Dual color LED package structure and method

Abstract

A dual-color LED packaging structure and method, comprising a substrate, a first LED chip, a second LED chip, a dike and a fluorescent glue layer, the first LED chip and the second LED chip are both flip chips, the top of the second LED chip is provided with a transparent light guide block, the dike is provided with a first glue layer covering the first LED chip, the top of the second LED chip is higher than the first glue layer, and the first glue layer is provided with a second glue layer covering the second LED chip. The height of the second LED chip is increased by the transparent light guide block, that is, the top light emitting surface of the second LED chip is higher than the top light emitting surface of the first LED chip, after filling the first glue layer and the second glue layer, the first LED chip can excite the first glue layer, and the second LED chip can excite the second glue layer, so that the control of two color temperatures is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED, in particular to a dual-color LED packaging structure and method. BACKGROUND

[0002] Dual-color LED generally controls different chips to emit light, excites different colloids to produce different color temperature light, and realizes intelligent control of color temperature. For example, a dual-color COB light source disclosed in Chinese Patent No. CN214956879U includes a substrate, a cofferank arranged on the substrate, a first blue light LED chip arranged on the substrate in an inverted manner, and a second blue light LED chip arranged on the substrate in an inverted manner. The first blue light LED chip and the second blue light LED chip are arranged in the cofferank. The top of the first blue light LED chip is provided with a first phosphor layer. The top of the first phosphor layer is provided with a second phosphor layer. The second phosphor layer is arranged at the opening of the cofferank, and the edge of the second phosphor layer extends to the inner wall of the cofferank and is bonded with the inner wall of the cofferank. The second phosphor layer is arranged in a spaced manner with the second blue light LED chip. No phosphor layer is arranged between the second phosphor layer and the second blue light LED chip. The color temperature of the second phosphor layer is higher than that of the first phosphor layer. The first blue light LED chip and the second blue light LED chip are vertical structure chips, and the light emitting surface of the vertical structure chip is the top surface. This kind of dual-color COB needs to form a first phosphor layer on the top of the first blue light chip first, then fill a transparent adhesive layer, and finally form a second phosphor layer. This kind of packaging process is relatively complex. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a dual-color LED packaging structure and method, which are simpler in packaging structure and packaging process.

[0004] To solve the above technical problems, the technical solution of the present application is as follows: a dual-color LED packaging structure, comprising a substrate, a first LED chip, a second LED chip, a cofferank, and a phosphor adhesive layer. The first LED chip and the second LED chip are both inverted chips. The top of the second LED chip is provided with a transparent light guide block. The cofferank is provided with a first colloid layer covering the first LED chip. The top of the second LED chip is higher than the top of the first LED chip. The first colloid layer is provided with a second colloid layer covering the second LED chip. The height of the second LED chip is increased by the transparent light guide block, i.e. the top light emitting surface of the second LED chip is higher than the top light emitting surface of the first LED chip. After filling the first colloid layer and the second colloid layer, the first LED chip can excite the first colloid layer, and the second LED chip can excite the second colloid layer, thereby realizing control of two color temperatures.

[0005] As an improvement, the transparent light guide block is formed by organic silicone adhesive or a substrate layer of the second LED chip without thinning.

[0006] As an improvement, the first LED chip and the second LED chip are staggered.

[0007] As an improvement, the first glue layer is a warm color temperature glue mixed with fluorescent powder or transparent glue.

[0008] As an improvement, the second glue layer is a high color temperature glue.

[0009] The packaging method comprises the following steps:

[0010] (1) fixing the first LED chip and the second LED chip on the substrate;

[0011] (2) forming a cofferdam on the substrate to enclose the first LED chip and the second LED chip, and the enclosed area is a functional area;

[0012] (3) filling the first glue in the cofferdam, the first glue completely covers the first LED chip, and the transparent light guide block on the top of the second LED chip is exposed outside the first glue;

[0013] (4) baking and curing the first glue;

[0014] (5) filling the second glue on the first glue layer in the cofferdam, the second glue completely covers the second LED chip, and the surface of the second glue is flat;

[0015] (6) baking to complete the curing of the first glue and the second glue.

[0016] Compared with the prior art, the present application has the following beneficial effects:

[0017] The present application increases the height of the second LED chip through the transparent light guide block, that is, the top light emitting surface of the second LED chip is higher than that of the first LED chip, and after filling the first glue layer and the second glue layer, the first LED chip can excite the first glue layer, and the second LED chip can excite the second glue layer, realizing the control of two color temperatures; since the transparent light guide block is integrated on the second LED chip, the packaging process can be simplified during packaging. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a packaging structure schematic diagram.

[0019] Figure 2 is a packaging process flow chart. DETAILED DESCRIPTION

[0020] The present application will be further described below in conjunction with the drawings of the specification.

