Display panel detection method and display device

Abstract

This application discloses a display panel inspection method and display device, comprising the following steps: providing a display panel to be inspected, the display panel comprising a first substrate and a second substrate disposed opposite each other; disposing a detection circuit on the first substrate, the detection circuit and a bonding circuit on the first substrate being located on opposite sides of the first substrate; pressing the detection circuit and the bonding circuit together for inspection; and removing the detection circuit. The technical effect of this application is that the bonding circuit is avoided from being cut when the detection circuit is cut, thereby reducing the risk of short circuits and improving the yield of the display device.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a detection method for a display panel and a display device. Background Art

[0002] With the development of display technology, users' demand for display screen-to-body ratio is becoming more and more obvious, resulting in full-screen displays becoming more and more popular among users. Full-screen is a relatively broad definition in the industry for the design of ultra-high screen-to-body ratio display screens, pursuing a screen-to-body ratio close to 100%.

[0003] In order to increase the screen-to-body ratio of display devices, the four borders of the display screen need to adopt ultra-narrow borders or borderless designs. When ultra-narrow borders or borderless designs are adopted, when testing the circuits on the display device, an external detection circuit is generally used to detect the front-end production of the screen, such as Figure 1 As shown, the detection circuit 120 and the bonding circuit 110 are located on the same side of the first substrate 100. After testing, the detection circuit must be removed using a cutting jig 400. Due to factors such as the ultra-narrow frame, cutting paths, and process precision, the metal wires of the bonding circuit can be easily cut when cutting the circuit metal wires and the screen body, causing problems such as metal shorts. This can lead to display anomalies that cannot be repaired, significantly reducing the yield of the display device. Summary of the Invention

[0004] The purpose of this application is to provide a display panel detection method and a display device, which can solve the technical problems of the existing display device circuit detection process that easily causes bonding circuit short circuit and low display device yield.

[0005] To achieve the above-mentioned purpose, the present application provides a method for detecting a display panel, comprising the following steps: providing a display panel to be detected, wherein the display panel includes a first substrate and a second substrate arranged opposite to each other; arranging a detection circuit on the first substrate, wherein the detection circuit and the bonding circuit on the first substrate are located on opposite side surfaces of the first substrate; pressing the detection circuit and the bonding circuit for detection; and cutting off the detection circuit.

[0006] Furthermore, the orthographic projection of the second substrate on the first substrate covers a portion of the first substrate; and the detection circuit is arranged at the periphery of the orthographic projection of the second substrate on the first substrate.

[0007] Furthermore, the detection circuit and the bonding circuit have no overlapping areas on their orthographic projections on the first substrate.

[0008] Furthermore, in the step of pressing the detection circuit and the bonding circuit for detection, the detection circuit and the bonding circuit are electrically connected via a detection jig; one end of the detection jig is pressed onto the bonding circuit, and the other end thereof is pressed onto the detection circuit.

[0009] Furthermore, after the step of pressing the detection circuit and the bonding circuit together for detection, the display panel detection method further includes: removing the detection jig to disconnect the detection circuit from the bonding circuit.

[0010] Furthermore, in the step of cutting off the detection circuit, the first substrate covered by the detection circuit is cut off, and the detection circuit is cut off at the same time.

[0011] Furthermore, the detection circuit is provided on a surface of the first substrate away from the second substrate, and the bonding circuit is provided on a surface of the first substrate close to the second substrate.

[0012] Furthermore, before the step of providing the detection circuit on the first substrate, the display panel detection method further includes: cutting and removing an edge portion of the second substrate to expose the bonding circuit on the first substrate.

[0013] To achieve the above-mentioned objectives, the present application further provides a display device, which is manufactured after being inspected using the display panel inspection method as described above.

[0014] Furthermore, the display device is one of a liquid crystal display device, a flexible OLED display device, and a rigid OLED display device.

