Camera module and control method thereof, control device, electronic device and storage medium

Abstract

The present application discloses a camera module and a control method, a control device, an electronic device and a storage medium thereof. The camera module comprises: a lens, a base, a circuit board, a focusing assembly, a light intensity detector and an image sensor; the lens is arranged on the focusing assembly, the base has a first surface and a second surface relative to each other and an inner cavity penetrating the first surface and the second surface, the focusing assembly is arranged on the first surface, the circuit board is arranged on the second surface of the base, the image sensor is built into the inner cavity and arranged on the circuit board; the light intensity detector is used to detect the power density of incident light, and the lens can move relative to the base.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to a camera module and a control method thereof, a control device, an electronic device and a storage medium. Background Art

[0002] Nowadays, mobile phones and tablet computers have become indispensable electronic devices in people's daily lives. For example, people are accustomed to using mobile phones to record some special or classic scenes in daily life. Among them, the photosensitive components used in the camera module of the mobile phone are mostly complementary metal oxide semiconductor (CMOS) image sensors.

[0003] When taking photos in certain usage scenarios, there will be laser irradiation. Since lasers have high brightness and high directionality, when lasers are irradiated on the camera module, the laser energy is concentrated on the image sensor under the focusing effect of the lens. Lasers of a certain power will burn the image sensor and form a dot-shaped or cross-shaped failure area on the image sensor. Through failure analysis, it was found that after the laser burns the image sensor, its failure phenomenon is irreversible. At the least, a small number of pixels are damaged, and black spots appear when taking photos; at the worst, a large number of surrounding pixel structures are damaged. Summary of the invention

[0004] The present application aims to provide a camera module and its control method, control device, electronic device and storage medium, which can solve the problem that the image sensor in the camera module is prone to structural damage under the irradiation of laser.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a camera module, including: a lens, a base, a circuit board, a focus adjustment component, a light intensity detector, and an image sensor;

[0007] The lens is arranged on the focusing assembly, the base has a first surface and a second surface opposite to each other, and an inner cavity penetrating the first surface and the second surface, the focusing assembly is arranged on the first surface, the circuit board is arranged on the second surface of the base, and the image sensor is built into the inner cavity and arranged on the circuit board;

[0008] The light intensity detector is used to detect the power density of the incident light, and the lens can move relative to the base.

[0009] In a second aspect, an embodiment of the present application provides a method for controlling a camera module, including:

[0010] Obtain the power density of the incident light;

[0011] The lens is driven to move relative to the base based on the power density of the incident light.

[0012] In a third aspect, an embodiment of the present application provides a control device, including:

[0013] An acquisition module, used for acquiring the power density of incident light;

[0014] The control module is used to drive the lens to move relative to the base based on the power density of the incident light.

[0015] In a fourth aspect, an embodiment of the present application proposes an electronic device, comprising: a housing and the above-mentioned camera module, wherein the camera module is arranged in the housing.

[0016] In a fifth aspect, an embodiment of the present application proposes a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, any of the above-mentioned camera module control methods is implemented.

[0017] In an embodiment of the present application, when the power density of the incident light is greater than the power density threshold, the light intensity detector outputs an electrical signal. After receiving the electrical signal, the camera module can drive the lens to move relative to the base. At this time, the focus of the incident light on the image sensor can be changed, thereby reducing the power density of the light on the image sensor and ensuring that the image sensor will not suffer structural damage.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is one of the structural schematic diagrams of the camera module according to an embodiment of the present application;

[0021] Figure 2 This is a second structural schematic diagram of a camera module according to an embodiment of the present application;

[0022] Figure 3 This is a third structural schematic diagram of a camera module according to an embodiment of the present application;

[0023] Figure 4 This is a fourth structural schematic diagram of a camera module according to an embodiment of the present application;

[0024] Figure 5 is a flow chart of a control method of a camera module according to an embodiment of the present application;

[0025] Figure 6 is a structural block diagram of a control device according to an embodiment of the present application;

