Heating element, atomizing component and electronic atomizing device

Abstract

This application provides a heating element, an atomizing component, and an electronic atomizing device. The heating element includes a dense substrate, a heating film, and a protective film. The dense substrate includes a first surface and a second surface opposite to the first surface. Multiple micropores are disposed on the dense substrate; these micropores are through-holes used to guide the aerosol-generating matrix to the first surface. The heating film is formed on the first surface. The protective film is formed on the surface of the heating film away from the dense substrate, and the protective film is made of a metal alloy resistant to corrosion by the aerosol-generating matrix. Through the above configuration, a heating element formed from a dense substrate is provided to meet the user's requirements for atomization effect.

Description

Technical Field

[0001] This invention relates to the field of atomizer technology, and more particularly to a heating element, atomizing component, and electronic atomizing device. Background Technology

[0002] A typical electronic atomizing device consists of a heating element, a battery, and a control circuit. As the core component of the electronic atomizing device, the characteristics of the heating element determine the atomization effect and user experience.

[0003] Existing heating elements are mainly cotton wick heating elements and ceramic heating elements. Cotton wick heating elements mostly consist of a spring-shaped metal heating wire wound around a cotton rope or fiber rope; the liquid aerosol matrix to be atomized is absorbed by both ends of the cotton rope and then transported to the central metal heating wire for heating and atomization. Ceramic heating elements mostly form a heating film on the surface of a porous ceramic body, which serves as a liquid conductor and reservoir.

[0004] With the advancement of technology, users have increasingly higher requirements for the atomization effect of electronic atomizing devices. In order to meet the needs of users, it is necessary to provide a heating element with better atomization effect. Summary of the Invention

[0005] In view of this, this application provides a heating element, an atomizing component, and an electronic atomizing device to solve the technical problem of how to meet users' needs for atomization effect in the prior art.

[0006] To solve the above-mentioned technical problems, the first technical solution provided in this application is: to provide a heating element, including a dense substrate, a heating film, and a protective film, wherein the dense substrate includes a first surface and a second surface opposite to the first surface; the dense substrate is provided with a plurality of micropores, the micropores being through holes, the micropores being used to guide the aerosol generating matrix to the first surface; the heating film is formed on the first surface; the protective film is formed on the surface of the heating film away from the dense substrate; the material of the protective film is a metal alloy resistant to corrosion by the aerosol generating matrix.

[0007] The protective film is made of one of the following materials: stainless steel, nickel-chromium-iron alloy, or nickel-based corrosion-resistant alloy.

[0008] The dense matrix is ​​glass or dense ceramic.

[0009] The dense matrix is ​​glass, which is borosilicate glass, quartz glass, or photosensitive lithium aluminosilicate glass.

[0010] The heating film is made of copper and its alloys, silver and its alloys, aluminum and its alloys, and gold and its alloys.

[0011] The thickness of the heating film is 200 nanometers to 5 micrometers.

[0012] The heating film has a resistance of 0.5 ohms to 2 ohms at room temperature.

[0013] The resistivity of the heating film is no greater than 0.06*10⁻⁶. -6 Ω·m.

[0014] The thickness of the protective film is 100 nanometers to 1000 nanometers.

[0015] The micropores penetrate the heating film and the protective film.

[0016] The heating film is made of one of the following materials: nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, silver, gold, and titanium.

[0017] The thickness of the heating film is 5 micrometers to 100 micrometers.

[0018] The thickness of the protective film is 5 micrometers to 20 micrometers.

[0019] The protective film exposes a portion of the heating film to serve as an electrode of the heating film.

[0020] The micropores are arranged in an array.

[0021] The micropores have the same shape and diameter; the micropores are arranged in a rectangular array.

[0022] Wherein, both the first surface and the second surface include smooth surfaces; the first surface is a plane; the micropore is a through hole that vertically penetrates the first surface and the second surface, and the cross-section of the micropore is circular.

[0023] The first surface and the second surface are both planar and arranged in parallel.

[0024] The thickness of the dense matrix is ​​0.1 mm to 1 mm.

[0025] The thickness of the dense matrix is ​​0.2 mm to 0.5 mm.

[0026] The pore size of the micropores is 1 micrometer to 100 micrometers.

[0027] The pore size of the micropores is 20 micrometers to 50 micrometers.

[0028] The ratio of the thickness of the dense matrix to the pore size of the micropores is 20:1-3:1.

[0029] The ratio of the thickness of the dense matrix to the pore size of the micropores is 15:1 to 5:1.

[0030] The ratio of the center distance between adjacent micropores to the diameter of the micropore is 3:1 to 1.5:1.

[0031] The ratio of the center distance between adjacent micropores to the diameter of the micropore is 3:1 to 2.5:1.

[0032] To solve the above-mentioned technical problems, the second technical solution provided in this application is: to provide an atomizing component, including a liquid storage chamber and a heating element; the liquid storage chamber is used to store a liquid aerosol generation matrix; the heating element is any one of the heating elements described above; the micropores are connected to the liquid storage chamber.

[0033] It also includes a loose matrix, which is disposed on the second surface of the dense matrix of the heating element.

[0034] The porous matrix is ​​a porous ceramic, sponge, foam, or fiber layer.

[0035] To solve the above-mentioned technical problems, the third technical solution provided in this application is: to provide an electronic atomizing device, including an atomizing component and a power supply component, wherein the atomizing component is the atomizing component described above, and the power supply component is electrically connected to the heating element.

[0036] The power supply component includes a battery with a voltage range of 2.5 volts to 4.4 volts; the power range of the electronic atomizing device is 6 watts to 8.5 watts.

[0037] The beneficial effects of this application are as follows: Unlike existing technologies, the heating element in this application includes a dense substrate, a heating film, and a protective film. The dense substrate includes a first surface and a second surface opposite to the first surface. Multiple micropores are provided on the dense substrate; these micropores are through-holes used to guide the aerosol-generating matrix to the first surface. The heating film is formed on the first surface. The protective film is formed on the surface of the heating film away from the dense substrate, and the material of the protective film is a metal alloy resistant to corrosion by the aerosol-generating matrix. Through the above configuration, a heating element formed from a dense substrate is provided to meet the user's requirements for atomization effect. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the electronic atomizing device provided in this application;

[0040] Figure 2 This is a schematic diagram of the atomizing component provided in this application;

[0041] Figure 3 This is a schematic diagram of the structure of the heating element provided in this application;

[0042] Figure 4 yes Figure 3 A schematic diagram of the dense matrix in the provided heating element;

[0043] Figure 5a yes Figure 3 A schematic diagram of the structure of the first embodiment of micropores in a dense matrix is ​​provided;

[0044] Figure 5b yes Figure 3 A schematic diagram of the structure of the second embodiment of the micropores in the dense matrix is ​​provided;

[0045] Figure 5c yes Figure 3 A schematic diagram of the structure of the third embodiment of the micropores in the dense matrix is ​​provided;

[0046] Figure 5d yes Figure 3 A schematic diagram of the structure of the fourth embodiment of the micropores in the dense matrix provided;

[0047] Figure 6a yes Figure 3 A top view of the first embodiment of the provided dense matrix;

[0048] Figure 6b yes Figure 3 A top view of the second embodiment of the dense matrix provided;

[0049] Figure 7 yes Figure 6b A schematic diagram of the manufacturing process for the provided dense matrix;

[0050] Figure 8a for Figure 7 A top view of the structure in step S1;

[0051] Figure 8b for Figure 7 A side view of the structure in step S1;

[0052] Figure 8c for Figure 7 A top view of the structure in step S2;

[0053] Figure 8d for Figure 7A side view of the structure in step S2;

[0054] Figure 9a This is a top view of the structure of the heating element provided in this application when the heating film is a thick film;

[0055] Figure 9b yes Figure 3 A top view diagram of the provided heating element;

[0056] Figure 10 This is a schematic diagram of the structure of the heating element provided in this application, which includes a protective film and the heating film is a thin film;

[0057] Figure 11 This is a top view of the heating element provided in this application, which includes a protective film and the heating film is a thick film.

[0058] Figure 12 This is a partial structural diagram of the atomizing component provided in this application, including the porous matrix;

[0059] Figure 13 This is a SEM image of one embodiment of the heating film provided in this application;

[0060] Figure 14 This is a comparison chart of the atomized aerosol content of the heating element in this application and that of a traditional porous ceramic heating element;

[0061] Figure 15 This is a diagram showing the failure of the heating film in the heating element provided in this application;

[0062] Figure 16 yes Figure 15 The provided SEM and EDS images show the failure of the heating film.

[0063] Figure 17 This is a graph showing the relationship between the lifespan of the heating film and the thickness of the protective film in the heating element provided in this application;

[0064] Figure 18 This is a schematic diagram of the wet burning test of the heating element provided in this application;

[0065] Figure 19 This is a graph showing the relationship between the dense matrix thickness / micropore diameter and atomization amount of the heating element provided in this application;

[0066] Figure 20 This is a graph showing the relationship between the atomization temperature and heating power of a traditional porous ceramic heating element.

