A method for manufacturing positioning pins for PCB board test fixtures

Abstract

This invention discloses a method for manufacturing a positioning pin for a PCB board test fixture, comprising a pin body, a pin holder, and a pin head. A pin tail is provided at the tail end of the pin body, and a spring is disposed inside the pin body. A piston is installed at the end of the spring. A pin rod is installed between the pin holder and the pin head. A reinforcing shell is installed on the outer wall of the pin body. The reinforcing shell includes a galvanized layer, a metal fiber layer, a polymer material layer, a copper alloy layer, and an aluminum alloy layer. The galvanized layer is located on the outer surface of the metal fiber layer, and the metal fiber layer is located on the outer surface of the polymer material layer. The method for manufacturing a positioning pin for a PCB board test fixture according to this invention, with its reinforcing shell and galvanized material layer, increases the strength of the positioning pin, making it less prone to damage and extending its service life. It also enhances the wear resistance of the outer surface of the positioning pin, further increasing its strength and simplifying manufacturing.

Description

Technical Field

[0001] This invention relates to the field of PCB board testing, and in particular to a method for manufacturing positioning pins for a PCB board testing fixture. Background Technology

[0002] PCB board test fixture positioning pins are support devices used to position PCB boards during testing. When testing a PCB board, it is necessary to first position its four corners to prevent displacement during testing. With the continuous development of technology, the manufacturing process requirements for PCB board test fixture positioning pins are also becoming increasingly stringent.

[0003] Existing PCB board test fixture positioning pins have certain drawbacks in use. First, the positioning pins may have low strength and are prone to damage, resulting in a short service life, which is not conducive to user operation. In addition, the manufacturing process is relatively complex, which also has a certain adverse effect on the user experience. To address these issues, we propose a manufacturing method for PCB board test fixture positioning pins. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a method for manufacturing positioning pins for PCB board testing fixtures. This method increases the strength of the positioning pins, reduces the likelihood of damage, extends their service life, and enhances the wear resistance of the outer surface, further increasing their strength. Furthermore, the manufacturing process is simpler, effectively solving the problems described in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a positioning pin for a PCB board testing fixture, comprising a pin body, a pin holder, and a pin head, wherein a pin tail is provided at the tail end of the pin body, a spring is provided inside the pin body, a piston is installed at the end of the spring, a pin rod is installed between the pin holder and the pin head, and a reinforcing shell is installed on the outer wall of the pin body.

[0006] As a preferred technical solution of this application, the reinforced outer shell includes a zinc plating layer, a metal fiber layer, a polymer material layer, a copper alloy layer, and an aluminum alloy layer. The zinc plating layer is located on the outer surface of the metal fiber layer, the metal fiber layer is located on the outer surface of the polymer material layer, the polymer material layer is located on the outer surface of the copper alloy layer, and the copper alloy layer is located on the outer surface of the aluminum alloy layer.

[0007] As a preferred technical solution of this application, the zinc plating layer, metal fiber layer, polymer material layer, copper alloy layer, and aluminum alloy layer are integrally formed by casting.

[0008] As a preferred technical solution of this application, a method for manufacturing positioning pins for a PCB board test fixture includes the following steps:

[0009] S1: Prepare the materials needed to make the positioning pin of the jig, including silicon functional groups, aluminum functional groups, polymer materials, metal fiber materials and solid zinc diffusion agent. Among them, silicon functional groups and aluminum functional groups are used as the base layer, and polymer materials, metal fiber materials and solid zinc diffusion agent are blended and molded.

[0010] S2: The prepared silicon functional groups, aluminum functional groups, polymer materials and metal fiber materials are cleaned and activated. After cleaning, they are placed in a vacuum dish for storage.

[0011] S3: Prepare a vacuum hot-press bonding device, mix the cleaned silicon functional groups, aluminum functional groups, polymer materials and metal fiber materials, and coat the materials with stabilizers and organic environmentally friendly solvents, and make a reinforced alloy by bonding.

