Manufacturing method of display screen for under-screen camera, AMOLED display screen

Abstract

The present invention relates to a method for manufacturing a display screen for an under-screen camera, comprising the following steps: etching a non-display area of ​​a rear cover plate to form a groove; forming a Frit pattern on the rear cover plate, and forming a packaging area matching the Frit pattern on a back plate; after evaporating an organic material on the back plate, laminating and laser welding the back plate and the rear cover plate; thinning the thickness of the back plate and the rear cover plate respectively; punching a hole in the non-display area of ​​the rear cover plate to form a through hole penetrating the rear cover plate; and removing the organic material in the through hole. The method for manufacturing a display screen for an under-screen camera provided by the present invention first etches the rear cover plate to form a groove, then punches a hole to form a through hole after laminating, and finally removes the organic material on the back plate by solvent cleaning, without the need to perform a punching operation on the back plate. Compared with the traditional method of simultaneously punching holes on the rear cover plate and the back plate to form a through hole, the thickness and difficulty of mechanical punching are reduced, and the operability and product yield are improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a method for manufacturing a display screen for an under-screen camera and an AMOLED display screen. Background Art

[0002] Active-matrix organic light-emitting diode (AMOLED) displays are widely used in various electronic consumer products. Related products include notch screens, water-drop screens, under-screen cameras, etc. Among them, with consumers' pursuit of high screen-to-body ratio, under-screen camera technology came into being.

[0003] The application of under-screen camera technology in flexible AMOLED displays is relatively mature, and related products have appeared on the market. Specifically, a through hole is made in the non-display area, and then a camera is installed under this area. However, for hard-screen AMOLED displays, the application of under-screen camera technology is more difficult. The holes that can be prepared in the non-display area are divided into through holes and blind holes. Through holes are the traditional hard-screen punching technology, that is, a glass powder (Frit) is used to form a closed display loop in the inner and outer circles, and then a through hole is formed within the diameter of the inner circle Frit by mechanical or laser, but the mechanical or laser punching technology is difficult and the yield of the final product is low; blind holes are to remove the organic material on the non-display area of ​​the backplane by laser sintering after the backplane is evaporated and before it is bonded to the back cover, so that the non-display area forms a high transmittance area, and then the camera is installed under this area. Although this avoids mechanical punching, it is difficult to remove the organic material, which makes the yield of the final product low. At the same time, the equipment investment required for the entire blind hole production process is large, and the production cost is high. Summary of the invention

[0004] In view of the technical problems existing in the prior art, on the one hand, the present invention provides a method for manufacturing a display screen applied to an under-screen camera, comprising the following steps:

[0005] S1: etching a non-display area of ​​the rear cover to form a groove;

[0006] S2: forming a Frit pattern on the rear cover plate, and forming a packaging area matching the Frit pattern on the back plate;

[0007] S3: after evaporating the organic material on the back plate, laminating and laser welding the back plate and the rear cover plate;

[0008] S4: thinning the thickness of the back plate and the rear cover plate respectively;

[0009] S5: punching holes in the non-display area of ​​the rear cover to form through holes penetrating the rear cover;

[0010] S6: removing the organic material in the through hole.

[0011] Further, in step S1, the depth of the groove is less than 40% of the thickness of the rear cover plate.

[0012] Furthermore, the depth of the groove is 30% of the thickness of the rear cover plate.

[0013] Further, in step S2, forming a Frit pattern on the rear cover includes: forming an inner Frit pattern on the outer side of the groove, and forming an outer Frit pattern on the outer edge of the display area on the rear cover.

[0014] Furthermore, a packaging area matching the Frit pattern is formed on the backplane, including: an inner ring packaging area matching the inner ring Frit pattern is formed in the non-display area of ​​the backplane, and an outer ring packaging area matching the outer ring Frit pattern is formed in the display area, and the inner ring packaging area does not contain metal routing.

[0015] Further, in step S4, the thickness of the back plate reduced by 60% of the thickness of the back plate, and the thickness of the rear cover plate reduced by 60% of the thickness of the rear cover.

[0016] Further, in step S5, the thickness of the punched hole is not greater than 10% of the thickness of the rear cover plate.

[0017] Furthermore, in step S6, an organic solvent is used to dissolve the organic material in the through hole.

