Electronic devices

Abstract

The present application discloses an electronic device, belonging to the technical field of communication equipment, the electronic device includes a device body, a functional module and a heat conductor; the device body has an inner cavity and an opening, the opening is connected to the inner cavity; the functional module can be movably arranged on the device body, at least part of the functional module can extend out of the device body or retract into the device body through the opening; the heat conductor is located in the inner cavity, the heat conductor includes a first heat conduction section, a second heat conduction section and a third heat conduction section connected in sequence, at least part of the first heat conduction section is attached to the functional module, at least part of the third heat conduction section is attached to the device body, and the heat conductor is used for mutual heat transfer between the device body and the functional module. The above scheme can solve the problem of greater difficulty in heat dissipation of electronic equipment.

Description

Technical Field

[0001] The present application belongs to the technical field of communication equipment, and specifically relates to an electronic device. Background Art

[0002] With the advancement of technology, electronic devices (such as mobile phones and tablet computers) have made great progress. As a powerful tool, electronic devices have greatly facilitated the lives and work of users.

[0003] Electronic devices usually have functions such as shooting, calling, and fingerprint recognition, so as to meet the needs of users. The above functions of electronic devices are usually completed by corresponding structures such as camera modules, receivers, and fingerprint recognition modules.

[0004] However, as user demands increase, the performance of the above-mentioned functional modules is getting higher and higher, which brings about the problem that the power consumption of the functional modules is getting higher and higher, which increases the heat generated by the functional modules, making it more difficult to dissipate heat in electronic equipment. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of the difficulty in heat dissipation of the electronic device.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] An embodiment of the present application provides an electronic device, including:

[0008] A device body, the device body having an inner cavity and an opening, the opening being in communication with the inner cavity;

[0009] A functional module, wherein the functional module is movably disposed on the device body, and at least a portion of the functional module can extend out of the device body or retract into the device body through the opening;

[0010] A heat conducting member, the heat conducting member is located in the inner cavity, the heat conducting member comprises a first heat conducting section, a second heat conducting section and a third heat conducting section which are connected in sequence, at least a portion of the first heat conducting section is attached to the functional module, at least a portion of the third heat conducting section is attached to the device body, and the heat conducting member is used for mutual heat transfer between the device body and the functional module;

[0011] A transmission assembly, the transmission assembly is located in the inner cavity, the transmission assembly includes a transmission member and a rotating member, the rotating member is rotatably connected to the device body, the functional module is connected to the transmission member, the transmission member is connected to the rotating member, and the functional module drives the rotating member to rotate through the transmission member;

[0012] When at least part of the functional module extends out of the device body, the functional module drives the rotating member to rotate along a first rotation direction, so that at least part of the second heat-conducting section is separated from the rotating member; when the functional module is retracted into the device body, the rotating member rotates along a second rotation direction, so that at least part of the second heat-conducting section is wound around the rotating member;

[0013] Wherein, the first rotation direction is opposite to the second rotation direction.

[0014] In an embodiment of the present application, at least part of the functional module can extend out of the device body or retract into the device body through the opening of the device body. At the same time, the device body and the functional module are connected by a heat conductor, and the heat conductor is used to transfer heat between the device body and the functional module. In this scheme, the heat of the functional module can be transferred to the device body through the heat conductor, so the device body can assist in heat dissipation of the functional module. At the same time, the functional module can also extend out of the device body, thereby increasing the contact area between the functional module and the cold air and improving the heat dissipation performance of the functional module. Therefore, the embodiments in the present application are more conducive to the heat dissipation of electronic equipment, thereby effectively reducing the difficulty of heat dissipation of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figures 1 to 3 is a schematic diagram of the structure of an electronic device disclosed in an embodiment of the present application;

[0016] Figures 4 to 6 It is a cross-sectional view of an electronic device disclosed in an embodiment of the present application.