[0012] S4: After the bonding molding operation is completed, open the vacuum hot press bonding device, take out the molded material, air dry it, wait for it to stabilize and mold, coat the surface of the molded reinforcing alloy with solid zinc diffusion agent and carry out the blending operation.

[0013] S5: Place the reinforcing alloy with zinc plating agent applied to its outer surface into the designated position of the zinc plating furnace for positioning. After fixing the position, heat the zinc plating furnace and control the heating temperature using a temperature control device until a zinc plating layer is formed on the surface of the reinforcing alloy. Then, shape the processed reinforcing alloy into the shape of a positioning pin using a mold, and the manufacturing process is complete.

[0014] As a preferred embodiment of this application, the mass fraction of the silicon functional groups is 30-45%, the mass fraction of the aluminum functional groups is 18-29%, the mass fraction of the polymer material is 12-24%, the mass fraction of the metal fiber material is 12-20%, and the mass fraction of the solid zinc diffusion agent is 10-20%.

[0015] As a preferred embodiment of this application, the mass fraction of the silicon functional groups is 35%, the mass fraction of the aluminum functional groups is 23%, the mass fraction of the polymer material is 15%, the mass fraction of the metal fiber material is 15%, and the mass fraction of the solid zinc diffusion agent is 12%.

[0016] As a preferred embodiment of this application, the mass fraction of the silicon functional groups is 38%, the mass fraction of the aluminum functional groups is 25%, the mass fraction of the polymer material is 13%, the mass fraction of the metal fiber material is 12%, and the mass fraction of the solid zinc diffusion agent is 12%.

[0017] As a preferred technical solution of this application, the heating operation is performed in step S5, and the heating time is 20-30 minutes.

[0018] Compared with the prior art, the present invention provides a method for manufacturing positioning pins for PCB board test fixtures, which has the following beneficial effects: This method for manufacturing positioning pins for PCB board test fixtures increases the strength of the positioning pins through a reinforced outer shell and a zinc-plated material layer, making them less prone to damage and increasing their service life. It also increases the wear resistance of the outer surface of the positioning pins, further increasing their strength. The manufacturing process is simpler. The materials needed to prepare the positioning pins include silicon functional groups, aluminum functional groups, polymer materials, metal fiber materials, and a solid zinc infiltration agent. Silicon and aluminum functional groups are used as the base layer, and the polymer materials, metal fiber materials, and solid zinc infiltration agent are blended and molded. The prepared silicon functional groups, aluminum functional groups, polymer materials, and metal fiber materials are then surface-cleaned and activated. After cleaning, they are stored in a vacuum dish. The vacuum hot-press bonding device mixes cleaned silicon functional groups, aluminum functional groups, polymer materials, and metal fiber materials, and coats the materials with stabilizers and environmentally friendly organic solvents. A reinforcing alloy is then formed through bonding. After bonding, the vacuum hot-press bonding device is opened, the formed material is removed, and air-dried until it stabilizes. A solid zinc-diffusion agent is then applied to the surface of the formed reinforcing alloy for blending. The reinforced alloy with the zinc-diffusion agent applied to its outer surface is placed into the designated position in the zinc-diffusion furnace for positioning. After positioning, the zinc-diffusion furnace is heated, and the heating temperature is controlled by a temperature control device until a zinc plating layer forms on the surface of the reinforcing alloy. The processed reinforcing alloy is then molded into the shape of a positioning pin. The entire PCB board test fixture positioning pin structure is simple, easy to operate, and performs better than traditional methods. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a method for manufacturing positioning pins for a PCB board testing fixture according to the present invention.

[0020] Figure 2 This is a schematic diagram of the needle head structure in the manufacturing method of the positioning needle of the PCB board test fixture of the present invention.

[0021] Figure 3 This is a schematic diagram of the needle body in the manufacturing method of the positioning needle of the PCB board test fixture of the present invention.

