Apparatus for separating semiconductor chips and method for separating semiconductor chips by using the same

Abstract

Disclosed are an apparatus and a method for separating a semiconductor chip provided on a base member via an adhesive member from the base member. The method includes the steps of providing a pushing member on a side of the base member opposite a side on which the semiconductor chip is provided, and moving the pushing member in a direction adjacent to the semiconductor chip; and separating the semiconductor chip moved together with the pushing member from the base member by a pickup unit. The adhesive member and the pushing member are each magnetized such that a repulsive force acts on each other.

Description

Technical Field

[0001] This invention claims the benefit of Korean Patent Application No. 10-2020-0014526, filed on February 6, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. The present invention relates to an apparatus for separating semiconductor chips and a method for separating semiconductor chips using the apparatus. Background Technology

[0002] Typically, in semiconductor manufacturing, the process of cutting several semiconductor chips that are integrally attached to a wafer at the chip level is called the sawing process. In the sawing process, a substrate component (so-called dicing tape) used to fix the semiconductor chips to be cut is attached to the lower surface of the wafer.

[0003] Semiconductor chips that are separated horizontally by a sawing process are sent to a die attachment process. During the die attachment process, each semiconductor chip is separated from the substrate component and picked up by a pick-up unit or the like, and then transported to an electrical connection device such as a substrate and a lead frame.

[0004] Meanwhile, recent trends have shown that semiconductor chips are becoming smaller in size and thickness. Furthermore, following this trend, the thickness of the die attach film (DAF) inserted between the semiconductor chip and the substrate is also decreasing.

[0005] As mentioned above, with the scaling of semiconductor chips and DAFs, the frequency of cracks and semiconductor chip picking errors increases during semiconductor chip separation and picking, resulting in reduced yield.

[0006] In related technologies, to improve the picking characteristics of the object to be picked up, several pushers are used to push the object upwards; that is, the pushers push the object upwards from its bottom, and simultaneously, the picking unit picks up the object by fixing it in place at the top using a vacuum. However, when using pushers, there is a problem that force is applied locally to the object to be picked up, which can lead to damage to objects with a small thickness.

[0007] The aforementioned background technology refers to technical information that is possessed by the inventors in order to obtain embodiments of the present invention or obtained in the process of obtaining embodiments of the present invention, and may not necessarily be considered as publicly known technology disclosed to the public prior to the filing of an application for use in embodiments of the present invention. Summary of the Invention

[0008] Technical issues

[0009] Embodiments of the present invention are intended to provide apparatus and methods for easily separating a semiconductor chip disposed on a substrate member via an adhesive member from the substrate member.

[0010] The problems to be solved by the present invention are not limited to the aforementioned problems, and those skilled in the art will clearly understand from the following description other problems not mentioned.

[0011] Technical solution

[0012] One embodiment of the present invention provides a method for separating a semiconductor chip disposed on a substrate member via an adhesive member from the substrate member, the method comprising: providing a pushing member on a side of the substrate member opposite to the side on which the semiconductor chip is disposed, and moving the pushing member in a direction adjacent to the semiconductor chip; and separating the semiconductor chip, which moves together with the pushing member, from the substrate member by a pickup unit, wherein the adhesive member and the pushing member are each magnetized such that repulsive forces act on each other.

[0013] According to one embodiment of the invention, the adhesive member and the pushing member can be magnetized in their thickness direction.

[0014] According to one embodiment of the present invention, the upper surface of the pushing member may be smaller than the lower surface of the semiconductor chip.

[0015] According to one embodiment of the invention, the adhesive component may be a die attachment film (DAF).

[0016] According to one embodiment of the invention, the die attachment film can be manufactured by: providing a magnetic material to a liquid mixture containing a polymer, magnetizing the magnetic material such that the magnetic material is oriented in a predetermined direction, and drying the liquid mixture.

[0017] According to one embodiment of the invention, the pickup unit can pick up a semiconductor chip by creating a vacuum therein.

