Display panel and display device

Abstract

The embodiment of the present invention discloses a display panel and a display device. The display panel includes: a substrate, including an opening area, a partition area at least partially arranged around the opening area, and a display area partially arranged around the partition area; at least one isolation groove, arranged in the substrate and located in the partition area; a display element layer arranged on the substrate, the display element layer including at least one organic material layer, the organic material layer being disconnected by the isolation groove; a blocking structure located in the isolation groove, along a first direction, the blocking structure at least partially overlaps with the sidewall of the isolation groove, wherein the first direction is the direction from the display area to the opening area. By setting a blocking structure, the position and size of the isolation groove etched on the substrate are controlled, and the isolation groove does not need to be realized through the process and the etching selectivity of different materials. The isolation groove can be precisely controlled, the packaging effect at the isolation groove is improved, the risk of water and oxygen corrosion is reduced, and the display effect of the display panel is improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of display technology, users have higher and higher requirements for the screen-to-body ratio of display screens. At present, in order to achieve a full screen, device accommodation holes are generally set in the display area to install functional components such as cameras, sensors or earpieces. However, setting device accommodation holes in the display area will have a certain risk of packaging failure. Water and oxygen in the environment will enter the display area through the failed packaging part, thereby affecting the display effect of the display panel. Summary of the Invention

[0003] The embodiments of the present invention provide a display panel and a display device, which can control the etching degree of the substrate by setting a blocking structure, ensure the packaging effect at the isolation groove, improve the water and oxygen barrier effect, and thus ensure the display effect of the display panel.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0005] The substrate includes an opening area, a partition area at least partially surrounding the opening area, and a display area partially surrounding the partition area.

[0006] at least one isolation trench disposed in the substrate and located in the isolation region;

[0007] A display element layer, the display element layer is provided on the substrate, the display element layer includes at least one organic material layer, and the organic material layer is disconnected by the isolation groove;

[0008] The blocking structure is disposed in the substrate and at least partially overlaps the sidewall of the isolation trench along a first direction, wherein the first direction is a direction from the display area to the opening area.

[0009] In a second aspect, an embodiment of the present invention further provides a display device, comprising the display panel described in any one of the first aspects.

[0010] The present invention provides a display panel and a display device. The display panel includes at least one isolation groove arranged in a substrate and located in a partition area, and a blocking structure is arranged along a first direction to at least partially overlap with the sidewall of the isolation groove. By designing the blocking structure, the position and size of the isolation groove etched on the substrate are controlled. There is no need to realize the isolation groove through processes and etching selectivity of different materials. Precise control of the isolation groove can be achieved, thereby improving the packaging effect at the isolation groove, reducing the risk of water and oxygen corrosion, and improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, although the drawings described below are some specific embodiments of the present invention, for those skilled in the art, the basic concepts of the device structure, driving method and manufacturing method disclosed and suggested by the various embodiments of the present invention can be expanded and extended to other structures and drawings. Undoubtedly, these should all be within the scope of the claims of the present invention.

[0012] Figure 1 A schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0013] Figure 2 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0014] Figure 3 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0015] Figure 4 A schematic structural diagram of an isolation trench provided by an embodiment of the present invention;

[0016] Figure 5 A schematic structural diagram of an isolation trench provided by an embodiment of the present invention;

[0017] Figure 6 A schematic structural diagram of an isolation trench provided by an embodiment of the present invention;

[0018] Figure 7 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0019] Figure 8 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0020] Figure 9 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0021] Figure 10 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0022] Figure 11 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0023] Figure 12 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0024] Figure 13 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0025] Figure 14 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention;

[0026] Figure 15 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the present invention more clear, the following will refer to the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions of the present invention through implementation methods. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the basic concepts disclosed and suggested by the embodiments of the present invention, all other embodiments obtained by those skilled in the art are within the scope of protection of the present invention.

[0028] The display panel has an opening area arranged around the display area, and the opening area is used to accommodate functional components. Since the opening area is easily corroded by external water and oxygen, an isolation groove is usually set between the opening area and the display area, and the isolation groove is filled with a packaging layer to increase the path of water and oxygen corrosion. However, since the packaging effect at the isolation groove is prone to the risk of packaging failure, water and oxygen will enter the display area through the failed packaging part, thereby affecting the display effect of the display panel.

[0029] In view of the problems of the background technology, an embodiment of the present invention provides a display panel, comprising: a substrate, comprising an opening area, a partition area at least partially surrounding the opening area, and a display area partially surrounding the partition area; at least one isolation groove, disposed in the substrate and located in the partition area; a display element layer, the display element layer disposed on the substrate, the display element layer comprising at least one organic material layer, the organic material layer being disconnected by the isolation groove; a blocking structure, the blocking structure being located within the isolation groove, and at least partially overlapping with the sidewalls of the isolation groove along a first direction, wherein the first direction is the direction from the display area to the opening area. By rationally arranging the blocking structure, the blocking structure at least partially overlaps with the sidewalls of the isolation groove, and the position and size of the isolation groove etched on the substrate are controlled, the isolation groove does not need to be realized through processes and etching selectivity of different materials, and precise control of the isolation groove can be achieved, thereby improving the packaging effect at the isolation groove, reducing the risk of water and oxygen corrosion, and improving the display effect of the display panel.

