Optoelectronic module
By employing a support structure and conductive leads in the optoelectronic module design, the problems of high-precision packaging and safety of small optoelectronic modules are solved, enabling damage detection and safety assurance of optical components, and ensuring the optical performance and ease of assembly of the module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AMS OSRAM INT GMBH
- Filing Date
- 2020-12-17
- Publication Date
- 2026-06-23
AI Technical Summary
Existing technologies struggle to achieve high-precision packaging and ensure the safety of optical structures in small optoelectronic modules, especially when optical components are damaged, or when there is moisture or chemical contamination, which could lead to safety hazards.
The design employs a combination of support structure and conductive leads. Through the use of conductive fluid and grooves, the optical components are electrically connected to the lead frame. The conductive structure is used to detect damage or moisture in the optical components, ensuring the safety and precise positioning of the module.
It achieves high-sensitivity damage detection and safety of optoelectronic modules, ensuring that optical performance is not compromised and that it is easy to assemble.
Smart Images
Figure CN114788103B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to compact optoelectronic modules and their manufacture. Background Technology
[0002] Various consumer electronics and other devices include packaged emitter or detector modules designed specifically for precision light projection or detection applications. These modules are typically very small in size, allowing them to be integrated into portable devices. One technology suitable for miniature illuminators is high-power vertical-cavity surface-emitting laser (VCSEL) devices and VCSEL array devices.
[0003] The dimensions of these miniature electronic packages must be controlled with high precision to ensure optimal module functionality. However, certain manufacturing techniques, such as the application of adhesives in the package, may make it difficult to achieve the necessary precision standards.
[0004] Furthermore, in some cases, the optical output power of a bare VCSEL can often be so high that if the quality of the optical components is compromised, it can potentially cause damage to the eyes or skin. Therefore, it is crucial to ensure that high-power laser illuminators operate in accordance with laser safety regulations. For example, an illuminator can be part of an assembly that, under normal operating conditions, maintains eye safety by preventing people from getting too close to the illuminator. However, in some cases, damage to the optical structure that modifies the output beam for safe operation (e.g., cracks) or the presence of moisture or chemical contamination on the optical structure can lead to safety hazards. Similarly, if the optical structure is to detach or be removed, safety may be compromised.
[0005] Therefore, the technical problem to be solved by this disclosure is to provide an optoelectronic module that solves one or more of the above-mentioned problems, or at least provides a useful alternative. Summary of the Invention
[0006] In summary, this disclosure proposes overcoming the aforementioned problems by facilitating the detection of damage to the optical structure or the presence of moisture or chemical contamination. The device does this without compromising the module's optical performance and enables direct manufacturing.
[0007] According to one aspect of this disclosure, a support structure is provided for mounting an optical component above an optoelectronic device, the optical component including a conductive structure, the support structure including: a first surface for supporting the optical component; and a conductive lead, wherein the conductive lead includes: a first electrical interface portion adjacent to the first surface for forming electrical contact with the conductive structure of the optical component supported by the first surface; and a second electrical interface portion on a side opposite to the first surface, wherein the conductive lead extends from the first electrical interface portion to the second electrical interface portion to maintain electrical contact between the optical component supported on the first surface and the second electrical interface portion.
[0008] According to another aspect of the invention, a support structure is provided for mounting an optical component above an optoelectronic device, the optical component including a conductive structure, the support structure including: a first surface for supporting the optical component; and a conductive lead, wherein the conductive lead includes: a first electrical interface portion adjacent to the first surface; and a first groove in the first surface, wherein the first groove includes one or more walls defining a volume for containing a conductive fluid, wherein the volume is exposed at the first surface but otherwise closed, and wherein at least a portion of the one or more walls of the groove is formed by the first electrical interface portion of the conductive lead, such that the conductive fluid contained in the groove keeps the first electrical interface portion of the conductive lead and the conductive structure of the optical component supported by the surface in an electrical connection.
[0009] Optical components may include, for example, microlens arrays (MLAs), optical scatterers, lenses, refractive or diffractive optical elements, scatterers, spectral filters, polarization filters, and / or other optical structures operable to modify the optical properties of the output beam of a light source onto the optical components. In some cases, the optical components may be operable to produce structured light emission.