[0026] Reference numerals:

[0027] 1: Circuit board; 2: Image sensor;

[0028] 3: Base; 4: Light intensity detector;

[0029] 5: Focusing assembly; 51: Driving base;

[0030] 52: lens carrier; 6: lens;

[0031] 61: first lens; 62: second lens;

[0032] 7: Elastic connector. DETAILED DESCRIPTION

[0033] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0034] In the description of the present application, it should be understood that the terms "first" and "second" may explicitly or implicitly include one or more of the features.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] The external laser passes through the cover glass and enters the lens. When the laser passes through the lens, it will converge. The power density of the laser is not very high when it reaches the lens. When it reaches the infrared filter, the power density becomes higher, but it has not reached the level that can damage the infrared filter. When the laser further reaches the image sensor, the laser is focused to the minimum, and the power density at this time reaches the highest value. At this time, the thermal accumulation effect of continuous laser will cause damage to the image sensor. Therefore, when the camera module is damaged, the image sensor is damaged. Among them, the above-mentioned laser can be the laser at the laser exhibition, or the laser emitted by the laser pen. The cover glass is the cover glass above the lens. The rear camera corresponds to the cover glass on the back; the front camera corresponds to the screen cover glass.

[0037] Currently, when most camera modules are not working, the lens is in a natural state. At this time, the point where the lens focuses external light is just near the surface of the image sensor. In other words, even if the camera module is not working, it is easy to fail when aiming at the laser.

[0038] In order to solve the above problems, Figures 1 to 4 As shown, the camera module of the embodiment of the present application includes: a lens 6, a base 3, a circuit board 1, a focusing assembly 5, a light intensity detector 4 and an image sensor 2.

[0039] The lens 6 is mounted on the focusing assembly 5, and the base 3 can be a closed-loop plastic part, that is, the outer contour of the cross section of the base 3 in the direction perpendicular to the axis of the lens 6 can be a closed square, circle or polygon. The base 3 has a first surface, a second surface and an inner cavity that passes through the first surface and the second surface. The focusing assembly 5 is mounted on the first surface, the circuit board 1 is mounted on the second surface, and the image sensor 2 is built into the inner cavity and is coaxially arranged on the circuit board 1 with the lens 6.

[0040] For example, a mounting position for the image sensor 2 is provided on the circuit board 1 . After the image sensor 2 is placed at the mounting position, an electrical connection can be formed by welding the image sensor 2 with a preset soldering foot on the circuit board 1 through a gold wire.

[0041] The focusing assembly 5 can be installed on the first surface by means of glue, threads or snaps, and the second surface of the base 3 can be installed on the reserved base mounting position on the circuit board 1 by glue or snaps. Specifically, a groove can be provided on the plastic bottom surface corresponding to the second surface of the base 3, and a corresponding boss can be provided on the circuit board 1 to better position and install the base 3 and the circuit board 1. Of course, a snap structure can also be provided for direct installation, and no specific restrictions are made here.

[0042] When the camera module is focused, the lens 6 can pass through the inner cavity of the base 3 and approach the image sensor 2 under the drive of the focusing assembly 5 to form a clear image surface on the image sensor 2.

[0043] The light intensity detector 4 is made of a composite material of photonic crystal and liquid crystal monomer. The potential difference at both ends of the light intensity detector 4 increases with the increase of light intensity, so it has the function of real-time detection of laser intensity. For example, the light intensity detector 4 can set a light power density threshold, and can output an electrical signal when the light power density exceeds the power density threshold.

[0044] The light intensity detector 4 is used to detect the power density of the incident light, and the camera module can drive the lens 6 to move relative to the base 3 according to the power density of the incident light, so that the power density of the light on the image sensor 2 is equal to the target power density. At the target power density, the image sensor 2 will not suffer structural damage.

