Chip key burning method, device, display device and storage medium

The chip key to cut, stitch and transmit the chip key through the host side of the I2C connection solves the problem of receiving end chip burn in the existing technology, and achieves a more convenient and secure chip secret burning process.

CN114884662BActive Publication Date: 2025-01-24SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD
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Patent Information

Application Number
CN202210485682.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-05-06
Publication Date
2025-01-24
Estimated Expiration
2042-05-06

AI Technical Summary

Technical Problem

The prior art display terminal chip firing requires an external port for the receiving end of the display terminal, which is inconvenient to operate.

Method used

Connect to the receiving chip through I2C, the host side is written on the chip key, including cutting the key, stitching secrets, and chip burn through I2C transmission.

Benefits of technology

The secret burns to complete the receiving chip through the host side are achieved, avoiding the needs of the external serial port, more convenient and fast operation, and ensuring the security of signal transmission.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention belongs to the technical field of chip burning, and discloses a chip key burning method, device, display device and storage medium. The method includes: when the receiving chip burns the chip key, the host end and the receiving chip's to-be-processed keys are cut according to a preset cutting method to obtain a first key to be spliced ​​and a second key to be spliced; the first key to be spliced ​​and the second key to be spliced ​​are spliced ​​to obtain a receiving chip key; the receiving chip key is transmitted to the receiving chip through the I2C, so that the receiving chip burns the chip through the receiving chip key. Through the above method, it is achieved that the security of the signal when it is transmitted through the electronic wire is guaranteed, and it is also more convenient and quick. In addition, the present invention has strong versatility and extensibility, can be transplanted and promoted to other platforms for implementation, is also convenient for standardized design, saves development time, and improves development efficiency.
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Description

Technical Field

[0001] The present invention relates to the field of chip burning technology, and in particular to a chip key burning method, device, display device and storage medium. Background Art

[0002] Judging from the current situation in the TV industry, split TV is a new trend in the development of the TV industry in the future. Although traditional all-in-one TVs can bring you the enjoyment of picture quality, there are still certain deficiencies in sound quality. Due to the size of the sound cavity, thickness restrictions, and speaker orientation, the effect of the sound will be affected. For this reason, all-in-one TVs cannot achieve the best audio and video experience due to the limitations of the speaker layout. So if users want to experience the best audio and video effects, in addition to TV with a home theater, only split TV can do it. The emergence of split TV can make the TV present the sound of nature. Due to the adjustment of the back structure of the split TV, the internal hardware unit has been completely separated from the TV screen, which can present users with thinner and more fashionable products. Split TVs are mainly composed of three parts: the host box, the electronic wire, and the screen end. Due to the leakage of the electronic wire, the signal transmitted by the electronic wire is easily illegally recorded, and the signal sending and receiving ends need to be encrypted and protected by HDCPkey.

[0003] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention

[0004] The main purpose of the present invention is to provide a chip key burning method, device, display device and storage medium, aiming to solve the technical problem that the receiving end chip burning of the display terminal in the prior art requires an external port and the operation is inconvenient.

[0005] To achieve the above object, the present invention provides a chip key burning method, which is applied to a display device, wherein the display device includes a split screen end and a host end, and the host end is connected to a receiving chip via I2C. The chip key burning method includes:

[0006] When the receiving chip is performing chip key burning, the to-be-processed keys of the host end and the receiving chip are cut according to a preset cutting method to obtain a first to-be-joined key and a second to-be-joined key;

[0007] Splicing the first to-be-spliced ​​secret key and the second to-be-spliced ​​secret key to obtain a receiving chip secret key;

[0008] The receiving chip secret key is transmitted to the receiving chip through the I2C, so that the receiving chip is programmed with the receiving chip secret key.

[0009] Optionally, when the receiving chip is performing chip key burning, before the to-be-processed keys of the host end and the receiving chip are cut according to a preset cutting method to obtain the first to-be-joined key and the second to-be-joined key, the method further includes:

[0010] When the display device is turned on, obtaining standard key data;

[0011] Compare the standard key data with the stored burned key data to obtain a comparison result;

[0012] When the comparison result is that the standard key data is different from the programmed key data, and the standard key data complies with the standard format specification, it is determined that chip key programming is required.

[0013] Optionally, when the receiving chip is performing chip key burning, the to-be-processed keys of the host end and the receiving chip are cut according to a preset cutting method to obtain a first to-be-joined key and a second to-be-joined key, including:

[0014] Obtaining a master chip standard key of the host end and a receiving chip standard key of the receiving chip;

[0015] Using the master chip standard key and the receiving chip standard key as the keys to be processed;

[0016] Cut the master chip standard key using a cutting tool according to a preset cutting specification to obtain a first key to be spliced;

[0017] The receiving chip standard key is cut using the cutting tool according to the preset cutting specification to obtain a second key to be spliced.