[0030] The above is the core concept of the present invention. The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] Figure 1A schematic structural diagram of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 2 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 1 and Figure 2 As shown, the display panel 100 includes: a substrate 101, including an opening area 102, a partition area 103 arranged at least partially around the opening area 102, and a display area 104 arranged partially around the partition area 103; at least one isolation trench 105, arranged in the substrate 101 and located in the partition area 103; a display element layer 106, the display element layer 106 is arranged on the substrate 101, the display element layer 106 includes at least one organic material layer 1061, and the organic material layer 1061 is disconnected by the isolation trench 105; a blocking structure 107, the blocking structure 107 is arranged in the substrate 101 and along a first direction (X direction as shown in the figure), the blocking structure 107 at least partially overlaps with the sidewall of the isolation trench 105, wherein the first direction is the direction from the display area 104 to the opening area 102.

[0032] The substrate 101 may include a flexible substrate and an inorganic layer stacked in sequence. The substrate 101 may include a laminated structure of a flexible substrate, an inorganic layer, a flexible substrate, and an inorganic layer. The substrate 101 may also include a laminated structure of a flexible substrate, an inorganic layer, a flexible substrate, an inorganic layer, a flexible substrate, and an inorganic layer. The number and material of the flexible substrate and the inorganic layer in the substrate 101 can be selected according to actual design requirements and are not specifically limited in the embodiment of the present invention. The substrate 101 includes an opening area 102, and the opening area 102 is provided with a mounting hole for mounting functional components such as a camera, a sensor, or an earpiece to increase the screen-to-body ratio and enhance the user's visual enjoyment. The partition area 103 is at least partially disposed around the opening area 102, and at least a portion of the display area 104 surrounds the partition area 103. To ensure a good water and oxygen barrier effect, the partition area 103 is disposed around the opening area 102, and the display area 104 is disposed around the partition area 103. The presence of the partition area 103 increases the path for water and oxygen to erode the opening area 102, reduces the probability of water and oxygen entering the display area 104, and ensures the display effect of the display area 104. At least one isolation groove 105 is disposed in the partition area 103. The isolation groove 105 is formed on the flexible substrate in the substrate 101. The isolation groove 105 can be an annular groove. The isolation groove 105 can be a circular groove. The isolation groove 105 is disposed around the opening area 102, isolating the organic light-emitting material layer between the opening area 102 and the display area 104, thereby blocking the channel for water and oxygen to invade the display area 104, thereby improving the service life and display effect of the display panel 100. A display element layer 106 is also provided on the substrate 101. The display element layer 106 includes at least one organic material layer 1061. The organic material layer 1061 includes at least one of a hole transport layer, a hole injection layer, an electron injection layer and an electron transport layer. The organic material layer 1061 is disconnected by the isolation groove 105 to prevent water and oxygen from invading the display area 104 of the display panel 100 along the organic light-emitting layer, thereby affecting the stability of the display panel 100. A barrier structure 107 is formed in the substrate 101. The barrier structure 107 is made of an inorganic material or a metal material. Due to the presence of the barrier structure 107 and the different materials of the barrier structure 107 and the substrate 101, the barrier structure 107 is not easily etched when the substrate 101 is etched along the first direction. The barrier structure 107 limits the extension width of the isolation trench 105 in the first direction. By controlling the etching time and etching rate, the etching depth of the isolation trench 105 in a direction perpendicular to the substrate 101 can be controlled. Therefore, along the first direction, the barrier structure 107 at least partially overlaps with the sidewalls of the isolation trench 105. The size of the isolation trench 105 is reasonably set so that the organic material layer 1061 is disconnected at the isolation trench 105. At the same time, in the subsequent packaging process, by controlling the extension width of the isolation trench 105 in the first direction, the isolation trench 105 has a good packaging effect, reducing the probability of water and oxygen corrosion, and ensuring normal display of the display area 104.

[0033] In an embodiment of the present invention, a blocking structure is reasonably arranged so that the blocking structure at least partially overlaps with the side wall of the isolation groove, thereby controlling the position and size of the isolation groove etched on the substrate. There is no need to implement the isolation groove through processes and etching selectivity of different materials. Precise control of the isolation groove can be achieved, thereby improving the packaging effect at the isolation groove, reducing the risk of water and oxygen corrosion, and improving the display effect of the display panel.

[0034] Continue to refer Figure 2 Optionally, the organic material layer 1061 includes a first sub-portion 1062 , and the first sub-portion 1062 is located in the isolation trench 105 ; along the first direction, the blocking structure 107 is located on a side of the first sub-portion 1062 close to the sidewall of the isolation trench 105 .

