Imprinting apparatus, imprinting method, and transfer method

Abstract

Provided are an imprint apparatus and an imprint method that can reduce deformation of a transferred molding pattern, and a transfer method. An imprint apparatus for transferring a molding pattern of a mold to a molded object by pressing the mold and a substrate against the molded object, the imprint apparatus including: a stage for placing either of the mold or the substrate; a configuration member that configures the one of the mold and the substrate that is not placed on the stage at a position where the mold and the substrate sandwich the molded object and is freely movable in a direction in which the mold and the substrate can approach each other; a pressure adjustment section having a pressure adjustment chamber that can contain the mold and the substrate; a pressure reduction member that reduces the pressure in the pressure adjustment chamber; a pressure application member that applies pressure to the pressure adjustment chamber within a range in which the mold and the substrate can freely move in the direction in which the mold and the substrate can approach each other; and a fixing member for fixing the molded object as the molding pattern.

Description

Technical Field

[0001] This invention relates to an imprinting apparatus, an imprinting method, and a conveying method. Background Technology

[0002] In the field of Micro Electro Mechanical Systems (MEMS), in order to improve functionality or added value, high integration or composite processes are carried out by integrating tiny parts with the same or different kinds of functions onto a single substrate.

[0003] Various methods exist for achieving this high level of integration, such as using an impression containing an elastic material and having multiple protrusions to transport micro-parts (e.g., Patent Document 1). In this case, the adhesion force to the micro-parts can be controlled by the pressure or speed between the protrusions of the impression and the micro-parts when picking them up.

[0004] On the other hand, research is underway on forming the mold using an imprinting method. The imprinting method is a method in which a mold with a fine pattern is pressed onto a workpiece such as resin, and the pattern is transferred onto the workpiece using light or heat (for example, see Patent Document 2).

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. WO2008 / 088068

[0008] Patent Document 2: International Publication No. WO2004 / 062886 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] However, in existing embossing methods, if pressure is applied to the mold, then... Figure 8 As shown, there is a problem along the central part of the mold. In this case, the positions of the protruding tips of the formed mold are different. As a result, the pressure between the protrusion of the stamp and the micro-part becomes uneven when picking up micro-parts, thus creating a problem where the adhesion to the micro-part cannot be controlled.

[0011] Therefore, the present invention aims to provide an embossing apparatus and embossing method that can reduce the deformation of the transferred pattern.

[0012] Technical means to solve the problem

[0013] To achieve the aforementioned objective, the first imprinting apparatus of the present invention is used to press a workpiece using a mold and a substrate to transfer a molding pattern of the mold onto the workpiece. The imprinting apparatus includes: a stage for placing either the mold or the substrate; a placement member for positioning the mold or the substrate not placed on the stage at a position where the mold and the substrate clamp the workpiece and is freely movable in a direction approaching the mold and the substrate; a pressure regulating unit having a pressure regulating chamber capable of containing the mold and the substrate; a pressure reducing member for reducing pressure within the pressure regulating chamber; a pressure increasing member for increasing pressure within the pressure regulating chamber within a range that allows free movement in the direction approaching the mold and the substrate; and a fixing member for fixing the workpiece into the molding pattern.

[0014] In this case, a sliding prevention member is preferably included to prevent sliding movement between the mold and the substrate. Alternatively, the configuration member can also be used as a sliding prevention member. In this case, the configuration member is configured to be movable to a position that prevents sliding movement between the mold and the substrate.

[0015] In addition, the configuration component may also have a position detection component for detecting the relative position of the mold with respect to the substrate.

[0016] Additionally, a control component may be included, which controls at least one of the configuration component or the voltage regulation component based on the detection information from the position detection component.

[0017] Furthermore, the configuration component is preferably configured such that the mold is parallel to the substrate.

[0018] Furthermore, it is preferable to include a mold having a wall portion surrounding the molded pattern. In this case, the height of the wall portion relative to the surface having the molded pattern is preferably formed to be 1 μm or more. Additionally, the difference between the maximum and minimum height of the wall portion relative to the surface having the molded pattern is preferably 1 μm or less.

[0019] Alternatively, the fixing component may be a light irradiation component for curing the workpiece by irradiating it with light, or a temperature control component for adjusting the temperature of the workpiece.

