Substrate transport device, substrate transport method and substrate processing system

Abstract

The present disclosure relates to a substrate transport device, a substrate transport method and a substrate processing system, which can use a planar motor to transport a substrate to a transport position in a processing chamber with high position accuracy. The substrate transport device for transporting a substrate comprises: a transport unit, which has a substrate holding portion for holding a substrate and a base having a magnet inside for moving the substrate holding portion; a planar motor, which has a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive portion for supplying power to the electromagnetic coils to make the base magnetically levitated and linearly drive the base; a substrate detection sensor, which detects the substrate when the substrate held by the substrate holding portion passes; and a transport control portion, which calculates the actual position of the substrate held by the substrate holding portion based on the detection data of the substrate detection sensor, calculates a correction value of the actual position relative to a set logical position, and corrects the transport position of the substrate based on the correction value.

Description

Technical Field

[0001] The present disclosure relates to a substrate transporting device, a substrate transporting method, and a substrate processing system. Background Art

[0002] For example, in semiconductor manufacturing processes, when processing semiconductor wafers as substrates, a substrate processing system including a plurality of processing chambers, a vacuum transfer chamber connected to the processing chambers, and a substrate transfer device installed in the vacuum transfer chamber is used.

[0003] Conventionally, a transfer robot with a multi-jointed arm structure has been used as such a substrate transfer device (e.g., Patent Document 1). However, the technology using a transfer robot has problems with gas intrusion through vacuum seals and limited mobility of the transfer robot. Therefore, a substrate transfer device using a planar motor utilizing magnetic levitation has been proposed as a technology that can solve these problems (e.g., Patent Document 2).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-168866

[0007] Patent Document 2: Japanese Patent Application No. 2018-504784 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] The present disclosure provides a substrate transfer device, a substrate transfer method, and a substrate processing system that can transfer a substrate to a transfer position in a processing chamber with high positional accuracy using a planar motor.

[0010] Solutions for solving problems

[0011] The substrate conveying device involved in one embodiment of the present invention is a device for conveying substrates, and the substrate conveying device comprises: a conveying unit, which has a substrate holding part for holding a substrate and a base with a magnet inside for moving the substrate holding part; a planar motor, which has a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive part that supplies power to the electromagnetic coils to make the base magnetically levitated and linearly drive the base; a substrate detection sensor, which detects the substrate held by the substrate holding part when the substrate passes through; and a conveying control part, which calculates the actual position of the substrate held by the substrate holding part based on the detection data of the substrate detection sensor, calculates a correction value of the actual position relative to the set logical position, and corrects the conveying position of the substrate based on the correction value.

[0012] Effects of the Invention

[0013] According to the present disclosure, a substrate transfer apparatus, a substrate transfer method, and a substrate processing system are provided that can transfer a substrate to a transfer position within a processing chamber with high positional accuracy using a planar motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic plan view showing the substrate processing system according to the first embodiment.

[0015] Figure 2 It is a cross-sectional view for explaining a transfer unit and a planar motor in an example of a substrate transfer device.

[0016] Figure 3 This is a three-dimensional diagram illustrating the driving principle of a planar motor.

[0017] Figure 4 This is a side view for explaining a wafer inspection sensor.

[0018] Figure 5 This is a block diagram for explaining a control system of a substrate transport device.

[0019] Figure 6 This is a plan view showing the logical center of the wafer on the end effector and the physical center of the wafer actually placed.

[0020] Figure 7 This is a flowchart showing an example of a wafer transfer sequence in the transfer control unit.

[0021] Figure 8 It is a plan view showing a transfer unit in another example of the substrate transfer apparatus.

[0022] Figure 9 It is a side view showing a transfer unit in another example of the substrate transfer apparatus. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0024] Figure 1 It is a schematic plan view showing a substrate processing system according to one embodiment.

[0025] The substrate processing system 100 of this embodiment is used to continuously process multiple substrates. The substrate processing is not particularly limited, and various processes such as film formation, etching, ashing, and cleaning can be used. While the substrate is not particularly limited, the following description uses a semiconductor wafer (hereinafter referred to as a wafer) as an example.

