Packaging structure and display device

Abstract

The application relates to the technical field of semiconductors, and discloses a packaging structure and a display device. The packaging structure comprises a metal support, a driving chip, a light-emitting component, a packaging piece and a metal cover plate; the metal support comprises a plurality of pins and oppositely arranged first and second surfaces, the driving chip is arranged on the first surface of the metal support, the driving chip is used for controlling the light-emitting state of the light-emitting component, the light-emitting component is arranged on the second surface of the metal support and is electrically connected with the driving chip through the metal support, the packaging piece is arranged on the metal support, the packaging piece fixes the metal support and covers the driving chip and the light-emitting component, the plurality of pins surround the driving chip and are partially exposed to the packaging piece, and the metal cover plate is arranged on the side, away from the light-emitting component, of the driving chip and covers the whole driving chip. The packaging structure and the display device provided by the application can solve the signal interference problem of the driving chip in the prior art, and greatly improve the use performance of the product.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a packaging structure and a display device. Background Technology

[0002] A light-emitting diode (LED) is a solid-state semiconductor device that can convert electrical energy into visible light. It uses a solid semiconductor chip as the light-emitting material and emits photons by releasing energy through recombination of charge carriers, thus directly converting electrical energy into light energy.

[0003] LED light sources are widely used in the field of display technology due to their advantages such as high brightness, small size, low energy consumption, and high stability. Among them, the key to improving the resolution of LED displays lies in reducing the size of LED packaging units.

[0004] In related technologies, a vertical packaging structure has been designed to reduce the size of LED packaging units, in which the LED chip and the driver chip are placed on opposite sides. However, with this packaging structure, the driver chip is susceptible to external signal interference, and the driver chip can also easily cause signal interference to other components on the circuit board during operation, affecting the normal use of the LED packaging unit. Summary of the Invention

[0005] The purpose of this application is to provide a packaging structure and display device that can solve the technical problem of signal interference in driver chips in the prior art.

[0006] In a first aspect, this application provides a packaging structure, comprising: a metal bracket including a plurality of pins and a first surface and a second surface disposed opposite to each other; a driver chip disposed on the first surface of the metal bracket; a light-emitting component disposed on the second surface of the metal bracket and electrically connected to the driver chip through the metal bracket, the driver chip being used to control the light-emitting state of the light-emitting component; a package disposed on the metal bracket, fixing the metal bracket and covering the driver chip and the light-emitting component, the plurality of pins surrounding the driver chip and partially exposed on the package, the pins being used to receive external electrical signals and transmit the electrical signals to the driver chip; and a metal cover plate disposed on the side of the driver chip away from the light-emitting component and covering the entire surface of the driver chip.

[0007] In one embodiment, the metal bracket and the metal cover plate are an integral structure, and the metal cover plate is opposite to the first surface of the metal bracket and forms an accommodating gap between the metal cover plate and the first surface of the metal bracket to accommodate the driver chip.

[0008] In one embodiment, the encapsulation includes an opaque first colloidal curing layer, which fixes the metal bracket, fills the accommodating gap, and covers the driver chip. The first colloidal curing layer forms an accommodating groove on a second surface of the metal bracket, and the light-emitting component is installed in the accommodating groove.

[0009] In one embodiment, the encapsulation includes a light-transmitting second colloidal curing layer that fills the receiving groove and covers the light-emitting component.

[0010] In one embodiment, a plurality of the pins are exposed above the first colloidal curing layer and surround the outer surfaces of the first and second surfaces, the pins extending to the bottom surface of the first colloidal curing layer opposite to the first surface.

[0011] In one embodiment, the encapsulation includes an opaque first colloidal curing layer, which fixes the metal bracket, forms a first groove on a first surface of the metal bracket and a second groove on a second surface of the metal bracket, the driving chip is mounted in the first groove, and the light-emitting component is mounted in the second groove.

[0012] In one embodiment, the encapsulation includes a light-transmitting second colloidal curing layer and an insulating adhesive. The second colloidal curing layer fills the second groove and covers the light-emitting component. The metal cover is fixed in the first groove by the insulating adhesive.

[0013] In one embodiment, a plurality of the pins extend from the position of the first surface to the bottom surface opposite the first surface, exposing the first colloid cured layer, and the plurality of the pins surround the first groove.

[0014] In one embodiment, the metal bracket includes a plurality of positioning blocks distributed around the first groove and surrounding the metal cover plate.

