A grinding control method based on a grinding robot

Abstract

An embodiment of the present application provides a grinding control method based on a grinding robot. The grinding control method based on the grinding robot includes: determining a plane to be ground that matches a preset grinding task; controlling a grinding disc of the grinding robot to perform a leveling operation according to the plane to be ground; performing path planning based on the size of the plane to be ground and the radius of the grinding disc to obtain a grinding path; and controlling the leveled grinding disc of the grinding robot to perform multiple grinding operations based on different grinding parameters along the grinding path. It can be seen that by implementing this implementation manner, the grinding robot can be controlled to perform putty grinding, thereby improving the putty grinding efficiency and further improving the overall repair efficiency.

Description

Technical Field

[0001] This application relates to the technical field of robots. Specifically, it relates to a grinding control method based on a grinding robot. Background Art

[0002] During the process of building decoration, materials such as putty are usually used to repair the working surfaces of building walls or ceilings, etc., so that the walls or ceilings are smoother and more beautiful. However, there are usually putty residues on the walls or ceilings after putty spraying or smearing, which makes the relevant workers have to grind the working surfaces to remove these residual putties.

[0003] In practice, it is found that most of the current grinding work for residual putty is done manually. However, when grinding manually, the movements are subjectively random and there is no fixed trajectory. There are intersections and overlaps between different grinding trajectories and areas, resulting in marks left at the edges, and there are still visual defects on the working surface after grinding. In addition, manual grinding also has the disadvantage of low grinding efficiency, which further limits the overall repair efficiency. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a grinding control method based on a grinding robot, which can control the grinding robot to grind putty, thereby improving the putty grinding efficiency and further improving the overall repair efficiency.

[0005] The first aspect of the embodiments of this application provides a grinding control method based on a grinding robot, including:

[0006] Determine the plane to be ground that matches the preset grinding task;

[0007] Control the grinding disc of the grinding robot to perform a leveling operation according to the plane to be ground;

[0008] Perform path planning according to the size of the plane to be ground and the radius of the grinding disc to obtain a grinding path;

[0009] The grinding robot controls the leveled grinding disc to perform multiple grinding operations with different grinding parameters along the grinding path.

[0010] In the above implementation process, this grinding control method based on a grinding robot can first determine the plane to be ground that matches the preset grinding task; then control the grinding disc of the grinding robot to level according to the plane to be ground; then perform path planning based on the size of the plane to be ground and the radius of the grinding disc to obtain a grinding path; finally, the grinding robot controls the leveled grinding disc to perform multiple grinding operations with different grinding parameters along the grinding path. It can be seen that implementing this implementation method can determine the actual grinding plane according to the actual scenario, and perform the leveling operation and path planning operation of the grinding disc according to the actual plane to be ground, so that the grinding disc of the grinding robot can perform multiple grinding operations with different grinding parameters according to the grinding path, thereby realizing an automatic, accurate, and efficient grinding process, and further improving the overall grinding efficiency.

[0011] Further, the grinding parameters include the moving speed of the grinding disc and the rotation speed of the grinding disc; in the multiple grinding operations, the moving speed increases sequentially, and the rotation speed decreases sequentially.

[0012] In the above implementation process, the grinding robot can perform the first grinding operation at a first moving speed and a first rotation speed, then perform the second grinding operation at a second moving speed greater than the first moving speed and a second rotation speed less than the first rotation speed, and then perform the third grinding operation at a third moving speed greater than the second moving speed and a third rotation speed less than the second rotation speed, and so on. It can be seen that implementing this implementation method can form an edge gradient layer at the edges of multiple grinding areas, thereby avoiding repeated deepening of the edges and further improving the overall grinding effect.

[0013] Further, the multiple grinding operations include a first grinding operation at a first moving speed and a first rotation speed, a second grinding operation at a second moving speed and a second rotation speed, and a third grinding operation at a third moving speed and a third rotation speed; wherein, the first moving speed, the second moving speed, and the third moving speed increase sequentially, and the first rotation speed, the second rotation speed, and the third rotation speed decrease sequentially.

[0014] In the above implementation process, when the multiple grinding operations are three grinding operations, the grinding robot can achieve a better grinding effect and will not leave heavy edge marks.