[0026] like Figure 1 As shown, the substrate processing system 100 is a cluster structure (multi-chamber type) system including a plurality of processing apparatuses 110 , a vacuum transfer chamber 120 , a load lock chamber 130 , an atmospheric transfer chamber 140 , a substrate transfer apparatus 150 , and a control unit 160 .

[0027] The planar shape of the vacuum transfer chamber 120 is rectangular. The interior of the vacuum transfer chamber 120 is decompressed to a vacuum atmosphere. A plurality of processing chambers 110 are connected to the opposing walls on the long sides of the vacuum transfer chamber 120 via gate valves G. In addition, two load lock chambers 130 are connected to one wall on the short side of the vacuum transfer chamber 120 via gate valve G1. On the side of the two load lock chambers 130 opposite to the vacuum transfer chamber 120, an atmospheric transfer chamber 140 is connected via gate valve G2. Figure 1 In FIG. 1 , the arrangement direction of the processing chambers 110 is the X direction, and the direction perpendicular to the X direction is the Y direction.

[0028] The substrate transfer apparatus 150 within the vacuum transfer chamber 120 transfers wafers W, serving as substrates, into and out of the processing chamber 110 and the load-lock chamber 130. The substrate transfer apparatus 150 includes a transfer unit 20 and a wafer detection sensor 60. The transfer unit 20 includes an end effector 50, which serves as a wafer holding portion that actually holds the wafers W. Details of the substrate transfer apparatus 150 will be described later.

[0029] By opening the gate valve G, the processing chamber 110 and the vacuum transfer chamber 120 are connected, allowing the substrate transfer device 150 to transfer wafers W between the processing chamber 110 and the vacuum transfer chamber 120. By closing the gate valve G, the processing chamber 110 and the vacuum transfer chamber 120 are isolated from each other. Furthermore, by opening the gate valve G1, the load lock chamber 130 and the vacuum transfer chamber 120 are connected, allowing the substrate transfer device 150 to transfer wafers W between the load lock chamber 130 and the vacuum transfer chamber 120. By closing the gate valve G1, the load lock chamber 130 and the vacuum transfer chamber 120 are isolated from each other.

[0030] The processing chamber 110 includes a mounting table 111 for mounting a wafer W. The processing chamber 110 performs desired processing (film formation, etching, ashing, cleaning, etc.) on the wafer W mounted on the mounting table 111 while the interior of the processing chamber 110 is decompressed to a vacuum atmosphere.

[0031] The load lock chamber 130 includes a mounting table 131 for mounting the wafer W. When the wafer W is transferred between the atmospheric transfer chamber 140 and the vacuum transfer chamber 120 , the pressure of the load lock chamber 130 is controlled between atmospheric pressure and vacuum.

[0032] Atmospheric transfer chamber 140 maintains an atmospheric atmosphere, for example, by forming a downflow of clean air. Furthermore, a loading port (not shown) is provided on a wall surface of atmospheric transfer chamber 140. The loading port is configured to receive a carrier (not shown) containing wafers W or an empty carrier. For example, a FOUP (Front Opening Unified Pod) can be used as the carrier.

[0033] Furthermore, an atmospheric transfer device (not shown) for transferring wafers W is provided within the atmospheric transfer chamber 140. The atmospheric transfer device removes wafers W received in a load port (not shown) and places them on the loading platform 131 of the load lock chamber 130, or removes wafers W placed on the loading platform 131 of the load lock chamber 130 and places them in the load port. Opening the gate valve G2 establishes communication between the load lock chamber 130 and the atmospheric transfer chamber 140, enabling the atmospheric transfer device to transfer wafers W between the load lock chamber 130 and the atmospheric transfer chamber 140. Closing the gate valve isolates the load lock chamber 130 from the atmospheric transfer chamber 140.

[0034] The control unit 160 is composed of a computer and includes an input device, an output device, a display device, a storage device (storage medium), and a main control unit with a CPU. The main control unit is used to control the operation of each component of the substrate processing system 100. For example, it controls the processing of wafers W in each processing chamber 110 and the opening and closing of gate valves G, G1, and G2. The main control unit controls each component based on a processing recipe, which is a control program stored in a storage medium (hard disk, optical disk, semiconductor memory, etc.) built into the storage device.