[0045] In an embodiment of the present application, when the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal. After receiving the electrical signal, the camera module can drive the lens 6 to move relative to the base 3. At this time, the focus of the incident light on the image sensor 2 can be changed, thereby reducing the power density of the light on the image sensor 2 and ensuring that the image sensor 2 will not suffer structural damage.

[0046] In an optional embodiment, the light intensity detector 4 is located outside the camera module. In this case, the camera module further includes a filter, which is arranged on a side of the image sensor 2 facing away from the circuit board 1 .

[0047] The filter may be an infrared cut-off filter, and may also be other filters, such as a narrow-band filter, a band-pass filter, etc., which are not specifically limited here.

[0048] It should be noted that when the filter is attached to the upper surface of the image sensor 2, it can be attached through an automatic mounting process. For example, through automatic mounting equipment, glue is first applied around the image sensor 2, and then the filter is attached to the surface of the image sensor 2 through a suction nozzle; of course, the filter can also be directly packaged on the upper surface of the image sensor 2 when the image sensor 2 is manufactured through semiconductor packaging technology.

[0049] In an optional embodiment, in order to improve the measurement accuracy of the power density of the incident light, the light intensity detector 4 is built into the inner cavity and is coaxially arranged with the lens 6 on the side of the image sensor 2 facing away from the circuit board 1 .

[0050] The incident light can pass through the light intensity detector 4 and then enter the image sensor 2 .

[0051] It should be noted that the incident light passes through the lens 6 and the light intensity detector 4 in sequence and then enters the image sensor 2. The light intensity detector 4 needs to ensure that the incident light can pass through itself to reach the image sensor 2.

[0052] In an optional embodiment, in order to improve the structural compactness of the camera module, the light intensity detector 4 is also used to filter out infrared light in the incident light, and the projection area of ​​the light intensity detector 4 on the circuit board 1 is larger than the projection area of ​​the image sensor 2 on the circuit board 1.

[0053] It should be noted that the light intensity detector 4 has the function of a filter, the light intensity detector 4 and the image sensor 2 are arranged coaxially, and the projection area of ​​the light intensity detector 4 on the circuit board 1 is larger than the projection area of ​​the image sensor 2 on the circuit board 1, which can prevent the incident light from bypassing the light intensity detector 4 and then entering the image sensor 2.

[0054] In an optional embodiment, an infrared absorption film is provided on a side of the light intensity detector 4 facing away from the image sensor 2 .

[0055] It should be noted that, in order to ensure the measurement accuracy of the light intensity detector 4 for the power density of the incident light, the infrared absorption film is arranged on the side of the light intensity detector 4 away from the image sensor 2 .

[0056] In an optional embodiment, if Figure 1 and Figure 2 As shown, the light intensity detector 4 is connected to the focusing component 5 .

[0057] The focusing assembly 5 can drive the lens 6 to move closer to or farther away from the image sensor 2 .

[0058] In the case where the power density of the incident light is greater than the power density threshold, the focusing assembly 5 can drive the lens 6 to move in a direction away from the image sensor 2 .

[0059] Among them, when the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal. After receiving the electrical signal, the integrated circuit of the camera module can output an operation instruction. The focusing component 5 can drive the lens 6 to move relative to the base 3 according to the operation instruction. At this time, the focus of the incident light on the image sensor 2 can be changed, thereby reducing the power density of the light on the image sensor 2 and ensuring that the image sensor 2 will not suffer structural damage.

[0060] It should be noted that the distance that the lens 6 moves in the direction away from the image sensor 2 is determined according to the difference between the power density of the incident light and the power density threshold.

[0061] In an optional embodiment, the power density threshold is 10000-100000 w / cm 2 .

[0062] For example, at a power density threshold of 10000w / cm 2 , and the power density of the incident light is 9000w / cm 2In the case of , the light intensity detector 4 will not output an electrical signal; when the power density threshold is 10000w / cm 2 , and the power density of the incident light is 11000w / cm 2 Under such circumstances, the light intensity detector 4 can output an electrical signal.