[0018] In another aspect, the present invention provides an AMOLED display screen, wherein the AMOLED display screen is manufactured by the above manufacturing method.

[0019] Furthermore, on the AMOLED display screen, the structure of the display area includes the rear cover plate and the back plate, and the structure of the non-display area only includes the back plate.

[0020] Compared with the prior art, the technical solution of the present invention has at least the following beneficial effects: in the manufacturing method of the display screen applied to the under-screen camera provided by the present invention, the back cover is first etched to form a groove, and then punched to form a through hole after bonding, and finally the organic material on the back plate is removed by solvent cleaning. There is no need to punch the back plate. Compared with the traditional method of simultaneously punching holes on the back cover and the back plate to form through holes, the thickness and difficulty of mechanical punching are reduced, and the operability and product yield are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings further illustrate the present invention, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention.

[0022] Figure 1 A flow chart of a method for manufacturing a display screen for an under-screen camera provided by the present invention;

[0023] Figure 2 A schematic diagram of forming a groove on a rear cover plate;

[0024] Figure 3 A schematic diagram of forming a Frit pattern on a rear cover;

[0025] Figure 4 is a transverse cross-sectional view of a plywood;

[0026] Figure 5 It is a transverse cross-sectional view of the plywood after thinning;

[0027] Figure 6 A transverse cross-sectional view of a plywood with a through hole formed therein;

[0028] Among them, the figures are marked as: 1-rear cover plate, 2-groove, 3-inner circle Frit pattern, 4-outer circle Frit pattern, 5-back plate. DETAILED DESCRIPTION

[0029] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0030] The application of under-screen camera technology in hard-screen AMOLED display screens is difficult, mainly manifested in the low yield of holes in the non-display area. Specifically, in the prior art, mechanical or laser drilling to form through holes is technically difficult, and the yield of the final product is low; although the method of removing organic materials from the backplane to form blind holes avoids mechanical drilling, it is difficult to remove organic materials, and the cost of preparing blind holes is high and the yield is low. The present invention provides a method for manufacturing a display screen for under-screen camera, such as Figure 1 As shown, the following steps are included:

[0031] S101: etching a non-display area of ​​the rear cover to form a groove;

[0032] Hard-screen AMOLED displays are generally made of a back plate and a rear cover plate through Frit packaging. Frit packaging mainly involves printing glass material on the cover plate (also known as forming a Frit pattern on the cover plate), and using a laser beam to move and heat the glass material to melt it, so as to form a sealing body between the cover plate and the back plate to achieve airtight packaging. The under-screen camera is placed in the non-display area. In the non-display area, in order from top to bottom, it is the rear cover plate, the back plate, and the camera. In the display area, it is the rear cover plate and the back plate.

[0033] In order to reduce the difficulty of mechanical punching and improve the product yield, the present invention first etches a groove on the back cover. Specifically, a circular pattern is designed on the non-display area of ​​the back cover, and the circular pattern is etched to obtain a groove. The diameter of the groove can be the same as the diameter of the camera. In the AMOLED display manufacturing process, after the back plate and the back cover are bonded to form a composite plate, the composite plate is double-sided thinned. In this process, the thinned thickness of the back cover can reach 60% of its own thickness. In order to prevent the etching liquid from entering the composite plate and etching away the Frit glue in the subsequent thinning process, the depth of the groove is less than 40% of the thickness of the back cover. Preferably, the depth of the groove is 30% of the thickness of the back cover. Due to the difficulty of mechanical punching to form a groove, mechanical precision punching cannot be achieved. Therefore, the groove is made by chemical etching.

[0034] S102: forming a Frit pattern on the rear cover plate, and forming a packaging area matching the Frit pattern on the back plate;

[0035] The rear cover is used to be bonded with the back plate to form a plywood to form a closed space to prevent water and oxygen from corroding the luminescent material. Before the plywood is made, a Frit pattern needs to be formed on the rear cover. Specifically, a circle with a diameter larger than the groove is printed on the outside of the groove to form an inner Frit pattern, and a rectangular frame is formed on the outer edge of the display area on the rear cover to form an outer Frit pattern. Correspondingly, an inner encapsulation area matching the inner Frit pattern is formed in the non-display area of ​​the back plate, and an outer encapsulation area matching the outer Frit pattern is formed in the display area.