[0015] Further, the grinding path includes at least one forward path and at least one backward path, the total number of the forward path and the backward path is the same as the number of passes of the multiple grinding operations, and the forward path and the backward path have opposite directions and are staggered from each other.

[0016] In the above implementation process, assuming that the first grinding path is the forward path, then the second grinding path is the reverse retraction path, and the third grinding path is the forward path. Among them, the three grinding paths correspond to three grinding operations, and the three grinding paths are staggered from each other.

[0017] Further, the forward path starts from the upper left position of the plane to be ground and extends downward in a winding manner to the right side of the plane to be ground; the retraction path starts from the lower right position of the plane to be ground and extends upward in a winding manner to the left side of the plane to be ground.

[0018] In the above implementation process, the method describes the generation starting point and generation method of the grinding path, so that the grinding path can be generated according to the regulations, making the generated grinding path more reliable, and at the same time improving the stability of the grinding path generation.

[0019] Further, the size of the area covered by the previous grinding in the multiple grindings is a preset multiple of the size of the area covered by the next grinding; the preset multiple is greater than one.

[0020] In the above implementation process, the first area of the grinding area of the first grinding operation is the smallest, the second area of the grinding area of the second grinding operation is a times (a is a custom preset multiple) of the first area, and the third area of the grinding area of the third grinding operation is a times of the second area. It can be seen that implementing this implementation method can regularly expand the area of the grinding area as the number of grinding passes increases, so as to achieve multi-segment progressive diffusion grinding, which can make the grinding edge blurred, and then form an edge grinding gradient layer, avoiding the situation of repeated deepening, and making the overall grinding effect better.

[0021] Further, the step of determining the plane to be ground that matches the preset putty grinding task includes:

[0022] Controlling the grinding robot to move to the location to be ground that matches the preset grinding task;

[0023] Controlling the grinding robot to identify and measure the area to be ground at the location to be ground to obtain the plane to be ground.

[0024] In the above implementation process, in the process of determining the plane to be ground that matches the preset grinding task, the method can first control the grinding robot to move to the location to be ground that matches the preset grinding task; control the grinding robot to identify and measure the area to be ground at the location to be ground to obtain the plane to be ground. It can be seen that implementing this implementation method can automatically control the grinding robot to move to a specific position and identify and measure the area to be ground according to the laser rangefinder, thereby improving the acquisition accuracy of the plane to be ground.

[0025] Further, the step of controlling the grinding disc of the grinding robot to level according to the plane to be ground includes:

[0026] Obtain three boundary corner points of the plane to be ground;

[0027] Calculate according to the three boundary corner points to obtain the pitch angle and yaw angle between the grinding disc of the grinding robot and the plane to be ground;

[0028] Control the grinding disc to perform a leveling operation according to the pitch angle and the yaw angle.

[0029] In the above implementation process, when the method controls the grinding disc of the grinding robot to level according to the plane to be ground, it can preferentially obtain three boundary corner points of the plane to be ground; then calculate according to the three boundary corner points to obtain the pitch angle and yaw angle between the grinding disc of the grinding robot and the plane to be ground; finally, control the grinding disc to perform a leveling operation according to the pitch angle and the yaw angle. It can be seen that implementing this implementation method can control and adjust the grinding robot by the three-point method, so that the grinding disc is level with the plane to be ground, thereby improving the subsequent path generation effect and generation efficiency, and at the same time improving the overall putty grinding efficiency.

[0030] Further, the method further includes:

[0031] Extract the area to be ground from the received construction site information;

[0032] Divide the area to be ground to obtain multiple planes to be ground;

[0033] Set multiple grinding tasks for the multiple planes to be ground according to a preset working sequence.

[0034] In the above implementation process, the method can extract the area to be ground from the construction site information and divide it to obtain multiple planes to be ground, and then further set multiple grinding tasks for the multiple planes to be ground according to a preset working sequence. It can be seen that implementing this implementation method can determine multiple grinding tasks in real time according to the construction site information, so that the grinding robot can prepare and perform grinding work in real time and on-site.

[0035] Further, after controlling the grinding disc of the grinding robot to level according to the plane to be ground, the grinding control method further includes:

[0036] Collect the distance data between the grinding disc and multiple points on the plane to be ground, and adjust the feed amount of the grinding disc based on the distance data.