[0063] It should be noted that the power density threshold can be 10000w / cm 2 , 50000w / cm 2 Or 100000w / cm 2 The power density threshold can be selected according to actual needs and is not specifically limited here.

[0064] In an optional embodiment, if Figure 3 and Figure 4 As shown, the focusing assembly 5 includes a driving base 51 and a lens carrier 52. The magnet is fixed on the driving base 51. The magnet is arranged along the circumference of the lens carrier 52. A coil is wound around the lens carrier 52. The lens carrier 52 is in a magnetic field environment formed by the magnet. When the coil on the lens carrier 52 is energized, a Lorentz force is generated, so that the coil moves under the force, driving the movement of the lens carrier 52 and the lens 6 to achieve automatic focusing.

[0065] The lens 6 includes a plurality of lenses, and the camera module further includes an elastic connector 7, and at least one lens is connected to the lens carrier 52 via the elastic connector 7, that is, one end of the elastic connector 7 is connected to the inner wall of the lens carrier 52, and the other end of the elastic connector 7 is connected to the edge of the lens. The elastic connector 7 can drive at least one lens to move in a direction parallel to the image sensor 2.

[0066] The lens connected with the elastic connecting member 7 is parallel to the other lenses, and the other lenses refer to the lenses not connected with the elastic connecting member 7 .

[0067] The elastic connector 7 can switch between a first state and a second state. When the elastic connector 7 is in the first state, the projections of multiple lenses on the image sensor 2 overlap; when the elastic connector 7 is in the second state, the projection of the lens connected to the elastic connector 7 on the image sensor 2 is staggered with the projections of the remaining lenses on the image sensor 2.

[0068] Wherein, when the power density of the incident light is greater than the power density threshold, the elastic connecting member 7 can be switched from the first state to the second state.

[0069] For example, Figure 4 As shown, the lens 6 includes a first lens 61 and a second lens 62 . The following description will be made by taking the example that the second lens 62 is connected to the lens carrier 52 via the elastic connector 7 .

[0070] When the power density of the incident light is less than the power density threshold, the elastic connector 7 is in the first state, and the projections of the first lens 61 and the second lens 62 on the image sensor 2 overlap; when the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal, and the integrated circuit of the camera module can output an operation instruction after receiving the electrical signal, and the elastic connector 7 can switch from the first state to the second state according to the operation instruction. At this time, the projections of the first lens 61 and the second lens 62 on the image sensor 2 are staggered, thereby changing the focus of the incident light on the image sensor 2 to reduce the power density of the light on the image sensor 2 and ensure that the image sensor 2 will not suffer structural damage.

[0071] In an optional embodiment, there are multiple elastic connectors 7, and the multiple elastic connectors 7 are connected to the multiple lenses in a one-to-one correspondence.

[0072] When the plurality of elastic connectors 7 are all in the second state, the projection of at least one lens on the image sensor 2 is displaced from the projections of the remaining lenses on the image sensor 2 .

[0073] For example, the lens 6 includes a first lens 61 and a second lens 62 . The following description will be made by taking an example that the first lens 61 is connected to the lens carrier 52 via an elastic connector 7 , and the second lens 62 is connected to the lens carrier 52 via another elastic connector 7 .

[0074] When the power density of the incident light is less than the power density threshold, the two elastic connectors 7 are in the first state, and the projections of the first lens 61 and the second lens 62 on the image sensor 2 overlap; when the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal, and the integrated circuit of the camera module can output two operation instructions after receiving the electrical signal, and the two elastic connectors 7 can switch from the first state to the second state according to the corresponding operation instructions. At this time, the projections of the first lens 61 and the second lens 62 on the image sensor 2 are staggered, thereby changing the focus of the incident light on the image sensor 2 to reduce the power density of the light on the image sensor 2 and ensure that the image sensor 2 will not be structurally damaged.

[0075] In an optional embodiment, the elastic connecting member 7 is a shape memory alloy member, and the shape memory alloy member drives the lens to move relative to the lens carrier 52 through its own thermal deformation.