[0010] Optoelectronic devices may include VCSELs, arrays of VCSELs, one or more light-emitting diodes (LEDs), infrared (IR) LEDs, organic LEDs (OLEDs), infrared (IR) lasers, or edge-emitting laser diodes.
[0011] It should be understood that the term conductive fluid is used herein to refer to a fluid that can be cured by heating or any other means and, upon curing, is conductive at least in its hardened state. Conductive fluids can include conductive adhesives. Conductive fluids can include conductive epoxy resins. Conductive fluids can be thermosetting fluids.
[0012] The conductive structure can be a circuit (or trace). The circuit can be resistive or capacitive. The circuit can be configured to detect moisture on the surface of an optical component or damage to the optical component. The conductive structure can be transparent. The conductive structure can be opaque. The conductive structure may include an interface portion for forming an electrical connection with a lead. The interface portion of the conductive structure can be one or more contact pads.
[0013] The support structure can be a spacer. The support structure can include electrically insulating materials. The support structure can support optical components at the correct distance from the optoelectronic device to produce structured light emission.
[0014] The conductive lead may include a circuit. A second electrical interface portion may be configured to enable electrical connection with the lead frame. The side opposite the first surface may be configured to interface with the lead frame on which optoelectronic devices are disposed. The side opposite the first surface may be integrated with the lead frame, on which optoelectronic devices are disposed.
[0015] The second electrical interface portion can make electrical contact with the lead frame on which the optical element is mounted. Therefore, the conductive leads can maintain electrical contact between the optical assembly supported on the first surface and the lead frame, on which the optical element may or may not be mounted. The second electrical interface portion can make electrical contact with the lead frame, and the optical element is mounted on the lead frame via a conductive fluid.
[0016] The support structure may include multiple grooves for receiving conductive fluid. The support structure may include two leads and two corresponding grooves for receiving conductive fluid.
[0017] Therefore, embodiments of this disclosure provide a support structure that enables electrical connection in the Z direction from the optical components to the lead frame support structure.
[0018] All or more walls of the first groove may be formed by the first interface portion of the conductive lead.
[0019] Therefore, embodiments of this disclosure are able to directly dispense conductive fluid during the assembly of optoelectronic structures and ensure electrical connections between optical components and lead frames.
[0020] The support structure may include a plurality of sidewalls extending from the first surface, such that the sidewalls define a continuous boundary surrounding the optical component supported by the first surface. The sidewalls may define a base for receiving the optical component. The sidewalls may be sufficiently spaced from the optical component so that conductive fluid can be dispensed into the recess when the optical component is supported by the first surface.
[0021] The support structure can be electrically insulated and saves on conductive leads.
[0022] The first groove can be positioned such that it is at least partially covered by an optical component supported on the first surface. The first groove can also be positioned such that a portion of the groove remains uncovered when the optical component is supported on the first surface. The uncovered portion can be large enough to allow conductive fluid to be distributed into the groove when the optical component is on the first surface.
[0023] One or more walls of the first groove may be substantially curved. The first groove may have a substantially concave spherical cap shape or a concave ellipsoidal cap shape.
[0024] Therefore, embodiments of this disclosure enable the direct assembly of optical modules because the curved shape of the groove drives the conductive fluid toward the contact area of the optical component during dispensing.
[0025] The support structure has spacers (supports) on a first surface. The support structure may have multiple spacers (supports) on the first surface. The support structure may have five or more spacers (supports) on the first surface. Optical components may be mounted on the spacers / multiple spacers (one / multiple supports). The spacers / multiple supports may act as barriers to prevent mechanical adhesive from entering the first recess. Mechanical adhesive may be applied to the first surface between the spacers (supports).
[0026] Therefore, the disclosed embodiments enable the optical components to be precisely positioned above the optoelectronic devices because the separator means that the position of the optical components remains constant with the thickness of the mechanical adhesive used.
[0027] In another aspect of this disclosure, an optoelectronic module is provided, comprising: a support structure for mounting an optical component above an optoelectronic device, the optical component including a conductive structure; the support structure including: a first surface for supporting the optical component; and a conductive lead, wherein the conductive lead includes: a first electrical interface portion adjacent to the first surface; a first groove in the first surface, wherein the first groove includes one or more walls defining a volume for containing a conductive fluid, wherein the volume is open at the first surface but otherwise closed, and wherein at least a portion of one or more walls of the groove is formed by the first electrical interface portion of the conductive lead, such that the conductive fluid contained in the groove maintains an electrical connection between the first electrical interface portion of the conductive lead and the conductive structure of the optical component supported by the surface; the optical component including the conductive structure located on the first surface; an adhesive for attaching the optical component to the first surface; and a conductive fluid disposed in the first groove and in contact with the conductive structure to maintain an electrical connection between the conductive lead and the conductive structure.
