and / or chemical properties than the second region AR2 (e.g., the portion of insulating layer 201 corresponding to the second region AR2). For example, the first region AR1 may have a higher film density than the second region AR2 and may effectively block impurities or foreign matter introduced from the outside. Therefore, the product stability of the display device 10 can be increased and the defect rate can be reduced.

[0170] At least one dam DAM is located in the non-display area NDA. In an embodiment, Figure 6AThe illustration shows three dam DAMs, but in another embodiment, there may be two or more dam DAMs. The first dam DAM1, the second dam DAM2, and the third dam DAM3 may be located on the insulating layer 201 within the dam region DR (e.g., directly above the dam region DR of the insulating layer 201). As described above, when the gate insulating layer 203, the first interlayer insulating layer 205, and / or the second interlayer insulating layer 207 cover (e.g., completely cover) the non-display region NDA, the first dam DAM1, the second dam DAM2, and the third dam DAM3 may be located on the gate insulating layer 203, the first interlayer insulating layer 205, and / or the second interlayer insulating layer 207.

[0171] The first dam DAM1, the second dam DAM2, and the third dam DAM3 are arranged in the non-display area NDA, but can be separated or spaced apart from each other in the direction from the display area DA towards the opening area OA. The first dam DAM1 can be closest to the display area DA, the third dam DAM3 can be closest to the opening area OA, and the second dam DAM2 can be between the first dam DAM1 and the third dam DAM3. Figure 5A As shown, each of the first dam DAM1, the second dam DAM2, and the third dam DAM3 may have a closed-loop shape surrounding (e.g., around) the opening region OA.

[0172] like Figure 6A As shown, opening 100H can be formed in substrate 100 to correspond to opening 10H of display device 10, and opening 201H can also be formed in insulating layer 201. Therefore, in this specification, "opening area OA", "opening 10H of display device 10", "opening 100H of substrate 100" and "opening 201H of insulating layer 201" can be used interchangeably. For example, "surrounding (e.g., around) opening 10H of display device 10" can mean "surrounding (e.g., around) opening 201H of insulating layer 201", "surrounding (e.g., around) opening 100H of substrate 100" and / or "surrounding (e.g., around) opening area OA".

[0173] The first dam DAM1, the second dam DAM2, and the third dam DAM3 may include insulating materials. For example, the first dam DAM1, the second dam DAM2, and the third dam DAM3 may include organic insulating materials. The first dam DAM1, the second dam DAM2, and the third dam DAM3 may be formed together (or simultaneously) in the process of forming multiple insulating material layers arranged in the aforementioned display area DA, and may include the same material as the aforementioned multiple insulating material layers.

[0174] like Figure 6AAs shown, the first dam DAM1 may include multiple first sub-dam layers 1110, 1120 and 1130. The first sub-dam layers 1110, 1120 and 1130 may include a first-1 sub-dam layer 1110, a first-2 sub-dam layer 1120 and a first-3 sub-dam layer 1130 stacked (e.g., stacked in sequence).

[0175] Figure 6A The diagram shows that the first-2 sub-dam layer 1120 covers the upper surface and sidewalls of the first-1 sub-dam layer 1110. However, as another example, the sidewalls of the first-1 sub-dam layer 1110 and the first-2 sub-dam layer 1120 may both be flush with the sidewalls of the first-3 sub-dam layer 1130.

[0176] In this embodiment, the first-1 sub-dam layer 1110 may include the same material as the second intermediate insulating layer 211, the first-2 sub-dam layer 1120 may include the same material as the upper insulating layer 215, and the first-3 sub-dam layer 1130 may include the same material as the spacer 217. The first-3 sub-dam layer 1130 may include the same material as the first-2 sub-dam layer 1120, and may be formed together (or simultaneously) in the same masking process.

[0177] like Figure 6A As shown, the second dam DAM2 may include multiple second sub-dam layers 1210, 1220 and 1230. The second sub-dam layers 1210, 1220 and 1230 may include a second-1 sub-dam layer 1210, a second-2 sub-dam layer 1220 and a second-3 sub-dam layer 1230 stacked (e.g., stacked in sequence).

[0178] Figure 6A The diagram shows that the second-2 sub-dam layer 1220 covers the upper surface and sidewalls of the second-1 sub-dam layer 1210. However, as another example, the sidewalls of the second-1 sub-dam layer 1210 and the second-2 sub-dam layer 1220 may both be flush with the sidewalls of the second-3 sub-dam layer 1230.

[0179] In this embodiment, the second-1 sub-dam layer 1210 may include the same material as the second intermediate insulating layer 211, the second-2 sub-dam layer 1220 may include the same material as the upper insulating layer 215, and the second-3 sub-dam layer 1230 may include the same material as the spacer 217. The second-3 sub-dam layer 1230 may include the same material as the second-2 sub-dam layer 1220, and may be formed together (or simultaneously) in the same masking process.

[0180] like Figure 6AAs shown, the third dam DAM3 may include multiple third sub-dam layers 1310 and 1320. The third sub-dam layers 1310 and 1320 may include a third-1 sub-dam layer 1310 and a third-2 sub-dam layer 1320 stacked (e.g., stacked sequentially).

[0181] In this embodiment, the third-1 sub-dam layer 1310 may include the same material as the upper insulating layer 215, and the third-2 sub-dam layer 1320 may include the same material as the spacer 217. The third-2 sub-dam layer 1320 may include the same material as the third-1 sub-dam layer 1310, and may be formed together (or simultaneously) in the same masking process.

[0182] The sub-dam layers of each of the first dam DAM1, the second dam DAM2, and the third dam DAM3 may be formed together (or simultaneously) in the same masking process as the masking process of at least one of the first intermediate insulating layer 209, the second intermediate insulating layer 211, the upper insulating layer 215, and the spacer 217, but are not limited thereto, and may have various suitable configurations.