[0035] The display element layer 106 includes an organic material layer 1061. This organic material layer 1061 serves as a light-emitting auxiliary layer, assisting the display elements in the display area 104 in emitting light and ensuring a good display effect. Due to the presence of the isolation trench 105, during the preparation process, the organic material layer 1061 is disconnected at the isolation trench 105. A first portion 1062 of the organic material layer 1061 is located within the isolation trench 105, i.e., at the bottom of the isolation trench 105. Furthermore, due to the presence of the blocking structure 107 on the substrate 101, the blocking structure 107 limits the extension width of the isolation trench 105 in the first direction 1062. Furthermore, due to the presence of the blocking structure 107, the first portion 1062 of the organic material layer 1061 is located close to a sidewall of the isolation trench 105 and in contact with the blocking structure 107.

[0036] Continue to refer Figure 2 Optionally, the display panel 100 further includes an isolation column 108, which is located in the partition area 103, and the isolation groove 105 includes at least one first isolation groove 1051 and at least one second isolation groove 1052; the first isolation groove 1051 is located on the side of the isolation column 108 close to the display area 104, and the second isolation groove 1052 is located on the side of the isolation column 108 away from the display area 104; the blocking structure 107 includes at least one first blocking structure 1071 and at least one second blocking structure 1072; along the first direction, the first blocking structure 1071 at least partially overlaps with the side wall of the first isolation groove 1051, and the second blocking structure 1072 at least partially overlaps with the side wall of the second isolation groove 1052.

[0037] Among them, the display panel 100 also includes an isolation column 108, which is located in the partition area 103. The existence of the isolation column 108 can effectively prevent cracks in the partition area 103 from spreading to the display area 104. The partition column 108 is formed by stacking film layers such as a planarization layer, a pixel definition layer and a support column. Due to the presence of the isolation column 108, the isolation groove 105 includes a first isolation groove 1051 located on the side of the isolation column 108 close to the display area 104 and a second isolation groove 1052 located on the side of the isolation column 108 away from the display area 104; a blocking structure 107 is provided in the isolation groove 105, and the size of the isolation groove 105 is limited by the blocking structure 107. Along the first direction, a first blocking structure 1071 is provided corresponding to the first isolation groove 1051, and the first blocking structure 1071 at least partially overlaps with the side wall of the first isolation groove 1051; a second blocking structure 1072 is provided corresponding to the second isolation groove 1052, and the second blocking structure 1072 at least partially overlaps with the side wall of the second isolation groove 1052. Since the closer to the display area 104, the more directly water and oxygen can affect the display effect of the display area 104, the first blocking structure 1071 affects the size of the first isolation groove 1051 to avoid encapsulation failure of the inorganic encapsulation layer 111 at the first isolation groove 1051 during the encapsulation process, thereby affecting the display effect. At the same time, away from the display area 104, by setting the second isolation groove 1052, the invasion path of water and oxygen is cut off, and the water and oxygen are blocked in the partition area 103, making it difficult for water and oxygen to enter the display area 104, thereby preventing the display area 104 from being affected by water and oxygen.

[0038] Continue to refer Figure 2 Optionally, the substrate 101 also includes a first flexible substrate 109 and a buffer layer 110 located on the side of the first flexible substrate 109 close to the light-emitting surface of the display panel 100, and the isolation groove 105 at least penetrates the buffer layer 110; the display panel 100 also includes an inorganic encapsulation layer 111, which extends from the display area 104 to the partition area 103. Along the first direction, the inorganic encapsulation layer 111 includes a first encapsulation section 112 covering the blocking structure 107, and along the direction perpendicular to the first flexible substrate 109 (the Y direction as shown in the figure), the inorganic encapsulation layer 111 covers the bottom of the first isolation groove 1051; the inorganic encapsulation layer 111 also includes a second encapsulation section 113 located on the side of the buffer layer 110 away from the first flexible substrate 109.

[0039] The substrate 101 includes a first flexible substrate 109. The first flexible substrate 109 can be formed of a transparent glass material of SiO2 or a transparent plastic material. The plastic material can be polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene ether dicarboxylate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl compound, polyimide (PI), polycarbonate (PC), cellulose triacetate (TAC) or cellulose acetate propionate (CAP). The thickness of the first flexible substrate 109 is 5 to 10 μm. A buffer layer 110 is provided on the side of the first flexible substrate 109 close to the light emitting surface of the display panel 100. The buffer layer 110 is provided on the side of the first flexible substrate 109 close to the light emitting surface of the display panel 100. 10 may include inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide or titanium nitride, or organic materials such as polyimide, polyester or acrylic, and may be formed into a plurality of stacks of the above materials. Since the buffer layer 110 is located on the side of the first flexible substrate 109 close to the light-emitting surface of the display panel 100, during the preparation of the isolation groove 105, it is necessary to partially penetrate the buffer layer 110, and then etch the first flexible substrate 109, and cooperate with the setting of the blocking structure 107 to form the isolation groove 105. The encapsulation layer in the display panel 100 is usually the first The three-layer stacked structure of inorganic encapsulation layer + organic encapsulation layer + second inorganic encapsulation layer ensures a good encapsulation effect and thus blocks water and oxygen corrosion. The inorganic encapsulation layer 111 in the embodiment of the present invention is the first inorganic encapsulation layer on the side of the encapsulation layer structure close to the first flexible substrate 109. The inorganic encapsulation layer 111 extends from the display area 104 to the partition area 103. The inorganic encapsulation layer 111 in the encapsulation layer is formed by a chemical vapor deposition (CVD) process, and a tightly adhered film layer is formed on the side wall of the isolation groove 105, thereby improving the encapsulation effect. Along the first direction, the inorganic encapsulation layer 111 includes a covering The first packaging section 112 of the blocking structure 107, that is, the first packaging section 112 contacts the side wall of the isolation groove 105; along the direction perpendicular to the first flexible substrate 109, the inorganic packaging layer 111 covers the bottom of the first isolation groove 1051, and the inorganic packaging layer 111 contacts the bottom of the second isolation groove 1052; the inorganic packaging layer 111 also includes a second packaging section 113 located on the side of the buffer layer 110 away from the first flexible substrate 109, and the second packaging section 113 contacts the side of the buffer layer 110 away from the first flexible substrate 109, thereby encapsulating and protecting the buffer layer 110.