[0028] The adhesive used to attach the optical component to the first surface can be a mechanical adhesive. The adhesive used to attach the optical component to the first surface can be a thermosetting adhesive. The adhesive used to attach the optical component to the first surface may differ from a conductive fluid. The adhesive used to attach the optical component to the first surface may have different curing properties than a conductive fluid.
[0029] The optoelectronic module may further include: a conductive line; and an optoelectronic device mounted on the conductive line and operable to emit or detect light through optical components, wherein the conductive leads are electrically connected to the conductive line.
[0030] In another aspect of this disclosure, a method of manufacturing an optoelectronic module is provided. The optoelectronic module includes: a support structure for mounting an optical component above an optoelectronic device, the optical component including a conductive structure; the support structure including: a first surface for supporting the optical component; and conductive leads, wherein the conductive leads include: a first electrical interface portion adjacent to the first surface; a first groove in the first surface, wherein the first groove includes one or more walls defining a volume for containing a conductive fluid, wherein the volume is open at the first surface but otherwise closed, and wherein at least a portion of one or more walls of the groove is formed by the first electrical interface portion of the conductive leads, such that the conductive fluid contained in the groove maintains an electrical connection between the first electrical interface portion of the conductive leads and the conductive structure of the surface-supported optical component; the optical component including the conductive structure located on the first surface; an adhesive for attaching the optical component to the first surface; and a conductive fluid disposed in the first groove and in contact with the conductive structure to maintain an electrical connection between the conductive leads and the conductive structure, the method comprising: applying an adhesive to the first surface; positioning the optical component on the first surface; thermosetting the mechanical adhesive; introducing the conductive fluid into the first groove once the mechanical adhesive has been thermoset; and thermosetting the conductive fluid.
[0031] UV-curable adhesives can be used before thermosetting adhesives.
[0032] Finally, the optical components disclosed herein employ a novel approach in providing grooves in the spacers to enable electrical connections from the lines to the lead frame, on which the optical elements are mounted. Attached Figure Description
[0033] Some embodiments of the disclosed content will now be described by way of example only, with reference to the accompanying drawings, in which:
[0034] Figure 1A A perspective view of an infrared illuminator according to an embodiment is shown; Figure 1B It shows Figure 1A A 3D view of an infrared illuminator;
[0035] Figure 2A and 2B It shows Figure 1A A cross-sectional view of the illuminator;
[0036] Figure 3A A perspective view of a portion of the spacer according to an embodiment is shown;
[0037] Figure 3B It shows Figure 3A A cross-sectional view of the spacer;
[0038] Figure 4 It shows Figure 3A A complete three-dimensional view of the spacer;
[0039] Figure 5 A method for assembling an infrared illuminator according to an embodiment is shown; and
[0040] picture Figure 6 Detailed illustration Figure 5 One of the steps in the method. Detailed Implementation
[0041] In summary, this disclosure provides an optoelectronic module solution that offers high sensitivity to damage to optical elements without compromising optical performance and is easy to assemble.
[0042] The attached figures show some examples of solutions.
[0043] According to an embodiment, a photoelectric module 100 including an infrared illuminator is in... Figure 1A and 1B The figures show a perspective view and an exploded view of the module, respectively. In this embodiment, the optoelectronic module includes an optical assembly 101 in the form of glass having a microlens array (MLA) situated on an optoelectronic device 103 in the form of a vertical cavity surface-emitting laser (VCSEL) configured to emit light through the glass 101. The VCSEL 103 is electrically connected to a lead frame 107, through which power is supplied to the VCSEL 103. In one embodiment, the power supply to the VCSEL may be controlled by a current driver controller or other electronic control unit (ECU) (not shown). For example, the controller may reside in a host device (e.g., a smartphone) in which the module 100 is integrated.
