Splicing screen and method for preparing splicing screen

Abstract

The embodiments of the present application disclose a splicing screen and a method for preparing the splicing screen. The splicing screen includes at least two panels, a filling layer and a first protective film layer. The panels include a light-emitting substrate and an encapsulation layer. The encapsulation layer encapsulates and covers the light-emitting substrate. Adjacent panels are spliced ​​together, and the sidewall surfaces of the two adjacent encapsulation layers are enclosed to define a receiving space with an opening. The opening is located on the side of the encapsulation layer away from the light-emitting substrate. The filling layer is arranged in the receiving space through the opening, and the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the encapsulation layer. The first protective film layer is arranged on the side of the encapsulation layer of at least two panels away from the light-emitting substrate, and is connected to the filling layer located in the receiving space. The present application aims to reduce the risk of separation of the first protective film layer and the panel after bending, so as to ensure the stability of the first protective film layer after setting, thereby increasing the service life of the splicing screen.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a spliced ​​screen and a method for preparing the spliced ​​screen. Background Art

[0002] Light-emitting diodes (LEDs) are semiconductor electronic components that convert electrical energy into light. Due to their compact size, long lifespan, rich colors, and low energy consumption, they are widely used in lighting, display screens, signal lights, backlights, toys, and other fields. Flexible electronic products have attracted widespread attention worldwide and are experiencing rapid development.

[0003] During research and practice in the prior art, the inventors of this application discovered that, during the manufacturing process, at least some flexible devices in flexible electronic products often begin by first forming a PI film (polyimide film) on a rigid glass substrate. The related electronic devices are then fabricated on the PI film. After the related electronic devices are fabricated, the glass substrate and the PI film are separated to form a flexible device with the PI film as the substrate. However, to create a large-scale screen, the flexible mini-LED screens need to be spliced ​​together, which is difficult to do. Furthermore, the seams at the joints are subject to stress when bent, making them prone to deformation, resulting in separation from the protective films on the upper and lower sides, thus shortening the product lifespan. Summary of the Invention

[0004] The embodiments of the present application provide a splicing screen and a method for preparing the splicing screen, aiming to reduce the risk of separation of the first protective film layer and the panel after bending, thereby ensuring the stability of the first protective film layer after setting, and thereby increasing the service life of the splicing screen.

[0005] The embodiment of the present application provides a spliced ​​screen, including:

[0006] At least two panels, each comprising a light-emitting substrate and an encapsulation layer, wherein the encapsulation layer encapsulates and covers the light-emitting substrate, wherein adjacent panels are spliced ​​together, and the sidewall surfaces of two adjacent encapsulation layers enclose and define a receiving space having an opening, wherein the opening is located on a side of the encapsulation layer away from the light-emitting substrate;

[0007] a filling layer, the filling layer passing through the opening and disposed in the accommodating space, the elastic modulus of the filling layer being lower than or equal to the elastic modulus of the encapsulation layer; and

[0008] The first protective film layer is provided on a side of the packaging layer of the at least two panels that is away from the light-emitting substrate and is connected to the filling layer located in the accommodating space.

[0009] Optionally, in some embodiments of the present application, the width D of the accommodating space gradually decreases in a direction from a side of the encapsulation layer away from the light-emitting substrate to a side close to the light-emitting substrate.

[0010] Optionally, in some embodiments of the present application, the longitudinal depth of the accommodating space is the same as the thickness of the packaging layer.

[0011] Optionally, in some embodiments of the present application, the sidewall surface of the encapsulation layer is arranged to be inclined.

[0012] Optionally, in some embodiments of the present application, an angle R formed between a side wall surface of the encapsulation layer and a surface of the encapsulation layer facing the light-emitting substrate is 20° to 60°.

[0013] Optionally, in some embodiments of the present application, the sidewall surface of the packaging layer is configured as a curved surface.

[0014] Optionally, in some embodiments of the present application, a surface of the filling layer facing away from the light-emitting substrate is coplanar with a surface of the encapsulation layer facing away from the light-emitting substrate.

[0015] Optionally, in some embodiments of the present application, the spliced ​​screen further includes a second protective film layer, and the second protective film layer is connected to a side of the light-emitting substrate of each panel facing away from the encapsulation layer.