[0020] Furthermore, the first imprinting method of the present invention is used to press a workpiece using a mold and a substrate to transfer a molding pattern of the mold onto the workpiece. The imprinting method further includes: a decompression step to remove gas between the mold and the workpiece; a configuration step in which, during decompression, the mold and the substrate are configured to hold the workpiece in the middle and are positioned to be freely movable toward the mold and the substrate; a pressurization step in which gas is used to pressurize the mold and the workpiece within a range that allows free movement toward the mold and the substrate; and a fixing step to fix the workpiece into the molding pattern.

[0021] The pressurization process is preferably performed while preventing the mold from sliding or moving against the substrate.

[0022] In addition, the configuration process is preferably configured such that the mold is parallel to the substrate.

[0023] Alternatively, the fixing process can be achieved by irradiating the workpiece with light to cure it, thereby fixing the pattern onto the workpiece, or by adjusting the temperature of the workpiece to cure it, thereby fixing the pattern onto the workpiece.

[0024] In this case, the mold preferably has a wall portion surrounding the molded pattern. The height of the wall portion relative to the surface having the molded pattern is preferably 1 μm or more. Furthermore, the difference between the maximum and minimum height of the wall portion relative to the surface having the molded pattern is preferably 1 μm or less.

[0025] The effects of the invention

[0026] The embossing apparatus and embossing method of the present invention can transfer a non-deformable pattern onto the workpiece by uniformly applying pressure to the mold. Attached Figure Description

[0027] Figure 1 This is a cross-sectional view showing the embossing apparatus during the decompression process of the present invention.

[0028] Figure 2 This is a cross-sectional view showing the embossing apparatus during the configuration process of the present invention.

[0029] Figure 3 This is a cross-sectional view showing the embossing apparatus in another configuration step of the present invention.

[0030] Figure 4 This is a cross-sectional view showing the embossing apparatus during the pressing process of the present invention.

[0031] Figure 5 This is a cross-sectional view showing another embossing device during the pressing process of the present invention.

[0032] Figure 6 This is a cross-sectional view showing the printing apparatus during the fixing process of the present invention.

[0033] Figure 7 This is a cross-sectional view of the formed object based on the present invention.

[0034] Figure 8 It is a cross-sectional view representing an existing molding method.

[0035] [Explanation of Symbols]

[0036] 1: Mold

[0037] 2: Substrate

[0038] 3: The object to be shaped

[0039] 4: Platform

[0040] 5: Configuration Components

[0041] 6: Pressure regulating section

[0042] 8: Fixing component

[0043] 9: Anti-slip components

[0044] 11: Wall section

[0045] 15: Protrusion

[0046] 61: Pressure regulating chamber

[0047] 62: Frame

[0048] 71: Pressure reducing components

[0049] 72: Pressurization component

[0050] 81: Light irradiation component Detailed Implementation

[0051] use Figures 1 to 7 To illustrate the imprinting apparatus of the present invention. For example... Figure 1 As shown, the embossing apparatus of the present invention is used to press the workpiece 3 with the mold 1 and the substrate 2 to transfer the molding pattern of the mold 1 onto the workpiece 3, and mainly includes a stage 4, a configuration component 5, a pressure regulating unit 6, a pressure reducing component 71, a pressure applying component 72, and a fixing component 8.

[0052] Furthermore, the mold 1 used in the embossing apparatus or method of the present invention preferably includes a rigid body to prevent deformation of the molded pattern. Any material such as a resin (e.g., polyethylene terephthalate, PET) or a cycloolefin polymer (COP), or an inorganic material such as glass, can be used. In photoembossing, when the light source is positioned on the mold 1 side, a transparent material is selected. Additionally, in the case of hot embossing, a material with heat resistance relative to the operating temperature is selected.

[0053] The molding pattern includes not only geometric shapes with raised and recessed areas, but also patterns used for transferring a specified surface condition, such as a mirror finish with a specified surface roughness. Furthermore, the minimum dimensions of the width of the raised or recessed portions of the molding pattern are various sizes, such as 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, etc. Additionally, the dimensions in the depth direction are also various sizes, such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, 100 μm or more, etc.