[0017] Description of reference numerals:

[0018] 100-device body, 101-inner cavity, 102-opening, 110-housing, 120-circuit board, 130-shielding cover, 200-functional module, 300-heat conducting part, 310-first heat conducting section, 320-second heat conducting section, 330-third heat conducting section, 400-transmission assembly, 410-transmission part, 411-first rack, 420-rotating part, 421-first gear, 422-winding protrusion, 4221-first protrusion, 4222-second protrusion, 423-second gear, 500-driving mechanism. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here. In addition, the "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the objects associated with each other are in an "or" relationship.

[0021] The electronic device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0022] Please refer to Figures 1 to 6 An embodiment of the present application discloses an electronic device, and the disclosed electronic device includes a device body 100, a functional module 200 and a heat conductor 300.

[0023] The device body 100 is the main component of the electronic device, and the device body 100 includes but is not limited to the housing 110, the display screen, the radiator, the main board and other components. In the embodiment of the present application, the device body 100 has an inner cavity 101 and an opening 102, and the opening 102 is connected to the inner cavity 101. The inner cavity 101 provides an installation space for the components of the electronic device. Specifically, the inner cavity 101 and the opening 102 can be opened on the housing 110.

[0024] Optionally, the shell 110 has a frame, and under normal circumstances, the frame is provided with an opening 102. The parts forming the frame of the shell 110 with different structures are different. For example, the shell 110 may include a front shell, a back cover, and a middle frame arranged therebetween. The frame may be formed on the middle frame. In this case, the frame serves as a part of the middle frame. For another example, the shell 110 may include a front cover and a back cover, and the frame may be formed on the back cover or on the front cover. Of course, the opening 102 may also be provided on other parts of the shell 110, and is not limited to providing the opening 102 on the frame.

[0025] The functional module 200 is movably arranged on the device body 100, and at least part of the functional module 200 can be extended out of the device body 100 or retracted into the device body 100 through the opening 102. Specifically, the functional module 200 may include at least one of a camera module, a fingerprint recognition module, a receiver, and a fill light, and of course may also include other components that can enter and exit the device body 100. When the functional module 200 is working, it can extend out of the device body 100 through the opening 102 on the device body 100; when the functional module 200 completes the work, it can be retracted into the device body 100 through the opening 102 on the device body 100. Such a functional module 200 will not occupy the display area of ​​the electronic device, so that the screen ratio of the electronic device is larger.

[0026] The heat conducting member 300 is located in the inner cavity 101, and includes a first heat conducting section 310, a second heat conducting section 320, and a third heat conducting section 330 connected in sequence. At least a portion of the first heat conducting section 310 is attached to the functional module 200, and at least a portion of the third heat conducting section 330 is attached to the device body 100. The heat conducting member 300 is used for heat transfer between the device body 100 and the functional module 200. At this time, the heat conducting member 300 can transfer the heat on the functional module 200 to the device body 100, or the heat on the device body 100 can also be transferred to the functional module 200.

[0027] Optionally, the heat conducting member 300 can be connected to a larger structure such as the housing 110, the radiator, and the mainboard of the device body 100, so as to be more conducive to the heat dissipation of the electronic device. Of course, the heat conducting member 300 can also be connected to other components of the device body 100, which is not limited herein. The above-mentioned heat conducting member 300 can be made of materials such as metal sheets and temperature averaging plates. Of course, the heat conducting member 300 can also be made of other materials with good thermal conductivity and heat dissipation performance, which is not limited herein.

[0028] Since the functional module 200 moves relative to the device body 100, the second heat-conducting section 320 needs to change its state according to the moving position of the functional module 200. Therefore, the second heat-conducting section 320 is expanded when at least part of the functional module 200 extends out of the device body 100, and is contracted when the functional module 200 is retracted into the device body 100.

[0029] Optionally, the second heat-conducting section 320 can be a flexible structure, for example, a metal or non-metallic sheet with a certain flexibility. When the functional module 200 is retracted into the device body 100, the second heat-conducting section 320 can be folded or curled in the inner cavity 101. Alternatively, the second heat-conducting section 320 can be a telescopic structure, and when the functional module 200 is retracted into the device body 100, the second heat-conducting section 320 is retracted. When at least part of the functional module 200 extends outside the device body 100, the second heat-conducting section 320 is extended. Of course, the heat-conducting member 300 can also be expanded or retracted in other ways, which is not limited herein.

