Underfill detection apparatus for semiconductor package structures

Abstract

The application discloses a kind of bottom glue detection devices of semiconductor packaging structure, for the detection of measured area on bearing table, this bottom glue detection equipment includes: area light source device and image pickup device;Wherein, area light source device includes the passage of through body and multiple light emitting units to the irradiation of bearing table, the maximum spacing between passage wall surface is first limit distance, the light emitting angle of each light emitting unit forming area light source is not greater than 30 degrees;Image pickup device is configured above area light source device, and the intercept image of measured area is obtained by passage;The distance between the bottom surface of area light source device and the focusing plane of image pickup device is second limit distance, and the ratio between second limit distance and first limit distance is between 3-7.5.The distribution condition of bottom glue of semiconductor packaging structure can be correctly detected in this way.

Description

[Technical Field]

[0001] This invention relates to a surface inspection device for a semiconductor package structure, and more specifically, to an underfill inspection device for detecting the distribution of underfill on the surface of a semiconductor package structure. [Background Technology]

[0002] In the semiconductor packaging process, the application of an appropriate primer between the chip and the substrate enhances the mechanical strength of the contacts, thereby extending the chip's lifespan. For example, the application of primer to flip-chips increases their reliability, preventing contacts (solder joints) from detaching or breaking due to differences in thermal expansion coefficients between the chip and the substrate.

[0003] However, as the overall semiconductor manufacturing process capabilities gradually improve, the requirements for packaging accuracy are becoming increasingly stringent. When the application of the primer is abnormal, it will prevent the primer from being properly distributed between the chip and the substrate, resulting in an excessively wide or narrow coating area. This can lead to abnormalities such as excess or creeping of the primer, which need to be effectively detected. [Summary of the Invention]

[0004] One objective of this invention is to provide an adhesive testing device that can effectively detect the distribution of adhesive in semiconductor packaging structures.

[0005] To achieve the above and other objectives, this invention proposes a substrate testing device for semiconductor packaging structures, used to test a test area on a carrier stage. The substrate testing device includes a surface light source and an image acquisition device. The surface light source is disposed above the carrier stage and includes a channel penetrating the surface light source and multiple light-emitting units for illuminating the carrier stage. The maximum spacing between the walls of the channel is a first limiting distance, and the half-power angle of each light-emitting unit forming the surface illumination light source is no greater than 30 degrees. The image acquisition device is disposed above the surface light source and is used to acquire a captured image of the test area through the channel. The distance between the bottom surface of the surface light source and a focusing plane of the image acquisition device is a second limiting distance, and the ratio of the second limiting distance to the first limiting distance is between 3 and 7.5.

[0006] According to one embodiment of the present invention, the second limiting distance does not exceed 350 mm.

[0007] According to one embodiment of the present invention, the channel is located between two additional channels.

[0008] According to an embodiment of the present invention, the adhesive testing device may further include: a side light source device that provides obliquely incident light to the test area, wherein the obliquely incident light is incident on the test area at an angle of 60-65 degrees, wherein the illumination for adhesive testing on the top surface of a chip within the semiconductor package structure is provided by the surface light source device; and the illumination for adhesive testing on the top surface of a substrate within the semiconductor package structure is provided solely by the side light source device.

[0009] According to an embodiment of the present invention, the side light source device has a first side light source module and a second side light source module, which are respectively arranged along the two long sides of the surface light source device.

[0010] According to an embodiment of the present invention, each light-emitting unit in the first side light source module and the second side light source module has a half-power angle of no more than 30 degrees.

[0011] According to one embodiment of the present invention, the wavelength of the obliquely incident light can be complementary to the color of the substrate.

