Wafer cleaning apparatus and wafer cleaning method thereof
By introducing a separate wafer loading and unloading path design into the wafer cleaning equipment, and using a drying and conveying mechanism to directly transport the cleaned wafers, the contradiction between cleaning efficiency and cleanliness is resolved, achieving efficient cleaning and high-cleanliness wafer surfaces, thus improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
- Filing Date
- 2022-05-07
- Publication Date
- 2026-05-12
AI Technical Summary
While existing wafer cleaning equipment improves cleaning efficiency, it is difficult to guarantee the cleanliness of the wafer surface. In particular, incomplete cleaning by the process transfer robot can lead to the transfer of contaminants to the wafer surface, affecting product quality.
Design a wafer cleaning device, including a drying module, a wafer cleaning module, a wafer transfer assembly, a process transfer mechanism, and a drying transfer mechanism. By separating the wafer entry and exit paths, the drying transfer mechanism directly transfers the cleaned wafers to the drying module, avoiding repetitive actions of the process transfer mechanism and reducing contaminant transfer.
It improves the cleaning efficiency of wafer cleaning equipment and the cleanliness of wafer surfaces, reduces the contamination of cleaning residues or particulate contaminants, and improves product yield.
Smart Images
Figure CN114864444B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor process equipment, and more specifically, to a wafer cleaning apparatus and a wafer cleaning method for wafer cleaning equipment. Background Technology
[0002] In semiconductor manufacturing processes, wet cleaning is an essential step, and tank-type cleaning machines hold a significant market share due to their high throughput and low cost. The drying module is the most complex and critical module of the entire cleaning machine. The surface condition of the wafer after drying directly reflects the cleaning efficiency of the entire process. Problems in the drying process will directly affect the next process step, leading to product scrap or even a chain reaction that affects the stability of the entire production line.
[0003] Generally, the last process module of a tank-type cleaning machine is the dryer tank, where the wafers undergo drying. They are then transferred to the wafer transfer system (WTS) via a process transfer robot (PTR) and subsequently transported out of the machine to complete the cleaning process. Specifically, the wafer transfer system retrieves the wafers to be cleaned from the wafer cassette and transfers them from their loading station to their buffer module. The PTR robot places the wafers to be cleaned from the buffer module into the wafer cleaning module and transfers the cleaned wafers to the dryer tank for further drying. Finally, the dried wafers are transferred to the loading station of the wafer transfer system, where they are placed into a wafer cassette for transport to other machines for further semiconductor processes. To prevent cleaning residues or particulate contaminants from contaminating the dried wafers on the PTR robot, the robot must be handwashed before removing the wafers from the dryer tank to ensure its cleanliness.
[0004] However, the process transfer robot frequently picks up wafers after cleaning in the process area, and cleaning residues or particulate contaminants accumulate in its gripping teeth. If the robot is not thoroughly cleaned during its handwashing action, these contaminants will inevitably be transferred to the wafer surface when picking up wafers in the drying tank, causing defects. On the other hand, if the cleanliness of the process transfer robot is improved by extending the handwashing time, it may prevent the robot from completing the inter-module transfer actions in a timely manner, affecting the machine's production capacity.
[0005] Therefore, how to provide a wafer cleaning device that can improve the wafer cleaning efficiency while ensuring the cleanliness of the wafer surface has become a technical problem that urgently needs to be solved in this field. Summary of the Invention
[0006] The present invention aims to provide a wafer cleaning device and a wafer cleaning method for wafer cleaning equipment. The wafer cleaning device can improve the wafer cleaning efficiency of the wafer cleaning equipment while ensuring the cleanliness of the wafer surface.
[0007] To achieve the above objectives, as one aspect of the present invention, a wafer cleaning apparatus is provided, comprising a drying module and at least one wafer cleaning module. The wafer cleaning apparatus further comprises a wafer transfer assembly, a process transfer mechanism, and a drying transfer mechanism. The wafer transfer assembly is used to remove a wafer to be cleaned from a wafer cassette or to place a dried wafer back into the wafer cassette. The process transfer mechanism is used to transfer the wafer to be cleaned obtained by the wafer transfer assembly into the wafer cleaning module for cleaning, and to transfer the cleaned wafer from the wafer cleaning module into the drying module for drying. The drying transfer mechanism is used to carry the cleaned wafer in the drying module and transfer the dried wafer to the wafer transfer assembly, so that the wafer transfer assembly places the dried wafer back into the wafer cassette.
[0008] Optionally, the wafer transfer assembly includes a wafer transfer mechanism, a first transfer module, and a second transfer module. The wafer transfer mechanism is used to transfer the wafer to be cleaned in the wafer cassette to the first transfer module. The first transfer module is used to flip the wafer to be cleaned to a vertical position and transfer it to the wafer loading station of the first transfer module. The process transfer mechanism is used to transfer the wafer to be cleaned on the wafer loading station into the wafer cleaning module.
