Radiographic detector reading

Abstract

A flexible digital radiography detector assembly includes a flexible sleeve enclosing an array of photosensors supported by a flexible substrate. Integrated circuit readout electronics are coupled to the array of photosensors and to a circuit board having conductive contacts. The contacts engage a handheld readout electronics cartridge to initiate reading of image data captured in the array of photosensors and to display the image data on a screen in the readout electronics cartridge.

Description

Technical Field

[0001] The subject matter disclosed in this article relates to digital radiography (DR) detectors. Background Technology

[0002] Portable digital radiographic detectors have been widely used to improve X-ray imaging productivity, X-ray image quality, and ease of use. In particular, industrial radiographic imaging is often conducted in challenging outdoor environments. This type of imaging process is best served by lightweight, flexible, and durable portable detectors to enhance ease of use and reliability.

[0003] Current digital radiographic detectors typically consist of an amorphous two-dimensional silicon TFT / photodiode image sensor array, fabricated on glass using semiconductor processes (similar to those used for flat panel displays). The scintillator, the image sensor array, and the electronics required for signal readout and processing, supported by an internal core board, are all housed within a durable housing to create a portable DR detector.

[0004] Figure 1 This is a perspective view of a digital radiographic (DR) imaging system 10 according to one embodiment. The DR imaging system may include a generally curved or planar DR detector 40 (shown in a planar embodiment and without a housing for clarity), an x-ray source 14 configured to generate radiographic energy (x-ray radiation), and a digital monitor or electronic display 26 configured to display images captured by the DR detector 40. The DR detector 40 may include a two-dimensional array 12 of detector units 22 (photodetectors) arranged in electronically addressable rows and columns. The DR detector 40 may be positioned to receive x-rays 16 emitted by the x-ray source 14 that pass through the object 20 during radiographic energy exposure or a radiographic energy pulse. Figure 1As shown, the radiographic imaging system 10 can use an x-ray source 14 that emits collimated x-rays 16 (e.g., an x-ray beam) that are selectively aimed at and pass through a pre-selected region 18 of the object 20. Depending on the internal structure of the object 20, the x-ray beam 16 may attenuate to varying degrees along its multiple rays, which are detected by an array 12 of photodetector units 22. A curved or planar DR detector 40 is positioned as perpendicular as possible to the substantially central ray 17 of the multiple rays 16 emitted by the x-ray source 14. In a curved array embodiment, the source 14 may be centrally positioned such that a larger percentage or all of the photodetector units are positioned perpendicular to the incident x-rays from the centrally positioned source 14. The array 12 of individual photosensitive units (pixels) 22 can be electronically addressed (scanned) by their position according to columns and rows. As used herein, the terms “column” and “row” refer to the vertical and horizontal arrangement of the photodetector units 22, and for clarity, it will be assumed that rows extend horizontally and columns extend vertically. However, the orientation of columns and rows is arbitrary and does not limit the scope of any embodiments disclosed herein. Furthermore, the term "object" can be illustrated as... Figure 1 The description refers to human patients; however, as used in this document, the object of a DR imaging system can be a human, animal, inanimate object, or part thereof.

[0005] In one exemplary embodiment, rows of photosensitive cells 22 can be scanned one or more rows at a time by electronic scanning circuitry 28, enabling exposure data from array 12 to be transmitted to electronic readout circuitry 30. Each photosensitive cell 22 can independently store a charge proportional to the intensity or energy level of the attenuated radiographic radiation or X-rays received and absorbed in the cell. Thus, upon readout, each photosensitive cell provides information defining the pixels of the radiographic image 24, such as the brightness level or the amount of energy absorbed by the pixel, which can be digitally decoded by image processing electronics 34 and transmitted for display by digital monitor 26 for viewing by a user. Electronic bias circuitry 32 is electrically connected to the two-dimensional detector array 12 to provide a bias voltage to each photosensitive cell 22.

[0006] Each of the bias circuit 32, scanning circuit 28, and readout circuit 30 can communicate with the acquisition control and image processing unit 34 via a connected cable 33 (wired), or the DR detector 40 and the acquisition control and image processing unit 34 can be equipped with a wireless transmitter and receiver to wirelessly transmit radiographic image data 35 to the acquisition control and image processing unit 34. The acquisition control and image processing unit 34 may include a processor and electronic memory (not shown) to control the operation of the DR detector 40 as described herein, including, for example, controlling circuits 28, 30, and 32 using programming instructions, and storing and processing image data. The acquisition control and image processing unit 34 can also be used to control the activation of the x-ray source 14 during radiographic exposure, control the x-ray tube current value, and thus control the fluence of x-rays in the x-ray beam 16 and / or the x-ray tube voltage, and thus control the energy level of x-rays in the x-ray beam 16. Some or all of the functions of the acquisition control and image processing unit 34 may reside in the detector 40 within an onboard processing system 36, which may include a processor and electronic memory to control the operation of the DR detector 40 as described herein, including controlling circuits 28, 30, and 32 using programming instructions, and storing and processing image data similar to the functions of the independent acquisition control and image processing system 34. The image processing system may perform image acquisition and image processing functions as described herein. The image processing system 36 may control image transmission, image processing, and image correction loaded on the detector 40 based on instructions or other commands transmitted from the acquisition control and image processing unit 34, and transmit corrected digital image data from there. Alternatively, the acquisition control and image processing unit 34 may receive raw image data from the detector 40 and process and store the image data, or it may store the raw, unprocessed image data in local memory or remotely accessible memory.