[0018] Optionally, the step of concatenating the first to-be-concatenated key and the second to-be-concatenated key to obtain a receiving chip key includes:

[0019] Obtaining first data structure information of the first secret key to be spliced;

[0020] Obtaining second data structure information of the second secret key to be spliced;

[0021] The first to-be-joined secret key and the second to-be-joined secret key are joined together using a preset joining tool according to the first data structure information and the second data structure information to obtain a receiving chip secret key.

[0022] Optionally, the step of splicing the first key to be spliced ​​and the second key to be spliced ​​using a preset splicing tool according to the first data structure information and the second data structure information to obtain a receiving chip key includes:

[0023] Determine the data header to be spliced ​​and the first other data according to the first data structure information;

[0024] Adding preset bytes to the data header to be spliced ​​to obtain a receiving chip key data header;

[0025] Determine the tail of the data to be spliced ​​and the other data according to the second data structure information;

[0026] Adding a preset sequence code to the tail of the data to be spliced ​​to obtain the tail of the receiving chip key data;

[0027] The receiving chip key data header, the receiving chip key data tail, the first other data and the second other data are concatenated to obtain the receiving chip key.

[0028] Optionally, transmitting the receiving chip secret key to the receiving chip via I2C includes:

[0029] Burn the receiving chip key into the host-side memory, and parse the receiving chip key through the middleware to obtain a parsed file;

[0030] Determine the target key according to the parsed file;

[0031] The target key is transmitted to the target hardware layer through a preset function, so that the target hardware layer transmits the target key to the receiving chip through I2C.

[0032] Optionally, determining the target key according to the parsed file includes:

[0033] Determining configuration information of the receiving chip key according to the parsed file;

[0034] Determine the data length and the data offset address according to the configuration information;

[0035] A target key is determined according to the data length and the data offset address.

[0036] In addition, to achieve the above purpose, the present invention also proposes a chip key burning device, the chip key burning device includes a separate screen end and a host end, the host end is connected to the receiving chip via I2C, and the chip key burning device also includes:

[0037] A cutting module, used for cutting the to-be-processed keys of the host end and the receiving chip according to a preset cutting method when the receiving chip is performing chip key burning, to obtain a first to-be-joined key and a second to-be-joined key;

[0038] A splicing module, used for splicing the first to-be-spliced ​​secret key and the second to-be-spliced ​​secret key to obtain a receiving chip secret key;

[0039] The burning module is used to transmit the receiving chip secret key to the receiving chip through I2C, so that the receiving chip can be burned by the receiving chip secret key.

[0040] In addition, to achieve the above-mentioned purpose, the present invention also proposes a display device, which includes: a memory, a processor, and a chip key burning program stored in the memory and runnable on the processor, and the chip key burning program is configured to implement the steps of the chip key burning method described above.

[0041] In addition, to achieve the above-mentioned purpose, the present invention also proposes a storage medium, on which a chip key burning program is stored, and when the chip key burning program is executed by a processor, the steps of the chip key burning method described above are implemented.

[0042] When the receiving chip is performing chip key burning, the present invention cuts the to-be-processed keys of the host end and the receiving chip according to a preset cutting method to obtain a first key to be spliced ​​and a second key to be spliced; splices the first key to be spliced ​​and the second key to be spliced ​​to obtain a receiving chip key; transmits the receiving chip key to the receiving chip through the I2C, so that the receiving chip performs chip burning through the receiving chip key. In this way, the burning of the receiving chip key is completed through the host end, without the need to burn the receiving chip key through an external serial port. It is more convenient and quicker while ensuring the security of the signal when it is transmitted through the electronic wire. In addition, the present invention has strong versatility and extensibility, can be transplanted and promoted to other platforms for implementation, is also convenient for standardized design, saves development time, and improves development efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a structural schematic diagram of a display device in a hardware operating environment involved in an embodiment of the present invention;

[0044] Figure 2 This is a flow chart of the first embodiment of the chip key burning method of the present invention;

[0045] Figure 3 It is a schematic diagram of the process of checking the startup key of a display device in an embodiment of the chip key burning method of the present invention;

[0046] Figure 4 This is a flow chart of a second embodiment of a chip key programming method according to the present invention;

[0047] Figure 5 This is a structural block diagram of the first embodiment of the chip key burning device of the present invention.

[0048] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0049] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0050] Reference Figure 1 , Figure 1 The figure is a schematic diagram of the structure of a display device in a hardware operating environment involved in an embodiment of the present invention.