[0009] The drying and conveying mechanism is used to convey the dried wafer in the drying module to the wafer exit station of the second conveying module. The second conveying module is used to obtain the dried wafer at the wafer exit station and flip it to a horizontal state. The wafer conveying mechanism is also used to convey the flipped dried wafer in the second conveying module to the wafer cassette.
[0010] Optionally, the first transmission module includes a first horizontal and vertical transmission mechanism and a first wafer transmission mechanism. The wafer transmission mechanism is used to transmit the wafer to be cleaned in the wafer cassette to the first horizontal and vertical transmission mechanism. The first horizontal and vertical transmission mechanism is used to flip the wafer to be cleaned to a vertical position. The first wafer transmission mechanism is used to transmit the wafer flipped to a vertical position to the wafer feeding station.
[0011] The second transmission module includes a second horizontal and vertical transmission mechanism and a second wafer transmission mechanism. The second wafer transmission mechanism is used to transmit the dried wafer at the wafer exit station to the second horizontal and vertical transmission mechanism. The second horizontal and vertical transmission mechanism is used to flip the dried wafer to a horizontal state. The wafer transmission mechanism is also used to transmit the dried wafer after being flipped by the second horizontal and vertical transmission mechanism to the wafer cassette.
[0012] Optionally, the drying transport mechanism includes horizontal and vertical transport modules and a wafer support mechanism; wherein,
[0013] The horizontal and vertical transmission module is used to drive the wafer support mechanism to rise to a preset height to receive the cleaned wafer when the process transmission mechanism transfers the cleaned wafer into the drying module, and to drive the wafer support mechanism to fall to the drying position of the cleaned wafer.
[0014] The horizontal and vertical transmission module is also used to drive the wafer support mechanism to rise from the drying position to remove the dried wafer it carries from the drying module, drive the wafer support mechanism to move horizontally to the wafer exit position, and then drive the wafer support mechanism to descend to place the dried wafer on the second wafer transmission mechanism of the wafer exit position.
[0015] Optionally, the wafer transfer mechanism includes a transfer guide rail and a third wafer drive mechanism. The third wafer drive mechanism is capable of moving along the transfer guide rail. When the third wafer drive mechanism transfers the wafer to be cleaned to the first transfer module, the position of the third wafer drive mechanism corresponds to the first horizontal and vertical drive mechanism.
[0016] When the third wafer transmission mechanism transmits the dried wafer, which has been flipped in the second transmission module, to the wafer cassette, the position of the third wafer transmission mechanism corresponds to that of the second horizontal and vertical transmission mechanism.
[0017] Optionally, the wafer support mechanism includes a fixed plate and multiple support rods. The support rods have multiple wafer slots for supporting multiple wafers, and the axial positions of the multiple wafer slots on the multiple support rods correspond one-to-one, so that the multiple support rods support multiple wafers.
[0018] Optionally, the second wafer transport mechanism includes multiple support tooth plates, all of which are vertically arranged and parallel to the multiple support rods. Multiple slots are formed on the top edges of the multiple support tooth plates, and the positions of the multiple slots on the multiple support tooth plates correspond one-to-one. When the wafer support mechanism moves horizontally to the wafer ejection station, the projections of the multiple support rods on the horizontal plane are all offset from the projections of the multiple support tooth plates on the horizontal plane. The horizontal and vertical transmission module is used to drive the wafer support mechanism to descend, so that the multiple dried wafers carried on the wafer support mechanism are transferred to the corresponding slots on the multiple support tooth plates.
[0019] Optionally, the wafer support mechanism includes three support rods, and the support rod with its horizontal projection position in the center is lower than the two support rods located at the edges; the second wafer transmission mechanism includes four support tooth plates, and the top edges of the two support tooth plates with their horizontal projection positions in the center are lower than the top edges of the two support tooth plates located at the edges.
[0020] When the wafer support mechanism moves horizontally to the wafer exit station, the horizontal projection position of the support rod located in the center is between the horizontal projection positions of the two support tooth plates located in the center, and the horizontal projection positions of the two support tooth plates located at the edge are outside the two support rods located at the edge.
[0021] Optionally, the wafer cleaning equipment further includes a handwashing module, which includes a wafer lifting mechanism for receiving the wafer to be cleaned obtained by the process transfer mechanism. The handwashing module is used to clean the process transfer mechanism before it transfers the cleaned wafer to the drying module.
[0022] As a second aspect of the present invention, a wafer cleaning method is provided, implemented using the wafer cleaning equipment described above, comprising:
[0023] The wafer transfer assembly removes the wafer to be cleaned from the wafer cassette;
[0024] The process transfer mechanism transfers the wafer to be cleaned, acquired by the wafer transfer component, into the wafer cleaning module;
[0025] The wafer to be cleaned is cleaned in the wafer cleaning module;
[0026] The process transfer mechanism transfers the cleaned wafer from the wafer cleaning module to the drying transfer mechanism in the drying module;
[0027] The cleaned wafer is dried in the drying module;
[0028] The drying and transport mechanism transports the dried wafer to the wafer transport assembly;
[0029] The wafer transfer assembly places the dried wafer back into the wafer cassette.