[0037] In the above implementation process, the grinding robot can collect the distance data between the grinding disc and the four corner points on the plane to be ground, and adjust the feed amount of the grinding disc based on the distance data, so that the distance between the grinding disc and the plane to be ground is more suitable, which is conducive to ensuring the grinding effect.

[0038] The second aspect of the embodiments of the present application provides a grinding control device based on a grinding robot, and the grinding control device based on the grinding robot includes:

[0039] A determination unit, configured to determine a plane to be ground that matches a preset grinding task;

[0040] A leveling unit, configured to control the grinding disc of the grinding robot to perform a leveling operation according to the plane to be ground;

[0041] A path planning unit, configured to perform path planning according to the size of the plane to be ground and the radius of the grinding disc to obtain a grinding path;

[0042] A grinding unit, configured to control the leveled grinding disc of the grinding robot to perform multiple grinding operations based on different grinding parameters along the grinding path.

[0043] In the above implementation process, the grinding control device can determine the actual grinding plane according to the actual scenario, and perform a leveling operation and a path planning operation on the grinding disc according to the actual plane to be ground, so that the grinding disc of the grinding robot can perform multiple grinding operations based on different grinding parameters according to the grinding path, thereby realizing an automatic, accurate and efficient grinding process, and further improving the overall grinding efficiency.

[0044] The third aspect of the embodiments of the present application provides an electronic device, including a memory and a processor, where the memory is used to store a computer program, and the processor runs the computer program to enable the electronic device to execute the grinding control method based on a grinding robot according to any one of the first aspects of the embodiments of the present application.

[0045] The fourth aspect of the embodiments of the present application provides a computer-readable storage medium, which stores computer program instructions, and when the computer program instructions are read and run by a processor, the grinding control method based on a grinding robot according to any one of the first aspects of the embodiments of the present application is executed. Description of the Drawings

[0046] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0047] Figure 1 It is a schematic flow chart of a grinding control method based on a grinding robot provided by an embodiment of the present application;

[0048] Figure 2 It is a schematic flow chart of another grinding control method based on a grinding robot provided by an embodiment of the present application;

[0049] Figure 3 It is a schematic structural diagram of a putty grinding control device based on a grinding robot provided by an embodiment of the present application;

[0050] Figure 4 It is a schematic diagram for determining the pitch angle and yaw angle between the grinding disc of a grinding robot and the plane to be ground provided by an embodiment of the present application;

[0051] Figure 5 It is a schematic diagram of the multi-stage grinding effect of a grinding robot provided by an embodiment of the present application;

[0052] Figure 6 It is a schematic diagram of the combined effect of multiple grinding paths provided by an embodiment of the present application. Detailed implementation manners

[0053] Next, the technical solutions in the embodiments of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application.

[0054] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0055] Embodiment 1

[0056] Please refer to Figure 1 , Figure 1 which is a schematic flow chart of a grinding control method based on a grinding robot provided by an embodiment of the present application. This method is during the process of grinding the putty after putty spraying. Among them, the grinding control method based on the grinding robot includes:

[0057] S101. Determine the plane to be ground that matches the preset grinding task.

[0058] In this embodiment, the grinding task can be a putty grinding task.

[0059] In this embodiment, when the grinding task is a putty grinding task, the method will spray, scrape, and repair the wall with putty before performing step S101.

[0060] In this embodiment, usually, after the putty is dry and the worker covers the wall junction box and potholes with cardboard, the plane to be ground can be determined.

[0061] In this embodiment, the above-mentioned putty spraying requirements ensure that the potholes on the wall are less than 0.5 mm deep and the protrusions are less than 2 mm high.

[0062] In this embodiment, the above-mentioned cardboard used for covering is required to be 2 mm lower than the wall surface, so as to ensure that it does not protrude outward and avoid interfering with the construction.

[0063] In this embodiment, the method can actually calculate the size of the on-site grinding area according to the task requirements, perform laser ranging point sampling at the lower left, lower right, upper right, and upper left of this area, and measure the on-site grinding area through a calculation laser ranging sensor, so as to determine the plane to be ground on-site.

[0064] S102. Control the grinding disc of the grinding robot to perform a leveling operation according to the plane to be ground.

[0065] In this embodiment, the method can have two symmetrical sandpapers adhered to the grinding disc of the grinding robot by the worker in advance. Among them, the sandpaper is 200-300 mesh sandpaper, installed symmetrically at 180°, and the diameter of the sandpaper is 120-130 mm.

