Display array and method of making the same

Abstract

The present disclosure provides a display array and a preparation method thereof, and belongs to the technical field of display. In the light emitting diode of the display array, the light emitting diode is arranged to include an epitaxial support layer, a light-transmitting bonding layer, an n-type layer, a light emitting layer, a p-type layer and an electrode which are sequentially stacked on a support substrate. The epitaxial support layer has a plurality of filling holes which are in communication with the support substrate and the light-transmitting bonding layer and quantum fluorescent particles which are located in the filling holes, and the quantum fluorescent particles facilitate the color control of the display array. The quantum fluorescent particles of at least one light emitting diode of the plurality of light emitting diodes are red quantum fluorescent particles, which ensure stable emission of red light. The preparation steps of the quantum fluorescent particles and the epitaxial support layer are less, and the growth system of the support layer is relatively simple, which can reduce the preparation difficulty of the display array.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to display arrays that are easy to fabricate and methods for fabricating the same. Background Technology

[0002] Display arrays are commonly used in various display devices and are used to emit light and display images. A display array consists of a support substrate and multiple light-emitting diodes (LEDs) arranged in an array on the support substrate. The color of the LEDs in the display array needs to be set according to the actual display requirements; different colors of LEDs require different epitaxial materials.

[0003] Some light-emitting diodes (LEDs) are difficult to manufacture and prone to defects. For example, the basic material for red and yellow LEDs is gallium phosphide, which has a complex and costly manufacturing system, resulting in high manufacturing costs for red and yellow LEDs. Summary of the Invention

[0004] This disclosure provides a display array that is easy to fabricate and a method for fabricating the same, which can reduce the difficulty of fabricating display arrays. The technical solution is as follows:

[0005] This disclosure provides a display array that is easy to fabricate. The display array includes a support substrate and a plurality of light-emitting diodes (LEDs) arrayed on the support substrate. Each LED includes an epitaxial support layer, a light-transmitting bonding layer, an n-type layer, a light-emitting layer, a p-type layer, and an electrode, which are sequentially stacked on the support substrate.

[0006] The epitaxial support layer has a plurality of filling holes connecting the support substrate and the light-transmitting bonding layer and quantum fluorescent particles located in the filling holes. The maximum distance between two adjacent filling holes is 0.1 to 10 μm. The quantum fluorescent particles of at least one of the plurality of light-emitting diodes are red quantum fluorescent particles.

[0007] Optionally, the thickness of the epitaxial support layer is 1 to 10 μm.

[0008] Optionally, the diameter of each of the filling holes is 0.01 to 10 μm.

[0009] Optionally, the plurality of light-emitting diodes are divided into red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes, wherein the quantum fluorescent particles of the red light-emitting diodes are red quantum fluorescent particles, the quantum fluorescent particles of the green light-emitting diodes are green quantum fluorescent particles, and the quantum fluorescent particles of the blue light-emitting diodes are blue quantum fluorescent particles.

[0010] Optionally, the light-transmitting bonding layer is an organic adhesive material.

[0011] Optionally, the light-emitting layer comprises either a nitride or a phosphide.

[0012] This disclosure provides a method for fabricating an easily fabricated display array, the method comprising:

[0013] A support substrate and an epitaxial structure are provided. The epitaxial structure includes a temporary substrate and a plurality of light-emitting diodes (LEDs) arrayed on the temporary substrate. Each LED includes an electrode, a p-type layer, a light-emitting layer and an n-type layer sequentially stacked on the temporary substrate.

[0014] Multiple epitaxial support layers are formed in an array on the support substrate, and a first bonding film is stacked on each of the epitaxial support layers. Each epitaxial support layer has multiple filling holes that connect the support substrate and the first bonding film and quantum fluorescent particles located in the filling holes. The maximum distance between two adjacent filling holes is 0.1 to 10 μm. The quantum fluorescent particles in at least one of the multiple epitaxial support layers are red quantum fluorescent particles.