[0036] The backplane is generally composed of metal traces and inorganic layers. Setting metal traces in the non-display area of ​​the backplane will reduce the transmittance of the non-display area due to the poor light transmittance of metal. Therefore, the inner ring packaging area is designed as a metal trace avoidance area, that is, the area does not contain metal traces to ensure the transmittance of the area.

[0037] S103: After evaporating the organic material on the back panel, the back panel and the rear cover are bonded and laser welded;

[0038] In the current AMOLED display manufacturing process, after the Frit pattern is completed on the backplane, it is necessary to evaporate organic materials on the backplane to form a light-emitting layer. After the light-emitting layer is formed, the bonding and laser welding operations are performed. The inner and outer ring packaging areas on the backplane are aligned with the inner and outer ring Frit patterns on the rear cover and tightly bonded, and the backplane and rear cover are made into a composite board using conventional Frit packaging. At this time, there is an organic material layer in the inner ring packaging area, which reduces the transmittance of the non-display area, thereby affecting the shooting quality of the camera. Therefore, the organic material layer needs to be removed before the final product is obtained.

[0039] The backplane used in the present invention has already been prepared with various functional film layers according to existing processes before the organic material is evaporated.

[0040] S104: thinning the thickness of the back plate and the rear cover plate respectively;

[0041] After the back plate and the rear cover plate are made into a composite plate, thinning the thickness of the back plate and the rear cover plate is not only conducive to the thinness of the display screen, but also conducive to improving the transmittance of the non-display area and improving the camera's photo quality. From the processing cost and the requirements of the hard-screen AMOLED display screen for the mechanical properties of the glass plate, preferably, the back plate is thinned to a thickness of 60% of the back plate thickness, and the rear cover is thinned to a thickness of 60% of the rear cover thickness. When the thinned thickness is greater than 60% of the thickness of the plate itself, the plate processing cost is high, and the plate will bend and deform in subsequent processes due to the small thickness, that is, its mechanical strength does not meet the requirements of the hard-screen AMOLED display screen, affecting the product yield; and when the thinned thickness is less than 60% of the thickness of the plate itself, the plate has a lower processing cost and can improve the transmittance of the non-display area while maintaining a certain mechanical strength. Within this range, as the ratio of the thinned thickness to the plate's own thickness increases, the transmittance also increases, until 60% is the best.

[0042] The thinning method may be any one of chemical etching thinning technology, physical grinding thinning technology, or a combination thereof.

[0043] S105: punching a hole in the non-display area of ​​the rear cover to form a through hole penetrating the rear cover;

[0044] In the non-display area, the thickness of the back cover plate is reduced by 30%-40% after step S101, preferably, reduced by 30%. After step S104, the thickness of the back cover plate is reduced by 60% again. Therefore, 10% of the thickness remains in the back cover plate, that is, the thickness of the punching is not more than 10% of the thickness of the back cover plate.

[0045] S106: removing organic materials in the through-holes.

[0046] After the rear cover is punched to form a through hole, the bottom of the through hole is an organic material layer, and the organic material in the through hole can be removed by dissolving with an organic solvent. The organic solvent can be isopropyl alcohol, alcohol, etc. Such organic solvents will not damage the Frit sealing ring.

[0047] Example 1

[0048] Step 1: If Figure 2 As shown, a circular pattern is designed in the non-display area on the 0.5mm rear cover plate 1, the diameter of the circular pattern is the same as the diameter of the camera, and the circular pattern is etched by chemical etching to form a groove 2 with a depth of 0.15mm;

[0049] Step 2: If Figure 3 As shown, a circle with a diameter larger than that of the groove is printed on the outer side of the groove 2 to form an inner circle Frit pattern 3, a rectangular frame is formed on the outer edge of the display area on the back cover 1 to form an outer circle Frit pattern 4, and relatively, an outer circle packaging area is formed on the back plate 5 in an area corresponding to the outer circle Frit pattern 4, and an inner circle packaging area is formed on the back plate 5 in an area corresponding to the inner circle Frit pattern 3, and metal wiring is avoided in the inner circle packaging area;