[0030] In the wafer cleaning equipment and wafer cleaning method provided by this invention, the process transfer mechanism is only used to transfer the wafer to be cleaned into the wafer cleaning module and to transfer the cleaned wafer to be dried into the drying module for drying. The dried wafer is transferred from the drying module to the wafer transfer assembly by the drying transfer mechanism. This saves the time of the process transfer mechanism in transferring the wafer to be dried and performing hand washing, thereby improving the wafer transfer efficiency. It also avoids the contamination of the dried wafer in the drying module by cleaning residues or particulate contaminants attached to the wafer cleaning module. While improving the wafer cleaning efficiency of the wafer cleaning equipment, it ensures the cleanliness of the wafer surface and improves the product yield. Attached Figure Description
[0031] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the following detailed description to explain the invention, but do not constitute a limitation thereof. In the drawings:
[0032] Figure 1 This is a schematic diagram of the structure of the wafer cleaning equipment provided in an embodiment of the present invention;
[0033] Figure 2 This is a schematic diagram of the wafer support mechanism of the drying and conveying mechanism in the wafer cleaning equipment provided in this embodiment of the invention;
[0034] Figure 3 yes Figure 2 A schematic diagram of the fixing plate of the wafer support mechanism;
[0035] Figure 4 yes Figure 2 A schematic diagram illustrating the principle of the wafer support mechanism supporting the wafer in an embodiment of the present invention;
[0036] Figures 5 to 12 This is a schematic diagram of the wafer transfer process between the drying transport mechanism and the second wafer transmission mechanism in the wafer cleaning equipment provided in this embodiment of the invention:
[0037] Figure 13 This is a schematic diagram of the wafer support mechanism of the drying and conveying mechanism in the wafer cleaning equipment provided in this embodiment of the invention;
[0038] Figure 14 This is a schematic diagram showing the relative positional relationship between the wafer support mechanism and the second wafer transmission mechanism of the drying transmission mechanism in a certain state in the wafer cleaning equipment provided in an embodiment of the present invention.
[0039] Figure 15 yes Figure 14 A top view of the relative positions between the middle wafer support mechanism and the second wafer drive mechanism.
[0040] Explanation of reference numerals in the attached figures:
[0041] 100: Wafer transfer assembly; 110: First transfer module
[0042] 111: First horizontal and vertical transmission mechanism; 112: First wafer transmission mechanism
[0043] 120: Second transmission module; 121: Second horizontal and vertical transmission mechanism
[0044] 122: Second wafer drive mechanism; 21: Support toothed plate
[0045] 22: Base plate 23: Motion mechanism
[0046] 130: Wafer transport mechanism; 200: Wafer cleaning module
[0047] 210: Chemical tank; 220: Water tank
[0048] 230: Wafer lifting mechanism; 300: Drying and conveying mechanism
[0049] 320: Horizontal and vertical transmission modules; 310: Wafer support mechanism
[0050] 311: Fixing plate; 312: Support rod
[0051] 400: Process transfer mechanism; 500: Drying module
[0052] 600: Handwashing Module 10: Wafer
[0053] 30: Wafer Box Detailed Implementation
[0054] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.
[0055] To address the aforementioned technical problems, as one aspect of the present invention, a wafer cleaning apparatus is provided, such as... Figure 1As shown, the wafer cleaning equipment includes a drying module 500 and at least one wafer cleaning module 200, and also includes a wafer transfer assembly 100 (i.e., a wafer transfer system (WTS)), a process transfer mechanism 400 (i.e., a process transfer robot (PTR)), and a drying transfer mechanism 300. The wafer transfer assembly 100 is used to remove the wafer to be cleaned from the wafer cassette 30 or to put the dried wafer back into the wafer cassette 30. The process transfer mechanism 400 is used to transfer the wafer to be cleaned obtained by the wafer transfer assembly 100 into the wafer cleaning module 200 for cleaning, and to transfer the cleaned wafer from the wafer cleaning module 200 into the drying module 500 for drying. The drying transfer mechanism 300 is used to carry the cleaned wafer in the drying module 500 and transfer the dried wafer to the wafer transfer assembly 100 so that the wafer transfer assembly 100 puts the dried wafer back into the wafer cassette 30.
[0056] In this invention, the wafer cleaning equipment includes a wafer transfer assembly 100, a process transfer mechanism 400, and a drying transfer mechanism 300. The process transfer mechanism 400 is only used to transfer the wafer to be cleaned into the wafer cleaning module 200 and to transfer the cleaned wafer to be dried into the drying module 500 for drying. The dried wafer is transferred from the drying module 500 to the wafer transfer assembly 100 by the drying transfer mechanism 300. This saves the time of the process transfer mechanism 400 in transferring the wafer to be dried and performing handwashing, thereby improving the wafer transfer efficiency. It also avoids the contamination of the dried wafer in the drying module 500 by cleaning residues or particulate contaminants attached to the wafer cleaning module 200. While improving the wafer cleaning efficiency of the wafer cleaning equipment, it ensures the cleanliness of the wafer surface and improves the product yield.