[0040] Continue to refer Figure 2 Optionally, along the first direction, the minimum thickness of the first encapsulation section 112 is W1; the maximum width of the buffer layer 110 extending beyond the blocking structure 107 is W2; wherein W1≥W2.

[0041] Among them, along the direction perpendicular to the first flexible substrate 109, the buffer layer 110 covers the blocking structure 107 and part of the buffer layer 110 extends beyond the blocking structure 107 along the first direction, that is, the distance between the surface of the blocking structure 107 close to the isolation groove 105 and the edge of the buffer layer 110 close to the corresponding blocking structure 107 is the width of the buffer layer 110 extending beyond the blocking structure 107. For the same isolation groove 105, the width of the buffer layer 110 extending beyond the blocking structure 107 may be different. The smaller the width of the buffer layer 110 extending beyond the blocking structure 107, the easier it is to deposit a certain thickness of the inorganic encapsulation layer 111 at the position where the buffer layer 110 extends beyond the blocking structure 107 in the subsequent process, thereby ensuring the encapsulation effect. Along the first direction, the minimum thickness of the first packaging section 112 is greater than or equal to the maximum width of the buffer layer 110 exceeding the blocking structure 107, so that the first packaging section 112 in the inorganic packaging layer 111 can completely cover the buffer layer 110 at the isolation groove 105, ensuring that the overall thickness of the first packaging section 112 is greater than the maximum width of the buffer layer 110 exceeding the blocking structure 107, ensuring the continuous packaging effect of the inorganic packaging layer 111 at the isolation groove 105, and reducing the probability of water and oxygen corrosion.

[0042] Continue to refer Figure 2 Optionally, along the first direction, the maximum width of the buffer layer 110 beyond the blocking structure 107 is W2; along the direction perpendicular to the first flexible substrate 109, the thickness of the second packaging section 113 is H1, wherein,

[0043] Among them, the maximum width of the buffer layer 110 exceeding the blocking structure 107 is reasonably controlled to avoid the buffer layer 110 exceeding the blocking structure 107 by a large width, so that the deposition thickness of the inorganic encapsulation layer 111 at the edge of the buffer layer 110 corresponding to the isolation groove 105 can avoid the inorganic encapsulation layer 111 from breaking. The maximum width of the buffer layer 110 exceeding the blocking structure 107 is set with reference to the thickness of the second encapsulation section 113. The thickness of the second encapsulation section 113 is generally 0.6μm~2μm. The width of the buffer layer 110 exceeding the shielding structure is less than or equal to half of the thickness of the second encapsulation section 113. The maximum width of the buffer layer 110 exceeding the blocking structure 107 is generally 0.2μm~1μm, thereby ensuring the deposition thickness of the inorganic encapsulation layer 111 at the isolation groove 105, reducing the probability of water and oxygen corrosion, and ensuring the normal display effect of the display area 104.

[0044] Continue to refer Figure 2 Optionally, along the first direction, the maximum width of the buffer layer 110 extending beyond the first blocking structure 1071 is W3, and the maximum width of the buffer layer 110 extending beyond the second blocking structure 1072 is W4, where W3≤W4.

[0045] In the first direction, the isolation trench 105 includes a first isolation trench 1051 where the isolation column 108 is close to the display area 104, and a second isolation trench 1052 where the isolation column 108 is further away from the display area 104. The first barrier structure 1071 at least partially overlaps the sidewalls of the first isolation trench 1051, and the second barrier structure 1072 at least partially overlaps the sidewalls of the second isolation trench 1052. In a direction perpendicular to the first flexible substrate 109, the buffer layer 110 covers the barrier structure 107 and partially extends beyond the barrier structure 107 along the first direction. The smaller the width of the buffer layer 110 extending beyond the barrier structure 107, the easier it is to subsequently deposit the inorganic encapsulation layer 111 at the location where the buffer layer 110 extends beyond the barrier structure 107, thereby ensuring an effective encapsulation effect. To ensure that the first and second isolation trenches 1051 and 1052 achieve the same or similar encapsulation effect after inorganic encapsulation, the maximum width of the buffer layer 110 extending beyond the first barrier structure 1071 can be equal to the maximum width of the buffer layer 110 extending beyond the second barrier structure 1072. The maximum width of the buffer layer 110 extending beyond the first blocking structure 1071 can also be smaller than the maximum width of the buffer layer 110 extending beyond the second blocking structure 1072, so as to ensure that the packaging effect at the first isolation groove 1051 is better than the packaging effect at the second isolation groove 1052, reduce the probability of water and oxygen corrosion at the first isolation groove 1051, and ensure the display effect of the display area 104.