[0067] Figure 21 This is a graph showing the relationship between the atomization temperature of the heating element and the heating power provided in this application;

[0068] Figure 22 This is a graph showing the relationship between the atomization temperature of the heating element and the suction time provided in this application. Detailed Implementation

[0069] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0070] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0071] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0072] Please see Figure 1 , Figure 1 This is a schematic diagram of the electronic atomizing device provided in this application.

[0073] Electronic atomization devices can be used for atomizing liquid substrates. The device includes an atomizing component 1 and a power supply component 2 connected to each other. The atomizing component 1 stores and atomizes the liquid aerosol generation substrate to form an aerosol that can be inhaled by the user. The liquid aerosol generation substrate can be a medicinal liquid, plant leaf liquid, or other liquid substrates. The atomizing component 1 can be used in various fields, such as medical applications and electronic aerosolization. The power supply component 2 includes a battery (not shown), an airflow sensor (not shown), and a controller (not shown). The battery powers the atomizing component 1, enabling it to atomize the substrate to form an aerosol. The airflow sensor detects changes in airflow within the electronic atomization device, and the controller activates the device based on these changes. The atomizing component 1 and the power supply component 2 can be integrated or detachably connected, depending on specific requirements.

[0074] Please see Figure 2 , Figure 2 This is a schematic diagram of the atomizing component provided in this application.

[0075] The atomizing assembly 1 includes a liquid storage chamber 10, a heating element 11, a mouthpiece 12, and a mist outlet channel 13. The liquid storage chamber 10 stores the liquid aerosol generation matrix, and the heating element 11 atomizes the aerosol generation matrix in the liquid storage chamber 10. In this embodiment, a liquid discharge channel 14 is formed between the liquid storage chamber 10 and the heating element 11 to guide the liquid in the liquid storage chamber 10 to the heating element 11; in another embodiment, the heating element 11 may also be directly exposed to the liquid storage chamber 10 to atomize the liquid in the liquid storage chamber 10. The atomized aerosol from the heating element 11 reaches the mouthpiece 12 through the mist outlet channel 13 and is inhaled by the user. The heating element 11 is electrically connected to the power supply assembly 2 to atomize the aerosol generation matrix.

[0076] Currently, commonly used heating elements include cotton wick heating elements and porous ceramic heating elements. Cotton wick heating elements typically consist of a spring-shaped metal heating wire wound around a cotton or fiber rope. This spring-shaped metal heating wire provides structural support, and to achieve sufficient strength, its diameter is usually several hundred micrometers. The liquid aerosol matrix to be atomized is absorbed by both ends of the cotton or fiber rope and then transported to the central metal heating wire for heating and atomization. One structure of porous ceramic heating elements involves a spring-shaped metal heating wire embedded within a cylindrical porous ceramic body. The porous ceramic body serves as a liquid conductor and reservoir. Another structure involves printing a thick metal film paste onto a porous ceramic body, followed by high-temperature sintering to form a metal wire. Because the pore size distribution on the porous ceramic surface varies from 1 micrometer to 100 micrometers, the surface roughness is relatively high. To form a continuous and stable metal film wire, the thickness of the metal film wire typically exceeds 100 micrometers.

[0077] Porous ceramic heating elements are gaining popularity due to their higher temperature stability and relative safety. A common structure for porous ceramic heating elements involves printing thick-film metal wires onto the porous ceramic surface. Existing electronic atomization devices typically use high-resistivity materials such as nickel-chromium alloys, nickel-chromium-iron alloys, and iron-chromium-aluminum alloys for their thick-film metal wires. When these thick-film metal wires repeatedly heat the liquid aerosol to form a matrix, heavy metal ions, such as excessive levels of nickel and chromium, are often detected in the aerosol. The accumulation of these heavy metal ions can damage human organs such as the lungs, liver, and kidneys, posing a significant safety hazard to users.

[0078] Furthermore, regarding the aforementioned structures of cotton-wick heating elements and porous ceramic heating elements, when energized, the metal heating wire or thick-film metal conductor is heated, and the heat is conducted to the liquid within the cotton rope or porous ceramic body, causing the liquid to be heated and atomized. Because the metal heating wire or thick-film metal conductor is a dense solid, it needs to be preferentially heated when energized. Only the liquid near the metal heating wire or thick-film metal conductor is directly heated by it; liquids further away need to be heated and atomized by the heat conducted by the cotton rope or porous ceramic body. The energy provided by the battery needs to heat the metal heating wire or thick-film metal conductor, as well as the entire liquid transport medium, resulting in low atomization efficiency in this heating method.

[0079] Existing e-cigarette devices typically have a power output of no more than 10 watts, with power ranging from 6 to 8.5 watts. The batteries used in these devices operate at voltages between 2.5 volts and 4.4 volts. For closed-system e-cigarette devices (those that do not require user-added atomizing media), the battery voltage range is 3 volts to 4.4 volts.

[0080] The inventors of this application have discovered that, due to the smooth surface of a liquid-conducting substrate made of dense materials such as glass, a continuous and stable metal heating film can be deposited on its surface using physical vapor deposition or chemical vapor deposition. The thickness of the metal heating film is in the range of a few micrometers or nanometers. This not only allows for the miniaturization of the heating element 11 but also saves on heating film material.

[0081] However, the inventors of this application have discovered that, compared to existing cotton wick heating elements and porous ceramic heating elements, liquid-conducting substrates made of dense materials such as glass have shorter liquid supply channels and faster liquid supply speeds, but also a greater risk of leakage. Therefore, the fabrication of the heating element 11 using a liquid-conducting substrate made of dense materials such as glass often requires a more robust sealing design for the atomizing component 1. This increases the difficulty and cost of fabricating the atomizing component 1. Moreover, even if a liquid storage tank or other structure is designed in the atomizing component 1 to collect leakage and prevent leakage from flowing out of the atomizing component 1, the utilization rate of the aerosol generation matrix is ​​relatively low.

[0082] Furthermore, the inventors of this application have discovered that, due to the high resistivity of existing materials such as nickel-chromium alloys, nickel-chromium-iron alloys, and iron-chromium-aluminum alloys, reducing the thickness of the heating film to a few micrometers or less under the same shape will significantly increase the resistance of the heating film. For example, reducing the thickness of the heating film from 100 micrometers to 10 micrometers increases the resistance tenfold. If the power of the heating element 11 is to remain unchanged, the battery voltage needs to be increased, which will lead to an increase in the cost of the electronic atomization device. Moreover, such a heating element 11 is incompatible with the voltage of the battery in the power supply component 2 of existing electronic atomization devices, causing inconvenience for consumers.

[0083] Based on the problems existing in the current heating element, this application provides a heating element 11 to solve the above problems. The structure of the heating element 11 of this application will be described in detail below.

[0084] Please see Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the structure of the heating element provided in this application. Figure 4 yes Figure 3 A schematic diagram of the dense matrix in the provided heating element.

[0085] The heating element 11 includes a dense substrate 111 and a heating film 112. The dense substrate 111 includes a first surface and a second surface 1112 opposite to the first surface 1111; a plurality of micropores 113 are provided on the dense substrate 111, the micropores 113 are through holes, and the micropores 113 are used to guide the aerosol generation matrix to the first surface 1111. The micropores 113 have a capillary effect. The heating film 112 is formed on the first surface 1111; the resistance of the heating film 112 at room temperature is 0.5 ohms to 2 ohms, where room temperature is 25°C. It is understood that the dense substrate 111 provides structural support, and the heating film 112 in the heating element 11 is electrically connected to the power supply component 2. When the power of the electronic atomizing device is 6 watts to 8.5 watts and the battery voltage range is 2.5 volts to 4.4 volts, in order to achieve the working resistance of the battery, the heating film 112 of the heating element 11 has a resistance range of 0.5 ohms to 2 ohms at room temperature.

[0086] This application improves product consistency by precisely controlling the porosity of the heating element 11 through the provision of multiple micropores 113 with capillary forces on the dense substrate 111. In other words, during mass production, the porosity of the dense substrate 111 in the heating element 11 is essentially uniform, and the thickness of the heating film 112 formed on the dense substrate 111 is uniform, ensuring consistent atomization effects for electronic atomizing devices manufactured in the same batch.

[0087] The aerosol generating matrix in the liquid storage chamber 10 reaches the dense substrate 111 of the heating element 11 through the liquid lowering channel 14. The capillary force of the micropores 113 on the dense substrate 111 guides the aerosol generating matrix to the first surface 1111 of the dense substrate 111, causing the aerosol generating matrix to be atomized by the heating film 112. In other words, the micropores 113 are connected to the liquid storage chamber 10 through the liquid lowering channel 14. The material of the dense substrate 111 can be glass or dense ceramic; when the dense substrate 111 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, or photosensitive lithium aluminosilicate glass.

[0088] Compared to existing cotton wick heating elements and porous ceramic heating elements, the microporous thin-film structure heating element 11 provided in this application has a shorter liquid supply channel and a faster liquid supply speed, but also a greater risk of leakage. Therefore, the inventors of this application studied the effect of the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113 on the liquid conduction of the heating element 11. The results showed that increasing the thickness of the dense substrate 111 and decreasing the pore size of the micropores 113 can reduce the risk of leakage but also decrease the liquid supply rate. Conversely, decreasing the thickness of the dense substrate 111 and increasing the pore size of the micropores 113 can increase the liquid supply rate but increase the risk of leakage, which is contradictory. To address this, this application designed the thickness of the dense substrate 111, the pore size of the micropores 113, and the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113, so that when the heating element 11 operates at a power of 6 watts to 8.5 watts and a voltage of 2.5 volts to 4.4 volts, it can achieve sufficient liquid supply while preventing leakage. The thickness of the dense matrix 111 is the distance between the first surface 1111 and the second surface 1112.

