Light-emitting module and display device

Abstract

An embodiment of the present disclosure provides a light-emitting module and a display device, which may include: a substrate, at least one light-emitting element located on one side of the substrate, and a first light-evening component and a reflective layer arranged on the light-emitting side of the light-emitting element; wherein the first light-evening component is configured to make the light emitted by the light-emitting element uniformly incident on the reflective layer; and the reflective layer is configured to reflect the light incident on the reflective layer in a direction away from the light-emitting side of the light-emitting element.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to, but are not limited to, the field of display technology, and in particular to a light-emitting module and a display device. Background Art

[0002] Current backlight modules primarily use light-emitting diodes (LEDs) as their light source. Direct-lit backlight modules typically require more film layers and a longer optical distance (OD) for uniform light distribution, resulting in thicker and more expensive modules. Summary of the Invention

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] The embodiments of the present disclosure mainly provide the following technical solutions:

[0005] In a first aspect, an embodiment of the present disclosure provides a light-emitting module, comprising: a substrate, at least one light-emitting element located on one side of the substrate, and a first light-uniformity component and a reflective layer arranged on the light-emitting side of the light-emitting element; wherein the first light-uniformity component is configured to make the light emitted by the light-emitting element uniformly incident on the reflective layer; and the reflective layer is configured to reflect the light incident on the reflective layer in a direction away from the light-emitting side of the light-emitting element.

[0006] In a second aspect, an embodiment of the present disclosure provides a display module, comprising: a display panel and the above-mentioned light-emitting module, wherein the display panel is arranged on a side away from the light-emitting side of the light-emitting element.

[0007] The light-emitting module and display device provided by the embodiments of the present disclosure may include: a substrate, at least one light-emitting element located on one side of the substrate, and a first light-homogenizing component and a reflective layer arranged on the light-emitting side of the light-emitting element; wherein the first light-homogenizing component is configured to make the light emitted by the light-emitting element uniformly incident on the reflective layer; and the reflective layer is configured to reflect the light incident on the reflective layer in a direction away from the light-emitting side of the light-emitting element. In this way, on the one hand, the light-emitting element emits light downward, which is reflected by the reflective layer arranged on one side of the first light-homogenizing component, and the thickness of the substrate can be effectively utilized to achieve a uniform light path. In this way, the use of a diffuser can be omitted, thereby reducing the thickness of the backlight module; on the other hand, the light emitted by the light-emitting element is dispersed by the first light-homogenizing component to achieve uniform light emission, which can improve the uniformity of the light emitted from the light-emitting surface while increasing the utilization of the light energy of the light-emitting element and improving the backlight efficiency.

[0008] Other features and advantages of the present disclosure will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present disclosure. Other advantages of the present disclosure can be realized and obtained through the solutions described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings are intended to facilitate understanding of the technical solutions of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solutions of the present disclosure and do not constitute a limitation of the technical solutions of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual scale and are intended only to illustrate the contents of the present disclosure.

[0010] Figure 1A Schematic diagram of the light output of a Lambertian light source;

[0011] Figure 1B Schematic diagram of the coverage area of the mini-LED light source emitting upward light;

[0012] Figure 2 This is a schematic diagram of the first structure of the light-emitting module in the embodiment of the present disclosure;

[0013] Figure 3 Schematic diagram of the coverage area of the mini-LED light source emitting downward light;

[0014] Figure 4 Schematic diagram of the second structure of the light-emitting module in the embodiment of the present disclosure;

[0015] Figure 5 Schematic diagram of the third structure of the light-emitting module in the embodiment of the present disclosure;

[0016] Figure 6 Schematic diagram of the fourth structure of the light-emitting module in the embodiment of the present disclosure;

[0017] Figure 7 Schematic diagram of the distribution design of the transmission and reflection control area in the embodiment of the present disclosure;

[0018] Figure 8 Schematic diagram of the relationship between the thickness of the metal routing layer and the duty cycle in the embodiment of the present disclosure;

[0019] Figure 9A A schematic diagram of a transflective control area in an embodiment of the present disclosure;

[0020] Figure 9B is another schematic diagram of the transflection control area in the embodiment of the present disclosure;

[0021] Figure 10A Schematic diagram of the fifth structure of the light-emitting module in the embodiment of the present disclosure;

[0022] Figure 10B Schematic diagram of the sixth structure of the light-emitting module in the embodiment of the present disclosure;

[0023] Figure 10C Schematic diagram of the seventh structure of the light-emitting module in the embodiment of the present disclosure;

[0024] Figure 11A Schematic diagram of an eighth structure of the light-emitting module in the embodiment of the present disclosure;

[0025] Figure 11B Schematic diagram of the ninth structure of the light-emitting module in the embodiment of the present disclosure;

[0026] Figure 11C 10th structural diagram of the light-emitting module in the embodiment of the present disclosure;

[0027] Figure 11D This is an eleventh structural diagram of the light-emitting module in the embodiment of the present disclosure;

[0028] Figure 12 : is a diagram showing the light uniforming effect of the microlens array with different duty ratios in the embodiment of the present disclosure;

[0029] Figure 13A is a structural schematic diagram of a microstructure in an embodiment of the present disclosure;

[0030] Figure 13B is another structural schematic diagram of the microstructure in an embodiment of the present disclosure;

[0031] Figure 13C is another structural schematic diagram of the microstructure in the embodiment of the present disclosure;

[0032] Figure 14A Schematic diagram of an arrangement of mini-LED light sources in an embodiment of the present disclosure;

[0033] Figure 14B Schematic diagram of another arrangement of mini-LED light sources in an embodiment of the present disclosure;

[0034] Figure 15 Schematic diagram of reflection when the first light homogenizing component and the reflective layer are realized by using a foamed white reflective film in an embodiment of the present disclosure.

[0035] Description of reference numerals:

[0036] 10-light-emitting element; 11-substrate; 12-encapsulation layer;

[0037] 13-first light-homogenizing component; 14-reflecting layer; 15-second light-homogenizing component;

[0038] 16-semi-transparent and semi-reflective film; 17-metal wiring layer; 18-microlens array;

[0039] 19-Reflective film. DETAILED DESCRIPTION

[0040] A number of embodiments are described herein, but this description is illustrative and not restrictive, and more embodiments and implementations may be included within the scope of the embodiments described herein. Although many possible feature combinations are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with any other feature or element in any other embodiment, or may replace any other feature or element in any other embodiment.

[0041] When describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps in the specific order described. As one of ordinary skill in the art will understand, other orders of steps are also possible. Therefore, the specific order of the steps set forth in the specification should not be interpreted as a limitation on the claims. In addition, the claims to the method and / or process should not be limited to performing their steps in the order written, and those skilled in the art can readily understand that these orders can be changed and still remain within the spirit and scope of the disclosed embodiments.

[0042] Unless otherwise defined, the technical or scientific terms used in the embodiments of the present disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which the invention belongs. The words "first", "second" and similar terms used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0043] The term "about" in the embodiments of the present disclosure refers to a numerical value that is not strictly limited and allows for process and measurement errors.

[0044] Traditional backlight modules typically include the following components: a substrate and associated driver circuitry, an LED light source, an LED encapsulation layer, a quantum dot (QD) film, a first diffuser, two orthogonal prism layers, and a second diffuser. To achieve uniform light output, multiple diffusers are typically required, increasing the overall thickness of the backlight module and significantly impacting overall light output efficiency. Furthermore, traditional LED chips emit light upward, resulting in a limited coverage area per lamp. This requires a larger number of chips to ensure adequate coverage of the light-emitting surface, significantly increasing the backlight cost of large-scale display devices and impacting overall volume and cost control.

[0045] Mini-LED light sources have smaller chip sizes and broad application prospects. Mini-LED light sources are used in backlight modules. Due to the high operability of each chip and the high precision of the coverage area, operations such as regional lighting can be realized, which can improve the controllability of the backlight module. However, in direct-type backlight modules, a larger number of light sources are usually required, and more film layer structures and a higher light mixing distance are required to achieve a high uniformity effect, which will cause the thickness of the Mini LED direct-type backlight module to be relatively thick. This limits the lightweight design of Mini-LED light sources as backlight module applications, and also brings the problem of high cost.