[0007] In a direct detection embodiment of the DR detector 40, each photosensitive unit 22 may include an x-ray-sensitive sensing element, i.e., which absorbs x-rays and generates an amount of charge carrier proportional to the amount of absorbed x-ray energy. A switching element may be configured to be selectively activated to read the charge level of the corresponding x-ray sensing element. In an indirect detection embodiment of the DR detector 40, each photosensitive unit 22 may include a light-sensitive sensing element sensitive to light rays in the visible spectrum, i.e., which absorbs light rays and generates an amount of charge carrier proportional to the amount of absorbed light energy, and a switching element selectively activated to read the charge level of the corresponding sensing element. A scintillator or wavelength converter may be disposed above the photosensitive element to convert incident x-ray radiographic energy into visible light energy. Therefore, in the embodiments disclosed herein, it should be noted that the DR detector 40 (or Figure 3 DR detector 300 or Figure 4 The DR detector 400 in the DR detector can include indirect or direct type DR detectors.

[0008] Examples of sensing elements used in sensing array 12 include various types of photoelectric conversion devices (e.g., photoelectric sensors), such as photodiodes (PN or PIN diodes), photocapacitors (MIS), phototransistors, or photoconductors. Examples of switching elements used for signal readout include a-Si TFTs, oxide TFTs, MOS transistors, bipolar transistors, and other pn junction components.

[0009] Figure 2 This is a schematic diagram 240 of a portion of the two-dimensional array 12 used for the DR detector 40. The array of photoelectric sensor units 212 (whose operation can be consistent with the photoelectric sensor array 12 described above) may include a plurality of hydrogenated amorphous silicon (a-Si:H) nip photodiodes 270 and thin-film transistors (TFTs) 271, formed as field-effect transistors (FETs), each FET having a gate (G), source (S), and drain (D) terminal. In embodiments of the DR detector 40 disclosed herein, such as multilayer DR detectors (… Figure 4 The two-dimensional array of photodetector unit 12 (400) can be formed in a device layer adjacent to an adjacent layer of the DR detector structure. This adjacent layer may include a rigid glass layer or a flexible polyimide layer or a layer including carbon fibers, without any adjacent rigid layer. Multiple gate driver circuits 228 can be electrically connected to multiple gate lines 283 that control the voltage applied to the gate of the TFT 271, multiple readout circuits 230 can be electrically connected to data lines 284, and multiple bias lines 285 can be electrically connected to a bias line bus or a variable bias reference voltage line 232 that controls the voltage applied to the photodiode 270. A charge amplifier 286 can be electrically connected to data lines 284 to receive signals from them. The outputs from the charge amplifier 286 can be electrically connected to a multiplexer 287, such as an analog multiplexer, and then electrically connected to an analog-to-digital converter (ADC) 288, or they can be directly connected to the ADC to stream digital radiographic image data at the desired rate. In one embodiment, Figure 2 The schematic diagram can represent a portion of the DR detector 40, such as an indirect flat panel, curved panel, or flexible panel imager based on a-Si:H.

[0010] Incident X-rays or X-ray photons 16 are converted into optical photons or light rays by a scintillator, which are then converted into electron-hole pairs or charges upon impact with an a-Si:H nip photodiode 270. In one embodiment, an exemplary detector unit 222 (which may be equivalently referred to herein as a pixel) may include a photodiode 270 with its anode electrically connected to a bias line 285 and its cathode electrically connected to the drain (D) of a TFT 271. A bias reference voltage line 232 is capable of controlling the bias voltage of the photodiode 270 at each detector unit 222. The charge capacity of each photodiode 270 is a function of its bias voltage and its capacitance. Typically, a reverse bias voltage (e.g., a negative voltage) may be applied to the bias line 285 to create an electric field (and thus a dissipation region) across the pn junction of each photodiode 270 to improve its collection efficiency for the charge generated by the incident light rays. The image signal represented by the array of photoelectric sensor units 212 can be integrated by photodiodes while their associated TFTs 271 remain in a non-conductive (off) state, for example, by maintaining the gate line 283 at a negative voltage via the gate driver circuit 228. The photoelectric sensor unit array 212 can be read by means of the gate driver circuit 228 by sequentially switching the rows of TFTs 271 to a conductive (on) state. When a row of pixels 22 is switched to a conductive state (e.g., by applying a positive voltage to the corresponding gate line 283), the charge collected from the photodiodes in these pixels can be transferred along the data line 284 and integrated by the external charge amplifier circuit 286. The row can then be switched back to the non-conductive state, and this process is repeated for each row until the entire array of photoelectric sensor units 212 has been read. Using a parallel-to-serial converter, such as a multiplexer 287, which together include a readout circuit 230, the integrated signal output is transmitted from the external charge amplifier 286 to an analog-to-digital converter (ADC) 288.

