An integrated radio frequency device package structure and a manufacturing method thereof

Abstract

The embodiment of the present application provides an integrated radio frequency component packaging structure and a manufacturing method thereof. The manufacturing method of the integrated radio frequency component packaging structure comprises the following steps: providing an antenna substrate; mounting a functional element on the back of the antenna substrate; performing plastic packaging on the back of the antenna substrate to form a first plastic packaging layer which encapsulates the functional element; etching the first plastic packaging layer to form a first via hole which exposes an antenna pad on the back of the antenna substrate; implanting an electrical connection structure into the first via hole and electrically connecting the electrical connection structure with the antenna pad. The embodiment of the present application provides an integrated radio frequency component packaging structure and a manufacturing method thereof, so as to realize overall system-level packaging protection for radio frequency components.

Description

Technical Field

[0001] This invention relates to chip packaging technology, and more particularly to an integrated radio frequency component packaging structure and its manufacturing method. Background Technology

[0002] Entering the new era of the 21st century, the research and development and manufacturing of integrated circuits have ushered in rapid development, and the functions of electronic products are becoming increasingly powerful and diversified. With the rise of concepts such as intelligence and the Internet of Things, and the booming demand, radio frequency (RF) components have entered a golden age of development. Especially in the fields of 60GHz wireless antenna technology and millimeter-wave radar technology, RF components need to rapidly receive and transmit multiple signals, and perform timely digital-to-analog and analog-to-digital conversion to achieve rapid response in signal reception and transmission.

[0003] In existing packaging structures, such as the antenna packaging module and electronic equipment described in application number CN202110170794.6, connectors are used for subsequent signal connections, which is not conducive to further system integration and subsequent installation and positioning of the RF antenna module. Summary of the Invention

[0004] This invention provides an integrated radio frequency (RF) component packaging structure and its fabrication method to achieve overall system-level packaging protection for RF components.

[0005] In a first aspect, embodiments of the present invention provide a method for fabricating an integrated radio frequency component packaging structure, comprising:

[0006] Provide antenna substrate;

[0007] The functional components are mounted on the back side of the antenna substrate;

[0008] The back side of the antenna substrate is encapsulated to form a first encapsulation layer that encapsulates the functional components.

[0009] The first molding layer is etched to form a first via that exposes the antenna pads on the back side of the antenna substrate;

[0010] An electrical connection structure is implanted into the first via and electrically connected to the antenna pad.

[0011] Optionally, before mounting the functional components on the back side of the antenna substrate, the method further includes:

[0012] Tin is pre-printed or balls are placed on the grounding pad on the front side of the antenna substrate.

[0013] Optionally, before etching the first molding layer to form the first via exposing the antenna pads on the back of the antenna substrate, the method further includes:

[0014] Thin the first molding layer until it is flush with the functional element.

[0015] Optionally, after implanting the electrical connection structure into the first via and electrically connecting the electrical connection structure to the antenna pad, the method further includes:

[0016] The side of the radio frequency component with the electrical connection structure and the functional chip are mounted on the substrate.

[0017] The front side of the substrate is encapsulated to form a second encapsulation layer that encapsulates the radio frequency components.

[0018] The second molding layer is etched to form a second via or annular groove that exposes the grounding pad on the front side of the antenna substrate.

[0019] A shielding layer is formed to encapsulate the second molding layer, and the shielding layer is electrically connected to the grounding pad.

[0020] Optionally, the side of the radio frequency component with the electrical connection structure and the functional chip are mounted on the substrate, including:

[0021] The side of the radio frequency component with the electrical connection structure is connected to the heat dissipation pad on the front side of the substrate by thermally conductive adhesive.

[0022] Optionally, after forming a shielding layer encapsulating the second molding layer and electrically connecting the shielding layer to the ground pad, the method further includes:

[0023] Remove the shielding layer and a portion of the thickness of the second molding layer surrounding the area of ​​the multiple second vias or the annular groove.

