Method for determining substrate rotation and exposure machine

Abstract

A method and exposure machine for determining the rotation direction of a substrate, the method comprising: placing and positioning a substrate on a carrying surface so that the second surface of the substrate faces the carrying surface, the first surface of the substrate faces away from the carrying surface, and a second mark on the second surface of the substrate corresponds to a fixed second image capture device. The first image capture device above the carrying surface searches for the first mark on the first surface and captures a first image of the first mark, and the second image capture device captures a second image of the second mark. The substrate is flipped over and placed on the carrying surface so that the first surface of the substrate faces the carrying surface, and the first mark corresponds to the second image capture device. Based on the captured first image, the second image capture device confirms the first mark, and based on the captured second image, the first image capture device searches for and confirms the second mark. Based on the confirmed first mark and the confirmed second mark, the rotation direction of the projection of the second surface of the flipped substrate on the carrying surface is determined.

Description

Technical Field

[0001] The present invention relates to a method for determining the direction of rotation of a substrate, and more particularly to an exposure machine using the method for determining the direction of rotation of a substrate. Background Art

[0002] A conventional exposure machine can perform an exposure process on a first surface and a second surface of a substrate, both facing each other. While the exposure machine is exposing the first surface of the substrate, the second surface of the substrate faces the support surface of the carrier. At this time, two image capture devices fixed to the back side of the carrier (opposite to the support surface) capture images of two marks on the second surface of the substrate (adjacent to an edge of the second surface) through two windows on the back side of the carrier.

[0003] After the exposure process on the first surface of the substrate is completed and the substrate is flipped over, the second surface of the substrate faces upward (i.e., the second surface of the substrate faces away from the supporting surface) and another image capture device located above the supporting stage moves relative to the supporting stage. This other image capture device searches for and confirms the two marks on the second surface of the substrate based on the images previously captured by the two image capture devices located on the back of the supporting stage. Based on the two marks on the second surface of the substrate confirmed by this other image capture device, the flipped second surface of the substrate can be positioned and oriented. Therefore, the positioned and oriented second surface of the substrate can undergo subsequent exposure processes, so that the patterns on the first and second surfaces of the substrate after exposure are precisely aligned.

[0004] However, in conventional exposure machines, the distance between the two image capture devices fixed to the back of the carrier is fixed, limiting the size of the substrates that can be positioned and oriented by conventional exposure machines. In other words, the distance between the two marks on the second surface of the substrate must be equal to this fixed distance, so the edge of the substrate's second surface adjacent to the two marks must not be smaller than this fixed distance. Summary of the Invention

[0005] An object of the present invention is to provide a method for determining the direction of rotation of a substrate and an exposure machine using the method, wherein the range of sizes of substrates that can be processed can be larger.

[0006] The present invention provides a method for determining a rotation direction of a substrate, wherein the substrate includes a first surface and a second surface opposite to each other, and a first mark and a second mark, wherein the first mark is located on the first surface, and the second mark is located on the second surface, and the first mark and the second mark are not opposite to each other. The above method includes the following steps. First, a carrier, a first image capture device, and a second image capture device are provided, wherein the carrier has a carrier surface and a back surface opposite to each other, the first image capture device is arranged above the carrier surface and is suitable for moving relative to the carrier, and the second image capture device is fixed on the back surface.

[0007] Next, the substrate is placed and positioned on the support surface such that the second surface of the substrate faces the support surface, the first surface of the substrate faces away from the support surface, and the second mark corresponds to the second image capture device. Next, the first image capture device searches for the first mark and captures a first image of the first mark, and the second image capture device captures a second image of the second mark. Next, the substrate is flipped over and placed on the support surface such that the first surface of the substrate faces the support surface, the second surface of the substrate faces away from the support surface, and the first mark corresponds to the second image capture device.

[0008] Next, the second image capture device identifies the first mark based on the captured first image, and the first image capture device searches for and identifies the second mark based on the captured second image. Next, based on the first mark identified by the second image capture device and the second mark identified by the first image capture device, a rotation of a projection of the flipped second surface of the substrate on the supporting surface is determined.

[0009] In one embodiment of the present invention, the substrate positioning method further includes processing the first surface of the substrate by a processing device.

[0010] In one embodiment of the present invention, the substrate positioning method further includes processing the second surface of the substrate by a processing device based on the rotation of the projection of the second surface of the flipped substrate on the supporting surface.