[0046] Figure 1A is a schematic diagram of the light output of a Lambertian light source, as shown in Figure 1A As shown, a typical LED light source (e.g., a mini-LED light source) is a Lambertian light source (solid line in FIG1 ), and its energy distribution is shown in formula (1):

[0047] I θ =I0cosθ formula (1).

[0048] As shown in Figure 1, because the LED light source is encapsulated in a light-emitting module, only the energy within a + / -40° radiation angle range can be utilized. Light beams outside this range are confined to the LED structure due to total internal reflection. Furthermore, light emitted within this + / -40° radiation angle concentrates approximately 61% of the LED light source's energy.

[0049] Figure 1B This is a schematic diagram of the coverage of the mini-LED light source emitting upward light, such as Figure 1B As shown, within the mini-LED luminous range, after passing through an optical medium with a thickness of t, the width (or diameter) L1 of the area that the mini-LED light source can radiate can be expressed as follows:

[0050] L1=2×D+l=2×t×tanθ+l Formula (2);

[0051] In formula (2), θ represents the total reflection angle of the optical medium to the mini-LED light, l represents the chip length of the mini-LED light source, D represents the coverage range of the mini-LED edge light within the total reflection angle range, and L1 represents the coverage diameter of the light emitted on the surface of the optical medium when the mini-LED chip emits light upward (that is, the width of the area that the mini-LED light source can radiate).

[0052] For example, taking the optical medium as glass with a thickness of 0.5mm and a refractive index of 1.52, and the chip length of the mini-LED light source as 100μm, within the usable range of the mini-LED radiation light, the light emitted by the mini-LED is transmitted through the glass. When the light is coupled out of the glass to the air, the above formula (2) can be used to calculate L1 = 0.969mm (i.e., the coverage range of the light spot with a diameter of approximately 1mm). In order to achieve backlight uniformity, traditional backlight modules need to design the mini-LED chip arrangement accordingly. For large-size display devices, such as 65-inch monitors (where the AA area is 1430mm×840mm), at least 1.28 million mini-LED chips are required to achieve light uniformity and brightness, which brings about the problem of high cost. Furthermore, to improve light uniformity, traditional backlight modules also employ diffusers of a certain thickness. For example, the mini-LED backlight modules used in some 65-inch 4K displays utilize a 2mm-thick diffuser to achieve backlight uniformity, bringing the backlight module thickness to approximately 3.85mm. This thick diffuser significantly hinders the thinning of display devices, making it impractical for thin and lightweight displays.

[0053] The present disclosure provides a light-emitting module that can achieve high uniformity, high light efficiency, low optical density (OD), low thickness, and a low number of light-emitting elements. The module can be widely used in backlight modules for display devices requiring large size and low thickness.

[0054] In an exemplary embodiment, the light-emitting module may include: a substrate, at least one light-emitting element located on one side of the substrate, and a first light-homogenizing component and a reflective layer arranged on the light-emitting side of the light-emitting element; wherein the first light-homogenizing component is configured to make the light emitted by the light-emitting element evenly incident on the reflective layer; and the reflective layer is configured to reflect the light incident on the reflective layer in a direction away from the light-emitting side of the light-emitting element. In this way, the light-emitting element emits light downward, which is reflected by the reflective layer arranged on one side of the first light-homogenizing component. The thickness of the substrate can be effectively utilized to achieve a uniform light path, and the use of a diffuser structure in the light-emitting module can be eliminated, so that the thickness of the light-emitting module can be reduced, thereby reducing costs. By using the first light-homogenizing component to scatter the light and using the reflective layer of the first light-homogenizing component to destroy the total reflection waveguide effect, a highly uniform light-emitting effect can be achieved, the amount of light collected can be increased, and the light-collecting efficiency of the light-emitting module can be improved.

[0055] In an exemplary embodiment, the light-emitting module may further include: an encapsulation layer, wherein the encapsulation layer and the substrate are respectively located on both sides of the light-emitting element. In this way, by using the thickness of the substrate and the light source encapsulation structure as the uniform light path, the use of a diffusion sheet structure in the light-emitting module can be eliminated, and the thickness of the light-emitting module can be more effectively reduced, thereby reducing costs. By using the first uniform light component to scatter the light, and using the reflective layer of the first uniform light component to destroy the total reflection waveguide effect, a highly uniform light output effect can be achieved, the amount of light collected can be increased, and the light collection efficiency of the light-emitting module can be improved.

[0056] For example, when the encapsulation layer is located on the light-emitting side of the light-emitting element and the substrate is located on the side away from the light-emitting side of the light-emitting element, the reflective layer is configured to reflect the light incident on the reflective layer toward the direction away from the light-emitting side (i.e., toward the direction close to the substrate) and emit from the substrate; or, when the substrate is located on the light-emitting side of the light-emitting element and the encapsulation layer is located on the side away from the light-emitting side of the light-emitting element, the reflective layer is configured to reflect the light incident on the reflective layer toward the direction away from the light-emitting side (i.e., toward the direction close to the encapsulation layer) and emit from the encapsulation layer.

[0057] In an exemplary embodiment, the light-emitting module may further include: a second light-homogenizing component, which is arranged on a side away from the light-emitting side of the light-emitting element, and is configured to homogenize the light emitted from the substrate when the substrate is located on a side away from the light-emitting side of the light-emitting element, or is configured to homogenize the light emitted from the packaging layer when the packaging layer is located on a side away from the light-emitting side of the light-emitting element.

[0058] In an exemplary embodiment, the light emitting module may further include: a semi-transmissive and semi-reflective film, which is arranged on a side of the second light homogenizing component away from the light emitting element.

[0059] In an exemplary embodiment, the light-emitting module may further include: a metal wiring layer arranged between the substrate and the light-emitting element, wherein the metal wiring layer includes: a plurality of transmissivity control areas, each transmissivity control area includes: a plurality of concentrically arranged areas with different transmittances.

[0060] The following describes the light-emitting module by taking the packaging layer located on the light-emitting side of the light-emitting element and the substrate located on the non-light-emitting side of the light-emitting element (ie, the substrate is located on the side away from the light-emitting side of the light-emitting element) as an example.

[0061] Figure 2 This is a schematic diagram of the first structure of the light-emitting module in the embodiment of the present disclosure, as shown in FIG. Figure 2 As shown, the light emitting module may include: a light emitting element 10, a substrate 11, an encapsulation layer 12, a first light homogenizing component 13, and a reflective layer 14 arranged on a side of the first light homogenizing component 13 away from the light emitting element 10; wherein,

[0062] The encapsulation layer 12 is located on the light-emitting side of the light-emitting element 10;

[0063] The substrate 11 is located on the non-light-emitting side of the light-emitting element 10, and the side of the substrate 11 away from the light-emitting element 10 is the light-emitting surface of the light-emitting module;

[0064] The first light homogenizing component 13 is located on the light-emitting side of the light-emitting element 10 (i.e., on the side of the encapsulation layer 12 away from the light-emitting element 10). It is configured to transmit the light emitted by the light-emitting element 10 so that the light emitted by the light-emitting element 10 is uniformly incident on the reflective layer 14. It is also configured to transmit the light reflected by the reflective layer 14 so that the reflected light is uniformly incident on the encapsulation layer 12.

[0065] The reflective layer 14 is configured to reflect the light incident on the reflective layer 14 toward the direction close to the substrate 11 (i.e., toward the light emitting side away from the light emitting element 10) when the substrate 11 is located on the non-light emitting side of the light emitting element 10, and to be emitted uniformly from the side of the substrate 11 away from the light emitting element 10.

[0066] In this way, when the substrate is located on the non-light-emitting side of the light-emitting element and the encapsulation layer is located on the light-emitting side of the light-emitting element, the light-emitting element emits light downward in the form of a Lambertian light source (i.e., emits light in a direction close to the encapsulation layer). The light emitted by the light-emitting element is incident on the encapsulation layer, and then, after being transmitted through the encapsulation layer, enters the first light-homogenizing component. The first light-homogenizing component transmits and homogenizes the light emitted by the light-emitting element. After being homogenized by the first light-homogenizing component, it is reflected by the reflective layer provided on the lower surface of the first light-homogenizing component (i.e., the side of the first light-homogenizing component away from the light-emitting element). The light reflected by the reflective layer is then transmitted by the first light-homogenizing component, enters the encapsulation layer, is transmitted through the encapsulation layer, enters the substrate, and is transmitted through the substrate before being emitted from the light-emitting surface of the substrate. In this way, by using the light-emitting element to emit light downward, the thickness of the encapsulation layer and the substrate can be effectively utilized to increase the optical path. Therefore, compared with the traditional backlight module, the use of the diffuser structure can be eliminated, the thickness can be reduced, the cost can be reduced, and the overall light output efficiency can be improved. Moreover, the light emitted by the light emitting element is dispersed by the first light homogenizing component to achieve light homogenization of the light emitted by the light emitting element, which can improve the uniformity of the light emitted from the light emitting surface, increase the utilization of the light energy of the light emitting element, and improve the light emitting effect.