[0024] Secondly, embodiments of the present invention provide an integrated radio frequency (RF) component packaging structure, wherein the RF component includes:

[0025] Antenna substrate, including antenna pads disposed on the back side of the antenna substrate;

[0026] Functional components are mounted on the back side of the antenna substrate;

[0027] A first molding compound layer, located on the back side of the antenna substrate, encapsulates the functional components therein; the first molding compound layer includes a first via exposing the antenna pads;

[0028] An electrical connection structure is located in the first via and is electrically connected to the antenna pad.

[0029] Optionally, the first molding layer is flush with the side of the functional element that is furthest from the antenna substrate.

[0030] Optionally, it also includes:

[0031] The substrate has the side of the radio frequency component with an electrical connection structure and the functional chip mounted on the substrate.

[0032] The second molding layer, located on the front side of the substrate, encapsulates the radio frequency components; the second molding layer includes a second via or annular groove that exposes the ground pad on the front side of the antenna substrate.

[0033] The shielding layer, which encapsulates the second molding layer, is electrically connected to the grounding pad.

[0034] Optionally, the second molding layer includes a first sub-molding layer and a second sub-molding layer, wherein the first sub-molding layer is located within the area surrounded by the plurality of second vias or the annular groove;

[0035] In a direction perpendicular to the substrate, the vertical distance between the first molding layer and the substrate is less than the vertical distance between the second molding layer and the substrate, and the first sub-molding layer and the shielding layer do not overlap.

[0036] This invention provides a method for fabricating an integrated radio frequency (RF) component packaging structure. After mounting the functional component onto the back side of an antenna substrate, the back side of the antenna substrate is further encapsulated to form a first encapsulation layer that encapsulates the functional component. The first encapsulation layer is etched to form a first via that exposes the antenna pads on the back side of the antenna substrate. An electrical connection structure is implanted into the first via and electrically connected to the antenna pads. Thus, the functional component can be electrically connected to subsequent packaged devices through the electrical connection structure, thereby achieving overall system-level packaging protection for the RF component. Attached Figure Description

[0037] Figure 1 A flowchart illustrating a method for fabricating an integrated radio frequency component packaging structure according to an embodiment of the present invention;

[0038] Figures 2-9 This is a schematic diagram illustrating the fabrication process of an integrated radio frequency component packaging structure provided in an embodiment of the present invention;

[0039] Figure 10 A flowchart illustrating a method for fabricating another integrated radio frequency component packaging structure provided in an embodiment of the present invention;

[0040] Figures 11-16 A schematic diagram illustrating the fabrication process of another integrated radio frequency component packaging structure provided in an embodiment of the present invention;

[0041] Figure 17 This is a schematic diagram of an integrated radio frequency component packaging structure provided in an embodiment of the present invention;

[0042] Figure 18 This is a schematic diagram of another integrated radio frequency component packaging structure provided in an embodiment of the present invention. Detailed Implementation

[0043] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0044] Figure 1 This is a flowchart illustrating a method for fabricating an integrated radio frequency component packaging structure according to an embodiment of the present invention. Figures 2-9 This is a schematic diagram illustrating the fabrication process of an integrated radio frequency component packaging structure according to an embodiment of the present invention. (Refer to...) Figures 1-9 The manufacturing method includes:

[0045] S101, Provides antenna substrate 1051.

[0046] refer to Figure 2 The antenna substrate 1051 may include a radio frequency antenna, which is used to transmit signals to the outside world or receive signals from the outside world.

[0047] S102. The functional component 1055 is mounted on the back side of the antenna substrate 1051.

[0048] refer to Figure 4 The functional element 1055 can be mounted on the back of the antenna substrate 1051 via a connection method such as solder balls. The radio frequency antenna of the antenna substrate 1051 is connected to the functional element 1055, and the functional element 1055 realizes signal reception and transmission through the radio frequency antenna.

[0049] The functional element 1055 may include at least one of a power control chip, a processor chip, and a multi-functional integrated chip.

[0050] S103. The back side of the antenna substrate 1051 is encapsulated to form a first encapsulation layer 1057 that encapsulates the functional element 1055.