[0051] like Figure 1 As shown, the display device may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a wireless fidelity (Wireless-Fidelity, Wi-Fi) interface). The memory 1005 may be a high-speed random access memory (Random Access Memory, RAM) memory, or a stable non-volatile memory (Non-Volatile Memory, NVM), such as a disk memory. The memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0052] Those skilled in the art will understand that Figure 1 The structure shown in the figure does not constitute a limitation on the display device, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0053] like Figure 1 As shown, the memory 1005 as a storage medium may include an operating system, a network communication module, a user interface module, and a chip key burning program.

[0054] exist Figure 1In the display device shown, the network interface 1004 is mainly used for data communication with a network server; the user interface 1003 is mainly used for data interaction with a user; the processor 1001 and the memory 1005 in the display device of the present invention can be set in the display device, and the display device calls the chip key burning program stored in the memory 1005 through the processor 1001, and executes the chip key burning method provided in an embodiment of the present invention.

[0055] The embodiment of the present invention provides a chip key burning method, referring to Figure 2 , Figure 2 The figure is a flow chart of a first embodiment of a chip key burning method of the present invention.

[0056] In this embodiment, the chip key burning method is applied to a display device, the display device includes a separate screen end and a host end, the host end is connected to the receiving chip via I2C, and the chip key burning method includes the following steps:

[0057] Step S10: When the receiving chip is performing chip key burning, the to-be-processed keys of the host end and the receiving chip are cut according to a preset cutting method to obtain a first to-be-spliced ​​key and a second to-be-spliced ​​key.

[0058] It should be noted that the display device to which the chip key burning method implemented in this embodiment is applied is a structure in which the host end is separated from the screen body and the display end. It can be a display device such as a split TV that separates the main processing module from the display module. This embodiment does not limit this.

[0059] It should be understood that the display mode of the display device in this embodiment is: the TV main chip at the host end outputs a VBO signal to the external output chip, that is, the RTK2800TX chip, and the RTK2800TX converts the VBO signal into an HDMI signal and sends it to the external receiving chip through an electronic line, that is, the RTK2800RX chip, and the RTK2800RX converts the received HDMI signal into a VBO signal and sends it to the screen end. In this process, due to the leakage of electronic wires, the HDMI signal sent by RTK2800TX needs to be encrypted by HDCP TX Key, that is, the output chip key, and then given to RTK2800RX. It is encrypted using HDCP2.2 Key. RTK2800RX then uses HDCP RX Key to receive the chip key for decryption, and then gives the VBO signal to the screen end. The HDCP TX Key required by RTK2800TX can be shared by all RTK2800TX chips, but the HDCP RX Key required by RTK2800RX requires each RTK2800RX chip to have an independent Key, which involves the burning of RTK2800RX HDCPKey. In the current situation, the burning of the receiving chip key needs to be carried out with the help of an external serial port. For example, a U disk or other device burns the already burned receiving chip key into the receiving chip, but this is not convenient. The chip key burning method proposed in this embodiment realizes that the receiving chip key does not need to be connected to an external serial port, and the receiving chip key is burned through the main TV chip on the host end.

[0060] In a specific implementation, the executor of this embodiment is a controller on the host side of the display device, which may be a controller for controlling the chip key burning method, or a system processor on the host side of the display device, or other devices that can implement this function, and this embodiment does not limit this.

[0061] It should be noted that when the receiving chip is performing chip key burning, the pending keys of the host and the receiving chip are cut according to a preset cutting method to obtain a first key to be spliced ​​and a second key to be spliced. This means that when it is determined that the receiving chip needs to be re-written with the chip key, the main chip standard key of the host and the receiving chip standard key of the receiving chip are cut as pending keys, and then the first key to be spliced ​​and the second key to be spliced ​​are obtained by cutting.

[0062] Furthermore, in order to accurately determine whether it is necessary to burn the key of the receiving chip, before step S10, it also includes: when the display device is turned on, obtaining standard key data; comparing the standard key data with the burned key data in storage to obtain a comparison result; when the comparison result is that the standard key data is different from the burned key data, and the standard key data conforms to the standard format specification, it is determined that the chip key needs to be burned.

[0063] It should be understood that the standard key data refers to the 32 SHA256 data in the 896 data of the RTK2800RX HDCP2.2 key passed from the skyhal layer, which is the specified hardware abstraction layer, obtained when the computer is started.

[0064] In the specific implementation, the stored secret key data refers to: reading the 32 SHA256 data stored in the Flash by RTK2800RX through the I2C protocol.