[0183] The heights of at least one of the first dam DAM1, the second dam DAM2, and the third dam DAM3 may differ from each other. For example, as Figure 6A As shown, the heights of the first dam DAM1 and the second dam DAM2 can be greater than the height of the third dam DAM3. In other words, the vertical distance from the upper surface of the base 100 to the upper surface of each of the first dam DAM1 and the second dam DAM2 can be greater than the vertical distance from the upper surface of the base 100 to the upper surface of the third dam DAM3.

[0184] Figure 6A The illustration shows that the first dam DAM1 and the second dam DAM2 have substantially the same height, but in another embodiment, the first dam DAM1 and the second dam DAM2 may have different heights from each other.

[0185] The aforementioned one or more dam DAMs (such as first dam DAM1, second dam DAM2, and third dam DAM3) can control the flow of materials constituting the organic encapsulation layer 320 during the process of forming the encapsulation layer 300. For example, the organic encapsulation layer 320 can be formed by applying monomers to the display area DA using a process such as inkjet printing and then curing the monomers. The dam DAMs can control the position of the organic encapsulation layer 320 by controlling the flow of the monomers. In this regard, Figure 6A The edge 320e of the organic encapsulation layer 320 is shown to be located on or on one side of the first dam DAM1.

[0186] In another embodiment, since the edge 320e of the organic encapsulation layer 320 is located on or at the upper surface of the first dam DAM1, a portion of the organic encapsulation layer 320 can be superimposed on the upper surface of the first dam DAM1. In another embodiment, the edge 320e of the organic encapsulation layer 320 can be on or at one side of the second dam DAM2, and in this case, a portion of the organic encapsulation layer 320 can be superimposed on the upper surface of the first dam DAM1. The position of the organic encapsulation layer 320 can be confirmed using an image from the display device 10 including the organic encapsulation layer 320. The display device 10 according to the embodiment can be used to monitor the position of the organic encapsulation layer 320 (e.g., the position of the edge 320e of the organic encapsulation layer 320) by having a plurality of dam DAMs as described above.

[0187] Because the edge 320e of the organic encapsulation layer 320 is located on or near one side of any dam DAM (e.g., the first dam DAM1), the second inorganic encapsulation layer 330 can contact (e.g., directly contact) the first inorganic encapsulation layer 310 in the non-display area NDA. For example, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can contact (e.g., directly contact) each other in the area between the edge 320e of the organic encapsulation layer 320 and the opening 10H of the display device 10. In the embodiment, Figure 6A The first inorganic encapsulation layer 310 is shown to contact (e.g., directly contact) the second inorganic encapsulation layer 330 in the region between the first dam DAM1 and the opening 10H of the display device 10.

[0188] The insulating layers of the input sensing layer 40 (e.g., first input insulating layers 41a and 41b, second input insulating layer 43 and third input insulating layer 45) may also extend to cover the non-display area NDA.

[0189] The planarization insulating layer 47 can be arranged to cover the non-display area NDA. The planarization insulating layer 47 can be located only in the non-display area NDA to have a width range from the first edge 47E1 to the second edge 47E2. Therefore, in a plan view, the planarization insulating layer 47 can have a closed curved shape (e.g., annular shape) surrounding (e.g., around) the opening 10H.

[0190] The first edge 47E1 of the planarization insulating layer 47 may face or define the opening 10H of the display device 10, and the second edge 47E2 of the planarization insulating layer 47 may be adjacent to the display area DA. A portion of the planarization insulating layer 47 adjacent to the display area DA may be superimposed on a portion of the organic encapsulation layer 320, while covering the edge 320e of the organic encapsulation layer 320. The second inorganic encapsulation layer 330 and the first sub-insulating layer 41a may be located between the portion of the planarization insulating layer 47 and the portion of the organic encapsulation layer 320.

[0191] The first sub-insulating layer 41a may contact (e.g., directly contact) the second sub-insulating layer 41b in the display area DA. In the non-display area NDA, the first sub-insulating layer 41a and the second sub-insulating layer 41b may be separated or spaced apart from each other in the thickness direction (e.g., the z-direction) by a planarization insulating layer 47 between the first sub-insulating layer 41a and the second sub-insulating layer 41b.

[0192] At least one organic material layer 222o included in the intermediate layer 222 (e.g., a first functional layer 222a and / or a second functional layer 222c) can be disconnected at the non-display area NDA. In other words, a portion of the organic material layer 222o can be removed from or at the non-display area NDA.

[0193] For example, the organic material layer 222o may have a first opening 222oh located in the non-display region NDA. The first opening 222oh may be superimposed on the irradiation region IR of the insulating layer 201. In this regard, Figure 6A Multiple first openings 222ohs in the non-display area NDA are shown. The first openings 222ohs can each partially expose the irradiation area IR of the insulating layer 201.

[0194] The organic material layer 222o may include a first functional layer 222a and a second functional layer 222c, and the opening 222ah of the first functional layer 222a and the opening 222ch of the second functional layer 222c may be stacked on top of each other to form a first opening 222oh. The opening 222ah of the first functional layer 222a and the opening 222ch of the second functional layer 222c may be formed while a portion of the first functional layer 222a and a portion of the second functional layer 222c are removed, and the first functional layer 222a and the second functional layer 222c may be discontinuous in the non-display area NDA due to the openings 222ah and 222ch, respectively, or may be discontinuous at the openings 222ah and 222ch, respectively.

[0195] At least a portion of the insulating layer 201 below the first opening 222oh can be exposed through the first opening 222oh, and the first inorganic encapsulation layer 310 can contact (e.g., directly contact) the insulating layer 201 through or within the first opening 222oh. For example, the irradiation region IR of the insulating layer 201 below the first opening 222oh can be exposed through the first opening 222oh, and the first inorganic encapsulation layer 310 can contact (e.g., directly contact) the irradiation region IR of the insulating layer 201 through or within the first opening 222oh. The insulating layer 201 may comprise an inorganic insulating material, and the contact between the first inorganic encapsulation layer 310 and the insulating layer 201 can block (e.g., partially block) the propagation of moisture.