[0011] The digital image information can then be processed by the image processing system 34 to produce a digital image, which can then be digitally stored and immediately displayed on the monitor 26, or can be displayed later by accessing a digital electronic memory containing the stored image. (See reference...) Figure 2 The flat panel DR detector 40 of the imaging array is capable of both single-emission (e.g., static, radiography) and continuous (e.g., fluorescence imaging) image acquisition.

[0012] Figure 3A perspective view of an exemplary prior art generally rectangular, planar, portable wireless DR detector 300 according to an embodiment of the DR detector 40 disclosed herein is shown. The DR detector 300 may include a flexible substrate to allow the DR detector to capture radiographic images in a curved orientation. The flexible substrate may be manufactured in a permanently curved orientation or remain flexible throughout its lifetime to provide adjustable curvature in two or three dimensions as desired. The DR detector 300 may include a similar flexible housing portion 314 that surrounds a multilayer structure or core including a flexible photoelectric sensor array portion 22 of the DR detector 300. The housing portion 314 of the DR detector 300 may include a continuous, rigid, or flexible x-ray-opaque material, or, as used herein by analogy, a radio-opaque material that surrounds the internal volume of the DR detector 300. The housing portion 314 may include four flexible edges 318 extending between a top side 321 and a bottom side 322 and arranged substantially orthogonally to the top side 321 and the bottom side 322. The bottom side 322 may be continuous with the four edges and is disposed opposite to the top side 321 of the DR detector 300. The top side 321 includes a top cover 312 attached to the housing portion 314, which, together with the housing portion 314, substantially encloses the core within the internal volume of the DR detector 300. The top cover 312 may be attached to the housing 314 to form a seal therebetween and is made of a material through which x-rays 16 are passed without significant attenuation, i.e., an x-ray projection material as used herein by analogy, a radiation-permeable material, such as carbon fiber, carbon fiber-embedded plastic, polymer, elastomer, or other plastic-based material.

[0013] refer to Figure 4 The diagram schematically illustrates the path along the DR detector 300 ( Figure 3An exemplary cross-sectional view of section 4-4 of an exemplary embodiment of the DR detector 400. For spatial reference purposes, as used herein, one main surface or side of the DR detector 400 may be referred to as the top side 451, and a second main surface or side of the DR detector 400 may be referred to as the bottom side 452. A core layer or sheet may be disposed within an internal volume 450 enclosed by a housing 314 and a top cover 312, and may be included as a flexible, curved or planar scintillator layer 404 above a curved or planar two-dimensional imaging sensor array 12, schematically shown as device layer 402. The flexible scintillator layer 404 may be directly beneath the substantially planar top cover 312 (e.g., directly connected to the substantially planar top cover), and the imaging array 402 may be directly beneath the flexible scintillator 404. Alternatively, a flexible layer 406 may be positioned between the flexible scintillator layer 404 and the top cover 312 as part of the core layer structure to allow adjustable curvature of the core layer structure and / or provide shock absorption. The flexible layer 406 may be selected to provide a certain amount of flexible support for both the top cover 312 and the scintillator 404, and may include a material of the foam rubber type. (See reference...) Figure 3 The layers, which include the core layered structure, described above, are typically formed in a rectangular shape and defined by orthogonally arranged edges, and are arranged to be parallel to the inside of the edge 318 of the housing 314.

[0014] A substrate layer 420 may be disposed below an imaging array 402, which in one embodiment is a rigid glass layer, or a flexible substrate comprising polyimide or carbon fiber, on which a photoelectric sensor array 402 can be formed to allow for adjustable curvature of the array, and may include another layer of a core layered structure. Below the substrate layer 420, a radiation-impermeable shielding layer 418, such as lead or flexible lead foil, may serve as an X-ray blocking layer to help prevent X-ray scattering through the substrate layer 420 and to block X-rays reflected from other surfaces in the internal volume 450. Readout electronics include scanning circuitry 28, readout circuitry 30, bias circuitry 32, and processing system 36 (all within…). Figure 1 As shown in the diagram, the imaging array 402 may be formed near the imaging array 402, or, as shown, may be disposed below the frame support member 416 in the form of an integrated circuit (IC) electrically connected to printed circuit boards (PCBs) 424, 425. The imaging array 402 may be electrically connected to the reading electronics 424 (IC) via a flexible connector 428, which may include multiple flexible sealed conductors referred to as chip-on-film (CoF) connectors.