[0057] To further improve the wafer transfer efficiency of wafer cleaning equipment, and thus improve the wafer cleaning efficiency of the wafer cleaning equipment, as a preferred embodiment of the present invention, such as... Figure 1 As shown, the wafer transfer assembly 100 includes a wafer transfer mechanism 130 (e.g., a wafer handle robot (WHR)), a first transfer module 110, and a second transfer module 120. The wafer transfer mechanism 130 is used to transfer the wafer to be cleaned in the wafer cassette 30 to the first transfer module 110. The first transfer module 110 is used to flip the wafer to be cleaned to a vertical position and transfer it to the wafer loading station of the first transfer module. The process transfer mechanism 400 is used to transfer the wafer to be cleaned on the wafer loading station into the wafer cleaning module 200.
[0058] The drying transfer mechanism 300 is used to transfer the dried wafer in the drying module 500 to the wafer exit station corresponding to the second transfer module 120. The second transfer module 120 is used to obtain the dried wafer at the wafer exit station and flip it to a horizontal state. The wafer transfer mechanism 130 is also used to transfer the flipped dried wafer in the second transfer module 120 to the wafer cassette 30.
[0059] In this embodiment of the invention, the wafer transfer assembly 100 includes two independent transfer modules (i.e., the first transfer module 110 and the second transfer module 120). The two transfer modules can respectively perform wafer flipping and transfer operations on the wafer entry path (i.e., the path from taking the wafer to be cleaned out of the wafer cassette 30 to the wafer cleaning module 200) and the wafer exit path (i.e., the path from the cleaned and dried wafer to the wafer cassette 30), thereby effectively realizing the separation of entry and exit and avoiding conflicts between entry and exit operations that would affect the transfer efficiency. Furthermore, the two transfer modules can be used as buffer areas on the wafer entry path and wafer exit path, respectively (for example, when the process transfer mechanism 400 is performing other operations and cannot receive the wafer to be cleaned in time, the first transfer module 110 can temporarily store the wafer to be cleaned; when the wafer transfer mechanism 130 is performing other operations and cannot receive the dried wafer in time, the second transfer module 120 can temporarily store the dried wafer), thereby further improving the wafer transfer efficiency of the wafer cleaning equipment and thus greatly improving the production efficiency of the machine.
[0060] As an optional embodiment of the present invention, such as Figure 1 As shown, the wafer cleaning equipment also includes a handwashing module 600 (End-effect wash & dry, EWD). The wafer cleaning module 200 includes a wafer lifting mechanism 230 (Lifter robot, LTR). The wafer lifting mechanism 230 is used to receive the wafers to be cleaned obtained by the process transfer mechanism 400. The handwashing module is used to clean the process transfer mechanism 400 before the process transfer mechanism 400 transfers the cleaned wafers to the drying module 500.
[0061] As an optional embodiment of the present invention, such as Figure 1 As shown, each wafer cleaning module 200 includes a chemical tank 210, a water tank 220, and a wafer lifting mechanism 230. The wafer lifting mechanism 230 is used to carry the wafer to be cleaned in the chemical tank 210 within its wafer cleaning module 200, and to transfer the wafer that has been cleaned in the chemical tank 210 to the water tank 220.
[0062] As an optional embodiment of the present invention, the transmission module includes a horizontal-vertical (HV) drive mechanism and a wafer pusher mechanism, wherein the horizontal-vertical drive mechanism is used to flip the wafer, and the wafer pusher mechanism is used to transport the wafer, specifically:
[0063] like Figure 1 As shown, the first transmission module 110 includes a first horizontal and vertical transmission mechanism 111 and a first wafer transmission mechanism 112. The wafer transmission mechanism 130 is used to transfer the wafer to be cleaned in the wafer cassette 30 to the first horizontal and vertical transmission mechanism 111. The first horizontal and vertical transmission mechanism 111 is used to flip the wafer to be cleaned to a vertical state. The first wafer transmission mechanism 112 is used to transfer the wafer flipped to a vertical state to the wafer feeding station.
[0064] The second transmission module 120 includes a second horizontal-vertical transmission mechanism 121 and a second wafer transmission mechanism 122. The second wafer transmission mechanism 122 is used to transmit the dried wafers from the wafer exit station to the second horizontal-vertical transmission mechanism 121. The second horizontal-vertical transmission mechanism 121 is used to flip the dried wafers to a horizontal state. The wafer transmission mechanism 130 is also used to transmit the dried wafers after being flipped by the second horizontal-vertical transmission mechanism 121 to the wafer cassette 30.
[0065] That is, in this embodiment of the invention, the first horizontal-vertical transmission mechanism 111 of the first transmission module 110 and the second horizontal-vertical transmission mechanism 121 of the second transmission module 120 are used to flip the wafer, and the first wafer transmission mechanism 112 and the second wafer transmission mechanism 122 are respectively used to realize the docking function with the process transmission mechanism 400 and the drying transmission mechanism 300. Specifically, the first wafer transmission mechanism 112 is used to transport the wafer, after it has been flipped to a vertical state, to the wafer loading station, where the process transmission mechanism 400 takes away the wafer it carries. The second wafer transmission mechanism 122 is used to wait at the wafer unloading station for the drying transmission mechanism 300 to transport the dried wafer onto it and to perform the handover.