[0018] One embodiment of the present invention provides an apparatus for separating a semiconductor chip disposed on a substrate member via an adhesive member from the substrate member, the apparatus comprising: a pushing member that moves the semiconductor chip from the substrate member by moving in a direction adjacent to the semiconductor chip; and a picking unit that separates the semiconductor chip from the substrate member by picking up the semiconductor chip moving together with the pushing member, wherein the adhesive member and the pushing member are each magnetized such that repulsive forces act on each other, and the pushing member is disposed on a side of the substrate member opposite to the side on which the semiconductor chip is disposed.

[0019] According to one embodiment of the invention, the adhesive member and the pushing member can be magnetized in their thickness direction.

[0020] According to one embodiment of the present invention, the upper surface of the pushing member may be smaller than the lower surface of the semiconductor chip.

[0021] According to one embodiment of the invention, the adhesive component may be a die attachment film (DAF).

[0022] According to one embodiment of the invention, the die attachment film can be manufactured by: providing a magnetic material to a liquid mixture containing a polymer, magnetizing the magnetic material such that the magnetic material is oriented in a predetermined direction, and drying the liquid mixture.

[0023] According to one embodiment of the invention, the pickup unit can pick up a semiconductor chip by creating a vacuum therein.

[0024] Beneficial effects

[0025] According to an embodiment of the present invention, an apparatus for separating a semiconductor chip and a method for using the apparatus to separate a semiconductor chip can be readily separated and picked up only the particular semiconductor chip without affecting other semiconductor chips surrounding the particular semiconductor chip to be separated and picked up from the substrate member.

[0026] The effects of the present invention are not limited to those described above, and those skilled in the art will clearly understand from the specification and drawings of this application any effects not mentioned. Attached Figure Description

[0027] Figure 1 This is a view illustrating the structure of a semiconductor chip disposed on a substrate member via an adhesive member according to an embodiment of the present invention.

[0028] Figure 2 The view is shown schematically to illustrate a process of separating a semiconductor chip by means of a pushing member and a picking unit according to an embodiment of the present invention.

[0029] Figure 3 A flowchart illustrating a method for separating a semiconductor chip according to one embodiment of the present invention is provided. Detailed Implementation

[0030] The invention will become apparent from the following embodiments taken in conjunction with the accompanying drawings. However, the invention is not limited to such embodiments and can be implemented in various forms. The embodiments described below are merely those provided to improve the disclosure of the invention and to help those skilled in the art to fully understand the scope of the invention. The invention is defined only by the scope of the appended claims. The terminology used herein is for the purpose of describing embodiments only and is not intended to limit the invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. When used herein, the components, steps, operations, and / or elements stated by the terms "comprises" and / or "comprising" do not exclude the presence or addition of one or more additional components, steps, operations, and / or elements. Terms such as "first" and "second" may be used to describe various components, but the components are not limited to those terms. The terms are used only to distinguish one component from another.

[0031] Invention Embodiments

[0032] Figure 1 A view illustrating the structure of a semiconductor chip disposed on a substrate member via an adhesive member according to an embodiment of the present invention, and Figure 2 The view is shown schematically to illustrate a process of separating a semiconductor chip by means of a pushing member and a picking unit according to an embodiment of the present invention.

[0033] Reference Figure 1 and Figure 2 One embodiment of the present invention relates to a method for separating a semiconductor chip 3 disposed on a substrate member 1 via an adhesive member 2 from the substrate member 1.

[0034] Figure 1 and Figure 2 Each of the above illustrates several semiconductor chips obtained by cutting a semiconductor chip 3 integrally attached to a wafer at the chip level via a sawing process.

[0035] The substrate component 1 (so-called dicing tape) used to hold the semiconductor chip during dicing is pre-attached to the lower surface of the wafer before the sawing process. Therefore, even after the sawing process, as... Figure 1 and Figure 2 As shown, the semiconductor chip 3 is also attached to the substrate member 1 via the adhesive member 2.

[0036] The adhesive component 2 can be made of adhesive tape, such as core attachment film (DAF).

[0037] at the same time, Figure 3A flowchart illustrating a method for separating a semiconductor chip according to one embodiment of the present invention is provided. (Refer to...) Figure 3 According to one embodiment of the present invention, a method for separating a semiconductor chip includes a step S11 of providing a pushing member 4 on a side 1b opposite to the side 1a on which the semiconductor chip 3 is disposed, and moving the pushing member 4 in a direction adjacent to the semiconductor chip 3; and a step S13 of separating the semiconductor chip 3, which moves together with the pushing member 4, from the substrate member 1 by a picking unit 5.