[0044] While the embodiment in Figure 1 pertains to an optoelectronic module with a VCSEL, other types of optical emitters or even detectors may be used in the optoelectronic module according to embodiments. Examples include VCSEL arrays, one or more light-emitting diodes (LEDs), infrared (IR) LEDs, organic LEDs (OLEDs), infrared (IR) lasers, or edge-emitting laser diodes. Typically, the light source can be used to emit light at a specific wavelength or any wavelength range (e.g., infrared). In some embodiments, the light source can be used to generate coherent light.
[0045] Similarly, other optical components, such as optical scatterers (or diffusers), lenses, refractive or diffractive optical elements, scatterers, spectral filters, polarizing filters, and / or other optical structures (operable to modify the optical properties of the output beam of a light source that strikes the optical component), may be implemented at the location of the MLA according to the embodiment.
[0046] A conductive structure 109 in the form of an electrical circuit is disposed on the surface of the MLA glass 101. In this embodiment, the electrical circuit is an interdigitated resistor. In other embodiments, the electrical circuit may include a capacitor or other conductive structure. In some cases, the circuit 109 is composed of a material (e.g., indium tin oxide (ITO)) that is substantially transparent to the wavelength of light emitted by the VCSEL (e.g., infrared). Therefore, this conductive structure can at least partially overlap the footprint of the light beam emitted by the VCSEL. In other instances, the conductive structure may be composed of a material (e.g., chromium) that is substantially opaque to the wavelength of light emitted by the light emitter. In this case, the conductive structure preferably does not overlap the footprint of the light beam emitted by the VCSEL.
[0047] Line 109 is connected to a conductive pad 303 on the surface of the MLA glass. In some instances, line 109 is covered by an insulating layer (e.g., SiO2) with openings for the conductive pad 303, which in some cases is composed of gold or another suitable conductive material.
[0048] In the embodiment of Figure 1, the function of the MLA circuitry is to ensure the eye safety of the module. As mentioned above, the unmodified optical output of the VCSEL can be sufficient to cause injury if it enters a person's eyes or skin. Therefore, it is important to detect any conditions or damage that may impair the function of the optical module due to changes in the optical output. In this embodiment, this is achieved by monitoring the capacitance or resistance (if applicable) of line 109. Both of these can impair the eye safety of the package, such as when the glass breaks or when moisture is present on the MLA glass, and the signal from the circuitry will change. Therefore, any change in the signal from the circuitry may indicate that the module is no longer eye-safe and should be discontinued.
[0049] In one embodiment, conductive line 109 forms part of a circuit coupled to a current driver controller or other electronic control unit (ECU) that controls the power of the VCSEL, as discussed above. This driver controller or ECU may be external to module 100. In this embodiment, the controller may be used to monitor the electrical characteristics of line 109 (e.g., electrical continuity; or capacitance, if suitable) such that if the monitored characteristic changes by more than a predetermined amount, the controller adjusts the light output of the VCSEL or other light source according to the embodiment. In one embodiment, the controller may be used to monitor the electrical characteristics of the line such that if the monitored characteristic changes by more than a respective predetermined amount, the controller causes the light output generated by the light source to stop. For example, the driver may turn off VCSEL 103 so that it no longer emits light.
[0050] MLA glass 101 is held above VCSEL 103 by a support structure 105 in the form of a spacer according to an embodiment. The spacer has a cavity 403 through which light emitted by VCSEL 103 passes. The VCSEL is mounted on a lead frame 107. Spacer 105 may include, for example, a molded interconnect device (MID), which allows selective metallization of the molded structure and enables the creation of three-dimensional metallic patterns in the device (e.g., using liquid crystal polymer-based materials). MLA glass 101 is located in a base 117 of the spacer and is mechanically attached to the spacer 105 using an adhesive 111. This will be discussed in more detail below. In one embodiment, base 117 includes a surface 118 that supports the MLA when positioned in the base and sidewalls 120 that extend from surface 118 and define a boundary around the MLA when positioned. In the embodiment of FIG. 1, the sidewalls define a continuous boundary around the MLA when in place. In other embodiments, there may be a boundary interruption or no boundary at all. In module 100 shown in Figure 1, mechanical bonding between spacer 105 and lead frame 107 is achieved through adhesive layer 119 between the two. In other embodiments, other methods of mechanically attaching spacers to lead frames may be used. In one embodiment, the spacer is formed as a cover mold of the lead frame.
[0051] The spacer according to this embodiment has many advantageous features according to the embodiment, which, according to the aforementioned eye safety features, facilitates the precise positioning of the MLA glass 101 above the VCSEL 103 and the monitoring of the output signal of the line 109.