[0054] Furthermore, when transferring a molded pattern with high dimensions (both longitudinal and transverse), or when the base supporting the molded pattern is thick, there is a problem of the workpiece 3 leaking towards the side of the mold 1, resulting in insufficient molding pressure to fill the molded pattern with the workpiece 3. Therefore, the mold 1 may also have a wall portion 11 surrounding the molded pattern. This suppresses leakage of the workpiece 3 towards the side of the mold 1 when pressurizing the workpiece 3 with the mold 1, ensuring sufficient filling of the molded pattern with the workpiece 3. The height of the wall portion 11 relative to the surface with the molded pattern is, for example, only 1 μm or more. However, if the height of the wall portion deviates, the parallelism between the mold and the substrate will be disrupted due to differences in the flow rate of the workpiece near the wall portion during the pressing process of the imprinting method described later. Therefore, it is preferable to have minimal deviation in the height of the wall portion. For example, it is preferable to set the difference between the maximum and minimum height of the wall portion relative to the surface with the molded pattern to 1 μm or less.

[0055] The substrate 2 can be any substrate that can support the object being molded 3, such as resin, inorganic compound or metal.

[0056] The molded object 3 only needs to have the molding pattern of the mold 1 transferred onto at least one of the mold 1 and the substrate 2. The resin used as the molded object 3 may be a photocurable resin, a thermocurable resin, or a thermoplastic resin.

[0057] The photocurable resin used for the molded object 3 is a fluid resin that is cured by light of a specific wavelength. Any resin can be used as long as it is used in photoimprinting technology. For example, silicone rubber such as polydimethylsiloxane (PDMS), or compounds containing epoxides, (meth)acrylates, vinyl ethers, or dielyl nadicimide, etc., containing unsaturated hydrocarbon groups such as vinyl or allyl groups, can be used. In this case, a photoreactive initiator can also be added, and the molding pattern is formed by polymerization reaction under light irradiation. As a photoreactive free radical initiator, acetophenone derivatives, benzophenone derivatives, benzoyl ether derivatives, xanthonesone derivatives, etc., are preferably used. In addition, the reactive monomer can be used in a solvent-free manner, or it can be dissolved in a solvent and then removed from the solvent after coating.

[0058] The thermosetting resin used in the molded article 3 is a fluid resin that hardens upon heating. Any resin used in thermoforming technology can be used. For example, silicone rubber such as polydimethylsiloxane (PDMS), or compounds containing epoxides, (meth)acrylates, vinyl ethers, or dielyl nadicimide compounds containing unsaturated hydrocarbon groups such as vinyl or allyl groups can be used. In this case, compounds containing polymerization reactive groups can be used alone for thermopolymerization, or thermoreactive initiators can be added to improve thermosetting properties. Organic peroxides and azo compounds are preferably used as thermoreactive free radical initiators, while acetophenone derivatives, benzophenone derivatives, benzoyl ether derivatives, and xanthonone derivatives are preferably used as photoreactive free radical initiators. Furthermore, the reactive monomer can be used solvent-free or dissolved in a solvent and then removed from the solvent after coating.

[0059] Furthermore, the thermoplastic resin used for the molded object 3 is a resin that is fluid when it reaches its glass transition temperature or melting point and cures upon cooling. Any resin can be used as long as it is used in hot stamping technology. For example, cyclic olefin resins such as cyclic olefin ring-opening polymers / hydrides (COP) or cyclic olefin copolymers (COC), acrylic resins, polycarbonate, vinyl ether resins, fluoropolymers such as perfluoroalkoxyalkane (PFA) or polytetrafluoroethylene (PTFE), polystyrene, polyimide resins, polyester resins, etc.

[0060] like Figure 2 or Figure 3As shown, the stage 4 is used to hold either the mold 1 or the substrate 2. It is preferable that the mold 1 and substrate 2 are placed parallel to each other, and more preferably, that the surface of the mold 1 with the patterned design is horizontal to the opposite side of the substrate 2. The material of the stage 4 can be any material suitable for the forming conditions; for example, a material with pressure resistance and heat resistance relative to the forming conditions is preferred, such as stainless steel. Furthermore, in the photolithography process, when the light source is positioned on the side of the stage 4, a transparent material such as glass can be used.