[0015] The packaging structure provided in this application includes a metal bracket, a driver chip, a light-emitting component, a package, and a metal cover. The driver chip and the light-emitting component are respectively disposed on opposite sides of the metal bracket and electrically connected through the metal bracket to form a vertical packaging structure. The package is used to fix the metal bracket and cover the driver chip and the light-emitting component, with several pins surrounding the driver chip. The metal cover is disposed on the side of the driver chip away from the light-emitting component and covers the entire surface of the driver chip. That is, the metal bracket, the pins, and the metal cover are respectively disposed on different sides of the driver chip, so that all six sides of the driver chip can be covered by metal, and the driver chip is located within the space enclosed by the metal. This improves the signal shielding capability of the packaging structure, reduces signal interference received by the driver chip, and reduces signal interference generated by the driver chip to external components, thereby improving the stability and reliability of the packaging structure.

[0016] Secondly, this application provides a display device including a plurality of the aforementioned packaging structures, wherein the plurality of packaging structures are arranged in a matrix.

[0017] The display device provided in this application improves its performance by modifying the packaging structure. Specifically, the packaging structure provided in this application improves the structure of the metal support and provides a metal cover plate on the side of the driver chip away from the light-emitting component, so that the driver chip is located in the space formed by the metal support, several pins and the metal cover plate. This improves the signal shielding capability of the packaging structure, thereby enhancing the stability and reliability of the packaging structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is one of the structural schematic diagrams of a packaging structure provided in Embodiment 1 of this application;

[0020] Figure 2 for Figure 1 The second schematic diagram of the packaging structure shown;

[0021] Figure 3 for Figure 1 The third schematic diagram of the packaging structure shown;

[0022] Figure 4 for Figure 1 The fourth schematic diagram of the packaging structure shown;

[0023] Figure 5 for Figure 1 One of the three-dimensional schematic diagrams of the packaging structure shown;

[0024] Figure 6 for Figure 1 The second three-dimensional schematic diagram of the packaging structure shown;

[0025] Figure 7 for Figure 1 The third three-dimensional schematic diagram of the packaging structure shown;

[0026] Figure 8 This is a schematic diagram of another packaging structure provided in Embodiment 1 of this application;

[0027] Figure 9 This is one of the perspective schematic diagrams of the packaging structure provided in Embodiment 2 of this application;

[0028] Figure 10 This is a second perspective view of the packaging structure provided in Embodiment 2 of this application;

[0029] Figure 11 for Figure 10 A schematic diagram of the metal cover plate in the encapsulation structure shown;

[0030] Figure 12 This is the third perspective view of the packaging structure provided in Embodiment 2 of this application;

[0031] Figure 13 The fourth is a three-dimensional schematic diagram of the packaging structure provided in Embodiment 2 of this application.

[0032] Explanation of key component symbols:

[0033] 100. Packaging structure;

[0034] 10. Metal bracket; 11. Pin; 20. Driver chip; 30. Light-emitting component; 40. Package; 41. First colloidal curing layer; 42. Second colloidal curing layer; 50. Metal cover plate; 60. Receiving groove; 70. First groove; 80. Second groove; 90. Positioning block. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0036] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are for descriptive convenience only, not indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the patent. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0037] This application provides a packaging structure and a display device including a plurality of such packaging structures, and by improving the packaging structure, the performance of the related products is greatly improved.

[0038] Example 1:

[0039] like Figures 1-8 As shown, this application provides a packaging structure 100, including a metal bracket 10, a driver chip 20, a light-emitting component 30, a package 40, and a metal cover plate 50.

[0040] like Figure 1 , Figure 5 and Figure 7 As shown, the metal support 10 includes a plurality of pins 11 and a first surface (e.g., facing each other) arranged opposite to each other. Figure 5 (as shown in A) and the second side (e.g.) Figure 5 (As shown in side B).

[0041] like Figure 5 and Figure 7 As shown, the driver chip 20 is disposed on the first surface of the metal bracket 10, and the driver chip 20 is used to control the light-emitting state of the light-emitting component 30. Specifically, the driver chip 20 is used to receive external electrical signals and send the control information carried by the electrical signals to the light-emitting component 30.