[0016] Accordingly, the present application also provides a method for preparing a spliced ​​screen, the method comprising:

[0017] Step 10: Providing at least two splicing modules, each comprising a temporary substrate and a panel disposed on the temporary substrate, wherein the panel comprises a light-emitting substrate and an encapsulation layer, wherein the light-emitting substrate is disposed on the temporary substrate, the encapsulation layer encapsulates and covers the light-emitting substrate, and the temporary substrate is disposed on a side of the light-emitting substrate facing away from the encapsulation layer;

[0018] Step 20: Splicing the splicing modules, wherein in two adjacent splicing modules, the sidewall surfaces of the two packaging layers define and enclose a receiving space having an opening, and the opening is located on a side of the packaging layer away from the light-emitting substrate;

[0019] Step 30: Disposing a filling layer of glue through the opening in the accommodating space, wherein the filling layer is connected to the packaging layer; the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the packaging layer;

[0020] Step 40: Disposing a first protective film layer on a side of the encapsulation layer of the at least two panels facing away from the light-emitting substrate, and the first protective film layer is connected to the filling layer.

[0021] Optionally, in some embodiments of the present application, after step 40, the preparation method further includes:

[0022] Step 50: Separating the temporary substrate and the panel;

[0023] Step 60: a second protective film layer is provided on a side of the light-emitting substrate facing away from the encapsulation layer.

[0024] The splicing screen provided by the present application includes at least two panels, a filling layer and a first protective film layer. The panel includes a light-emitting substrate and an encapsulation layer, the encapsulation layer covers the light-emitting substrate, the adjacent panels are spliced ​​together, and the side walls of the two adjacent encapsulation layers define a receiving space with an opening, and the opening is located on the side of the encapsulation layer away from the light-emitting substrate. The filling layer is arranged in the receiving space, and the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the encapsulation layer. The first protective film layer is arranged on the side of the encapsulation layer of at least two panels away from the light-emitting substrate and is connected to the filling layer. In this way, when the splicing screen is bent, the filling layer is located at the splicing position and is connected to the side wall of the encapsulation layer and the first protective film layer at the same time, and the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the encapsulation layer, so that the filling layer can be easily deformed when bent, and thus can effectively release the stress generated during bending, so as to reduce the risk of the first protective film layer detaching from the encapsulation layer of the panel, to ensure the stability of the first protective film layer after being set, and thus improve the service life of the splicing screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a schematic structural diagram of a spliced ​​screen provided in an embodiment of the present application;

[0027] Figure 2 is a structural schematic diagram of a panel provided in another embodiment of the present application;

[0028] Figure 3 1 is a flow chart of a method for preparing a spliced ​​screen provided in an embodiment of the present application;

[0029] Figure 4 1 is a schematic structural diagram of the light-emitting substrate and the temporary substrate in step 10 of the method for preparing a spliced ​​screen provided in an embodiment of the present application;

[0030] Figure 5 1 is a schematic structural diagram of a splicing module in step 10 of the method for preparing a spliced ​​screen provided in an embodiment of the present application;

[0031] Figure 6 20 and 30 of the method for preparing a spliced ​​screen according to an embodiment of the present application;

[0032] Figure 7 1 is a structural diagram of step 50 of the method for preparing a spliced ​​screen provided in an embodiment of the present application.

[0033] Description of reference numerals:

[0034] DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0036] The present application provides a spliced ​​screen 100. Detailed descriptions are provided below. It should be noted that the order in which the following embodiments are described is not intended to limit the preferred order of the embodiments.

[0037] Reference Figure 1 The splicing screen 100 provided in the present application includes at least two panels 11, a filling layer 20 and a first protective film layer 30. The panel 11 includes a light-emitting substrate 111 and an encapsulation layer 112. The encapsulation layer 112 covers the light-emitting substrate 111. Adjacent panels 11 are spliced ​​together, and the sidewall surfaces of the two adjacent encapsulation layers 112 define a receiving space 10a with an opening. The opening is located on the side of the encapsulation layer 112 away from the light-emitting substrate 111. The filling layer 20 is arranged in the receiving space 10a, and the elastic modulus of the filling layer 20 is lower than or equal to the elastic modulus of the encapsulation layer 112. The first protective film layer 30 is arranged on the side of the encapsulation layer 112 of at least two panels 11 away from the light-emitting substrate 111, and is connected to the filling layer 20.