[0065] It should be noted that if Figure 3 The figure shows a flow chart of judging whether the chip key needs to be burned when the display device is turned on. When the comparison result is that the standard key data is different from the burned key data, and the standard key data complies with the standard format specification, judging that the chip key needs to be burned means: when the comparison result is that any one of the standard key data and the burned key data is different, then judging that the comparison result is that the standard key data is different from the burned key data, and then judging whether the standard key data complies with the standard format specification, that is, whether the 896 data formats of the RTK2800RXHDCP2.2 key comply with the specification. Only when it complies with the specification can the key be burned through I2C.

[0066] It should be understood that SHA256 is one of the secure hash algorithm SHA series algorithms, and its digest length is 256 bits, that is, 32 bytes, so it is called SHA256. For messages of any length (calculated in bits), SHA256 will generate a 32-byte length data, called a message digest. When a message is received, this message digest can be used to verify whether the data has changed, that is, to verify its integrity. Here, the 816-byte data of the RTK2800RX HDCP2.2 key is verified by SHA256 to generate a check code. As long as one of the data in the RTK2800RX HDCP2.2 key is different, the check code generated by SHA256 will be different.

[0067] In this way, it is possible to automatically determine whether the chip key needs to be re-burned when the display device is turned on. There is no need to re-burn the chip key every time it is turned on, which can effectively reduce the boot time of the device and reduce the program steps executed by the system when it is turned on.

[0068] Furthermore, in order to accurately cut the first key to be spliced ​​and the second key to be spliced, step S10 includes: obtaining the main chip standard key of the host end and the receiving chip standard key of the receiving chip; using the main chip standard key and the receiving chip standard key as the keys to be processed; using a cutting tool to cut the main chip standard key according to a preset cutting specification to obtain the first key to be spliced; using the cutting tool to cut the receiving chip standard key according to the preset cutting specification to obtain the second key to be spliced.

[0069] It should be noted that obtaining the host chip standard key and the receiving chip standard key of the receiving chip means: obtaining the host chip standard key stored in the host chip, that is, the standard key in HDCP format stored on the host chip. Then obtaining the standard key in HDCP format corresponding to the receiving chip and using it as the key to be processed.

[0070] It should be understood that using a cutting tool to cut the main chip standard key according to preset cutting specifications to obtain a first key to be spliced, and using the cutting tool to cut the receiving chip standard key according to the preset cutting specifications to obtain a second key to be spliced ​​means: using a cutting tool to cut the data structure of the main chip standard key and the receiving chip standard key in the key to be processed respectively to obtain the first key to be spliced ​​and the second key to be spliced. Specifically, the data structure of the first and second keys to be spliced ​​cut out by the tool is as follows: a) The starting address of the first KEY code is uniformly in the 0x20 unit (the first 32 bytes are left empty to record the peripheral basic information of this batch of KEYs); b) The total value of the KEY code provided this time is placed in the 0x11 (high) and 0x12 (low) address units in compressed Hex format. For example, if this batch provides KEYs for 1,500 machines, the 0x11 unit is 05 and the 0x12 unit is DC; c) The compressed HEX format is placed in the 0x13 (high) and 0x The valid byte number of a single HDCP1.4 KEY of this batch of data is placed in the 14 (low) address (that is, the number of bytes actually written into the machine EEPROM). If a certain scheme is fixed to 289, then 0x13 unit is 01 and 0x14 unit is 21; the valid byte number of a single HDCP2.0 KEY of this batch of data is stored in the 0x17 (high) and 0x18 (low) addresses. If a certain scheme is fixed to 862, then 0x17 is 03 and 0x18 is 5E; the valid byte number of a single HDCP2.2 KEY of this batch of data is stored in the 0x1B (high) and 0x1C (low) addresses. The number of valid bytes of KEY. For example, if the number of valid bytes of HDCP2.2 of a certain scheme is 1024, then 0x1B is 0x04 and 0x1C is 0x00; d) The order of arrangement of various KEY codes is HDCP1.4, HDCP2.0, and HDCP2.2 respectively; if the value of the relevant address bit defined in c) is 00, it means that this KEY code is not burned; if the values ​​at addresses 0X17 and 0X18 are both 00, it means that this model only needs to burn HDCP1.4 and HDCP2.2. If the values ​​at addresses 0x17, 0X18, 0X1B, and 0X1C are all 00, it means that only HDCP1.4 needs to be burned; (compatible with models that only need to burn HDCP1.4 at present); e) Use compressed HEX format to store the total number of bytes of a single HDCP 1.4KEY of this batch of data in addresses 0x15 (high) and 0x16 (low) (including HDCP1.4 in c). The total number of bytes of a single HDCP2.0KEY in this batch of data (including the valid bytes of HDCP2.0KEY in c and the additional bytes of HDCP2.4KEY in f) is stored in the addresses 0x19 (high order) and 0x1A (low order).0 KEY additional bytes); the total number of bytes of a single HDCP2.2 KEY in this batch of data is stored at addresses 0x1D (high) and 0X1E (low) (including the number of valid bytes of HDCP2.2 KEY in c and the number of additional bytes of HDCP2.2 KEY in f); f), additional bytes are allowed at the end of each KEY of each type of KEY (HDCP1.4 / HDCP2.0 / HDCP2.2) for data management or data segmentation, etc.; g), the last 4 bytes of each total KEY (from high to low) are required to be attached with a compressed Hex sequence code, which is an increasing +1 sequence, and the starting sequence code value is not required. (If the total length of each KEY code of a certain scheme (the total length in e) is 2022 bytes, the KEY 2019th byte (highest bit) to the 2022nd byte (lowest bit) are attached with a sequence code). In order to meet g), the last component KEY of a single total KEY (if three types of KEY need to be burned, the last component KEY is HDCP2.2, if two types of KEY need to be burned, the last component KEY is HDCP2.0 or HDCP2.2) is required to have at least four additional bytes to store the ordered sequence code. First use the MTK9950 key cutting tool to cut out the corresponding hdcp key, and then use the RTK2800RX key cutting tool to cut out the corresponding hdcp key. .