[0030] In the embodiments disclosed in the present application, the heat of the functional module 200 can be transferred to the device body 100 through the heat conductor 300, so the device body 100 can assist in cooling the functional module 200. At the same time, the functional module 200 can also extend outside the device body 100, thereby increasing the contact area between the functional module 200 and the cold air and improving the heat dissipation performance of the functional module 200. Therefore, the embodiments in the present application are more conducive to the heat dissipation of electronic equipment, thereby effectively reducing the heat dissipation difficulty of electronic equipment.

[0031] In the above embodiment, the functional module 200 may have a working state and a closed state. When the functional module 200 is in the working state, at least part of the functional module 200 extends out of the device body 100, and the functional module 200 extends out of the device body 100 to work. It can be understood that when the functional module is in the working state, the components in the functional module 200 are connected with a signal transmission current, so the functional module 200 will heat up. When the functional module 200 is in the closed state, the functional module 200 does not work at this time, and the components in the functional module 200 are not connected with a signal transmission current, so the functional module 200 has a low heat. The closed state here can be understood as the components in the functional module 200 have no signal transmission current, and the components of the functional module 200 do not generate heat or generate less heat. When the above-mentioned functional module 200 is in the closed state, it can also be understood that the components in the functional module 200 are in a power-off state.

[0032] When the functional module 200 is in working state, the functional module 200 is a heat source, and the temperature of the functional module 200 is higher than the temperature of the device body 100. The heat conductor 300 transfers the heat generated by the functional module 200 to the device body 100. Therefore, the heat generated by the functional module 200 during operation can be transferred to the device body 100 for auxiliary heat dissipation.

[0033] When the functional module 200 is in the closed state, the functional module 200 does not work, so the heat of the functional module 200 is relatively low. The heat conducting member 300 can transfer the heat generated by the device body 100 to the functional module 200. At this time, the heat of the functional module 200 when in the closed state is relatively low, so the heat generated when the device body 100 is working can be transferred to the functional module 200, thereby using the functional module 200 to assist in heat dissipation.

[0034] The functional module 200 in the above embodiment may be a camera module. When the camera module is extended out of the device body 100 for shooting, the camera module generates heat. At this time, the heat of the camera module is transferred to the device body 100 through the heat conductor 300, and the device body 100 performs auxiliary heat dissipation.

[0035] When the camera module is not shooting, the camera module is in a closed state. At this time, the camera module does not generate heat or generates very low heat. When the device body 100 generates high heat, the heat on the device body 100 can be transferred to the camera module through the heat conductor 300.

[0036] In the above embodiment, when the functional module 200 retracts into the device body 100, there is no mechanism in the inner cavity 101 to stack the second heat-conducting segments 320, so the second heat-conducting segments 320 are arranged very messily in the inner cavity, which makes it easy for the second heat-conducting segments 320 to rub against other structures in the inner cavity 101, thereby easily causing damage to the heat-conducting component 300.

[0037] Based on this, in another optional embodiment, the electronic device disclosed in the present application may also include a transmission assembly 400, the transmission assembly 400 may be located in the inner cavity 101, the transmission assembly 400 may include a transmission member 410 and a rotating member 420, the rotating member 420 may be rotatably connected to the device body 100, the functional module 200 is connected to the transmission member 410, the transmission member 410 may be connected to the rotating member 420, and the functional module 200 may drive the rotating member 420 to rotate through the transmission member 410.

[0038] When at least a portion of the functional module 200 extends out of the device body 100 , the functional module 200 drives the rotating member 420 to rotate along the first rotation direction, so that at least a portion of the second heat conducting section 320 is separated from the rotating member 420 .

[0039] When the functional module 200 is retracted into the device body 100 , the rotating member 420 rotates along the second rotation direction, so that at least a portion of the second heat conducting section 320 is wound around the rotating member 420 .

[0040] The first rotation direction is opposite to the second rotation direction.