[0066] Specifically, the drying and conveying mechanism 300 has the function of transferring wafers in both horizontal and vertical directions, and can automatically place the wafers on the second wafer conveying mechanism 122 at the wafer exit station, such as... Figure 5 As shown, the drying transfer mechanism 300 includes a horizontal and vertical transfer module 320 and a wafer support mechanism 310. The horizontal and vertical transfer module 320 is used to drive the wafer support mechanism 310 to rise to a preset height to receive the cleaned wafer when the process transfer mechanism 400 transfers the cleaned wafer into the drying module 500, and to drive the wafer support mechanism 310 to descend to the drying position of the cleaned wafer for drying (i.e., the preset position of the cleaned wafer when it is being dried in the drying module 500).
[0067] The horizontal and vertical transmission module 320 is also used to drive the wafer support mechanism 310 to rise from the drying position to remove the dried wafer it carries from the drying module 500, and drive the wafer support mechanism 310 to move horizontally to the wafer exit position, and then drive the wafer support mechanism 310 to fall to place the wafer on the second wafer transmission mechanism 122 of the wafer exit position.
[0068] In this embodiment of the invention, the drying transfer mechanism 300 includes a horizontal and vertical transfer module 320 and a wafer support mechanism 310. The horizontal and vertical transfer module 320 can drive the wafer support mechanism 310 to move horizontally so that the wafer support mechanism 310 moves back and forth between the drying module 500 and the wafer exit station. It can also drive the wafer support mechanism 310 to move vertically so that when the wafer support mechanism 310 is located at the drying module 500, it can descend and allow the cleaned wafer to enter the drying position in the drying module 500 for drying, and rise and drive the dried wafer carried on it to leave the drying module 500. It can also allow the wafer support mechanism 310 to descend and place the dried wafer on the second wafer transmission mechanism 122 located at the wafer exit station when it is located at the wafer exit station.
[0069] As an optional embodiment of the present invention, such as Figure 1 As shown, the wafer transfer mechanism 130 (WHR) includes a transfer guide rail and a third wafer drive mechanism. The third wafer drive mechanism can move along the transfer guide rail. When the third wafer drive mechanism 130 transfers the wafer to be cleaned to the first transfer module 110, the position of the third wafer drive mechanism corresponds to the first horizontal and vertical drive mechanism 111.
[0070] When the third wafer transmission mechanism 130 transmits the dried wafer after being flipped in the second transmission module to the wafer cassette, the position of the third wafer transmission mechanism corresponds to that of the second horizontal and vertical transmission mechanism 121.
[0071] That is, in this embodiment of the invention, the wafer transfer mechanism 130 includes a transfer guide rail and a third wafer drive mechanism that moves along the transfer guide rail. The third wafer drive mechanism can move along the transfer guide rail to a position corresponding to the wafer cassette 30, the first horizontal-vertical drive mechanism 111, or the second horizontal-vertical drive mechanism 121, thereby transferring wafers between the wafer cassette 30 and the first horizontal-vertical drive mechanism 111 or between the wafer cassette 30 and the second horizontal-vertical drive mechanism 121.
[0072] As an optional embodiment of the present invention, such as Figures 2 to 4As shown, the wafer support mechanism 310 includes a fixed plate 311 and multiple support rods 312. The support rods 312 have multiple wafer slots for supporting multiple wafers, and the axial positions of the wafer slots on the multiple support rods 312 correspond one-to-one. The process transfer mechanism 400 is used to place multiple wafers 10 into the multiple wafer slots one-to-one, so that the multiple support rods 312 support multiple wafers 10.
[0073] In this embodiment of the invention, the wafer support mechanism 310 includes a fixing plate 311 and multiple support rods 312, such as... Figure 4 As shown, the projection positions of the multiple support rods 312 along their axial direction correspond to the edge contour of the wafer 10. That is, the multiple support rods 312 can simultaneously contact the circular edge of the wafer 10 to stably support the wafer 10.
[0074] In a preferred embodiment of the present invention, the support rod 312 is made of a rigid material to ensure the consistency of the positions of the multiple wafers 10 and to prevent the wafers 10 from slipping off. Figures 2 to 4 , Figure 13 As shown, the length h of the support rod 312 should be greater than the total longitudinal distance when 50 wafers are conventionally arranged (i.e., the support rod 312 has at least 50 wafer slots).
[0075] As a preferred embodiment of the present invention, such as Figure 13 As shown, the distance k between the two ends of the support rod 312 and the adjacent wafer is 15mm to 20mm. That is, the distance between the end of the support rod 312 and the nearest wafer slot is 15mm to 20mm. This ensures the structural strength of the support rod 312 and prevents it from deforming. It also avoids the boundary effect caused by the wafer 10 being too close to the tank or fixing plate 311 of the drying module 500 (drying tank). (Here, the boundary effect refers to the fact that the wafer 10 located at the outermost edge (e.g., slot 1 or slot 50) is easily affected by contaminants due to its proximity to the tank wall or fixing plate 311 and the horizontal and vertical transmission module 320, resulting in poor cleaning effect.)