[0076] For example, the power source is connected to the shape memory alloy member through a wire, that is, the power source, the wire and the shape memory alloy member form a heat-generating electrical circuit.

[0077] When the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal. After receiving the electrical signal, the integrated circuit of the camera module can start the power supply, and the shape memory alloy component can generate heat, thereby switching from the first state to the second state. At this time, the projections of the first lens 61 and the second lens 62 on the image sensor 2 are staggered, thereby changing the focus of the incident light on the image sensor 2 to reduce the power density of the light on the image sensor 2, ensuring that the image sensor 2 will not suffer structural damage.

[0078] In an optional embodiment, the elastic connecting member 7 is an electrodeformable member, which can deform when powered on, thereby driving the lens to move relative to the lens carrier 52 .

[0079] The material of the electrodeformable element may be an ionic polymer metal composite material. Of course, the material of the electrodeformable element may also be other materials, such as piezoelectric ceramics, which is not specifically limited here.

[0080] In addition, if Figure 5 As shown, the embodiment of the present application also provides a method for controlling a camera module, including:

[0081] S100, obtaining the power density of the incident light.

[0082] The light intensity detector 4 is used to detect the power density of the incident light.

[0083] The light intensity detector 4 can be located outside the camera module. In this case, the camera module also includes a filter, which is arranged on the side of the image sensor 2 away from the circuit board 1; or, the light intensity detector 4 is built into the inner cavity and is coaxially arranged with the lens 6 on the side of the image sensor 2 away from the circuit board 1, and the incident light can pass through the light intensity detector 4 and then enter the image sensor 2.

[0084] S200 , driving the lens 6 to move relative to the base 3 based on the power density of the incident light.

[0085] When the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal. After receiving the electrical signal, the integrated circuit of the camera module can output an operation instruction. The focusing component 5 can drive the lens 6 to move relative to the base 3 according to the operation instruction. At this time, the focus of the incident light on the image sensor 2 can be changed, thereby reducing the power density of the light on the image sensor 2 and ensuring that the image sensor 2 will not suffer structural damage.

[0086] In an embodiment of the present application, when it is determined that the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal. After receiving the electrical signal, the camera module can drive the lens 6 to move relative to the base 3. At this time, the focus of the incident light on the image sensor 2 can be changed, thereby reducing the power density of the light on the image sensor 2 and ensuring that the image sensor 2 will not suffer structural damage.

[0087] In an optional embodiment, the lens 6 is driven to move relative to the base 3 based on the power density of the incident light, including:

[0088] The elastic connecting member 7 is controlled to switch between a first state and a second state based on the power density of the incident light. When the elastic connecting member 7 is in the first state, the projections of the plurality of lenses on the image sensor 2 overlap. When the elastic connecting member 7 is in the second state, the projections of the lenses connected to the elastic connecting member 7 on the image sensor 2 are staggered with the projections of the remaining lenses on the image sensor 2.

[0089] The power density of the incident light corresponding to the elastic connecting member 7 in the first state is smaller than the power density of the incident light corresponding to the elastic connecting member 7 in the second state.

[0090] When the power density of the incident light is less than the power density threshold, the elastic connector 7 is in the first state, and the projections of the first lens 61 and the second lens 62 on the image sensor 2 overlap; when the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal, and the integrated circuit of the camera module can output an operation instruction after receiving the electrical signal, and the elastic connector 7 can switch from the first state to the second state according to the operation instruction. At this time, the projections of the first lens 61 and the second lens 62 on the image sensor 2 are staggered, thereby changing the focus of the incident light on the image sensor 2 to reduce the power density of the light on the image sensor 2 and ensure that the image sensor 2 will not suffer structural damage.

[0091] In an optional embodiment, when the plurality of elastic connectors 7 are in the second state, the projection of at least one lens on the image sensor 2 is staggered with the projections of the remaining lenses on the image sensor 2 .