[0051] refer to Figure 5 The back side of the antenna substrate 1051 is encapsulated with plastic. The encapsulation material is located on the back side of the antenna substrate 1051 and wraps the functional component 1055 to form the first encapsulation layer 1057.

[0052] S104. Etch the first molding layer 1057 to form a first via 1058 that exposes the antenna pads on the back of the antenna substrate 1051.

[0053] refer to Figure 7For example, a laser polishing process can be used to create a hole in the first molding compound 1057, forming a first via 1058 on the first molding compound 1057 that exposes the antenna pads on the back of the antenna substrate 1051. There can be multiple first vias 1058 formed on the first molding compound 1057, and multiple first vias 1058 can form a via array.

[0054] S105. The electrical connection structure 1056 is implanted into the first via 1058, and the electrical connection structure 1056 is electrically connected to the antenna pad.

[0055] refer to Figure 8 Taking the electrical connection structure 1056 as a solder ball as an example, the solder ball is implanted into the first via 1058, with each solder ball corresponding to one of the first vias 1058. Through processes such as reflow soldering and cleaning, the solder ball is soldered to the antenna pad, achieving electrical connection between the solder ball and the antenna pad. In other embodiments, the electrical connection structure 1056 can also take other forms, such as an adapter board or a copper pillar.

[0056] This invention provides a method for fabricating an integrated radio frequency (RF) component package structure. After mounting a functional component 1055 onto the back side of an antenna substrate 1051, the back side of the antenna substrate 1051 is further encapsulated to form a first encapsulation layer 1057 encapsulating the functional component 1055. The first encapsulation layer 1057 is etched to form a first via 1058 exposing the antenna pads on the back side of the antenna substrate 1051. An electrical connection structure 1056 is implanted into the first via 1058 and electrically connected to the antenna pads. Thus, the functional component 1055 can be electrically connected to subsequent packaged devices through the electrical connection structure 1056. Therefore, a system-level package protection for the RF component is achieved, enabling the RF component to be further integrated into multi-functional processes in subsequent manufacturing processes.

[0057] In one embodiment, between steps S101 and S102, the manufacturing method may further include: referencing Figure 3 Solder is pre-printed or balls are implanted on the grounding pad on the front side of the antenna substrate 1051. It can be understood that the grounding pad on the front side of the antenna substrate 1051 is electrically led out by the solder paste layer 1053 formed by pre-printing solder (or implanted balls) to facilitate electrical connection with subsequent packaged devices.

[0058] In one embodiment, between step S103 and step S104, the manufacturing method may further include: referencing Figure 6The first molding compound 1057 is thinned until it is flush with the functional element 1055. In this embodiment of the invention, by thinning the first molding compound 1057 so that its height after grinding is flush with the functional element 1055, the surface of the functional element 1055 is fully exposed, thereby reducing the thickness of the first molding compound 1057, reducing the thickness of the radio frequency component, and reducing the thickness of the package structure integrating the radio frequency component.

[0059] In one embodiment, multiple antenna substrates 1051 form a connecting plate. After step S105 described above, the manufacturing method may further include: referencing... Figure 9 The connecting plate is cut to form a single radio frequency component 105. There are various ways to cut the connecting plate, such as laser cutting, mechanical cutting and other splitting processes to form a single radio frequency component 105.

[0060] For example, before the step of cutting the interconnect to form a single RF component 105, most or all of the packaging tests can be performed on the antenna substrate 1051. That is, the interconnect is cut after the packaging tests of the antenna substrate 1051 are completed. The packaging tests of the antenna substrate 1051 may include testing the electrical performance of the antenna substrate 1051, for example, applying a test signal to the antenna substrate 1051 through a probe, receiving the feedback signal from the antenna substrate 1051, and determining the electrical performance of the antenna substrate 1051 based on the feedback signal.