[0061] The configuration component 5 positions the mold 1 and the substrate 2 that are not placed on the stage 4 at a position where the mold 1 and substrate 2 clamp the workpiece 3, and allows it to move freely toward the mold 1 and substrate 2. Furthermore, in this specification, "the mold 1 and substrate 2 clamp the workpiece 3" means that the workpiece 3 is in contact with both the mold 1 and substrate 2. Additionally, in this specification, "allowing it to move freely toward the mold 1 and substrate 2" means that the mold 1 or substrate 2 is placed on the fluid workpiece 3 and substantially floats, with the entire mold 1 or substrate 2 subjected to uniform pressure. Specifically, as... Figure 2 As shown, with the substrate 2 placed on the stage 4, the mold 1 is positioned so that it can move freely in the direction of approaching the substrate 2. That is, it becomes a state where the mold 1 is placed on the workpiece 3 on the substrate 2 and substantially floats. Furthermore, as... Figure 3 As shown, when the mold 1 is placed on the stage 4, the substrate 2 is positioned in a position that allows it to move freely toward the mold 1 and the substrate 2. That is, the substrate 2 is placed on the workpiece 3 on the mold 1 and is substantially floating.

[0062] Furthermore, the configuration component 5 is preferably configured so that the mold 1 and the substrate 2 are parallel. The configuration component 5 can be any component, as long as it can be positioned such that either the mold 1 or the substrate 2 is clamped between the mold 1 and the substrate 2 and can move freely in a direction approaching the mold 1 and the substrate 2. For example, it can include components such as: a holding portion that horizontally holds the mold 1 or the substrate 2, a lifting component for raising and lowering the holding portion, and a retraction component that moves the holding portion laterally away from the mold 1. As a holding portion, for example, it can simply be a protrusion 15 that protrudes horizontally from the side of the mold 1 and is configured to support the protrusion 15. Although not shown, the movement of the holding portion using the lifting component or the retraction component can be any known component, such as a component that moves via a hydraulic or pneumatic cylinder, or a component that moves via an electric motor and a ball screw.

[0063] Alternatively, the configuration component 5 may also include a position detection component that detects the relative position of the mold 1 with respect to the substrate 2. This allows for the determination of the contact position between the mold 1 and the workpiece 3, or between the substrate 2 and the workpiece 3, or the position where the mold 1 can move freely in the direction of approaching the substrate 2. Furthermore, during pressurization, pressure can be applied to the mold 1 and the substrate 2 within a range that allows free movement in the direction of approaching the substrate 2. As the position detection component, any known component can be used; for example, a component that uses a laser length measuring machine mounted on the stage 4 to determine the position of the mold 1 can be used. Alternatively, if an electric motor is used for the configuration component 5, an encoder mounted on the electric motor can be used to calculate and determine the position of the mold 1 based on the displacement.

[0064] The pressure regulating unit 6 constitutes a pressure regulating chamber 61 capable of containing the mold 1 and the substrate 2. Therefore, by regulating the air pressure in the pressure regulating chamber 61, gas residue within the molding pattern of the mold 1 can be prevented, or the molded object 3 can be pressurized using the mold 1 and the substrate 2. The pressure regulating chamber 61 can be of any size and shape as long as it can contain the mold 1 and the substrate 2, and its design can be tailored to consider factors such as the air pressure within the pressure regulating chamber 61 and the adjustment time. For example, such as... Figure 4 As shown, a bottomed cylindrical frame 62 can be used, which together with the platform 4 forms the pressure regulating chamber 61. In this case, in order to transport the mold 1 or the substrate 2 into the pressure regulating chamber 61, a lifting member that can raise and lower the frame 62 relative to the platform 4 can be provided, thus opening the gap between the frame 62 and the platform 4. Alternatively, an opening and closing part for transporting the mold 1 or the substrate 2 into the pressure regulating chamber 61 can be provided in the frame 62. In addition, the pressure regulating unit 6 can also be configured to have a pressure regulating chamber 61 that also contains the platform 4.

[0065] The pressure-reducing component 71 is used to remove gas between the mold 1 and the workpiece 3, reducing the pressure in the pressure regulating chamber 61 to a pressure that allows for pattern formation without problems. This pressure, where pattern formation is not problematic, refers to a pressure that prevents gas from remaining as air bubbles within the molded pattern and causing poor transfer; preferably, it is 1000 Pa or less, and more preferably 100 Pa or less. As the pressure-reducing component 71, a known pressure-reducing pump connected to the pressure regulating chamber 61 and capable of removing gas from it is sufficient, for example.