[0015] A plurality of second bonding films, corresponding one-to-one with the plurality of first bonding films, are formed on the side of the n-type layer away from the temporary substrate;

[0016] The supporting substrate and the temporary substrate are bonded together, and each of the first bonding films is bonded to the corresponding second bonding film to form a transparent bonding layer;

[0017] Remove the temporary substrate.

[0018] Optionally, an array of multiple epitaxial support layers is formed on the support substrate, including:

[0019] Multiple epitaxial support films are formed on the support substrate;

[0020] Multiple filling holes are formed on the multiple epitaxial support films by electrochemical etching.

[0021] Quantum dot fluorescent particles are filled into the plurality of filling holes to obtain an epitaxial support layer.

[0022] Optionally, the support substrate and the temporary substrate are bonded under conditions of temperature of 150–300°C and pressure of 500–3000 kg.

[0023] Optionally, the epitaxial structure is provided, comprising:

[0024] Multiple light-emitting diodes are grown on a growth substrate, wherein the multiple light-emitting diodes include an n-type layer, a light-emitting layer, a p-type layer and an electrode sequentially stacked on the growth substrate;

[0025] A temporary substrate is glue-bonded to the side of the light-emitting diode away from the growth substrate;

[0026] Separate the growth substrate from the light-emitting diode to obtain an epitaxial structure.

[0027] The beneficial effects of the technical solutions provided in this disclosure are:

[0028] In the LEDs of the display array, the LEDs are configured to include an epitaxial support layer, a transparent bonding layer, an n-type layer, an emissive layer, a p-type layer, and electrodes, sequentially stacked on a support substrate. The epitaxial support layer has multiple filling holes connecting the support substrate and the transparent bonding layer, and quantum fluorescent particles located within the filling holes. The maximum distance between two adjacent filling holes is 0.1–10 μm. The epitaxial support layer provides support for the quantum fluorescent particles, ensuring their stable operation within the LEDs. The quantum fluorescent particles themselves can be activated by light emitted from the emissive layer and ultimately emit light of the desired color from the emitting surface of the display array. This facilitates color control of the display array, and since quantum fluorescent materials are relatively conventional, adjusting their composition allows for the emission of light of any color. If at least one of the LEDs has a red quantum fluorescent particle, it ensures that the display array can stably emit the required red light. If the maximum distance between the filling holes is within the above range, it can ensure that the quantum fluorescent particles in the filling holes can effectively convert the light emitted by the light-emitting layer, ensuring the consistency of the color of the light emitted by the light-emitting diode. At the same time, the preparation steps of the quantum fluorescent particles and the epitaxial support layer are less, and the growth system of the support layer is simpler, which can reduce the difficulty of fabricating the display array. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a display array provided in an embodiment of this disclosure;

[0031] Figure 2 This is a top view of the epitaxial support layer provided in the embodiments of this disclosure;

[0032] Figure 3 This is a side view of the extensional support layer provided in an embodiment of this disclosure;

[0033] Figure 4This is a flowchart of a display array fabrication method provided in an embodiment of this disclosure;

[0034] Figure 5 This is a top view of the multiple extensional support layers provided in the embodiments of this disclosure;

[0035] Figure 6 This is a flowchart of another display array fabrication method provided in this embodiment;

[0036] Figure 7 and Figure 8 This is a schematic diagram of the display array fabrication process provided in an embodiment of this disclosure. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0038] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0039] Figure 1 This is a schematic diagram of a display array structure provided in an embodiment of this disclosure, such as... Figure 1 As shown, this embodiment of the present disclosure provides a display array that is easy to fabricate. The display array includes a support substrate 1 and a plurality of light-emitting diodes 2 arrayed on the support substrate 1. Each light-emitting diode 2 includes an epitaxial support layer 21, a light-transmitting bonding layer 22, an n-type layer 23, a light-emitting layer 24, a p-type layer 25 and an electrode 26, which are sequentially stacked on the support substrate 1.