[0042] like Figure 5 , Figure 6 and Figure 7 As shown, the light-emitting component 30 is disposed on the second surface of the metal bracket 10 and is electrically connected to the driver chip 20 through the metal bracket 10. The driver chip 20 is used to control the light-emitting state of the light-emitting component 30, specifically including the brightness and color temperature of the light-emitting component 30.

[0043] like Figure 3 , Figure 4 and Figure 7As shown, the package 40 is disposed on the metal bracket 10. The package 40 fixes the metal bracket 10 and covers the driver chip 20 and the light-emitting component 30. Several pins 11 surround the driver chip 20 and are partially exposed outside the package 40. The pins 11 are used to receive external electrical signals and transmit the electrical signals to the driver chip 20. The electrical signals carry control information.

[0044] like Figure 3 , Figure 5 and Figure 7 As shown, the metal cover plate 50 is disposed on the side of the driver chip 20 away from the light-emitting component 30 and covers the entire surface of the driver chip 20. It can be understood that the metal cover plate 50 is a planar cover plate, and the size of the metal cover plate 50 is larger than the size of the driver chip 20. Figure 2 , Figure 3 and Figure 4 The area covered by the metal cover plate 50 is shown in the dashed box.

[0045] The packaging structure 100 provided in this application includes a metal bracket 10, a driver chip 20, a light-emitting component 30, a package 40, and a metal cover plate 50. The driver chip 20 and the light-emitting component 30 are respectively disposed on opposite sides of the metal bracket 10 and electrically connected through the metal bracket 10 to form a vertical packaging structure 100. The package 40 is used to fix the metal bracket 10 and cover the driver chip 20 and the light-emitting component 30. Several pins 11 surround the driver chip 20. The metal cover plate 50 is disposed on the side of the driver chip 20 away from the light-emitting component 30 and covers the entire surface of the driver chip 20. That is, the metal bracket 10, the several pins 11, and the metal cover plate 50 are respectively disposed on different sides of the driver chip 20, so that all six sides of the driver chip 20 can be covered by metal, and the driver chip 20 is located within the space enclosed by the metal. This improves the signal shielding capability of the packaging structure 100, reduces signal interference to the driver chip 20, and reduces signal interference generated by the driver chip 20 to external components, thereby improving the stability and reliability of the packaging structure 100.

[0046] In the embodiments provided in this application, such as Figure 1 , Figure 2 and Figure 5 As shown, the metal support 10 and the metal cover 50 are an integral structure. The first surface of the metal cover 50 faces the first surface of the metal support 10, and a receiving gap is formed between the metal cover 50 and the first surface of the metal support 10 to accommodate the driver chip 20. With this design, the package structure 100 has high integrity, the metal cover 50 is not easily detached, and manufacturing is convenient. Furthermore, as... Figure 1 , Figure 5 and Figure 7As shown, the metal bracket 10 may have a connecting portion, which extends to connect to the metal cover plate 50. The metal cover plate 50 can be used to shield the signal interference on the side of the driver chip 20 away from the light-emitting component 30, and the connecting portion can be used to shield the signal interference on the periphery of the driver chip 20, thereby effectively ensuring the anti-signal interference capability of the packaging structure 100.

[0047] In the embodiments provided in this application, the shape of the metal cover 50 is not unique. In some embodiments, such as Figure 1 As shown, the metal cover 50 has a similar shape to the main body (excluding pins 11) of the metal bracket 10, and the metal cover 50 can cover the first surface of the metal bracket 10. Alternatively, in some embodiments, such as Figure 6 and Figure 8 As shown, the size of the metal cover 50 is slightly larger than the size of the main body of the metal bracket 10, and the edge of the metal cover 50 can be bent to cover the periphery of the package 40.

[0048] In the embodiments provided in this application, the driver chip 20 and the light-emitting component 30 are welded to the metal bracket 10 and fixed by dispensing adhesive.

[0049] In the embodiments provided in this application, such as Figure 4 , Figure 5 and Figure 6 As shown, the package 40 includes an opaque first colloidal curing layer 41. The first colloidal curing layer 41 fixes the metal support 10, fills the accommodating gap between the metal cover plate 50 and the first surface of the metal support 10, and covers the driver chip 20. In this way, the first colloidal curing layer 41 can encapsulate the driver chip 20, provide physical protection for the driver chip 20, achieve insulation isolation of the driver chip 20, and support and connect the metal cover plate 50, thereby improving the safety and reliability of the package structure 100.

