LED bracket and manufacturing method, LED lamp bead and light-emitting component

Abstract

The present invention relates to an LED bracket and a manufacturing method, an LED lamp bead and a light-emitting component. The LED bracket includes a ceramic base and a resin cup body; the ceramic base includes a bottom and two opposite side parts, the resin cup body is arranged on the bottom of the ceramic base and fixedly connected to the two side parts of the ceramic base, and the connection part of the resin cup body in contact with the two side parts is provided with two guide grooves adapted to the two side parts, and at least parts of the two side parts are respectively engaged in the two guide grooves; the LED bracket provided by the present invention uses ceramic as the base of the bracket, and the resin cup body is arranged on the ceramic base, and the good thermal conductivity of the ceramic is used to improve the heat dissipation efficiency of the LED chip; the present invention also provides an LED lamp bead including the LED bracket, and the lamp bead can be directly mounted on the back plate of the casing and the LED chip is powered by a wire, without the need to mount the lamp bead on a PCB for power supply, thereby further improving the heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an LED bracket and a manufacturing method thereof, an LED lamp bead and a light-emitting component. Background Art

[0002] LED (Light Emitting Diode) is a semiconductor device that can convert electrical energy into visible light. When the LED is on, its photoelectric conversion efficiency is 30-40%, and the rest of the electrical energy is converted into heat energy, which gradually increases the internal temperature of the LED. The temperature increase will reduce the luminous efficiency and service life of the LED. In the related art, due to the limitation of the LED lamp bead bracket structure, the LED lamp bead needs to be installed on the PCB board, and the LED lamp bead is powered by the PCB board. Due to the PCB structure, the PCB thermal conductivity is low, resulting in a large thermal resistance of the PCB board, which seriously hinders the heat from the lamp bead to the back panel of the casing, causing the heat to accumulate in the lamp bead and the temperature to increase, reducing the service life of the LED.

[0003] Therefore, how to improve the heat dissipation effect of LEDs is an urgent problem to be solved. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide an LED bracket and a manufacturing method, an LED lamp bead and a light-emitting component, aiming to solve the problem of poor heat dissipation effect of the LED lamp bead.

[0005] An LED bracket comprises: a ceramic base and a resin cup body; wherein the ceramic base comprises a bottom and two opposite side portions arranged on the bottom; the resin cup body is arranged on the bottom of the ceramic base and fixedly connected to the two side portions of the ceramic base, and the connection portion of the resin cup body in contact with the two side portions is provided with two guide grooves adapted to the two side portions, and at least part of the two side portions of the ceramic base are snapped into the two guide grooves.

[0006] The above-mentioned LED bracket adopts a ceramic base and a resin cup body as the overall structure of the LED bracket, and utilizes the high thermal conductivity of ceramics to better conduct the heat generated by the LED chip to the outside of the bracket. The two sides of the ceramic base are fixedly connected to the resin cup body through guide grooves, so that the ceramic base and the resin cup body are firmly connected.

[0007] Optionally, the two guide grooves are provided on a surface of the resin cup body that contacts the bottom of the ceramic base.

[0008] In the above-mentioned LED bracket, the two side parts of the ceramic base are fixedly connected to the resin cup body through the guide grooves, so that the ceramic base and the resin cup body are firmly connected.

[0009] Optionally, the two side portions of the ceramic base respectively have a first bending portion and a second bending portion extending upward perpendicular to the bottom and bending inward to form a first bending portion and a second bending portion facing each other; the resin cup body has a first side portion and a second side portion fixedly connected to the first bending portion and the second bending portion respectively; the two guide grooves are respectively arranged on the first side portion and the second side portion, and part of the first bending portion and part of the second bending portion are respectively engaged in the two guide grooves.

[0010] In the above-mentioned LED bracket, the two side portions of the ceramic base have a first bending portion and a second bending portion extending upward perpendicularly to the bottom and bending inward to form a first bending portion and a second bending portion facing each other, so as to be fixedly connected to the side portion of the resin cup body, thereby improving the stability of the connection between the ceramic base and the resin cup body.