[0066] In this embodiment, the grinding disc is annular, with an outer ring diameter of 300±50 mm and an inner ring diameter of 50±10 mm.

[0067] In this embodiment, the method can give priority to the leveling operation. The specific process is to perform laser ranging point sampling at the lower left, lower right, and upper right points of the plane to be ground to calculate the pitch angle and yaw angle based on the laser sensor data, and then correct the roll angle using the attitude sensor.

[0068] In this embodiment, by selecting the lower left, lower right, and upper right points of the plane to be ground, it can ensure that the leveling range of the three points is the largest and the leveling effect is the best, so as to ensure that there will be no large deviation between the upper and lower sides or the left and right sides during grinding.

[0069] S103. Perform path planning according to the size of the plane to be ground and the radius of the grinding disc to obtain the grinding path.

[0070] In this embodiment, the method can generate a grinding path according to the size of the plane to be ground and the radius of the grinding disc, and further perform error compensation on each point in the grinding path, so that the grinding robot can ensure that the distance between the grinding disc and the wall remains the same during the grinding process (the error range is ±3 mm).

[0071] In this embodiment, the grinding path includes at least one forward path and at least one backward path. The total number of the forward path and the backward path is the same as the number of passes of the multi-pass grinding operation. The forward path and the backward path have opposite directions and are staggered from each other.

[0072] In this embodiment, the forward path starts from the upper left position of the plane to be ground and extends downward in a winding manner to the right side of the plane to be ground; the backward path starts from the lower right position of the plane to be ground and extends upward in a winding manner to the left side of the plane to be ground.

[0073] Please refer to Figure 6 , Figure 6 Fig. shows a schematic diagram of the combined effect of multiple grinding paths. In this figure, path a is the grinding path for the first pass of the grinding operation, path b is the grinding path for the second pass of the grinding operation, and path c is the grinding path for the third pass of the grinding operation.

[0074] S104. The grinding robot controls the leveled grinding disc to perform multi-pass grinding operations based on different grinding parameters along the grinding path.

[0075] In this embodiment, the grinding parameters include the moving speed of the grinding disc and the rotation speed of the grinding disc; in the multi-pass grinding operation, the moving speed increases sequentially, and the rotation speed decreases sequentially.

[0076] In this embodiment, the above multi-pass grinding operation includes a first pass of grinding operation at a first moving speed and a first rotation speed, a second pass of grinding operation at a second moving speed and a second rotation speed, and a third pass of grinding operation at a third moving speed and a third rotation speed; wherein, the first moving speed, the second moving speed, and the third moving speed increase sequentially, and the first rotation speed, the second rotation speed, and the third rotation speed decrease sequentially.

[0077] In this embodiment, the method can be applied to the wall grinding scenario or the ceiling grinding scenario. Among them, only the initial posture of the robotic arm needs to be adjusted in the two scenarios, and the rest of the processes can be executed according to the above steps.

[0078] In the embodiment of the present application, the execution subject of the method can be a computing device such as a computer or a server, and no limitation is made in this embodiment.

[0079] In the embodiment of the present application, the execution subject of the method can also be a smart device such as a smart phone or a tablet computer, and no limitation is made in this embodiment.

[0080] It can be seen that implementing the grinding control method based on a grinding robot described in this embodiment can preferentially determine the plane to be ground that matches the preset grinding task; then control the grinding disc of the grinding robot to perform a leveling operation according to the plane to be ground; then perform path planning according to the size of the plane to be ground and the radius of the grinding disc to obtain a grinding path; finally, the grinding robot controls the leveled grinding disc to perform multiple grinding operations based on different grinding parameters along the grinding path. It can be seen that implementing this implementation method can determine the actual grinding plane according to the actual scenario, and perform the leveling operation and path planning operation of the grinding disc according to the actual plane to be ground, so that the grinding disc of the grinding robot can perform multiple grinding operations based on different grinding parameters along the grinding path, thereby realizing an automatic, accurate, and efficient grinding process, and further improving the overall grinding efficiency.

[0081] Embodiment 2

[0082] Please refer to Figure 2 , Figure 2 which is a schematic flowchart of a grinding control method based on a grinding robot provided by an embodiment of the present application. As Figure 2 shown, the grinding control method based on the grinding robot includes:

[0083] S201. Extract the area to be ground from the received construction site information.