[0052] Figure 2B A cross-sectional view of the illuminator package is shown, which passes through... Figure 2ALine A is shown in the diagram. For proper functional performance of the package 100, it is important to precisely control the distance 302 between the optoelectronic device (VSCEL) and the optical assembly (MLA) to ensure the correct focusing distance of the MLA. Movements in the X, Y, and Z directions all affect the optical performance of the device. Furthermore, to achieve the eye-safe features of the described MLA glass 101, it is desirable that the line 109 is located in the electrical connection 301 from the spacer 105 to the lead frame 107, thereby enabling monitoring of the line by the current driver controller or other electronic control unit (ECU) via the lead frame 107. The spacer 105 achieves these objectives in several ways, which will now be described in detail.
[0053] In this embodiment, the electrical connection between the MLA glass 101 and the lead frame 107 is achieved by a conductive lead 113, which extends downward from the top of the spacer 105 to the side of the spacer and then to the lead frame 107.
[0054] In the embodiment of Figure 1, these leads include electroplated lines that extend across the entire height of the spacer. However, other conductive structures extending from the top to the bottom of the spacer may be used according to embodiments. At the top of the spacer, within the base where the MLA glass 101 is located, there is an electroplated groove 123 that is electrically connected to the lead 113.
[0055] Although there is a continuous electroplated line from the groove to the bottom of the spacer in the embodiment of FIG1, any structure that ensures electrical connection between the groove and the spacer base can be used according to the embodiment.
[0056] A magnified view of groove 123 Figure 3A and 3B The figures show a perspective view of the spacer without MLA in position and a cross-sectional view of the spacer with MLA glass 101 in position, respectively. In this example, the groove has a cap-shaped geometry. The importance of this geometry will become apparent from the discussion below. However, other groove geometries, including straight-edged grooves, can be used according to the embodiments. As can be seen from Figure 3b, there are two continuous electroplated lines that extend to the side of the spacer (lead 113) and over the top into each groove.
[0057] from Figure 3B As can be seen, when the MLA glass 101 is in place, a portion of each groove extends beneath it.
[0058] In the assembled module 100 according to this embodiment, the recess contains a conductive fluid 121 in the form of a conductive paste. An example of a conductive paste suitable for this embodiment is silver paste. Other conductive pastes may be used depending on the specific embodiment. The conductive paste 121 contacts electrical contacts on the basis of the MLA glass. Since the recess is electroplated, this forms an electrical connection between the lines of the MLA glass 101 and the recess 123, which itself is electrically connected to the lead 113. Thus, the conductive paste 121 enables an electrical connection between the lines 109 of the MLA glass 101 and the lead 113. A further conductive fluid 125 in the form of a conductive paste is positioned between the spacer 105 and the lead frame 107 to provide electrical contact between the lead frame and the lines 113.
[0059] Therefore, the electrical connection 301 from the MLA line 109 to the spacer of the lead frame 107 is achieved by means of conductive paste 121, groove 123, lead 113 and conductive paste 125.
[0060] As described above, in this embodiment, an electrical connection between the MLA lines and the lead frame is used to ensure eye safety in the device. In other embodiments, an electrical connection from the top to the bottom of the package is desirable for other reasons, such as to deform the lens in combination with capacitor lines.
[0061] As described above, the MLA glass 101 is attached to the spacer 105 with adhesive 111. Figure 4 A perspective view of the spacer without MLA glass 101 is shown to emphasize the positioning of adhesive 111 within the base 117 of the spacer. The spacer 103 has a plurality of spacers 401 in the form of supports, on which the MLA glass 101 is directly mounted when positioned in the base 117. In this embodiment, five supports are spaced apart around the base of the spacer (two in...). Figure 1B (Not visible in Figure 2) to provide stable support for the MLA glass when in place. Adhesive layer 111 is applied between supports 401. Supports 401 protrude above the surfaces where the adhesive is applied. No adhesive is applied to the upper surface of the supports themselves.