[0015] The X-ray flux can pass through the X-ray-permeable top cover 312 in the direction represented by the exemplary X-ray beam 16 and strike the scintillator 404, where stimulation by the high-energy X-rays 16 or photons causes the scintillator 404 to emit low-energy photons as visible light rays, which are then received in the photoelectric sensor of the imaging array 402. An optional frame support member 416 can connect the core layered structure to the housing 314 and can further function as a shock absorber by providing an elastic pad (not shown) between the frame support beam 422 and the housing 314. In the embodiments disclosed herein for flexible positioning of the DR detector, the frame support member 416 can be omitted. Fasteners 410 can be used to attach the top cover 312 to the housing 314 and form a seal between them in the area 430 where they contact. In one embodiment, an external shock absorber 412 can be attached along the edge 318 of the DR detector 400 to provide additional shock absorption.

[0016] Recently, a process has been developed to fabricate image sensor arrays onto durable thin substrates such as polyimide. Because it eliminates the need for glass substrates, this highly durable substrate allows for the use of lighter alternative housing components.

[0017] The above discussion is provided for general background information only and is not intended to help determine the scope of the subject matter for which protection is sought. Summary of the Invention

[0018] A flexible digital radiography (DR) detector assembly includes a flexible sleeve that encloses a photodetector array supported by a flexible substrate. Integrated circuit readout electronics are coupled to the photodetector array and to a circuit board having conductive contacts. The contacts engage a handheld readout electronics cartridge to initiate the reading of image data captured in the photodetector array and to display the image data on a screen within the readout electronics cartridge. The flexible sleeve is capable of receiving a digital radiography detector so that the detector conforms to the surface of a pre-selected structure. Advantages achievable in practice with some disclosed embodiments of the DR detector include a lightweight, flexible, and durable DR detector assembly and the ability to process images in the field, such as in outdoor environments.

[0019] In one embodiment, the flexible digital radiographic detector includes integrated circuit readout electronics coupled to a photodetector array. A flexible sleeve encloses the photodetector array. A circuit board holds the integrated circuit readout electronics and includes conductive contacts for reading image data captured by the photodetector array. The readout electronics housing includes electrical contacts for engaging the circuit board and a display for displaying the images captured by the photodetector array.

[0020] In one embodiment, a method of operating a flexible digital radiography (DR) detector assembly having an array of photoelectric sensors includes attaching the flexible DR detector assembly to a curved structure. A radiographic image of the curved structure is captured in the photoelectric sensor array. The flexible DR detector is inserted into a handheld portable reader having a digital display that reads and displays the radiographic image of the curved structure.

[0021] This brief description of the invention is intended only to provide a brief overview of the subject matter disclosed herein based on one or more illustrative embodiments, and is not intended as guidance for interpreting the claims or defining or limiting the scope of the invention solely by the appended claims. This brief description is provided to introduce illustrative choices of concepts in a simplified form, which will be further described in the detailed description below. This brief description is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. The claimed subject matter is not limited to the implementation of any or all of the disadvantages pointed out in the background. Attached Figure Description

[0022] To understand the features of the invention, it can be described in detail by referring to certain embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only certain embodiments of the invention and should not be considered as limiting its scope, as the scope of the invention includes other equally effective embodiments. The drawings are not necessarily drawn to scale, and the emphasis is generally placed on the features illustrating certain embodiments of the invention. In the drawings, the same numerals are used to indicate common components in various views. Therefore, for a further understanding of the invention, reference can be made to the following detailed description, read in conjunction with the accompanying drawings, in which:

[0023] Figure 1 This is a schematic perspective view of an exemplary X-ray system;

[0024] Figure 2 This is a schematic diagram of the photoelectric sensor array in a radiographic detector;

[0025] Figure 3 This is a perspective view of an exemplary DR detector;

[0026] Figure 4 This is a cross-sectional view of an exemplary DR detector;

[0027] Figures 5A-5B This is a perspective view of an exemplary core component of a DR detector;

[0028] Figures 6A-6B This is a perspective view of an additional exemplary board-side core component of a DR detector;

[0029] Figures 7A-7B This is a perspective view of an exemplary sensor-side core component of a DR detector;

[0030] Figures 8A-8B This is an exploded perspective view of the final DR detector assembly;

[0031] Figure 9A -B illustrates a packaged flexible image sensor array assembly;

[0032] Figure 9C yes Figure 9B Cross-section of the encapsulated flexible image sensor array assembly;

[0033] Figure 10A -C illustrates a sleeve used to encapsulate a flexible image sensor array assembly; and

[0034] Figure 11A -D illustrates the readout electronics box used for detectors of different sizes. Detailed Implementation

[0035] This application claims priority to U.S. Patent Application Serial No. 62 / 950,140, ​​filed on December 19, 2019, in the name of Bogumil et al., entitled “RADIOGRAPHIC DETECTOR READOUT”, the entire contents of which are hereby incorporated by reference.