[0046] Figure 3 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 3 As shown, optionally, the isolation trench 105 includes a plurality of second isolation trenches 1052 , and along the first direction, the maximum width of the buffer layer 110 exceeding the second blocking structure 1072 gradually increases.

[0047] Among them, multiple second isolation grooves 1052 are arranged in the partition area 103. Along the first direction, the maximum width of the buffer layer 110 exceeding the second blocking structure 1072 gradually increases, so that the packaging thickness of the isolation groove 105 at the position close to the buffer layer 110 gradually decreases, so that the closer to the display area 104, the better the packaging effect of the isolation groove 105 at the position close to the buffer layer 110, and thus the closer to the display area 104, the better the effect of blocking water and oxygen, thereby reducing the probability of water and oxygen erosion entering the display area 104 and ensuring the display effect of the display area 104.

[0048] Continue to refer Figure 2 Optionally, along a direction perpendicular to the first flexible substrate 109 , the thickness of the second packaging portion 113 is H1 , and along the first direction, the minimum width of the blocking structure 107 is W5 ; wherein W5 ≥ H1 .

[0049] Among them, the second packaging section 113 located on the side of the buffer layer 110 away from the first flexible substrate 109 is affected by the deposition process of the inorganic packaging layer 111. Therefore, the thickness of the second packaging section 113 is greater than the thickness of the first packaging section 112, and the thickness of the second packaging section 113 extending in the first direction is the maximum thickness of the inorganic packaging layer 111. At the same time, the width of the blocking structure 107 is reasonably controlled so that the width of the blocking structure 107 is greater than the thickness of the second packaging section 113, or the width of the blocking structure 107 is equal to the thickness of the second packaging section 113, to avoid the width of the blocking structure 107 being too small, which would cause the blocking structure 107 to be damaged during the etching process of the first flexible substrate 109 and affect the formation size of the isolation trench 105. This ensures the deposition effect of the inorganic packaging layer 111 at the isolation trench 105 and improves the barrier effect of the isolation trench 105 against water and oxygen.

[0050] Figure 4 A schematic structural diagram of an isolation trench provided by an embodiment of the present invention is shown in FIG. Figure 4 As shown, optionally, along the first direction, the maximum inner diameter of the first isolation groove 1051 is W6, and the maximum inner diameter of the second isolation groove 1052 is W7, wherein W6≤W7.

[0051] in, Figure 5 A schematic structural diagram of an isolation trench provided by an embodiment of the present invention is shown in FIG. Figure 5 As shown, when the isolation groove 105 is annular, the inner diameter of the isolation groove 105 is the maximum inner diameter of the isolation groove 105 . Figure 6 A schematic structural diagram of an isolation trench provided by an embodiment of the present invention is shown in FIG. Figure 6 As shown, when the isolation trench 105 is in a rectangular ring shape, the length of the diagonal of the inner rectangle of the isolation trench 105 is the maximum inner diameter of the isolation trench 105. In the direction from the display area 104 to the opening area 102, the maximum inner diameter of the first isolation trench 1051 can be set to be smaller than the maximum inner diameter of the second isolation trench 1052, so that the deposition thickness of the inorganic encapsulation layer 111 at the first isolation trench 1051 is greater than the deposition thickness of the inorganic encapsulation layer 111 at the second isolation trench 1052. This improves the water and oxygen barrier effect at the first isolation trench 1051, reduces the probability of water and oxygen erosion entering the display area 104, and ensures normal display of the display area 104. The maximum inner diameter of the first isolation groove 1051 can also be set to be equal to the maximum inner diameter of the second isolation groove 1052, and the first isolation groove 1051 and the second isolation groove 1052 have the same size, which effectively simplifies the difficulty of the etching process and makes the deposition thickness of the inorganic encapsulation layer 111 at the first isolation groove 1051 equal to the deposition thickness of the inorganic encapsulation layer 111 at the second isolation groove 1052, ensuring that the first isolation groove 1051 and the second isolation groove 1052 have the same water and oxygen blocking effect, thereby ensuring the normal display of the display area 104.

[0052] Figure 7 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 7 As shown, optionally, the isolation groove 105 includes a plurality of second isolation grooves 1052 , and the maximum inner diameter of the second isolation groove 1052 gradually increases along the first direction.