[0196] Because at least one organic material layer 222o included in the intermediate layer 222 is formed to cover the display area DA (e.g., to cover the entire display area DA), the organic material layer 222o may provide a path for moisture flow through the opening 10H of the display device 10. However, according to an embodiment, because the organic material layer 222o includes a first opening 222oh located in the non-display area NDA, the travel of moisture through the organic material layer 222o can be prevented, reduced, or minimized.

[0197] The first opening 222oh of the organic material layer 222o can be arranged to be separated from or spaced apart from each other, corresponding to the irradiation region IR of the insulating layer 201. For example, Figure 6A The first opening 222oh between the first dam DAM1 and the display area DA is shown, as well as the first opening 222oh between the first dam DAM1 and the second dam DAM2 and the first opening 222oh between the second dam DAM2 and the third dam DAM3.

[0198] Figure 6A The diagram shows an organic material layer 222o comprising a plurality of first openings 222oh, such that portions of the organic material layer 222o respectively surround (e.g., encircle) a first dam to a third dam (first dam DAM1, second dam DAM2, and third dam DAM3). However, as another example, the organic material layer 222o may include only one first opening 222oh. The organic material layer 222o may include a single first opening 222oh. In this case, the portions of the organic material layer 222o that respectively surround (e.g., encircle) the first dam DAM1, the second dam DAM2, and the third dam DAM3 may be omitted.

[0199] In a plan view, the first opening 222oh may surround (e.g., encircle) the opening 10H. For example, the first opening 222oh may extend along the edge of the opening 10H and may have a closed loop shape in the plan view that surrounds (e.g., completely encircles) the opening 10H.

[0200] The second electrode 223 on the organic material layer 222o can be disconnected at the non-display area NDA. In other words, the second electrode 223 can be removed from the non-display area NDA or a portion of the second electrode 223 can be removed at the non-display area NDA.

[0201] For example, the second electrode 223 may have a second opening 223oh located in the non-display area NDA. The second opening 223oh may be superimposed with the first opening 222oh and the irradiation area IR of the insulating layer 201. In this regard, Figure 6A Multiple second openings 223ohs in the non-display area NDA are shown. The second openings 223ohs can be superimposed on the first opening 222ohs respectively. The second openings 223ohs can each partially expose the irradiation area IR of the insulating layer 201.

[0202] At least a portion of the insulating layer 201 below the second opening 223oh can be exposed through the second opening 223oh, and the first inorganic encapsulation layer 310 can contact (e.g., directly contact) the insulating layer 201 through the second opening 223oh. For example, the irradiation region IR of the insulating layer 201 below the second opening 223oh can be exposed through the second opening 223oh, and the first inorganic encapsulation layer 310 can contact (e.g., directly contact) the irradiation region IR of the insulating layer 201 through the second opening 223oh. The insulating layer 201 may comprise an inorganic insulating material, and the contact between the first inorganic encapsulation layer 310 and the insulating layer 201 can block (e.g., partially block) the propagation of moisture.

[0203] The second opening 223oh of the second electrode 223 can be arranged to be separated from or spaced apart from each other, corresponding to the irradiation region IR of the insulating layer 201. For example, Figure 6A The second opening 223oh between the first dam DAM1 and the display area DA is shown, as are the second opening 223oh between the first dam DAM1 and the second dam DAM2, and the second opening 223oh between the second dam DAM2 and the third dam DAM3.

[0204] Figure 6A The diagram shows a second electrode 223 comprising a plurality of second openings 223oh, such that portions of the second electrode 223 respectively surround (e.g., encircle) the first dam DAM1, the second dam DAM2, and the third dam DAM3. However, as another example, the second electrode 223 may include one (or a single) second opening 223oh. In this case, the portions of the second electrode 223 that respectively surround (e.g., encircle) the first dam DAM1, the second dam DAM2, and the third dam DAM3 may be omitted.

[0205] In the plan view, the second opening 223oh may surround (e.g., encircle) the opening 10H. For example, the second opening 223oh may extend along the edge of the opening 10H and may have a closed loop shape surrounding (e.g., completely surrounding) the opening 10H in the plan view.

[0206] After forming the second electrode 223 to cover the display area DA and the non-display area NDA (e.g., the entire display area DA and the non-display area NDA), the portion of the second electrode 223 located in the non-display area NDA can be removed. This portion of the second electrode 223 can be removed by a laser ablation process, and the edge portion 223ep of the second electrode 223 can have an irregular shape due to the laser beam. For example, as... Figure 6B As shown, the edge portion 223ep of the second electrode 223 may include burrs formed by the laser ablation process. The edge portion 223ep of the second electrode 223 may extend in an inclined direction away from the upper surface of the substrate 100, and the cross-section of the edge portion 223ep may be irregular. Because the edge portion 223ep of the second electrode 223 may have an irregular shape due to the laser beam, the second opening 223oh and the irradiation area IR may be misaligned.

[0207] The first inorganic encapsulation layer 310 has relatively excellent step coverage, but the edge portion 223ep of the second electrode 223 beneath the first inorganic encapsulation layer 310 has an irregular shape, which means that the first inorganic encapsulation layer 310 may locally include portions with low density and / or portions with reduced thickness. In this case, cracks may occur in the first inorganic encapsulation layer 310, and the cracks may propagate to the surrounding area.

[0208] However, as will be described below Figure 11B As shown, during the laser stripping process, a conductive pattern CP can be used to expose a portion of the irradiation region IR of the insulating layer 201. When the conductive pattern CP exposes a portion of the irradiation region IR of the insulating layer 201, a portion of the second electrode 223 disposed on the insulating layer 201 can be irradiated (e.g., directly irradiated) with a laser beam. That is, a portion of the second electrode 223 disposed in the irradiation region IR can be heated and evaporated by the laser beam, and another portion of the second electrode 223 can be removed together with (or simultaneously with) the conductive pattern CP.