[0012] Therefore, by limiting the emission angle of the detection equipment and the configuration relationship between the light source height and the imaging channel, it is helpful to detect the contour of the adhesive on the semiconductor packaging structure, thereby accurately identifying the distribution of the adhesive and avoiding errors under manual visual inspection. This detection equipment can also be used for one-by-one and comprehensive inspection on a mass production line with limited space, avoiding the situation of missed / undetected defects that is easily caused by manual sampling. [Attached Image Description]

[0013] Figure 1 This is a schematic diagram of a semiconductor packaging structure;

[0014] Figure 2 This is a cross-sectional schematic diagram of the adhesive testing device according to an embodiment of the present invention;

[0015] Figure 3 This is a three-dimensional schematic diagram of the adhesive testing device according to an embodiment of the present invention;

[0016] Figure 4 This is a cross-sectional schematic diagram of the adhesive testing device according to another embodiment of the present invention;

[0017] Figure 5 This is a cross-sectional schematic diagram of the adhesive testing device in another embodiment of the present invention;

[0018] Figure 6 for Figure 5 A three-dimensional schematic diagram of the adhesive testing device in the embodiment;

[0019] Figure 7 for Figure 5A schematic diagram of the first detection state in the embodiment;

[0020] Figure 8 for Figure 5 A schematic diagram of the second detection state in the embodiment; and

[0021] Figure 9 This is a perspective view of the adhesive testing device in another embodiment of the present invention.

Detailed Implementation Methods

[0022] To fully understand the purpose, features, and effects of the present invention, the present invention will now be described in detail with reference to the following specific embodiments and accompanying drawings:

[0023] In this application, the terms "a" or "an" are used to describe units, components, structures, devices, modules, systems, parts, or regions, etc. This is used merely for ease of explanation and to provide a general meaning for the scope of the invention. Therefore, unless it is obvious otherwise, this description should be understood to include one or at least one, and the singular also includes the plural.

[0024] In this application, the terms “comprising,” “including,” “having,” or any other similar terms are not limited to the elements listed herein, but may include other elements not expressly listed but which are typically inherent in the unit, component, structure, device, module, system, part, or region.

[0025] Please refer to Figure 1 This is a schematic diagram of a semiconductor packaging structure. Figure 1 The semiconductor packaging structure described above uses a flip-chip package as an example, comprising a substrate 11, a chip 12, bonding pads 13, and a primer 14. Generally, during fabrication, the chip 12 is first aligned and stacked with the substrate 11, followed by reflow soldering to allow the solder balls on the bottom surface of the chip 12 to bond with the solder pads on the top surface of the substrate 11, forming bonding pads 13. Then, a suitable amount of primer is applied to one or more sides of the chip 12 using a coating machine. Capillary action or additional negative pressure suction forces the primer into the gap between the chip 12 and the substrate 11 to complete the filling, followed by curing. The distribution of the primer on the semiconductor packaging structure will vary depending on the quality of the filling.

[0026] The normal distribution of the base adhesive will be on the side edge of chip 12, and after curing, it will appear as follows. Figure 1 The diagram shows the normal state 141. If adhesive residue appears on the top surface of chip 12, it is considered an abnormal state 143, indicating adhesive creep. Furthermore, if the adhesive residue on substrate 11 is excessively distributed, it is considered an abnormal state 142, indicating adhesive overflow. These abnormalities need to be detected; they cannot be effectively detected through manual visual inspection.

[0027] Next, please refer to the following: Figure 2 and Figure 3 , Figure 2 This is a cross-sectional schematic diagram of the adhesive testing device according to one embodiment of the present invention. Figure 3 This is a perspective view of a substrate testing device according to an embodiment of the present invention. The substrate testing device is used to test the test area A on the support stage 40. The substrate testing device includes a surface light source device 20 and an image acquisition device 30. The surface light source device 20 is disposed above the support stage 40. The surface light source device 20 itself includes a channel 21 penetrating its body. This channel 21 is used to allow the image acquisition device 30 disposed above the surface light source device 20 to acquire an image of the test area A, thereby obtaining a cropped image I1.