[0053] Among them, multiple second isolation grooves 1052 are arranged in the partition area 103. Along the first direction, the second blocking structure 1072 at least partially overlaps with the side wall of the second isolation groove 1052. The maximum inner diameter W7 of the second isolation groove 1052 gradually increases, and the packaging thickness at the second isolation groove 1052 gradually decreases, so that the closer to the display area 104, the better the packaging effect, and thus the closer to the display area 104, the better the effect of blocking water and oxygen, thereby reducing the probability of water and oxygen erosion entering the display area 104 and ensuring the display effect of the display area 104.

[0054] Figure 8 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention, Figure 9 A schematic diagram of another isolation trench structure provided by an embodiment of the present invention is shown in FIG. Figure 8 and Figure 9 As shown, optionally, along a direction perpendicular to the first flexible substrate 109 , the thickness of the first flexible substrate 109 is H2 , and the thickness of the blocking structure 107 is H3 , wherein H3 ≤ H2 .

[0055] Among them, Figure 8 As shown, the thickness of the first flexible substrate 109 is equal to the thickness of the barrier structure 107, or as Figure 9 As shown, the thickness of the first flexible substrate 109 is smaller than the thickness of the barrier structure 107. According to the setting of the barrier structure 107, the etching width of the first flexible substrate 109 is effectively controlled. At the same time, the etching rate and etching time are coordinated to affect the size of the isolation groove 105, thereby improving the packaging effect at the isolation groove 105 and reducing the probability of water and oxygen corrosion.

[0056] Figure 10 A schematic structural diagram of another isolation trench provided by an embodiment of the present invention, Figure 11 A schematic diagram of another isolation trench structure provided by an embodiment of the present invention is shown in FIG. Figure 2 、 Figure 10 and Figure 11 As shown, optionally, the display panel 100 further includes a first isolation layer 114 located on the side of the first flexible substrate 109 away from the light emitting surface of the display panel 100 , and the blocking structure 107 is integrally provided with the first isolation layer 114 , and the blocking structure 107 and the first isolation layer 114 are made of the same material.

[0057] Among them, in order to simplify the difficulty of the preparation process, when the blocking structure 107 and the first isolation layer 114 are made of the same material, and both the blocking structure 107 and the first isolation layer 114 are inorganic materials, the first isolation layer 114 can be reused, and the first isolation layer 114 is etched to form the blocking structure 107, so that the blocking structure 107 and the first isolation layer 114 form an integrated structure, and then the first flexible substrate 109 material is deposited, and the first flexible substrate 109 is etched to form the isolation groove 105. Due to the existence of the blocking structure 107, combined with the etching speed and etching time, the size of the isolation groove 105 is controlled, thereby ensuring the subsequent packaging effect at the isolation groove 105.

[0058] Figure 12 A schematic diagram of another isolation trench structure provided by an embodiment of the present invention is shown in FIG. Figure 2 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12 As shown, optionally, the thickness of the blocking structure 107 is H3, the isolation trench 105 includes a first sub-isolation trench 115 disposed in the first flexible substrate 109, and the depth of the first sub-isolation trench 115 is H4; wherein H4≤H3.

[0059] The isolation trench 105 is partially located in the buffer layer 110 and partially located in the first flexible substrate 109. The first flexible substrate 109 is etched to a certain depth to form a first sub-isolation trench 115. Figure 12 As shown, the depth H4 of the first sub-isolation trench 115 is equal to the thickness H3 of the blocking structure 107. During the preparation process, when the first isolation layer 114 and the blocking structure 107 are made of the same material, the first isolation layer 114 material with a certain thickness can be deposited first, the first isolation layer 114 is reused, and the blocking structure 107 is formed by performing exposure, development and etching processes. Then, the first flexible substrate 109 material is deposited, and the first flexible substrate 109 is etched to expose a portion of the first isolation layer 114 to form the first sub-isolation trench 115. Figure 10 As shown, the depth H4 of the first sub-isolation trench 115 is equal to the thickness H3 of the blocking structure 107. When the first isolation layer 114 and the blocking structure 107 are made of different materials, after forming the first isolation layer 114, the material of the blocking structure 107 is deposited, and the exposure, development and etching processes are performed to form the blocking structure 107. Then, the material of the first flexible substrate 109 is deposited, and then the first flexible substrate 109 is etched to expose a portion of the first isolation layer 114 to form the first sub-isolation trench 115. Figure 11As shown, the depth H4 of the first sub-isolation trench 115 is equal to the thickness H3 of the blocking structure 107. After forming the first isolation layer 114, a layer of the first flexible substrate 109 material is first deposited, and then the blocking structure 107 material is deposited. Exposure, development, and etching processes are performed to form the blocking structure 107. Then, another layer of the first flexible substrate 109 material is deposited, and then the second layer of the first flexible substrate 109 is etched to form the first sub-isolation trench 115. Figure 13 As shown, the depth H4 of the first sub-isolation trench 115 is less than the thickness H3 of the blocking structure 107. During the preparation process, when the first isolation layer 114 and the blocking structure 107 are made of the same material, the first isolation layer 114 material with a certain thickness can be deposited first, the first isolation layer 114 is reused, and the blocking structure 107 is formed by exposure, development and etching processes. Then, the first flexible substrate 109 is deposited, and the first flexible substrate 109 is partially etched to form the first sub-isolation trench 115. Figure 14 As shown, the depth H4 of the first sub-isolation trench 115 is less than the thickness H3 of the blocking structure 107. When the first isolation layer 114 and the blocking structure 107 are made of different materials, the material of the blocking structure 107 is deposited, and then exposed, developed, and etched to form the blocking structure 107. The first flexible substrate 109 is then deposited, and then partially etched to form the first sub-isolation trench 115. By properly setting the thickness of the blocking structure 107, the etching width of the first flexible substrate 109 can be ensured, and the etching depth of the first flexible substrate 109 can be controlled according to actual design requirements, thereby ensuring the size of the isolation trench 105 and the isolation effect of the isolation trench 105.