[0067] In an exemplary embodiment, the light-emitting element may be a mini-LED light source, an LED light source, or the like.

[0068] Figure 3 This is a schematic diagram of the coverage of the mini-LED light source emitting downward light, such as Figure 3 As shown, within the mini-LED luminous range, after passing through an optical medium with a thickness of t, the width (or diameter) L2 of the area that the mini-LED light source can radiate can be expressed as follows (3):

[0069] L2=4×D+l=4×t×tanθ+l Formula (3);

[0070] In formula (3), θ represents the total reflection angle of the optical medium to the mini-LED light, l represents the chip length of the mini-LED light source, D represents the coverage range of the mini-LED edge light within the total reflection angle range, and L2 represents the coverage diameter of the light emitted on the surface of the optical medium when the mini-LED chip emits light downward (that is, the width of the area that the mini-LED light source can radiate).

[0071] As can be seen from formula (3), in the light-emitting module provided in the disclosed embodiments, by utilizing a design scheme in which the mini-LED chips emit light in an inverted manner, the optical path is extended because the light emitted by the mini-LEDs is reflected back within the substrate or packaging layer. Furthermore, the coverage area of each LED chip on the top surface is somewhat expanded. This expansion of the coverage area of a single mini-LED bright spot directly reduces the number of mini-LED chips in the overall light-emitting module, thereby reducing the cost of the light-emitting module.

[0072] From the above content, it can be seen that in the light-emitting module in the embodiment of the present disclosure, the use of the substrate and the light source packaging structure as the uniform light path can eliminate the use of the diffusion plate structure in the light-emitting module, and can achieve the thickness of the light-emitting module to be thinned and reduce costs. The first uniform light component is used to scatter the light, and the reflective layer of the first uniform light component is used to destroy the total reflection waveguide effect, which can achieve a high uniformity of light output effect, achieve the effect of increasing the amount of light collected, and achieve the improvement of the light collection efficiency of the light-emitting module. The solution of using the light-emitting element to emit light downward can expand the optical path, and the coverage area of the emitted light of each light-emitting element is expanded to a certain extent, which can reduce the number of light-emitting element chips in the overall light-emitting module, thereby reducing the cost of the light-emitting module.

[0073] In an exemplary embodiment, Figure 4 As shown, the light-emitting module may further include: a second light-homogenizing component 15; wherein, the second light-homogenizing component 15 is arranged on the side of the substrate 11 away from the light-emitting element 10 (that is, on the non-light-emitting side of the light-emitting element), and is configured to homogenize the light emitted from the substrate 11 when the substrate 11 is located on the non-light-emitting side of the light-emitting element 10. In this way, when the substrate is located on the non-light-emitting side of the light-emitting element, the light emitted from the substrate is scattered by the second light-homogenizing component provided on the upper surface of the substrate (that is, on the side of the substrate away from the light-emitting element), which can increase the angle of reflection / diffraction and make most of the emitted light oscillate and transmit repeatedly in the substrate. In this way, while further reducing the number of light-emitting elements used, uniform light emission in a larger area is achieved, further improving the light-homogenizing effect and light efficiency, and thus, the power consumption of the light-emitting module will also be reduced.

[0074] In an exemplary embodiment, still as Figure 4As shown, the light-emitting module may further include: a semi-transparent and semi-reflective film 16; wherein the semi-transparent and semi-reflective film 16 is arranged on the side of the second light-homogenizing component 15 away from the light-emitting element 11 (in this case, it is arranged on the side of the substrate 11 away from the light-emitting element 10). In this way, since the substrate is located on the non-light-emitting side of the light-emitting element, the second light-homogenizing component and the semi-transparent and semi-reflective film arranged on the upper surface of the substrate (that is, the side of the substrate away from the light-emitting element) can jointly disperse the light emitted from the substrate, thereby better increasing the reflection / diffraction angle and causing most of the emitted light to oscillate and transmit repeatedly in the substrate. In this way, while reducing the number of light-emitting elements used, it is possible to better achieve uniform light emission in a larger area, greatly improving the light-homogenizing effect and light efficiency, and thus the power consumption of the light-emitting module will also be greatly reduced.

[0075] The following describes the light-emitting module by taking the example of the substrate being located on the light-emitting side of the light-emitting element and the encapsulation layer being located on the non-light-emitting side of the light-emitting element (i.e., the encapsulation layer is located on the side away from the light-emitting side of the light-emitting element).

[0076] Figure 5 This is a schematic diagram of the third structure of the light-emitting module in the embodiment of the present disclosure, as shown in FIG. Figure 5 As shown, the light emitting module may include: a light emitting element 10, a substrate 11, an encapsulation layer 12, a first light homogenizing component 13, and a reflective layer 14 arranged on a side of the first light homogenizing component 13 away from the light emitting element 10; wherein,

[0077] The substrate 11 is located on the light-emitting side of the light-emitting element 10;

[0078] The encapsulation layer 12 is located on the non-light-emitting side of the light-emitting element 10 , and the side of the encapsulation layer 12 away from the light-emitting element 10 is the light-emitting surface of the light-emitting module 11 ;

[0079] The first light homogenizing component 13 is located on the light-emitting side of the light-emitting element 10 (i.e., on the side of the substrate 11 away from the light-emitting element 10). It is configured to transmit the light emitted by the light-emitting element 10 so that the light emitted by the light-emitting element 10 is uniformly incident on the reflective layer 14. It is also configured to transmit the light reflected by the reflective layer 14 so that the reflected light is uniformly incident on the substrate 11.

[0080] The reflective layer 14 is configured to reflect the light incident on the reflective layer 14 toward the direction close to the packaging layer 12 (i.e., toward the light emitting side away from the light emitting element) when the substrate 11 is located on the light emitting side of the light emitting element 10, and emit uniformly from the packaging layer 12.

[0081] In this way, when the substrate is located on the light-emitting side of the light-emitting element and the encapsulation layer is located on the non-light-emitting side of the light-emitting element, the light-emitting element emits light downward in the form of a Lambertian light source. The light emitted by the light-emitting element is incident on the substrate, and then, after being transmitted through the substrate, enters the first light-homogenizing component. The first light-homogenizing component transmits and homogenizes the light emitted by the light-emitting element. After being homogenized by the first light-homogenizing component, it is reflected by the reflective layer provided on the lower surface of the first light-homogenizing component. The light reflected by the reflective layer is then transmitted by the first light-homogenizing component and enters the substrate. After being transmitted by the substrate, it enters the encapsulation layer. After being transmitted by the encapsulation layer, it is emitted from the light-emitting surface of the encapsulation layer. In this way, by using the light-emitting element to emit light downward, the thickness of the encapsulation layer and the substrate can be effectively utilized to increase the optical path. Therefore, compared with the traditional backlight module, the use of the diffuser structure can be eliminated, the thickness can be reduced, the cost can be reduced, and the overall light output efficiency can be improved. Moreover, the light emitted by the light emitting element is dispersed by the first light homogenizing component to achieve light homogenization of the light emitted by the light emitting element, which can improve the uniformity of the light emitted from the light emitting surface, increase the utilization of the light energy of the light emitting element, and improve the light emitting effect.

[0082] From the above content, it can be seen that in the light-emitting module in the embodiment of the present disclosure, the use of the substrate and the light source packaging structure as the uniform light path can eliminate the use of the diffusion plate structure, and can achieve the thickness of the light-emitting module to be thinned and reduce costs. The first uniform light component is used to scatter the light, and the reflective layer of the first uniform light component is combined to change the total reflection waveguide effect, which can achieve a high uniformity of light output effect, increase the amount of light collected, and improve the light collection efficiency of the light-emitting module, thereby improving the backlight effect. The solution of using the light-emitting element to emit light downward can expand the optical path, and the coverage area of the emitted light of each light-emitting element is expanded to a certain extent, which can reduce the number of light-emitting element chips in the overall light-emitting module, thereby reducing the cost of the light-emitting module.