[0022] Figure 4 This is a schematic diagram of the reinforced outer shell structure in the manufacturing method of the positioning pin of the PCB board test fixture of the present invention.

[0023] In the diagram: 1. Needle body; 2. Needle tail; 3. Spring; 4. Reinforcing shell; 5. Piston; 6. Needle holder; 7. Needle bar; 8. Needle tip; 9. Zinc plating layer; 10. Metal fiber layer; 11. Polymer material layer; 12. Copper alloy layer; 13. Aluminum alloy layer. Detailed Implementation

[0024] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0025] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Example

[0027] like Figure 1-4 As shown, a PCB board test fixture positioning pin includes a pin body 1, a pin holder 6, and a pin head 8. A pin tail 2 is provided at the tail of the pin body 1. A spring 3 is provided inside the pin body 1. A piston 5 is installed at the end of the spring 3. A pin rod 7 is installed between the pin holder 6 and the pin head 8. A reinforcing shell 4 is installed on the outer wall of the pin body 1.

[0028] Furthermore, the reinforced outer shell 4 includes a zinc plating layer 9, a metal fiber layer 10, a polymer material layer 11, a copper alloy layer 12, and an aluminum alloy layer 13. The zinc plating layer 9 is located on the outer surface of the metal fiber layer 10, the metal fiber layer 10 is located on the outer surface of the polymer material layer 11, the polymer material layer 11 is located on the outer surface of the copper alloy layer 12, and the copper alloy layer 12 is located on the outer surface of the aluminum alloy layer 13.

[0029] Furthermore, the zinc plating layer 9, the metal fiber layer 10, the polymer material layer 11, the copper alloy layer 12, and the aluminum alloy layer 13 are integrally formed by casting.

[0030] Furthermore, a method for manufacturing a positioning pin for a PCB board test fixture includes the following steps:

[0031] S1: Prepare the materials needed to make the positioning pin of the jig, including silicon functional groups, aluminum functional groups, polymer materials, metal fiber materials and solid zinc diffusion agent. Among them, silicon functional groups and aluminum functional groups are used as the base layer, and polymer materials, metal fiber materials and solid zinc diffusion agent are blended and molded.

[0032] S2: The prepared silicon functional groups, aluminum functional groups, polymer materials and metal fiber materials are cleaned and activated. After cleaning, they are placed in a vacuum dish for storage.

[0033] S3: Prepare a vacuum hot-press bonding device, mix the cleaned silicon functional groups, aluminum functional groups, polymer materials and metal fiber materials, and coat the materials with stabilizers and organic environmentally friendly solvents, and make a reinforced alloy by bonding.

[0034] S4: After the bonding molding operation is completed, open the vacuum hot press bonding device, take out the molded material, air dry it, wait for it to stabilize and mold, coat the surface of the molded reinforcing alloy with solid zinc diffusion agent and carry out the blending operation.

[0035] S5: Place the reinforcing alloy with zinc plating agent applied to its outer surface into the designated position of the zinc plating furnace for positioning. After fixing the position, heat the zinc plating furnace and control the heating temperature using a temperature control device until a zinc plating layer is formed on the surface of the reinforcing alloy. Then, shape the processed reinforcing alloy into the shape of a positioning pin using a mold, and the manufacturing process is complete.

[0036] Furthermore, the mass fraction of silicon functional groups is 30-45%, the mass fraction of aluminum functional groups is 18-29%, the mass fraction of polymer materials is 12-24%, the mass fraction of metal fiber materials is 12-20%, and the mass fraction of solid zinc diffusion agent is 10-20%.

[0037] Furthermore, the mass fraction of silicon functional groups is 35%, the mass fraction of aluminum functional groups is 23%, the mass fraction of polymer materials is 15%, the mass fraction of metal fiber materials is 15%, and the mass fraction of solid zinc diffusion agent is 12%.