[0071] In this way, a preset cutting method is implemented, that is, cutting is performed using a cutting tool according to preset cutting specifications to obtain the first key to be spliced ​​and the second key to be spliced, thereby making the splicing of the receiving chip key more accurate.

[0072] Step S20: concatenate the first key to be concatenated with the second key to be concatenated to obtain a receiving chip key.

[0073] It should be noted that splicing the first key to be spliced ​​and the second key to be spliced ​​to obtain the receiving chip key means: processing the data structure of the first key to be spliced ​​and the second key to be spliced, and then splicing them together with the receiving chip key data header, the receiving chip key data tail, the first other data and the second other data, and finally obtaining the receiving chip key required by the receiving chip.

[0074] Step S30: transmitting the receiving chip key to the receiving chip through the I2C, so that the receiving chip is programmed with the receiving chip key.

[0075] It should be understood that I2C herein refers to a two-wire serial bus, which requires only two wires to transmit information between devices connected to the bus.

[0076] In a specific implementation, transmitting the receiving chip key to the receiving chip via I2C means: after the receiving chip key is spliced, it is parsed to obtain the target key, and then the target key is transmitted to the receiving chip via I2C and I2C, so that the chip burning is finally completed.

[0077] Furthermore, in order to complete the key burning of the receiving chip according to the receiving chip key, step S30 includes: burning the receiving chip key into the host-side memory, and parsing the receiving chip key through the middleware to obtain a parsed file; determining the target key according to the parsed file; transmitting the target key to the target hardware layer through a preset function, so that the target hardware layer transmits the target key to the receiving chip through I2C.

[0078] It should be noted that burning the receiving chip key into the host-side memory and parsing the receiving chip key through the middleware to obtain the parsed file means: after the receiving chip key is finally spliced ​​together, a file containing 10 HDCP Keys is obtained, and the synthesized receiving chip key is burned into FlashEeprom according to the serial port / network port burning instructions produced by the factory, and then the middleware parses the file, and the obtained ini file is the parsed file.

[0079] It should be understood that determining the target key according to the parsed file means: determining the data length and data offset address of the received chip key according to the parsed file, and finally determining the target key based on the data length and data offset address.

[0080] In a specific implementation, transmitting the target key to the target hardware layer through a preset function, so that the target hardware layer transmits the target key to the receiving chip through I2C, means: passing the obtained RTK2800RX Key to the skyhal layer through a function, the skyhal layer sends the key to the RTK2800RX through the I2C protocol, and after receiving the key, the RTK2800RX writes it to the Flash chip for storage.

[0081] In this way, the target key is determined according to the receiving chip key, and then the target key is transmitted to the receiving chip to complete the key burning of the receiving chip.

[0082] Furthermore, in order to accurately obtain the target key, the step of determining the target key according to the parsed file includes: determining the configuration information of the receiving chip key according to the parsed file; determining the data length and the data offset address according to the configuration information; and determining the target key according to the data length and the data offset address.

[0083] It should be noted that the configuration information of the received chip key includes but is not limited to the data length and data offset address of the received chip key, and may also include other relevant information of the data structure of the received chip key.