[0083] In an exemplary embodiment, Figure 6 As shown, the light-emitting module may further include: a second light-homogenizing component 15; wherein, the second light-homogenizing component 15 is arranged on the side of the encapsulation layer 12 away from the light-emitting element 10 (that is, on the non-light-emitting side of the light-emitting element 10), and is configured to homogenize the light emitted from the encapsulation layer 11 when the substrate 11 is located on the light-emitting side of the light-emitting element 10 (that is, the encapsulation layer 12 is located on the non-light-emitting side of the light-emitting element 10). In this way, when the encapsulation layer is located on the non-light-emitting side of the light-emitting element, the light emitted from the encapsulation layer can be dispersed by the second light-homogenizing component provided on the upper surface of the encapsulation layer (that is, on the side of the encapsulation layer away from the light-emitting element), which can increase the angle of reflection / diffraction and make most of the emitted light oscillate and transmit repeatedly in the encapsulation layer. In this way, while reducing the number of light-emitting elements used, uniform light emission in a larger area can be achieved, further improving the light-homogenizing effect and light efficiency, and thus, the power consumption of the light-emitting module will also be reduced.

[0084] In an exemplary embodiment, still as Figure 6 As shown, the light-emitting module may further include: a semi-transparent and semi-reflective film 16; wherein, the semi-transparent and semi-reflective film 16 is arranged on the side of the second light-homogenizing component 15 away from the light-emitting element 10 (in this case, it is also arranged on the side of the encapsulation layer 12 away from the light-emitting element 10). In this way, since the encapsulation layer is located on the non-light-emitting side of the light-emitting element, the second light-homogenizing component and the semi-transparent and semi-reflective film provided on the upper surface of the encapsulation layer (that is, the side of the encapsulation layer away from the light-emitting element) can jointly disperse the light emitted from the encapsulation layer, thereby better increasing the angle of reflection / diffraction, so that most of the emitted light is repeatedly oscillated and transmitted in the substrate. In this way, while reducing the number of light-emitting elements used, it is possible to better achieve uniform light emission in a larger area, greatly improving the light-homogenizing effect and light efficiency, and thus the power consumption of the light-emitting module will also be greatly reduced.

[0085] In an exemplary embodiment, Figure 2 、 Figure 4 、 Figure 5 and Figure 6 As shown, the light emitting module may further include: a metal wiring layer 17 arranged on a side of the light emitting element 10 away from the packaging layer 12. The metal wiring layer includes: a plurality of transflective control areas ( Figure 2 、 Figure 4 、 Figure 5 and Figure 6 (not shown), each transmission and reflection control region includes: a plurality of regions with different transmittances arranged concentrically. Here, "concentric" may mean that the plurality of regions have the same geometric center.

[0086] In this way, the metal routing layer is located between the substrate and the packaging layer. By designing the transmission and reflection control area of the metal routing layer, a transmission and reflection distribution design is achieved on the light-emitting surface of the substrate or packaging layer. This redistributes the light energy concentrated by the light-emitting elements, reducing transmitted light and increasing reflected light for the next transmission process, thereby achieving a uniform distribution design of the emitted light energy. This can achieve a uniform light output effect on the one hand, and significantly reduce the number of light-emitting elements and cost on the other hand.

[0087] In an exemplary embodiment, each light-emitting element may correspond to a transflective control area.

[0088] In an exemplary embodiment, taking the example that each light-emitting element corresponds to one transmissive-reflective control region, the geometric center of each light-emitting element may be set corresponding to the geometric center of the corresponding transmissive-reflective control region.

[0089] In practical applications, the number of zones within each transflective control region depends on the spacing between the light-emitting element chips and the designed surface transmittance. For example, the transflective control region may include three zones. Of course, the number of zones can also be increased. For example, if the light-emitting element chips are spaced farther apart, or if overall transmittance requirements are less stringent, a larger number of zones, such as four or five, can be designed. This is not limited in the presently disclosed embodiments.

[0090] The following description will be made by taking the case where the reflection-transmission control area includes three areas as an example.

[0091] Take the three-area energy distribution design where the substrate is located on the non-light-emitting side of the light-emitting element, the encapsulation layer is located on the light-emitting side of the light-emitting element, and the LED light source emits light downward into the encapsulation layer as an example. Figure 7 As shown, the geometric center of the LED light source corresponds to the geometric center of Area 1. The light emitted by the LED light source propagates within the packaging layer. The main light-emitting area is Area 1. The second emission area that reaches the upper surface after reflection from the upper and lower surfaces of the packaging layer is Area 2. Similarly, Area 3 can be divided. Next, the transmittances from Area 1 to Area 3 are set to 40.0%, 66.7%, and 100%, respectively. Among them, Area 3 is considered to be the overlapping part of the light paths of the two LED light sources. In this way, the regional transmittance distribution design is carried out according to the LED light-emitting characteristics, which can ensure the overall light uniformity while increasing the distance between the two lamps.

[0092] In one exemplary embodiment, since the metal trace layer primarily comprises a metal wire structure, the metal trace layer's duty cycle (also known as the aperture ratio) can be controlled by one or more of the trace thickness and trace width. Thus, by controlling the metal trace layer's duty cycle (also known as the aperture ratio), it is possible to control the transmittance of light energy in each region of the surface within the reflective control area, achieving energy regulation. This results in a uniform light output effect at the light-emitting surface.

[0093] For example, the metal trace layer is implemented by Cu (copper) material, and the transmittance of Area 1 to Area 3 is set to 40.0%, 66.7% and 100% respectively. The duty cycle of the metal trace layer is controlled by the trace thickness. Then, according to Figure 8 As shown in the figure, the thickness of the metal routing layer and the duty cycle can be set to 1.9 μm, 4.8 μm, or no routing layer in Area 1 to Area 3, respectively.

[0094] In an exemplary embodiment, the plurality of regions are any one of a circular region and a rectangular ring region. For example, taking the reflection control region including three regions as an example, Figure 9AAs shown, the reflection-transmittance control area can be a concentrically arranged circular area with different transmittances; Figure 9B As shown, the transmission and reflection control areas can be concentrically arranged rectangular ring areas with different transmittances.

[0095] In an exemplary embodiment, there are overlapping areas between adjacent transflective control areas. Figure 9B The concentric square ring areas shown are based on Figure 7 The distribution design of the reflective control area shown in the figure is that the outermost area in the reflective control area (for example, Area 3) belongs to the overlapping part of the control of two adjacent light-emitting element chips. In this way, due to the overlapping design of the light-emitting area of the light-emitting element, it is possible to maintain a higher far-end brightness by superimposing the light after multiple propagations in the packaging layer or substrate while increasing the distance between adjacent light-emitting element chips, thereby ensuring the uniformity of the light emission of the entire light-emitting module. Therefore, the light-emitting module provided by the embodiment of the present disclosure can greatly reduce the number of light-emitting element chips required for the entire light-emitting module, and has a great optimization in terms of cost. For example, with a light-emitting element as shown in FIG. Figure 9B The concentric square partitioning method shown is based on Figure 7 Taking the distribution design of the transflective control area shown in the figure as an example, when designing a light-emitting module for a 65-inch 4K display, the Mini-LED array can be designed with a horizontal and vertical spacing of 4.445mm. The AA area in this 65-inch 4K display measures 1430mm by 840mm. Therefore, a light-emitting module with a 0mm OD can be achieved using 61,000 Mini-LEDs, which is less than the 100,000 Mini-LEDs required for traditional light-emitting modules, significantly reducing costs. Furthermore, experimental measurements by the inventors of the present disclosure show that the backlight uniformity of the light-emitting module with a 0mm OD achieved using 61,000 Mini-LEDs in the disclosed embodiment is approximately 91.8%, far exceeding the backlight uniformity of traditional light-emitting modules.

[0096] The following is Figure 7 Taking the design scheme of the transmissive-reflective control area as an example, how to determine the radius value or side length value of each area in the transmissive-reflective control area to determine the coverage range of the transmissive-reflective control area is described.