[0038] In this way, when the splicing screen 100 is bent, the filling layer 20 is located at the splicing position and is connected to the side wall surface of the encapsulation layer 112 and the first protective film layer 30 at the same time, and the elastic modulus of the filling layer 20 is lower than or equal to the elastic modulus of the encapsulation layer 112, so that the filling layer 20 can be easily deformed when bent, and thus can effectively release the stress generated at the splicing position during bending, so as to reduce the risk of the first protective film layer 30 detaching from the encapsulation layer 112 of the panel 11, thereby ensuring the stability of the first protective film layer 30 after being set, and thereby improving the service life of the splicing screen 100.

[0039] Among them, the first protective film layer 30 can be a PET film (Polyester Film). PET film is a packaging film with relatively comprehensive performance. The mechanical properties of PET film are excellent, and its toughness is the best among all thermoplastics. Its tensile strength and impact strength are much higher than those of ordinary films. It also has excellent heat resistance, cold resistance, and good chemical resistance and oil resistance. Furthermore, the elastic modulus of the filling layer 20 is lower than the elastic modulus of the encapsulation layer 112, so that the filling layer 20 is easier to deform, and thus maintains the stability of the connection with the first protective film layer 30 and the encapsulation layer 112 when bending. The filling layer 20 can be OCA, OCA (Optically Clear Adhesive) is a special adhesive used to bond transparent optical components. It is required to be colorless and transparent, have a light transmittance of more than 95%, good bonding strength, can be cured at room temperature or medium temperature, and have small curing shrinkage.

[0040] It should be noted that the light-emitting substrate 111 includes a flexible substrate 1111 and a plurality of LED devices 1112 spaced apart on the flexible substrate 1111. The flexible substrate 1111 can be made of PI material, film material, etc., which can provide bendability for large-scale spliced ​​displays, further improving the display effect. The LED devices 1112 are three-primary color LED chips, including: red LED devices, green LED devices, and blue LED devices. The LED devices 1112 can be Mini-LED (submillimeter light-emitting diode) chips or Micro-LED (micro light-emitting diodes). Mini-LEDs have dimensions in the micron range and can provide higher resolution, thereby improving the display effect. The LED devices 1112 are covered with encapsulation glue to form an encapsulation layer 112, reducing the risk of the LED devices 1112 being affected by moisture. In addition, the encapsulation layer 112 can be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD). By adjusting the deposition parameters, the thickness and film quality of each layer can be adjusted, thereby adjusting the encapsulation effect of the encapsulation layer 112.

[0041] Furthermore, the orthographic projection of the sidewall of the encapsulation layer 112 is located outside the outermost LED device 1112. This ensures that light emitted by the LED device 1112 facing the side of the encapsulation layer 112 away from the flexible substrate 1111 is not refracted by the sidewall of the encapsulation layer 112, thereby ensuring a good display effect. Optionally, the refractive index of the filling layer 20 is equal to that of the encapsulation layer 112. This ensures that light passing through the filling layer 20 is refracted in the same direction as light passing through the encapsulation layer 112, thereby improving the display effect.

[0042] In one embodiment of the present application, referring to Figure 1 The width D of the accommodating space 10a gradually decreases from the side of the encapsulation layer 112 away from the light-emitting substrate 111 to the side closer to the light-emitting substrate 111. This prevents the filling layer 20 from occupying too much space in the splicing screen 100, while ensuring the contact area between the filling layer 20 and the first protective film layer 30, thereby ensuring the stability of the connection between the filling layer 20 and the first protective film layer 30.

[0043] Furthermore, the sidewalls of the encapsulation layer 112 are arranged in an inclined surface. While ensuring that the light-emitting substrate 111 is completely covered by the encapsulation layer 112, the thickness of the encapsulation layer 112 at the edge gradually becomes thinner, so that the sidewalls of the encapsulation layer 112 form an inclined surface. Thus, when the sidewalls of two adjacent encapsulation layers 112 are joined, an inverted triangular accommodating space 10a is formed, facilitating the placement of the filling layer 20 while ensuring the contact area between the filling layer 20 and the sidewalls of the encapsulation layer 112, thereby ensuring the stability of the connection.

[0044] Furthermore, the angle R formed by the side wall surface of the encapsulation layer 112 and the surface of the encapsulation layer 112 facing the light-emitting substrate 111 is 20° to 60°. Specifically, the angle R can be 20°, 30°, 40°, 50°, 60°, etc. Within this interval range, the space between the side walls of two adjacent encapsulation layers 112 can effectively avoid occupying too much space of the splicing screen 100, while ensuring the stability of the filling layer 20 after it is set.