[0062] Because the MLA glass is mounted directly on the bracket 401 rather than on the surface coated with adhesive 111, the presence of the bracket 401 facilitates precise positioning of the MLA glass above the VCSEL 103, enabling optimal functioning of the module 100. In particular, the bracket allows for variations in adhesive thickness while maintaining the correct focusing distance between the MLA glass and the VCSEL; the position of the MLA glass 101 will not change as long as the adhesive thickness remains below the height of the bracket 401. The bracket 401 also provides a barrier against mechanical adhesive entering the groove 123 during manufacturing. This will be described in more detail below. In one example, the adhesive is epoxy resin.
[0063] Similarly, in addition to facilitating electrical connection from the top to the bottom of the package 100, the recess ensures that the distance between the VCSEL 103 and the MLA glass 101 will be independent of the thickness of the conductive paste, as long as it remains below the height of the recess.
[0064] Further features that facilitate the precise positioning of the MLA relative to the VCSEL will be described below, relating to the process of manufacturing the package according to embodiments.
[0065] Figure 6 The steps for mounting MLA glass in a package according to an embodiment are shown, with the package shown in a schematic cross-section.
[0066] In step S601, as described above... Figure 4 As discussed, a mechanical adhesive 111, such as epoxy resin, is dispensed or dispensed through nozzle 503 onto the surface of the base of the spacer 105 between the supports 401. The supports 401 provide a barrier to prevent the mechanical adhesive from flowing into the grooves 123 during this step.
[0067] In step S603, the MLA glass 101 is inserted into the base 117 of the spacer, such that it is supported by the bracket 401. The height of the bracket 401 ensures the correct positioning of the MLA glass 101 relative to the VCSEL distance in the Z direction. In the X / Y plane, the correct positioning of the MLA glass 101 is achieved by alignment using standard alignment marks. In one embodiment, the correct positioning of the MLA glass 101 can be achieved by aligning the MLA glass 101 with the edge of the VCSEL 103. In one embodiment, the MLA glass 101 is positioned by a pick-and-place machine according to methods known in the art.
[0068] In step S605, a hard baking of the epoxy resin is performed. In one embodiment, this includes simply heating the module according to the curing temperature profile of the epoxy resin. In another embodiment, this may include spot curing of the adhesive 111 using UV light to hold it in place before thermal curing of the adhesive.
[0069] Once the mechanical adhesive has cured, the position of the MLA glass 101 is fixed in the X, Y, and Z planes, and proper alignment with the VCSEL 103 is ensured for the remaining steps described below.
[0070] In step S607, conductive paste 121 is embedded in groove 123 using standard dispensing or standard dispensing or spraying processes (both of which are known in the prior art).
[0071] Figure 6 An enlarged image of this step using a dispenser 503 in the form of a nozzle or needle is shown. It can be seen that the cap shape of the groove 123 according to this embodiment drives the conductive paste 121 upwards toward the base of the MLA glass 101 to ensure electrical connection between the electrical contact pads 305 and the leads on the base of the MLA glass 101. Therefore, the cap-shaped geometry ensures proper flow of the conductive paste. As can be seen from the figure, the cap shape redirects the conductive paste to the bottom of the MLA where the electrical contact pads are located. This shape pushes the conductive paste toward the bottom of the MLA glass.
[0072] It should be noted that in this embodiment, the groove 123 is fully electroplated, so it is not necessary to insert the slurry into the groove with high precision.
[0073] Those skilled in the art will appreciate that the conductive paste has sufficient viscosity to eliminate the need to consider fluid dynamics.
[0074] In step S609, the conductive paste 121 is hard-baked. In one embodiment, this includes heating the module according to the curing temperature profile of the conductive paste 121.
[0075] Therefore, in Figure 6 In this method, the hard-baking steps for the mechanical adhesive and conductive paste are performed separately. This ensures that the glass does not move during curing, thus maintaining the correct positioning of the MLA glass after initial alignment using alignment marks, as described above. The conductive paste and mechanical adhesive may have different curing profiles and surface tensions, and failure to separate both could lead to movement of the MLA glass during curing.
[0076] Those skilled in the art will understand that in the foregoing description and the appended claims, positional terms such as “above,” “along,” “side,” etc., are references to conceptual views, such as those shown in the accompanying drawings. These terms are used for ease of reference but are not intended to be limiting. Therefore, when in the orientation shown in the drawings, these terms should be understood to refer to an object.
[0077] Embodiments of this disclosure can be used in many different applications, including providing illumination for facial recognition sensors, such as in smartphones and other technologies, autonomous driving, object recognition in drones, smart devices for smart homes, or any device or machine designed to recognize objects.