[0084] S202. Divide the area to be ground to obtain multiple planes to be ground.

[0085] S203. Set multiple grinding tasks for the multiple planes to be ground according to the preset working sequence.

[0086] S204. Control the grinding robot to move to the location to be ground that matches the preset grinding task.

[0087] In this embodiment, the grinding robot can automatically move to the location to be ground.

[0088] S205. Control the grinding robot to identify and measure the area to be ground at the location to be ground to obtain the plane to be ground.

[0089] In this embodiment, the method can determine the area to be ground according to the actual scenario to make the grinding position more accurate.

[0090] In this embodiment, this process can be measured and positioned by determining multiple boundary corner points (such as 4) of the plane to be ground, so that the plane to be ground is the plane that really needs to be ground.

[0091] S206. Obtain three boundary corner points of the plane to be ground.

[0092] In this embodiment, the shape of the plane to be polished is not limited; however, the method has better efficiency and effect when polishing a rectangular plane to be polished.

[0093] In this embodiment, the boundary corner point is the corner point of the plane boundary, and this corner point can be an acute angle, an obtuse angle, a right angle or even an arc angle.

[0094] S207. Calculate according to the three boundary corner points to obtain the pitch angle and yaw angle between the polishing disc of the polishing robot and the plane to be polished.

[0095] In this embodiment, the deviation angle between the polishing disc and the plane to be polished can be calculated through the three boundary corner points, which is beneficial to further adjust the angle according to the deviation angle.

[0096] In this embodiment, Figure 4 is a schematic diagram for determining the pitch angle and yaw angle between the polishing disc of a polishing robot provided by an embodiment of the present application and the plane to be polished. In Figure 4 , point S is the position where the laser rangefinder of the polishing robot is located, point A is the upper right boundary corner point of the plane to be polished, point B is the lower right boundary corner point of the plane to be polished, and point C is the lower left boundary corner point of the plane to be polished. By measuring and collecting points through the laser rangefinder, the lengths of SA, SB and SC can be obtained. At the same time, with the assistance of ∠ASB and ∠BSC, all the lengths and widths in the figure can be calculated, so as to determine the distance between the laser rangefinder and the plane to be polished. Then, based on the fixed relationship between the laser rangefinder and the polishing disc, the pitch angle and yaw angle that the polishing disc needs to be adjusted can be determined, so that the polishing disc is parallel to the plane to be polished.

[0097] In this embodiment, please refer to Figure 4 , the method can also determine the parallel plane parallel to the plane ABC according to the positions of the vertical planes between point S and line segment AB and between point S and line segment BC at point S, so as to further determine the pitch angle and yaw angle that the polishing disc needs to be adjusted according to the fixed relationship between the laser rangefinder and the polishing disc, so that the polishing disc is parallel to the plane to be polished.

[0098] In this embodiment, please refer to Figure 4 , the method can also perform proportional interception according to the laser ranging result, so as to determine the adjustment posture of the polishing disc through the relevant theorems of similar triangles, so that the polishing disc is parallel to the plane to be polished.

[0099] S208. Control the polishing disc to perform a leveling operation according to the pitch angle and yaw angle.

[0100] In this embodiment, the adjusted polishing disc can be parallel to the plane to be polished.

[0101] S209. Collect the distance data between the grinding disc and multiple points on the plane to be ground, and adjust the feed rate of the grinding disc based on the distance data.

[0102] In this embodiment, the method can collect the distance data between the grinding disc and the four corner points on the plane to be ground, and adjust the feed rate of the grinding disc based on the distance data.

[0103] S210. Perform path planning according to the size of the plane to be ground and the radius of the grinding disc to obtain the grinding path.

[0104] S211. The grinding robot controls the leveled grinding disc to perform multiple grinding operations based on different grinding parameters along the grinding path.

[0105] Please refer to Figure 5 , Figure 5 , a schematic diagram of the multi-stage grinding effect of a grinding robot is provided. In the figure, the first grinding operation corresponds to the grinding effect in the first stage, the second grinding operation corresponds to the grinding effect in the second stage, and the third grinding operation corresponds to the grinding effect in the third stage.

[0106] In this embodiment, the size of the area covered by the previous grinding in multiple grindings is a preset multiple of the size of the area covered by the subsequent grinding; the preset multiple is greater than one.