[0045] Reference Figure 1 In one embodiment of the present application, the longitudinal depth of the accommodating space 10a is the same as the thickness of the packaging layer 112. This ensures the contact area between the filling layer 20 and the sidewall of the packaging layer 112, thereby ensuring the stability of the filling layer 20 and eliminating the stress caused by bending.

[0046] In some embodiments, reference Figure 1The surface of the filling layer 20 facing away from the light-emitting substrate 111 is coplanar with the surface of the encapsulation layer 112 facing away from the light-emitting substrate 111. To ensure the stability of the formation of the first protective film layer 30, the surface of the filling layer 20 facing away from the light-emitting substrate 111 and the surface of the encapsulation layer 112 facing away from the light-emitting substrate 111 are coplanar, so that the filling layer 20 and the encapsulation layer 112 form a plane, so that the first protective film layer 30 can be formed more smoothly, the stability of the first protective film layer 30 is improved, and the protective effect of the first protective film layer 30 is ensured.

[0047] Reference Figure 1 In some embodiments, the splicing screen 100 further includes a second protective film layer 40, which is connected to the side of the light-emitting substrate 111 of each panel 11 that faces away from the encapsulation layer 112. The second protective film layer 40 is provided to protect the side of the light-emitting substrate 111 that faces away from the encapsulation layer 112, thereby ensuring protection of opposite sides of the splicing screen 100 and improving the service life of the splicing screen 100. The second protective film layer 40 can be made of the same material as the first protective film layer 30, namely, PET film, which not only facilitates the preparation of the second protective film layer 40 but also ensures the protective properties of the second protective film layer 40.

[0048] Reference Figure 2 In another embodiment of the present application, the difference between this embodiment and the above embodiment is that the sidewall surface of the encapsulation layer 112 is configured as a curved surface. This further increases the contact area between the encapsulation layer 112 and the filling layer 20, thereby improving the stability of the filling layer 20 after installation.

[0049] Reference Figure 3 The embodiment of the present application provides a method for preparing a spliced ​​screen 100, the method comprising:

[0050] Step 10: Providing at least two splicing modules, the splicing modules including a temporary substrate and a panel disposed on the temporary substrate, the panel including a light-emitting substrate and an encapsulation layer, the light-emitting substrate being disposed on the temporary substrate, and the encapsulation layer covering the light-emitting substrate;

[0051] Step 20: Joining at least two joining modules, wherein in two adjacent joining modules, a receiving space having an opening is defined between the sidewall surfaces of the two encapsulation layers, and the opening is located on a side of the encapsulation layer away from the light-emitting substrate;

[0052] Step 30: Disposing a filling layer in the accommodating space, wherein the filling layer is connected to the encapsulation layer, and the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the encapsulation layer;

[0053] Step 40: Disposing a first protective film layer on a side of the packaging layer of at least two panels facing away from the light-emitting substrate, and the first protective film layer is connected to the filling layer.

[0054] In this way, when the splicing screen formed by this preparation method is bent, the filling layer is located at the splicing position and is connected to the side wall surface of the packaging layer and the first protective film layer at the same time, and the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the packaging layer, so that the filling layer can be easily deformed when bent, and thus can effectively release the stress generated during bending, thereby reducing the risk of the first protective film layer detaching from the packaging layer of the panel, ensuring the stability of the first protective film layer after setting, and thereby improving the service life of the splicing screen.

[0055] The following is a detailed description of the splicing preparation method of this embodiment.

[0056] Reference Figures 3 to 5 Step 10: Provide at least two splicing modules 10. The splicing modules 10 include a temporary substrate 12 and a panel 11 disposed on the temporary substrate 12. The panel 11 includes a light-emitting substrate 111 and an encapsulation layer 112. The light-emitting substrate 111 is disposed on the temporary substrate 12, and the encapsulation layer 112 covers the light-emitting substrate 111. The temporary substrate 12 is a glass substrate, and the light-emitting substrate 111 includes a flexible substrate 1111 and a plurality of LED devices 1112 spaced apart on the flexible substrate 1111. Therefore, before the plurality of LED devices 1112 are disposed on the flexible substrate 1111, the temporary substrate 12 is required to provide support and stability to facilitate the installation of the plurality of LED devices 1112. At the same time, the temporary substrate 12 also provides stability when the encapsulation layer 112 is formed on the light-emitting substrate 111.