[0035] In addition, in this embodiment, the control unit 160 controls the transport control unit 70 which is a part of the substrate transport device 150. The transport control unit 70 will be described together with the description of the substrate transport device 150 to be described later.

[0036] Next, an example of the operation of the substrate processing system 100 will be described. Here, as an example of the operation of the substrate processing system 100, the following operation is described: after processing a wafer W housed in a carrier mounted on a load port in the processing chamber 110, the wafer W is placed on an empty carrier mounted on the load port. Furthermore, the following operation is executed based on a processing recipe controlled by the control unit 160.

[0037] First, the atmospheric transfer device (not shown) in the atmospheric transfer chamber 140 removes the wafer W from the carrier connected to the load port, and opens the gate valve G2 to move the wafer W into the load lock chamber 130 in the atmospheric atmosphere. Then, after closing the gate valve G2, the load lock chamber 130 into which the wafer W has been moved is set to a vacuum state corresponding to the vacuum transfer chamber 120. Next, the corresponding gate valve G1 is opened, and the end effector 50 of the transfer unit 20 removes the wafer W from the load lock chamber 130, and then the gate valve G1 is closed. Next, after opening the gate valve G corresponding to any processing chamber 110, the end effector 50 moves the wafer W into the processing chamber 110 and places it on the mounting table 111. Then, the end effector 50 is retracted from the processing chamber 110, and after closing the gate valve G, film formation processing and other processes are performed in the processing chamber 110.

[0038] After processing in the processing chamber 110 is completed, the corresponding gate valve G is opened, and the end effector 50 of the transfer unit 20 removes the wafer W from the processing chamber 110. Then, after the gate valve G is closed, the gate valve G1 is opened to transfer the wafer W held by the end effector 50 to the load lock chamber 130. After that, the gate valve G1 is closed, and after the load lock chamber 130 with the wafer W is brought into the atmospheric atmosphere, the gate valve G2 is opened, and the atmospheric transfer device (not shown) removes the wafer W from the load lock chamber 130 and stores the wafer W in the carrier of the load port (both not shown).

[0039] The above-mentioned processes are performed on a plurality of wafers W simultaneously and in parallel, and all wafers W in the carrier are processed.

[0040] Furthermore, the above description describes a case of parallel transport in which the substrate transport device 150 transports a wafer W to any one processing chamber 110, and while the wafer W is being transported within the processing chamber 110, other wafers W are transported to other processing chambers 110. However, the present invention is not limited to parallel transport. For example, serial transport in which one wafer W is sequentially transported to a plurality of processing chambers 110 is also possible.

[0041] [Example of substrate transfer device]

[0042] Next, in addition to the above Figure 1 In addition, based on Figures 2 to 5 An example of a substrate transport device will be described in detail. Figure 2 This is a cross-sectional view for explaining the transport unit and planar motor of the substrate transport device. Figure 3 This is a three-dimensional diagram used to illustrate the driving principle of the planar motor. Figure 4 This is a side view for explaining the wafer detection sensor. Figure 5 This is a block diagram for explaining a control system of a substrate transport device.

[0043] like Figure 1 As shown, the substrate transfer device 150 includes a planar motor (linear unit) 10 , a transfer unit 20 , a wafer detection sensor 60 , and a transfer control unit 70 .

[0044] The planar motor (linear unit) 10 linearly drives the transport unit 20. The planar motor (linear unit) 10 includes a main body 11 formed by the bottom wall 121 of the vacuum transport chamber 120, a plurality of electromagnetic coils 12 disposed throughout the main body 11, and a linear drive unit 13 that linearly drives the transport unit 20 by supplying power to the electromagnetic coils 12 individually. The linear drive unit 13 is controlled by the planar motor control unit 72 of the transport control unit 70. A magnetic field is generated by supplying current to the electromagnetic coils 12.