[0011] Optionally, a first conductive pad and a second conductive pad are provided on the bottom of the ceramic base, and an insulating partition is provided between the first conductive pad and the second conductive pad; the bottom of the ceramic base has at least one outer side surface, and the outer side surface is located between the two side portions, and at least a portion of the first conductive pad and the second conductive pad extends to the outer side surface of the bottom of the ceramic base.

[0012] In the above-mentioned LED bracket, a conductive pad is arranged on the bottom of the ceramic base, and an insulating partition is arranged between the two conductive pads, so that the two pads are insulated, which is convenient for welding and fixing of the LED chip; the two conductive pads at least partially extend to the outer side surface of the bottom of the ceramic base, so that the lamp beads using the bracket can be electrically connected to the outside through the conductive pads, that is, the lamp beads using the bracket can be directly mounted on the back panel of the casing, abandoning the traditional PCB power supply and solving the problem of large PCB thermal resistance.

[0013] Optionally, the first conductive pad and the second conductive pad protrude from the bottom of the ceramic base, and the resin cup body is provided with a first limiting groove and a second limiting groove combined with the first conductive pad and the second conductive pad.

[0014] In the above LED bracket, the conductive pad protrudes from the bottom of the ceramic base, and a limiting groove for accommodating the conductive pad is provided on the resin cup body, so that the resin cup body can fit tightly with the ceramic base, thereby making the resin cup body and the ceramic base firmly connected.

[0015] Optionally, the first conductive pad includes a first conductive fixing portion and a first protruding electrode portion connected to each other, and the second conductive pad includes a second conductive fixing portion and a second protruding electrode portion connected to each other, and there are gaps between the first conductive fixing portion and the second conductive fixing portion and the outer side surface of the bottom of the ceramic base, respectively, and at least a portion of the resin cup body fills the gap.

[0016] In the above bracket, a gap is provided between the conductive fixing parts of the two conductive pads and the outer side surface of the bottom of the ceramic base. When the resin cup body is formed on the ceramic base, the gap is filled with resin to prevent sliding between the resin cup body and the ceramic base.

[0017] Optionally, the projection area of ​​the first raised electrode portion on the bottom of the ceramic base is smaller than the projection area of ​​the first conductive fixed portion on the bottom of the ceramic base; the projection area of ​​the second raised electrode portion on the bottom of the ceramic base is smaller than the projection area of ​​the second conductive fixed portion on the bottom of the ceramic base.

[0018] In the above-mentioned LED bracket, the conductive pad is arranged so that the projected area of ​​the raised electrode part on the bottom of the ceramic base is smaller than the projected area of ​​the conductive fixing part on the bottom of the ceramic base. When the resin cup body is formed on the ceramic base, more resin is filled around the raised electrode part than around the conductive fixing part, thereby further preventing sliding between the resin cup body and the ceramic base, and thereby making the connection between the resin cup body and the ceramic base more firmly.

[0019] Based on the same inventive concept, the present invention also provides an LED lamp bead, comprising the LED bracket as described above, and an LED chip; wherein the LED chip is fixed in the resin cup body of the LED bracket.

[0020] In the above-mentioned LED lamp beads, an LED bracket including a ceramic base and a resin cup body is used, and the high thermal conductivity of ceramics can be used to better conduct the heat generated by the LED chip to the outside of the bracket, thereby improving the heat dissipation effect of the LED chip.

[0021] Based on the same inventive concept, the present invention also provides an LED light-emitting component, comprising at least one of the above-mentioned LED lamp beads, a casing back panel, and a driving module; wherein the LED lamp beads are mounted on the casing back panel; the driving module is connected to the LED lamp beads to drive and control the LED lamp beads.

[0022] In the above-mentioned LED light-emitting component, not only LED lamp beads with better heat dissipation are used, but the LED lamp beads are also directly mounted on the back panel of the casing, which can save the PCB board and further improve the heat dissipation effect of the LED chip.