[0209] In this way, because a portion of the second electrode 223 is evaporated in the irradiation region IR, the size (or length) S of the remaining edge portion 223ep of the second electrode 223 can be smaller than the width w1 of the irradiation region IR. Optionally, the size (or length) S of the edge portion 223ep of the second electrode 223 can be equal to or less than the width w2 of the first region AR1. For example, the size (or length) of the edge portion 223ep of the second electrode 223 can be about 5 μm or less.

[0210] When the conductive pattern CP exposes a portion of the irradiation area IR of the insulating layer 201, the size (or length) of the edge portion 223ep of the second electrode 223 can be reduced compared to when the conductive pattern CP covers the entire irradiation area IR. Therefore, cracking in the first inorganic encapsulation layer 310 due to the edge portion 223ep of the second electrode 223 can be prevented or reduced. Furthermore, the conductive pattern CP removed by the laser beam remains as particles, and because the size (or area) of the conductive pattern CP is reduced, the size of the particles can also be reduced. Therefore, the product stability of the display device 10 can be increased, and the defect rate can be reduced.

[0211] Figure 7 This is an enlarged cross-sectional view of a display device according to another embodiment. Figure 7 yes Figure 6A and Figure 6B The modified embodiment, which is similar to Figure 6A and Figure 6B The difference lies in the structure of the insulating layer. In the following text, based on... Figure 6A and Figure 6B Redundant content in the description can be avoided, and the description can mainly focus on the content related to... Figure 6A and Figure 6B The differences in the descriptions.

[0212] Reference Figure 7 The insulating layer 201 on the substrate 100 may include an irradiation region IR. The irradiation region IR may include a first region AR1 and a second region AR2.

[0213] In an embodiment, the insulating layer 201 may have a trench 201t corresponding to the first region AR1. Because the insulating layer 201 has the trench 201t, the thickness t1 of a portion of the first region AR1 may be smaller than the thickness t2 of the second region AR2.

[0214] As above Figure 5B As described, when the first region AR1 includes multiple line regions LA, the insulating layer 201 may have multiple trenches 201t corresponding to the multiple line regions LA respectively.

[0215] When the insulating layer 201 has trenches 201t as shown in the embodiment, the surface area of ​​the insulating layer 201 can be increased. As a result, the permeation path of moisture or oxygen introduced from the outside may increase, and the organic light-emitting diode (OLED) can be protected from the effects of moisture or oxygen.

[0216] Figure 8 This is an enlarged plan view of a display device according to another embodiment. More specifically, Figure 8 This is an enlarged view of a portion of the illumination area IR' in the non-display area, and another embodiment of the illumination area IR' is shown.

[0217] Reference Figure 8 The irradiated area IR' may include a first area AR1' and a second area AR2'. In this case, the first area AR1' may be a heat-conducting treated area. Due to the heat-conducting treatment or thermal conductivity treatment, the first area AR1' (e.g., the portion of the insulating layer 201 corresponding to the first area AR1') may have different physical and / or chemical properties than the second area AR2' (e.g., the portion of the insulating layer 201 corresponding to the second area AR2').

[0218] In an embodiment, the first region AR1' may include multiple line regions LA', and the second region AR2' may include multiple spaced regions SA'.

[0219] Line regions LA' may extend along the second direction DIR2 and may be arranged to be separated from or spaced apart from each other along the first direction DIR1. Spacing regions SA' may extend along the second direction DIR2 and may be arranged to be separated from or spaced apart from each other along the first direction DIR1. Line regions LA' and spacing regions SA' may be arranged alternately along the first direction DIR1.

[0220] As above Figure 5A As described, when the planar shape of the irradiation area IR' is circular (e.g., annular), the planar shapes of the first region AR1' and the second region AR2' forming the irradiation area IR' can also be circular. In this case, the first direction DIR1 can be the circumferential direction, and the second direction DIR2 can be the radial direction.

[0221] Figure 8 The line region LA' and the spacer region SA' are shown extending in the second direction DIR2, but the line region LA' and the spacer region SA' may extend upward in a third party that intersects the first direction DIR1 and the second direction DIR2.

[0222] Figure 9 and Figure 10 This is an enlarged plan view of a display device according to another embodiment. More specifically, Figure 9and Figure 10 Each of these is an enlarged view of a portion of the irradiated area in the non-display area, and another embodiment of the irradiated area is shown.

[0223] Reference Figure 9 and Figure 10 The irradiation area IR” may include a first area AR1” and a second area AR2”', and the irradiation area IR”' may include a first area AR1”' and a second area AR2”'. In this case, the first areas AR1” and AR1”' may be heat conduction treated areas. Due to heat conduction treatment or thermal conduction treatment, the first areas AR1” and AR1”' (e.g., the portions of insulating layer 201 corresponding to the first areas AR1” and AR1”') may have different physical and / or chemical properties than the second areas AR2” and AR2”' (e.g., the portions of insulating layer 201 corresponding to the second areas AR2” and AR2”').

[0224] In an embodiment, the second region AR2” may include a plurality of point regions DTA surrounded by the first region AR1”, and the second region AR2”’ may include a plurality of point regions DTA’ surrounded by the first region AR1”’. The number and shape of the point regions DTA and DTA’ can be appropriately changed. For example, as Figure 9 As shown, the planar shape of the point region DTA can be circular, or as shown in the figure. Figure 10 As shown, the planar shape of the point region DTA' can be rectangular. However, this disclosure is not limited thereto.

[0225] In addition, such as Figure 9 As shown, point regions DTA can be arranged offset from each other. In another example, such as Figure 10 As shown, point regions DTA' can be arranged to be separated from each other at regular intervals or spaced apart.

[0226] Although only display devices have been described so far, this disclosure is not limited thereto. For example, methods of manufacturing display devices are also within the scope of this disclosure.

[0227] Figures 11A to 11D These are cross-sectional views showing a method of manufacturing the display device 10 according to an embodiment. Figure 12 This is a schematic enlarged plan view of the conductive pattern CP according to an embodiment.