[0045] The transfer unit 20 includes an end effector 50 as a wafer holding portion that holds the wafer W, and a base 30. Although one transfer unit 20 is shown in the figure, two or more transfer units 20 may be provided.

[0046] like Figure 3 As shown, the base 30 is configured with a plurality of permanent magnets 35 arranged therein and is driven by the planar motor (linear unit) 10. Furthermore, the end effector 50 moves in conjunction with the driving of the base 30. The base 30 is magnetically levitated from the surface of the main body 11 by directing the current supplied to the electromagnetic coils 12 of the planar motor (linear unit) 10 in such a direction that the generated magnetic field repels the permanent magnets 35. By stopping the current supplied to the electromagnetic coils 12, the base 30 ceases to levitate and is placed on the floor of the vacuum transfer chamber 120, i.e., the surface of the main body 11 of the planar motor 10. Furthermore, by independently controlling the current supplied from the linear drive unit 13 to the electromagnetic coils 12, the base 30 is moved along the surface of the main body 11 of the planar motor 10 while magnetically levitated, thereby controlling the position of the base 30. Furthermore, the amount of levitation can also be controlled by controlling the current.

[0047] The wafer detection sensor 60 includes two sensor elements 61 provided at portions of the vacuum transfer chamber 120 corresponding to the wafer loading / unloading ports of the respective processing chambers 110. Figure 4 As shown, the sensor element portion 61 includes, for example, a light emitting element 61a and a light receiving element 61b arranged in a vertical direction to form a light sensor. The sensor element portion 6 detects the wafer W when the wafer W passes between the light emitting element 61a and the light receiving element 61b. Figure 5 As shown, the wafer inspection sensor 60 includes a measuring unit 62 that receives a signal from a sensor element unit 61 and performs measurement.

[0048] The transport control unit 70 includes a calculation unit 71 and the aforementioned planar motor control unit 72. The calculation unit 71 receives signals from the measurement unit 62 of the wafer detection sensor 60 to calculate the actual position of the wafer W on the end effector 50. Based on this calculation result, it calculates a correction value for the wafer position relative to the logical position. Based on this correction value, the planar motor control unit 72 corrects the transport position of the wafer W on the mounting table 111 of the processing chamber 110 and controls the linear drive unit 13 to transport the wafer W to the corrected transport position.

[0049] In the substrate transport device 150 thus configured, the planar motor control unit 72 controls the current supplied from the linear drive unit 13 of the planar motor (linear unit) 10 to the electromagnetic coil 12, thereby generating a magnetic field that repels the permanent magnet 35 and magnetically levitates the base 30. The amount of levitation at this time can be controlled by controlling the current.

[0050] By individually controlling the current supplied from the linear drive unit 13 to the electromagnetic coil 12 while in magnetic levitation, the base 30 is moved along the surface of the main body 11 of the planar motor 10 (the floor of the vacuum transfer chamber 120), thereby controlling the position of the base 30. This allows the transfer unit 20 to be moved and rotated.

[0051] When the wafer W is loaded into the processing chamber 110 by the transfer unit 20, the base 30 is moved with the wafer W placed on the end effector 50 so that the end effector 50 is positioned relative to the processing chamber 110. Then, after the gate valve G is opened, the base 30 is further moved to insert the end effector 50 into the processing chamber 110, thereby transferring the wafer W to the mounting table 111 in the processing chamber 110.

[0052] At this time, the transport control unit 70 controls the position of the base 30 based on the stored position data to transport the wafer W to the target position on the mounting table 111 in the processing chamber 110. However, the wafer W may be placed on the end effector 50 at a position deviated from the preset position.

[0053] Specifically, if Figure 6 As shown, in the transport control unit 70, the position of the center of the wafer W placed on the end effector 50 is set as the logical center O1, and the transport control unit 70 controls the position of the center M of the base 30 as the linear drive center based on the logical center O1. However, sometimes the position of the physical center O2 of the wafer W actually placed on the end effector 50 deviates from the position of the logical center O1. Figure 6 In the example shown, a state is shown in which the physical center O2 of the wafer W placed on the end effector 50 is offset from the logical center O1 by x in the X direction and by y in the Y direction.