[0023] The present invention also provides a method for manufacturing the LED bracket as described above, the method comprising:

[0024] Coating ceramic slurry on a ceramic base mold to form the ceramic base;

[0025] electroplating a first conductive pad and a second conductive pad on the ceramic base;

[0026] The ceramic base is placed in a resin cup body mold, and the resin cup body is formed on the bottom of the ceramic base by an injection molding process or a compression molding process.

[0027] The LED bracket manufactured by the above method has a stable structure and better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of an optional LED bracket structure provided in an embodiment of the present invention;

[0029] Figure 2 A schematic diagram of another optional LED bracket structure provided in an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of another LED bracket structure provided by an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of the overall structure of an LED bracket provided in an embodiment of the present invention;

[0032] Figure 5 A schematic diagram of the structure of an LED lamp bead provided in another embodiment of the present invention;

[0033] Figure 6-1 A schematic diagram of LED lamp bead connection provided by another embodiment of the present invention;

[0034] Figure 6-2 Another LED lamp bead connection schematic diagram provided by another embodiment of the present invention;

[0035] Figure 7 A flow chart of a method for manufacturing an LED bracket provided by another embodiment of the present invention;

[0036] Description of reference numerals:

[0037] 10-ceramic base, 101-bottom of ceramic base, 102-side of ceramic base, 103-first bending portion, 104-second bending portion, 107-outer side surface, 12-resin cup body, 121-conducting groove, 122-first side portion, 123-second side portion, 124-through hole, 125-insulating partition, 126-third side portion, 127-fourth side portion, 128-first limiting groove notch, 105-first conductive pad, 1051-first raised electrode portion, 106-second conductive pad, 1061-second raised electrode portion, 41-electrode identification groove, 51-LED chip, 52-first wire, 53-second wire. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0040] Due to the limitation of the LED lamp bead bracket structure in the related technology, the LED lamp bead needs to be installed on the PCB board, and the LED lamp bead is powered by the PCB board. The PCB thermal conductivity is low due to the PCB structure, resulting in a large thermal resistance of the PCB board, which seriously hinders the heat conduction from the lamp bead to the back plate of the casing, causing the heat to accumulate in the lamp bead and the temperature to rise, thereby reducing the service life of the LED.

[0041] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0042] An embodiment of the present invention provides an LED bracket, comprising:

[0043] A ceramic base, and a resin cup body; wherein the ceramic base includes a bottom and two opposite side portions; the resin cup body is arranged on the bottom of the ceramic base and fixedly connected to the two side portions of the ceramic base, and the connection between the resin cup body and the two side portions of the ceramic base is provided with two guide grooves adapted to the two side portions, and at least parts of the two side portions of the ceramic base are respectively engaged in the two guide grooves.

[0044] The resin cup body in this embodiment is used to protect and fix the LED chip. The material of the resin cup body includes but is not limited to PCT, PPA, EMC, SMC, and PU. It should be understood that the material of the resin cup body in this embodiment is not limited to the materials listed, and can also be other resin materials, or a mixture of several materials. In this embodiment, the two side portions of the ceramic base are fixedly connected to the resin cup body through the guide groove, so that the connection between the ceramic base and the resin cup body is more stable, and water can be prevented from entering the hollow resin cup body through the contact surface between the ceramic base and the resin cup body, so as to play a waterproof role, thereby protecting the LED chip.

[0045] For ease of understanding, the LED bracket provided in this embodiment is described below with reference to the accompanying drawings as examples.