[0084] It should be understood that determining the data length and the data offset address according to the configuration information refers to: determining the total length of the data of the received chip key and the address of the data offset from the configuration information.

[0085] In this way, the target key is determined according to the data length and data offset address of the receiving chip key, that is, the key that ultimately needs to be burned into the receiving chip, making the key burning of the receiving chip more convenient and accurate.

[0086] In this embodiment, when the receiving chip is burning the chip key, the host end and the receiving chip's to-be-processed keys are cut according to a preset cutting method to obtain a first key to be spliced ​​and a second key to be spliced; the first key to be spliced ​​and the second key to be spliced ​​are spliced ​​to obtain a receiving chip key; the receiving chip key is transmitted to the receiving chip through the I2C, so that the receiving chip is burned through the receiving chip key. In this way, the burning of the receiving chip key is completed through the host end, without the need to burn the receiving chip key through an external serial port. It is also more convenient and quicker while ensuring the security of the signal when it is transmitted through the electronic wire. In addition, the present invention has strong versatility and extensibility, can be transplanted and promoted to other platforms for implementation, is also convenient for standardized design, saves development time, and improves development efficiency.

[0087] refer to Figure 4 , Figure 4 The figure is a flow chart of a second embodiment of a chip key burning method of the present invention.

[0088] Based on the above first embodiment, the chip key burning method of this embodiment includes in step S20:

[0089] Step S201: Obtain first data structure information of the first key to be spliced.

[0090] It should be noted that the first data structure information refers to information related to the data structure of the first secret key to be spliced, including but not limited to: the data length in the data structure of the first secret key to be spliced, the position of each byte, etc.

[0091] Step S202: Obtain second data structure information of the second key to be spliced.

[0092] It should be understood that the second data structure information refers to information related to the data structure of the second secret key to be spliced, including but not limited to: the data length in the data structure of the second secret key to be spliced, the position of each byte, etc.

[0093] Step S203: splicing the first key to be spliced ​​and the second key to be spliced ​​using a preset splicing tool according to the first data structure information and the second data structure information to obtain a receiving chip key.

[0094] In a specific implementation, the first key to be spliced ​​and the second key to be spliced ​​are spliced ​​through a preset splicing tool according to the first data structure information and the second data structure information to obtain the receiving chip key, which means: according to the first data structure information, the first key to be spliced ​​is decomposed into a data header to be spliced ​​and first other data, and then according to the second data structure information, the second key to be spliced ​​is decomposed into a data tail to be spliced ​​and second other data, and finally, the data header to be spliced, the first other data, the data tail to be spliced ​​and the second other data are combined to obtain the receiving chip key.

[0095] Furthermore, in order to accurately perform splicing, step S203 includes: determining the data header to be spliced ​​and the first other data according to the first data structure information; appending a preset byte to the data header to be spliced ​​to obtain a receiving chip key data header; determining the data tail to be spliced ​​and the second other data according to the second data structure information; appending a preset sequence code to the data tail to be spliced ​​to obtain a receiving chip key data tail; splicing the receiving chip key data header, the receiving chip key data tail, the first other data and the second other data to obtain a receiving chip key.

[0096] It should be noted that the data header to be spliced ​​refers to the data header of the first secret key to be spliced, and the first other data refers to the remaining data in the data packet of the first secret key to be spliced ​​excluding the data header; similarly, the data tail to be spliced ​​refers to the data tail of the second secret key to be spliced, and the second other data refers to the remaining data in the data packet of the second secret key to be spliced ​​excluding the data tail.

[0097] It should be understood that the addition of preset bytes to the data header to be spliced ​​to obtain the receiving chip key data header means: adding the additional bytes of the preset bytes to the data header to be spliced ​​to obtain the receiving chip key data header. The preset bytes refer to bytes of a specified length set by the user, which is not limited in this embodiment, and generally the preset bytes are 4 bytes.

[0098] In a specific implementation, appending a preset sequence code to the tail of the data to be spliced ​​to obtain the tail of the receiving chip key data means: appending a preset sequence code to the tail of the data to be spliced ​​to obtain the tail of the receiving chip key data. The preset sequence code refers to a sequence code of a specified length set by the user, which is not limited in this embodiment, and generally the preset sequence code is 4 bytes long.

[0099] It should be noted that concatenating the receiving chip key data header, the receiving chip key data tail, the first other data and the second other data to obtain the receiving chip key means: synthesizing a new key through the TOOL tool in the order of receiving chip key data header ++ first other data + second other data receiving chip key data tail, which is the receiving chip key.