[0097] For Figure 9A The concentric ring areas shown in the figure have radius values R of each area in the reflection control area. n The following formula (4) can be satisfied:

[0098] R n =0.5l+(2n-1)t×tanθ Formula (4);

[0099] In formula (4), R nIt represents the radius value of the nth level area, t represents the thickness of the packaging layer or substrate, n represents the partition level, θ represents the total reflection angle of light in the packaging layer or substrate, and l represents the chip side length of the light-emitting element.

[0100] At this time, the distance L between adjacent light-emitting elements can satisfy the following formula (5):

[0101] L = l + 2 × 2 (N - 1) t × tan θ Formula (5);

[0102] In formula (5), L represents the spacing between adjacent light-emitting elements, l represents the side length of the chip of the light-emitting element, N represents the number of partitions, t represents the thickness of the packaging layer or substrate, and θ represents the total reflection angle of light in the packaging layer or substrate.

[0103] As for Figure 9B The concentric square ring area shown in the figure has a side length of each square in the reflection control area. Figure 9A In the circular ring area shown, the diameters of the concentric circles in the transmission and reflection control area are the same, which can satisfy the following formula (6):

[0104] d n =2R n Formula (6);

[0105] In formula (6), d n Indicates the side length of the n-th level region, R n Indicates the radius value of the n-th level area.

[0106] In order to achieve the highest utilization rate of light energy, 61% of the energy in Area 1 needs to be evenly distributed to each area. Therefore, the number of partitions N in the transflective control area is related to the final light output surface light efficiency. If the number of partitions is greater, the energy allocated to each area will be relatively lower. The transmittance of each area in the transflective control area can be calculated using the following formula (7):

[0107]

[0108] In formula (7), n represents the partition level, N represents the number of partitions, and T n Indicates the transmittance of the n-th level area.

[0109] Meanwhile, the transmittance of the outermost area in the transflection control area is 100%.

[0110] For example, if the energy is distributed in three areas, if the reflection control area is as follows Figure 9A The circular area shown in FIG1 is a circle area. Then, the radius values of Area 1 to Area 3 can be calculated by the above formula (4) to be 0.919 mm, 1.788 mm, and 2.657 mm respectively. If the reflection control area is as follows: Figure 9B For the rectangular annular area shown, the side lengths of Area 1 to Area 3 can be calculated to be 1.838 mm, 3.576 mm, and 5.314 mm using the above formula (6); the spacing between adjacent light-emitting elements can be calculated to be 4.445 mm using the above formula (5); and the transmittances of Area 1 to Area 3 can be set to 40.0%, 66.7%, and 100%, respectively, using the above formula (7).

[0111] Of course, in addition to the energy distribution design schemes listed above, other calculation rules can also be used to design energy distribution for each area within the transflective control area to achieve the same uniform light effect. For example, the energy distribution design can be set to set the energy of the entire surface to 25% of the center energy.

[0112] In one exemplary embodiment, the metal routing layer has a first surface positioned oppositely to the light-emitting element and a second surface positioned farther from the light-emitting element, wherein at least one of the first and second surfaces is provided with a reflective film. By designing a low-absorption-loss reflective film on at least one of the first and second surfaces, the metal routing layer can reduce absorption losses in the light path caused by the metal routing layer, thereby improving the light efficiency of the light-emitting module.

[0113] For example, taking the first light homogenizing component as a microlens array, the microlenses in the microlens array are convex microlenses, and the curved surface of the microlens is convex in the direction away from the light emitting element, as shown in FIG. Figure 10A 、 Figure 10B and Figure 10C As shown, the light emitting module may further include: a reflective film 19. Figure 10A As shown, the reflective film 19 can be provided on the first surface of the metal wiring layer 17 close to the light emitting element 10. Alternatively, as shown in FIG. Figure 10B As shown, the reflective film 19 can be arranged on the second surface of the metal wiring layer 17 away from the light emitting element 10. Alternatively, as shown in FIG. Figure 10C As shown, the reflective film 19 can be provided on a first surface of the metal wiring layer 17 close to the light emitting element 10 and a second surface of the metal wiring layer 17 away from the light emitting element 10. Here, the reflective film can only cover the wiring in the metal wiring layer.

[0114] For example, the reflective films provided on the first and second surfaces of the metal wiring layer may be a composite structure of ITO / Ag / ITO, or may be a high reflectivity material layer (eg, a white oil layer).

[0115] Here, the metal wiring layer is connected to the light emitting element and can serve as a driving circuit layer of the light emitting element to drive the light emitting element to emit light.

[0116] In one exemplary embodiment, the metal trace layer can be made of a material that does not absorb light, such as Al (aluminum) or Ag (silver). This allows light reaching the metal trace layer (e.g., the driver circuit layer for the light-emitting element) to be efficiently reflected or fully transmitted without being absorbed and lost, thereby improving the light efficiency of the light-emitting module.

[0117] In addition, to prevent Ag oxidation, a thin ITO (indium tin oxide) layer needs to be deposited on the surface of the Ag layer for protection. Therefore, the metal wiring layer can be a composite structure of ITO / Ag / ITO or ITO / Ag / Al / Ag / ITO.

[0118] The following is a detailed description of each structure in the light-emitting module.

[0119] In an exemplary embodiment, the material of the substrate can be a printed circuit board (PCB) material or a transparent material. For example, taking the transparent material as an example, considering the optical path and the requirements of the ultra-thin device structure, the transmittance of the substrate can be as high as possible, then the material of the substrate can be a glass material. For example, the substrate can be a glass substrate with a refractive index of 1.52. For example, the thickness of the glass substrate can be 0.5 mm, 0.7 mm, etc. Of course, it can also be other materials, and the embodiments of the present disclosure do not limit this.

[0120] In one exemplary embodiment, the refractive index of the encapsulation layer is less than or equal to that of the substrate. This ensures that light can be emitted from either the substrate or the encapsulation layer. For example, the substrate may be a glass substrate with a refractive index of 1.52, and the encapsulation layer may be a PCB material with a refractive index of 1.5.

[0121] For example, the thickness of the encapsulation layer may be 0.2 mm, 0.5 mm, etc. Of course, it may also be other thicknesses, which are not limited in the embodiments of the present disclosure.

[0122] In an exemplary embodiment, the first light homogenizing component may include any one of a microlens array and a concave-convex microstructure. Of course, other configurations are also possible, and this disclosure does not limit this.

[0123] In an exemplary embodiment, the second light homogenizing component may include any one of a microlens array and a concave-convex microstructure, which is not limited in the present embodiment.

[0124] Here, the microlens array is one of the important micro-optical elements. By designing the shape, curvature radius, arrangement, thickness and other parameters of the microlens, it can achieve modulation functions such as shaping, uniformity, diffusion, and focusing of the incident light.

[0125] In the embodiment of the present disclosure, the uniform light effect of the microlens array is used to realize the first uniform light component. When the substrate is located on the light-emitting side of the light-emitting element, the microlens array is superimposed on the bottom of the substrate (that is, the side of the substrate away from the light-emitting element), or, when the encapsulation layer is located on the light-emitting side of the light-emitting element, the microlens array is superimposed on the bottom of the encapsulation layer (that is, the side of the encapsulation layer away from the light-emitting element), and a reflective layer (for example, a total reflection film) is added to the curved surface of the microlens array, which can solve the problem that the energy distribution of the Lambertian light type of the LED light source is limited in uniform light. In addition, in actual applications, when the microlens array is set below the substrate or below the encapsulation layer, it can be achieved by a process with low performance impact such as dispensing, or by bonding, without further processing on the substrate or encapsulation layer, and will not affect the stability of the device in the light-emitting module. Moreover, the processing controllability of the microlens array is strong, and the design degree is relatively higher, which can ensure the stability of the performance of the light-emitting module and the product yield is high.

[0126] In an exemplary embodiment, the microlens array includes: a plurality of convex or concave microlenses arranged in an array, wherein the curved surface of the microlenses is a portion of a spherical surface, for example, a hemispherical surface.

[0127] In an exemplary embodiment, a microlens array includes a plurality of convex microlenses arranged in an array, as an example. Figure 11A As shown in FIG. 1 , the surface of the microlens in the microlens array 18 close to the light emitting element 10 may be a curved surface that is convex toward the direction close to the light emitting element 10. In another exemplary embodiment, as shown in FIG. Figure 11B As shown, a surface of the microlens in the microlens array 18 away from the light emitting element may be a curved surface that is convex in a direction away from the light emitting element 10 .