[0046] An example of an LED bracket is shown in Figure 1 As shown, the LED bracket structure includes a ceramic base 10, a resin cup body 12 arranged on the ceramic base 10, the ceramic base 10 includes a bottom 101 and two side parts 102, the two side parts 102 are arranged opposite to each other and arranged on the bottom 101 of the ceramic base 10; the resin cup body 12 is arranged on the bottom 101 of the ceramic base 10, the two side parts 102 of the ceramic base 10 are fixedly connected to the resin cup body 12, and two guide grooves 121 are arranged at the connection between the resin cup body 12 and the two side parts 102 of the ceramic base 10. In this example, the two guide grooves 121 fixedly connected to the two side parts 102 of the ceramic base 10 are arranged on the side of the resin cup body 12 in contact with the bottom 101 of the ceramic base 10, that is, the two guide grooves 121 are arranged at the bottom of the resin cup body 12, and the bottom of the resin cup body 12 is the side in contact with the bottom 101 of the ceramic base 10.

[0047] Another example of an LED bracket is shown in Figure 2 As shown, the LED bracket structure includes a ceramic base 10, a resin cup body 12 arranged on the ceramic base 10, the ceramic base 10 includes a bottom 101 and two side portions 102, the two side portions 102 are arranged opposite to each other and are arranged on the bottom 101 of the ceramic base 10, the two side portions 102 of the ceramic base 10 respectively have a first bending portion 103 and a second bending portion 104 extending upward perpendicular to the bottom 101 of the ceramic base 10 and bending inward to form opposite first bending portions 103 and second bending portions 104; the resin cup body 12 has a first side portion 122 and a second side portion 123 respectively fixedly connected to the first bending portion 103 and the second bending portion 104; the first side portion 122 and the second side portion 123 of the resin cup body 12 are respectively fixedly connected to the first bending portion 103 and the second bending portion 104 of the ceramic base 10. In this example, two guide grooves 121 fixedly connected to the bending portion of the ceramic base 10 are respectively provided on the first side 122 and the second side 123 of the resin cup body 12, and parts of the first bending portion 103 and the second bending portion 104 are respectively engaged in the two guide grooves 121.

[0048] In this embodiment, see Figure 3As shown, a through hole 124 is provided at the center of the resin cup body 12, and the through hole 124 is used to accommodate the LED chip and the packaging glue for packaging the LED chip. At the same time, the through hole 124 can be a circular through hole or a rectangular through hole, and can be flexibly arranged according to the actual application needs. In this embodiment, the through hole 124 is a through hole that is wide at the top and narrow at the bottom, which is convenient for filling the packaging glue after installing the LED chip. An insulating partition 125 is provided on the side of the resin cup body in this embodiment that contacts the bottom of the ceramic base, and the insulating partition 125 is exposed in the through hole 124 of the resin cup body; a first conductive pad 105 and a second conductive pad 106 are provided on the bottom of the ceramic base, and the first conductive pad 105 and the second conductive pad 106 are located on both sides of the insulating partition 125 and protrude from the bottom of the ceramic base. In other embodiments, a first conductive pad and a second conductive pad are provided on the bottom, and an insulating partition is provided between the first conductive pad and the second conductive pad, so that the two conductive pads are insulated by means of the insulating partition; and the specific setting position of the insulating partition can be flexibly selected, for example, the insulating partition can be provided on the bottom of the ceramic base, or the insulating partition can be provided on the resin cup body. The first conductive pad and the second conductive pad in this embodiment are respectively used to weld the two electrodes of the LED chip. In this embodiment, the side of the resin cup body that contacts the bottom of the ceramic base is also provided with a first limiting groove and a second limiting groove that are respectively adapted to the first conductive pad 105 and the second conductive pad 106, and the first conductive pad 105 and the second conductive pad 106 are respectively located in the first limiting groove and the second limiting groove of the resin cup body. Through the conductive pad protruding from the bottom of the ceramic base, the resin cup body is provided with a limiting groove for accommodating the conductive pad, and the resin cup body can be closely fitted with the ceramic base, thereby making the resin cup body and the ceramic base firmly connected. In order to allow the first conductive pad 105 and the second conductive pad 106 to be connected to an external circuit, at least a portion of the first conductive pad 105 and the second conductive pad 106 in this embodiment extends to the outer side surface 107 of the bottom of the ceramic base. It can be understood that the bottom of the ceramic base may have two outer side surfaces 107, and each outer side surface 107 is located between the two side portions of the ceramic base; the first conductive pad 105 and the second conductive pad 106 respectively have opposite ends; one end of the first conductive pad 105 and one end of the second conductive pad 106 can be arranged to extend to one of the outer side surfaces of the bottom of the ceramic base; one end of the first conductive pad 105 can also be arranged to extend to one of the outer side surfaces of the bottom of the ceramic base, and one end of the second conductive pad 106 can extend to the other outer side surface of the bottom of the ceramic base; one end of the first conductive pad 105 and one end of the second conductive pad 106 can also be arranged to extend to one of the outer side surfaces of the bottom of the ceramic base, and the other end of the first conductive pad 105 and the other end of the second conductive pad 106 can also be arranged to extend to the other outer side surface of the bottom of the ceramic base.In this embodiment, the first conductive pad 105 includes a first conductive fixing portion and a first protruding electrode portion 1051 connected to each other; the second conductive pad 106 includes a second conductive fixing portion and a second protruding electrode portion 1061 connected to each other. In this embodiment, there is a gap between the first conductive fixing portion and the second conductive fixing portion and the outer side surface 107 of the ceramic base, and at least a part of the resin cup body 12 fills the gap to prevent sliding between the resin cup body and the ceramic base. The projection area of ​​the first protruding electrode portion on the bottom of the ceramic base is smaller than the projection area of ​​the first conductive fixing portion on the bottom of the ceramic base, and the projection area of ​​the second protruding electrode portion on the bottom of the ceramic base is smaller than the projection area of ​​the second conductive fixing portion on the bottom of the ceramic base. When the resin cup body is molded on the ceramic base, more resin is filled around the protruding electrode portion than around the conductive fixing portion, which further prevents sliding between the resin cup body and the ceramic base, and the resin cup body and the ceramic base are more firmly connected.