[0028] The area of ​​the tested region A can be the same as or different from the area of ​​the captured image I1. For example, when the area of ​​the tested region A is large, the tested region A can be detected by moving the detection device or the moving platform 40 and capturing images multiple times. In addition, the tested region A can also be detected by multiple imaging devices 30 working together.

[0029] like Figure 2 As shown, the maximum spacing between the walls of channel 21 is defined as the first limit distance D1. The aforementioned spacing between walls refers to the distance between two walls facing each other. The distance between the plane P1 of the bottom surface of the surface light source device 20 and the focusing plane P2 of the imaging device 30 is defined as the second limit distance D2. The surface light source device 20 includes multiple light-emitting units 22 for illuminating the support stage 40. The half-power angle of each of these light-emitting units 22 is no greater than 30 degrees (i.e., no more than 15 degrees to the left and right), and they are distributed in a planar shape to provide a surface illumination light source to the support stage 40. Although a smaller half-power angle of the light-emitting units 22 can create an illumination effect similar to parallel light, reducing the amount of reflected light back to the imaging device 30, further spatial parameter limitations are needed for reliable substrate detection in semiconductor packaging structures.

[0030] In embodiments of the present invention, the ratio (D2 / D1) of the second limiting distance D2 to the first limiting distance D1 needs to be between 3 and 7.5. That is, through this specific definition of spatial relationship, the bottom surface of the surface light source device 20 can have a sufficient light source layout area, and the limitation on the opening size of the channel 21 can also block unwanted reflected light, making it difficult for light reflected from the substrate to enter the imaging device 30, thereby improving the recognition degree of the substrate outline. For the detection of the substrate, the specific configuration relationship between the second limiting distance D2 and the first limiting distance D1 in the embodiments enables the substrate detection device to achieve accurate detection of the substrate distribution in a small space.

[0031] The first limit distance D1 refers to the maximum distance between the walls of the channel 21 of the surface light source device 20. For example, if the channel is a circular through hole, the first limit distance D1 is the diameter. Furthermore, if the channel is a rectangular through hole, the first limit distance D1 is the diagonal distance.

[0032] The focusing plane P2 refers to the focusing position of the image acquisition device 30 on the stage 40, and it has a certain depth of field (DOF) so that the surface structure of the semiconductor package structure 10 under test within this depth of field range can be clearly presented in the captured image I1. The height (second limiting distance D2) of the surface light source device 20 can be defined by the two planes P1 and P2.

[0033] Furthermore, based on the foregoing, with the half-power angle of each light-emitting unit 22 less than 30 degrees and / or the second limiting distance D2 not exceeding 350 (mm), the adhesive testing equipment can be configured more compactly, thus facilitating its assembly on existing production lines. Given the increasingly stringent space conditions on these production lines, an adhesive testing equipment that can be compactly configured and provides accurate testing results will help address this issue. The aforementioned half-power angle refers to the angle between two emission directions, selected from the cross-section of the light-emitting unit 22, where the luminous intensity is half the central intensity. In other words, the half-power angle is the maximum angle that a beam with half-power intensity can form. The light-emitting unit 22 can, for example, be a light-emitting diode (LED).

[0034] Next, please refer to Figure 4 This is a cross-sectional schematic diagram of the adhesive testing device according to another embodiment of the present invention. In this embodiment, two additional imaging devices 31 are further included, and the surface light source device 20 also has two additional channels 211. The additional imaging devices 31 can obtain corresponding additional cropped images in the test area through the corresponding additional channels 211. When the test area is large, due to the reflective characteristics of the adhesive, a specific configuration relationship is required so that the distribution of the adhesive can still be effectively detected even when the test area is expanded.