[0066] Additionally, the pressurizing component 72 is used to pressurize the pressure regulating chamber 61 to fill the molded object 3 into the molding pattern of the mold 1. The pressure required to fill the molded object 3 into the molding pattern of the mold 1 is appropriately set according to the viscosity of the molded object 3, etc. Furthermore, the pressurizing component 72 pressurizes the pressure regulating chamber 61 within a range that allows it to move freely in the direction of approaching the mold 1 and the substrate 2. This allows uniform pressure to be applied to the mold 1, the substrate 2, and the molded object 3, thus preventing deformation of the molded object 3. For example, the pressurizing component 72 can be a gas cylinder connected to the pressure regulating chamber 61 and supplied with a gas capable of pressurizing the pressure regulating chamber 61, such as air or an inert gas, or a pressurizing pump. Alternatively, if atmospheric pressure is sufficient, other methods can be used. Figure 4 As shown, an open valve that connects the inside of the pressure regulating chamber 61 to the outside of the pressure regulating chamber 61 can also be used.

[0067] Alternatively, a control unit may be included to control the configuration unit 5 or the pressure regulating unit based on detection information from the position detection unit. Thus, the configuration unit 5 can be used to position the mold 1 or the substrate 2 at a position where the mold 1 and the substrate 2 clamp the workpiece 3 and can move freely in a direction approaching the mold 1 and the substrate 2; or the pressure applying unit 72 can be used to apply pressure to the mold 1 and the workpiece 3 within a range that allows free movement in the direction approaching the mold 1 and the substrate 2. As for the control unit, any component can be used as long as it can control the configuration unit 5 or the pressure regulating unit, and a known computer can be used.

[0068] The fixing component 8 is used to fix the workpiece 3 into a molded pattern. When used for photolithography, the fixing component 8 can be simply a light irradiation component 81. Alternatively, when used for thermal lithography, a temperature control component can be used.

[0069] The light irradiation component 81 is used to irradiate the workpiece 3 containing the photocurable resin with light to cure it. The light irradiation component 81 can be any component as long as it can irradiate the workpiece 3 with electromagnetic waves of a predetermined wavelength to cure it; for example, any ultraviolet irradiation device that irradiates the workpiece 3 with ultraviolet light is acceptable. Here, the light irradiation component 81 can be single or multiple, as long as it can irradiate the workpiece 3. When multiple components are configured, it is preferable to arrange them in a manner that makes the illuminance distribution as uniform as possible within the workpiece 3.

[0070] The temperature regulating component is used to adjust the temperature of the workpiece 3 containing a thermosetting resin or a thermoplastic resin, so as to make the workpiece 3 flowable or to cure it. As the temperature regulating component, a heating component that directly or indirectly heats the workpiece 3 can be used. Alternatively, a cooling component that directly or indirectly cools the workpiece 3 can also be used.

[0071] The heating component can be any component that can heat either or both of the mold 1 and the workpiece 3 to a specified temperature, such as above the glass transition temperature or melting point of the thermoplastic resin constituting the workpiece 3, or above the curing temperature of the thermosetting resin. Furthermore, the workpiece 3 can be heated from the stage 4 side or from the mold 1 side. For example, a component with a heater installed inside the stage 4 can be used to heat the mold 1 or the workpiece 3. Alternatively, heated liquid or gas can also be used for heating.

[0072] The cooling component can be any component that can cool either or both of the mold 1 and the workpiece 3 to a specified temperature, such as below the glass transition temperature or melting point of the thermoplastic resin constituting the workpiece 3, or below the curing temperature of the thermosetting resin. Alternatively, the workpiece 3 can be cooled from the stage 4 side or from the mold 1 side. For example, a cooling fan or a cooling water channel formed within the stage 4 and through which liquid flows to cool the mold 1 or the workpiece 3 can be used.

[0073] In addition, the temperature control component may also include a temperature detection component that detects the temperature of the mold 1, substrate 2, workpiece 3, stage 4, etc., and adjusts the temperature of workpiece 3 based on the detected temperature information.

[0074] Furthermore, in the embossing apparatus of the present invention, when either the mold 1 or the substrate 2 is in a position where it can move freely in the direction of approaching the mold 1 and the substrate 2, it is suspended above the workpiece 3. Therefore, there is a problem that the mold 1 and the substrate 2 are prone to sliding during pressure application. Therefore, a sliding prevention member 9 can be provided to prevent sliding of the mold 1 and the substrate 2. The sliding prevention member 9 can be any component as long as it prevents sliding in a direction orthogonal to the approach direction without hindering the movement of the mold 1 or the substrate 2 suspended above the workpiece 3 in the approach direction. For example, such as... Figure 4 As shown, a guide-shaped anti-slip member 9 with a predetermined gap is simply provided on the side of the mold 1, which is suspended above the workpiece 3. Furthermore, if a substrate 2 is floating above the workpiece 3, although not shown, a guide-shaped anti-slip member with a predetermined gap is simply provided on the side of the substrate 2. Additionally, as... Figure 5 As shown, the configuration component 5 can also be used as a sliding prevention component. In this case, the configuration component 5 only needs to be formed so that it can move to a position that prevents the mold 1 and the substrate 2 from sliding when the mold 1 and the workpiece 3 are pressurized. Furthermore, the size of the gap between the sliding prevention component 9 and the side of the mold 1 or the substrate 2 is not particularly limited as long as it allows the mold 1 and the substrate 2 to slide. For example, it can be set to a size of 0.5 mm or less.