[0054] In linear drive using the planar motor 10, unlike conventional transfer robots, there is no central axis, making it impossible to perform transfer correction using the central axis as a reference point. Therefore, if the wafer W is placed on the end effector 50 at a position that is offset, even if the transfer control unit 70 controls the transfer position of the wafer W, the wafer W will be placed on the mounting table 111 at a position that is offset from the target transfer position.

[0055] As described above, substrate transport using a planar motor solves the problems of gas intrusion from vacuum seals and the limited movement of the transport robot in technologies using a transport robot. However, recently, the requirements for miniaturization of devices have become stricter, and the requirements for the placement accuracy of substrates (wafers) on the mounting table of the processing chamber have become stricter to improve uniformity and characteristics. In addition, as for the processing of substrates (wafers), there are high-temperature processing and low-temperature processing. In such cases, due to the difference in thermal expansion, there is a tendency for the positional offset of the substrate on the end effector as described above to become larger. Therefore, the positional offset relative to the transport target position caused by the positional offset of the substrate on the end effector becomes a problem.

[0056] Therefore, in this embodiment, a sensor element 61 of a wafer detection sensor 60 is installed in a portion of the vacuum transfer chamber 120 corresponding to the wafer loading / unloading port of each processing chamber 110. This sensor element 61 detects the position of the wafer W on the end effector 50 during the transfer process to the loading platform 111 of the processing chamber 110. Based on this detection data, the calculation unit 71 of the transport control unit 70 calculates the actual position of the wafer W on the end effector 50 and, based on the calculation result, calculates a correction value for the wafer position relative to the logical position. Based on this correction value, the planar motor control unit 72 corrects the transfer position of the wafer W on the loading platform 111 of the processing chamber 110. The linear drive unit 13 then controls the transfer process to transfer the wafer W to the corrected transfer position.

[0057] Figure 7 An example of the sequence of the transport control unit 70 at this time is shown.

[0058] First, a command of the center coordinates (X, Y) of the wafer W as a transfer target position is given to the linear drive unit 13 (step ST1 ). The transfer target position is a position on the mounting table 111 of the processing chamber 110 .

[0059] Next, the linear drive unit 13 is activated based on the command (step ST2). This causes the base 30 of the transfer unit 20 to move, and the wafer W on the end effector 50 is transferred along this movement. Specifically, after the wafer W is transferred along the X direction to a position corresponding to the target processing chamber 110 while being held by the end effector 50, the wafer W is further transferred along the Y direction to the target processing chamber 110.

[0060] Next, the wafer detection sensor 60 detects the wafer W (step ST3 ). Specifically, the two sensor element units 61 detect the passing wafer W, and the measurement unit 62 measures the detection signal.

[0061] Next, the physical center position O2 of the wafer W on the end effector 50 is calculated based on the detection data of the wafer detection sensor 60 , and correction values ​​(x, y) relative to the logical center O1 are calculated (step ST4 ).

[0062] Next, the center coordinates of the wafer W at the transport position of the wafer W are corrected to (X+x, Y+y) based on the correction values ​​(x, y) (step ST5 ). The linear drive unit 13 performs transport control based on the corrected transport position.

[0063] Thus, the wafer W can be transferred to a preset transfer position on the mounting table 111 in the processing chamber 110 with high positional accuracy.

[0064] A wafer detection sensor 60 (sensor element unit 61 ) is disposed for each processing chamber 110 , and similar position correction is performed every time a wafer W is transferred to each processing chamber 110 .

[0065] Such position correction can be performed in the same manner regardless of whether the wafer W is transported in parallel or in series.

[0066] [Other Examples of Substrate Transport Devices]

[0067] Next, another example of the substrate transport device will be described. In this example, the structure of the transport unit is different from that of the above example. Figure 8 1 is a top view showing the transport unit of the substrate transport device of this example. Figure 9 : is a side view showing the transport unit of the substrate transport device of this example. Figure 8 (a) and (b) show different postures of the transport unit.

[0068] The transport unit 20 ′ of this example includes two bases 31 and 32 , a link mechanism (links 41 and 42 ), and an end effector 50 .