[0076] The diameter of the support rod 312 should be minimized while maintaining its structural strength to facilitate drying and dehydration. For example, as an optional embodiment of the present invention, the diameter of the support rod 312 can be 5mm-10mm.
[0077] As an optional embodiment of the present invention, such as Figure 3 , Figure 4 , Figure 13 As shown, the spacing between the projections of adjacent support rods 312 on the horizontal plane is consistent (i.e., the horizontal spacing between the mounting holes 313 on the fixing plate 311 for mounting the support rods 312 is consistent).
[0078] As an optional embodiment of the present invention, such as Figure 6 , Figure 14 As shown, the second wafer transmission mechanism 122 includes multiple support tooth plates 21, all of which are vertically arranged and parallel to multiple support rods 312. Multiple slots are formed on the top edge of the multiple support tooth plates 21, and the positions of the multiple slots on the multiple support tooth plates 21 (here referring to the positions along the extension direction of the top edge) correspond one-to-one. When the wafer support mechanism 310 moves horizontally to the wafer unloading station, the projections of the multiple support rods 312 on the horizontal plane are all staggered with the projections of the multiple support tooth plates 21 on the horizontal plane. The horizontal and vertical transmission module 320 is used to drive the wafer support mechanism 310 to descend, so that the multiple dried wafers 10 carried on the wafer support mechanism 310 are transferred to the corresponding slots on the multiple support tooth plates 21.
[0079] In this embodiment of the invention, the second wafer transmission mechanism 122 includes a plurality of support toothed plates 21, such as... Figure 8 As shown, the projection position of the top edge of the multiple support teeth 21 along the horizontal extension direction corresponds to the edge contour of the wafer 10. That is, the multiple support teeth 21 can simultaneously contact the circular edge of the wafer 10, so that the wafer 10 enters multiple slots in the same axial position to stably support the wafer 10.
[0080] As an optional embodiment of the present invention, such as Figure 6 , Figure 14 As shown, the second wafer transmission mechanism 122 also includes a base plate 22 and a motion mechanism 23. The base plate 22 is horizontally arranged, and multiple support toothed plates 21 are fixedly arranged on the base plate 22. The motion mechanism 23 is used to drive the base plate 22 to move the multiple support toothed plates 21 back and forth between the second horizontal vertical transmission mechanism 121 and the wafer exit station.
[0081] like Figures 5 to 12 The diagram shows the process flow for transferring wafers between the drying and conveying mechanism 300 and the second wafer conveying mechanism 122:
[0082] like Figure 5 As shown, the horizontal and vertical transmission module 320 drives the wafer support mechanism 310 to lift the wafer 10 from the drying module 500 and move it horizontally to the wafer ejection station. At this time, as... Figure 6 As shown, both the wafer support mechanism 310 and the wafer 10 are located above the second wafer drive mechanism 122;
[0083] Next, as Figure 7 , Figure 8As shown, the horizontal and vertical transmission module 320 drives the wafer support mechanism 310 to lower the wafer 10. The multiple support rods 312 of the wafer support mechanism 310 are inserted into the gaps between the support tooth plates 21 of the second wafer transmission mechanism 122, so that the wafer 10 enters the multiple slots of the multiple support tooth plates 21.
[0084] like Figure 9 , Figure 10 As shown, the horizontal and vertical transmission module 320 continues to drive the wafer support mechanism 310 to descend, and multiple support rods 312 disengage from the wafer 10 and continue to descend in the gap between the support tooth plates 21. At this time, the wafer 10 has been transferred to the second wafer transmission mechanism 122.
[0085] like Figure 11 , Figure 12 As shown, the horizontal and vertical transport module 320 drives the wafer support mechanism 310 to exit the second wafer transmission mechanism 122 in the horizontal direction (the extension direction of the support rod 312 and the support tooth plate 21). Subsequently, the horizontal and vertical transport module 320 can drive the wafer support mechanism 310 back into the drying module 500, waiting to load the subsequent wafers 10 to be dried.
[0086] Optionally, each movement step of the horizontal and vertical transmission module 320 is performed at a preset speed. After detecting the wafer 10, the second wafer transmission mechanism 122 moves horizontally to the second horizontal and vertical transmission mechanism 121 at a set speed, and issues a movement completion command after reaching the set position. After receiving the command and the sensor on the second horizontal and vertical transmission mechanism 121 detects the wafer 10 (i.e., it has been determined that the second wafer transmission mechanism 122 has moved the wafer 10), the horizontal and vertical transmission module 320 drives the wafer support mechanism 310 to return along the original path, that is, first rise, then return to the drying module 500, and finally descend to the drying station in the drying module 500.