[0038] According to one embodiment of the invention, the adhesive member 2 and the pushing member 4 are each magnetized such that repulsive forces act on each other.

[0039] Specifically, the adhesive member 2 and the pushing member 4 can be magnetized in their thickness direction. For example, as Figure 1 and Figure 2 As shown, the adhesive member 2 can be magnetized such that its upper side has an N pole and its lower side has an S pole in its thickness direction, and the pushing member 4 can be magnetized such that its upper side has an S pole and its lower side has an N pole in its thickness direction so that a repulsive force can act on the adhesive member 2. Conversely, the adhesive member 2 can be magnetized such that its upper side has an S pole and its lower side has an N pole in its thickness direction, and the pushing member 4 can be magnetized such that its upper side has an N pole and its lower side has an S pole in its thickness direction so that a repulsive force can act on the adhesive member 2.

[0040] According to one embodiment of the present invention, the pushing member 4 can be magnetized in the desired thickness direction by using an electromagnet to generate a magnetic field in the direction opposite to the direction in which the adhesive member 2 is magnetized. Specifically, an electromagnet, which is a member in which a coil is wound, is provided in the thickness direction of the pushing member 4, and a current is applied to the electromagnet to generate a magnetic field by the principle of electromagnetic induction. By adjusting the predetermined magnetization direction of the adhesive member 2 and the direction of the current to generate a repulsive force, the semiconductor chip 3 can be separated from the substrate member 1 by the repulsive force between the pushing member 4 and the adhesive member 2. Furthermore, the pushing member 4 itself can be magnetized to generate a repulsive force with the adhesive member 2, and the pushing member 4 can be made of a conductive material and connected to the electromagnet to generate a magnetic field while applying a current to the electromagnet, thereby generating a repulsive force with the adhesive member 2. By magnetizing the pushing member 4 in the aforementioned method, the semiconductor chip 3 can be easily separated from the substrate member 1.

[0041] Therefore, when the pushing member 4 is moved in a direction adjacent to the semiconductor chip 3, the adhesive member 2 moves together with the semiconductor chip 3 by a repulsive force in a direction spaced apart from the pushing member 4, so that the semiconductor chip 3 can be easily separated from the substrate member 1.

[0042] According to one embodiment of the present invention, preferably, the upper surface 4a of the pushing member 4 is smaller than the lower surface 3a of the semiconductor chip 3. This is to reduce the influence of the repulsive force between the pushing member 4 and the adhesive member 2 on the adhesive member 2 disposed around the pushing member 4.

[0043] According to one embodiment of the invention, a die attachment film (DAF) can be manufactured by: providing a magnetic material to a liquid mixture containing a polymer, magnetizing the magnetic material such that the magnetic material is oriented in a predetermined direction, and drying the liquid mixture.

[0044] According to one embodiment of the invention, a magnetic material is dispersed in a liquid mixture containing a polymer, a coating layer is formed using the liquid mixture containing the dispersed magnetic material, and a magnetic field is applied to the lower surface of the coating layer such that the dispersed magnetic material is oriented in a thickness direction that is the desired direction of magnetization. Specifically, the magnetic material is dispersed in a liquid mixture containing a polymer, a coating layer is formed using the liquid mixture containing the dispersed magnetic material, and then a magnetic field is applied to the lower surface of the coating layer such that the dispersed magnetic material is oriented in a direction parallel to the direction of the magnetic field. By orienting the magnetic material in the aforementioned method, the adhesive member 2 can be made magnetic in the thickness direction.

[0045] Furthermore, according to one embodiment of the present invention, the pickup unit 5 can be a device for picking up the semiconductor chip 3 by forming a vacuum therein. Specifically, the pickup unit 5 can be bent inward from the surface in contact with the semiconductor chip 3 to form a space, thereby picking up the semiconductor chip 3 by using the formed space as a vacuum condition.