[0228] First, refer to Figure 11AA pixel circuit PC, at least one dam DAM, and a first electrode 221 on the pixel circuit PC are formed on the substrate 100. Before forming the pixel circuit PC, an insulating layer 201 may be formed to cover the upper surface of the substrate 100 (e.g., the entire upper surface). Thereafter, a semiconductor layer of a thin-film transistor, a gate insulating layer 203, a gate electrode of the thin-film transistor and a lower electrode of a storage capacitor, a first interlayer insulating layer 205, an upper electrode of the storage capacitor, a second interlayer insulating layer 207, a source electrode and a drain electrode, a first intermediate insulating layer 209, a contact metal layer, and a second intermediate insulating layer 211 may be formed (e.g., sequentially).

[0229] While the insulating layer 201 covers the substrate 100 (e.g., covers the entire substrate 100), a portion of at least one layer on the insulating layer 201 can be removed. For example, each of the gate insulating layer 203, the first interlayer insulating layer 205, the second interlayer insulating layer 207, the first intermediate insulating layer 209, and the second intermediate insulating layer 211 formed in a portion of the opening region OA and the non-display region NDA adjacent to the opening region OA can be removed. Therefore, as... Figure 11A As shown, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207, facing the opening region OA and / or the edges 203e, 205e, and 207e adjacent to the opening region OA, can be separated from or spaced apart from the first dam DAM1 and covered by the first intermediate insulating layer 209. Similarly, the first intermediate insulating layer 209 and the second intermediate insulating layer 211, facing the opening region OA and / or the edges 209e and 211e adjacent to the opening region OA, can be separated from or spaced apart from the first dam DAM1. The edge 209e of the first intermediate insulating layer 209 can be covered by the second intermediate insulating layer 211.

[0230] Figure 11A The illustration shows a portion of each of the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 removed from the non-display area NDA. However, as another example, similar to insulating layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, or the second interlayer insulating layer 207 may completely cover the non-display area NDA.

[0231] A first electrode 221 can be formed on the second intermediate insulating layer 211, and an upper insulating layer 215 and a spacer 217 can be formed on the first electrode 221. When the first electrode 221 is formed in the display area DA, a plurality of conductive patterns CP can be formed in the non-display area NDA, and when an insulating material layer including an organic insulating material is formed in the display area DA, at least one dam DAM can be formed in the non-display area NDA.

[0232] In this case, a conductive pattern CP can be formed on the insulating layer 201 in the irradiation region IR, and a dam DAM can be formed on the insulating layer 201 in the dam region DR. (Refer to the above.) Figure 5A As described, the irradiation region IR and the dam region DR of the insulating layer 201 can be arranged alternately. In this case, the conductive pattern CP and the dam DAM can be arranged alternately.

[0233] In the embodiments, as described above... Figure 5B As described above, the irradiation area IR may include a first area AR1 and a second area AR2, and a conductive pattern CP may be formed in the first area AR1 of the irradiation area IR. That is, the conductive pattern CP may cover the first area AR1 of the insulating layer 201 and expose the second area AR2 of the insulating layer 201. The conductive pattern CP may expose a portion of the irradiation area IR.

[0234] For example, refer to Figure 12 The first region AR1 can include multiple line regions LA, and the second region AR2 can include multiple interval regions SA. For example... Figure 11A and Figure 12 As shown in the enlarged diagram, because a conductive pattern CP is formed in the first region AR1 within the irradiation region IR, conductive patterns CP can also be formed in the line regions LA. The conductive patterns CP can each cover the line regions LA and can each expose the interval regions SA.

[0235] The conductive patterns CP can extend along the shape of the line region LA in the first direction DIR1, and can be separated or spaced apart from each other in the second direction DIR2. For example, a conductive pattern CP can be between the display region DA and the first dam DAM1, a conductive pattern CP can be between the adjacent first dam DAM1 and the second dam DAM2, and a conductive pattern CP can be between the adjacent second dam DAM2 and the third dam DAM3.

[0236] As above Figure 5A As described, when the planar shape of the irradiation region IR is circular (e.g., annular), the planar shapes of the first region AR1 and the second region AR2 forming the irradiation region IR can also be circular. The planar shape of the conductive pattern CP following the shape of the first region AR1 can also be circular. In this case, the first direction DIR1 can be the circumferential direction, and the second direction DIR2 can be the radial direction.

[0237] Figure 12 The first region AR1 is shown to surround (e.g., around) the outer edge of the conductive pattern CP, but the first region AR1 and the conductive pattern CP can be aligned.

[0238] in addition, Figure 12 The first region AR1 and the second region AR2 of the irradiation area IR are shown to include a line region LA and a spacer region SA extending in the first direction DIR1, respectively. However, this is only an embodiment, and as referenced above... Figures 8 to 10 As described, the shapes of the first region AR1 and the second region AR2 of the irradiation area IR can be appropriately changed. Therefore, the shape of the conductive pattern CP can also be modified differently according to the shape of the first region AR1. The following will refer to... Figures 13 to 15 Describe its specific implementation method.

[0239] The conductive pattern CP may include the same material as the first electrode 221 (e.g., a conductive material) and may be formed together (or simultaneously) in the same process. For example, the conductive pattern CP may include metals and transparent conductive oxides (such as ITO / Ag / ITO).

[0240] At least one dam DAM (e.g., first dam DAM1, second dam DAM2, and third dam DAM3) may have a cross-sectional shape in which the width of the lower portion is greater than the width of the upper portion. First dam DAM1, second dam DAM2, and third dam DAM3 may include multiple sublayers, and each of the multiple sublayers may be formed together (or simultaneously) in the process of forming the first intermediate insulation layer 209, the second intermediate insulation layer 211, the upper insulation layer 215, and / or the spacer 217. The specific materials of the sublayers of first dam DAM1, second dam DAM2, and third dam DAM3 are as described above. Figure 6A The material being described.