[0128] In an exemplary embodiment, the microlens array includes a plurality of concave microlenses arranged in an array, as an example. Figure 11C As shown in FIG. 1 , the surface of the microlens in the microlens array 18 close to the light emitting element 10 may be a curved surface that is concave in a direction away from the light emitting element 10. In another exemplary embodiment, as shown in FIG. Figure 11D As shown, a surface of the microlens in the microlens array 18 away from the light emitting element may be a curved surface that is concave toward the direction approaching the light emitting element 10 .

[0129] In an exemplary embodiment, the curved surface of the microlens array can be oriented toward the light-emitting surface of the light-emitting module (i.e., the curved surface of the microlens array is upward). Alternatively, the curved surface of the microlens array can be oriented toward the non-light-emitting surface of the light-emitting module (i.e., the curved surface of the microlens array is downward). For example, Figure 11AAs shown, taking the curved surface of the microlens array 18 as a convex curved surface as an example, when the encapsulation layer 12 is located on the light-emitting side of the light-emitting element 10, the curved surface of the microlens array 18 can be attached to the bottom of the encapsulation layer 12 (that is, the side of the encapsulation layer 12 away from the light-emitting element 10). At this time, the curved surface of the microlens array 18 faces the light-emitting surface of the light-emitting module (that is, the curved surface of the microlens array 18 faces upward). For example, Figure 11C As shown, taking the curved surface of the microlens array 18 as a concave curved surface as an example, when the encapsulation layer 12 is located on the light-emitting side of the light-emitting element 10, the curved surface of the microlens array 18 can be attached to the bottom of the encapsulation layer 12 (that is, the side of the encapsulation layer 12 away from the light-emitting element 10). At this time, the curved surface of the microlens array 18 faces the non-light-emitting surface of the light-emitting module (that is, the curved surface of the microlens array 18 faces downward).

[0130] In an exemplary embodiment, the structural parameters of the microlens array may include any one or more of the following parameters: a diameter Lens_D of a single microlens may be less than 20 μm (for example, the diameter of a single microlens may be 2 μm, 4 μm, 6 μm, 8 μm, 9 μm, or 16 μm), where the diameter of the microlens may be the diameter of the spherical surface on which the curved surface of the microlens is located; a ratio of the diameter Lens_D of a single microlens to the pitch Lens_Pitch between adjacent microlenses in either the row direction or the column direction of the microlens array (denoted as the duty cycle of the microlens array) may be greater than or equal to 2 (for example, Lens_D:Lens_Pitch=2:1), where, when the curved surface of the microlens is convex, the pitch between adjacent microlenses may be the distance between the vertices of the convex surfaces of two adjacent microlenses; and when the curved surface of the microlens is concave, the pitch between adjacent microlenses may be the distance between the lowest points of the concave surfaces of two adjacent microlenses). In this way, small-angle light incident on the surface of the microlens array (small-angle light that concentrates the main energy of the LED) is reflected at a slightly larger angle, avoiding absorption loss by the upper LED chip; large-angle light incident on the surface of the microlens array (for example, large-angle light greater than the total reflection angle of the substrate) is reflected at a condition smaller than the total reflection angle, reducing the number of light rays confined in the substrate, thereby maximizing the energy of light, increasing the light extraction amount of the light-emitting module, and achieving higher light efficiency.

[0131] Here, the spacing between adjacent microlenses (also referred to as the arrangement period of microlenses) can represent the degree of close contact between adjacent lenses.

[0132] In an exemplary embodiment, according to the ratio of the diameter Lens_D of the microlens to the pitch Lens_Pitch between adjacent microlenses, as shown in FIG. Figure 12As shown, adjacent microlenses exist in three states: spaced, overlapping, and connected. When the ratio of the microlens diameter Lens_D to the pitch Lens_Pitch between adjacent microlenses is greater than 1, the adjacent microlenses are spaced; when the ratio of the microlens diameter Lens_D to the pitch Lens_Pitch between adjacent microlenses is less than 1, the adjacent microlenses are overlapping; and when the ratio of the microlens diameter Lens_D to the pitch Lens_Pitch between adjacent microlenses is equal to 1, the adjacent microlenses are connected.

[0133] For example, Figure 12 The uniform light effect diagram of the microlens array with different duty ratios is shown in Figure 12 In the figure, taking the diameter of the microlens Lens_D = 2μm as an example, from top to bottom, the ratios of the diameter of the microlens Lens_D to the spacing between adjacent microlenses Lens_Pitch are given as none (i.e., no microlens array), 1:2 (at this time, the spacing between adjacent microlenses Lens_Pitch = 4μm), 1:1.5 (at this time, the spacing between adjacent microlenses Lens_Pitch = 3μm), 1:1 (at this time, the spacing between adjacent microlenses Lens_Pitch = 2μm), 1:0.75 (at this time, the spacing between adjacent microlenses Lens_Pitch = 1.5μm) and 1:0.5 (at this time, the spacing between adjacent microlenses Lens_Pitch = 1μm), and schematic diagrams of adjacent microlenses corresponding to different ratios are given. Figure 12 As shown, for both the curved surface-upward and curved surface-downward solutions of the microlens in the microlens array, a better light uniformity effect can be achieved when Lens_D:Lens_Pitch = 1:0.5 (i.e., Lens_D:Lens_Pitch = 2:1). That is, when adjacent microlenses are closely arranged in a Lens_D:Lens_Pitch = 1:0.5, a better light uniformity effect can be achieved. For example, the diameter of the microlens Lens_D = 2μm, and multiple microlenses are arranged in a two-dimensional array with a Lens_Pitch = 1μm period. Here, the curved surface of the microlens upward refers to the side of the microlens close to the light-emitting element, and the curved surface of the microlens downward refers to the side of the microlens away from the light-emitting element.

[0134] In an exemplary embodiment, the material of the microlenses in the microlens array can be polymethyl methacrylate (PMMA) material or printed circuit board (PCB) material. Of course, it can also be other materials, such as a material with a refractive index close to that of the encapsulation layer or substrate, which is not limited in the embodiments of the present disclosure.

[0135] In one exemplary embodiment, the difference in refractive index between the microlens and at least one of the substrate and the encapsulation layer can be between 0 and 1 (i.e., the refractive index of the microlens is similar to the refractive index of at least one of the substrate and the encapsulation layer). For example, the microlens can be made of PMMA with a refractive index of 1.49, the substrate can be made of glass with a refractive index of 1.52, and the encapsulation layer can be made of an encapsulant with a refractive index of 1.5.

[0136] In an exemplary embodiment, the reflective layer may be disposed on the curved surface of the microlens array.

[0137] In an exemplary embodiment, the microstructure may include: a plurality of raised areas or a plurality of recessed areas. The plurality of recessed areas are areas in the microstructure other than the plurality of raised areas, and the plurality of raised areas and the plurality of recessed areas include: any one or more of a part of a sphere and a part of a pyramid. The shape of the raised or recessed structure is any one or more of a prism, a truncated cone, an ellipsoid, a hemisphere, a pyramid, a pyramid, a cone, and a V-shape. For example, taking the plurality of raised areas and the plurality of recessed areas including: a part of a pyramid as an example, as Figure 13A As shown, the microstructure may include: pyramidal protrusions or depressions; or, as shown Figure 13B As shown, the microstructure can be a plurality of pyramid structures arranged in an array (for example, the microstructure including the pyramid structure can be prepared by nanoimprinting); or Figure 13C As shown, the microstructure may be a combination of various projections or depressions in the shape of a prism and a pyramid.

[0138] In an exemplary embodiment, taking a plurality of pyramid structures arranged in an array as an example, the side length of each pyramid structure may be 50 μm, and the spacing between adjacent pyramid structures may be 50 μm. Here, the spacing between adjacent pyramid structures may refer to the distance between the center points of two adjacent pyramid structures.

[0139] In an exemplary embodiment, the microstructure can be realized by wet etching, electrochemical texturing, reactive ion etching texturing, laser texturing, mask texturing, mechanical texturing, etc. Here, the embodiment of the present disclosure does not limit this.