[0046] One embodiment of the present invention provides an apparatus 10 for separating a semiconductor chip 3 disposed on a substrate member 1 via an adhesive member 2 from the substrate member 1. The apparatus 10 includes: a pushing member 4 that moves the semiconductor chip 3 from the substrate member 1 by moving it in a direction adjacent to the semiconductor chip 3; and a picking unit 5 that separates the semiconductor chip 3 from the substrate member 1 by picking up the semiconductor chip 3 moving together with the pushing member 4, wherein the adhesive member 2 and the pushing member 4 are each magnetized such that repulsive forces act on each other, and the pushing member 4 is disposed on a side of the substrate member 1 opposite to the side on which the semiconductor chip 3 is disposed.

[0047] According to an embodiment of the invention, an apparatus for separating semiconductor chips can easily separate and pick up only the specific semiconductor chip without affecting other semiconductor chips surrounding the specific semiconductor chip to be separated and picked up from the substrate member.

[0048] According to one embodiment of the present invention, the adhesive member 2 and the pushing member 4 can be magnetized in their thickness direction. Specifically, the adhesive member 2 and the pushing member 4 can be magnetized in their thickness direction. For example, as... Figure 1 and Figure 2 As shown, the adhesive member 2 can be magnetized such that its upper side has an N pole and its lower side has an S pole in its thickness direction, and the pushing member 4 can be magnetized such that its upper side has an S pole and its lower side has an N pole in its thickness direction so that a repulsive force can act on the adhesive member 2. Conversely, the adhesive member 2 can be magnetized such that its upper side has an S pole and its lower side has an N pole in its thickness direction, and the pushing member 4 can be magnetized such that its upper side has an N pole and its lower side has an S pole in its thickness direction so that a repulsive force can act on the adhesive member 2. As described above, since the adhesive member 2 and the pushing member 4 are magnetized in the thickness direction and are configured to exhibit a repulsive force when the pushing member 4 is moved in a direction adjacent to the semiconductor chip 3, the adhesive member 2 moves together with the semiconductor chip 3 by the repulsive force in a direction spaced apart from the pushing member 4, making it easy to separate the semiconductor chip 3 from the substrate member 1.

[0049] According to one embodiment of the present invention, the pushing member 4 can be magnetized in the desired thickness direction by using an electromagnet to generate a magnetic field in the direction opposite to that in which the adhesive member 2 is magnetized. Specifically, an electromagnet, which is a member in which a coil is wound, is provided in the thickness direction of the pushing member 4, and a current is applied to the electromagnet to generate a magnetic field by the principle of electromagnetic induction. By adjusting the predetermined magnetization direction of the adhesive member 2 and the direction of the current to generate a repulsive force, the semiconductor chip 3 can be separated from the substrate member 1 by the repulsive force between the pushing member 4 and the adhesive member 2. Furthermore, the pushing member 4 itself can be magnetized to generate a repulsive force with the adhesive member 2, and the pushing member 4 can be made of a conductive material and connected to an electromagnet to generate a magnetic field while applying a current to the electromagnet, thereby generating a repulsive force with the adhesive member 2. By magnetizing the pushing member 4 in the aforementioned method, the semiconductor chip 3 can be easily separated from the substrate member 1.

[0050] According to one embodiment of the present invention, the upper surface of the pushing member 4 may be smaller than the lower surface of the semiconductor chip 3. As described above, the upper surface of the pushing member 4 is made smaller than the lower surface of the semiconductor chip 3, thereby reducing the influence of the repulsive force between the pushing member 4 and the adhesive member 2 on the adhesive member 2 disposed around the pushing member 4.

[0051] According to one embodiment of the present invention, the adhesive member 2 may be a die attachment film (DAF). By selecting the adhesive member 2 as a die attachment film as described above, the semiconductor chip 3 can be easily attached to the wafer.

[0052] According to one embodiment of the invention, the die attachment film can be manufactured by providing a magnetic material to a liquid mixture containing a polymer, magnetizing the magnetic material such that it is oriented in a predetermined direction, and then drying the liquid mixture. By manufacturing the die attachment film (DAF) as described above, the magnetization direction can be easily adjusted.