[0061] Furthermore, this embodiment of the invention also provides an exemplary method for integrating radio frequency component 105 as a component into a terminal SiP system-in-package motherboard to form a package structure. Figure 10 This is a flowchart illustrating a method for fabricating another integrated radio frequency component packaging structure according to an embodiment of the present invention. Figures 11-16 This is a schematic diagram illustrating the fabrication process of another integrated radio frequency component packaging structure provided in an embodiment of the present invention, with reference to... Figures 2-16 The manufacturing method includes:

[0062] S201, Provide antenna substrate 1051.

[0063] S202. The functional component 1055 is mounted on the back side of the antenna substrate 1051.

[0064] S203. The back side of the antenna substrate 1051 is encapsulated to form a first encapsulation layer 1057 that encapsulates the functional element 1055.

[0065] S204. Etch the first molding layer 1057 to form the first via 1058 that exposes the antenna pads on the back of the antenna substrate 1051.

[0066] S205. The electrical connection structure 1056 is implanted into the first via 1058, and the electrical connection structure 1056 is electrically connected to the antenna pad.

[0067] S206. The radio frequency component 105 is disposed on one side of the electrical connection structure 1056, and the functional chip is mounted on the substrate 101.

[0068] refer to Figure 11 The aforementioned radio frequency (RF) components 105 are mounted on the substrate 101 using techniques such as bonding, surface mount technology (SMT), and flip chip technology. The side of the RF component 105 with the electrical connection structure 1056 faces the substrate 101, and the RF component 105 is electrically connected to the substrate 101 through the electrical connection structure 1056. The functional element 1055 processes the signal of the RF antenna, and the processed signal is transmitted to the substrate 101 through the inner layer circuitry of the antenna substrate 1051 and through the electrical connection structure 1056.

[0069] For example, refer to Figure 11 In this step, multiple functional chips may include, for example, 102, 106, and 107. Components 102, 106, and 107 can be mounted on substrate 101 using bonding processes, surface mount processes, flip chip processes, or other technologies.

[0070] Optionally, refer to Figure 11 This step may include: connecting the side of the RF component 105 with the electrical connection structure 1056 to the heat dissipation pad 1011 on the front side of the substrate 101 using thermally conductive adhesive 1054. By using thermally conductive adhesive 1054, the heat generated by the RF component 105 can be transferred to the heat dissipation pad 1011 on the front side of the substrate 101, thereby improving the ability to diffuse the heat generated by the RF component 105.

[0071] For example, refer to Figure 11 The substrate 101 also includes a thermally conductive via 1012 penetrating the substrate 101 and a back pad 1013 located on the back side of the substrate 101. One end of the thermally conductive via 1012 is connected to the heat dissipation pad 1011, and the other end of the thermally conductive via 1012 is connected to the back pad 1013. After the heat generated by the RF component 105 is transferred to the heat dissipation pad 1011, the heat dissipation pad 1011 introduces the heat into the back pad 1013 of the substrate 101 through the thermally conductive via 1012 inside the substrate 101, so that the heat can be dissipated to the external space through the back pad 1013.

[0072] S207. The front side of the substrate 101 is encapsulated to form a second encapsulation layer 104 that encapsulates the radio frequency components 105.

[0073] refer to Figure 12The front side of the substrate 101 is encapsulated with molding material, which is located on the front side of the substrate 101 and wraps the radio frequency components 105 to form a second molding layer 104.

[0074] For example, such as Figure 12 As shown, the molding compound can also encapsulate the components 102, RF components 105, components 106, and components 107 located on the front side of the substrate 101.

[0075] S208, etch the second molding layer 104 to form a second via 108 or an annular groove that exposes the grounding pad on the front side of the antenna substrate 1051.

[0076] In this step, refer to Figure 13 For example, a laser polishing process can be used to create holes or grooves in the second molding compound 104, forming a second via 108 or an annular groove on the second molding compound 104 to expose the grounding pad on the front side of the antenna substrate 1051. Multiple second vias 108 can be formed on the second molding compound 104, and these multiple second vias 108 can form a via array.