[0035] exist Figure 4 In the example, the maximum spacing between the walls of the additional channel 211 is the third limit distance D3, which must be configured to be no greater than half of the first limit distance D1, and the shortest distance D4 between the walls of the additional channel 211 and the channel 21 does not exceed half of the third limit distance D3. This configuration allows the surface light source device 20 to provide effective and sufficient incident light to the areas with adhesive underlay within the test area. This effective and sufficient illumination, within a compact configuration where the second limit distance D2 does not exceed 350 mm, allows the distribution of adhesive underlay within the expanded test area to be effectively detected by each imaging device. Figure 4 In the example configuration, the maximum length of the wide side of the detection range can reach 350 (mm), and the wide side of the detection range is parallel to the side length D5 of the surface light source device 20 extending in the arrangement direction of channel 21 and the two additional channels 211.

[0036] Please see Figure 5 and Figure 6 . Figure 5 This is a cross-sectional schematic diagram of the adhesive testing device in another embodiment of the present invention. Figure 6 for Figure 5 A perspective view of the adhesive testing device in this embodiment. Compared to Figure 3 In the embodiments, Figure 5 and Figure 6 In this embodiment, the substrate testing equipment is additionally equipped with a side light source device 50 that can provide oblique incident light L1 to the substrate 11 (the area under test). The side light source device 50 has a first side light source module 51 and a second side light source module 52. Figure 6 As shown, the first side light source module 51 and the second side light source module 52 can extend along the two long sides of the surface light source device 20, respectively, to provide illumination to the area under test in this configuration. It should be understood that the side light source device 50 may also include only a single set of side light source modules. Figure 5 and Figure 6 What is shown is not a limitation.

[0037] Figure 5 In this embodiment, the side light source device 50, which has a first side light source module 51 and a second side light source module 52, is configured to allow obliquely incident light L1 to be incident on the support stage 40 at an incident angle θ between 60 and 65 degrees. That is, the obliquely incident light L1 has an incident angle θ on the substrate 11 of the semiconductor package structure 10. The half-power angle of each light-emitting unit (or side light-emitting unit) mounted on the first side light source module 51 and the second side light source module 52 in the side light source device 50 can be configured to be no greater than 30 degrees (i.e., no more than 15 degrees to the left and right). When the undercoat detection device detects whether the top surface of the chip 12 has a coating layer through the imaging device 30, the surface light source device 20 is used for illumination (the side light source device 50 is not turned on); when the undercoat detection device detects the coating layer overflow condition on the substrate 11 through the imaging device 30, only the side light source device 50 is used for illumination to complete the detection of the overflow distribution condition of the coating layer on the surface of the semiconductor package structure. For coatings using epoxy resin (i.e., primer) Figure 5 The example of the base adhesive testing equipment can provide more accurate detection of adhesive overflow.

[0038] Next, please refer to the following: Figure 5 and Figure 7 . Figure 7 for Figure 5 The first detection state diagram of the embodiment is irradiated with forward incident light L2. Figure 7 The examples of base adhesive distribution include normal state 141, adhesive overflow state 142, and adhesive creep state 143. Figure 5 The surface light source device 20 provides near-forward incident light L2. When the incident surface is relatively flat, the reflected light L2' from the flat surface (i.e. the incident surface of the forward incident light L2) is more likely to enter the imaging device 30 arranged above the chip 12 and the substrate 11 based on the law of reflection. Therefore, in the image obtained by the imaging device 30, the image of the chip 12 and the substrate 11 is brighter. On the other hand, for the adhesive creep state 143, since the surface of the adhesive creep state 143 has a certain degree of curvature, when the incident light L2 is incident on a near-normally incident direction, based on the law of reflection, the reflected light L2" from the adhesive creep state 143 tends to propagate in a near-horizontal direction, making it less likely to be captured by the imaging device 30 positioned above. As a result, the image of the adhesive creep state 143 is dark. For the normal state 141 and the adhesive overflow state 142, under the coating conditions with a narrow coating edge, there is less risk of spreading (not covering a large area of ​​the substrate 11 surface). Although the incident light L2 is incident on a rough surface that can cause diffuse reflection, the reflected light L2"' from the normal state 141 and the reflected light L2"" from the adhesive overflow state 142 are also less likely to be captured by the imaging device 30 positioned above. As a result, the images of the normal state 141 and the adhesive overflow state 142 are also dark. Therefore, the images of chip 12 and substrate 11 are too bright, while the images of normal state 141, overflow state 142 and creep state 143 are too dark, and the coating state of the base adhesive can be detected.