[0041] In a specific working process, when the functional module 200 extends out of the device body 100, the functional module 200 drives the transmission member 410 to move in the direction of extending out of the device body 100, and the transmission member 410 drives the rotating member 420 to rotate around the first rotation direction. As the number of rotations increases, the second heat conducting section 320 is separated from the rotating member 420, so that the second heat conducting section 320 is unfolded. The first rotation direction can be clockwise.

[0042] When the functional module 200 retracts to the device body 100, the functional module 200 drives the transmission member 410 to move in the direction of retracting to the device body 100, and the transmission member 410 drives the rotating member 420 to rotate around the second rotation direction. At this time, as the number of rotations increases, the second heat conducting section 320 is wound around the rotating member 420. The second rotation direction can be counterclockwise.

[0043] In this solution, when the functional module 200 retracts into the device body 100, the rotating part 420 can wrap around the second heat-conducting section 320, so that the second heat-conducting section 320 can shrink neatly in the inner cavity 101. Therefore, the heat-conducting part 300 is not easy to be scratched with other structures in the inner cavity 101, and the heat-conducting part 300 is not easy to be damaged.

[0044] In addition, the functional module 200 drives the second heat-conducting section 320 to expand and contract through the transmission member 410 and the rotating member 420. Therefore, as long as the functional module 200 moves the rotating member 420, the second heat-conducting section 320 is expanded or contracted synchronously, and therefore, no other driving structure is required in the electronic device to drive the rotating member 420, so the recovery difficulty of the heat-conducting member 300 is relatively small. In addition, the functional module 200 and the rotating member 420 move synchronously, so that the retraction speed of the functional module 200 is the same as the recovery speed of the heat-conducting member 300, so the pulling force on the heat-conducting member 300 is relatively small, thereby improving the safety of the heat-conducting member 300.

[0045] In another optional embodiment, the transmission member 410 may include a first rack 411, the first rack 411 is fixedly connected to the functional module 200, the rotating member 420 may include a first gear 421 and a winding protrusion 422, the first rack 411 may be meshed with the first gear 421, the first gear 421 may be rotatably connected to the device body 100, and the winding protrusion 422 may be connected to the first gear 421. The functional module 200 may drive the first rack 411 to move, and the first rack 411 may drive the winding protrusion 422 to rotate through the first gear 421, so that at least a portion of the second heat conducting section 320 is detached from the winding protrusion 422 or is wound around the winding protrusion 422.

[0046] In this solution, the functional module 200 drives the winding protrusion 422 to rotate through the gear and rack mechanism so that the second heat conducting section 320 is wound around the winding protrusion 422. The gear and rack mechanism is simple and small in size, thus making the structure of the electronic device simple and small in size.

[0047] Of course, the transmission member 410 is not limited to a rack, but can also be a combination of a rack and a gear, and the rotating member 420 can be a combination of a gear and a gear, or a combination of a gear and a transmission belt. The specific structures of the transmission member 410 and the rotating member 420 are not limited herein.

[0048] In another optional embodiment, the winding protrusion 422 may include a first protrusion 4221 and a second protrusion 4222. The first protrusion 4221 and the second protrusion 4222 may be arranged on the same side of the first gear 421. The extension direction of the first protrusion 4221 and the extension direction of the second protrusion 4222 are parallel to the direction of the rotation axis of the first gear 421. The second heat conductive section 320 may extend between the first protrusion 4221 and the second protrusion 4222.

[0049] In a specific working process, when the functional module 200 extends out of the device body 100, the functional module 200 drives the first rack 411 to move toward the outside of the device body 100, the first gear 421 rotates around the first rotation direction, and the second heat conducting section 320 wrapped around the first protrusion 4221 and the second protrusion 4222 gradually unfolds. The specific unfolding process is as follows: Figures 4 to 6 in the order shown.

[0050] When the functional module 200 retracts to the device body 100, the functional module 200 drives the first rack 411 to move toward the inside of the device body 100, the first gear 421 rotates around the second rotation direction, and the second heat conducting section 320 is alternately wound around the first protrusion 4221 and the second protrusion 4222. The specific winding process is as follows: Figure 6 to Figure 4 in the order shown.