[0049] In this embodiment, see Figure 4 As shown, the top surface of the resin cup body is also provided with at least one electrode identification groove 41, which is used to identify the positive and negative polarity of the first raised electrode portion or the second raised electrode portion, so as to distinguish the positive and negative electrodes of the LED bracket electrode end when installing the LED chip.

[0050] The LED bracket provided by the embodiment of the present invention includes: a ceramic base, and a resin cup body; wherein the ceramic base includes a bottom and two opposite sides, the resin cup body is arranged on the bottom of the ceramic base and fixedly connected to the two sides of the ceramic base, and the connection portion of the resin cup body that contacts the two sides of the ceramic base is provided with two guide grooves adapted to the two sides, and at least part of the two sides of the ceramic base are respectively engaged in the two guide grooves. It can be seen that the present invention adopts the ceramic base and the resin cup body as the overall structure of the LED bracket, and utilizes the high thermal conductivity of ceramics to better conduct the heat generated by the LED chip to the outside of the bracket, thereby improving the heat dissipation efficiency, and the two sides of the ceramic substrate are fixedly connected to the resin cup body through the guide grooves, so that the connection between the ceramic substrate and the resin cup body is more stable.

[0051] Another embodiment of the present invention:

[0052] This embodiment provides an LED lamp bead, which at least includes: any one of the LED brackets in the above embodiments, and an LED chip; wherein the LED chip is fixed in the resin cup body.

[0053] For ease of understanding, the LED lamp beads provided in this embodiment are described below with reference to the accompanying drawings as examples.