[0069] The bases 31 and 32 are similar to the base 30 of the above example, and are configured such that a plurality of permanent magnets 35 are arranged in the bases 31 and 32 (see FIG. Figure 3 ), the bases 31 and 32 move the end effector 50 via a link mechanism (links 41 and 42). By directing the current supplied to the electromagnetic coil 12 of the planar motor (linear unit) 10 so that the magnetic field generated thereby repels the permanent magnet 35, the bases 31 and 32 are magnetically suspended from the surface of the main body 11.

[0070] The links 41 and 42 that constitute the link mechanism connect the two bases 31 and 32 with the end effector 50. Specifically, one end of the link 41 is rotatably connected to the base 31 via a vertical rotation axis 43. The other end of the link 41 is rotatably connected to the end effector 50 via a vertical rotation axis 45. One end of the link 42 is rotatably connected to the base 32 via a vertical rotation axis 44. The other end of the link 42 is rotatably connected to the end effector 50 via a vertical rotation axis 46.

[0071] Alternatively, the linkage mechanism can be configured to operate in a linked manner with respect to the link angle. For example, the linkage mechanism can include an angle linkage mechanism (not shown) that links the angle formed by the extension direction of the end effector 50 (the direction perpendicular to the line connecting the rotation axes 45 and 46) with the link 41, and the angle formed by the extension direction of the end effector 50 with the link 42, to the same angle. The angle linkage mechanism (not shown) can be configured, for example, with gears, belts, or the like. Thus, by varying the distance between the rotation axes 43 and 44 (i.e., the distance between the bases 31 and 32), the linkage mechanism can extend and retract the end effector 50 while maintaining its direction.

[0072] In this example, the end effector 50 is connected to the link mechanism (links 41, 42). Furthermore, the end effector 50 is connected to the two bases 31, 32 via the link mechanism (links 41, 42), thereby enabling the end effector 50 to be positioned Figure 8 (a) the retreat position and Figure 8 (b) The forward position.

[0073] That is, in Figure 8 At the retracted position of (a), the interval between the bases 31 and 32 is D1, and the extension distance H1 of the end effector 50 is uniquely determined. Figure 8 At the advanced position of (b), the interval between the bases 31 and 32 is D2, and the extension distance H2 of the end effector 50 is uniquely determined.

[0074] The spacing between bases 31 and 32 is the distance between the reference positions of base 31 and base 32, or in this example, the distance between rotation axis 43 and rotation axis 44. Furthermore, the extended distance is the distance between the straight line connecting rotation axis 43 of base 31 and rotation axis 44 of base 32 and the center of wafer W placed on end effector 50. Reference numerals 47 and 48 denote stoppers for limiting the rotation angles of links 41 and 42, and are provided as needed.

[0075] In the thus configured transport unit 20', the planar motor control unit 72 controls the current supplied from the linear drive unit 13 of the planar motor (linear unit) 10 to the electromagnetic coil 12, generating a magnetic field that repels the permanent magnet 35 and thereby magnetically levitates the bases 31 and 32. By individually controlling the current supplied to the electromagnetic coil 12 while in magnetic levitation, the bases 31 and 32 are moved along the surface of the main body 11 of the planar motor 10 (the floor of the vacuum transport chamber 120), thereby controlling the positions of the bases 31 and 32. This allows the transport unit 20' to be moved and rotated.

[0076] In addition, the extension distance of the end effector 50 can be changed by controlling the current supplied to the electromagnetic coil 12 so that the distance between the bases 31 and 32 becomes a desired distance. For example, when accessing the processing chamber 110 or the load lock chamber 130, as shown in FIG. Figure 8 As shown in (b), the distance between the bases 31 and 32 is narrowed to increase the extension distance of the end effector 50. In this way, the end effector 50 can be inserted into the processing chamber 110 and the load lock chamber 130 while the bases 31 and 32 are kept on the surface of the main body 11 of the planar motor 10 (the floor surface of the vacuum transfer chamber 120). In addition, for example, when the transfer unit 20' is moved and rotated in the vacuum transfer chamber 120, as shown in FIG. Figure 8 As shown in (a), the distance between the bases 31 and 32 is increased to shorten the extension distance of the end effector 50. This allows the end effector 50 holding the wafer W to be brought closer to the bases 31 and 32, thereby reducing the sagging and vibration of the link mechanism (links 41 and 42) and minimizing the deviation of the wafer W during transport.