[0051] In this solution, the second heat-conducting section 320 extends between the first protrusion 4221 and the second protrusion 4222. When the second heat-conducting section 320 contracts, the first protrusion 4221 and the second protrusion 4222 exert a certain pulling force on the second heat-conducting section 320, so that the heat-conducting member 300 is better wound around the first protrusion 4221 and the second protrusion 4222. In addition, when the second heat-conducting section 320 contracts, the first protrusion 4221 and the second protrusion 4222 exert a certain pulling force on the heat-conducting member 300, and thus a pulling force is also applied to the functional module 200, thereby accelerating the retraction speed of the functional module 200.

[0052] Optionally, the winding protrusion 422 is not limited to the first protrusion 4221 and the second protrusion 4222 described above, but may also be a plate-like structure, the plate-like structure is provided with a through hole along the thickness direction, and the second heat conducting section 320 may pass through the through hole. In this case, when the plate-like structure rotates, the parts on both sides of the through hole exert a certain pulling force on the heat conducting member 300, thereby achieving the contraction or expansion of the heat conducting member 300. Of course, the winding protrusion 422 may also be other structures, which are not limited herein.

[0053] In the above embodiment, one of the first protrusion 4221 and the second protrusion 4222 may be located at the rotation center of the first gear 421, and the other may be eccentrically disposed. In this case, only the eccentrically disposed protrusion has a pulling force on the heat conducting member 300, so the shrinking speed of the heat conducting member 300 is relatively slow.

[0054] To this end, in another optional embodiment, the first protrusion 4221 and the second protrusion 4222 can be located on both sides of the rotation axis of the first gear 421, and the first protrusion 4221 and the second protrusion 4222 are symmetrically distributed. In this case, the first protrusion 4221 and the second protrusion 4222 are both eccentrically arranged, so the first protrusion 4221 and the second protrusion 4222 both have a traction force on the heat conductive member 300, thereby increasing the contraction speed of the heat conductive member 300. In addition, the first protrusion 4221 and the second protrusion 4222 are symmetrically distributed, so the traction force of the first protrusion 4221 and the second protrusion 4222 on the second heat conductive segment 320 is relatively uniform.

[0055] Furthermore, the first protrusion 4221 and the second protrusion 4222 can be distributed on the edges of the opposite sides of the first gear 421. At this time, the distance between the first protrusion 4221 and the second protrusion 4222 is larger, so the length of the second heat conductive segment 320 wrapped by the first protrusion 4221 and the second protrusion 4222 is longer, so that the winding performance of the winding protrusion 422 is better.

[0056] Optionally, the first protrusion 4221 and the second protrusion 4222 may be rod-shaped structural members or strip-shaped structural members.

[0057] In the above embodiment, the end of the winding protrusion 422 away from the first gear 421 is a free end, that is, the end of the winding protrusion 422 away from the first gear 421 is suspended. At this time, the heat conductive member 300 is easily separated from the free end of the winding protrusion 422 during the expansion and contraction process, resulting in poor reliability of the rotating member 420.

[0058] In another optional embodiment, the rotating member 420 may further include a driven wheel, which is rotatably connected to the device body 100, and the rotation axis of the first gear 421 coincides with the rotation axis of the driven wheel. The winding protrusion 422 may be located between the first gear 421 and the driven wheel, one end of the winding protrusion 422 may be connected to the first gear 421, and the other end of the winding protrusion 422 may be connected to the driven wheel. At this time, the first gear 421 drives the driven wheel to rotate through the winding protrusion 422.

[0059] In this solution, the winding protrusion 422 is disposed between the first gear 421 and the driven wheel, so the heat conducting member 300 will not be separated from the winding protrusion 422 , thereby improving the reliability of the rotating member 420 .

[0060] Optionally, when the winding protrusion 422 includes the above-mentioned first protrusion 4221 and second protrusion 4222, one end of the first protrusion 4221 and second protrusion 4222 is connected to the first gear 421, and the other end of the first protrusion 4221 and second protrusion 4222 can be connected to the driven wheel.