[0100] In this way, the data structure of the first key to be spliced ​​and the second key to be spliced ​​is processed to obtain the synthesized and spliced ​​key for burning into the receiving chip, that is, the receiving chip key. This makes the synthesis of the receiving chip key more accurate and faster, and does not require external serial port programming.

[0101] In this embodiment, the first data structure information of the first key to be spliced ​​is obtained; the second data structure information of the second key to be spliced ​​is obtained; and the first key to be spliced ​​and the second key to be spliced ​​are spliced ​​by a preset splicing tool according to the first data structure information and the second data structure information to obtain the receiving chip key. In this way, it is realized that the components of the receiving chip key are determined according to the data structures of the first key to be spliced ​​and the second key to be spliced, and then spliced, so that the splicing and processing of the receiving chip key are more accurate and fast.

[0102] In addition, an embodiment of the present invention further proposes a storage medium, on which a chip key burning program is stored. When the chip key burning program is executed by a processor, the steps of the chip key burning method described above are implemented.

[0103] Since the storage medium adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0104] Reference Figure 5 , Figure 5 This is a structural block diagram of the first embodiment of the chip key burning device of the present invention.

[0105] like Figure 5 As shown, the chip key burning device proposed in the embodiment of the present invention includes:

[0106] The cutting module 10 is used to cut the to-be-processed keys of the host end and the receiving chip according to a preset cutting method when the receiving chip is performing chip key burning, so as to obtain a first to-be-joined key and a second to-be-joined key.

[0107] The splicing module 20 is used to splice the first to-be-spliced ​​secret key with the second to-be-spliced ​​secret key to obtain a receiving chip secret key.

[0108] The burning module 30 is used to transmit the receiving chip secret key to the receiving chip through I2C, so that the receiving chip is burned with the receiving chip secret key.

[0109] In this embodiment, when the receiving chip is burning the chip key, the host end and the receiving chip's to-be-processed keys are cut according to a preset cutting method to obtain a first key to be spliced ​​and a second key to be spliced; the first key to be spliced ​​and the second key to be spliced ​​are spliced ​​to obtain a receiving chip key; the receiving chip key is transmitted to the receiving chip through the I2C, so that the receiving chip is burned through the receiving chip key. In this way, the burning of the receiving chip key is completed through the host end, without the need to burn the receiving chip key through an external serial port. It is also more convenient and quicker while ensuring the security of the signal when it is transmitted through the electronic wire. In addition, the present invention has strong versatility and extensibility, can be transplanted and promoted to other platforms for implementation, is also convenient for standardized design, saves development time, and improves development efficiency.

[0110] In one embodiment, the cutting module 10 is also used to obtain standard key data when the display device is turned on; compare the standard key data with the burned key data in storage to obtain a comparison result; when the comparison result is that the standard key data is different from the burned key data, and the standard key data conforms to the standard format specification, it is determined that the chip key needs to be burned.

[0111] In one embodiment, the cutting module 10 is also used to obtain the main chip standard key of the host end and the receiving chip standard key of the receiving chip; use the main chip standard key and the receiving chip standard key as the keys to be processed; use the cutting tool to cut the main chip standard key according to the preset cutting specifications to obtain the first key to be spliced; use the cutting tool to cut the receiving chip standard key according to the preset cutting specifications to obtain the second key to be spliced.

[0112] In one embodiment, the splicing module 20 is further used to obtain the first data structure information of the first key to be spliced; obtain the second data structure information of the second key to be spliced; and splice the first key to be spliced ​​and the second key to be spliced ​​through a preset splicing tool according to the first data structure information and the second data structure information to obtain the receiving chip key.

[0113] In one embodiment, the splicing module 20 is further used to determine the data header to be spliced ​​and the first other data according to the first data structure information; append preset bytes to the data header to be spliced ​​to obtain a receiving chip key data header; determine the data tail to be spliced ​​and the second other data according to the second data structure information; append a preset sequence code to the data tail to be spliced ​​to obtain a receiving chip key data tail; splice the receiving chip key data header, the receiving chip key data tail, the first other data and the second other data to obtain a receiving chip key.

[0114] In one embodiment, the burning module 30 is also used to burn the receiving chip key into the host-side memory, and parse the receiving chip key through the middleware to obtain a parsed file; determine the target key according to the parsed file; and transmit the target key to the target hardware layer through a preset function, so that the target hardware layer transmits the target key to the receiving chip through I2C.

[0115] In one embodiment, the burning module 30 is further used to determine the configuration information of the receiving chip key according to the parsed file; determine the data length and the data offset address according to the configuration information; and determine the target key according to the data length and the data offset address.