[0140] In an exemplary embodiment, the reflective layer can be a single-layer structure or a multi-layer structure. For example, the reflective layer can be a single-layer structure of a high-reflectivity material such as Ag (silver) film, white reflective material film, or white oil. For example, the reflective film can be a multi-layer structure of a high-reflectivity material such as ITO / Ag / ITO. In this way, the light incident on the reflective layer and scattered by the first light homogenization component can be reflected and emitted through the packaging layer or substrate to achieve a highly uniform light output effect.

[0141] In an exemplary embodiment, a thin film deposition technology may be used to deposit a reflective layer on a side of the first light homogenizing component away from the light emitting element.

[0142] In an exemplary embodiment, the light emitting element may include: a plurality of mini-LED light sources.

[0143] In an exemplary embodiment, the light emitting element includes: a plurality of mini-LED light sources, such as Figure 14A As shown, the multiple mini-LED light sources can be arranged in a quadrilateral distribution. Figure 14A The mini-LED light source is represented by a small black square. This maximizes the use of the light-emitting surface while reducing the difficulty of wiring the chip driver circuit.

[0144] In another exemplary embodiment, the light emitting element includes: a plurality of mini-LED light sources, such as Figure 14B As shown, the multiple mini-LED light sources can be arranged in a regular triangle distribution. Figure 14B The mini-LED light source is represented by a small white square in the figure. This allows for the most efficient use of the light-emitting area of each mini-LED chip, resulting in a light-emitting module with a low thickness and high uniformity.

[0145] Of course, the arrangement of the light emitting elements in the light emitting module in the embodiment of the present disclosure may be other than the two arrangements listed above, and the embodiment of the present disclosure does not limit this.

[0146] In practical applications, the spacing of mini-LED light sources can be determined based on the design of zoning, or overlapping light control ranges. For example, if the mini-LED light sources are arranged in a regular quadrilateral, the spacing between two mini-LED chips can be the same in both the horizontal and vertical directions, and can be 4.445mm. When the mini-LED light sources are arranged in an equilateral triangle, the spacing in the horizontal direction can be 4.445mm, and the spacing in the vertical direction can be 3.849mm.

[0147] In an exemplary embodiment, the size of the mini-LED light source is 100 μm×100 μm.

[0148] In an exemplary embodiment, the first light homogenizing component and the reflective layer may be an integrated structure, and the integrated structure is a diffuse reflective material layer with bubbles. Figure 15As shown, the first light-homogenizing component and the reflective layer can be implemented using a foamed white reflective film. The foamed white reflective film is created by adding a foaming agent (e.g., titanium dioxide (TiO2)) or introducing an inert gas during the extrusion process of the resin material (e.g., polyethylene terephthalate (PET)) of the white reflective film to create small bubbles. This allows the bubbles in the foamed white reflective film to achieve diffuse reflection.

[0149] In an exemplary embodiment, the transflective film can be implemented by a thin film made of a Ni-Cr (nickel-chromium) alloy, or by an Al (aluminum) thin film, or by a multilayer film constructed by alternating SiO2 / TiO2 materials. Of course, other methods are also possible, and the present disclosure does not limit this.

[0150] Based on the above embodiments, the embodiments of the present disclosure provide a light-emitting module. Taking the light-emitting element as a Mini-LED light source and the first light-homogenizing component as a microlens array as an example, then, in an exemplary embodiment, Figure 11A 、 Figure 11B 、 Figure 11C and Figure 11D As shown, the light-emitting module may include: a plurality of light-emitting elements 10 (Mini-LED light sources); a metal wiring layer 17, located on the non-light-emitting side of the plurality of light-emitting elements 10 (Mini-LED light sources); a substrate 11, located on the side of the metal wiring layer 17 away from the plurality of light-emitting elements 10 (Mini-LED light sources); a packaging layer 12, located on the light-emitting side of the plurality of light-emitting elements 10 (Mini-LED light sources); a microlens array 18, located on the side of the packaging layer 12 away from the plurality of light-emitting elements 10 (Mini-LED light sources); and a reflective layer 14, located on the curved surface of the microlens array 18.

[0151] The structure of the light-emitting module is described below using the manufacturing process.

[0152] In the embodiments of the present disclosure, the terms "film" and "layer" may be interchanged. For example, the term "reflective layer" may sometimes be replaced with "reflective film."

[0153] The "patterning process" mentioned in the embodiments of the present disclosure includes processes such as depositing a film layer, coating a photoresist, mask exposure, development, etching, and stripping of the photoresist, which are mature preparation processes in some technologies. Deposition can adopt known processes such as sputtering, evaporation, and chemical vapor deposition, coating can adopt known coating processes, and etching can adopt known methods, which are not limited here. In the description of the embodiments of the present disclosure, it should be understood that "thin film" refers to a thin film made by depositing a certain material on a substrate using deposition or other processes. If the "thin film" does not require a patterning process during the entire production process, the "thin film" can also be called a "layer". If the "thin film" still requires a patterning process during the entire production process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern".

[0154] For example, a glass substrate can be selected as the substrate, and the Mini-LED encapsulation layer can be used as the transmission structure for the Mini-LED chip to emit light, simplifying the overall process to a single-sided process, reducing the process difficulty in lamination while increasing light energy utilization. Copper material can be selected as the metal trace layer. On the one hand, an ITO / Ag / ITO reflective film can be prepared on the lower surface of the glass substrate (i.e., the surface of the substrate close to the light-emitting element, i.e., the surface of the metal trace layer away from the light-emitting element) through a composition process to correspond to the structure of the copper trace layer (i.e., the metal trace layer), so that the ITO / Ag / ITO reflective film covers the copper trace, thereby reducing the absorption loss of reflected light caused by the copper trace layer (i.e., the metal trace layer) in the optical path. On the other hand, a white PR glue (photoresist) layer can be prepared on the lower surface of the copper trace layer (i.e., the surface of the metal trace layer away from the light-emitting element) through a composition process to correspond to the structure of the copper trace layer (i.e., the metal trace layer), so that the copper trace layer (i.e., the metal trace layer) can construct the designed reflection-transmitting control area with its aperture ratio. A white reflective material layer can be selected as the reflective layer, and a microlens array plate with a white reflective material layer is attached to the lower surface of the packaging layer (ie, the surface of the packaging layer away from the light-emitting element).

[0155] In addition, with regard to the preparation of the microlens array, the size of the microlens array involved in the light-emitting module provided in the embodiment of the present disclosure is relatively small (for example, the diameter of the microlens can be less than 20 μm, and the spacing between adjacent microlenses can be half the diameter of the microlens). Therefore, the overall structure is relatively simple and has strong uniformity. Based on this feature, the microlens array can be manufactured using jet dispensing technology. By precisely positioning the dispensing on the encapsulation layer and then curing it, a microlens array with a unit scale of less than 20 μm can be obtained. Corresponding to the process capabilities, the microlens diameter ranges from 4 μm to 16 μm, and the effect of improving uniformity is almost the same, and both can achieve an improvement of about 10%.

[0156] The inventors of the present disclosure have modeled and simulated the backlight structure provided in the embodiment of the present disclosure by using simulation software. The simulation results show that the backlight structure provided in the embodiment of the present disclosure is provided by using light emitting elements as shown in FIG. Figure 9B The concentric square partitioning method shown is based on Figure 7 The distribution design of the reflection control area is shown in FIG. Figure 11A 、 Figure 11B 、 Figure 11C and Figure 11D Taking the light-emitting module shown as an example, when designing a light-emitting module for a 65-inch 4K display screen, the spacing of the Mini-LED array in the horizontal and vertical directions can be designed to be 4.445mm. The size of the AA area in the 65-inch 4K display screen is 1430mm*840mm. Therefore, 61,000 Mini-LEDs can be used to achieve a light-emitting module with 0mmOD, which is far less than the required number of 100,000 Mini-LEDs for traditional light-emitting modules, achieving a great optimization in cost from one dimension. Moreover, the backlight uniformity of the light-emitting module with 0mmOD achieved by using 61,000 Mini-LEDs in the embodiment of the present disclosure is approximately 91.8% or more, which is far greater than the backlight uniformity of traditional light-emitting modules, achieving a high-uniformity uniform light effect. In addition, the light-emitting module in the embodiment of the present disclosure omits the diffuser structure in the existing light-emitting module, and the overall thickness of the light-emitting module is reduced from 3.85mm to 1.18mm, reducing the cost of the light-emitting module from another dimension.