[0054] An example of an LED lamp bead is shown in Figure 2 , Figure 3 and Figure 5 As shown, this LED lamp bead includes an LED bracket, which includes a ceramic base 10 and a resin cup body 12 with a through hole 124; wherein the ceramic base 10 includes a bottom 101 and two side portions 102, the two side portions 102 are arranged opposite to each other, and the two side portions 102 of the ceramic base have a first bending portion 103 and a second bending portion 104 extending upward and bending inward perpendicular to the bottom 101 of the ceramic base 10 to form a first bending portion 103 and a second bending portion 104 facing each other; and the resin cup body 12 has a first side portion 122 and a second side portion 123 respectively fixedly connected to the first bending portion 103 and the second bending portion 104, and a third side portion 126 and a fourth side portion 127 opposite to each other. In this example, two guide grooves 121 fixedly connected to the bending portion of the ceramic base 10 are respectively arranged on the first side portion 122 and the second side portion 123 of the resin cup body 12, and the first bending portion 103 and the second bending portion 104 are respectively engaged in the two guide grooves 121. A first conductive pad 105 and a second conductive pad 106 are provided on the bottom 101 of the ceramic base 10, and a first limiting groove and a second limiting groove respectively matched with the first conductive pad 105 and the second conductive pad 106 are provided on a side of the resin cup body 12 that contacts the bottom 101 of the ceramic base 10, and the first conductive pad 105 and the second conductive pad 106 are respectively located in the first limiting groove and the second limiting groove of the resin cup body 12. In this example, the first conductive pad 105 includes a first conductive fixing portion and a first protruding electrode portion 1051 that are connected to each other; the second conductive pad 106 includes a second conductive fixing portion and a second protruding electrode portion 1061 that are connected to each other; wherein the projection area of ​​the first protruding electrode portion 1051 on the bottom of the ceramic base is smaller than the projection area of ​​the first conductive fixing portion on the bottom of the ceramic base; and the projection area of ​​the second protruding electrode portion 1061 on the bottom of the ceramic base is smaller than the projection area of ​​the second conductive fixing portion on the bottom of the ceramic base. At the same time, there are gaps between the first conductive fixing part and the second conductive fixing part and the outer side surface 107 of the bottom of the ceramic base, and at least a part of the resin cup body fills the gap; and the third side 126 and the fourth side 127 of the resin cup body 12 are respectively provided with a first limiting groove notch 128 and a second limiting groove notch (not shown in the figure), the first raised electrode part 1051 of the first conductive pad 105 extends to the first limiting groove notch 128, and the second raised electrode part 1061 of the second conductive pad 106 extends to the second limiting groove notch. This LED lamp bead also includes an LED chip 51, which is arranged in the through hole 124 of the resin cup body 12, and the through hole 124 of the resin cup body 12 is filled with packaging glue to package and protect the LED chip. The packaging glue in this embodiment can be silica gel. It should be understood that the packaging glue in this embodiment can also be other glue materials with good light transmittance, and the specific material of the packaging glue can be flexibly selected according to the actual application needs.

[0055] The LED chip in this embodiment includes any one of a red LED light-emitting chip, a blue LED light-emitting chip, and a green LED light-emitting chip. It should be understood that the LED chip in this embodiment can be a micro light-emitting chip, for example, it can include but is not limited to at least one of a Mini LED chip and a Micro LED chip, or it can be an ordinary light-emitting chip with a size greater than or equal to 200 microns. And the LED light-emitting chip in this embodiment is a positive light-emitting chip, in other embodiments it can be a flip-chip light-emitting chip or a vertical light-emitting chip, or it can be a mixture of the above different types of chips, which can be flexibly set according to application requirements. In this embodiment, the two electrodes of the LED chip are welded to the first conductive pad and the second conductive pad in the LED bracket, and the LED lamp bead also includes a first wire 52 and a second wire 53, the first wire 52 is electrically connected to the first protruding electrode portion 1051 through the first limiting groove notch located on the third side 126 of the resin cup body 12, and the second wire 53 is electrically connected to the second protruding electrode portion 1061 through the second limiting groove notch located on the fourth side 127 of the resin cup body 12.