[0060] Figure 13 A schematic diagram of another isolation trench structure provided by an embodiment of the present invention is shown in FIG. Figure 2 and Figure 13 As shown, optionally, the substrate 101 includes a first flexible substrate 109 and a first isolation layer 114 located on the side of the first flexible substrate 109 away from the light-emitting surface of the display panel 100, and the isolation groove 105 includes a side surface 116 close to the blocking structure 107. Along the first direction, the angle between the side surface 116 and the first isolation layer 114 is θ1, where θ1≤90°.

[0061] In which, the substrate 101 includes a first flexible substrate 109 and a first isolation layer 114 located on the side of the first flexible substrate 109 away from the light-emitting surface of the display panel 100. The first isolation layer 114 is an inorganic material. The isolation groove 105 includes a side surface 116 close to the blocking structure 107. Along the first direction, there is an angle between the side surface 116 and the first isolation layer 114. The angle can be less than or equal to 90°, thereby making the shape of the isolation groove 105 an inverted trapezoidal structure. At the same time, it makes it easier for the organic material layer 1061 located in the display element layer 106 to be disconnected at the isolation groove 105, thereby making the inorganic encapsulation layer 111 fill the isolation groove 105, and depositing a certain thickness at the disconnection point of the organic material layer 1061, thereby ensuring the encapsulation effect at the isolation groove 105 and reducing the probability of water and oxygen corrosion.

[0062] Figure 14 A schematic diagram of another isolation trench structure provided by an embodiment of the present invention is shown in FIG. Figure 2 and Figure 14 As shown, optionally, the substrate 101 includes a first flexible substrate 109 and a first isolation layer 114 located on the side of the first flexible substrate 109 away from the light-emitting surface of the display panel 100, and the isolation groove 105 includes a side 116 close to the blocking structure 107. Along the first direction, the angle between the tangent at any point in the side 116 and the first isolation layer 114 gradually increases.

[0063] Among them, the isolation groove 105 includes a side surface 116 close to the blocking structure 107. Along the first direction, the angle between the tangent at any point in the side surface 116 and the first isolation layer 114 gradually increases. The side surface 116 of the isolation groove 105 is an arc surface, which makes it easier for the organic material layer 1061 located in the display element layer 106 to be disconnected at the isolation groove 105, and then the inorganic encapsulation layer 111 material is deposited to a certain thickness at the disconnection point of the organic material layer 1061, thereby ensuring the encapsulation effect at the isolation groove 105 and reducing the probability of water and oxygen corrosion.

[0064] Optionally, the material of the blocking structure 107 includes at least one of SiN, SiO 2 , a-Si, Mo, Ti, Al and Ag.

[0065] The barrier structure 107 can be made of inorganic materials such as SiN, SiO2, a-Si, or metallic materials such as Mo, Ti, Al, and Ag. When the barrier structure 107 is made of an inorganic material, it can be etched from the first flexible substrate in the base 101, and the first flexible substrate can be reused. In this case, the first flexible substrate and the barrier structure 107 are an integrated structure, eliminating the need for additional deposition of materials forming the barrier structure 107, thereby reducing manufacturing complexity and cost.

[0066] Based on the same inventive concept, an embodiment of the present invention further provides a display device. Figure 15 A schematic structural diagram of a display device provided by an embodiment of the present invention is shown in FIG. Figure 15 As shown, the display device 200 includes the display panel 100 in the above embodiment. The display device 200 includes the display panel described in any embodiment of the present invention. Therefore, the display device 200 provided by the embodiment of the present invention has the corresponding beneficial effects of the display panel provided by the embodiment of the present invention, which will not be repeated here. Exemplarily, the display device 200 can be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, and the embodiment of the present invention is not limited to this. The display device 200 provided by the embodiment of the present invention also includes a sensor 201, and the sensor 201 is arranged corresponding to the opening area 102. The sensor 201 may include any photosensitive element such as a camera, an infrared sensor, etc. By arranging the sensor 201 corresponding to the opening area 102, it is ensured that the sensor 201 can receive light normally and operate normally.