[0050] Furthermore, such as Figure 6 and Figure 7 As shown, the first colloidal curing layer 41 forms a receiving groove 60 on the second surface of the metal bracket 10, and the light-emitting component 30 is installed in the receiving groove 60. In this way, the sidewalls of the receiving groove 60 form a light-blocking structure, ensuring that the light beam emitted by the light-emitting component 30 can only exit from the unblocked area at the top of the receiving groove 60. This improves the light-gathering ability of the light-emitting component 30 and prevents light leakage from the bottom or sides. Furthermore, installing the light-emitting component 30 within the receiving groove 60 reduces the risk of damage to the light-emitting component 30, resulting in high reliability.

[0051] Understandable, such as Figure 6 and Figure 7 As shown, when the light-emitting component 30 is installed in the receiving groove 60, the light-emitting component 30 does not protrude from the receiving groove 60.

[0052] In the embodiments provided in this application, such as Figure 7 As shown, the encapsulation 40 includes a light-transmitting second colloidal curing layer 42, which fills the receiving groove 60 and covers the light-emitting component 30. In this way, the second colloidal curing layer 42 can encapsulate the light-emitting component 30, providing physical protection for the light-emitting component 30, achieving insulation isolation of the light-emitting component 30, and ensuring that the light beam emitted by the light-emitting component 30 can be emitted normally, thereby improving the safety and reliability of the encapsulation structure 100.

[0053] like Figure 6 The diagram shown is a schematic of the accommodating groove 60 before the second colloid curing layer 42 is filled. Figure 7 The diagram shows a second colloid curing layer 42 filled into the receiving groove 60. Figure 7 The center-point filling is a translucent second colloidal cured layer 42. It can be understood that the second colloidal cured layer 42 fills the receiving groove 60 and does not protrude from the receiving groove 60.

[0054] Furthermore, the second colloidal curing layer 42 is a light-transmitting colloidal material, specifically epoxy resin or silicone.

[0055] In the embodiments provided in this application, such as Figure 1 , Figure 4 and Figure 5 As shown, several pins 11 are exposed above the first gel-cured layer 41 and surround the outer surfaces of the first and second surfaces of the metal bracket 10. The pins 11 extend to the bottom surface of the first gel-cured layer 41 opposite to the first surface. With this design, the package structure 100 has high overall integrity and facilitates electrical connection between the pins 11 and the driver chip 20. Furthermore, the several pins 11 surrounding the sides of the driver chip 20, together with the metal bracket 10 and the metal cover plate 50, form a six-sided surrounding structure, which further enhances the signal interference immunity of the driver chip 20. In addition, the pins 11 being exposed above the first gel-cured layer 41 and extending to the bottom surface of the first gel-cured layer 41 opposite to the first surface of the metal bracket 10 provides a reasonable structure and facilitates connection with other components.

[0056] Furthermore, a portion of pin 11 is perpendicular to the first surface of metal bracket 10.

[0057] The packaging structure 100, metal bracket 10 and metal cover plate 50 provided in this application are made of copper or copper alloy.

[0058] Optionally, in the embodiments provided in this application, the metal bracket 10 and the metal cover plate 50 are made of a copper sheet. Specifically, according to design requirements, the structure of the metal bracket 10, the pin 11 and the metal cover plate 50 is etched on a copper sheet.

[0059] In the embodiments provided in this application, the light-emitting component 30 includes a plurality of light-emitting chips. Specifically, the light-emitting component 30 includes red light-emitting chips, green light-emitting chips and blue light-emitting chips. These light-emitting chips are independent of each other, and the light emission of these light-emitting chips can be controlled separately by the driver chip 20.

[0060] The packaging structure 100 provided in this application embodiment has the following specific manufacturing process: S1, a copper sheet is provided and the required pattern is made on the copper sheet to form a metal bracket 10 and a metal cover plate 50 structure, wherein the metal bracket 10 includes a plurality of pins 11 and a first side and a second side arranged opposite to each other; S2, a driver chip 20 and a light-emitting component 30 are provided, and the driver chip 20 and the light-emitting component 30 are respectively mounted on the first side and the second side of the metal bracket 10; S3, a package 40 is provided on the metal bracket 10, and the package 40 fixes the metal bracket 10 and covers the driver chip 20 and the light-emitting component 30; S4, the metal cover plate 50 is folded so that the metal cover plate 50 covers the side of the driver chip 20 away from the light-emitting component 30; S5, the pins 11 are bent so that the pins 11 surround the driver chip 20.