[0061] Further, the transmission member 410 may also include a second rack, the driven wheel may be a second gear 423, the second rack may be fixedly connected to the functional module 200, and the second rack may mesh with the second gear 423. The second gear 423 may be rotatably connected to the device body 100. The first rack 411 is parallel to the second rack, and the functional module 200 may drive the winding protrusion 422 to rotate through the first gear 421, the first rack 411, the second gear 423 and the second rack.

[0062] In this solution, the first gear 421 and the second gear 423 can jointly drive the winding protrusion 422 to rotate, thereby improving the rotation efficiency of the transmission assembly 400. At the same time, the driving force received by the transmission assembly 400 is relatively more balanced, so that the expansion and contraction effect of the heat conducting member 300 is better.

[0063] In the above embodiment, a torsion spring may be mounted on the rotating shaft of the first gear 421. When the first gear 421 rotates around the first rotation direction, the torsion spring is deformed and is in a force storage state. At this time, at least part of the functional module 200 extends out of the device body 100. When at least part of the functional module 200 is retracted into the device body 100, the torsion spring recovers its deformation, so the torsion spring can also drive the first gear 421 to rotate. At this time, the torsion spring can provide a rotational force for the first gear 421 during the contraction of the second heat conducting section 320, so that the second heat conducting section 320 is better wound around the winding protrusion 422.

[0064] In another optional embodiment, the device body 100 may further include a circuit board 120, and the circuit board 120 may be located in the inner cavity 101, and the heat conductor 300 is connected to the circuit board 120. The above-mentioned circuit board 120 may be a main board or a sub-board of an electronic device. In this scheme, the area of ​​the circuit board 120 of the electronic device is generally set to be larger, so the heat of the functional module 200 is transferred to the circuit board 120, which is more conducive to the heat dissipation of the functional module 200. In addition, the circuit board 120 is integrated with a large number of electronic components, so the circuit board 120 is also one of the main heat-generating components of the electronic device. The heat on the circuit board 120 is assisted by the functional module 200 to dissipate heat, which is more conducive to the heat dissipation of the circuit board 120.

[0065] In the above embodiment, a large number of electronic components are integrated on the circuit board 120 , so the heat conducting member 300 is directly connected to the circuit board 120 , which easily occupies a larger position on the circuit board 120 .

[0066] Based on this, in another optional embodiment, the device body 100 may also include a shielding cover 130, which may be disposed on the circuit board 120, and the shielding cover 130 is used to shield some electronic components on the circuit board 120. The shielding cover 130 may be disposed between the heat conducting member 300 and the circuit board 120. In this solution, the heat conducting member 300 first transfers heat to the shielding cover 130, and the heat on the shielding cover 130 is then transferred to the circuit board 120. At this time, the heat conducting member 300 is not directly connected to the circuit board 120, that is, it does not occupy the position of the circuit board 120, so that the circuit board 120 has a larger position to set electronic components, thereby improving the integration of the circuit board 120.

[0067] In the above embodiment, the user can manually drive the functional module 200 to enter and exit the device body 100. In this case, the opening 102 of the electronic device needs to be set larger, so that a certain operating space is reserved between the side wall of the functional module 200 and the side wall of the opening 102, so that the user's fingers can be inserted, so as to facilitate the user to clamp the functional module 200, so that the functional module 200 can enter and exit the device body 100. However, the larger opening 102 is not conducive to the waterproof and dustproof performance of the electronic device.

[0068] To this end, in another optional embodiment, the electronic device disclosed in the present application may also include a driving mechanism 500. The driving mechanism 500 may be disposed in the inner cavity 101. The driving mechanism 500 may be connected to the functional module 200. The driving mechanism 500 may drive at least a portion of the functional module 200 to extend out of the device body 100 or retract into the device body 100.