[0038] Furthermore, a heating operation is performed in step S5, with a heating time of 24 minutes. Example

[0039] Based on Example 1, such as Figure 1-4 As shown, a PCB board test fixture positioning pin includes a pin body 1, a pin holder 6, and a pin head 8. A pin tail 2 is provided at the tail of the pin body 1. A spring 3 is provided inside the pin body 1. A piston 5 is installed at the end of the spring 3. A pin rod 7 is installed between the pin holder 6 and the pin head 8. A reinforcing shell 4 is installed on the outer wall of the pin body 1.

[0040] Furthermore, the reinforced outer shell 4 includes a zinc plating layer 9, a metal fiber layer 10, a polymer material layer 11, a copper alloy layer 12, and an aluminum alloy layer 13. The zinc plating layer 9 is located on the outer surface of the metal fiber layer 10, the metal fiber layer 10 is located on the outer surface of the polymer material layer 11, the polymer material layer 11 is located on the outer surface of the copper alloy layer 12, and the copper alloy layer 12 is located on the outer surface of the aluminum alloy layer 13.

[0041] Furthermore, the zinc plating layer 9, the metal fiber layer 10, the polymer material layer 11, the copper alloy layer 12, and the aluminum alloy layer 13 are integrally formed by casting.

[0042] Furthermore, a method for manufacturing a positioning pin for a PCB board test fixture includes the following steps:

[0043] S1: Prepare the materials needed to make the positioning pin of the jig, including silicon functional groups, aluminum functional groups, polymer materials, metal fiber materials and solid zinc diffusion agent. Among them, silicon functional groups and aluminum functional groups are used as the base layer, and polymer materials, metal fiber materials and solid zinc diffusion agent are blended and molded.

[0044] S2: The prepared silicon functional groups, aluminum functional groups, polymer materials and metal fiber materials are cleaned and activated. After cleaning, they are placed in a vacuum dish for storage.

[0045] S3: Prepare a vacuum hot-press bonding device, mix the cleaned silicon functional groups, aluminum functional groups, polymer materials and metal fiber materials, and coat the materials with stabilizers and organic environmentally friendly solvents, and make a reinforced alloy by bonding.

[0046] S4: After the bonding molding operation is completed, open the vacuum hot press bonding device, take out the molded material, air dry it, wait for it to stabilize and mold, coat the surface of the molded reinforcing alloy with solid zinc diffusion agent and carry out the blending operation.

[0047] S5: Place the reinforcing alloy with zinc plating agent applied to its outer surface into the designated position of the zinc plating furnace for positioning. After fixing the position, heat the zinc plating furnace and control the heating temperature using a temperature control device until a zinc plating layer is formed on the surface of the reinforcing alloy. Then, shape the processed reinforcing alloy into the shape of a positioning pin using a mold, and the manufacturing process is complete.

[0048] Furthermore, the mass fraction of silicon functional groups is 30-45%, the mass fraction of aluminum functional groups is 18-29%, the mass fraction of polymer materials is 12-24%, the mass fraction of metal fiber materials is 12-20%, and the mass fraction of solid zinc diffusion agent is 10-20%.

[0049] Furthermore, the mass fraction of silicon functional groups is 38%, the mass fraction of aluminum functional groups is 25%, the mass fraction of polymer materials is 13%, the mass fraction of metal fiber materials is 12%, and the mass fraction of solid zinc diffusion agent is 12%.

[0050] Furthermore, a heating operation is performed in step S5, with a heating time of 26 minutes.