[0021] As Figure 1As shown in the figure, a double-color LED packaging structure includes a substrate 1, a first LED chip 4, a second LED chip 7, a coffer 2 and a fluorescent glue layer. A white coffer 2 is formed on the substrate 1 to form a circular functional area, and the first LED chip 4 and the second LED chip 7 are arranged in the functional area. In order to make the mixed light more uniform, the first LED chip 4 is staggered with the second LED chip 7. The first LED chip 4 and the second LED chip 7 are both flip chips, the first LED chip 4 is a normal blue light chip, and the top of the second LED chip 7 is provided with a transparent light guide block 6, which is higher than the first LED chip 4. The transparent light guide block 6 is formed by an organic silicone glue or a substrate layer of the second LED chip 7 which is not thinned, that is, the transparent light guide block 6 is part of the second LED chip 7. The coffer 2 is provided with a first glue layer 5 covering the first LED chip 4, and the top of the second LED chip 7 is higher than the first glue layer 5, and the light emitted by the first LED chip 4 excites the first glue layer 5. The first glue layer 5 is a warm color temperature glue mixed with fluorescent powder or transparent glue. The first glue layer 5 is provided with a second glue layer 3 covering the second LED chip 7, and the second glue layer 3 is in close contact with the first glue layer 5. The second glue layer 3 is a high color temperature glue.

[0022] As Figure 2 shown, the packaging method of the present application comprises the following steps:

[0023] (1) fixing the first LED chip 4 on the substrate 1;

[0024] (2) fixing the second LED chip 7 on the substrate 1;

[0025] (3) forming a coffer 2 on the substrate 1 to enclose the first LED chip 4 and the second LED chip 7, and the enclosed area is a functional area;

[0026] (4) filling the first glue in the coffer 2, the first glue completely covers the first LED chip 4, and the transparent light guide block 6 on the top of the second LED chip 7 is exposed outside the first glue;

[0027] (5) baking and curing the first glue;

[0028] (6) filling the second glue on the first glue layer 5 in the coffer 2, the second glue completely covers the second LED chip 7, and the surface of the second glue is flat;

[0029] (7) baking to complete the curing of the first glue and the second glue.

[0030] The application increases the height of the second LED chip 7 through the transparent light guide block 6, that is, the top light emitting surface of the second LED chip 7 is higher than the top light emitting surface of the first LED chip 4, after filling the first glue layer 5 and the second glue layer 3, the first LED chip 4 can excite the first glue layer 5, and the second LED chip 7 can excite the second glue layer 3, so that the control of two color temperatures is realized; since the transparent light guide block 6 is integrated on the second LED chip 7, the packaging process can be simplified during packaging.

Claims

1. A dual-color LED packaging structure, comprising a substrate, a first LED chip, a second LED chip, a dike and a fluorescent glue layer, characterized in that: The first LED chip and the second LED chip are flip chips, the top of the second LED chip is provided with a transparent light guide block, the cofferdam is provided with a first gel layer covering the first LED chip, the top of the second LED chip is higher than the first gel layer, and the first gel layer is provided with a second gel layer covering the second LED chip. 2.The dual-color LED package structure of claim 1, wherein: The transparent light guide block is formed by silicone glue or a substrate layer of the second LED chip without thinning.

3. The dual-color LED package structure of claim 1, wherein: The first LED chip and the second LED chip are distributed staggeredly.

4. The dual-color LED package structure of claim 1, wherein: The first gel layer is a warm color temperature gel mixed with fluorescent powder or transparent glue.

5. The dual-color LED package structure of claim 1, wherein: The second gel layer is high color temperature glue.

6. A packaging method of the dual-color LED package structure according to claim 1, wherein, The method comprises the following steps: (1) fixing the first LED chip and the second LED chip on a substrate; (2) forming a cofferdam on the substrate to enclose the first LED chip and the second LED chip, and the enclosed area is a functional area; (3) filling a first gel in the cofferdam, the first gel covering the first LED chip completely, and the transparent light guide block on the top of the second LED chip being exposed outside the first gel; (4) baking and curing the first gel; (5) filling a second gel on the first gel layer in the cofferdam, the second gel covering the second LED chip completely, and the surface of the second gel being flat; (6) baking to complete the curing of the first gel and the second gel.

7. The packaging method of the dual-color LED packaging structure according to claim 6, characterized in that: The transparent light guide block is formed by silicone glue or a substrate layer of the second LED chip without thinning.

8. The packaging method of the dual-color LED packaging structure according to claim 6, wherein: The first gel layer is a warm color temperature gel mixed with fluorescent powder or transparent glue.

9. The packaging method of the dual-color LED packaging structure according to claim 6, wherein: The second gel layer is high color temperature glue.

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