[0040] The epitaxial support layer 21 has multiple filling holes 211 that connect the support substrate 1 and the light-transmitting bonding layer 22, and quantum fluorescent particles 212 located in the filling holes 211. The maximum distance between two adjacent filling holes 211 is 0.1 to 10 μm. At least one of the multiple light-emitting diodes 2 has a red quantum fluorescent particle 212.

[0041] In the light-emitting diode 2 of the display array, the light-emitting diode 2 is configured to include an epitaxial support layer 21, a transparent bonding layer 22, an n-type layer 23, a light-emitting layer 24, a p-type layer 25, and an electrode 26, which are sequentially stacked on a support substrate 1. The epitaxial support layer 21 has multiple filling holes 211 connecting the support substrate 1 and the transparent bonding layer 22, and quantum fluorescent particles 212 located in the filling holes 211. The maximum distance between two adjacent filling holes 211 is 0.1~10um. The epitaxial support layer 21 can provide a certain support for the quantum fluorescent particles 212, ensuring that the quantum fluorescent particles 212 can work stably in the light-emitting diode 2. The quantum fluorescent particles 212 themselves can be activated by the light emitted from the light-emitting layer 24, and finally emit light of the desired color from the emitting surface of the display array. This facilitates the color control of the display array, and since quantum fluorescent materials are relatively conventional, adjusting the composition of the quantum fluorescent material can achieve the emission of light of any color. If at least one of the LEDs 2 has a red quantum fluorescent particle 212, then the display array can stably emit the required red light. If the maximum distance between the filling holes 211 is within the specified range, the quantum fluorescent particles 212 within the filling holes 211 can effectively convert the light emitted from the light-emitting layer 24, ensuring the consistency of the color of the light emitted by the LEDs 2. Furthermore, the fabrication steps for the quantum fluorescent particles 212 and the epitaxial support layer 21 are fewer, and the growth system of the support layer is simpler, reducing the fabrication difficulty of the display array. Moreover, placing the quantum dot fluorescent particles 212 inside the filling holes 211 of the epitaxial support layer 21 effectively protects the quantum fluorescent particles 212, reducing the possibility of them falling off or being damaged by external influences, thus extending the lifespan of the quantum fluorescent particles 212 and consequently extending the lifespan of the display array. Furthermore, the epitaxial support layer 21 and the n-type layer 23 are connected by a transparent bonding layer 22, which can reduce defects caused by epitaxial growth, ensure a stable connection between the epitaxial support layer 21 and the n-type layer 23, and reduce defects that may exist in the light-emitting layer 24, which is beneficial to improving the light-emitting quality of the obtained light-emitting diode 2 and the display array.

[0042] It should be noted that in a display array with consistent light emission color, the light-transmitting bonding layer 22 and the epitaxial support layer 21 of adjacent light-emitting diodes 2 can be connected accordingly. In the actual fabrication process, the electrodes 26 of the light-emitting diodes are usually divided into n-electrodes 26 and p-electrodes 26. A groove is also provided on the p-type layer 25 to connect to the n-type layer 23. The n-electrodes 26 are connected to the n-type layer 23 through the grooves, while the p-electrodes 26 are connected to the surface of the p-type layer 25 away from the support substrate 1. Figure 1 The groove extending from the p-type layer 25 to the n-type layer 23 is omitted, as is the connection between the n-electrode 26 and the n-type layer 23. It should be noted that the side containing the supporting substrate 1 in this disclosure is the light-emitting side of the display array. Furthermore, in the implementation provided in this disclosure, all quantum fluorescent particles 212 in the display array can be of the same color, or they can have a structure where the quantum fluorescent particles 212 of the multiple light-emitting diodes 2 shown below are not completely identical. This disclosure does not impose any limitations on this.