[0089] In addition, the inventors of this application studied the ratio of the center-to-center distance of adjacent micropores 113 to the pore diameter of micropores 113. They found that if the ratio of the center-to-center distance of adjacent micropores 113 to the pore diameter of micropores 113 is too large, the dense matrix 111 has greater strength and is easier to process, but the porosity is too small, which can easily lead to insufficient liquid supply. If the ratio of the center-to-center distance of adjacent micropores 113 to the pore diameter of micropores 113 is too small, the porosity is larger and the liquid supply is sufficient, but the strength of the dense matrix 111 is smaller and it is not easy to process. Therefore, this application also designed a ratio of the center-to-center distance of adjacent micropores 113 to the pore diameter of micropores 113 to maximize the strength of the dense matrix 111 while meeting the liquid supply capacity.

[0090] The following section will use glass made of dense matrix 111 as an example.

[0091] Specifically, both the first surface 1111 and the second surface 1112 include smooth surfaces, and the first surface 1111 is planar. That is to say, the first surface 1111 of the dense substrate 111 is a smooth surface and is planar. The heating film 112 is formed on the first surface 1111. The smooth surface of the first surface 1111 is beneficial for the deposition of metal materials into films with a small thickness.

[0092] In one embodiment, the first plane 1111 and the second surface 1112 of the dense substrate 111 are both smooth surfaces, both planar, and the first surface 1111 and the second surface 1112 of the dense substrate 111 are arranged parallel to each other; the micropore 113 penetrates through the first surface 1111 and the second surface 1112, the axis of the micropore 113 is perpendicular to the first surface 1111 and the second surface 1112, and the cross-section of the micropore 113 is circular; in this case, the thickness of the dense substrate 111 is equal to the length of the micropore 113. It can be understood that the second surface 1112 is parallel to the first surface 1111, and the micropore 113 penetrates from the first surface 1111 to the second surface 1112, which simplifies the manufacturing process of the dense substrate 111 and reduces costs. The thickness of the dense substrate 111 is the distance between the first surface 1111 and the second surface 1112. The micropore 113 can be a through-hole with a uniform diameter or a through-hole with a non-uniform diameter, as long as the diameter variation range is within 50%. For example, due to limitations in the fabrication process, the micropores 113 created on the glass by laser induction and etching typically have larger diameters at both ends and smaller diameters in the middle. Therefore, it is sufficient to ensure that the diameter of the middle portion of the micropore 113 is not less than half the diameter of the two end ports.

[0093] In another embodiment, the first surface 1111 of the dense substrate 111 is a smooth surface and is planar, which facilitates the deposition of metal material into a film with a small thickness. The second surface 1112 of the dense substrate 111 is a smooth surface, and the second surface 1112 can be non-planar, such as a bevel, arc, or serrated surface. The second surface 1112 can be designed according to specific needs, as long as the micropores 113 penetrate through the first surface 1111 and the second surface 1112.

[0094] The following describes the material of the dense substrate 111 as glass, and the first surface 1111 and the second surface 1112 of the dense substrate 111 are both smooth planes and arranged in parallel. The ratio of the thickness of the dense substrate 111 to the diameter of the micropores 113 and the ratio of the center distance between two adjacent micropores 113 to the diameter of the micropores 113 are described below.

[0095] The thickness of the dense substrate 111 is 0.1 mm to 1 mm. When the thickness of the dense substrate 111 is greater than 1 mm, it cannot meet the liquid supply requirements, resulting in a decrease in aerosol volume and greater heat loss, and the cost of setting micropores 113 is high. When the thickness of the dense substrate 111 is less than 0.1 mm, the strength of the dense substrate 111 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. Preferably, the thickness of the dense substrate 111 is 0.2 mm to 0.5 mm. The pore size of the micropores 113 on the dense substrate 111 is 1 μm to 100 μm. When the pore size of the micropores 113 is less than 1 μm, it cannot meet the liquid supply requirements, resulting in a decrease in aerosol volume. When the pore size of the micropores 113 is greater than 100 μm, the aerosol generation matrix is ​​prone to flow out from the micropores 113 to the first surface 1111, causing leakage and reducing atomization efficiency. Preferably, the pore size of the micropores 113 is 20 μm to 50 μm. Understandably, the thickness of the dense matrix 111 and the pore size of the micropores 113 are selected according to actual needs.

[0096] The ratio of the thickness of the dense matrix 111 to the pore size of the micropores 113 is 20:1-3:1; preferably, the ratio is 15:1-5:1 (see...). Figure 19 Experiments revealed that a better atomization effect is achieved when the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113 is 15:1 to 5:1. When the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113 is greater than 20:1, the aerosol generating matrix supplied by the capillary force of the micropores 113 is insufficient to meet the atomization requirements of the heating element 11, which not only easily leads to dry burning but also reduces the amount of aerosol generated per atomization cycle. When the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113 is less than 3:1, the aerosol generating matrix easily flows out from the micropores 113 to the first surface 1111, resulting in a waste of the aerosol generating matrix, a decrease in atomization efficiency, and consequently a reduction in the total amount of aerosol.

[0097] The ratio of the center-to-center distance between two adjacent micropores 113 to the pore diameter of the micropore 113 is 3:1-1.5:1, so that the micropores 113 on the dense substrate 111 can maximize the strength of the dense substrate 111 while meeting the liquid supply capacity; preferably, the ratio of the center-to-center distance between two adjacent micropores 113 to the pore diameter of the micropore 113 is 3:1-2:1; more preferably, the ratio of the center-to-center distance between two adjacent micropores 113 to the pore diameter of the micropore 113 is 3:1-2.5:1.

[0098] In one specific embodiment, preferably, the ratio of the thickness of the dense substrate 111 to the pore diameter of the micropores 113 is 15:1-5:1, and the ratio of the center distance between two adjacent micropores 113 to the pore diameter of the micropores 113 is 3:1-2.5:1.

[0099] Please see Figure 5a , Figure 5b , Figure 5c and Figure 5d , Figure 5a yes Figure 3 A schematic diagram of the structure of the first embodiment of micropores in a dense matrix is ​​provided. Figure 5b yes Figure 3 A schematic diagram of the structure of the second embodiment of the dense matrix with micropores. Figure 5c yes Figure 3 A schematic diagram of the structure of the third embodiment of the dense matrix with micropores is provided. Figure 5d yes Figure 3 A schematic diagram of the structure of the fourth embodiment of the dense matrix with micropores.

[0100] In other embodiments, the micropore 113 may also have other structures; please refer to [link to relevant documentation]. Figure 5a , Figure 5b , Figure 5c and Figure 5d The extension direction of the micropores 113 is perpendicular to the thickness direction of the dense matrix 111. Specifically, the longitudinal section of the micropores 113 can be rectangular (e.g., ...). Figure 5a (as shown), trapezoidal (as shown) Figure 5b (as shown), a dumbbell shape, large at both ends and small in the middle (e.g.) Figure 5c (as shown). In another embodiment, the extending direction of the micropore 113 forms an angle with the thickness direction of the dense matrix 111, the angle ranging from 80 degrees to 90 degrees; when the longitudinal section of the micropore 113 is rectangular, the structure is as follows: Figure 5d As shown. Since the micropores 113 are set in a regular geometric shape, the volume of the micropores 113 in the heating element 11 can be calculated, and thus the porosity of the entire heating element 11 can also be calculated, so that the consistency of the porosity of the heating element 11 of similar products can be well guaranteed.

[0101] Please see Figure 6a and Figure 6b , Figure 6a yes Figure 3 A top view of the first embodiment of the provided dense matrix. Figure 6b yes Figure 3 A top view of the second embodiment of the dense matrix provided.

[0102] Specifically, the dense substrate 111 has a regular shape, such as a rectangular plate or a circular plate. In this embodiment, the multiple micropores 113 disposed on the dense substrate 111 are arranged in an array; that is, the multiple micropores 113 disposed on the dense substrate 111 are arranged in a regular pattern, and the center-to-center distance between adjacent micropores 113 is the same. Optionally, the multiple micropores 113 are arranged in a rectangular array; or in a circular array; or in a hexagonal array. The pore diameters of the multiple micropores 113 can be the same or different, depending on the design requirements.

[0103] In one embodiment, the dense substrate 111 is rectangular plate-shaped, and a plurality of micropores 113 disposed on the dense substrate 111 have the same shape and diameter and are arranged in a rectangular array, such as... Figure 6a As shown.