[0241] After that, as Figure 11B As shown, a first functional layer 222a, a light-emitting layer 222b, a second functional layer 222c, and a second electrode 223 can be formed on the first electrode 221. The light-emitting layer 222b can be formed to correspond to the first electrode 221, which is arranged separately or spaced apart from each other in the display area DA; however, as... Figure 11B As shown, the organic material layer 222o (e.g., the first functional layer 222a and / or the second functional layer 222c) and the second electrode 223, which serve as a common layer, can be formed to cover the substrate 100 (e.g., the entire substrate 100).

[0242] When the organic material layer 222o, serving as a common layer, and the second electrode 223, serving as an electrode layer, cover the upper surface of the substrate 100 (e.g., the entire upper surface), there is a problem of cracks or moisture flowing into the light-emitting diode (LED). Therefore, a portion of the organic material layer 222o and a portion of the second electrode 223 can be removed from the non-display area NDA. For this purpose, the substrate 100 is irradiated with a laser beam. The laser beam can be irradiated in a direction from the rear surface 100b of the substrate 100 toward the upper surface 100t. The output of the laser beam can be set based on the bandgap of the second electrode 223. The laser beam can irradiate once or multiple times (e.g., the substrate 100 can be irradiated once or multiple times by the laser beam), and when the laser beam irradiates multiple times, the type, output, and / or irradiation range (or size) of the laser beam can be changed in an appropriate manner. A portion of the organic material layer 222o and a portion of the second electrode 223 can be removed by the aforementioned laser beam (e.g., during a laser lift-off process).

[0243] like Figure 11B As shown, a laser beam can be used to illuminate (e.g., locally) a non-display area NDA. For example, a laser beam can be used to illuminate an irradiation area IR of the non-display area NDA.

[0244] Figure 11B This shows that the laser beam only illuminates the irradiated area IR, but the laser beam can also illuminate the dam area DR.

[0245] During the laser stripping process described above, the conductive pattern CP can be heated to a certain temperature by absorbing the laser beam, and the portion of the second electrode 223 that is not superimposed on the conductive pattern CP can also be heated to a certain temperature by absorbing the laser beam.

[0246] The conductive pattern CP, heated to a certain temperature, can be separated from the insulating layer 201, and portions of the organic material layer 222o (e.g., the first functional layer 222a and the second functional layer 222c) on the conductive pattern CP and portions of the second electrode 223 on the conductive pattern CP can be separated and removed together (or simultaneously). A portion of the organic material layer 222o on the conductive pattern CP and a portion of the second electrode 223 on the conductive pattern CP can be partially evaporated by the heat received from the conductive pattern CP. The conductive pattern CP is a sacrificial layer, and after portions of the organic material layer 222o are removed (e.g., after the first opening 222oh is formed in the organic material layer 222o), it can be... Figure 11C The conductive pattern CP is removed as shown in the figure.

[0247] A portion of the second electrode 223 that is heated to a certain temperature but not superimposed on the conductive pattern CP can be evaporated and removed. When a portion of the second electrode 223 is evaporated, a portion of the organic material layer 222o beneath the second electrode 223 can also be evaporated by receiving heat.

[0248] The heat from the laser beam can be conducted to the organic material layer 222o in the irradiation region IR or to the second electrode 223 through a portion of the second electrode 223 and the conductive pattern CP. As a result, a portion of the organic material layer 222o in the irradiation region IR can be removed.

[0249] Meanwhile, the energy level of the laser beam irradiating the irradiation area IR varies depending on the location of the irradiation area IR. For example, the energy level of the laser beam irradiating the center of the irradiation area IR will be greater than the energy level of the laser beam irradiating the edge of the irradiation area IR. In this case, because less heat is transmitted to the conductive pattern CP or the second electrode 223 at the edge of the irradiation area IR than to the center of the irradiation area IR, the organic material layer 222o and / or the second electrode 223 at the edge of the irradiation area IR may not be completely removed. In this case, as described above... Figure 6B As described, a portion of the second electrode 223 may be torn off, potentially forming burrs. Therefore, the irradiated area IR to which the laser beam irradiates and the organic material layer 222o and / or the area from which the second electrode 223 is removed (e.g., the first opening 222oh and / or the second opening 223oh) may not be exactly the same and may differ from each other.

[0250] Reference Figure 11C Through the aforementioned laser lift-off process, the organic material layer 222o may include a first opening 222oh located in the non-display area NDA, and the second electrode 223 may include a second opening 223oh located in the non-display area NDA. When the organic material layer 222o includes a first functional layer 222a and a second functional layer 222c, the first opening 222oh of the organic material layer 222o may include an opening 222ah of the first functional layer 222a and an opening 222ch of the second functional layer 222c.

[0251] Figure 11C The first opening 222oh and the second opening 223oh are shown located in the non-display area NDA, but this disclosure is not limited thereto. The positions of the first opening 222oh and the second opening 223oh can be appropriately varied depending on the number, position, and / or irradiation range of the laser beam irradiating or guiding the conductive pattern CP. For example, the laser beam can be irradiated into the irradiation area IR and the dam area DR, and in this case, the organic material layer 222o surrounding (e.g., around) the dam DAM and the second electrode 223 can be removed.

[0252] In this embodiment, the amount of hydrogen gas, the amount of carbon gas, or the film density may differ in each of the first region AR1 and the second region AR2. Figure 11B During the laser lift-off process, the first region AR1 of the insulating layer 201 can receive radiant heat caused by the laser beam and conductive heat caused by the conductive pattern CP. That is, unlike the second region AR2, the first region AR1 undergoes heat conduction treatment via the conductive pattern CP. Therefore, through this heat conduction treatment, the first region AR1 can have a higher film density than the second region AR2.

[0253] After performing the laser lift-off process, the encapsulation layer 300 and the input sensing layer 40 can be formed on the substrate 100.