[0043] In the implementation provided in this disclosure, when the light-emitting diode 2 is a blue LED and used as the excitation light, only green and red quantum fluorescent particles 212 need to be filled. When the light-emitting diode 2 is an ultraviolet LED and used as the excitation light, it needs to be filled with corresponding red, green, and blue quantum fluorescent particles 212. This ensures stable light emission from the display array.

[0044] For example, the material of the epitaxial support layer 21 is gallium nitride.

[0045] Gallium nitride (GaN) is a relatively stable material that provides good protection for quantum fluorescent materials and is easy to fabricate. It also allows for stable connections and compatibility with most epitaxial materials, which is beneficial for improving the quality of the final light-emitting diode (LED) and display array.

[0046] In one implementation provided in this disclosure, the epitaxial support layer 21 may be doped with Si. Doping the gallium nitride epitaxial support layer 21 with Si can give the epitaxial support layer 21 a certain conductivity, while providing a relatively sufficient number of electrons.

[0047] For example, with Si doped in the epitaxial support layer 21, the Si doping concentration in the epitaxial support layer 21 can be reduced in the direction from the support substrate 1 to the epitaxial support layer 21. This can control the formation speed of vias by changing the Si doping concentration, thereby forming relatively uniform vias in the light emission direction.

[0048] Optionally, in the direction from the supporting substrate 1 to the epitaxial support layer 21, the Si doping concentration in the epitaxial support layer 21 can decrease linearly or in a gradient. The resulting epitaxial support layer 21 has good quality and can also achieve stable connections with different epitaxial materials.

[0049] Optionally, the thickness of the epitaxial support layer 21 is 1 to 10 μm.

[0050] The thickness of the epitaxial support layer 21 is within the above range, which can ensure that the epitaxial support layer 21 achieves a stable connection between the support substrate 1 and the n-type layer 23, and at the same time ensures that the filling distance of the quantum fluorescent particles 212 is reasonable, which can ensure the stable light emission of the quantum fluorescent particles 212.

[0051] In other implementations provided in this disclosure, the material of the epitaxial support layer 21 may also be a phosphide or a material with a certain chemical corrosion capability, which can also provide support for the quantum fluorescent particles 212 and achieve connection with other materials. The thickness of the epitaxial support layer 21 may also be slightly greater than the maximum value of the above range or slightly less than the minimum value of the above range, and this disclosure does not impose any restrictions on it.

[0052] Figure 2 This is a top view of the extensional support layer 21 provided in the embodiments of this disclosure. Figure 3 This is a side view of the extensional support layer 21 provided in this embodiment of the disclosure, combined with... Figure 2 and Figure 3 The diameter of each filling hole 211 is 0.1 to 10 μm.

[0053] The diameter of each filling hole 211 is within the above range, which can ensure that the filling hole 211 is filled with enough quantum fluorescent particles 212, and can ensure the stable emission of light by the quantum fluorescent particles 212.

[0054] It should be noted that, Figure 2 The quantum fluorescent particle 212 is omitted in the text. Figure 2 and Figure 3 In the implementation shown, the distance between two adjacent filling holes 211 is not exactly the same. In other implementations provided in this disclosure, the diameter of every two adjacent filling holes 211 in each epitaxial support layer 21 may also be the same, and this disclosure does not impose any restrictions on this.

[0055] Optionally, the multiple light-emitting diodes 2 are divided into red light-emitting diodes, green light-emitting diodes and blue light-emitting diodes, with the quantum fluorescent particles 212 of the red light-emitting diodes being red quantum fluorescent particles 212, the quantum fluorescent particles 212 of the green light-emitting diodes being green quantum fluorescent particles 212, and the quantum fluorescent particles 212 of the blue light-emitting diodes being blue quantum fluorescent particles 212.

[0056] Dividing the multiple light-emitting diodes 2 in the display array into red, green, and blue light sources ensures stable light output from the display array and facilitates its application. It also reduces the fabrication difficulty of a three-color display array.