[0036] refer to Figure 5A and 5B The illustration shows a multi-layered DR detector core 500, which has a substantially planar rectangular high-density foam layer 502, the foam layer being machined to form grooves 503 on its two main sides. Figure 5A As shown, a plate 504 made of metal (such as aluminum) is positioned in a groove on the top side of the foam layer 502. The metal plate or ground plane 504 can be glued to the foam layer 502 to hold it in place. Figure 5B As shown, a groove 503 is machined into the bottom side of the foam layer 502, which will house electronic components. As described herein, the foam layer 502 is also machined to form cutouts 505 through it, into which printed circuit boards and other electronic components can be placed and positioned against a ground plane 504. As described herein, the ground plane 504 serves as an electrical ground for the electronic components to be assembled. Figure 5B As shown, the metal ground plane 504 can be viewed through the cut 505.

[0037] The metal ground plane 504 includes a plurality of holes 506, some of which may be threaded for attaching electrical and mechanical components. Protective end caps 507 (also made of the same or similar high-density foam as foam layer 502) are positioned along the edge of foam layer 502 (after the electronic components are positioned thereon). As mentioned herein, the width dimension of the multilayer core 500 is parallel to its shorter side compared to its length dimension, which is parallel to the longer side. See respectively... Figure 5A and Figure 5B The top and bottom sides of the multilayer core 500 shown, together with other detector component layers as described herein, can be referred to as the main surfaces of the multilayer core 500. Figure 5A As shown, the area of ​​the top-side principal surface of the multilayer core 500 made of foam layer 502 can be approximately the same as or larger than the area made of metal ground plane 504. According to embodiments of the multilayer core 500 disclosed herein, the area of ​​metal ground plane 504 can be designed to cover from approximately 40% to up to approximately 65% ​​of the top-side principal surface area. The foam used for foam layer 502 and end cap 507, as well as other foam components described herein, can include high-density, thermoplastic, closed-cell foam with good heat and flame resistance, thermal and electrical insulation, high strength-to-weight ratio, and low moisture absorption. High-density foams, such as thermoplastic foams based on polyetherimide or foams based on polyvinylidene fluoride, can be used. Alternatively, the foam components can be formed of silicone or rubber.

[0038] Figure 6A and 6B The diagram illustrates the underside of a multilayer core 500 having a PCB positioned within a notch 505 and a recess 503. PCBs 602, 606, and 608, positioned within the notch 505, are adjacent to and can be connected to a ground plane 504 (using screws through holes 506 in the PCB to the ground plane 504). Screws can be used to electrically connect the PCBs to the ground plane 504, or they can be electrically connected individually together. PCB 604 is positioned within the recess 503. The PCB may include, for example, a power distribution electronics PCB 602, a PCB 604 containing a readout integrated circuit (ROIC), a PCB 606 for gate driver lines, and a PCB 608 having a main processor segment. As described herein, some PCBs having gate driver lines 606 and / or ROIC 604 may include conductive communication lines (CoF) 605 extending from PCBs 604, 606 around the edges of the foam layer 502 and ground plane 504 assembly to enable digital communication between the PCB electronics and a radiographic sensor array on the top side of a multilayer core 500 (including a two-dimensional array of photosensitive units). Figure 6BAs shown, the protective foam end cap 507 can be positioned on the edge of the foam layer 502 and the ground surface 504 assembly above the CoF 605.

[0039] Figures 7A-7B The top side of the multilayer core 500 is illustrated. A lead layer 702 is positioned against the top side of the multilayer core 500 to provide shielding against X-rays that may be scattered near the DR detector assembly. The lead layer 702 has an area substantially equal to the area of ​​the main surface of the multilayer core 500, and in the embodiments described herein, the lead layer 702 is the only metal layer in the multilayer core 500 having an area as large as the multilayer core 500 itself. As mentioned herein, a metal ground plane 504 can cover up to about 65% of the area covered by the lead layer 702. A sensor layer 704, which may include a scintillator layer laminated onto a two-dimensional array of photosensitive cells, is placed on the lead layer 702 and located on the top side of the multilayer core 500, as shown below. Figure 7B As shown in the diagram. Sensor layer 704 may further include a polyimide substrate on which a two-dimensional array of photoelectric sensors is formed, and subsequently, a scintillator layer is included thereon, similar to... Figure 4 The core layer is a composite material. The substrate may include a rigid glass substrate, or it may be formed as a flexible substrate, such as a polyimide substrate. Finally, a shock-absorbing foam layer 706 is positioned on top of the substrate / sensor / scintillator layer 704 and typically abuts the inner surface of the housing for the multilayer core 500. In summary, the multilayer core 500 has a thickness between approximately one-eighth of an inch and approximately half an inch, including the PCB traces attached thereto.