[0011] In one embodiment of the present invention, the processing device is an exposure device.

[0012] The present invention provides an exposure machine suitable for exposing a first surface and a second surface opposite to each other of a substrate, wherein the substrate includes a first mark and a second mark, the first mark is located on the first surface, and the second mark is located on the second surface, and the first mark and the second mark are not opposite to each other. The above-mentioned exposure machine includes a carrier, a first image capture device and a second image capture device. The carrier has a carrier surface and a back surface opposite to each other. The first image capture device is arranged above the carrier surface and is suitable for moving relative to the carrier. The second image capture device is fixed on the back surface. The substrate is suitable for being placed and positioned on the carrier surface so that the second surface of the substrate faces the carrier surface, the first surface of the substrate faces away from the carrier surface, and the second mark corresponds to the second image capture device.

[0013] The exposure machine is suitable for performing the following steps. First, a first image capture device searches for a first mark and captures a first image of the first mark, and a second image capture device captures a second image of the second mark. Next, the first surface of the substrate is exposed. Next, the substrate is flipped and placed on a support surface, with the first surface facing the support surface and the second surface facing away from the support surface, and the first mark corresponding to the second image capture device.

[0014] Next, based on the captured first image, the second image capture device identifies the first marker, and based on the captured second image, the first image capture device searches for and identifies the second marker. Next, based on the first marker identified by the second image capture device and the second marker identified by the first image capture device, a rotation of a projection of the flipped second surface of the substrate on the support surface is determined. Finally, based on the rotation of the projection of the flipped second surface of the substrate on the support surface, the second surface of the substrate is exposed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional schematic diagram of an exposure machine according to an embodiment of the present invention is shown.

[0016] Figure 2 Show Figure 1 Another three-dimensional schematic diagram of the substrate.

[0017] Figure 3 Another perspective schematic diagram of an exposure machine according to an embodiment of the present invention is shown, wherein the substrate has been turned over.

[0018] Figure 4 A flow chart illustrating a method for determining a direction of rotation of a substrate according to another embodiment of the present invention. DETAILED DESCRIPTION

[0019] Figure 1 A three-dimensional schematic diagram of an exposure machine according to an embodiment of the present invention is shown. Figure 2 Show Figure 1 Please refer to the other three-dimensional diagram of the substrate. Figure 1 and Figure 2 The exposure machine 200 of the embodiment of the present invention can perform an exposure process on a first surface 310 and a second surface 320 of a substrate 300 that are opposite to each other. The substrate 300 includes a first mark 312 and a second mark 322. The first mark 312 is located on the first surface 310, and the second mark 322 is located on the second surface 320. The first mark 312 and the second mark 322 are not opposite to each other. That is, a projection of the first mark 312 on the second surface 320 does not completely overlap with the second mark 322, and preferably, no overlap at all.

[0020] The exposure machine 200 includes a carrier 210, a first image capture device 220, and a second image capture device 230. The carrier 210 has a carrier surface 212 and a back surface 214, which are opposite each other. The first image capture device 220 is disposed above the carrier surface 212 and is adapted to move relative to the carrier 210. Specifically, the carrier 210 can be stationary while the first image capture device 220 is movable, or the carrier 210 can be movable while the first image capture device 220 is stationary, or both the carrier 210 and the first image capture device 220 are movable. The second image capture device 230 is fixed to the back surface 214 of the carrier 210.

[0021] Furthermore, the substrate 300 can be placed and positioned on the supporting surface 212 of the supporting platform 210 such that the second surface 320 of the substrate 300 faces the supporting surface 212, the first surface 310 of the substrate 300 faces away from the supporting surface 212 (i.e., the first surface 310 of the substrate 300 faces upward), and the second mark 322 corresponds to the second image capture device 230. In this embodiment, before any exposure process is performed, the positioning of the substrate 300 is achieved by placing adjacent edges 330 and 340 of the substrate 300 against two supporting bars 216 and 218 located on the supporting surface 212 of the supporting platform 210, respectively.