[0077] In this example, similar to the above example, the sensor element portion 61 of the wafer detection sensor 60 is installed in the portion of the vacuum transfer chamber 120 corresponding to the wafer loading / unloading port of each processing chamber 110. The sensor element portion 61 detects the position of the wafer W on the end effector 50 during transfer to the loading table 111 of the processing chamber 110. Based on this detection data, the calculation unit 71 of the transport control unit 70 calculates the actual position of the wafer W on the end effector and, based on this calculation result, calculates a correction value for the wafer position relative to the logical position. Based on this correction value, the planar motor control unit 72 corrects the transfer position of the wafer W on the loading table 111 of the processing chamber 110 and controls the linear drive unit 13 to transfer the wafer W to the corrected transfer position.

[0078] Thus, the wafer W can be transferred to a preset transfer position on the mounting table 111 in the processing chamber 110 with high positional accuracy.

[0079] <Other Applications>

[0080] While the embodiments have been described above, they should be considered to be illustrative in all respects and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and their spirit.

[0081] For example, in the above embodiments, examples of the substrate processing system transport unit with one or two bases are shown, but the number of bases may be three or more. Furthermore, when a linkage mechanism is used between the base and the end effector, a multi-joint linkage mechanism may be used, or a combination of a horizontally displaceable linkage mechanism and a height-variable linkage mechanism may be used.

[0082] Furthermore, in the above-described embodiment, the wafer transfer destination is set on the mounting table of the processing chamber, but the present invention is not limited thereto.

[0083] Furthermore, in the above-described embodiment, an example is shown in which a photosensor having a light emitting element and a light receiving element as a sensor element portion is used as the wafer inspection sensor, but the present invention is not limited to this.

[0084] Furthermore, although a semiconductor wafer (wafer) is used as the substrate, the present invention is not limited to a semiconductor wafer and may be another substrate such as an FPD (flat panel display) substrate, a quartz substrate, or a ceramic substrate.

[0085] Description of Reference Numerals

[0086] 10: Planar motor; 11: Main body; 12: Electromagnetic coil; 13: Linear drive unit; 20, 20': Transport unit; 30, 31, 32: Base; 35: Permanent magnet; 41, 42: Connecting rod; 50: End effector (substrate holding unit); 60: Wafer detection sensor; 61: Sensor element unit; 62: Measuring unit; 70: Transport control unit; 71: Calculation unit; 72: Planar motor control unit; 100: Substrate processing system; 110: Processing chamber; 120: Vacuum transport chamber; 130: Load lock chamber; 140: Atmospheric transport chamber; 150: Substrate transport device; 160: Control unit; W: Semiconductor wafer (substrate).

Claims

1. A substrate transporting device for transporting a substrate, the substrate transporting device comprising: A transport unit having a substrate holding portion for holding a substrate and a base having a magnet therein for moving the substrate holding portion; A planar motor having a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive unit for supplying power to the electromagnetic coils to magnetically levitate the base and linearly drive the base; a substrate detection sensor that detects the substrate when the substrate held by the substrate holding portion passes through; as well as a transport control unit that calculates the actual position of the substrate held on the substrate holding unit based on the detection data of the substrate detection sensor, calculates a correction value of the actual position relative to the set logical position, and corrects the transport position of the substrate based on the correction value, Among them, the conveying unit has two bases and a connecting rod mechanism connecting each base to the substrate holding part, and the conveying control part is configured to change the extension distance of the substrate holding part by controlling the current supplied to the electromagnetic coil so that the interval between the two bases becomes the desired interval.

2. The substrate transport device according to claim 1, wherein: The transport control unit calculates a physical center of the substrate held by the substrate holding unit as the actual position of the substrate, and calculates a correction value of the physical center with respect to a logical center of the substrate as the logical position.