[0039] Next, please refer to the following: Figure 5 and Figure 8 . Figure 8 for Figure 5 A schematic diagram of the second detection state in the embodiment. The second detection state addresses further changes in the state of adhesive overflow. Figure 8 The example of base adhesive distribution includes normal state 141 and adhesive overflow state 142'. Figure 8 The example of adhesive overflow state 142' is a coating state presented under coating conditions with a wide adhesive edge. Adhesive overflow state is prone to spreading (covering a large area of ​​the substrate 11 surface). Figure 5 When the obliquely incident light L1 provided by the side light source device 50 is incident on the relatively flat surfaces of the chip 12 and substrate 11, the reflected light L1' from the flat surface (i.e., the incident surface of the obliquely incident light L1) is unlikely to enter the imaging device 30 positioned above the chip 12 and substrate 11 due to the law of reflection. Therefore, in the image acquired by the imaging device 30, the image of the chip 12 and substrate 11 is darker. On the other hand, for the state of excess adhesive 142', Figure 5 The obliquely incident light L1 provided by the side light source device 50, due to the rough surface of the glue-overflow state 142', will produce diffuse reflection to form reflected light L1" (reflected light from the glue-overflow state) in various directions, which can be easily captured by the image capturing device 30 positioned above. Similarly, based on the rough surface also present in the normal state 141, under the illumination of the obliquely incident light L1, diffuse reflection can also produce reflected light L1"' (reflected light from the normal state) in various directions, such as... Figure 8 As shown, it can also be easily captured by the imaging device 30 positioned above. Accordingly, the image of the substrate 14 is actually brighter than the image of the chip 12 and the substrate 11.

[0040] Furthermore, under coating conditions with a wider coating edge, the edge of the overflow state 142' is more extensive and tends to have a thin and flat coating area. For the overflow state 142', since the overflow state 142' covers a large area of ​​the substrate 11 surface, and thus has a coverage area that is approximately parallel to the substrate 11 surface, this will cause reflected light in various directions after the incident light L2 is incident. This reflected light may be easily captured by the imaging device 30 positioned above, but since the image of the overflow state 142' must be darker under the incident light L2 (it needs to be difficult for light to be reflected back to the imaging device 30).

[0041] Therefore, to further improve or enhance the detection effect of adhesive overflow, for coating conditions with a wider adhesive edge, the detection of adhesive overflow state 142' can be performed under the condition of only the side light source device 50 irradiation. Therefore, adhesive overflow can be detected regardless of whether the side light source device 50 is present. For primer detection equipment without the side light source device 50 (or without using the oblique incident light L1), it can be used for general adhesive overflow conditions (adhesive overflow with uneven edges); for primer detection equipment using the oblique incident light L1, it can detect more types of adhesive overflow conditions, including general adhesive overflow and adhesive overflow with flat edges.

[0042] Back Figure 8 In the example, with the oblique incident light L1, the reflected light L1"" from the edge of the adhesive overflow state 142' can be easily captured by the imaging device 30 positioned above. Therefore, the image of the chip 12 and substrate 11 will be darker, the image of the adhesive 14 will be brighter, and the distribution outline of the adhesive can be clearly displayed. In one embodiment, the images obtained by the imaging device 30 in the first and second detection states can correctly determine the adhesive width D6. For example, in the absence of adhesive overflow, if the defined adhesive width D6 is between 1 (mm) and 2.5 (mm), adhesive widths D6 outside this range are considered overflow and are abnormal; therefore, whether the adhesive 14 has an overflow state can be correctly detected accordingly.