[0069] In this solution, the driving mechanism 500 can drive the functional module 200 to move, so there is no need for the user's fingers to extend between the side wall of the functional module 200 and the side wall of the opening 102. Therefore, the opening 102 can be set smaller so that the functional module 200 can pass through the opening 102, which is more conducive to the waterproof and dustproof of the electronic device.

[0070] In the embodiments disclosed in the present application, the driving mechanism 500 may be a driving motor, a pneumatic cylinder, a hydraulic cylinder or other power structures. Of course, it may also be other power structures, which is not limited herein.

[0071] In order to better dissipate heat for the device body 100 , in another optional embodiment, the electronic device disclosed in the present application may further include a temperature detection element. The temperature detection element may be disposed on the device body 100 , and the temperature detection element may be used to detect the temperature value of the device body 100 .

[0072] When the temperature of the device body 100 is higher than the preset temperature, the driving mechanism 500 can extend at least a portion of the closed function module 200 outside the device body 100. At this time, the heat dissipation of the device body 100 alone cannot meet the heat dissipation requirements of the electronic device, so the closed function module 200 is pushed out of the device body 100 for auxiliary heat dissipation.

[0073] When the temperature of the device body 100 is less than or equal to the preset temperature, the driving mechanism 500 retracts the closed functional module 200 into the device body 100. At this time, the heat dissipation requirement of the electronic device can be met by relying on the heat dissipation of the device body 100. Therefore, there is no need to push the functional module 200 out to assist in heat dissipation.

[0074] In a specific working process, the temperature detected by the temperature detection element can be fed back to the processor of the electronic device in real time. When the temperature value detected by the temperature detection element is greater than the preset temperature, the processor outputs a first driving signal to control the driving mechanism 500 to drive at least part of the functional module 200 to extend out of the device body 100. When the temperature value detected by the temperature detection element drops to the preset temperature or less than the preset temperature, the driving mechanism 500 can drive the functional module 200 to retract into the device body 100.

[0075] In this solution, the electronic device can drive the functional module 200 in a closed state to enter and exit the device body 100 according to the heat dissipation requirements of the device body 100, thereby further improving the heat dissipation performance of the device body 100.

[0076] Further, when the temperature of the device body 100 gradually increases, the extended volume of the functional module 200 in the closed state may gradually increase. Specifically, when the device body 100 is at a first temperature, the volume of the portion of the functional module 200 extending outside the device body 100 may be a first volume; when the device body 100 is at a second temperature, the volume of the portion of the functional module 200 extending outside the device body 100 may be a second volume. The second volume may be greater than the first volume, wherein the first temperature may be less than the second temperature.

[0077] In this solution, the greater the heat generated by the device body 100, the larger the volume of the functional module 200 extending out of the device body 100. Therefore, the volume of the functional module 200 extending out of the device body 100 can be controlled according to the heat generated by the device body 100, so that the heat generated by the device body 100 matches the heat dissipation capacity of the electronic device, so as to achieve better heat dissipation effect of the electronic device.

[0078] In the above embodiment, the functional module 200 can be arranged on the circuit board 120. In this case, the functional module 200 is stacked on the circuit board 120. The stacking size of the circuit board 120 and the functional module 200 is larger, so that the thickness of the electronic device is larger.

[0079] To this end, in another optional embodiment, the circuit board 120 may be provided with an escape notch, and the functional module 200 may be located in the escape notch. In this solution, the functional module 200 is located in the escape notch, so the stacking thickness of the functional module 200 and the circuit board 120 is small, thereby making the thickness of the electronic device smaller, which is more conducive to the development of thin and light electronic devices.

[0080] The electronic device disclosed in the embodiments of the present application may be a smart phone, a tablet computer, an e-book reader, a wearable device (such as a smart watch), an electronic game console, or the like. The embodiments of the present application do not limit the specific types of electronic devices.