[0022] At this time, the first image capture device 220 above the support surface 212 searches for the first mark 312 on the first surface 310 of the substrate 300 and captures a first image of the first mark 312. Furthermore, the second image capture device 230 fixed to the back surface 214 of the support platform 210 captures a second image of the second mark 322 on the second surface 320 of the substrate 300 through a window (not shown) on the back surface 214 of the support platform 210. Next, the exposure machine performs exposure on the first surface 310 of the substrate 300. It should be noted that if the processes of the first image capture device 220 and the second image capture device 230 capturing the first image and the second image respectively do not interfere with the exposure process of the first surface 310 of the substrate 300, the processes of the first image capture device 220 and the second image capture device 230 capturing the first image and the second image respectively can be performed simultaneously with the exposure process of the first surface 310 of the substrate 300.

[0023] Figure 3 Another perspective view of the exposure machine according to an embodiment of the present invention is shown. Figure 1 、 Figure 2 and Figure 3 After the exposure process is completed on the first surface 310 of the substrate 300, the substrate 300 is flipped over and placed on the supporting surface 212 of the supporting platform 210, such that the first surface 310 of the substrate 300 faces the supporting surface 212, the second surface 320 of the substrate 300 faces away from the supporting surface 212 (i.e., the second surface 320 of the substrate 300 faces upward), and the first mark 312 corresponds to the second image capture device 230. At this point, the adjacent edges 330 and 350 of the substrate 300 can rest on the two supporting bars 216 and 218 located on the supporting surface 212 of the supporting platform 210, respectively. However, since the edges 330, 340, and 350 of the substrate 300 may not be completely straight or their intersection angles may not be completely perpendicular, the projection of the second surface 320 of the flipped substrate 300 on the supporting surface 212 may be slightly tilted.

[0024] Therefore, next, based on the first image acquired, the second image capturing device 230 confirms the first mark 312 (see Figure 1), and based on the captured second image, the first image capture device 220 searches for and confirms the second mark 322 on the second surface 320 of the substrate 300. Next, based on the first mark 312 confirmed by the second image capture device 230 and the second mark 322 confirmed by the first image capture device 220, the rotation direction of the projection of the second surface 320 of the flipped substrate 300 on the supporting surface 212 is determined. In this embodiment, the rotation direction of the projection of the second surface 320 of the flipped substrate 300 on the supporting surface 212 can be represented by a vector calculated from the coordinate position of the projection of the flipped second mark 322 on the supporting surface 212 relative to the coordinate position of the projection of the flipped first mark 312 on the supporting surface 212.

[0025] Finally, the second surface 320 of the flipped substrate 300 is exposed based on the rotation of the projection of the second surface 320 on the supporting surface 212. In this way, the patterns on the first surface 310 and the second surface 320 of the substrate 300 can be accurately aligned after exposure.

[0026] Figure 4 A flow chart showing a method for determining the direction of rotation of a substrate according to another embodiment of the present invention is shown. This method for determining the direction of rotation of a substrate comprises the following steps. First, step S21 is performed to provide a substrate. The substrate comprises a first surface and a second surface opposite to each other and a first mark and a second mark, wherein the first mark is located on the first surface and the second mark is located on the second surface, and the first mark and the second mark are not opposite to each other. Next, step S22 is performed to provide a carrier, a first image capture device and a second image capture device. The carrier has a carrier surface and a back surface opposite to each other, the first image capture device is arranged above the carrier surface and is suitable for moving relative to the carrier, and the second image capture device is fixed on the back surface.

[0027] Next, step S23 is performed to place and position the substrate on the supporting surface so that the second surface of the substrate faces the supporting surface, the first surface of the substrate faces away from the supporting surface, and the second mark corresponds to the second image capture device. Next, step S24 is performed to search for the first mark and capture a first image of the first mark by the first image capture device, and to capture a second image of the second mark by the second image capture device. Next, step S25 is optionally performed to process the first surface of the substrate by a processing device (such as an exposure device) (such as an exposure process). It must be noted here that if the above-mentioned step 24 does not interfere with step 25, then step 24 and step 25 can be performed simultaneously, or step 25 can precede step 24.

[0028] Next, step S26 is executed to flip the substrate and place the substrate on the carrying surface so that the first surface of the substrate faces the carrying surface, the second surface of the substrate faces away from the carrying surface, and the first mark corresponds to the second image capture device. Next, step S27 is executed, and based on the captured first image, the second image capture device confirms the first mark, and based on the captured second image, the first image capture device searches for and confirms the second mark. Next, step S28 is executed to determine the direction of a projection of the second surface of the flipped substrate on the carrying surface based on the first mark confirmed by the second image capture device and the second mark confirmed by the first image capture device. Finally, step S29 is optionally executed to process the second surface of the substrate (e.g., an exposure process) by a processing device (e.g., an exposure device) based on the direction of the projection of the second surface of the flipped substrate on the carrying surface.