[0057] It should be noted that the light-emitting substrate 111 includes a flexible substrate 1111 and a plurality of LED devices 1112 spaced apart on the flexible substrate 1111. The flexible substrate 1111 can be made of PI material, film material, etc., which can provide bendability for large-scale spliced ​​displays, further improving the display effect. The LED devices 1112 are three-primary color LED chips, including: red LED devices, green LED devices, and blue LED devices. The LED devices 1112 can be Mini-LED (submillimeter light-emitting diode) chips or Micro-LED (micro light-emitting diodes). Mini-LEDs have dimensions in the micron range and can provide higher resolution, thereby improving the display effect. The LED devices 1112 are covered with encapsulation glue to form an encapsulation layer 112, reducing the risk of the LED devices 1112 being affected by moisture. In addition, the encapsulation layer 112 can be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD). By adjusting the deposition parameters, the thickness and film quality of each layer can be adjusted, thereby adjusting the encapsulation effect of the encapsulation layer 112. Furthermore, the orthographic projection of the sidewall of the encapsulation layer 112 is located outside the outermost LED device 1112. This ensures that light emitted by the LED device 1112 facing the side of the encapsulation layer 112 away from the flexible substrate 1111 is not refracted by the sidewall of the encapsulation layer 112, thereby ensuring a good display effect. Optionally, the refractive index of the filling layer 20 is equal to that of the encapsulation layer 112. This ensures that light passing through the filling layer 20 is refracted in the same direction as light passing through the encapsulation layer 112, thereby improving the display effect.

[0058] Reference Figure 6Step 20: Splice at least two splicing modules 10. In two adjacent splicing modules 10, a receiving space 10a having an opening is defined between the side walls of the two encapsulation layers 112. The opening is located on the side of the encapsulation layer 112 away from the light-emitting substrate 111. The light-emitting substrates 111 of the two splicing modules 10 can be spliced ​​together by bonding or welding to form a whole. In this way, in two adjacent splicing modules 10, a receiving space 10a is defined between the side walls of the two encapsulation layers 112. The receiving space 10a has an opening facing the surface of the encapsulation layer 112 away from the light-emitting substrate 111, so as to facilitate the subsequent filling and setting of the filling layer 20. Furthermore, the side walls of the encapsulation layer 112 are arranged in an inclined surface. Among them, under the premise of ensuring that the light-emitting substrate 111 is completely covered by the encapsulation layer 112, the thickness of the encapsulation layer 112 at the edge gradually becomes thinner, so that the side wall surface of the encapsulation layer 112 forms a slope, so that the side walls of the two adjacent encapsulation layers 112 are spliced ​​to form an inverted triangle accommodating space 10a, which is convenient for the setting of the filling layer 20, while ensuring the contact area between the filling layer 20 and the side wall surface of the encapsulation layer 112, thereby ensuring the stability of the connection.

[0059] Reference Figure 6 , step 30: a filling layer 20 is provided in the accommodating space 10a, the filling layer 20 is connected to the encapsulation layer 112, and the elastic modulus of the filling layer 20 is lower than or equal to the elastic modulus of the encapsulation layer 112. Among them, the OCA glue can be filled through the opening of the accommodating space 10a toward the surface of the encapsulation layer 112 away from the light-emitting substrate 111 to form the filling layer 20. OCA glue (Optically Clear Adhesive) is a special adhesive used to bond transparent optical elements (such as lenses, etc.). It is required to have the characteristics of being colorless and transparent, with a light transmittance of more than 95%, good bonding strength, being able to be cured at room temperature or medium temperature, and having small curing shrinkage. Furthermore, the elastic modulus of the filling layer is lower than the elastic modulus of the encapsulation layer, so that the filling layer is easier to deform, thereby maintaining the stability of the connection with the first protective film layer 30 and the encapsulation layer 112 when bent.

[0060] Step 40: A first protective film layer is provided on the side of the encapsulation layer of at least two panels facing away from the light-emitting substrate, and the first protective film layer is connected to the filling layer. The first protective film layer may be a PET film (Polyester Film). PET film is a packaging film with a wide range of properties. PET film has excellent mechanical properties, with the highest toughness among all thermoplastics, and significantly higher tensile strength and impact resistance than conventional films. It also offers excellent heat and cold resistance, as well as good chemical and oil resistance.