[0077] It should be noted that, in one embodiment, between steps S201 and S202, the fabrication method may further include: pre-printing solder or placing solder balls on the grounding pad on the front side of the antenna substrate 1051. In this step, etching the second via 108 or annular groove formed by the second molding compound 104 can expose the solder paste layer 1053 or solder balls formed on the grounding pad. At this time, refer to... Figure 13 This ensures that the second via 108 makes full contact with the solder paste layer 1053 or solder ball on the RF component 105 without damaging the circuit layer of the RF component 105.

[0078] S209. Form a shielding layer 103 that encapsulates the second molding layer 104, and electrically connect the shielding layer 103 to the grounding pad.

[0079] In this step, refer to Figure 15 For example, electromagnetic shielding can be achieved by using shielding processes such as physical vapor deposition, spin coating, and chemical deposition to mount the aforementioned radio frequency component integrated board (the structure formed by mounting radio frequency components 105 onto substrate 101), thereby forming a thin film shielding layer 103 on the outer surface of the second molding compound 104. The shielding layer 103 needs to be in complete contact with the grounding pad to form a grounding effect. If a solder paste layer 1053 or solder balls are provided on the grounding pad, the shielding layer 103 needs to be in complete contact with the solder paste layer 1053 or solder balls, thereby forming a grounding effect through the complete contact between the solder paste layer 1053 or solder balls and the grounding pad.

[0080] For example, refer to Figure 15 The shielding layer 103 needs to be bonded to the grounded copper layer on the side wall of the substrate 101 to form an electrical connection.

[0081] This invention provides a method for fabricating an integrated radio frequency (RF) component package structure. Based on the above embodiments, an RF component 105 with an electrical connection structure 1056 on one side, and a functional chip are mounted on a substrate 101. The front side of the substrate 101 is plastic-encapsulated to form a second plastic encapsulation layer 104 encapsulating the RF component 105. The second plastic encapsulation layer 104 is etched to form a second via 108 or an annular groove exposing the grounding pad on the front side of the antenna substrate 1051. A shielding layer 103 is formed, encapsulating the second plastic encapsulation layer 104, and the shielding layer 103 is electrically connected to the grounding pad. The shielding layer 103 breaks at the second via 108 or annular groove due to the height difference, ensuring that at least at the second via 108 or annular groove, it does not shield the RF signal. This achieves overall system-level package protection for the RF component, improves the penetration capability of the RF signal, and enhances signal strength. In other words, encapsulating the RF component 105 in the back-end integrated module not only achieves physical protection for the RF component 105, freeing it from the influence of external electromagnetic, moisture, impact and other physical and chemical environments, thus increasing the electrical reliability of the RF component 105, but also does not affect the RF antenna in the RF component 105 for receiving and transmitting signals.

[0082] In one embodiment, a plurality of radio frequency components 105 are mounted on a substrate 101. Between steps S208 and S209, the fabrication method may further include: referencing... Figure 14 The substrate 101 is cut to form a single radio frequency component integrated board. There are various ways to cut the substrate 101, such as using laser cutting, mechanical cutting or other dicing processes to form a single radio frequency component integrated board.

[0083] In one embodiment, after step S209, the manufacturing method may further include: referring to Figure 16 The shielding layer 103 and a portion of the thickness of the second molding compound 104 surrounding the area of ​​the multiple second vias 108 or annular grooves are removed. For clarity, the second molding compound 104 located within the area surrounded by the multiple second vias 108 or annular grooves is referred to as the first sub-molding compound 1041, and the shielding layer 103 located within the area surrounded by the multiple second vias 108 or annular grooves is referred to as the first sub-shielding layer 1031. In this embodiment of the invention, for example, laser polishing or other processes can be used to remove the first sub-shielding layer 1031 and thin the first sub-molding compound 1041, thereby avoiding the first sub-shielding layer 1031 from shielding the radio frequency signal, reducing the degree of shielding of the radio frequency signal by the first sub-molding compound 1041, improving the penetration capability of the radio frequency signal, and enhancing the signal strength.

[0084] Optionally, the height of the first sub-molding layer 1041 is greater than or equal to 50 μm and less than or equal to 200 μm.