[0061] In summary, the packaging structure 100 provided in this application, by improving the structure of the metal support 10 and providing a metal cover plate 50 on the side of the driver chip 20 away from the light-emitting component 30, allows the driver chip 20 to be located within the space formed by the metal support 10, several pins 11, and the metal cover plate 50. This improves the signal shielding capability of the packaging structure 100, thereby enhancing its stability and reliability. Furthermore, the metal support 10 and the metal cover plate 50 of the packaging structure 100 are an integral structure, resulting in high integrity, preventing the metal cover plate 50 from easily detaching, and facilitating manufacturing.

[0062] Example 2:

[0063] like Figures 9-13 As shown, this application provides a packaging structure 100, including a metal bracket 10, a driver chip 20, a light-emitting component 30, a package 40, and a metal cover plate 50.

[0064] In the embodiments provided in this application, such as Figure 9 , Figure 10 and Figure 13 As shown, the metal support 10 includes a plurality of pins 11 and a first surface (e.g., facing each other) arranged opposite to each other. Figure 9 (as shown on one side) and the second side (e.g.) Figure 13As shown on one side), a driver chip 20 is disposed on the first side, and a light-emitting component 30 is disposed on the second side. The light-emitting component 30 is electrically connected to the driver chip 20 through a metal bracket 10. The driver chip 20 is used to control the light-emitting state of the light-emitting component 30. A package 40 is disposed on the metal bracket 10, fixing the metal bracket 10 and covering the driver chip 20 and the light-emitting component 30. Several pins 11 surround the driver chip 20 and are partially exposed outside the package 40. The pins 11 are used to receive external electrical signals and transmit the electrical signals to the driver chip 20. A metal cover plate 50 is disposed on the side of the driver chip 20 away from the light-emitting component 30 and covers the entire driver chip 20.

[0065] In the embodiments provided in this application, such as Figure 9 , Figure 10 and Figure 11 As shown, the metal bracket 10 and the metal cover plate 50 are separate structures, and the metal cover plate 50 is connected to the side of the driver chip 20 away from the light-emitting component 30. This design facilitates the installation of the driver chip 20, effectively integrates space, and helps to reduce the overall volume of the packaging structure 100, resulting in a reasonable structure.

[0066] In the embodiments provided in this application, such as Figure 9 , Figure 10 and Figure 13 As shown, the encapsulation 40 includes an opaque first colloidal curing layer 41, which fixes a metal bracket 10. A first groove 70 is formed on a first surface of the metal bracket 10, and a second groove 80 is formed on a second surface of the metal bracket 10. The driver chip 20 is installed in the first groove 70, and the light-emitting component 30 is installed in the second groove 80. The driver chip 20 and the light-emitting component 30 are respectively installed in the first groove 70 and the second groove 80, which reduces the risk of damage to the driver chip 20 and the light-emitting component 30, resulting in high reliability. Furthermore, the sidewall of the second groove 80 forms a light-blocking structure, ensuring that the light beam emitted by the light-emitting component 30 can only exit from the unblocked area at the top of the second groove 80. This improves the light-gathering ability of the light-emitting component 30 and prevents light leakage from the bottom or sides.

[0067] In the embodiments provided in this application, such as Figure 10 , Figure 12 and Figure 13As shown, the encapsulation 40 includes a light-transmitting second colloidal curing layer 42 and an insulating adhesive. The second colloidal curing layer 42 fills the second groove 80 and covers the light-emitting component 30. The metal cover plate 50 is fixed in the first groove 70 by the insulating adhesive. With this design, the second colloidal curing layer 42 can encapsulate the light-emitting component 30, providing physical protection and insulation for the light-emitting component 30, and ensuring that the light beam emitted by the light-emitting component 30 can be emitted normally, thereby improving the safety and reliability of the encapsulation structure 100. Furthermore, using the insulating adhesive to fix the metal cover plate 50 can achieve insulation isolation between the metal cover plate 50 and the driver chip 20, and can also provide physical protection for the driver chip 20.

[0068] Understandable, such as Figure 9 and Figure 10 As shown, the metal cover plate 50 is disposed in the first groove 70, and the metal cover plate 50 does not protrude from the first groove 70.