[0043] In the images obtained under the first and second detection states, the image of the adhesive 14 in the adhesive-crawling state 143 is darker than the image of the chip 12 and substrate 11. Thus, the images of the chip 12 and substrate 11 are brighter, while the image of the adhesive 14 in the adhesive-crawling state 143 is darker. The outlines of the chip 12 and substrate 11 can be clearly displayed, allowing for the identification of areas obscured by the adhesive 14. Based on the known surface area of ​​the chip 12, the adhesive-crawling range extending from the edge of the chip 12 towards its center can be defined by the range of adhesive-crawling state 143 in the image and the surface area of ​​the chip 12. The maximum vertical distance between this adhesive-crawling range and the edge of the chip 12 can be defined as the maximum width, and the longest distance the adhesive-crawling range extends along the edge of the chip 12 can be defined as the maximum length. Based on this, threshold values ​​for the maximum width and maximum length can be defined. Exceeding these threshold values ​​indicates an abnormal adhesive-crawling state 143. Therefore, whether the base adhesive 14 has a crawling state can be correctly detected.

[0044] Therefore, based on the aforementioned configuration relationship between the light source height and the imaging channel, it is helpful to detect the adhesive creeping and overflow states. Furthermore, to further enhance or strengthen the overflow detection effect, a side light source device 50 can be added, which, based on the configuration relationship between the light source height and the imaging channel, can accurately detect the distribution of the base adhesive 14 in the creeping and more widespread overflow states.

[0045] Furthermore, in the aforementioned second detection state, the wavelength of the incident light L1 provided by the side light source device 50 can be configured to be complementary to the color of the substrate 11 of the semiconductor package structure, which can further help to reveal the distribution of the adhesive. This is because when the wavelength of the incident light L1 is configured to be complementary to the color of the substrate 11, the contrast of the reflected light (one type of reflected light L1' from the flat surface) of the substrate 11 can be further improved, which helps to reveal the distribution of the adhesive. For example, when the color of the substrate 11 is green, the side light source device 50 can use a light-emitting unit that can provide red light, or it can be achieved by switching the output light band of the side light source device 50. In addition, an adhesive (or black adhesive) with a higher reflectivity for red light also helps to further improve the accuracy of detection.

[0046] Next, please refer to Figure 9 This is a three-dimensional schematic diagram of the adhesive testing device in another embodiment of the present invention. Figure 9 In the example, it is possible to, within a limited space, based on the aforementioned Figure 4 and Figure 5 The arrangements described herein enable the base adhesive testing equipment to be compacted and installed on the production line.

[0047] In summary, by limiting the emission angle of the detection equipment and the configuration relationship between the light source height and the imaging channel, it is helpful to detect the substrate outline and accurately determine the substrate distribution for subsequent screening. Furthermore, the detection equipment disclosed in this embodiment can be directly integrated into mass production lines with stringent space constraints, achieving comprehensive and individual substrate distribution detection of semiconductor packaging structures. This avoids the possibility of missed / undetected defects or visual misjudgments that can easily occur during manual sampling, enabling the detection equipment disclosed in this embodiment to accurately detect the substrate distribution.

[0048] Preferred embodiments have been disclosed above. However, those skilled in the art should understand that these embodiments are for illustrative purposes only and should not be construed as limiting the scope of the invention. It should be noted that all equivalent variations and substitutions to the embodiments should be understood as being within the scope of the invention. Therefore, the scope of protection of this invention is determined by the scope of the claims.