[0092] For example, the lens 6 includes a first lens 61 and a second lens 62 . The following description will be made by taking an example that the first lens 61 is connected to the lens carrier 52 via an elastic connector 7 , and the second lens 62 is connected to the lens carrier 52 via another elastic connector 7 .

[0093] When the power density of the incident light is less than the power density threshold, the two elastic connectors 7 are in the first state, and the projections of the first lens 61 and the second lens 62 on the image sensor 2 overlap; when the power density of the incident light is greater than the power density threshold, the light intensity detector 4 outputs an electrical signal, and the integrated circuit of the camera module can output two operation instructions after receiving the electrical signal, and the two elastic connectors 7 can switch from the first state to the second state according to the corresponding operation instructions. At this time, the projections of the first lens 61 and the second lens 62 on the image sensor 2 are staggered, thereby changing the focus of the incident light on the image sensor 2 to reduce the power density of the light on the image sensor 2 and ensure that the image sensor 2 will not be structurally damaged.

[0094] In addition, an embodiment of the present application also provides an electronic device, including: a housing and a camera module according to any of the above embodiments, wherein the camera module is disposed in the housing.

[0095] Since the electronic device includes the camera module as described above, and the specific structure of the camera module refers to the above embodiment, the electronic device shown in this embodiment includes all the technical solutions of the above embodiment, and therefore has at least all the beneficial effects achieved by all the above technical solutions, which will not be described one by one here.

[0096] In addition, the present application provided in the embodiments of the present application also provides a control device. In the embodiments of the present application, the control device is described by taking the control method of the camera module described in any of the above embodiments as an example.

[0097] like Figure 6 As shown, the control device includes an acquisition module 10 and a control module 20 .

[0098] The acquisition module 10 is used to acquire the power density of the incident light, and the control module 20 is used to drive the lens 6 to move relative to the base 3 based on the power density of the incident light.

[0099] Further, the control module 20 is further used to control the elastic connector 7 to switch between the first state and the second state based on the power density of the incident light. When the elastic connector 7 is in the first state, the projections of the plurality of lenses on the image sensor 2 overlap; when the elastic connector 7 is in the second state, the projections of the lenses connected to the elastic connector 7 on the image sensor 2 are staggered with the projections of the remaining lenses on the image sensor 2.

[0100] The power density of the incident light corresponding to the elastic connecting member 7 in the first state is smaller than the power density of the incident light corresponding to the elastic connecting member 7 in the second state.

[0101] Furthermore, the control module 20 is also used to cause the light intensity detector 4 to output an electrical signal when the power density of the incident light is greater than the power density threshold. After receiving the electrical signal, the integrated circuit of the camera module can output an operation instruction, and the focusing component 5 can drive the lens 6 to move relative to the base 3 according to the operation instruction. At this time, the focus of the incident light on the image sensor 2 can be changed, thereby reducing the power density of the light on the image sensor 2 and ensuring that the image sensor 2 will not suffer structural damage.

[0102] Furthermore, the control module 20 is also used for displacing the projection of at least one lens on the image sensor 2 with the projections of the remaining lenses on the image sensor 2 when the plurality of elastic connectors 7 are all in the second state.

[0103] The control device in the embodiment of the present application can be an electronic device, or a component in the electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal, or other devices other than a terminal. Exemplarily, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and can also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0104] The control device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0105] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the various processes of the above-mentioned control method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0106] The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a computer read-only memory ROM, a random access memory RAM, a magnetic disk or an optical disk.