[0040] Figures 8A-8B The top and bottom sides of a multi-layered core 500, as assembled, are illustrated. This multi-layered core is inserted into an open end 803 of a housing or casing 800, which can also be considered to have corresponding top and bottom sides. Figure 8BAs shown, the bottom side of the housing 800 includes an opening 801 for placing the battery 802 through it into a corresponding recess 503 in the foam layer 502 after the multilayer core 500 has been fully inserted into the housing 800. Subsequently, a housing end cap 802 can be positioned in the opening end 803 of the housing to seal the opening end 803 of the housing 800 and complete the assembly of the DR detector 900 (FIG. 9). As described herein, such an end cap 802 may be formed of aluminum and positioned to make thermal contact with one or more components in the PCB. The opening end 803 may have a height between approximately one-eighth of an inch and approximately half an inch, similar to the thickness of the multilayer core 500, to allow the multilayer core 500 to slide in through the opening end 803. In one embodiment, when the multilayer core 500 is inserted into the housing 800, the shock-absorbing foam layer 706 may be compressed to half its thickness. As shown, the outer shell 800 is based on carbon fiber materials, such as twill carbon fiber; however, other types of carbon fiber shells, such as carbon fiber embedded in plastic, can also be used. In addition to carbon fiber, magnesium, aluminum, and plastic shells can be used, which are similar in form to the carbon fiber shell 800.

[0041] Figure 9A -C illustrates an embodiment of a flexible core sensor array assembly 901 without a housing 800. Figure 9C It is along Figure 9BA cross-sectional view of the cross-section line CC. As described herein, the sensor array assembly 901 can be used in outdoor (potentially remote) environments to capture radiographic images of industrial equipment exposed to a high-power X-ray source. Various X-ray sources that can be used in outdoor industrial environments are well known to those skilled in the art and will not be described separately herein. The flexible core sensor array assembly 901 with battery 802 is enclosed or packaged in a flexible sealing sleeve, sleeve, or bag 903. The fabrication of the flexible sensor array assembly 901, including the flexible substrate 910, is described herein and in the published PCT patent application WO2018 / 212744A1 entitled FLEXIBLESUBSTRATE MODULE AND FABRICATION METHOD. The flexible sleeve or sheath 903 may be made of polyimide film (such as Kapton developed by DuPont, or Ultem developed by GE) and made of polyetherimide (PEI) resin or very thin FR4, or it may be a metallized bag for protection against electromagnetic interference. The sleeve 903 is preferably sealed to protectively enclose the flexible sensor array assembly 901 against contaminants, moisture, and other elements such as those found in challenging outdoor environments. One layer of the sensor array assembly 901 may include a scintillator layer 907, which may include a GOS-based or cesium-based scintillator. The sensor array layer 909 may include a sensor array formed on a flexible polyimide substrate layer 910, which may be further supported by another flexible polyimide substrate 911. The sensor array layer 909 and the flexible polyimide substrate 910 may be adhered to the additional flexible substrate 911 via a layer of adhesive 912 between them.

[0042] The envelope 903 may include an open side or edge into which the sensor array assembly 901 is inserted. Furthermore, a sliding surface 913 may be formed between the scintillator 907 and the sensor array layer 909. Additionally, a sliding surface may be formed at the same location between the sensor array layer 909 and the substrate 911, replacing the adhesive layer 912, to allow for a sliding bond between them. In one embodiment, to facilitate slight bending of the sensor array assembly 901 around a large radius object, a sliding surface 913 may not be formed between the scintillator 907 and the sensor array layer 909 or between the sensor array layer 909 and the substrate 911 to maintain a desired fixed or high-friction bond between them. The more layers attached or adhered to each other in a layered stack, the more rigid and less flexible the stack becomes, which may introduce limitations on how small the bending radius can be achieved. The polyimide portion of the sensor array layer 909 may include a thickness between about 10 μm and about 100 μm, preferably between about 30 μm and 50 μm. The substrate layer 911 may include a thickness of about 50 μm to about 350 μm, preferably between about 150 μm and 250 μm. Durability characteristics, such as those of the sensor array assembly 901, can be increased with a greater thickness of the substrate 911, while flexibility can be increased with a smaller thickness of the substrate 911.