[0078] List of reference numerals in the attached diagram:
[0079] 100 Optoelectronic Modules
[0080] 101 Optical Components
[0081] 103 Optoelectronic Equipment
[0082] 105 Supporting Structure
[0083] 107 Lead Frame
[0084] 109 Conductive Structure
[0085] 111 Adhesive
[0086] 113 Conductive lead
[0087] 117 Base
[0088] 118 surface
[0089] 119 Adhesive Layer
[0090] 120 sidewall
[0091] 121 Conductive fluid
[0092] 123 Groove
[0093] 125 Conductive fluid
[0094] 301 Electrical Connection
[0095] 302 Distance between optoelectronic devices and optical components
[0096] 303 conductive pad
[0097] 401 Separator
[0098] 403 Cavity
[0099] 503 Distributor
[0100] S601 Application of Adhesive Steps
[0101] S603 Steps for Positioning Optical Components
[0102] Steps for curing S605 adhesive
[0103] S607 Step of applying conductive fluid
[0104] S609 Curing of Conductive Fluid Steps
[0105] While the disclosure has been described with reference to the preferred embodiments described above, it should be understood that these embodiments are merely illustrative and the claims are not limited to these embodiments. Those skilled in the art will be able to make modifications and substitutions based on the disclosure, and such modifications and substitutions are considered to fall within the scope of the appended claims. Each feature disclosed or described in this specification may be combined in any form, either individually or in any suitable combination with any other feature disclosed or described therein.
Claims
1. A support structure for mounting an optical component above an optoelectronic device, the optical component including a conductive structure, the support structure comprising: The first surface used to support optical components; and Conductive leads, The conductive leads include: The first electrical interface portion adjacent to the first surface; A first groove in the first surface, wherein the first groove includes one or more walls defining a volume for containing a conductive fluid, wherein the volume is exposed at the first surface but otherwise closed, and In this first groove, at least a portion of one or more walls is formed by a first electrical interface portion of a conductive lead, such that a conductive fluid contained in the first groove keeps the first electrical interface portion of the conductive lead and the conductive structure of the surface-supported optical component in an electrical connection. The support structure further includes a spacer on the first surface, and the support structure further includes at least one spacer on the first surface on which the optical component is disposed, and the at least one spacer is configured as a barrier to prevent mechanical adhesive disposed between the optical component and the support structure from entering the first groove.
2. The support structure according to claim 1, wherein, One or more walls of the first groove are all formed by the first interface portion of the conductive lead.
3. The support structure of claim 1, further comprising a plurality of sidewalls extending from the first surface, such that the sidewalls define a continuous boundary surrounding the optical component supported by the first surface.
4. The support structure according to claim 1, wherein, The support structure is electrically insulated to save on conductive leads.
5. The support structure according to claim 1, wherein, The first groove is positioned such that it is at least partially covered by an optical component supported on the first surface.
6. The support structure according to claim 5, wherein, The first groove is positioned such that a portion of the first groove remains uncovered when the optical component is supported on the first surface.
7. The support structure according to claim 1, wherein, One or more walls of the first groove are substantially curved.
8. The support structure according to claim 7, wherein the first groove has a substantially concave spherical cap shape or a concave ellipsoidal cap shape.
9. The support structure according to claim 1, wherein the conductive fluid is a conductive epoxy resin.
10. The support structure according to claim 1, wherein the conductive fluid is a thermosetting fluid.
11. A photoelectric module, comprising: The support structure according to claim 1; Optical components, including conductive structures located on a first surface; An adhesive that connects the optical components to the first surface; and A conductive fluid is disposed in the first groove and in contact with the conductive structure to maintain the electrical connection between the conductive lead and the conductive structure.
12. The photoelectric module according to claim 11, further comprising: Conductive circuits; Optical devices, which are mounted on conductive lines and can be operated to emit or detect light passing through optical components. The conductive leads are electrically connected to the conductive circuit.
13. A method for manufacturing the optoelectronic module according to claim 11, the method comprising: Apply adhesive to the first surface; Position the optical components on the first surface; Thermosetting mechanical adhesives; Once the mechanical adhesive has been thermally cured, conductive fluid is introduced into the first groove; Thermosetting conductive fluid.
14. The method according to claim 13, wherein, The adhesive is partially cured using ultraviolet light before being heat-cured.