[0056] The LED lamp bead provided in an embodiment of the present invention includes an LED bracket and an LED chip; wherein the LED chip is fixed in the resin cup body of the LED bracket, and also includes a first wire and a second wire, the first wire is electrically connected to the first protruding electrode portion through a first limiting groove notch located on the third side of the resin cup body, and the second wire is electrically connected to the second protruding electrode portion through a second limiting groove notch located on the fourth side of the resin cup body; in the LED lamp bead, the high thermal conductivity of ceramics can be utilized to better conduct the heat generated by the LED chip to the outside of the bracket, thereby improving the heat dissipation effect of the LED chip; and by leading out wires from the side of the LED bracket to power the LED chip, the mounting of the lamp bead of the LED bracket structure is facilitated, so that the LED lamp bead can be directly mounted on the back panel of the casing without the need for power supply through a PCB, thereby further improving the heat dissipation effect of the LED chip.

[0057] It can be understood that, through the LED lamp beads provided in this embodiment, since the LED lamp beads can be directly connected to the electrodes of the LED chip through wires, the cascade between multiple LED lamp beads can be more convenient, and the arrangement of the lamp beads can be more free. For example, when multiple LED lamp beads are connected in series, the wires on both sides of the LED lamp beads can be directly connected in series. Figure 6-1 Similarly, when multiple LED lamp beads are connected in parallel, the wires on both sides of the LED lamp beads can be directly connected in parallel. Figure 6-2 shown.

[0058] This embodiment also provides an LED light-emitting component, including at least one LED lamp bead as described above, a housing back plate, and a driving module; wherein the LED lamp bead is mounted on the housing back plate, and the driving module is connected to the LED lamp bead to drive and control the LED lamp bead. Through the LED lamp bead with better heat dissipation provided by this embodiment, the LED lamp bead can be directly mounted on the housing back plate and powered by copper wire, abandoning the traditional PCB power supply and solving the problem of large PCB thermal resistance. And the LED lamp bead structure provided by this embodiment can make the arrangement of the lamp bead more free, no longer restricted by PCB wiring.

[0059] Another embodiment of the present invention:

[0060] This embodiment provides a method for manufacturing an LED bracket as provided in any of the above embodiments. Figure 7 As shown, the method comprises the steps of:

[0061] S701: coating ceramic slurry on a ceramic base mold to form a ceramic base.

[0062] The ceramic base manufactured in this embodiment includes a bottom and two side portions, and the two side portions are arranged opposite to each other.

[0063] S702: electroplating a first conductive pad and a second conductive pad on the ceramic base.

[0064] After the ceramic base is manufactured, the first conductive pad and the second conductive pad are electroplated on the ceramic base. In this embodiment, the first conductive pad and the second conductive pad are electroplated on the same side of the bottom of the ceramic base, and the first conductive pad and the second conductive pad are welded to the LED chip.

[0065] S703: placing the ceramic base in a resin cup mold, and forming the resin cup on the bottom of the ceramic base by an injection molding process or a compression molding process.

[0066] The cup body material is added to the mold by injection molding or compression molding to form a resin cup body. In this embodiment, the cup body material includes but is not limited to PCT, PPA, EMC, SMC, and PU. It should be understood that the material of the cup body in this embodiment is not limited to the several materials listed, and can also be other resin materials, or a mixture of several materials. In this embodiment, a through hole is provided at the center of the resin cup body, and the through hole is used to install the LED chip and the packaging glue for encapsulating the LED chip; the through hole can be a circular through hole or a rectangular through hole, and can be flexibly arranged according to the actual application needs. In this embodiment, the through hole is a through hole that is wide at the top and narrow at the bottom, which is convenient for filling the packaging glue after the LED chip is installed. The resin cup body has a guide groove fixedly connected to the ceramic base.