[0075] Next, the imprinting method of the present invention will be described. The imprinting method of the present invention is a method for transferring the molding pattern of the mold 1 onto the workpiece 3 by applying pressure to the workpiece 3 using the mold 1 and the substrate 2, and mainly includes a decompression process, a configuration process, a pressure application process, and a fixing process.

[0076] The decompression process is used to remove gas between the mold and the workpiece. For example... Figure 1 As shown, simply by creating a gap between the mold 1 and the workpiece 3 to reduce the pressure in the pressure regulating chamber 61, the gas inside the chamber can be removed. This prevents gas from remaining as bubbles within the molded pattern and causing poor transfer. The pressure during the pressure reduction process is not particularly limited as long as it reduces the pressure in the pressure regulating chamber 61 to a level that allows for proper pattern formation; for example, it is preferably 1000 Pa or less, and more preferably 100 Pa or less.

[0077] like Figure 2 or Figure 3 As shown, in the decompression process, the mold 1 and the substrate 3 are configured to hold the workpiece 3 in the middle and are positioned so as to allow free movement toward the mold 1 and the substrate 2. Specifically, as... Figure 2 As shown, with the substrate 2 placed on the stage 4, the mold 1 is positioned so that it can move freely in the direction of approaching the substrate 2. That is, it becomes a state where the mold 1 is placed on the workpiece 3 on the substrate 2 and substantially floats. Furthermore, as... Figure 3 As shown, when the mold 1 is placed on the stage 4, the substrate 2 is positioned so that it can move freely toward the mold 1 and the substrate 2. That is, the substrate 2 is placed on the workpiece 3 on the mold 1 and is substantially floating. Furthermore, in the placement process, the mold 1 and the substrate 2 are preferably arranged in a parallel manner.

[0078] like Figure 4 As shown, the pressurizing process applies pressure to the mold 1 and the workpiece 3 using gas within a range that allows the mold 1 to move freely toward the substrate 2. This applies uniform pressure to the mold 1, substrate 2, and workpiece 3, thus preventing deformation of the workpiece 3.

[0079] Furthermore, during the pressurization process, as described above, in a position where it can move freely towards the mold 1 and the substrate 2, either the mold 1 or the substrate 2 is suspended above the workpiece 3. Therefore, during pressurization of the mold 1 and the substrate 2, the mold 1 and the substrate 2 are prone to sliding. Therefore, the pressurization process is preferably performed while preventing the mold 1 and the substrate 2 from sliding (see reference). Figure 4 or Figure 5 ).

[0080] The fixing process fixes the workpiece 3 into a molded pattern. As a fixing process, in the case of photolithography, such as... Figure 6 As shown, the pattern can be fixed onto the workpiece 3 by simply irradiating it with light to cure it. The irradiated light can be any light that can cure the photocurable resin used in the workpiece 3, such as ultraviolet light. Alternatively, in the case of thermoforming, the pattern can be fixed onto the workpiece 3 by adjusting its temperature to cure it. For example, if the workpiece 3 contains a thermocurable resin, it can be cured by heating the workpiece 3 to a temperature above the resin's curing temperature. Conversely, if the workpiece 3 contains a thermoplastic resin, it can be cured by cooling the workpiece 3 to a temperature below the resin's glass transition temperature or melting point.

[0081] Furthermore, in the case of hot stamping, a temperature conditioning process is sometimes required before the pressing process to adjust the temperature so that the workpiece 3 has a fluidity. For example, if the workpiece 3 contains a thermoplastic resin, the workpiece 3 is heated to above the glass transition temperature or melting point of the resin. Alternatively, if the workpiece 3 contains a thermosetting resin, the temperature of the workpiece 3 is maintained below the temperature at which the resin does not harden. Furthermore, the temperature conditioning process can be performed either before or after the decompression process.