[0069] like Figure 12 The diagram shows the second groove 80 without the second colloid cured layer 42 filled. Figure 13 The diagram shows the second groove 80 filled with the second colloidal curing layer 42. Figure 13 The midpoint filler is a translucent second colloidal cured layer 42. This can be understood as... Figure 13 As shown, the light-emitting component 30 and the second colloidal curing layer 42 are disposed in the second groove 80, and the second colloidal curing layer 42 does not protrude from the second groove 80.

[0070] In the embodiments provided in this application, such as Figure 9 and Figure 13 As shown, a plurality of pins 11 extend from the first surface of the metal support 10 to the bottom surface of the first adhesive curing layer 41 opposite to the first surface, and the plurality of pins 11 surround the first groove 70. With the above design, the pins 11 do not protrude from the periphery of the first adhesive curing layer 41, do not occupy surface space, have a reasonable structure, and are easy to process and manufacture.

[0071] In the embodiments provided in this application, such as Figure 9 and Figure 13 As shown, the metal support 10 is made of etched copper blocks. A first groove 70 is formed on the first surface of the metal support 10, and a second groove 80 is formed on the second surface of the metal support 10. The encapsulation structure 100 has high support strength, is not easily deformed, and has a stable structure.

[0072] To facilitate fixing the metal cover plate 50, in the embodiments provided in this application, such as Figure 9 and Figure 10 As shown, the metal bracket 10 includes a plurality of positioning blocks 90, which are distributed around the first groove 70 and surround the metal cover plate 50.

[0073] In summary, the packaging structure 100 provided in this application, by improving the structure of the metal support 10 and providing a metal cover plate 50 on the side of the driver chip 20 away from the light-emitting component 30, allows the driver chip 20 to be located within the space formed by the metal support 10, several pins 11, and the metal cover plate 50. This improves the signal shielding capability of the packaging structure 100, thereby enhancing its operational stability and reliability. Furthermore, the metal support 10 and the metal cover plate 50 of the packaging structure 100 are separate structures, facilitating component installation and effectively integrating space, which helps to reduce the volume of the packaging structure 100, resulting in a rational structure.

[0074] Example 3:

[0075] This application provides a display device, including a circuit board and a plurality of package structures 100, wherein the plurality of package structures 100 are disposed on the circuit board and arranged in a matrix.

[0076] The display device provided in this application improves the performance of the display device and reduces the area occupied by the packaging structure 100 in the display device by improving the packaging structure 100. Specifically, the packaging structure 100 provided in this application improves the structure of the metal bracket 10 and provides a metal cover plate 50 on the side of the driver chip 20 away from the light-emitting component 30, so that the driver chip 20 is located in the space formed by the metal bracket 10, a plurality of pins 11 and the metal cover plate 50, thereby improving the signal shielding capability of the packaging structure 100 and thus improving the stability and reliability of the packaging structure 100.

[0077] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A packaging structure, characterized in that, include: A metal support, comprising several pins and a first and a second surface arranged opposite to each other; An encapsulation component is disposed on the metal bracket. The encapsulation component includes an opaque first colloidal curing layer, a translucent second colloidal curing layer, and an insulating adhesive. The first colloidal curing layer fixes the metal bracket, forms a first groove on the first surface, and forms a second groove on the second surface. The driver chip is installed in the first groove; A light-emitting component is installed in the second groove. The light-emitting component is electrically connected to the driving chip through the metal bracket. The driving chip is used to control the light-emitting state of the light-emitting component. The second colloidal curing layer fills the second groove and covers the light-emitting component. A metal cover plate is disposed on the side of the driving chip away from the light-emitting component and covers the entire driving chip. The metal cover plate is fixed in the first groove by the insulating adhesive. A portion of the pins is perpendicular to the first surface so that the pins surround the driver chip. The package supports the pins, and the pins extend to the bottom surface of the package opposite to the first surface. The pin portions are exposed outside the package. The pins are used to receive external electrical signals and transmit the electrical signals to the driver chip.

2. The packaging structure according to claim 1, characterized in that, The pins do not protrude from the periphery of the first colloid curing layer and extend from the position of the first surface to the bottom surface of the first colloid curing layer opposite to the first surface, and the pins surround the first groove.

3. The packaging structure according to claim 1, characterized in that, The metal bracket includes a plurality of positioning blocks, which are distributed around the first groove and surround the metal cover plate.

4. A display device, characterized in that, It includes several packaging structures as described in any one of claims 1-3, wherein the several packaging structures are arranged in a matrix.

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