[0015] The technical effect of this application is that the detection circuit and bonding circuit of the display panel are arranged on different two side surfaces of the substrate, while ensuring that there is no overlapping part in the vertical position, staggering the cutting position, and ensuring that the metal wires on the bonding circuit will not be damaged when cutting and removing the detection circuit, avoiding the problem of circuit short circuit and improving the production yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the detection circuit structure of a display panel in the prior art;

[0018] Figure 2is a flow chart of a display panel detection method provided in an embodiment of the present application;

[0019] Figure 3 This is a schematic diagram of the structure of the display panel before detection provided by an embodiment of the present application;

[0020] Figure 4 This is a schematic diagram of the structure of the detection fixture after installation provided by the embodiment of the present application;

[0021] Figure 5 This is a schematic diagram of the structure of the cutting detection circuit provided in an embodiment of the present application;

[0022] Figure 6 3 is a schematic diagram of the structure of the display panel after detection provided in an embodiment of the present application.

[0023] Description of reference numerals:

[0024] 100. First substrate; 200. Second substrate; 300. Detection fixture; 400. Cutting fixture;

[0025] 110, bonding circuit; 120, detection circuit;

[0026] 310. Circuit layer. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0028] like Figures 2 to 6 As shown, the embodiments of the present application provide a display panel detection method and a display device. Detailed descriptions are given below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0029] like Figure 2 As shown, an embodiment of the present application provides a method for detecting a display panel, including the following steps S1 to S5.

[0030] S1 provides a display panel to be tested, which includes a first substrate 100 and a second substrate 200 arranged opposite to each other. The edges of the two substrates are set flush. A bonding circuit 110 is provided on the side of the first substrate 100 close to the second substrate 200. First, a portion of the substrate at the edge of the second substrate 200 is cut and removed. After the second substrate 200 is cut, the orthographic projection of the second substrate 200 on the first substrate 100 only covers a portion of the first substrate 100, exposing the bonding circuit 110 to facilitate subsequent circuit testing.

[0031] S2: A detection circuit 120 is provided on the first substrate 100. The detection circuit 120 and the bonding circuit 110 on the first substrate 100 are located on two opposite sides of the first substrate 100, that is, the detection circuit 120 is provided on the side (lower surface) of the first substrate 100 away from the second substrate 200. The orthographic projections of the detection circuit 120 and the bonding circuit 110 on the first substrate 100 do not overlap, and the detection circuit 120 is provided on the periphery of the orthographic projection of the second substrate 200 on the first substrate 100 (see Figure 3 ), so as not to damage the bonding circuit 110 during the subsequent cutting process, thereby avoiding problems such as short circuit in the bonding circuit 110.

[0032] S3 presses the detection circuit 120 and the bonding circuit 110 together for detection. Specifically, the detection circuit 120 and the bonding circuit 110 are electrically connected through a detection fixture 300 (see Figure 4 The detection jig 300 is also provided with a circuit layer 310, which is provided on the inner side surfaces of both ends of the detection jig 300. One end of the detection jig 300 is pressed onto the bonding circuit 110, and the other end is pressed onto the detection circuit 120. Specifically, the two circuit layers 310 are respectively attached to the detection circuit 120 and the bonding circuit 110. At the same time, the detection jig 300 is not like the attached Figure 4 The simple component shown in the figure is only a schematic diagram. In actual use, it is a complete detection device. The circuit connection is not described in detail in this embodiment. It only shows how the detection fixture 300 performs detection after the detection circuit 120 is set behind the first substrate 100. In this embodiment, the detection fixture 300 in the detection device needs to be adjusted accordingly. Figure 1 The detection circuit 120 and the bonding circuit 110 are arranged on the same side and are now arranged on both sides of the first substrate 100. Accordingly, the detection fixture 300 also needs to be improved to adapt to the technical solution in this application.

[0033] S4 After the detection is completed, the detection fixture 300 is removed. The removal of the detection fixture 300 disconnects the electrical connection between the detection circuit 120 and the bonding circuit 110 .