[0104] In another embodiment, the dense substrate 111 is rectangular plate-shaped. The first surface 1111 of the dense substrate 111 includes a first-pore-size micropore array region 1113 and a second-pore-size micropore array region 1114. The pore size of the micropores 113 in the second-pore-size micropore array region 1114 is different from that in the first-pore-size micropore array region 1113, but the shape of the micropores 113 in the second-pore-size micropore array region 1114 is the same as that in the first-pore-size micropore array region 1113. Both the micropores 113 in the second-pore-size micropore array region 1114 and the micropores 113 in the first-pore-size micropore array region 1113 are arranged in a rectangular array. The first-pore-size micropore array region 1113 is located on both sides of the second-pore-size micropore array region 1114, and the pore size of the micropores 113 in the second-pore-size micropore array region 1114 is smaller than that in the first-pore-size micropore array region 1113. Figure 6b As shown. It can be understood that the second aperture micropore array region 1114 can also be located on both sides of the first aperture micropore array region 1113, and the aperture of the micropores 113 in the second aperture micropore array region 1114 is smaller than the aperture of the micropores 113 in the first aperture micropore array region 1113. The first aperture micropore array region 1113, the second aperture micropore array region 1114 and the micropores 113 disposed therein can be designed as needed.

[0105] In other embodiments, the axis of the micropore 113 is not perpendicular to the first surface 1111 and the second surface 1112. One end of the micropore 113 is located on the first surface 1111, and the other end of the micropore 113 may be located on a third surface (not shown) connecting the first surface 1111 and the second surface 1112; or, the other end of the micropore 113 is located on the second surface 1112, and the micropore 113 extends in a curved manner; the structure of the micropore 113 can be designed as needed, as long as it can guide the aerosol generation matrix to the first surface 1111 using its capillary force.

[0106] Please see Figure 7 , Figure 7 yes Figure 6b A schematic diagram of the manufacturing process for the provided dense matrix. Figure 8a for Figure 7 A top view of the structure in step S1; Figure 8b for Figure 7 A side view of the structure in step S1; Figure 8c for Figure 7 A top view of the structure in step S2; Figure 8d for Figure 7 A side view of the structure in step S2.

[0107] In one embodiment, the dense matrix is ​​glass, referred to as a liquid-conducting glass matrix, and the method for manufacturing the liquid-conducting glass matrix includes the following steps:

[0108] Step S1: Perform the first laser-induced etching on the substrate to be processed to form the pre-made holes of the first micropores.

[0109] For details, see Figures 8a-8b A substrate 111a to be processed is provided, comprising a first surface 1111a and a second surface 1111b opposite to the first surface 1111a. The substrate 111a is subjected to a first laser induction process, and then immersed in an etching solution to form a pre-formed hole for a first micropore 113a. The pre-formed hole for the first micropore 113a has a pre-formed aperture and penetrates both the first surface 1111a and the second surface 1111b.

[0110] After step S1, a first micropore array 113c comprising multiple pre-formed holes with pre-formed apertures is formed on the substrate 111a to be processed.

[0111] Step S2: Perform a second laser-induced etching on the substrate to be processed to form a second micropore. The second micropore has a second pore diameter. The second etching process on the substrate to be processed causes the pre-formed pore of the first micropore to be expanded from the pre-formed pore diameter to the first pore diameter.

[0112] For details, see Figures 8c-8dThe substrate 111a to be processed is subjected to a second laser induction according to the second pore size. The substrate 111a after the second laser induction is immersed in the etching solution to form a second micropore 113b. The second micropore 113b has a second pore size. The second etching process of the substrate 111a to be processed causes the pre-made hole of the first micropore 113a to be expanded from the pre-made pore size to the first pore size. The first micropore 113a penetrates the first surface 1111a and the second surface 1111b, thereby obtaining a liquid-conducting glass substrate 116 with liquid-conducting micropores 113 of different pore sizes.

[0113] After step S2, a second micropore array 113d including a plurality of second micropores 113b with a second pore size and a first micropore array 113c including a plurality of first micropores 113a with a first pore size are formed on the liquid-conducting glass substrate 116.

[0114] In one specific embodiment, in order to control the pore size of the first micropore 113a and the second micropore 113b, the method for manufacturing the dense matrix includes:

[0115] S11: Laser-induced processing of the substrate to be processed according to the distribution of the first micropores with the third aperture.

[0116] See Figures 8a-8b The substrate 111a to be processed is made of glass, which can be one or more of borosilicate glass, quartz glass, and photosensitive lithium aluminosilicate glass. The substrate 111a includes a first surface 1111a and a second surface 1111b opposite to the first surface 1111a. The substrate 111a is first irradiated with an infrared picosecond or femtosecond laser with a frequency of 100kHz-200kHz and a pulse width of less than 10 picoseconds, according to a first aperture. In this step, the material of the substrate 111a within the first aperture range is induced by the laser and can be removed in the subsequent etching process.

[0117] S12: Perform the first etching on the substrate that has undergone the first laser-induced etching. The etching time is the total etching time (N) required for the first micropore with the first pore size minus the etching time (M) required for the second micropore with the second pore size.

[0118] Specifically, the substrate 111a to be processed after the first laser induction is immersed in a corrosion solution with a temperature of 30℃~60℃. The corrosion solution can be an acidic corrosion solution of hydrofluoric acid or an alkaline corrosion solution of sodium hydroxide. The corrosion rate of the laser-modified part is tens of times greater than that of the unmodified part. Therefore, a pre-made hole with a pre-made aperture is formed on the substrate 111a to be processed, and the pre-made hole penetrates the first surface 1111a and the second surface 1111b.

[0119] Specifically, before preparation, experiments were conducted to determine that it takes N minutes to etch out the first micropore 113a with the first pore size, and M minutes to etch out the second micropore 113b with the second pore size. Therefore, in this step, the first etching time is NM minutes. That is, N is the first etching time to form the first micropore 113a with the first pore size, M is the second etching time to form the second micropore 113b with the second pore size, and NM is the time difference between the first etching time to form the first micropore 113a with the first pore size and the second etching time to form the second micropore 113b with the second pore size.

[0120] In other specific embodiments, the first etching of the substrate 111a is performed using methods such as spraying, stirring, and aeration to ensure sufficient exchange and flow of the etching solution, resulting in more uniform and smoother sidewalls for the first micropores 113a. Furthermore, preheating the etching solution to between 30°C and 60°C can accelerate the etching process.

[0121] In one specific embodiment, after steps S11 and S12, a first micropore array 113c including a plurality of pre-made holes with pre-made apertures is formed on the substrate 111a to be processed.

[0122] S13: Laser-induced laser treatment is performed on the substrate to be processed according to the second aperture.

[0123] See Figures 8c-8d The substrate 111a, after the first laser-induced etching, is then irradiated a second time with an infrared picosecond or femtosecond laser at a frequency of 100kHz-200kHz and a pulse width of less than 10 picoseconds, according to the second aperture. The area irradiated in the second irradiation is different from the area irradiated in the first irradiation. In this step, all the material of the substrate 111a within the second aperture range is laser-induced and can be removed in the subsequent etching process.

[0124] S14: Perform a second etching on the substrate subjected to a second laser-induced etching for a time (M) equal to the etching time (M) required for the second micropore of the second pore size.

[0125] In this step, the substrate 111a, after undergoing a second laser induction, is immersed in an etching solution for M minutes. This immersion forms a second micropore 113b with a second pore size on the substrate 111a. The second etching process expands the pre-formed pore size to a first pore size, forming the first micropore 113a. Specifically, after two immersions in the etching solution, the thickness of the substrate 111a decreases to some extent, and the first micropore 113a and the second micropore 113b penetrate the first surface 1111a and the second surface 1111b, thus obtaining a liquid-conducting glass substrate 116 with liquid-conducting micropores 113 of different pore sizes. It is understood that when the liquid-conducting glass substrate 116 is made of borosilicate glass, quartz glass, or photosensitive lithium aluminosilicate glass, or other glass or dense ceramics, it is a dense substrate 111.

[0126] In one specific embodiment, after steps S13 and S14, a second micropore array 113d including a plurality of second micropores 113b with a second pore size and a first micropore array 113c including a plurality of first micropores 113a with a first pore size are formed on the liquid-conducting glass substrate 116.

[0127] Since the dense substrate 111 in the heating element 11 is a dense material, it can play a role in structural support. Compared with the spring-shaped metal heating wire of the existing cotton wick heating element and the thick metal film wire of the porous ceramic heating element, there are no requirements for the strength and thickness of the heating film 112 in the heating element 11, and the heating film 112 can be made of a metal material with low resistivity.

[0128] In one embodiment, the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thin film with a thickness ranging from 200 nanometers to 5 micrometers, i.e., the heating film 112 is relatively thin; preferably, the thickness of the heating film 112 ranges from 200 nanometers to 1 micrometer; more preferably, the thickness of the heating film 112 ranges from 200 nanometers to 500 nanometers. When the heating film 112 is a thin film, the micropores 113 penetrate the heating film 112. Furthermore, the heating film 112 is also formed on the inner surface of the micropores 113; preferably, the heating film 112 is also formed on the entire inner surface of the micropores 113 (structure as shown in the figure). Figure 3 (As shown). A heating film 112 is provided on the inner surface of the micropores 113, so that the aerosol generation matrix can be atomized within the micropores 113, which is beneficial to improving the atomization effect.