[0051] Working Principle: This invention includes a needle body 1, a needle tail 2, a spring 3, a reinforcing outer shell 4, a piston 5, a needle holder 6, a needle shaft 7, a needle tip 8, a zinc plating layer 9, a metal fiber layer 10, a polymer material layer 11, a copper alloy layer 12, and an aluminum alloy layer 13. During preparation, the materials needed to prepare the fixture positioning needle are prepared, including silicon functional groups, aluminum functional groups, polymer materials, metal fiber materials, and a solid zinc infiltration agent. Silicon and aluminum functional groups serve as the base layer, while the polymer materials, metal fiber materials, and solid zinc infiltration agent are blended and molded. The prepared silicon, aluminum, polymer, and metal fiber materials undergo surface cleaning and activation treatment. After cleaning, they are placed in a vacuum dish for storage, and a vacuum hot-press bonding device is prepared. After cleaning, silicon functional groups, aluminum functional groups, polymer materials, and metal fiber materials are mixed, and stabilizers and environmentally friendly organic solvents are coated between the materials. A reinforcing alloy is formed by bonding. After the bonding molding process is completed, the vacuum hot pressing bonding device is opened, the molded material is taken out, and air-dried until it stabilizes. The surface of the molded reinforcing alloy is coated with a solid zinc-diffusion agent and blended. The reinforcing alloy with the zinc-diffusion agent on its outer surface is placed into the designated position of the zinc-diffusion furnace for positioning. After the position is fixed, the zinc-diffusion furnace is heated, and the heating temperature is controlled by a temperature control device until a zinc-plated layer is formed on the surface of the reinforcing alloy. The processed reinforcing alloy is then molded into the shape of a positioning pin, and the manufacturing process is completed.

[0052] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0053] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A method for manufacturing a positioning pin for a PCB board test fixture, the positioning pin for the PCB board test fixture comprising a pin body (1), a pin holder (6), and a pin head (8), characterized in that: The tail position of the needle body (1) is provided with a needle tail (2), the inside of the needle body (1) is provided with a spring (3), the end of the spring (3) is installed with a piston (5), the needle holder (6) and the needle head (8) are installed with a needle rod (7), and the outer wall position of the needle body (1) is installed with a reinforcing shell (4); The reinforcing shell (4) comprises a galvanized layer (9), a metal fiber layer (10), a high polymer material layer (11), a copper alloy layer (12) and an aluminum alloy layer (13), the galvanized layer (9) is located on the outer surface of the metal fiber layer (10), the metal fiber layer (10) is located on the outer surface of the high polymer material layer (11), the high polymer material layer (11) is located on the outer surface of the copper alloy layer (12), and the copper alloy layer (12) is located on the outer surface of the aluminum alloy layer (13); The galvanized layer (9), the metal fiber layer (10), the high polymer material layer (11), the copper alloy layer (12) and the aluminum alloy layer (13) are integrally formed by pouring; The following operation steps are included: S1: Prepare the materials needed for the positioning needle, including silicon functional groups, aluminum functional groups, high polymer materials, metal fiber materials and solid zinc infiltration agent, wherein the silicon functional groups and the aluminum functional groups are used as the base layer, and the high polymer materials, the metal fiber materials and the solid zinc infiltration agent are blended into the form; S2: The prepared silicon functional groups, aluminum functional groups, high polymer materials and metal fiber materials are surface cleaned and activated, and after cleaning, they are stored in a vacuum dish; S3: Prepare a vacuum hot-press bonding device, mix the cleaned silicon functional groups, aluminum functional groups, high polymer materials and metal fiber materials, and coat stabilizers and organic environmentally friendly solvents between the materials, and make a reinforcing alloy by bonding; S4: After the bonding forming operation is completed, open the vacuum hot-press bonding device, take out the formed material, dry it, and coat the surface of the formed reinforcing alloy with solid zinc infiltration agent for blending operation; S5: Put the reinforcing alloy with the zinc infiltration agent on the surface into the specified position of the zinc infiltration furnace, position it, fix its position, heat the zinc infiltration furnace, control the heating temperature by a temperature control device, until a galvanized layer is formed on the surface of the reinforcing alloy, and then the processed reinforcing alloy is formed into the shape of a positioning needle by a mold, and the manufacturing is completed; The mass fraction of the silicon functional groups is 38%, the mass fraction of the aluminum functional groups is 25%, the mass fraction of the high polymer materials is 13%, the mass fraction of the metal fiber materials is 12%, and the mass fraction of the solid zinc infiltration agent is 12%; In the heating operation in the S5 step, the heating time is 20-30 min.

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