[0087] As a preferred embodiment of the present invention, such as Figure 14 As shown, after the wafer 10 is transferred to the second wafer transmission mechanism 122, the horizontal and vertical transmission module 320 continues to drive the wafer support mechanism 310 to descend by a height H1 of 5mm to 10mm to ensure the stability of the wafer position.
[0088] As an optional embodiment of the present invention, such as Figures 13 to 15 As shown, the wafer support mechanism 310 includes three support rods 312, and the support rod 312 with its horizontal projection position in the center is lower than the two support rods 312 located at the edge. The second wafer transmission mechanism 122 includes four support tooth plates 21, and the top edges of the two support tooth plates 21 with their horizontal projection positions in the inner side are lower than the top edges of the two support tooth plates 21 located in the outer side.
[0089] When the wafer support mechanism 310 moves horizontally to the wafer exit station, the horizontal projection position of the central support rod 312 is between the horizontal projection positions of the two inner support tooth plates 21, and the horizontal projection positions of the two edge support tooth plates 21 are outside the two edge support rods 312.
[0090] As a preferred embodiment of the present invention, such as Figure 15 As shown, the distance s between the horizontal projection position of the support rod 312 and the horizontal projection position of the adjacent support toothed plate 21 is 10mm to 15mm to avoid interference between the support rod 312 and the adjacent support toothed plate 21 caused by slight shaking of the wafer support mechanism 310. It should be noted that the horizontal spacing between adjacent support rods 312 and support toothed plates 21 can be inconsistent. Optionally, as... Figure 15 As shown, the minimum distance between the side of the support tooth plate 21 and the fixing plate 311 can also be controlled within 10mm to 15mm.
[0091] The height n of the inner support tooth plate 21 and the height m of the outer support tooth plate 21 can be determined according to the range of motion of the drying conveying mechanism 300.
[0092] As a second aspect of the present invention, a wafer cleaning method is provided, implemented using the wafer cleaning equipment provided in the embodiments of the present invention, the method comprising:
[0093] Step S1: The wafer transfer assembly 100 removes the wafer to be cleaned from the wafer cassette 30;
[0094] Step S2: The process transfer mechanism 400 transfers the wafer to be cleaned obtained by the wafer transfer component into the wafer cleaning module 200;
[0095] Step S3: The wafer to be cleaned is cleaned in the wafer cleaning module 200;
[0096] Step S4: The process transfer mechanism 400 transfers the cleaned wafer from the wafer cleaning module 200 to the drying transfer mechanism 300 in the drying module 500.
[0097] Step S5: The cleaned wafer is dried in the drying module 500;
[0098] Step S6: The drying and transfer mechanism 300 transfers the dried wafer to the wafer transfer assembly 100;
[0099] Step S7: The wafer transfer assembly 100 places the dried wafer back into the wafer cassette 30.
[0100] In the wafer cleaning method provided by this invention, the process transfer mechanism 400 is only used to transfer the wafer to be cleaned into the wafer cleaning module 200 and to transfer the cleaned wafer to be dried into the drying module 500 for drying. The dried wafer is transferred from the drying module 500 to the wafer transfer assembly 100 by the drying transfer mechanism 300. This saves the time of the process transfer mechanism 400 in transferring the wafer to be dried and performing the hand washing action, thereby improving the wafer transfer efficiency. It also avoids the cleaning residue or particulate contaminants attached to the wafer cleaning module 200 from contaminating the dried wafer in the drying module 500. While improving the wafer cleaning efficiency of the wafer cleaning equipment, it ensures the cleanliness of the wafer surface and improves the product yield.
[0101] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A wafer cleaning apparatus, comprising a drying module and at least one wafer cleaning module, characterized in that, The wafer cleaning equipment also includes a wafer transfer assembly, a process transfer mechanism, and a drying transfer mechanism. The wafer transfer assembly is used to remove the wafer to be cleaned from the wafer cassette or to put the dried wafer back into the wafer cassette. The process transfer mechanism is used to transfer the wafer to be cleaned, acquired by the wafer transfer assembly, into the wafer cleaning module for cleaning, and to transfer the cleaned wafer from the wafer cleaning module into the drying module for drying; the drying transfer mechanism is used to carry the cleaned wafer transferred by the process transfer mechanism in the drying module for drying and to transfer the dried wafer to the wafer transfer assembly, so that the wafer transfer assembly can place the dried wafer back into the wafer cassette. The wafer transfer assembly includes a wafer transfer mechanism, a first transfer module, and a second transfer module; The drying and transfer mechanism includes a horizontal and vertical transfer module and a wafer support mechanism. The drying and transfer mechanism is used to transfer the dried wafer in the drying module to the wafer exit station of the second transfer module. The wafer support mechanism includes a fixing plate and multiple support rods; The second wafer transmission mechanism of the second transmission module includes multiple support tooth plates, all of which are vertically arranged and parallel to the multiple support rods. Multiple slots are formed on the top edges of the multiple support tooth plates, and the positions of the multiple slots on the multiple support tooth plates correspond one-to-one. When the wafer support mechanism moves horizontally to the wafer ejection station, the projections of the multiple support rods on the horizontal plane are all offset from the projections of the multiple support tooth plates on the horizontal plane. The horizontal and vertical transmission module is used to drive the wafer support mechanism to descend, so that the multiple dried wafers carried on the wafer support mechanism are transferred to the corresponding slots on the multiple support tooth plates.