[0116] It should be understood that the above is only an example and does not constitute any limitation on the technical solution of the present invention. In specific applications, technicians in this field can make settings as needed, and the present invention does not limit this.

[0117] Since the present device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0118] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of the present invention. In practical applications, technicians in this field can select part or all of them according to actual needs to achieve the purpose of the present embodiment, and no limitation is made here.

[0119] In addition, for technical details not described in detail in this embodiment, reference may be made to the chip key burning method provided in any embodiment of the present invention, which will not be repeated here.

[0120] In addition, it should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or system including the element.

[0121] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0122] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as a read-only memory (ROM) / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present invention.

[0123] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip key burning method, characterized in that: Applied to a display device, the display device includes a split screen end and a host end, the host end is connected to a receiving chip via I2C, and the chip key burning method includes: Obtaining a master chip standard key of the host end and a receiving chip standard key of the receiving chip; Using the master chip standard key and the receiving chip standard key as the keys to be processed; Cut the master chip standard key using a cutting tool according to a preset cutting specification to obtain a first key to be spliced; Using the cutting tool to cut the receiving chip standard key according to the preset cutting specification, to obtain a second key to be spliced; Obtaining first data structure information of the first secret key to be spliced; Obtaining second data structure information of the second secret key to be spliced; According to the first data structure information and the second data structure information, the first to-be-joined secret key and the second to-be-joined secret key are joined by a preset joining tool to obtain a receiving chip secret key; The receiving chip secret key is transmitted to the receiving chip through the I2C, so that the receiving chip is programmed with the receiving chip secret key.

2. The method according to claim 1, characterized in that When the receiving chip is performing chip key burning, the to-be-processed keys of the host end and the receiving chip are cut according to a preset cutting method to obtain a first to-be-joined key and a second to-be-joined key, and the method further includes: When the display device is turned on, obtaining standard key data; Compare the standard key data with the stored burned key data to obtain a comparison result; When the comparison result is that the standard key data is different from the programmed key data, and the standard key data complies with the standard format specification, it is determined that chip key programming is required.

3. The method according to claim 1, characterized in that The step of splicing the first key to be spliced ​​and the second key to be spliced ​​using a preset splicing tool according to the first data structure information and the second data structure information to obtain a receiving chip key includes: Determine the data header to be spliced ​​and the first other data according to the first data structure information; Adding preset bytes to the data header to be spliced ​​to obtain a receiving chip key data header; Determine the tail of the data to be spliced ​​and the other data according to the second data structure information; Adding a preset sequence code to the tail of the data to be spliced ​​to obtain the tail of the receiving chip key data; The receiving chip key data header, the receiving chip key data tail, the first other data and the second other data are concatenated to obtain the receiving chip key.

4. The method according to claim 1, characterized in that The step of transmitting the receiving chip secret key to the receiving chip via I2C includes: Burn the receiving chip key into the host-side memory, and parse the receiving chip key through the middleware to obtain a parsed file; Determine the target key according to the parsed file; The target key is transmitted to the target hardware layer through a preset function, so that the target hardware layer transmits the target key to the receiving chip through I2C.

5. The method according to claim 4, characterized in that Determining the target key according to the parsed file includes: Determining configuration information of the receiving chip key according to the parsed file; Determine the data length and the data offset address according to the configuration information; A target key is determined according to the data length and the data offset address.

6. A chip key burning device, characterized in that: The chip key burning device includes a separate screen end and a host end, the host end is connected to the receiving chip via I2C, and the chip key burning device also includes: A cutting module, used for obtaining the main chip standard key of the host end and the receiving chip standard key of the receiving chip; using the main chip standard key and the receiving chip standard key as the keys to be processed; using a cutting tool to cut the main chip standard key according to a preset cutting specification to obtain a first key to be spliced; using the cutting tool to cut the receiving chip standard key according to the preset cutting specification to obtain a second key to be spliced; A splicing module, used to obtain the first data structure information of the first key to be spliced; obtain the second data structure information of the second key to be spliced; splice the first key to be spliced ​​and the second key to be spliced ​​through a preset splicing tool according to the first data structure information and the second data structure information to obtain a receiving chip key; The burning module is used to transmit the receiving chip secret key to the receiving chip through the I2C, so that the receiving chip is burned by the receiving chip secret key.

7. A display device, characterized in that: The display device comprises: a memory, a processor, and a chip key burning program stored in the memory and executable on the processor, wherein the chip key burning program is configured to implement the chip key burning method according to any one of claims 1 to 5.

8. A storage medium, characterized in that: The storage medium stores a chip key burning program, and when the chip key burning program is executed by the processor, the chip key burning method according to any one of claims 1 to 5 is implemented.

Citation Information

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