3. The substrate transport device according to claim 1 or 2, characterized in that: The substrate transfer device is disposed in a transfer chamber connected to a processing chamber for processing a substrate, and is used to transfer the substrate to the processing chamber. The main body of the planar motor constitutes a bottom wall of the transfer chamber.

4. The substrate transport device according to claim 3, characterized in that: The substrate detection sensor is provided at a position in the transfer chamber corresponding to a substrate loading / unloading port of the processing chamber, and detects the substrate while the substrate holding portion holding the substrate is being transferred to the processing chamber.

5. A substrate transporting method for transporting a substrate, the substrate transporting method using a substrate transporting device, the substrate transporting device comprising: a transporting unit having a substrate holding portion for holding a substrate and a base having a magnet inside for moving the substrate holding portion; and a planar motor having a main body, a plurality of electromagnetic coils arranged in the main body, and a linear driving portion for supplying power to the electromagnetic coils to cause the base to be magnetically suspended and linearly drive the base, in, The transport unit includes two bases and a link mechanism connecting each base to the substrate holding portion. The substrate transport method comprises: In a process of conveying the substrate while the substrate is held on the substrate holding portion, detecting the substrate by a substrate detection sensor; calculating an actual position of the substrate held on the substrate holding portion based on detection data of the substrate detection sensor, and calculating a correction value of the actual position relative to a set logical position; correcting the conveying position of the substrate based on the correction value; and The extension distance of the substrate holding portion is changed by controlling the current supplied to the electromagnetic coil so that the interval between the two base portions becomes a desired interval.

6. The substrate transport method according to claim 5, characterized in that: The physical center of the substrate held by the substrate holding portion is calculated as the actual position of the substrate, and a correction value of the physical center with respect to the logical center of the substrate as the logical position is calculated.

7. The substrate transporting method according to claim 5 or 6, characterized in that: The substrate transfer device is disposed in a transfer chamber connected to a processing chamber for processing a substrate, and is used to transfer the substrate to the processing chamber. The main body of the planar motor constitutes a bottom wall of the transfer chamber.

8. The substrate transport method according to claim 7, characterized in that: The substrate detection sensor is provided at a position in the transfer chamber corresponding to a substrate loading / unloading port of the processing chamber, and detects the substrate while the substrate holding portion holding the substrate is being transferred to the processing chamber.

9. A substrate processing system comprising: a processing chamber that processes the substrate; a transfer chamber connected to the processing chamber; and A substrate transport device, which is disposed inside the transport chamber and is used to transport the substrate to a transport position in the processing chamber; in, The substrate conveying device comprises: A transport unit having a substrate holding portion for holding a substrate and a base having a magnet therein for moving the substrate holding portion; A planar motor having a main body, a plurality of electromagnetic coils arranged in the main body, and a linear drive unit for supplying power to the electromagnetic coils to magnetically levitate the base and linearly drive the base; a substrate detection sensor that detects the substrate when the substrate held by the substrate holding portion passes through; as well as a transport control unit that calculates the actual position of the substrate held on the substrate holding unit based on the detection data of the substrate detection sensor, calculates a correction value of the actual position relative to the set logical position, and corrects the transport position of the substrate based on the correction value, Among them, the conveying unit has two bases and a connecting rod mechanism connecting each base to the substrate holding part, and the conveying control part is configured to change the extension distance of the substrate holding part by controlling the current supplied to the electromagnetic coil so that the interval between the two bases becomes the desired interval.

10. The substrate processing system according to claim 9, characterized in that: The transport control unit calculates a physical center of the substrate held by the substrate holding unit as the actual position of the substrate, and calculates a correction value of the physical center with respect to a logical center of the substrate as the logical position.

11. The substrate processing system according to claim 9 or 10, characterized in that: The main body of the planar motor constitutes a bottom wall of the transfer chamber.

12. The substrate processing system according to claim 9 or 10, characterized in that: The substrate detection sensor is provided at a position corresponding to a substrate loading / unloading port of the processing chamber.

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