[0129] The thinner the heating film 112, the less impact it has on the pore size of the micropores 113, thus achieving a better atomization effect. Furthermore, a thinner heating film 112 results in less heat absorption and lower heat loss, leading to a faster heating rate of the heating element 11. Based on the heating film 112 having a resistance of 0.5 ohms to 2 ohms at room temperature, this application uses a low-conductivity metal material to form a thinner metal film, minimizing its impact on the pore size of the micropores 113. Optionally, the resistivity of the heating film 112 is no greater than 0.06 × 10⁻⁶. -6 The low conductivity metallic material of the heating film 112 includes silver and its alloys, copper and its alloys, aluminum and its alloys, and gold and its alloys; optionally, the material of the heating film 112 may include aluminum and its alloys, and gold and its alloys. When heated by electricity, the heating film 112 can heat up rapidly, directly heating the aerosol generation matrix within the micropores 113, achieving efficient atomization.

[0130] Furthermore, the inventors of this application have discovered that the liquid aerosol generating matrix contains various fragrances and additives, including elements such as sulfur, phosphorus, and chlorine. When the heating film 122 is heated by electricity, silver and copper are prone to corrosion and failure. Gold has very strong chemical inertness, and a dense oxide film forms on the surface of aluminum. Both of these materials are very stable in the liquid aerosol generating matrix and are preferred as materials for the heating film 122.

[0131] The heating film 112 can be formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition (e.g., magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (ion-assisted chemical deposition, laser-assisted chemical deposition, metal-organic compound deposition). It is understood that the formation process of the heating film 112 ensures that it does not cover the micropores 113; that is, the micropores 113 penetrate the heating film 112. While the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition or chemical vapor deposition, the heating film 112 is also formed on the inner surface of the micropores 113. When magnetron sputtering is used to form a heating film 112 on the first surface 1111 of a dense substrate 111, the metal atoms are perpendicular to the first surface 1111 and parallel to the inner surface of the micropore 113 during magnetron sputtering, making it easier for the metal atoms to deposit on the first surface 1111. Assuming that the thickness of the heating film 112 formed by the metal atoms deposited on the first surface 1111 is 1 micrometer, the thickness of the metal atoms deposited on the inner surface of the micropore 113 is much less than 1 micrometer, or even less than 0.5 micrometers. The thinner the thickness of the heating film 112 deposited on the first surface 1111, the thinner the heating film 112 formed on the inner surface of the micropore 113, and the smaller the impact on the pore size of the micropore 113. Since the thickness of the heating film 112 is much smaller than the pore size of the micropore 113, and the thickness of the portion of the heating film 112 deposited in the micropore 113 is smaller than the thickness of the portion deposited on the first surface 1111 of the dense substrate 111, the effect of the heating film 112 deposited in the micropore 113 on the pore size of the micropore 113 can be ignored.

[0132] In another embodiment, the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thick film, with a thickness ranging from 5 micrometers to 100 micrometers, preferably 5 micrometers to 50 micrometers. Based on a resistance of 0.5 ohms to 2 ohms, the material of the heating film 112 includes one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium. The heating film 112 is formed on the first surface 1111 of the dense substrate 111 by printing; due to the low roughness of the first surface 1111 of the dense substrate 111, a continuous film can be formed with a thickness of less than 100 micrometers. At this time, the first surface 1111 of the dense substrate 111 includes a microporous pattern region 1115 and a non-microporous pattern region 1116, and the heating film 112 is formed in the non-microporous pattern region 1116; that is, no micropores 113 are provided at the location where the heating film 112 is formed on the first surface 1111 of the dense substrate 111, so as to ensure the stability and consistency of the heating film 112. (e.g.) Figure 9a As shown, Figure 9a This is a top view of the structure of the heating element provided in this application when the heating film is a thick film.

[0133] Please see Figure 9b , Figure 9b yes Figure 3 A top view diagram of the provided heating element.

[0134] The heating film 112 can be in the shape of a sheet, a mesh, or a strip. In this application, "sheet" and "strip" refer to different aspect ratios of the heating film 112; an aspect ratio greater than 2 can be considered strip-shaped, and less than 2 can be considered sheet-shaped. Under the same material and thickness conditions, the resistance of the strip-shaped heating film 112 is greater than that of the sheet-shaped heating film 112. When the heating film 112 is sheet-shaped, it can cover the entire first surface 1111, resulting in a uniform temperature field on the first surface 1111 of the dense substrate 111. Since the aerosol-generating matrix typically contains multiple components, a uniform temperature field is not conducive to the reduction of the aerosol-generating matrix. When the heating film 112 is strip-shaped, it only covers a portion of the first surface 1111. The heating film 112 forms a gradient temperature field on the first surface 1111 of the dense substrate 111. This gradient temperature field includes the boiling point temperatures of different components in the aerosol generation matrix, allowing each component in the aerosol generation matrix to atomize at its boiling point, achieving a better atomization effect and improving the reduction degree of the aerosol generation matrix. When the heating film 112 is mesh-shaped, the size of the mesh determines whether the temperature field formed by the heating film 112 on the first surface 1111 of the dense substrate 111 is uniform. The mesh size is designed as needed. Even if the mesh size is set to allow the heating film 112 to form a gradient temperature field on the first surface 1111 of the dense substrate 111, its atomization effect is not as good as when the heating film 112 is strip-shaped.

[0135] In other embodiments, when the heating film 112 is sheet-like, it can cover the entire first surface 1111. By making the thickness of the heating film 112 uneven in different regions, or by using different materials for the heating film 112 in different regions, a gradient temperature field is formed on the first surface 1111 of the dense substrate 111. It is understood that by depositing the heating film 112 using physical vapor deposition or chemical vapor deposition, a heating film 112 with gradient thickness can be easily achieved by adjusting the positional relationship between the dense substrate 111 and the material source.

[0136] The heating film 112 is described as being strip-shaped, with the structure as follows: Figure 9bAs shown. The dense substrate 111 is a rectangular plate, and the heating film 112 includes a heating film body 1121 and an electrode 1122. The electrode 1122 includes a positive electrode and a negative electrode. To achieve better atomization, the heating film body 1121 is designed as an S-shaped curved strip to form a temperature field with a temperature gradient on the first surface 1111 of the dense substrate 111. That is, a high-temperature zone and a low-temperature zone are formed on the first surface 1111 of the dense substrate 111, maximizing the atomization of various components in the aerosol generation matrix. One end of the heating film body 1121 is connected to the positive electrode, and the other end is connected to the negative electrode. The size of the electrode 1122 is larger than the size of the heating film body 1121 to facilitate better electrical connection between the electrode 1122 and the power supply component 2. In this embodiment, the heating film body 1121 and the electrode 1122 are integrally formed, that is, the heating film body 1121 and the electrode 1122 are made of the same material; in other embodiments, the heating film body 1121 and the electrode 1122 may be made of different materials, as long as their functions can be realized.

[0137] The inventors of this application have discovered that, due to the elongated and slender structure of the strip-shaped heating film 112, its resistance is greater than that of the sheet-shaped heating film 112 under the same conditions. Therefore, in order to prepare a strip-shaped heating film 112 with a thickness in the nanometer range, especially a thickness of 200-500 nanometers, the material of the heating film 112 can only be selected from materials such as aluminum, gold, silver, and copper, with a resistivity not greater than 0.03 × 10⁻⁶. -6 Materials with Ω·m.

[0138] The first surface 1111 of the dense substrate 111 includes a microporous region 1117 and a non-microporous region 1118. The electrode 1122 is disposed in the non-microporous region 1118, and the heating film body 1121 is disposed in the microporous region 1117. Because... Figure 9b The heating film 112 shown is a thin film, with some micropores 113 penetrating the heating film body 1121.

[0139] It is understandable that when the pore sizes of the multiple micropores 113 provided on the dense substrate 111 are different, the micropore region 1117 includes a first pore size micropore array region 1113 and a second pore size micropore array region 1114. The pore sizes of the micropores 113 in the first pore size micropore array region 1113 are the same, and the pore sizes of the micropores 113 in the second pore size micropore array region 1114 are the same. The pore sizes of the micropores 113 in the first pore size micropore array region 1113 are different from those in the second pore size micropore array region 1114. The specific design is based on the needs. When the heating film 112 formed on the first surface 1111 of the dense substrate 111 is a thick film, the heating film body 1121 is disposed in the microporous region 1117, and the electrode 1122 is disposed in the non-microporous region 1118. Due to the process conditions for forming the thick film heating film 112, no micropores 113 are provided in the microporous region 1117 where the heating film body 1121 is disposed. That is, the microporous region 1117 includes a microporous pattern region 1115 and a non-microporous pattern region 1116, and the heating film body 1121 is disposed in the non-microporous pattern region 1116.

[0140] As described above, aluminum, gold, silver, and copper are preferred materials for preparing heating films 112 with a thickness of less than 5 micrometers, or even nanometers. However, heating films 112 made of silver and copper are easily corroded and fail in the liquid aerosol generation matrix. In addition, heating films 112 made of aluminum also have the risk of failure under long-term high-power use. To this end, the inventors of this application studied the protective layer of the heating film 112 and found that existing oxide and nitride protective layers, such as silicon dioxide, have a large difference in the coefficient of thermal expansion with metals. During thermal cycling, the internal stress between the film layers can cause the protective layer to fail rapidly. Moreover, oxides and nitrides have poor conductivity. If they are used as protective layers to cover the heating film and electrodes, it will lead to poor electrical contact between the electrodes and leads or pins; if they are not used to cover the electrodes, the preparation process is complicated. To solve the above problems, this application provides a protective film 115 further provided on the heating film 112 of the heating element 11.