[0081] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A device body, the device body having an inner cavity and an opening, the opening being in communication with the inner cavity; A functional module, wherein the functional module is movably disposed on the device body, and at least a portion of the functional module can extend out of the device body or retract into the device body through the opening; A heat conducting member, the heat conducting member is located in the inner cavity, the heat conducting member comprises a first heat conducting section, a second heat conducting section and a third heat conducting section which are connected in sequence, at least a portion of the first heat conducting section is attached to the functional module, at least a portion of the third heat conducting section is attached to the device body, and the heat conducting member is used for mutual heat transfer between the device body and the functional module; A transmission assembly, the transmission assembly is located in the inner cavity, the transmission assembly includes a transmission member and a rotating member, the rotating member is rotatably connected to the device body, the functional module is connected to the transmission member, the transmission member is connected to the rotating member, and the functional module drives the rotating member to rotate through the transmission member; When at least a portion of the functional module extends out of the device body, the functional module drives the rotating member to rotate along a first rotation direction, so that at least a portion of the second heat conducting section is separated from the rotating member; When the functional module is retracted into the device body, the rotating member rotates along a second rotation direction so that at least a portion of the second heat conducting section is wound around the rotating member; Wherein, the first rotation direction is opposite to the second rotation direction.

2. The electronic device according to claim 1, characterized in that: The transmission member includes a first rack, which is fixedly connected to the functional module; the rotating member includes a first gear and a winding protrusion, the first rack is meshed with the first gear, the first gear is rotatably connected to the device body, and the winding protrusion is connected to the first gear; the functional module can drive the first rack to move, and the first rack drives the winding protrusion to rotate through the first gear, so that at least a portion of the second heat conductive section is detached from the winding protrusion or wound onto the winding protrusion.

3. The electronic device according to claim 2, characterized in that: The winding protrusion includes a first protrusion and a second protrusion, the first protrusion and the second protrusion are arranged on the same side of the first gear, the extension direction of the first protrusion and the extension direction of the second protrusion are parallel to the direction of the rotation axis of the first gear, and the second heat conductive section extends between the first protrusion and the second protrusion.

4. The electronic device according to claim 3, characterized in that: The first protrusion and the second protrusion are located on both sides of the rotation axis of the first gear, and the first protrusion and the second protrusion are symmetrically distributed.

5. The electronic device according to claim 2, characterized in that: The rotating member also includes a driven wheel, which is rotatably connected to the device body, the rotation axis of the first gear coincides with the rotation axis of the driven wheel, the winding protrusion is arranged between the first gear and the driven wheel, one end of the winding protrusion is connected to the first gear, and the other end of the winding protrusion is connected to the driven wheel.

6. The electronic device according to claim 5, characterized in that: The driven wheel is a second gear, and the transmission member also includes a second rack, which is fixedly connected to the functional module, meshed with the second gear, and rotatably connected to the device body, and the first rack is parallel to the second rack; the functional module drives the winding protrusion to rotate through the first gear, the first rack, the second gear and the second rack.

7. The electronic device according to claim 1, characterized in that: The device body comprises a shell and a circuit board, the shell is provided with the inner cavity and the opening, the circuit board is located in the inner cavity, and the heat conducting member is connected to the circuit board.

8. The electronic device according to claim 7, characterized in that: The device body also includes a shielding cover, which is arranged on the circuit board and between the heat conducting member and the circuit board.

9. The electronic device according to claim 1, characterized in that: The functional module has a working state and a closed state. When the functional module is in the working state, at least part of the functional module extends out of the device body. When the functional module is in the working state, the heat conductive member transfers the heat generated by the functional module to the device body. When the functional module is in the closed state, the heat conductive member can transfer the heat generated by the device body to the functional module.

10. The electronic device according to claim 9, characterized in that: The electronic device further comprises a driving mechanism and a temperature detection element, wherein the driving mechanism is disposed in the inner cavity, the driving mechanism is connected to the functional module, and the driving mechanism drives at least a portion of the functional module to extend out of the device body or retract into the device body; The temperature detection element is arranged on the device body, and the temperature detection element is used to detect the temperature of the device body; When the temperature of the device body is greater than a preset temperature, the driving mechanism extends at least a portion of the functional module in the closed state out of the device body; When the temperature of the device body is less than or equal to the preset temperature, the driving mechanism retracts the functional module in the closed state into the device body.

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