[0029] Based on the foregoing, the method for determining substrate rotation and the exposure machine according to the embodiments of the present invention have at least one of the following advantages. Because the substrates according to the embodiments of the present invention each have a mark on two opposing surfaces and only one image capture device is required, the range of substrate sizes that can be loaded by the loading platform is wider than in conventional techniques. In other words, the size of the substrates that can be loaded by the loading platform is less restricted.

[0030]

Explanation of symbols

[0031] 200 exposure machine

[0032] 210 Loading Platform

[0033] 212 bearing surface

[0034] 214 Back

[0035] 216, 218 support strips

[0036] 220 First image capture device

[0037] 230 Second image capture device

[0038] 300 substrates

[0039] 310 first surface

[0040] 312 First Mark

[0041] 320 Second Surface

[0042] 322 Second Mark

[0043] 330, 340, 350 Edge

[0044] Steps S21 to S29.

Claims

1. A method for determining the direction of rotation of a substrate, wherein: The substrate includes a first surface and a second surface opposite to each other, and a first mark and a second mark, wherein the first mark is located on the first surface, and the second mark is located on the second surface, and the first mark and the second mark are not opposite to each other. The method includes: A supporting platform, a first image capturing device, and a second image capturing device are provided, wherein the supporting platform has a supporting surface and a back surface opposite to each other, the first image capturing device is disposed above the supporting surface and is adapted to move relative to the supporting platform, and the second image capturing device is fixed to the back surface; placing and positioning the substrate on the carrying surface such that the second surface of the substrate faces the carrying surface, the first surface of the substrate faces away from the carrying surface, and the second mark corresponds to the second image capture device; Searching for the first marker and capturing a first image of the first marker by the first image capture device; capturing a second image of the second marker by the second image capture device; flipping the substrate and placing the substrate on the carrying surface such that the first surface of the substrate faces the carrying surface, the second surface of the substrate faces away from the carrying surface, and the first mark corresponds to the second image capture device; Based on the captured first image, the second image capture device confirms the first mark; Based on the acquired second image, the first image capturing device searches for and confirms the second marker; The rotation direction of a projection of the second surface of the flipped substrate on the supporting surface is determined based on the first mark confirmed by the second image capturing device and the second mark confirmed by the first image capturing device. 2 . The method according to claim 1 , further comprising processing the first surface of the substrate by a processing device. 3 . The method according to claim 2 , further comprising processing the second surface of the substrate by the processing device based on the rotation of the projection of the second surface of the flipped substrate on the supporting surface.

4. The method according to claim 2 or claim 3, wherein the processing device is an exposure device.

5. An exposure machine adapted to expose a first surface and a second surface of a substrate facing each other, wherein the substrate comprises a first mark and a second mark, the first mark being located on the first surface and the second mark being located on the second surface, and the first mark and the second mark being not facing each other, the exposure machine comprising: A supporting platform having a supporting surface and a back surface facing each other; a first image capturing device disposed above the carrying surface and adapted to move relative to the carrying platform; and a second image capturing device fixed to the back surface; wherein the substrate is adapted to be placed and positioned on the carrying surface such that the second surface of the substrate faces the carrying surface, the first surface of the substrate faces away from the carrying surface, and the second mark corresponds to the second image capture device; in, The exposure machine is suitable for performing the following steps: Searching for the first marker and capturing a first image of the first marker by the first image capture device; capturing a second image of the second marker by the second image capture device; exposing the first surface of the substrate; flipping the substrate and placing the substrate on the carrying surface such that the first surface of the substrate faces the carrying surface, the second surface of the substrate faces away from the carrying surface, and the first mark corresponds to the second image capture device; Based on the captured first image, the second image capture device confirms the first mark; Based on the acquired second image, the first image capturing device searches for and confirms the second marker; Determining a rotation direction of a projection of the second surface of the flipped substrate on the supporting surface based on the first mark determined by the second image capturing device and the second mark determined by the first image capturing device; as well as Based on the rotation of the projection of the flipped second surface of the substrate on the carrying surface, the second surface of the substrate is exposed.

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