[0107] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned control method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0108] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0109] The embodiment of the present application provides a computer program product, which is stored in a storage medium, and the program product is executed by at least one processor to implement the various processes of the control method embodiment described above, and can achieve the same technical effect. To avoid repetition, it is not repeated here. In the description of this specification, the description of the reference term "optional implementation" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0110] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that: include: Lenses, bases, circuit boards, focusing components, light intensity detectors, and image sensors; The lens is arranged on the focusing assembly, the base has a first surface and a second surface opposite to each other, and an inner cavity penetrating the first surface and the second surface, the focusing assembly is arranged on the first surface, the circuit board is arranged on the second surface of the base, and the image sensor is built into the inner cavity and arranged on the circuit board; The light intensity detector is used to detect the power density of incident light; The light intensity detector is connected to the focusing assembly, and the focusing assembly can drive the lens to move closer to or away from the image sensor; The focusing assembly includes a lens carrier, the lens includes a plurality of lenses, and the camera module also includes an elastic connector, at least one of the lenses is connected to the lens carrier via the elastic connector, and when the power density of the incident light is greater than a power density threshold, the camera module controls the elastic connector to drive at least one of the lenses to move in a direction parallel to the image sensor, so that the projection of at least one of the plurality of lenses on the image sensor is staggered with the projections of the remaining lenses on the image sensor.

2. The camera module according to claim 1, characterized in that: The light intensity detector is built in the inner cavity and is arranged on a side of the image sensor away from the circuit board.

3. The camera module according to claim 2, characterized in that: The light intensity detector is also used to filter out infrared light in the incident light, and the projection area of ​​the light intensity detector on the circuit board is larger than the projection area of ​​the image sensor on the circuit board.

4. The camera module according to claim 3, characterized in that: An infrared absorption film is provided on a side of the light intensity detector away from the image sensor.

5. The camera module according to claim 1, characterized in that: There are multiple elastic connectors, and the multiple elastic connectors are connected to the multiple lenses in a one-to-one correspondence.

6. The camera module according to claim 1, characterized in that: The elastic connecting member is a shape memory alloy member, and the shape memory alloy member drives the lens to move relative to the lens carrier.

7. The camera module according to claim 1, characterized in that: The elastic connecting member is an electro-deformable member, and the electro-deformable member drives the lens to move relative to the lens carrier.

8. A camera module control method, applied to the camera module according to any one of claims 1 to 7, characterized in that: include: Obtain the power density of the incident light; driving the lens to move relative to the base based on the power density of the incident light; The driving the lens to move relative to the base based on the power density of the incident light comprises: The elastic connecting member is controlled to switch between a first state and a second state based on the power density of the incident light, wherein when the elastic connecting member is in the first state, projections of the plurality of lenses on the image sensor overlap; and when the elastic connecting member is in the second state, a projection of at least one of the plurality of lenses on the image sensor is staggered with projections of the remaining lenses on the image sensor; Wherein, the power density of the incident light corresponding to the elastic connecting member in the first state is smaller than the power density of the incident light corresponding to the elastic connecting member in the second state.

9. The control method of the camera module according to claim 8, characterized in that: Also includes: There are multiple elastic connectors, and when the multiple elastic connectors are in the second state, the projection of at least one lens on the image sensor is staggered with the projections of the remaining lenses on the image sensor.

10. A control device, applied to the control method of the camera module according to claim 8, characterized in that: include: An acquisition module, used for acquiring the power density of incident light; A control module, configured to drive the lens to move relative to the base based on the power density of the incident light; The driving the lens to move relative to the base based on the power density of the incident light comprises: The elastic connecting member is controlled to switch between a first state and a second state based on the power density of the incident light, wherein when the elastic connecting member is in the first state, projections of the plurality of lenses on the image sensor overlap; and when the elastic connecting member is in the second state, a projection of at least one of the plurality of lenses on the image sensor is staggered with projections of the remaining lenses on the image sensor; Wherein, the power density of the incident light corresponding to the elastic connecting member in the first state is smaller than the power density of the incident light corresponding to the elastic connecting member in the second state.

11. An electronic device, characterized in that: It comprises: a shell and a camera module according to any one of claims 1 to 7, wherein the camera module is arranged in the shell.

12. A readable storage medium, characterized in that: The readable storage medium stores programs or instructions, and when the programs or instructions are executed by the processor, the control method of the camera module as described in any one of claims 8 to 9 is implemented.

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