[0082] Finally, as Figure 7 As shown, as long as the mold 1 is demolded from the workpiece 3, the workpiece 3 can be formed by transferring the molding pattern of the mold 1 without deformation.

Claims

1. An embossing apparatus for applying pressure to a workpiece using a mold and a substrate to transfer a molding pattern from the mold onto the workpiece, wherein the embossing apparatus comprises: A stage for placing either the mold or the substrate; The configuration component positions the mold and the substrate that are not placed on the stage at the position where the mold and the substrate hold the workpiece, and places it on the workpiece which has fluidity, so that it is substantially floating. The configuration component also configures the mold and the substrate that are not placed on the stage in such a way that the mold and the substrate can move freely in a direction that allows them to approach each other. The pressure regulating section has a pressure regulating chamber capable of containing the mold and the substrate; A pressure-reducing component reduces pressure within the pressure-regulating chamber; A pressurizing component pressurizes the pressure regulating chamber in a state where either the mold or the substrate is placed on the stage and the other is placed on the fluid workpiece to be formed, thus substantially floating. as well as A fixing component for fixing the workpiece into the molded pattern.

2. The imprinting apparatus according to claim 1, characterized in that, Includes a sliding prevention component to prevent the mold from sliding against the substrate.

3. The imprinting apparatus according to claim 1, characterized in that, The configuration component can be moved to a position that prevents the mold from sliding against the substrate.

4. The imprinting apparatus according to any one of claims 1 to 3, characterized in that, The configuration component has a position detection component for detecting the relative position of the mold with respect to the substrate.

5. The imprinting apparatus according to claim 4, characterized in that, The system includes a control component that controls at least one of the configuration component or the pressurization component based on the detection information from the position detection component.

6. The embossing apparatus according to any one of claims 1 to 3, characterized in that, The configuration components are arranged in a manner in which the mold is parallel to the substrate.

7. The imprinting apparatus according to any one of claims 1 to 3, characterized in that, The mold has a surrounding wall that surrounds the shaped pattern.

8. The embossing apparatus according to claim 7, characterized in that, The height of the wall portion relative to the surface having the molded pattern is 1 μm or more.

9. The imprinting apparatus according to claim 7, characterized in that, The difference between the maximum and minimum height of the wall portion relative to the surface having the shaped pattern is less than 1 μm.

10. The embossing apparatus according to any one of claims 1 to 3, characterized in that, The fixing component is a light irradiation component used to irradiate the workpiece with light to cure it, or a temperature control component used to adjust the temperature of the workpiece.

11. An embossing method for applying pressure to a workpiece using a mold and a substrate to transfer a molding pattern from the mold onto the workpiece, wherein the embossing method is characterized by having: The decompression process removes the gas between the mold and the workpiece. In the configuration process, under decompression, the mold and the substrate are configured to hold the workpiece in the middle, and one of the mold and the substrate is placed on the workpiece which has fluidity so that it is substantially floating. In the configuration process, the one of the mold and the substrate that is not placed on the stage is configured in such a way that the mold and the substrate can move freely in the direction of mutual approach. In the pressurization process, the mold and the workpiece are pressurized by air pressure while one of the mold or the substrate is placed on the stage and the other is placed on the fluid workpiece, thus becoming substantially floating. as well as The fixing process fixes the object to be formed into the pattern.

12. The imprinting method according to claim 11, characterized in that, The pressurization process is performed while preventing the mold from sliding or moving against the substrate.

13. The imprinting method according to claim 11 or 12, characterized in that, The configuration process is performed with the mold and the substrate arranged in a parallel manner.

14. The imprinting method according to claim 11 or 12, characterized in that, The fixing process is either a process of curing the workpiece by irradiating it with light, thereby fixing the pattern onto the workpiece, or a process of curing the workpiece by adjusting its temperature, thereby fixing the pattern onto the workpiece.

15. The imprinting method according to claim 11 or 12, characterized in that, The mold has a surrounding wall that surrounds the shaped pattern.

16. The imprinting method according to claim 15, characterized in that, The height of the wall portion relative to the surface having the molded pattern is 1 μm or more.

17. The imprinting method according to claim 15, characterized in that, The difference between the maximum and minimum height of the wall portion relative to the surface having the shaped pattern is less than 1 μm.

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