[0050] Step 3: Evaporate organic material on the back plate 5, then align the inner and outer ring packaging areas on the back plate 5 with the inner and outer ring Frit patterns on the rear cover plate 1 and fit them tightly, and use conventional Frit packaging to make the back plate 5 and the rear cover plate 1 into a composite board. The structure of the composite board is as follows: Figure 4 As shown, in the non-display area, from top to bottom, there are the rear cover plate 1, the groove 2, and the back plate 5. At this time, the thickness of the rear cover plate 1 is 0.35 mm, and the thickness of the back plate 5 is 0.5 mm. In the display area, the thickness of the rear cover plate 1 and the back plate 5 are both 0.5 mm;

[0051] Step 4: Thin the two sides of the plywood, the thickness of the back plate 5 and the back cover plate 1 are both 0.3 mm. Figure 5 As shown, at this time, in the non-display area, the thickness of the rear cover plate 1 is 0.05 mm, and the thickness of the back plate 5 is 0.2 mm. In the display area, the thickness of the rear cover plate 1 and the back plate 5 are both 0.2 mm.

[0052] Step 5: Remove the 0.05 mm thick back cover 1 in the non-display area by mechanical punching to form a through hole, such as Figure 6 As shown, at this time, in the non-display area, there is no rear cover plate 1, and the thickness of the back plate 5 is 0.2 mm;

[0053] Step 6: Use alcohol to remove the organic material at the bottom of the through hole by cleaning, soaking, ultrasound, etc., and then produce the AMOLED display screen by cutting.

[0054] Based on the same inventive concept, the present invention also provides an AMOLED display screen manufactured by the above method, in which the structure of the non-non-display area includes a rear cover plate and a back plate, and the structure of the non-display area only includes a back plate.

[0055] The method for manufacturing a display screen for an under-screen camera provided by the present invention has the following advantages:

[0056] 1. The rear cover is first etched to form a groove and then punched to form a through hole. The thickness of the punched hole is only 10% of the thickness of the rear cover, which reduces the difficulty of punching, realizes mechanical precision punching, and improves the product yield;

[0057] 2. Use solvent cleaning to remove organic materials on the backplane, without the need to punch holes in the backplane. Compared with the traditional method of punching holes in the back cover and backplane at the same time to form through holes, it reduces the thickness and difficulty of mechanical punching while also ensuring the transmittance;

[0058] 3. The groove depth and punching thickness of the rear cover are designed to effectively avoid the damage of the etching liquid to the inside of the plywood during the thinning process, ensuring the yield of the product.

[0059] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a display screen for an under-screen camera, characterized in that: The following steps are involved: S1: etching a non-display area of ​​the rear cover to form a groove, wherein the depth of the groove is 30% of the thickness of the rear cover; S2: forming a Frit pattern on the rear cover plate, and forming a packaging area matching the Frit pattern on the back plate; S3: After evaporating the organic material on the back plate, laminating and laser welding the back plate and the rear cover plate; S4: thinning the thickness of the back plate and the rear cover plate respectively; S5: punching holes in the non-display area of ​​the rear cover to form through holes penetrating the rear cover; S6: removing the organic material in the through hole; In step S2, forming a Frit pattern on the rear cover plate includes: forming an inner Frit pattern on the outer side of the groove, and forming an outer Frit pattern on the outer edge of the display area on the rear cover plate; In step S2, a packaging area matching the Frit pattern is formed on the backplane, including: forming an inner ring packaging area matching the inner ring Frit pattern in a non-display area of ​​the backplane, forming an outer ring packaging area matching the outer ring Frit pattern in a display area, and the inner ring packaging area does not contain metal wiring; In step S4, the thickness of the back plate is reduced to 60% of the thickness of the back plate, and the thickness of the rear cover plate is reduced to 60% of the thickness of the rear cover plate; In step S5, the thickness of the punched hole is 10% of the thickness of the rear cover plate before thinning.

2. The method according to claim 1, characterized in that: In step S6, an organic solvent is used to dissolve the organic material in the through hole.

3. An AMOLED display screen, characterized in that: The AMOLED display screen is manufactured by the manufacturing method described in claim 1 or 2.

4. The AMOLED display screen according to claim 3, characterized in that: On the AMOLED display screen, the structure of the display area includes the rear cover plate and the back plate, and the structure of the non-display area only includes the back plate.

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