[0141] Please see Figure 10 and Figure 11 , Figure 10 This is a partial structural diagram of the heating element provided in this application, including a protective film and the heating film being a thin film. Figure 11 This is a top view of the heating element provided in this application, which includes a protective film and the heating film is a thick film.

[0142] Furthermore, the heating element 11 also includes a protective film 115. The protective film 115 is formed on the surface of the heating film 112 away from the dense substrate 111. The material of the protective film 115 is a metal alloy that is resistant to corrosion by the aerosol generation matrix, so as to prevent the aerosol generation matrix from corroding the heating film 112, thereby protecting the heating film 112 and improving the performance of the electronic atomization device.

[0143] When the heating film 112 is a thin film (structure as follows) Figure 10 As shown, the thickness of the heating film 112 is 200 nanometers to 5 micrometers, and the resistivity of the heating film 112 is no greater than 0.06*10⁻⁶. -6 The heating film 112 is made of copper and its alloys, silver and its alloys, aluminum and its alloys, or gold and its alloys. The heating film 112 is formed on the first surface 1111 of the dense substrate 111 by physical vapor deposition or chemical vapor deposition. Optionally, the material of the heating film 112 is one of copper, silver, aluminum, gold, aluminum alloys, or aluminum-gold alloys. The protective film 115 has a thickness of 100 nm to 1000 nm and is made of stainless steel, nickel-chromium-iron alloy, or nickel-based corrosion-resistant alloys. The stainless steel can be 304 stainless steel, 316L stainless steel, 317L stainless steel, 904L stainless steel, etc., the nickel-chromium-iron alloy can be Inconel 625, Inconel 718, etc., and the nickel-based corrosion-resistant alloy can be nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276, etc. Preferably, the material of the protective film 115 is stainless steel. The protective film 115 is formed on the surface of the heating film 112 away from the dense substrate 111 by physical vapor deposition (e.g., magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (ion-assisted chemical deposition, laser-assisted chemical deposition, metal-organic compound deposition). It is understood that the formation processes of the heating film 112 and the protective film 115 ensure that they do not cover the micropores 113; that is, the micropores 113 penetrate both the heating film 112 and the protective film 115. Since the protective film 115 effectively prevents the aerosol-forming matrix from corroding the heating film 112, the material of the heating film 112 can be copper or silver, thereby preparing a nanoscale heating film 112.

[0144] When the heating film 112 is a thick film (structure as follows) Figure 11As shown, the thickness of the heating film 112 is 5 micrometers to 100 micrometers, and the material of the heating film 112 is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, gold, silver, nickel, platinum, and titanium. The thickness of the protective film 115 is 5 micrometers to 20 micrometers, and the material of the protective film 115 is one of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy; wherein, the stainless steel can be 304 stainless steel, 316L stainless steel, 317L stainless steel, 904L stainless steel, etc., the nickel-chromium-iron alloy can be Inconel 625, Inconel 718, etc., and the nickel-based corrosion-resistant alloy can be nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276, etc. Preferably, the material of the protective film 115 is stainless steel. When both the heating film 112 and the protective film 115 are sequentially formed on the first surface 1111 of the dense substrate 111 by printing, the heating film 112 is made of one of the following materials: nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium, and the protective film 115 is made of stainless steel. Alternatively, when the heating film 112 is formed on the first surface 1111 of the dense substrate 111 by printing, and the protective film 115 is formed on the surface of the heating film 112 away from the dense substrate 111 by physical vapor deposition or chemical vapor deposition, the heating film 112 is made of one of the following materials: nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium, and the protective film 115 is made of one of the following materials: stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy. By setting the protective film 115 on the surface of the thick-film heating film 112, aerosol generation can be prevented from corroding the heating film 112.

[0145] A protective film 115 is disposed on the surface of the heating film 112. The protective film 115 is made of a metal alloy. Theoretically, the protective film 115 should also be heating up while the heating film 112 is heating up. However, because the resistance of the protective film 115 is much greater than that of the heating film 112, the protective film 115 hardly heats up. The heating film 112 is the primary source of heat for the atomized aerosol to generate the matrix. For example, if the resistance of the heating film 112 is about 1 ohm, and the protective film 115 is made of stainless steel, its resistance is about 30 ohms. The resistance of the protective film 115 is too high, and it is much greater than that of the heating film 112. Under the conditions that the power of the electronic atomizing device is 6 watts to 8.5 watts and the battery voltage is 2.5 volts to 4.4 volts, the protective film 115 cannot perform the function of the heating film 112; that is, the protective film 115 cannot heat the atomized aerosol to generate the matrix.

[0146] In this application, the heating film 112 includes a heating film body 1121 and an electrode 1122. The heating film body 1121 and the electrode 1122 are made of the same material, and a protective film 115 is simultaneously disposed on the surfaces of the heating film body 1121 and the electrode 1122. It can be understood that the protective film 115 is formed only on the heating film body 1121, and no protective film 115 is disposed on the electrode 1122, in order to reduce the resistance of the electrode 1122, thereby reducing the resistance loss between the electrode 1122 and the pin of the power supply assembly 2. That is, the protective film 115 exposes part of the heating film 112 to serve as the electrode 1122 of the heating film 112. Furthermore, the electrode 1122 can be made of a different material than the heating film body 1121, so that the resistance of the electrode 1122 is lower, thereby reducing the resistance loss between the electrode 1122 and the pin of the power supply assembly 2.

[0147] It is understood that the thickness of the dense substrate 111, the pore size of the micropores 113, the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113, and the ratio of the center-to-center distance between adjacent micropores 113 to the pore size of the micropores 113 provided in this application can be designed and combined as needed; the dense substrate 111 can be combined with the thin-film heating film 112 (the thickness of the heating film 112 is 200 nanometers to 5 micrometers, and the resistivity of the heating film 112 is not greater than 0.06*10). -6 The heating film 112 is made of copper and its alloys, silver and its alloys, aluminum and its alloys, or gold and its alloys, or a thick film heating film 112 (the thickness of the heating film 112 is 5 micrometers to 100 micrometers, and the material of the heating film 112 is one of nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, and titanium). These materials can be combined and designed as needed. A protective film 115 can be designed as required. The protective film 115 in the heating element 11 provided in this application can be applied to the surface of a traditional porous ceramic heating element to protect its heating film.

[0148] Please see Figure 12 , Figure 12 This is a partial structural diagram of the atomizing component provided in this application, including the porous matrix.

[0149] Furthermore, the atomizing component 1 also includes a porous substrate 114, which is disposed on the second surface 1112 of the dense substrate 111 of the heating element 11. The porous substrate 114 can be made of porous ceramics, sponge, foam, fiber layer, or other materials, as long as it can achieve the effects of liquid storage, liquid conduction, and heat insulation. That is, the aerosol generation matrix in the liquid storage chamber 10 is first guided to the second surface 1112 of the dense substrate 111 through the porous substrate 114, and then guided to the first surface 1111 of the dense substrate 111 through the micropores 113 on the dense substrate 111 to be atomized by the heating film 112.

[0150] The following experiments verify the effects of the arrangement of micropores 113 on the dense substrate 111, the selection of heating film 112 material, and the protective film 115 provided in this application.

[0151] Experiment 1: Material selection when heating film 112 is a thin film.

[0152] Taking the common heating film pattern 112 in this industry as an example (e.g.) Figure 9b The heating film 112 shown has a length of 8.5 mm, a width of 0.4 mm, and a resistance of 1 ohm at room temperature. The heating film 112 is made of different materials. The theoretical thickness of the heating film 112 can be obtained based on the resistivity of different metal materials. The results are shown in Table 1.

[0153] Table 1. Resistivity of metallic materials and theoretical thickness of heating film

[0154]

[0155] As shown in Table 1, when using traditional nickel-chromium alloys, nickel-chromium-iron alloys, and iron-chromium-aluminum alloys, the theoretical thickness of the heating film 112 needs to exceed 20 μm, which will seriously affect the atomization efficiency. During the deposition process, it will also lead to a reduction in the pore size of the micropores 113 in the dense substrate 111, affecting the supply of the aerosol generation matrix and atomization. When using low-resistivity metal materials such as silver, copper, gold, and aluminum, the theoretical thickness of the heating film 112 is less than 1 μm. This not only has no effect on the pore size of the micropores 113 in the dense substrate 111, but also reduces the energy absorbed by the heating film 112 during atomization. Furthermore, the thermal conductivity of materials such as silver, copper, gold, and aluminum is much higher than that of nickel-chromium alloys, nickel-chromium-iron alloys, and iron-chromium-aluminum alloys, which is beneficial for rapid heat conduction and enhances atomization efficiency.