[0067] The LED bracket manufacturing method provided in this embodiment comprises a ceramic base and a resin cup body arranged on the ceramic base; the ceramic base comprises a bottom and two opposite sides, the resin cup body is arranged on the bottom of the ceramic base and fixedly connected to the two sides of the ceramic base, and the connection portion of the resin cup body that contacts the two sides of the ceramic base is provided with two guide grooves adapted to the two sides, and at least parts of the two sides are respectively engaged in the two guide grooves. It can be seen that the manufactured LED bracket adopts the ceramic base and the resin cup body as the overall structure of the LED bracket, and utilizes the high thermal conductivity of ceramics to better conduct the heat generated by the LED chip to the outside of the bracket, thereby improving the heat dissipation efficiency of the LED chip, and the two sides of the ceramic base are fixedly connected to the resin cup body through the guide grooves, so that the ceramic base and the resin cup body are firmly connected.

[0068] The LED support structure provided in the above embodiments can be applied to various display fields. For example, it can be made into a backlight module and applied to the display backlight field (it can be a backlight module of a terminal such as a television, a display, or a mobile phone). In this case, it can be applied to the backlight module. In addition to being applied to the display backlight field, it can also be applied to the decoration field, the automotive field, the transportation field, etc.

[0069] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. An LED bracket, characterized in that: include: A ceramic base and a resin cup body; wherein the ceramic base includes a bottom and two opposite side portions arranged on the bottom, the two side portions respectively having a first bending portion and a second bending portion extending upward perpendicularly to the bottom and bending inward to form a first bending portion and a second bending portion facing each other; the resin cup body is arranged on the bottom of the ceramic base and fixedly connected to the two side portions of the ceramic base, the resin cup body having a first side portion and a second side portion respectively fixedly connected to the first bending portion and the second bending portion; the resin cup body contacts the two side portions of the ceramic base Two guiding grooves adapted to the two side portions are provided at the connection of the two side portions, the two guiding grooves are respectively provided at the first side portion and the second side portion, and parts of the first bending portion and parts of the second bending portion are respectively engaged in the two guiding grooves, a first conductive pad and a second conductive pad are provided on the bottom of the ceramic base, the bottom of the ceramic base has at least one outer side surface, the outer side surface is located between the two side portions, and at least a portion of the first conductive pad and the second conductive pad extends to the outer side surface of the bottom of the ceramic base.

2. The LED bracket according to claim 1, characterized in that: An insulating partition is provided between the first conductive pad and the second conductive pad.

3. The LED bracket according to claim 2, characterized in that: The first conductive pad and the second conductive pad protrude from the bottom of the ceramic base; the resin cup body is provided with a first limiting groove and a second limiting groove combined with the first conductive pad and the second conductive pad.

4. The LED bracket according to claim 3, characterized in that: The first conductive pad includes a first conductive fixing portion and a first protruding electrode portion connected to each other, and the second conductive pad includes a second conductive fixing portion and a second protruding electrode portion connected to each other. There are gaps between the first conductive fixing portion and the second conductive fixing portion and the outer side surface of the bottom of the ceramic base, respectively, and at least a portion of the resin cup body fills the gap.

5. The LED bracket according to claim 4, characterized in that: The projection area of ​​the first raised electrode portion on the bottom of the ceramic base is smaller than the projection area of ​​the first conductive fixing portion on the bottom of the ceramic base; the projection area of ​​the second raised electrode portion on the bottom of the ceramic base is smaller than the projection area of ​​the second conductive fixing portion on the bottom of the ceramic base.

6. An LED lamp bead, characterized in that: It comprises the LED bracket as described in any one of claims 1 to 5, and an LED chip; wherein the LED chip is fixed in the resin cup body of the LED bracket.

7. An LED light-emitting assembly, characterized in that: It comprises at least one LED lamp bead as described in claim 6, a casing back plate, and a driving module; wherein the LED lamp bead is mounted on the casing back plate; and the driving module is connected to the LED lamp bead to drive and control the LED lamp bead.

8. A method for manufacturing the LED bracket according to any one of claims 1 to 5, characterized in that: The method comprises: Coating ceramic slurry on a ceramic base mold to form the ceramic base; electroplating a first conductive pad and a second conductive pad on the ceramic base; The ceramic base is placed in a resin cup body mold, and the resin cup body is formed on the bottom of the ceramic base by an injection molding process or a compression molding process.

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