[0057] Optionally, the light-transmitting bonding layer 22 is an organic adhesive material.

[0058] The light-transmitting bonding layer 22 is made of organic adhesive material, which can ensure a stable connection between the epitaxial support layer 21 and the n-type layer 23. At the same time, organic adhesive material is also relatively common, which can reduce the overall manufacturing cost of the display array.

[0059] For example, the light-emitting layer 24 includes one of the following materials: nitride or phosphide, which have a certain chemical corrosion resistance.

[0060] The material of the light-emitting layer 24 is one of the aforementioned materials, which facilitates the fabrication of the light-emitting layer 24 and also helps to reduce the fabrication cost of the display array. Since the fabrication process of the aforementioned materials is relatively mature, it also ensures that the resulting light-emitting layer 24 has high quality and high luminous efficiency.

[0061] It should be noted that the materials of the n-type layer 23, the emitting layer 24, and the p-type layer 25 are all within the same emission color system. For example, the n-type layer 23, the emitting layer 24, and the p-type layer 25 can be the base materials used to fabricate the blue light-emitting diode 2, the violet light-emitting diode 2, or the yellow-green light-emitting diode 2. A lower fabrication cost coupled with better luminous efficiency of the emitting layer 24 results in better luminous efficiency emitted through the quantum fluorescent particles 212. In one implementation provided in this disclosure, the epitaxial support layer 21, the n-type layer 23, the emitting layer 24, and the p-type layer 25 can all be common gallium nitride materials, and this disclosure does not impose any limitations on this.

[0062] For ease of understanding, the following is provided: Figure 4 , Figure 4 This is a flowchart of a display array fabrication method provided in an embodiment of this disclosure. Figure 4 The display array fabrication method shown is used to fabricate, for example, Figure 1 The display array shown is for reference. Figure 4 As can be seen, the present disclosure provides a method for fabricating an easy-to-manufacture display array, which includes:

[0063] S101: Provides a support substrate and an epitaxial structure, the epitaxial structure including a temporary substrate and a plurality of light-emitting diodes arrayed on the temporary substrate, each light-emitting diode including an electrode, a p-type layer, a light-emitting layer and an n-type layer sequentially stacked on the temporary substrate.

[0064] S102: An array of multiple epitaxial support layers and a first bonding film stacked on each epitaxial support layer are formed on a support substrate. The epitaxial support layer has multiple filling holes that connect the support substrate and the first bonding film and quantum fluorescent particles located in the filling holes. The maximum distance between two adjacent filling holes is 0.1 to 10 μm. At least one of the multiple epitaxial support layers has a quantum fluorescent particle that is a red quantum fluorescent particle.

[0065] S103: A plurality of second bonding films corresponding one-to-one with a plurality of first bonding films are formed on the side of the n-type layer away from the temporary substrate.

[0066] S104: Bond the support substrate and the temporary substrate, and each first bonding film is bonded to the corresponding second bonding film to form a transparent bonding layer.

[0067] S105: Remove temporary substrate.