[0053] According to one embodiment of the invention, a magnetic material is dispersed in a liquid mixture containing a polymer, a coating layer is formed using the liquid mixture containing the dispersed magnetic material, and a magnetic field is applied to the lower surface of the coating layer such that the dispersed magnetic material can be oriented in a thickness direction that is the desired direction of magnetization. Specifically, the magnetic material is dispersed in a liquid mixture containing a polymer, a coating layer is formed using the liquid mixture containing the dispersed magnetic material, and then a magnetic field is applied to the lower surface of the coating layer such that the dispersed magnetic material can be oriented in a direction parallel to the direction of the magnetic field. By orienting the magnetic material in the aforementioned method, the adhesive member 2 can be made magnetic in the thickness direction.

[0054] According to one embodiment of the invention, the pickup unit 5 can be configured to pick up the semiconductor chip 3 by creating a vacuum therein. Specifically, the pickup unit 5 can be bent inward from the surface in contact with the semiconductor chip 3 to form a space, thereby using the formed space as a vacuum condition to pick up the semiconductor chip 3. As described above, the pickup unit 5 creates a vacuum to pick up the semiconductor chip 3, and since the pickup unit 5 is used in conjunction with the pushing member 4, damage to the surface of the semiconductor chip 3 is minimized and the pickup characteristics of the semiconductor chip 3 are improved.

[0055] According to one embodiment of the invention, only the specific semiconductor chip can be easily separated and picked up without affecting other semiconductor chips surrounding the specific semiconductor chip to be separated and picked up from the substrate member.

[0056] While the invention has been described with respect to the preferred embodiments described above, various corrections and modifications can be made without departing from the subject matter and scope of this disclosure. Therefore, the appended claims are intended to include such corrections or modifications, provided they fall within the scope of the invention.

[0057] [Figure Labels]

[0058] 1: Base components

[0059] 2: Adhesive components

[0060] 3: Semiconductor chips

[0061] 4: Pushing components

[0062] 5: Pick-up Unit

[0063] 10: Devices for separating semiconductor chips

[0064] S11: Steps for moving the pushing component

[0065] S13: Steps for separating semiconductor chips

Claims

1. A method for separating a semiconductor chip disposed on a substrate member via an adhesive member from the substrate member, the method comprising: A step of providing a pushing member on the side of the substrate member opposite to the side on which the semiconductor chip is disposed, and moving the pushing member in a direction adjacent to the semiconductor chip; as well as The step of separating the semiconductor chip, which moves together with the pushing member, from the substrate member via the pickup unit. The base member is a non-magnetized base member, and the adhesive member and the pushing member are each magnetized such that a repulsive force acts on each other through the base member.

2. The method of claim 1, wherein the adhesive member and the pushing member are magnetized in their thickness direction.

3. The method according to claim 1, wherein the upper surface of the pushing member is smaller than the lower surface of the semiconductor chip.

4. The method according to claim 1, wherein the adhesive component is a core attachment film.

5. The method of claim 4, wherein the die attachment film is manufactured by: providing a magnetic material to a liquid mixture comprising a polymer, magnetizing the magnetic material such that the magnetic material is oriented in a predetermined direction, and drying the liquid mixture.

6. The method of claim 1, wherein the pickup unit picks up the semiconductor chip by creating a vacuum therein.

7. An apparatus for separating a semiconductor chip disposed on a non-magnetized substrate member via an adhesive member from the substrate member, the apparatus comprising: A pushing member that moves the semiconductor chip by moving it from the substrate member in a direction adjacent to the semiconductor chip; and A pickup unit separates the semiconductor chip from the substrate component by picking up the semiconductor chip that moves together with the pushing member. The adhesive member and the pushing member are each magnetized such that a repulsive force acts on each other through the substrate member, and the pushing member is disposed on the side of the substrate member opposite to the side on which the semiconductor chip is disposed.

8. The apparatus of claim 7, wherein the adhesive member and the pushing member are magnetized in their thickness direction.

9. The apparatus of claim 7, wherein the upper surface of the pushing member is smaller than the lower surface of the semiconductor chip.

10. The apparatus of claim 7, wherein the adhesive member is a core attachment membrane.

11. The apparatus of claim 10, wherein the die attachment film is manufactured by: providing a magnetic material to a liquid mixture comprising a polymer, magnetizing the magnetic material such that the magnetic material is oriented in a predetermined direction, and drying the liquid mixture.

12. The apparatus of claim 7, wherein the pickup unit picks up the semiconductor chip by creating a vacuum therein.

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