[0156] Heating films 112 made of materials such as silver, copper, gold, and aluminum can operate stably for a long time in PG / VG mixtures (propylene glycol / glycerol mixtures). However, the aerosol generating matrix contains various fragrances and additives, which contain elements such as sulfur, phosphorus, and chlorine, which may corrode the heating film 112. Experiments have shown that when silver is used as the material for the heating film 112, the resistance of the heating film 112 continuously increases during wet-firing heat cycling, and the heating film 112 fails after about 30 cycles. Because copper has stronger resistance to chloride ion corrosion, when copper is used as the material for the heating film 112, the resistance of the heating film 112 still increases during wet-firing heat cycling, but the lifespan of the heating film 112 can be extended to about 80 cycles. Aluminum is more stable in the aerosol generating matrix environment, and a dense oxide film structure can be formed on its surface, which can withstand more than 600 cycles during heat cycling. Gold, as the most chemically stable metal, is more stable and reliable in heat cycling, and its resistance remains unchanged after more than 1500 heat cycles.

[0157] Therefore, when the heating film 112 is made of silver or copper, it is prone to corrosion failure when heated by electricity. Since gold has very strong chemical inertness, and a dense oxide film forms on the surface of aluminum, the heating film 112 formed by these two materials is very stable in the aerosol-generating matrix and is not easily corroded when heated by electricity. Therefore, when the heating element 11 does not include the protective film 115, the material of the heating film 112 is aluminum and its alloys, or gold and its alloys. When the heating element 11 includes the protective film 115, the protective film 115 can prevent the heating element 11 from being corroded by the aerosol-generating matrix, and there are no requirements on the material of the heating element 11. The material of the heating film 112 can be silver and its alloys, copper and its alloys, aluminum and its alloys, or gold and its alloys.

[0158] Aluminum was selected as the material for the heating film 112, and it was deposited on the first surface 1111 of the dense substrate 111 by magnetron sputtering. The thickness of the deposited film was 3 micrometers, and the obtained SEM image is shown below. Figure 13 As shown ( Figure 13 This is a SEM image of one embodiment of the heating film provided in this application. Figure 13 It can be seen that the deposition thickness of the heating film 112 is 3 micrometers, and the inner surface of the micropore 113 is also deposited with the heating film 112, but it has no significant effect on the pore size of the micropore 113.

[0159] The heating element 11 provided in this application and a traditional porous ceramic heating element were subjected to a wet firing experiment at 6.5 watts to obtain their respective atomized aerosol amounts. A comparison was then made to obtain the following results: Figure 14 The results shown ( Figure 14 This is a comparison chart of the atomized aerosol content between the heating element of this application and a traditional porous ceramic heating element; wherein, the heating element of this application is 11; the traditional porous ceramic heating element has a porosity of 57%-61%, a thickness of 1.6 mm, and a pore size of 15-50 μm. Figure 14 It is known that the aerosol content of the heating element 11 of this application remains stable after 650 wet firings, while the aerosol content of traditional porous ceramic heating elements begins to decrease significantly after 650 wet firings. Under the same number of wet firings, the atomized aerosol content of the heating element 11 provided by this application is greater than that of traditional porous ceramic heating elements. In other words, the heating element 11 provided by this application can achieve efficient atomization.

[0160] Experiment 2: Verify the function of the protective film 115 provided in this application.

[0161] The lifespan of the heating element 11 was evaluated by wet burning after loading it with a cartridge. Experimental conditions: a constant power supply of 6.5 watts was used, with a 3-second inhalation followed by a 27-second pause. The aerosol generation matrix was mint flavored with a nicotine content of 50 mg / 100 ml. The thickness of the heating film 112 was 1-2 micrometers. The heating element 11 with and without a protective film 115 were compared, and different materials were used for the protective film 115. The experiment simulated the normal operating environment of an electronic atomizing device. The comparison results are shown in Table 2, revealing the relationship between the materials of the heating film 112 and the protective film 115 and the lifespan of the heating element 11.

[0162] Table 2. Relationship between heating film material, protective layer material and heating element lifespan

[0163]

[0164] In Table 2, the thickness of the protective film 115 is 30 nm when using silicon dioxide, 100 nm when using titanium nitride, and 800 nm when using 316L stainless steel. According to Table 2, silver and copper, when used as materials for the heating film 112, are easily corroded by flavorings and additives containing sulfur, phosphorus, and chlorine in the aerosol generation matrix, making it difficult to meet lifespan requirements. Aluminum, when used as the heating film 112 material, can withstand more than 600 thermal cycles, meeting the usage conditions of most electronic atomizing devices (with a power of 6-8.5 watts), but it is difficult to meet the requirement of more than 1500 cycles when the power of an electronic atomizing device is greater than 10 watts.

[0165] When silicon dioxide is used as the protective film 115 material, the large difference in thermal expansion coefficients between silicon dioxide and metals leads to rapid failure of the protective film 115 due to interlayer stress during thermal cycling, rendering it ineffective. Similarly, when zirconium oxide and alumina are used as the protective film 115, their large thermal expansion coefficients compared to metals also cause them to fail easily, rendering them ineffective.

[0166] Titanium nitride is a commonly used protective coating. This application verifies whether titanium nitride is suitable as a protective film material 115 by using copper as the material for the heating film 112. During wet firing, the resistance of the heating film 112 continuously increases, and after 130 thermal cycles, the heating film 112 fails (e.g., Figure 15 As shown, Figure 15 This is a diagram showing the failure of the heating film in the heating element provided in this application. Observation under an optical microscope revealed that the heating film 112 was severely corroded and detached from the dense substrate 111. Figure 16 ( Figure 16 yes Figure 15The SEM and EDS images of the provided heating film failure diagram show that the titanium nitride layer on the surface of the heating film 112 has been almost completely corroded, exposing the copper layer of the heating film 112. The copper layer is also severely corroded, with some areas exposing the dense substrate 111. In other words, in this application, the protective film 115 made of titanium nitride is also easily corroded by the aerosol generation matrix.

[0167] When stainless steel is used as the protective film 115 material, regardless of whether the heating film 112 material is silver, copper, or aluminum, it can withstand more than 1500 thermal cycles, which can significantly improve the lifespan of the heating element 11. Furthermore, experiments have shown that metals with a high nickel content can also protect the heating film 112.

[0168] Therefore, this application uses corrosion-resistant stainless steel (304, 316L, 317L, 904L, etc.), nickel-chromium-iron alloys (Inconel 625, Inconel 718, etc.), and nickel-based corrosion-resistant alloys (nickel-molybdenum alloy B-2, nickel-chromium-molybdenum alloy C-276) as the protective film 115 material to improve the lifespan of the heating element 11. Regardless of whether the heating film 112 material is silver, copper, or aluminum, using the protective film 115 can significantly improve the lifespan of the heating element 11.

[0169] The lifespan of the heating film 112 increases with the increase of the thickness of the protective film 115, such as... Figure 17 As shown ( Figure 17 This is a graph showing the relationship between the lifespan of the heating film and the thickness of the protective film in the heating element provided in this application. Figure 17 It can be seen that when the aerosol generating matrix is ​​50mg of peppermint and the material of the protective film 115 is S316L stainless steel, as the thickness of the protective film 115 increases, the resistance change of the heating film 112 is smaller and the life of the heating film 112 is longer.

[0170] Experiment 3: The effect of the thickness of the dense matrix 111 and the pore size of the micropores 113 on the liquid supply efficiency.

[0171] The liquid supply efficiency of heating element 11 was evaluated through a wet-burning test. The principle of the wet-burning test is as follows: Figure 18 As shown ( Figure 18 This is a schematic diagram of the wet burning experiment of the heating element provided in this application. A DC power supply is used, and the electrodes 1122 of the heating film 112 are connected to the pins 20 of the power supply assembly 2 (the pins 20 are electrically connected to the battery). The power supply power and power supply time are controlled, and the temperature of the heating film 112 is measured by an infrared thermal imager or a thermocouple.

[0172] When the heating film 112 is energized, the temperature rises instantaneously, causing the aerosol generation matrix in the micropores 113 to vaporize. As the aerosol generation matrix in the micropores 113 is consumed, the capillary action of the micropores 113 causes the aerosol generation matrix in the liquid storage chamber 10 to continuously replenish the heating film 112.

[0173] The flow of the aerosol generating matrix within the capillary-effect micropores 113 can be calculated using the Washburn equation, where S is the pore area of ​​the micropores 113, ρ is the density of the aerosol generating matrix, z is the distance traveled by the aerosol generating matrix, γ is the surface tension, μ is the viscosity of the aerosol generating matrix, r is the radius of the micropores 113, and θ is the contact angle between the aerosol generating matrix and the dense matrix material 111. The atomization rate of the aerosol generating matrix is ​​as follows:

[0174]

[0175] As can be seen from the formula, once the materials of the aerosol generating matrix and the dense matrix 111 are determined, ρ, γ, μ, and θ remain unchanged. Larger pore sizes of the micropores 113 result in more sufficient liquid supply, but also increase the risk of leakage during air transport under negative pressure and during use due to temperature fluctuations. Therefore, the thickness, pore size, and aspect ratio of the dense matrix 111 are crucial, ensuring both sufficient liquid supply during atomization and preventing leakage of the aerosol generating matrix.