[0254] The first inorganic encapsulation layer 310 of the encapsulation layer 300 can be formed to cover the substrate 100 (e.g., to cover the entire substrate 100). The first inorganic encapsulation layer 310 can be formed by chemical vapor deposition or the like. As described above, because the conductive pattern CP between adjacent dams DAM is removed, the first inorganic encapsulation layer 310 can contact (e.g., directly contact) the underlying inorganic insulating layer (e.g., insulating layer 201).

[0255] As above Figure 11B As described, during the laser stripping process, a conductive pattern CP can be used to expose a portion of the irradiation region IR of the insulating layer 201. When the conductive pattern CP exposes a portion of the irradiation region IR of the insulating layer 201, a portion of the second electrode 223 disposed on the insulating layer 201 can be irradiated (e.g., directly irradiated) with a laser beam. That is, a portion of the second electrode 223 disposed in the irradiation region IR can be heated and evaporated by the laser beam, and another portion of the second electrode 223 can be removed together with (or simultaneously with) the conductive pattern CP.

[0256] In this way, because a portion of the second electrode 223 is evaporated in the irradiation region IR, the size (or length) of the remaining edge portion 223ep of the second electrode 223 can be smaller than the width of the irradiation region IR. Optionally, the size (or length) of the edge portion 223ep of the second electrode 223 can be equal to or smaller than the width of the first region AR1. For example, the size (or length) of the edge portion 223ep of the second electrode 223 can be about 5 μm or less.

[0257] When the conductive pattern CP exposes a portion of the irradiation area IR of the insulating layer 201, the size (or length) of the edge portion 223ep of the second electrode 223 can be reduced compared to when the conductive pattern CP covers the entire irradiation area IR. Therefore, cracks in the first inorganic encapsulation layer 310 due to the edge portion 223ep of the second electrode 223 can be prevented or reduced.

[0258] Furthermore, the conductive pattern CP removed by the laser beam can remain as particles, and because the size (or area) of the conductive pattern CP is reduced, the size of the particles can also be reduced.

[0259] The organic encapsulation layer 320 can be formed by applying a monomer using an inkjet printing method or similar means and then curing the monomer. The organic encapsulation layer 320 may include a resin formed during monomer curing. The specific material of the organic encapsulation layer 320 is as described above. Furthermore, the organic encapsulation layer 320 may cover particles retained on the second electrode 223 among the particles generated during the laser lift-off process.

[0260] Similar to the first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330 can be formed on the organic encapsulation layer 320 using a chemical vapor deposition method. The second inorganic encapsulation layer 330 can contact (e.g., directly contact) the first inorganic encapsulation layer 310 in a portion of the non-display area NDA where the organic encapsulation layer 320 is not formed and in an opening region OA. For example, the second inorganic encapsulation layer 330 can be at the edge 320e of the organic encapsulation layer 320 (see...). Figure 6A The first inorganic encapsulation layer 310 is in contact (e.g., in direct contact) with the opening area OA, thereby further reducing or preventing the possibility of moisture penetration.

[0261] Subsequently, a first sub-insulating layer 41a can be formed, and a planarization insulating layer 47 can be formed on the first sub-insulating layer 41a. The planarization insulating layer 47 can be formed in the non-display area NDA and the opening area OA. When the organic encapsulation layer 320 is arranged to cover the display area DA, the planarization insulating layer 47 may not cover the display area DA. Figure 11C In the manufacturing process shown, the planarization insulating layer 47 may exist only in or be disposed in the non-display area NDA and the opening area OA.

[0262] Next, a second sub-insulating layer 41b can be formed, and (for example, sequentially) a first conductive layer CML1, a second input insulating layer 43, a second conductive layer CML2, and a third input insulating layer 45 can be formed.

[0263] After that, as Figure 11DAs shown, when the opening region OA is cut along the cutting line SCL using a method such as laser cutting, the display device 10 may include an opening 10H formed in the opening region OA.

[0264] Figure 13 This is an enlarged plan view of the conductive pattern CP' according to another embodiment. More specifically, Figure 13 The arrangement in Figure 8 The conductive pattern CP' in the irradiated area IR'.

[0265] Reference Figure 13 As shown above Figure 8 As described, the irradiation area IR' may include a first area AR1' and a second area AR2'. The first area AR1' may include multiple line areas LA', and the second area AR2' may include multiple spaced areas SA'. In this case, the line areas LA' and the spaced areas SA' may extend in the second direction DIR2 and may be separated from or spaced apart from each other in the first direction DIR1.

[0266] like Figure 13 As shown, because the conductive pattern CP' can cover the first region AR1' of the insulating layer 201 and expose the second region AR2' of the insulating layer 201, the conductive pattern CP' can be formed on the line region LA' respectively. The conductive pattern CP' can cover the line region LA' and expose the spacing region SA' respectively.

[0267] The conductive patterns CP' can extend along the shape of the line regions LA' in the second direction DIR2, and can be separated or spaced apart from each other in the first direction DIR1. In this case, as Figure 5A As shown, when the planar shape of the irradiation area IR' is circular (e.g., annular), the first direction DIR1 can be the circumferential direction, and the second direction DIR2 can be the radial direction.

[0268] Figure 13 The conductive pattern CP' is shown extending in the second direction DIR2, but the conductive pattern CP' may extend upward in a third direction that intersects the first direction DIR1 and the second direction DIR2.

[0269] Figure 14 and Figure 15 This is an enlarged plan view of the conductive patterns CP” and CP”’ according to another embodiment. More specifically, Figure 14 The arrangement in Figure 9 The conductive pattern CP in the irradiated area IR. Figure 15 The arrangement in Figure 10 The conductive pattern CP in the irradiated area IR”'.

[0270] Reference Figure 14 and Figure 15 As mentioned above Figure 9 and Figure 10 As described, the irradiation area IR " can include a first area AR1" and a second area AR2, and the irradiation area IR "' can include the first area AR1"' and the second area AR2"'. The second area AR2" can include multiple point regions DTA surrounded by the first area AR1", and the second area AR2"' can include multiple point regions DTA' surrounded by the first area AR1"'. The number and shape of the point regions DTA and DTA' can be appropriately changed. For example, as Figure 14 As shown, the planar shape of the point region DTA can be circular, or as shown in the figure. Figure 15 As shown, the planar shape of the point region DTA' can be rectangular. Additionally, as... Figure 14 As shown, point regions DTA can be arranged offset or deviated from each other. In another example, such as Figure 15 As shown, point regions DTA' can be arranged to be separated from each other at regular intervals.