[0107] In this embodiment, the first grinding operation is the process of the grinding robot controlling the grinding disc to perform hardened layer grinding.

[0108] In this embodiment, the grinding parameters corresponding to the first grinding operation include: grinding speed 0.18 - 0.22 m / s, grinding rotation speed 900 - 1100 rad / min, two 240-mesh sandpapers, and the grinding track sequence is from left to right and then from top to bottom in turn.

[0109] In this embodiment, the purpose of this process is to remove 80% - 90% of the hardened layer on the surface.

[0110] In this embodiment, the second grinding operation is the first grinding of the edge gradient layer by the grinding robot controlling the grinding disc.

[0111] In this embodiment, the grinding parameters corresponding to the second grinding operation include: grinding speed 0.22 - 0.27 m / s, grinding rotation speed 700 - 800 rad / min, two 240-mesh sandpapers, and the grinding track sequence is opposite to that of the first grinding operation. At the same time, the grinding area of the second grinding operation is 1.04 times larger than that of the first grinding operation.

[0112] In this embodiment, the purpose of this process is to form an edge gradient layer and avoid repeated deepening of the edge.

[0113] In this embodiment, the third grinding operation is for the grinding robot to control the grinding disc to perform the second grinding of the edge gradient layer.

[0114] In this embodiment, the grinding parameters corresponding to the third grinding operation include: a grinding speed of 0.28 - 0.32 m / s, a grinding rotation speed of 350 - 450 rad / min, two 240-mesh sandpapers, and the grinding track sequence is from left to right and then from top to bottom; the grinding area of the third grinding operation is 1.04 times larger than that of the second grinding operation and 1.08 times larger than that of the first grinding operation.

[0115] In this embodiment, the purpose of this process is to form an edge grinding gradient layer again to avoid repeated deepening.

[0116] In this embodiment, when grinding multiple planes to be ground, the multiple planes to be ground need to have overlapping parts so that putty grinding has no omissions.

[0117] In this embodiment, the width of the overlapping part between multiple planes to be ground is 210 mm.

[0118] It can be seen that implementing the grinding control method based on a grinding robot described in this embodiment can determine the actual grinding plane according to the actual scenario, and perform the leveling operation and path planning operation of the grinding disc according to the actual plane to be ground, so that the grinding disc of the grinding robot can perform multiple grinding operations based on different grinding parameters according to the grinding path, thereby realizing an automatic, accurate, and efficient grinding process, and further improving the overall grinding efficiency.

[0119] The above embodiments are described by grinding after putty spraying. However, there is no doubt that after spraying and smearing related operations on working surfaces such as walls and ceilings using other types of decoration and finishing materials other than putty, the grinding control method of this solution can also be applied.

[0120] Embodiment 3

[0121] Please refer to Figure 3 , Figure 3 which is a schematic structural diagram of a grinding control device based on a grinding robot provided by an embodiment of the present application. As Figure 3 shown, the grinding control device based on a grinding robot includes:

[0122] A determination unit 310, configured to determine a plane to be ground that matches a preset grinding task;

[0123] A leveling unit 320, configured to control the grinding disc of the grinding robot to perform a leveling operation according to the plane to be ground;

[0124] A planning unit 330 is configured to perform path planning according to the size of the plane to be polished and the radius of the polishing disc, so as to obtain a polishing path.

[0125] A polishing unit 340 is configured to control the polished polishing disc to perform multiple polishing operations based on different polishing parameters along the polishing path.

[0126] In the embodiments of the present application, the explanation of the polishing control device based on the polishing robot can refer to the description in Embodiment 1 or Embodiment 2, and will not be elaborated herein.

[0127] It can be seen that implementing the polishing control device based on the polishing robot described in this embodiment can determine the actual polishing plane according to the actual scenario, and perform the leveling operation and path planning operation of the polishing disc according to the actual plane to be polished, so that the polishing disc of the polishing robot can perform multi-segment polishing according to the polishing path, thereby realizing an automatic, accurate, and efficient polishing process, and further improving the polishing efficiency and the overall repair efficiency.

[0128] In the embodiments of the present application, the explanation of the polishing control device based on the polishing robot can refer to the description in Embodiment 1 or Embodiment 2, and will not be elaborated herein.