[0068] In the LEDs of the display array, the LEDs are configured to include an epitaxial support layer, a transparent bonding layer, an n-type layer, an emissive layer, a p-type layer, and electrodes, sequentially stacked on a support substrate. The epitaxial support layer has multiple filling holes connecting the support substrate and the transparent bonding layer, and quantum fluorescent particles located within the filling holes. The maximum distance between two adjacent filling holes is 0.1–10 μm. The epitaxial support layer provides support for the quantum fluorescent particles, ensuring their stable operation within the LEDs. The quantum fluorescent particles themselves can be activated by light emitted from the emissive layer and ultimately emit light of the desired color from the emitting surface of the display array. This facilitates color control of the display array, and since quantum fluorescent materials are relatively conventional, adjusting their composition allows for the emission of light of any color. If at least one of the LEDs has a red quantum fluorescent particle, it ensures that the display array can stably emit the required red light. By ensuring the maximum distance between the filling holes is within the specified range, the quantum fluorescent particles within the filling holes can effectively convert the light emitted from the emissive layer, guaranteeing the consistency of the light color emitted by the LEDs. Furthermore, the fabrication steps for the quantum fluorescent particles and the epitaxial support layer are fewer, and the growth system of the support layer is simpler, reducing the fabrication difficulty of the display array. Placing the quantum dot fluorescent particles inside the filling holes of the epitaxial support layer also effectively protects the quantum fluorescent particles, reducing the possibility of them falling off or being damaged by external influences, thus extending the lifespan of the quantum fluorescent particles and consequently the lifespan of the display array. The connection between the epitaxial support layer and the n-type layer via a transparent bonding layer also reduces defects caused by epitaxial growth, ensuring a stable connection between the epitaxial support layer and the n-type layer while minimizing defects within the emissive layer, which is beneficial for improving the luminous quality of the resulting LEDs and display array. Moreover, the independent fabrication of the support substrate and the epitaxial structure also reduces the overall fabrication time required for multiple display arrays.

[0069] Optionally, in step S102, forming an array of multiple epitaxial support layers on the support substrate includes:

[0070] Multiple epitaxial support films are formed on a support substrate; multiple filling holes are formed on the multiple epitaxial support films by electrochemical etching; quantum dot fluorescent particles are filled into the multiple filling holes to obtain an epitaxial support layer.

[0071] In the process of forming the epitaxial support layer, multiple epitaxial support films are first formed on the support substrate. After obtaining the epitaxial support films, multiple filling holes are formed on the epitaxial support films by electrochemical etching. The formation of filling holes is faster and has fewer side effects on the epitaxial support films, which can ensure that the quality of the obtained epitaxial support layer is also better, thereby improving the quality of the final display array.

[0072] It should be noted that during the electrochemical etching process, the supporting substrate and the side of the epitaxial support film closest to the supporting substrate are immersed in a solution, with the solution connected to the positive electrode. The side of the epitaxial support film furthest from the supporting substrate is connected to the negative electrode. The negative electrode is preferably distributed along the outer edge of the epitaxial support film, preferably in a ring-like distribution to facilitate uniform distribution in the center of the ring. A voltage is applied between the positive and negative electrodes to etch filling holes at the epitaxial film locations. This ensures the stable formation of the filling holes.

[0073] Optionally, during the formation of the filling holes, the current between the positive and negative electrodes can be controlled to increase over time. This can be adjusted by adjusting the Si doping concentration in gallium nitride to achieve a more uniformly sized filling hole, ensuring uniform light emission from the final display array.

[0074] For example, filling multiple filling wells with quantum dot fluorescent particles to obtain an epitaxial support layer includes: immersing the epitaxial support film in a solution containing quantum dot fluorescent particles, and allowing the solution to stand or stir for a period of time to ensure that the filling wells are filled with sufficient quantum dot fluorescent particles. This facilitates the filling of the filling wells with quantum dot fluorescent particles.

[0075] Optionally, the solution containing quantum dot fluorescent particles includes a mixture of organic solution and quantum dot fluorescent particles. This ensures thorough mixing with the quantum dot fluorescent particles, guaranteeing a relatively uniform number of quantum dot fluorescent particles entering each filled well.

[0076] For example, at a temperature of 20–30 degrees Celsius, the epitaxial support film is immersed in a solution containing quantum dot fluorescent particles, and left to stand for 5–60 minutes or stirred for 5–30 minutes to obtain a solution with a relatively uniform distribution of quantum dot fluorescent particles. This can result in an epitaxial support layer with a relatively uniform distribution of quantum dot fluorescent particles, thereby improving the uniformity of light emission.