[0271] like Figure 14 and Figure 15 As shown, because the conductive pattern CP” covers the first region AR1 of the insulating layer 201, the conductive pattern CP”' covers the first region AR1”' of the insulating layer 201, and the second regions AR2” and AR2”' of the insulating layer 201 can be exposed, the conductive patterns CP” and CP”' can have multiple openings CPh and CPh' that expose the point regions DTA and DTA' respectively. Depending on the planar shape of the point regions DTA and DTA', the planar shape of the openings CPh or CPh' can be as follows: Figure 14 The circle shown, or it could be like... Figure 15 The rectangle shown.

[0272] According to the embodiments, moisture penetration and crack formation in display devices including openings can be prevented, reduced, or minimized. However, the above effects are illustrative, and those skilled in the art can understand the effects of the embodiments more clearly from the description.

[0273] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the claims and their equivalents.

Claims

1. A method for manufacturing a display device, the method comprising: Prepare a substrate in which an opening region and a non-display region surrounding at least a portion of the opening region are defined; An insulating layer is formed on the substrate, the insulating layer having an opening corresponding to the opening region and defining an irradiation area including a first region and a second region in the non-display region; A conductive pattern is formed on the insulating layer in the irradiated area, the conductive pattern covering the first area of ​​the insulating layer and exposing the second area of ​​the insulating layer; An organic material layer is formed on the insulating layer and the conductive pattern; An electrode layer is formed on the organic material layer; as well as The conductive pattern, the organic material layer in the irradiated area, and the electrode layer in the irradiated area are removed by irradiating the insulating layer with a laser beam.

2. The method according to claim 1, wherein, The first region includes a plurality of line regions extending in a first direction and spaced apart from each other in a second direction. The second region includes a plurality of spaced-out regions extending in the first direction and spaced apart from each other in the second direction. The plurality of line regions and the plurality of spaced regions are arranged alternately along the second direction.

3. The method according to claim 2, wherein, The irradiated area has a closed curve shape extending in the first direction in the plan view.

4. The method according to claim 3, wherein, The planar shape of the irradiated area is circular. Wherein, the first direction is the circumferential direction, and The second direction is the radial direction.

5. The method according to claim 2, wherein, The irradiated area has a closed curve shape extending in the second direction in the plan view.

6. The method according to claim 5, wherein, The planar shape of the irradiated area is circular. Wherein, the second direction is the circumferential direction, and Wherein, the first direction is the radial direction.

7. The method according to claim 1, wherein, The second region includes a plurality of point regions surrounded by the first region, and The conductive pattern has multiple openings that expose the multiple point regions.

8. The method according to claim 1, wherein, A display area is also defined in the substrate. The non-display area is located between the opening area and the display area, and The method further includes: A pixel circuit including transistors and capacitors is formed on the insulating layer; Pixel electrodes are formed in the display area, and the pixel electrodes are electrically connected to the pixel circuit; and The organic material layer is formed on the pixel electrode.

9. The method according to claim 8, wherein, The pixel electrode and the conductive pattern are formed using the same process and include the same conductive material.

10. The method according to claim 1, wherein, The step of irradiating the irradiated area of ​​the insulating layer with the laser beam includes: A first opening is formed in the organic material layer to expose at least a portion of the insulating layer; and A second opening corresponding to the first opening is formed in the electrode layer.

11. The method according to claim 1, further comprising heat-treating the first region of the insulating layer.

12. The method according to claim 11, wherein, The step of irradiating the irradiated area of ​​the insulating layer with the step of performing the heat treatment on the first area of ​​the insulating layer is performed simultaneously.

13. The method according to claim 1, further comprising forming an encapsulation layer on the electrode layer, the encapsulation layer comprising an inorganic encapsulation layer and an organic encapsulation layer.

14. The method according to claim 13, wherein, The inorganic encapsulation layer contacts the upper surface of the irradiated area of ​​the insulating layer and the sidewall of the organic material layer, the sidewall of the organic material layer being formed by removing the organic material layer from the irradiated area.

15. The method of claim 1, further comprising forming a plurality of dams on the substrate in the non-display area. in, The conductive pattern is arranged between the multiple dams.

16. A display device, the display device comprising: A substrate having an opening region, a display region surrounding at least a portion of the opening region, and a non-display region between the opening region and the display region; An insulating layer, on the substrate, has an opening corresponding to the opening region, and defines a plurality of irradiation regions and a plurality of dam regions in the non-display region; An organic material layer is placed on the insulating layer, and at least a portion of each of the plurality of irradiated areas of the insulating layer is exposed; as well as Multiple dams are respectively arranged in the multiple dam regions of the insulation layer. The plurality of irradiation areas and the plurality of dam areas extend in a first direction and are arranged alternately along a second direction intersecting the first direction. Each of the plurality of irradiated regions includes a first region and a second region, and Through thermal conduction treatment, the first region has a higher film density than the second region.

17. The display device according to claim 16, wherein, Each of the plurality of irradiation areas and the plurality of dam areas has a closed curve shape extending in the first direction in the plan view.

18. The display device according to claim 16, wherein, The first region includes a plurality of line regions that extend upward in a third direction and are spaced apart from each other in a fourth direction intersecting the third direction. The second region includes a plurality of spaced regions that extend upward from the third direction and are spaced apart from each other in the fourth direction. The plurality of line regions and the plurality of spaced regions are arranged alternately along the fourth direction.

19. The display device according to claim 16, wherein, The second region includes multiple point regions surrounded by the first region.

20. The display device according to claim 16, wherein, The insulating layer includes trenches corresponding to the first region.

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