[0176] The heating element 11 was installed and tested to evaluate the relationship between the thickness of the dense substrate 111 / pore size of the micropores 113 and the atomization amount. The results are as follows: Figure 19 As shown ( Figure 19 This is a graph showing the relationship between the dense matrix thickness / micropore size and the atomization amount of the heating element provided in this application. Figure 19 It can be seen that when the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113 is too large, the aerosol generation matrix supplied by capillary action is insufficient to meet the atomization demand, resulting in a decrease in the atomization amount. When the ratio of the thickness of the dense substrate 111 to the pore size of the micropores 113 is too small, the aerosol generation matrix easily flows out from the micropores 113 to the surface of the heating film 112, leading to a decrease in atomization efficiency and a reduction in the atomization amount.

[0177] Experiment 4: Performance comparison of the heating element 11 provided in this application with that of traditional porous ceramic heating elements.

[0178] If the supply of the aerosol generating matrix is ​​sufficient, the temperature of the heating film 112 will be maintained near the boiling point of the aerosol generating matrix under thermal equilibrium. If the supply of the aerosol generating matrix is ​​insufficient, dry burning will occur, and the temperature of the heating film 112 will be higher than the boiling point of the aerosol generating matrix. Therefore, the liquid supply efficiency of the heating element 11 can be evaluated by a wet burning experiment.

[0179] The heating element 11 provided in this application has a dense substrate 111 with a thickness of 0.2 mm and micropores 113 with a pore size of 30 μm. The heating element 11 is compared with a conventional porous ceramic heating element (porosity of 57%-61%, thickness of 1.6 mm, and pore size of 15-50 μm).

[0180] For traditional porous ceramic heating elements, under a power of 6.5W, the temperature of the heating film instantly rises to around 270℃ after being powered on. During the 3-second heating duration, the temperature remains almost stable, reaching thermal equilibrium. However, as the heating power increases, the temperature of the heating film in thermal equilibrium continuously rises, indicating insufficient liquid supply from the porous ceramic structure responsible for conducting the liquid. Figure 20 As shown ( Figure 20 This is a graph showing the relationship between the atomization temperature and heating power of a traditional porous ceramic heating element.

[0181] In contrast, when using a heating element 11 with a dense substrate 111 thickness of 0.2 mm and micropores 113 pore size of 30 μm, the temperature of the heating film 112 in thermal equilibrium is around 250℃ within a power range of 6.5 W-11.5 W. Figure 21 As shown ( Figure 21 (This is a graph showing the relationship between the atomization temperature and heating power of the heating element provided in this application); it indicates that the dense matrix 111 of the structure has sufficient liquid supply, and no leakage was found in the experiment.

[0182] The relationship between the atomization temperature and the suction time of the heating element 11 provided in this application was studied under a heating power of 6.5W. The results are as follows: Figure 22 As shown ( Figure 22 This is a graph showing the relationship between the atomization temperature of the heating element and the suction time provided in this application. Figure 22 It can be seen that as the heating time increases, the atomization temperature of the heating element 11 provided in this application remains stable under thermal equilibrium. This indicates that as the aerosol generation matrix in the micropore 113 is continuously consumed, the aerosol generation matrix in the liquid storage chamber 10 can be continuously supplied when boiling atomization occurs, which can meet the atomization demand and ensure the atomization amount.

[0183] The heating element in this application includes a dense substrate, a heating film, and a protective film. The dense substrate includes a first surface and a second surface opposite to the first surface. Multiple micropores are provided on the dense substrate; these micropores are through-holes used to guide the aerosol-generating matrix to the first surface. The heating film is formed on the first surface. The protective film is formed on the surface of the heating film away from the dense substrate, and the material of the protective film is a metal alloy resistant to corrosion by the aerosol-generating matrix. Through the above configuration, a heating element formed from a dense substrate is provided to meet the user's requirements for atomization effect.

[0184] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heating element for heating a matrix generated from atomized liquid aerosol, characterized in that, The heating element includes: A dense matrix includes a first surface and a second surface opposite to the first surface; the dense matrix is ​​provided with a plurality of micropores, the micropores being through-holes, the micropores being used to guide the aerosol generating matrix to the first surface; A heating film is formed on the first surface; the material of the heating film is one of copper and its alloys, silver and its alloys, aluminum and its alloys, gold and its alloys, nickel-chromium alloys, nickel-chromium-iron alloys, iron-chromium-aluminum alloys, nickel, platinum, and titanium. A protective film is formed on the surface of the heating film away from the dense substrate; the material of the protective film is a metal alloy resistant to corrosion by the aerosol-forming matrix; the material of the protective film is one of stainless steel and nickel-based corrosion-resistant alloys. The protective film has a much higher resistance than the heating film, so that the protective film hardly generates heat, and the matrix is ​​mainly generated by the heating film heating the atomized aerosol.

2. The heating element according to claim 1, characterized in that, The dense matrix is ​​glass or dense ceramic.

3. The heating element according to claim 2, characterized in that, The dense matrix is ​​glass, which is borosilicate glass, quartz glass, or photosensitive lithium aluminosilicate glass.

4. The heating element according to claim 3, characterized in that, The heating film is made of one of the following materials: copper and its alloys, silver and its alloys, aluminum and its alloys, and gold and its alloys. The thickness of the heating film is 200 nanometers to 5 micrometers.

5. The heating element according to claim 3, characterized in that, The heating film is made of one of the following materials: copper and its alloys, silver and its alloys, aluminum and its alloys, and gold and its alloys. The resistance of the heating film at 25°C is 0.5 ohms to 2 ohms.

6. The heating element according to claim 3, characterized in that, The heating film is made of one of the following materials: copper and its alloys, silver and its alloys, aluminum and its alloys, and gold and its alloys. The resistivity of the heating film is not greater than 0.06*10⁻⁶. -6 Ω·m.

7. The heating element according to claim 3, characterized in that, The heating film is made of one of the following materials: copper and its alloys, silver and its alloys, aluminum and its alloys, and gold and its alloys. The thickness of the protective film is 100 nanometers to 1000 nanometers.

8. The heating element according to claim 3, characterized in that, The heating film is made of one of copper and its alloys, silver and its alloys, aluminum and its alloys, and gold and its alloys. The micropores penetrate the heating film and the protective film.

9. The heating element according to claim 3, characterized in that, The heating film is made of one of the following materials: nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, silver, gold, and titanium. The thickness of the heating film is 5 micrometers to 100 micrometers.

10. The heating element according to claim 3, characterized in that, The heating film is made of one of the following materials: nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, silver, gold, and titanium. The thickness of the protective film is 5 micrometers to 20 micrometers.

11. The heating element according to claim 1, characterized in that, The protective film exposes a portion of the heating film to serve as an electrode of the heating film.

12. The heating element according to claim 3, characterized in that, The micropores are arranged in an array.

13. The heating element according to claim 12, characterized in that, The multiple micropores have the same shape and diameter; the multiple micropores are arranged in a rectangular array.

14. The heating element according to claim 3, characterized in that, Both the first surface and the second surface include smooth surfaces; the first surface is a plane; the micropore is a through hole that perpendicularly penetrates the first surface and the second surface, and the cross-section of the micropore is circular.

15. The heating element according to claim 14, characterized in that, Both the first surface and the second surface are planar and arranged in parallel.

16. The heating element according to claim 15, characterized in that, The thickness of the dense matrix is ​​0.1 mm to 1 mm.

17. The heating element according to claim 15, characterized in that, The thickness of the dense matrix is ​​0.2 mm to 0.5 mm.

18. The heating element according to claim 15, characterized in that, The pore size of the micropores is 1 micrometer to 100 micrometers.

19. The heating element according to claim 15, characterized in that, The pore size of the micropores is 20 micrometers to 50 micrometers.

20. The heating element according to claim 15, characterized in that, The ratio of the thickness of the dense matrix to the pore size of the micropores is 20:1-3:

1.

21. The heating element according to claim 15, characterized in that, The ratio of the thickness of the dense matrix to the pore size of the micropores is 15:1 to 5:

1.

22. The heating element according to claim 15, characterized in that, The ratio of the center distance between adjacent micropores to the diameter of the micropore is 3:1 to 1.5:

1.

23. The heating element according to claim 15, characterized in that, The ratio of the center distance between adjacent micropores to the diameter of the micropore is 3:1 to 2.5:

1.

24. An atomizing component, characterized in that, include: The liquid storage chamber is used to store the matrix for generating liquid aerosols; A heating element, wherein the heating element is the heating element according to any one of claims 1-23; The micropores are connected to the liquid storage chamber.

25. The atomizing component according to claim 24, characterized in that, It includes a porous matrix, which is disposed on the second surface of the dense matrix of the heating element.

26. The atomizing component according to claim 25, characterized in that, The porous matrix is ​​a porous ceramic, sponge, foam, or fiber layer.

27. An electronic atomizing device, characterized in that, It includes an atomizing component and a power supply component, wherein the atomizing component is the atomizing component according to any one of claims 24-26, and the power supply component is electrically connected to the heating element.

28. The electronic atomizing device according to claim 27, characterized in that, The power supply assembly includes a battery cell with a voltage range of 2.5 volts to 4.4 volts, and the electronic atomizing device has a power range of 6 watts to 8.5 watts.

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