[0034] S5: Cut off the detection circuit 120. Specifically, use a cutting tool 400 to cut off the portion of the first substrate 100 covered by the detection circuit 120, and at the same time cut off the detection circuit 120 (see Figure 5 ), the cutting jig 400 is a laser cutting jig or a wheel cutting jig. As mentioned above, the orthographic projections of the detection circuit 120 and the bonding circuit 110 on the first substrate 100 do not overlap, and the spacing between the two orthographic projections is adjustable and can be adjusted as needed to ensure that there is no vertical intersection. This is equivalent to staggering the cutting positions. Therefore, the metal wires on the bonding circuit 110 will not be damaged during the cutting process, naturally preventing circuit short circuits and improving the yield of the display panel.

[0035] The technical effect of the method for preparing the display panel described in this embodiment is that the detection circuit and the bonding circuit of the display panel are arranged on two different sides of the substrate, while ensuring that there is no overlapping part in the longitudinal position, staggering the cutting position, and ensuring that the metal wires on the bonding circuit are not damaged when cutting and removing the detection circuit, avoiding the problem of circuit short circuit, and improving the preparation yield of the display panel.

[0036] like Figure 6 As shown, this embodiment provides a display device manufactured after undergoing the above-described circuit testing. The display device is one of a liquid crystal display, a flexible OLED display, and a rigid OLED display. The first substrate 100 and the second substrate 200 in these display devices may differ somewhat. For example, in a liquid crystal display, the first substrate 100 is an array substrate, and the second substrate 200 is a color filter substrate, with components such as liquid crystal, spacers, and sealant interposed between them. In an OLED display, the first substrate 100 is the base substrate beneath the thin-film transistors. In a flexible OLED display, it is a flexible substrate layer, such as a flexible PI layer, while in a rigid OLED display, it is a glass substrate. Accordingly, the position of the bonding circuit 110 thereon may vary slightly due to different packaging methods, but its general position remains constant, being located at the edge of the first substrate 100. Consequently, the position of the detection circuit 120 also remains constant. Therefore, the above-described detection method can be used to detect these types of display devices and all fall within the scope of protection of this application.

[0037] The above is a detailed introduction to a display panel detection method and a display device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for detecting a display panel, characterized in that: The following steps are involved: Providing a display panel to be inspected, the display panel comprising a first substrate and a second substrate disposed opposite to each other; A detection circuit is provided on the first substrate, wherein the detection circuit and the bonding circuit on the first substrate are located on two opposite sides of the first substrate; Pressing the detection circuit and the bonding circuit together for detection; as well as cutting off the detection circuit; The detection circuit is provided on a surface of the first substrate away from the second substrate, and the bonding circuit is provided on a surface of the first substrate close to the second substrate; The orthographic projections of the detection circuit and the bonding circuit on the first substrate have no overlapping area.

2. The display panel detection method according to claim 1, wherein: The orthographic projection of the second substrate on the first substrate covers a portion of the first substrate; The detection circuit is arranged at the periphery of the orthographic projection of the second substrate on the first substrate.

3. The display panel detection method according to claim 1, wherein: In the step of pressing the detection circuit and the bonding circuit together for detection, The detection circuit is electrically connected to the bonding circuit via a detection fixture; One end of the detection fixture is pressed onto the bonding circuit, and the other end is pressed onto the detection circuit.

4. The display panel detection method according to claim 3, wherein: After the step of pressing the detection circuit and the bonding circuit together for detection, the method further includes: The detection fixture is removed to disconnect the detection circuit from the bonding circuit.

5. The display panel detection method according to claim 1, wherein: In the step of cutting off the detection circuit, The first substrate covered by the detection circuit is removed, and the detection circuit is removed at the same time.

6. The display panel detection method according to claim 1, wherein: Before the step of providing a detection circuit on the first substrate, the display panel detection method further includes: The edge portion of the second substrate is cut and removed to expose the bonding circuit on the first substrate.

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