[0157] Based on the aforementioned embodiments, the embodiments of the present disclosure provide a light-emitting module, in which the light-emitting element is a Mini-LED light source, the lower surface of the substrate is provided with a first light-homogenizing component and a reflective layer, and the encapsulation layer is provided with a second light-homogenizing component and a semi-transparent and semi-reflective film, wherein the light-emitting module in the embodiments of the present disclosure is described by taking the first light-homogenizing component and the second light-homogenizing component as microstructures as an example. Then, in an exemplary embodiment, the light-emitting module may include: a plurality of Mini-LED light sources; a metal wiring layer, located on the light-emitting side of the plurality of Mini-LED light sources; a substrate, located on the side of the metal wiring layer away from the plurality of Mini-LED light sources; a first microstructure, located on the side of the substrate away from the plurality of Mini-LED light sources; a reflective layer, located on the side of the first microstructure away from the plurality of Mini-LED light sources; an encapsulation layer, located on the non-light-emitting side of the plurality of Mini-LED light sources; a second microstructure, located on the side of the encapsulation layer away from the plurality of Mini-LED light sources; and a semi-transparent and semi-reflective film, located on the side of the second microstructure away from the plurality of Mini-LED light sources.

[0158] In this way, the Mini-LED chips are mounted upside down on the substrate and arranged at a certain distance. The Mini-LED array emits light downward in the form of a Lambertian light source. Next, the substrate acts as a transmission layer to transmit the light emitted downward by the Mini-LED array, increasing the optical path and achieving a thinner light-emitting module. At the same time, the first microstructure and reflective layer provided on the lower surface of the substrate (the side of the substrate away from the light-emitting element) scatter the light and reflect it upward, effectively utilizing the substrate to transmit the reflected light, further increasing the optical path and achieving a thinner light-emitting module. This reduces costs, improves overall light output efficiency, and improves the uniformity of the light emitted from the light-emitting surface, increases the utilization of light energy from the light-emitting element, and improves the backlight efficiency. Then, the encapsulation layer acts as a transmission layer to continue transmitting the reflected light, further increasing the optical path and achieving a thinner light-emitting module. At the same time, the second microstructure and semi-transparent and semi-reflective film provided on the upper surface of the encapsulation layer further scatter the emitted light, increasing the angle of reflection diffraction, and causing most of the emitted light to oscillate and transmit repeatedly in the encapsulation layer, thereby reducing the number of Mini-LEDs used while achieving uniform light output over a larger area. At the same time, power consumption is also reduced. Thus, a highly uniform light emitting effect is achieved on the surface of the light emitting module, the light extraction efficiency of the light emitting module is improved, the thickness of the light emitting module is reduced, the cost is reduced, and the overall light extraction efficiency of the light emitting module is improved.

[0159] For example, taking the first microstructure as Figure 13C As shown, the light emitted by the Mini-LED that reaches the lower surface of the substrate can be further dispersed, so that the small-angle light (for example, 0° to 10°) that concentrates most of the energy can be dispersed into reflected light at other angles, avoiding the small-angle light from being reflected again at a small angle and affecting the uniform energy distribution effect; at the same time, the large-angle light that is greater than the total reflection angle of the substrate (for example, 41°) can also be dispersed and converted into small-angle light within the total reflection angle range, thereby maximizing the light collection of the substrate and improving the backlight efficiency.

[0160] The inventors of this disclosure used simulation software to model and simulate the light-emitting module. The simulation results show that the light-emitting module provided by the embodiments of this disclosure can achieve a light uniformity greater than 80% at the zero light mixing distance on the surface of the light-emitting module (with a local uniformity greater than 81% and an overall uniformity greater than 93%). At the same time, the light efficiency of the light-emitting module can reach 78%. This achieves a high degree of uniformity at the zero light mixing distance of the light-emitting module.

[0161] An embodiment of the present disclosure further provides a display module, comprising a display panel and the light-emitting module of one or more of the above embodiments, wherein the display panel is arranged on a side away from the light-emitting side of the light-emitting element.

[0162] In an exemplary embodiment, the display module can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, or a navigator.

[0163] Although the embodiments disclosed in this disclosure are as described above, the contents are merely embodiments adopted to facilitate understanding of the disclosure and are not intended to limit the disclosure. Any person skilled in the art of the disclosure may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope of the disclosure. However, the scope of patent protection of the disclosure shall still be based on the scope defined by the attached claims.

Claims

1. A light emitting module, characterized in that: include: A substrate, at least one light-emitting element located on one side of the substrate, and a first light-homogenizing component and a reflective layer arranged on the light-emitting side of the light-emitting element; wherein, The first light homogenizing component is configured to make the light emitted by the light emitting element uniformly incident on the reflective layer; The reflective layer is configured to reflect light incident on the reflective layer in a direction away from the light emitting side of the light emitting element; It also includes: an encapsulation layer, wherein the encapsulation layer and the substrate are respectively located on both sides of the light-emitting element, and the encapsulation layer and the reflective layer are respectively located on both sides of the first light-homogenizing component; It also includes: a metal routing layer, which is arranged between the substrate and the light-emitting element, wherein the metal routing layer includes: multiple transmission and reflection control areas, each transmission and reflection control area includes: multiple concentrically arranged areas with different transmittances; each light-emitting element corresponds to a transmission and reflection control area, and the geometric center of each light-emitting element is arranged corresponding to the geometric center of the transmission and reflection control area corresponding to it.

2. The light emitting module according to claim 1, wherein: Also includes: The second light homogenizing component is arranged on a side away from the light emitting side of the light emitting element, and is configured to homogenize the light emitted from the substrate when the substrate is located on a side away from the light emitting side of the light emitting element, or is configured to homogenize the light emitted from the packaging layer when the packaging layer is located on a side away from the light emitting side of the light emitting element.

3. The light emitting module according to claim 2, characterized in that: Also includes: The semi-transmissive and semi-reflective film is arranged on a side of the second light-homogenizing component away from the light-emitting element.

4. The light emitting module according to claim 2, wherein: The first light uniforming component includes: any one of a microlens array and an uneven microstructure, and / or the second light uniforming component includes: any one of a microlens array and an uneven microstructure.

5. The light emitting module according to claim 4, characterized in that: The microlens array includes: a plurality of convex or concave microlenses arranged in an array, wherein the curved surface of the microlens is a part of a spherical surface.

6. The light emitting module according to claim 5, characterized in that: The structural parameters of the microlens array include any one or more of the following parameters: The diameter of a single microlens is less than 20 μm; The ratio of the diameter of a single microlens to the pitch between adjacent microlenses in either a row direction or a column direction of the microlens array is greater than or equal to 2.

7. The light emitting module according to claim 5, characterized in that: A difference between a refractive index of the microlens and at least one of the substrate and the encapsulation layer is 0 to 1.

8. The light emitting module according to claim 4, characterized in that: The microstructure includes: multiple raised areas and multiple recessed areas, wherein the multiple recessed areas are areas in the microstructure other than the multiple raised areas, and the multiple raised areas and the multiple recessed areas include: any one or more of a part of a sphere and a part of a pyramid.

9. The light emitting module according to claim 1, wherein: The multiple areas are any one of circular areas and rectangular annular areas.

10. The light emitting module according to claim 1, wherein: There is an overlapping area between adjacent transmission and reflection control areas.

11. The light emitting module according to claim 1, wherein: The metal wiring layer has a first surface close to the light emitting element and a second surface far from the light emitting element, and is relatively arranged. At least one of the first surface and the second surface is provided with a reflective film.

12. The light emitting module according to claim 1, wherein: The refractive index of the encapsulation layer is less than or equal to the refractive index of the substrate.

13. The light emitting module according to claim 1, wherein: The light-emitting element includes: mini-LED.

14. The light emitting module according to claim 13, wherein: Multiple mini-LEDs are arranged in a quadrilateral or equilateral triangle distribution.

15. The light emitting module according to claim 1, wherein: The first light homogenizing component and the reflective layer are an integrated structure, and the integrated structure is a diffuse reflective material layer with bubbles.

16. A display module, characterized in that: include: A display panel and a light-emitting module according to any one of claims 1 to 15, wherein the display panel is arranged on a side away from the light-emitting side of the light-emitting element.

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