[0049] [Attached image labels]

[0050] 10 Semiconductor Packaging Structure

[0051] 11 base plate

[0052] 12 chips

[0053] 13 Joints

[0054] 14 Base Rubber

[0055] 141 Normal state

[0056] 142. Glue overflow condition

[0057] 142' Overflow condition (coating conditions with a wide adhesive edge)

[0058] 143 Adhesive climbing state

[0059] 20-face light source device

[0060] 21 channels

[0061] 211 Additional Channel

[0062] 22 light-emitting units

[0063] 30 Image capturing device

[0064] 31 Additional image acquisition device

[0065] 40 support platform

[0066] 50 Side Light Source Device

[0067] 51 First side light source module

[0068] 52 Second side light source module

[0069] A Test Area

[0070] D1 First Distance

[0071] D2 Second Distance

[0072] D3 Third Distance

[0073] D4 Shortest distance between the additional passage and the passage wall

[0074] The side length of the D5 surface light source device

[0075] D6 glue width

[0076] I1 Capture Image

[0077] L1 oblique incident light

[0078] L1' Reflected light from the flat surface

[0079] L1" Reflected light from the overflow state

[0080] L1"' Reflected light from the normal state

[0081] L1"" Reflected light from the edge of the overflow state 142'

[0082] L2 forward incident light

[0083] L2' Reflected light from the flat surface

[0084] L2" Reflected light from the adhesive-covered state

[0085] L2"' Reflected light from the normal state

[0086] L2"" Reflected light from the overflow state

[0087] P1 The plane of the bottom surface of the surface light source device

[0088] The focusing plane of the P2 image acquisition device

[0089] θ is the incident angle of the incident light onto the stage.

Claims

1. A die-bond inspection apparatus for inspecting a die-bond of a semiconductor package structure, the die-bond inspection apparatus comprising: a surface light source device disposed above a substrate table, the surface light source device comprising a passage through the surface light source device and a plurality of light emitting units for illuminating the substrate table, a maximum distance between walls of the passage is a first distance, and a half-power angle of each of the light emitting units of the surface light source device is not greater than 30 degrees; and an image capturing device disposed above the surface light source device for capturing a cut image of a die-bond of a semiconductor package structure through the passage, wherein a distance between a bottom surface of the surface light source device and a focal plane of the image capturing device is a second distance, a ratio of the second distance to the first distance is between 3 and 7.5, and the focal plane is disposed between the bottom surface of the surface light source device and the substrate table. 2.The die-bond inspection apparatus of claim 1, further comprising: two additional image capturing devices disposed above the surface light source device, the surface light source device further comprising two additional passages, a maximum distance between walls of each of the additional passages is a third distance, the third distance is not greater than 1 / 2 of the first distance, a shortest distance between walls of each of the additional passages and the passage is not greater than 1 / 2 of the third distance, and each of the additional image capturing devices is configured to capture a corresponding additional cut image of a die-bond of a semiconductor package structure through a corresponding one of the additional passages. 3.The die-bond inspection apparatus of claim 2, wherein the second distance is not greater than 350 mm. wherein 4.The die-bond inspection apparatus of claim 3, wherein the passage is disposed between the two additional passages. 5.The die-bond inspection apparatus of claim 1, wherein illumination for die-bond inspection of a top surface of a chip in the semiconductor package structure is provided by the surface light source device, and illumination for die-bond inspection of a top surface of a substrate in the semiconductor package structure is provided by the edge light source device. 6.The die-bond inspection apparatus of claim 5, wherein the edge light source device comprises a first edge light source module and a second edge light source module, the first edge light source module and the second edge light source module are respectively disposed along two long sides of the surface light source device. 7.The die-bond inspection apparatus of claim 6, wherein each of the light emitting units in the first edge light source module and the second edge light source module has a half-power angle not greater than 30 degrees.

5. The primer inspection apparatus according to any one of claims 1 to 4, wherein the primer inspection apparatus further comprises a side light source device that provides oblique incident light to the inspection area, the oblique incident light being incident to the inspection area at an angle of 60 degrees to 65 degrees. 8.The die-bond inspection apparatus of claim 5, wherein a wavelength of the oblique incident light is a complementary color of a color of the substrate. ​ ​ ​

Images