[0077] In one implementation provided in this disclosure, different regions can be defined on the support substrate. After the epitaxial support film is grown on the support substrate and filling holes are formed, quantum fluorescent particles of different colors can be filled into the filling holes in different regions using photolithography. This facilitates the fabrication of display arrays with different colors. For example, if the region is divided into three regions (red, green, and blue), the surface of the epitaxial support film and the corresponding filling holes in two regions can be covered at a time, and the filling holes in the last region can be filled with quantum fluorescent particles of one color. Performing three operations can yield a display array containing three different colors.

[0078] For ease of understanding, the following is provided: Figure 5 , Figure 5This is a top view of the multiple extensional support layers provided in the embodiments of this disclosure. Figure 5 The rectangles with the three fill colors in the middle refer to the three light-emitting colors of the epitaxial support layer 21.

[0079] Figure 6 This is a flowchart of another display array fabrication method provided in this disclosure embodiment, see reference. Figure 6 It can be seen that S201: provides a support substrate.

[0080] For example, the support substrate can be a sapphire substrate. It has a good match with the epitaxial material and good light transmittance.

[0081] S202: Grow multiple light-emitting diodes on a growth substrate. The multiple light-emitting diodes include an n-type layer, a light-emitting layer, a p-type layer, and an electrode that are sequentially stacked on the growth substrate. A temporary substrate is glue-bonded to the side of the light-emitting diodes away from the growth substrate. Separate the growth substrate and the light-emitting diodes to obtain an epitaxial structure.

[0082] The epitaxial structure is grown using a growth substrate, which improves the quality of the resulting epitaxial structure. The use of a temporary substrate facilitates the transfer and connection between the epitaxial structure and the supporting substrate. Furthermore, the temporary substrate and the light-emitting diode (LED) are bonded together using adhesive, ensuring the stability of the connection between the LED and the temporary substrate while facilitating separation between them.

[0083] For example, the growth substrate is a substrate with minimal lattice mismatch with the n-type layer. This can improve the quality of the resulting epitaxial structure.

[0084] In one implementation provided in this disclosure, the connection between the light-emitting diode and the temporary substrate is also achieved by coating with organic adhesive and then bonding.

[0085] Optionally, laser separation can be used between the growth substrate and the light-emitting diode. This facilitates rapid separation between the growth substrate and the light-emitting diode.

[0086] S203: An array of multiple epitaxial support layers and a first bonding film stacked on each epitaxial support layer are formed on a support substrate. The epitaxial support layer has multiple filling holes that connect the support substrate and the first bonding film and quantum fluorescent particles located in the filling holes. The maximum distance between two adjacent filling holes is 0.1 to 10 μm. At least one of the multiple epitaxial support layers has a quantum fluorescent particle that is a red quantum fluorescent particle.

[0087] Step S203 can be referred to Figure 4 The S102 shown is not included here, so it will not be described again.

[0088] S204: A plurality of second bonding films corresponding one-to-one with a plurality of first bonding films are formed on the side of the n-type layer away from the temporary substrate.

[0089] For example, both the first bonding film and the second bonding film can be made of organic adhesive materials. This ensures the bonding effect and bonding quality.

[0090] S205: Bonding the support substrate and the temporary substrate, and bonding each first bonding film with the corresponding second bonding film to form a transparent bonding layer.

[0091] Optionally, the support substrate and the temporary substrate can be bonded under conditions of 150–300°C and 500–2000 kg of pressure. This can improve the stability of the display array.

[0092] S206: Remove the temporary substrate.

[0093] For example, the temporary substrate and the p-type layer can be separated by laser. This facilitates rapid separation of the temporary substrate and the p-type layer.

[0094] Figure 7 and Figure 8 This is a schematic diagram of the display array fabrication process provided in an embodiment of this disclosure. Figure 7 This is a structural diagram of the light-emitting diode after it has been grown on the substrate. Figure 7 The diagram illustrates the growth substrate 3 and the light-emitting diode 2. Figure 8 The structure diagram obtained after performing step S202 is shown. Figure 8 The diagram illustrates the temporary substrate 4 and the light-emitting diode 2.