[0043] In one embodiment, such as Figure 10A As shown in the top view of -B, the sleeve or cover 903 can be formed by placing two sheets or two layers of selected encapsulation material having a larger area than the sensor assembly 901, one on the top side of the sensor array assembly 901 and the other on the bottom side of the sensor array assembly 901, and then adhering their edges together around the periphery 905 of the sensor array assembly 901. In one embodiment, one or both of such sheets may include adhesive on the inner surface within the periphery 905 to securely attach the encapsulation material to the sensor array assembly 901 and prevent one or both of the top and bottom sides of the sensor array assembly 901 from sliding against the inner surface of the cover 903. In one embodiment, one or both of such sheets may be laminated to the top and / or bottom sides of the sensor array assembly 901. In one embodiment, the cover 903 includes adhesive only along the interior of its outer edge facing the periphery 905 to allow the sensor array assembly 901 to slide against the inner surface of the cover 903 within the periphery 905 (without adhesive). This sliding engagement can be used in applications where the sensor array assembly 901 is bent around a small-radius object to be radiographically imaged. In one embodiment, the envelope 903 can be vacuum-sealed around the sensor array assembly 901.

[0044] Figure 10A-B shows a top view of a hermetically sealed sensor array assembly 901, in which a readout integrated circuit (ROIC) 1001 is disposed on a PCB 1002 and electrically connected to the sensor array assembly 901. As described herein, a processor or controller 36, also disposed on the PCB 1002, controls the readout and image processing of the captured X-ray images, and, as described herein, controls the transfer of the captured image data to a portable electronic readout cartridge via conductive electrical contacts 1005. Figure 10A In one embodiment shown, ROIC 1001 and PCB 1002 are included within a package sleeve or casing 903. In another embodiment, ROIC 1001 is electrically connected to the sensor array assembly 901 through a perforation or one or more slits in the package sleeve 903, and is therefore not included within the package sleeve 903, as... Figure 10B As shown in the figure. In one embodiment, the flexible sleeve 903 may be made of a heat-resistant flexible rubber, such as a high-temperature silicone material. The flexible sleeve 903 may be selected for the specific application of the sensor array assembly 901. The flexible sleeve 903 may be adhesive on its outer surface or portions thereof, such as having an adhesive 1004 applied to at least one of its outer sides, such as a repositionable adhesive, to facilitate repeated attachment of the flexible sensor array assembly 901 to different sections of a pipe, such as an oil or gas delivery pipe, for radiographic imaging of different sections of the pipe. The flexible sleeve 903 may be shaped as (such as...) Figure 10C (As shown) is suitable for specific desired structures, such as the inner or outer section of a bend in a pipe, so that after the sensor array assembly 901 is inserted, the sensor array can quickly conform to the structure to be imaged. The sensor array assembly 901 can also be inserted into a standard box or carbon fiber housing for use as... Figure 8A The standard rigid planar detector imaging application is shown. The flexible sleeve 903 can be manufactured with a temporary sealing strip 1003 along one edge using a releasable mechanically joined strip or a reusable adhesive strip to temporarily seal the top and bottom sheets of the sleeve 903 together. The sealing strip 1003 can be released to allow insertion and removal of the sensor array assembly 901 into and from the flexible sleeve 903.

[0045] Sleeve 903 may include a lead (Pb) layer on one side or within the sheet for suitable applications (where a radiation-impermeable lead layer may be advantageous). The sleeve may include a conductive layer. Flexible sleeve 903 may be made of a heat-resistant material for applications in high-heat areas or near flames or welding equipment. Flexible sleeve 903 may be made of a UV-resistant or adhesive material to help hold in the desired position, or of a low-friction material for easy insertion into small gaps.

[0046] Figure 11A-B is a perspective view of the electronic portable reading box 1101, which is small and light enough to be handheld to a remote location where radiographic imaging of an industrial facility can be performed. Figure 11C -D are respectively Figure 11A -A top and side view schematic of the readout box 1101. The readout box 1101 includes a conductive electrical contact 1102 configured to electrically engage the electrical contact 1005 of the sensor array assembly 901 when the edge of the PCB 1002 is inserted into the slot 1103 of the readout box 1101. When the sensor array assembly 901 is inserted into the slot 1103 of the readout box 1101, a readout box controller 1104, including an electronic image memory, communicates with the readout box contact 1102 to sense the insertion of the sensor array assembly 901 when the readout box contact 1102 is electrically engaged with the detector contact 1005. The controller 1104 is configured to communicate with the ROIC 1101 and / or the processor 36 to initiate the downloading of captured image data from the sensor array assembly 901 to the image memory of the readout box 1101. The readout box 1101 includes a digital display 1105 controlled by the controller 1104 for displaying the downloaded images captured by the sensor array assembly 901. The reader cassette 1101 may also include a printer (not shown) for printing images captured by the sensor array assembly 901. As described herein, a power source such as battery 1106 provides power to operate the reader cassette 1101. Figure 11A As shown in -B, sensor array assemblies 901 of different sizes can be used in the readout box 1101.