2. The wafer cleaning equipment according to claim 1, characterized in that, The wafer transfer mechanism is used to transfer the wafer to be cleaned in the wafer cassette to the first transfer module. The first transfer module is used to flip the wafer to be cleaned to a vertical position and transfer it to the wafer loading station of the first transfer module. The process transfer mechanism is used to transfer the wafer to be cleaned on the wafer loading station into the wafer cleaning module. The second transmission module is used to acquire the dried wafer at the wafer exit station and flip it to a horizontal position. The wafer transmission mechanism is also used to transfer the flipped dried wafer in the second transmission module to the wafer cassette.
3. The wafer cleaning equipment according to claim 2, characterized in that, The first transmission module includes a first horizontal and vertical transmission mechanism and a first wafer transmission mechanism. The wafer transmission mechanism is used to transmit the wafer to be cleaned in the wafer cassette to the first horizontal and vertical transmission mechanism. The first horizontal and vertical transmission mechanism is used to flip the wafer to be cleaned to a vertical position. The first wafer transmission mechanism is used to transmit the wafer flipped to a vertical position to the wafer feeding station. The second transmission module includes a second horizontal and vertical transmission mechanism and a second wafer transmission mechanism. The second wafer transmission mechanism is used to transmit the dried wafer at the wafer exit station to the second horizontal and vertical transmission mechanism. The second horizontal and vertical transmission mechanism is used to flip the dried wafer to a horizontal state. The wafer transmission mechanism is also used to transmit the dried wafer after being flipped by the second horizontal and vertical transmission mechanism to the wafer cassette.
4. The wafer cleaning equipment according to claim 3, characterized in that, The horizontal and vertical transmission module is used to drive the wafer support mechanism to rise to a preset height to receive the cleaned wafer when the process transmission mechanism transfers the cleaned wafer into the drying module, and to drive the wafer support mechanism to fall to the drying position of the cleaned wafer. The horizontal and vertical transmission module is also used to drive the wafer support mechanism to rise from the drying position to remove the dried wafer it carries from the drying module, drive the wafer support mechanism to move horizontally to the wafer exit position, and then drive the wafer support mechanism to descend to place the dried wafer on the second wafer transmission mechanism of the wafer exit position.
5. The wafer cleaning equipment according to claim 3, characterized in that, The wafer transfer mechanism includes a transfer guide rail and a third wafer drive mechanism. The third wafer drive mechanism can move along the transfer guide rail. When the third wafer drive mechanism transfers the wafer to be cleaned to the first transfer module, the position of the third wafer drive mechanism corresponds to the first horizontal and vertical drive mechanism. When the third wafer transmission mechanism transmits the dried wafer, which has been flipped in the second transmission module, to the wafer cassette, the position of the third wafer transmission mechanism corresponds to that of the second horizontal and vertical transmission mechanism.
6. The wafer cleaning equipment according to claim 4, characterized in that, The support rod has multiple wafer slots for supporting multiple wafers, and the axial positions of the multiple wafer slots on the multiple support rods correspond one-to-one, so that the multiple support rods support multiple wafers.
7. The wafer cleaning equipment according to claim 1, characterized in that, The wafer support mechanism includes three support rods, and the support rod with its horizontal projection position in the center is lower than the two support rods located at the edges. The second wafer transmission mechanism includes four support tooth plates, and the top edges of the two support tooth plates with their horizontal projection positions in the center are lower than the top edges of the two support tooth plates located at the edges. When the wafer support mechanism moves horizontally to the wafer exit station, the horizontal projection position of the support rod located in the center is between the horizontal projection positions of the two support tooth plates located in the center, and the horizontal projection positions of the two support tooth plates located at the edge are outside the two support rods located at the edge.
8. The wafer cleaning equipment according to claim 1, characterized in that, The wafer cleaning equipment also includes a handwashing module, which includes a wafer lifting mechanism. The wafer lifting mechanism is used to receive the wafer to be cleaned obtained by the process transfer mechanism. The handwashing module is used to clean the process transfer mechanism before the process transfer mechanism transfers the cleaned wafer to the drying module.
9. A wafer cleaning method, implemented using the wafer cleaning equipment according to any one of claims 1 to 8, comprising: The wafer transfer assembly removes the wafer to be cleaned from the wafer cassette; The process transfer mechanism transfers the wafer to be cleaned, acquired by the wafer transfer component, into the wafer cleaning module; The wafer to be cleaned is cleaned in the wafer cleaning module; The process transfer mechanism transfers the cleaned wafer from the wafer cleaning module to the drying transfer mechanism in the drying module; The cleaned wafer is dried in the drying module; The drying and transport mechanism transports the dried wafer to the wafer transport assembly; The wafer transfer assembly places the dried wafer back into the wafer cassette.