[0067] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations, and substitutions are possible for those skilled in the art without departing from the scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: A substrate comprising an opening area, a partition area at least partially surrounding the opening area, and a display area partially surrounding the partition area; at least one isolation trench disposed in the substrate and located in the isolation region; a display element layer, the display element layer being disposed on the substrate, the display element layer comprising at least one organic material layer, the organic material layer being disconnected by the isolation groove; A blocking structure is arranged in the substrate and along a first direction, the blocking structure at least partially overlaps with the side wall of the isolation groove, and the blocking structure is used to limit the extension width of the isolation groove in the first direction; wherein the first direction is the direction from the display area to the opening area.

2. The display panel according to claim 1, wherein: The organic material layer includes a first sub-portion, and the first sub-portion is located in the isolation trench; Along the first direction, the blocking structure is located on a side of the first portion close to a sidewall of the isolation trench.

3. The display panel according to claim 1, wherein: The display panel further includes an isolation column, wherein the isolation column is located in the partition area. The isolation trench includes at least one first isolation trench and at least one second isolation trench; the first isolation trench is located on a side of the isolation column close to the display area, and the second isolation trench is located on a side of the isolation column away from the display area; The blocking structure includes at least one first blocking structure and at least one second blocking structure; Along the first direction, the first blocking structure at least partially overlaps with a sidewall of the first isolation trench, and the second blocking structure at least partially overlaps with a sidewall of the second isolation trench.

4. The display panel according to claim 3, wherein: The substrate further includes a first flexible substrate and a buffer layer located on a side of the first flexible substrate close to the light emitting surface of the display panel, and the isolation groove at least penetrates the buffer layer; The display panel further includes an inorganic encapsulation layer, the inorganic encapsulation layer extending from the display area to the partition area, and along the first direction, the inorganic encapsulation layer includes a first encapsulation portion covering the barrier structure, and along a direction perpendicular to the first flexible substrate, the inorganic encapsulation layer covers the bottom of the first isolation trench; The inorganic encapsulation layer further includes a second encapsulation portion located on a side of the buffer layer away from the first flexible substrate.

5. The display panel according to claim 4, wherein: Along the first direction, the minimum thickness of the first encapsulation section is W1; the maximum width of the buffer layer extending beyond the barrier structure is W2; Among them, W1≥W2.

6. The display panel according to claim 4, wherein: Along the first direction, the maximum width of the buffer layer extending beyond the barrier structure is W2; along the direction perpendicular to the first flexible substrate, the thickness of the second packaging section is H1. in, 7. The display panel according to claim 4, wherein: Along the first direction, the maximum width of the buffer layer extending beyond the first barrier structure is W3, and the maximum width of the buffer layer extending beyond the second barrier structure is W4. Among them, W3≤W4.

8. The display panel according to claim 4, wherein: The isolation trench includes a plurality of second isolation trenches, and along the first direction, a maximum width of the buffer layer exceeding the second barrier structure gradually increases.

9. The display panel according to claim 4, wherein: Along a direction perpendicular to the first flexible substrate, the thickness of the second encapsulation section is H1, and along the first direction, the minimum width of the blocking structure is W5; Among them, W5≥H1.

10. The display panel according to claim 3, wherein: Along the first direction, the maximum inner diameter of the first isolation trench is W6, and the maximum inner diameter of the second isolation trench is W7, where W6≤W7.

11. The display panel according to claim 3, wherein The isolation groove includes a plurality of second isolation grooves, and the maximum inner diameter of the second isolation groove gradually increases along the first direction.

12. The display panel according to claim 4, wherein: Along a direction perpendicular to the first flexible substrate, the thickness of the first flexible substrate is H2, and the thickness of the blocking structure is H3. Among them, H3≤H2.

13. The display panel according to claim 4, wherein: The display panel further includes a first isolation layer located on a side of the first flexible substrate away from the light emitting surface of the display panel. The blocking structure is integrally provided with the first isolation layer and is made of the same material as that of the first isolation layer.

14. The display panel according to claim 4, wherein: The blocking structure has a thickness of H3, the isolation trench includes a first sub-isolation trench provided in the first flexible substrate, and the depth of the first sub-isolation trench is H4; Among them, H4≤H3.

15. The display panel according to claim 1, wherein The substrate includes a first flexible substrate and a first isolation layer located on a side of the first flexible substrate away from the light emitting surface of the display panel. The isolation groove includes a side surface close to the blocking structure. Along the first direction, the angle between the side surface and the first isolation layer is θ1, where θ1≤90°.

16. The display panel according to claim 1, wherein The substrate includes a first flexible substrate and a first isolation layer located on the side of the first flexible substrate away from the light-emitting surface of the display panel. The isolation groove includes a side surface close to the blocking structure. Along the first direction, the angle between the tangent line at any point on the side surface and the first isolation layer gradually increases.

17. The display panel according to claim 1, wherein: The material of the barrier structure includes at least one of SiN, SiO2, a-Si, Mo, Ti, Al and Ag.

18. A display device, characterized in that: A display panel comprising any one of claims 1-17.

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