[0061] Combine Figure 3 and Figure 7Furthermore, after step 40, the preparation method further includes step 50: separating the temporary substrate 12 and the panel 11. The temporary substrate 12 and the panel 11 can be separated by laser scanning, so that the prepared spliced ​​screen 100 can further improve its bendability.

[0062] Combine Figure 1 Step 60: A second protective film layer 40 is provided on the side of the light-emitting substrate 111 facing away from the encapsulation layer 112. The second protective film layer 40 protects the side of the light-emitting substrate 111 facing away from the encapsulation layer 112, thereby ensuring protection of the opposite sides of the splicing screen 100 and improving the service life of the splicing screen 100. The second protective film layer 40 can be made of the same material as the first protective film layer 30, namely PET film, which not only facilitates the preparation of the second protective film layer 40 but also ensures the protective performance of the second protective film layer 40.

[0063] The above is a detailed introduction to a splicing screen and a method for preparing a splicing screen provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A splicing screen, characterized in that: include: At least two panels, each comprising a light-emitting substrate and an encapsulation layer, wherein the encapsulation layer covers the light-emitting substrate, wherein adjacent panels are spliced ​​together, and sidewalls of two adjacent encapsulation layers define a receiving space having an opening, wherein the opening is located on a side of the encapsulation layer away from the light-emitting substrate; a filling layer, the filling layer being disposed in the accommodating space, the elastic modulus of the filling layer being lower than or equal to the elastic modulus of the encapsulation layer; as well as a first protective film layer, the first protective film layer being provided on a side of the encapsulation layer of the at least two panels away from the light-emitting substrate and connected to the filling layer; The light emitting substrate includes a flexible substrate and a plurality of LED devices spaced apart and arranged on the flexible substrate.

2. The splicing screen according to claim 1, characterized in that: The width D of the accommodating space gradually decreases from a side of the encapsulation layer away from the light-emitting substrate to a side close to the light-emitting substrate.

3. The splicing screen according to claim 1, wherein: The longitudinal depth of the accommodating space is the same as the thickness of the packaging layer.

4. The splicing screen according to claim 2, wherein: The sidewall surface of the packaging layer is arranged in an inclined surface.

5. The splicing screen according to claim 4, characterized in that: An angle R formed between a side wall surface of the encapsulation layer and a surface of the encapsulation layer facing the light-emitting substrate is in a range of 20° to 60°.

6. The splicing screen according to claim 1, wherein: The sidewall surface of the packaging layer is arranged in an arc shape.

7. The splicing screen according to claim 1, wherein: A surface of the filling layer facing away from the light-emitting substrate is coplanar with a surface of the encapsulation layer facing away from the light-emitting substrate.

8. The splicing screen according to claim 1, wherein: The spliced ​​screen further includes a second protective film layer, which is connected to a side of the light-emitting substrate of each panel facing away from the encapsulation layer.

9. A method for preparing a spliced ​​screen, characterized in that: The preparation method comprises: Step 10: Providing at least two splicing modules, wherein the splicing modules include a temporary substrate and a panel disposed on the temporary substrate, wherein the panel includes a light-emitting substrate and an encapsulation layer, wherein the light-emitting substrate is disposed on the temporary substrate and the encapsulation layer covers the light-emitting substrate, wherein the light-emitting substrate includes a flexible substrate and a plurality of LED devices spaced apart on the flexible substrate; Step 20: Splicing the splicing modules, wherein in two adjacent splicing modules, a receiving space having an opening is defined between the sidewall surfaces of the two packaging layers, and the opening is located on a side of the packaging layer away from the light-emitting substrate; Step 30: Disposing a filling layer in the accommodating space, wherein the filling layer is connected to the encapsulation layer; the elastic modulus of the filling layer is lower than or equal to the elastic modulus of the encapsulation layer; Step 40: Disposing a first protective film layer on a side of the packaging layer of the panels of the at least two splicing modules that is away from the light-emitting substrate, and the first protective film layer is connected to the filling layer.

10. The method for preparing a spliced ​​screen according to claim 9, wherein: After step 40, the preparation method further comprises: Step 50: Separating the temporary substrate and the panel; Step 60: a second protective film layer is provided on a side of the light-emitting substrate facing away from the encapsulation layer.

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