[0047] As will be appreciated by those skilled in the art, aspects of the invention can be implemented as systems, methods, or computer program products. Therefore, aspects of the invention can take the form of entirely hardware embodiments, entirely software embodiments (including firmware, resident software, microcode, etc.), or embodiments combining software and hardware aspects, all of which can be generally referred to herein as “services,” “circuits,” “lines,” “modules,” and / or “systems.” Furthermore, aspects of the invention can take the form of computer program products implemented on one or more computer-readable media (having computer-readable program code implemented thereon).

[0048] Any combination of one or more computer-readable media may be used. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example, but not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or apparatuses, or any suitable combination thereof. Further specific examples of computer-readable storage media (a non-exhaustive list) will include the following: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable optical disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In the context of this document, a computer-readable storage medium can be any tangible medium capable of containing or storing a program used by or associated with an instruction execution system, device, or apparatus.

[0049] Program code and / or executable instructions implemented on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, fiber optic cable, RF, or any suitable combination thereof.

[0050] The computer program code used to perform operations related to this invention can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, Smalltalk, C++, etc., and traditional procedural programming languages ​​such as the "C" programming language or similar programming languages. The program code can be executed entirely on the user's computer (device), partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer can be connected to the user via any type of network.

[0051] The network includes a local area network (LAN) or a wide area network (WAN), or a connection to an external computer that can be made (e.g., by using the Internet through an Internet service provider).

[0052] This document describes aspects of the invention with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus to produce a machine such that the instructions, executable via the processor of the computer or other programmable data processing apparatus, create a method for implementing the function / action specified in one or more blocks of the flowchart illustrations and / or block diagrams.

[0053] These computer program instructions may also be stored in a computer-readable medium that can instruct a computer, other programmable data processing device or other means to act in a particular manner, such that the instructions stored in the computer-readable medium produce an article of writing comprising instructions that implement the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0054] Computer program instructions may also be loaded onto a computer, other programmable data processing apparatus or other device to cause a series of operational steps to be performed on the computer, other programmable apparatus or other device to produce a computer-implemented process, such that the instructions, which execute on the computer or other programmable apparatus, provide a process for implementing the function / action specified in one or more boxes of a flowchart and / or block diagram.

[0055] This written description uses examples to disclose the invention, including the best mode, and also enables those skilled in the art to practice the invention, including making and using any device or system, and performing any incorporated methods. The patentable scope of the invention is defined by the claims, but may include other examples that would occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements that do not substantially differ from the literal language of the claims.

Claims

1. A flexible digital radiographic detector for providing digital radiographic images of industrial equipment, the flexible digital radiographic detector comprising: A flexible two-dimensional photoelectric sensor array for capturing digital radiographic image data of the industrial equipment, a scintillator layer on a first side of the photoelectric sensor array, and a flexible substrate on a second side of the photoelectric sensor array opposite to the first side. An integrated circuit readout electronics coupled to the photoelectric sensor array is used to read digital radiographic image data of the industrial equipment captured in the photoelectric sensor array; as well as A flexible sleeve that encloses the photoelectric sensor array, the scintillator layer, and the flexible substrate, wherein the flexible sleeve includes an adhesive surface for adhering the photoelectric sensor array to a curved surface; The integrated circuit reading electronics are configured to engage with a handheld reading electronics box to begin reading image data captured in the photoelectric sensor array.

2. The flexible digital radiographic detector of claim 1, further comprising a circuit board, wherein, The edge of the circuit board supporting the integrated circuit reading electronics includes conductive contacts configured to electrically engage with the handheld reading electronics.

3. The flexible digital radiographic detector as described in claim 1, wherein, The handheld reading electronic box includes a display screen to display image data captured in the photoelectric sensor array.

4. A method for operating a flexible digital radiographic detector having a photoelectric sensor array and integrated circuit readout electronics coupled to said photoelectric sensor array, the method comprising: The flexible digital radiographic detector is enclosed in a flexible sleeve; The flexible digital radiographic detector is adhered to the curved structure; A radiographic image of the curved structure is captured in the photoelectric sensor array; The flexible digital radiographic detector is inserted into a handheld portable reader, the handheld portable reader including a digital display; and The handheld portable reader is used to read and display the radiographic image of the curved structure on the digital display. The integrated circuit reading electronics are configured to engage with the handheld portable reading box to begin reading image data captured in the photoelectric sensor array.

5. The method of claim 4, further comprising engaging a contact on the flexible digital radiography detector with a contact in the handheld portable reader during the insertion step.

6. The method of claim 5, further comprising inserting the flexible digital radiography detector into a slot in the handheld portable reader and electrically engaging a contact therein.

7. The method of claim 4, wherein, The adhesion step includes placing an adhesive on the surface of the sleeve.

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