[0129] It can be seen that implementing the polishing control device based on the polishing robot described in this embodiment can determine the actual polishing plane according to the actual scenario, and perform the leveling operation and path planning operation of the polishing disc according to the actual plane to be polished, so that the polishing disc of the polishing robot can perform multi-segment polishing according to the polishing path, thereby realizing an automatic, accurate, and efficient polishing process, and further improving the polishing efficiency and the overall repair efficiency.

[0130] The embodiments of the present application provide an electronic device, including a memory and a processor. The memory is used to store a computer program, and the processor runs the computer program to enable the electronic device to execute any one of the polishing control methods based on the polishing robot in Embodiment 1 or Embodiment 2 of the present application.

[0131] The embodiments of the present application provide a computer-readable storage medium, which stores computer program instructions. When the computer program instructions are read and run by a processor, they execute any one of the polishing control methods based on the polishing robot in Embodiment 1 or Embodiment 2 of the present application.

[0132] In several embodiments provided in this application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of this application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0133] In addition, each functional module in various embodiments of this application can be integrated together to form an independent part, or each module can exist alone, or two or more modules can be integrated to form an independent part.

[0134] If the said function is implemented in the form of a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of this application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0135] The above are only examples of the present application and are not used to limit the protection scope of the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application. It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0136] As described above, this is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, and all such changes or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0137] It should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

Claims

1. A grinding control method based on a grinding robot, characterized in that, The method includes: Determine a plane to be polished that matches a preset polishing task; Control the polishing disc of the polishing robot to perform a leveling operation according to the plane to be polished; Perform path planning based on the size of the plane to be polished and the radius of the polishing disc to obtain a polishing path; The polishing robot controls the leveled polishing disc to perform multiple polishing operations based on different polishing parameters along the polishing path; the polishing parameters include the moving speed of the polishing disc and the rotation speed of the polishing disc; in the multiple polishing operations, the moving speed increases sequentially, and the rotation speed decreases sequentially; Among them, the multiple polishing operations include a first polishing operation at a first moving speed and a first rotation speed, a second polishing operation at a second moving speed and a second rotation speed, and a third polishing operation at a third moving speed and a third rotation speed; among them, the first moving speed, the second moving speed, and the third moving speed increase sequentially, and the first rotation speed, the second rotation speed, and the third rotation speed decrease sequentially.

2. The grinding control method according to claim 1, wherein The polishing path includes at least one forward path and at least one backward path, and the total number of the forward path and the backward path is the same as the number of passes of the multiple polishing operations. The forward path and the backward path have opposite directions and are staggered from each other.

3. The grinding control method according to claim 2, wherein, The forward path starts from the upper left position of the plane to be polished and extends downward in a winding manner to the right side of the plane to be polished; the backward path starts from the lower right position of the plane to be polished and extends upward in a winding manner to the left side of the plane to be polished.

4. The grinding control method according to claim 1, characterized in that The size of the area covered by the latter polishing in the multiple polishings is a preset multiple of the size of the area covered by the previous polishing; the preset multiple is greater than one.

5. The grinding control method according to claim 1, characterized in that The step of determining a plane to be polished that matches a preset polishing task includes: Control the polishing robot to move to a location to be polished that matches a preset polishing task; Control the polishing robot to identify and measure the area to be polished at the location to be polished to obtain a plane to be polished.

6. The grinding control method according to claim 1, characterized in that The step of controlling the polishing disc of the polishing robot to perform a leveling operation according to the plane to be polished includes: Obtain three boundary corner points of the plane to be polished; Calculate based on the three boundary corner points to obtain the pitch angle and yaw angle between the polishing disc of the polishing robot and the plane to be polished; Control the polishing disc to perform a leveling operation according to the pitch angle and the yaw angle.

7. The grinding control method according to claim 1, characterized in that The method further includes: Extract the area to be polished from the received construction site information; Perform area division on the area to be polished to obtain multiple planes to be polished; Set multiple polishing tasks for the multiple planes to be polished according to a preset working order.

8. The grinding control method according to claim 1, wherein After the step of controlling the polishing disc of the polishing robot to perform a leveling operation according to the plane to be polished, the polishing control method further includes: Collect the distance data between the polishing disc and multiple points on the plane to be polished, and adjust the feed amount of the polishing disc based on the distance data.

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