[0095] The above description is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above through embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A display array convenient to manufacture, characterized by, The display array comprises a support substrate and a plurality of light emitting diodes arranged in an array on the support substrate, each of the light emitting diodes comprising an epitaxial support layer, a light-transmitting bonding layer, an n-type layer, a light emitting layer, a p-type layer and an electrode which are sequentially stacked on the support substrate, The epitaxial support layer has a plurality of filling holes which communicate the support substrate and the light-transmitting bonding layer and quantum fluorescent particles located in the filling holes, the maximum distance between two adjacent filling holes is 0.1-10 um, and the quantum fluorescent particles of at least one of the light emitting diodes are red quantum fluorescent particles.

2. The display array of claim 1, wherein, The thickness of the epitaxial support layer is 1-10 um.

3. The display array of claim 1, wherein, The diameter of each of the filling holes is 0.01-10 um.

4. The display array of any of claims 1-3, wherein, The plurality of light emitting diodes are divided into red light emitting diodes, green light emitting diodes and blue light emitting diodes, the quantum fluorescent particles of the red light emitting diodes are red quantum fluorescent particles, the quantum fluorescent particles of the green light emitting diodes are green quantum fluorescent particles, and the quantum fluorescent particles of the blue light emitting diodes are blue quantum fluorescent particles.

5. The display array of any of claims 1-3, wherein, The light-transmitting bonding layer is an organic adhesive material.

6. The display array of any of claims 1-3, wherein, The light emitting layer comprises a nitride.

7. A method of fabricating a display array that facilitates fabrication, characterized by, The method for preparing the display array which is convenient to prepare comprises: Providing a support substrate and an epitaxial structure, the epitaxial structure comprising a temporary substrate and a plurality of light emitting diodes arranged in an array on the temporary substrate, each of the light emitting diodes comprising an electrode, a p-type layer, a light emitting layer and an n-type layer which are sequentially stacked on the temporary substrate; Forming a plurality of epitaxial support layers arranged in an array on the support substrate and a first bonding film stacked on each of the epitaxial support layers, the epitaxial support layer having a plurality of filling holes which communicate the support substrate and the first bonding film and quantum fluorescent particles located in the filling holes, the maximum distance between two adjacent filling holes being 0.1-10 um, and the quantum fluorescent particles of at least one of the epitaxial support layers being red quantum fluorescent particles; Forming a plurality of second bonding films corresponding to the plurality of first bonding films one by one on the side of the n-type layer away from the temporary substrate; Bonding the support substrate and the temporary substrate, and each of the first bonding films and the corresponding second bonding film to form a transparent bonding layer; Removing the temporary substrate.

8. The method of claim 7, wherein, Forming a plurality of epitaxial support layers arranged in an array on the support substrate comprises: Forming a plurality of epitaxial support films on the support substrate; Forming a plurality of the filling holes on the plurality of epitaxial support films by electrochemical etching; Filling quantum dot fluorescent particles in the plurality of filling holes to obtain an epitaxial support layer.

9. The method of claim 7, wherein the display array is prepared by a method comprising: Bonding the support substrate and the temporary substrate under the conditions of a temperature of 150-300 ℃ and a pressure of 500-2000 kg.

10. A method of fabricating a display array for ease of fabrication according to any one of claims 7 to 9, wherein, Providing the epitaxial structure comprises: Growth of a plurality of light emitting diodes on a growth substrate, the plurality of light emitting diodes comprising an n-type layer, a light emitting layer, a p-type layer and an electrode which are sequentially stacked on the growth substrate; Gluing a temporary substrate to the side of the light emitting diodes away from the growth substrate; separating the growth substrate from the light emitting diode to obtain an epitaxial structure.

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