[0085] This invention also provides an integrated radio frequency component packaging structure, see reference. Figure 16 The radio frequency component 105 includes an antenna substrate 1051, a functional element 1055, a first molding compound 1057, and an electrical connection structure 1056. The antenna substrate 1051 includes antenna pads disposed on its back side. The functional element 1055 is mounted on the back side of the antenna substrate 1051. The first molding compound 1057 is located on the back side of the antenna substrate 1051 and encapsulates the functional element 1055 within it. The first molding compound 1057 includes a first via 1058 exposing the antenna pads. The electrical connection structure 1056 is located in the first via 1058 and is electrically connected to the antenna pads.

[0086] This invention provides an integrated radio frequency (RF) component packaging structure. An electrical connection structure 1056 is located in a first via 1058 and is electrically connected to an antenna pad. Thus, the functional element 1055 can be electrically connected to subsequent packaged devices through the electrical connection structure 1056. Therefore, it achieves overall system-level packaging protection for the RF component, enabling the RF component to be further integrated into multi-functional processes in subsequent manufacturing processes.

[0087] Optionally, refer to Figure 16 The first molding layer 1057, on the side away from the antenna substrate 1051, is flush with the side of the functional element 1055, which is also away from the antenna substrate 1051. In this embodiment of the invention, the first molding layer 1057 is flush with the functional element 1055, thus fully exposing the surface of the functional element 1055, thereby reducing the thickness of the first molding layer 1057, reducing the thickness of the radio frequency components, and reducing the thickness of the package structure integrating the radio frequency components.

[0088] Optionally, refer to Figure 16 The packaging structure also includes a substrate 101, a second molding compound 104, and a shielding layer 103. The radio frequency (RF) component 105 has an electrical connection structure 1056 on one side, and a functional chip is mounted on the substrate 101. The second molding compound 104 is located on the front side of the substrate 101 and encapsulates the RF component 105 within it. The second molding compound 104 includes a second via 108 or an annular groove that exposes the ground pad on the front side of the antenna substrate 1051. The shielding layer 103 surrounds the second molding compound 104 and is electrically connected to the ground pad.

[0089] The integrated radio frequency (RF) component packaging structure provided in this embodiment of the invention, based on the above embodiment, further includes a substrate 101, a second molding layer 104, and a shielding layer 103. The shielding layer 103 breaks at the second via 108 or the annular groove due to the height difference, ensuring that it does not shield the RF signal at least at the second via 108 or the annular groove. This achieves overall system-level packaging protection for the RF component, improves the penetration capability of the RF signal, and enhances signal strength. In other words, molding the RF component 105 into the back-end integrated module provides physical protection for the RF component 105, protecting it from external electromagnetic, moisture, impact, and other physical and chemical environmental influences, increasing the electrical reliability of the RF component 105, without affecting the RF antenna's signal transmission and reception within the RF component 105.

[0090] Optionally, refer to Figure 16 The second molding layer 104 includes a first sub-molding layer 1041 and a second sub-molding layer 1042. The first sub-molding layer 1041 is located within the area surrounded by a plurality of second vias 108 or annular grooves. In the direction perpendicular to the substrate 101, the vertical distance between the first sub-molding layer 1041 and the substrate 101 is less than the vertical distance between the second sub-molding layer 1042 and the substrate 101. That is, the thickness of the first sub-molding layer 1041 is less than the thickness of the second sub-molding layer 1042, reducing the shielding degree of the first sub-molding layer 1041 on radio frequency signals. Furthermore, in the direction perpendicular to the substrate 101, the first sub-molding layer 1041 does not overlap with the shielding layer 103. That is, the portion of the shielding layer 103 located on the first sub-molding layer 1041 is removed, preventing it from shielding radio frequency signals, improving the penetration capability of radio frequency signals, and enhancing signal strength.

[0091] Optionally, the height of the first sub-molding layer 1041 is greater than or equal to 50 μm and less than or equal to 200 μm.

[0092] Figure 17 This is a schematic diagram of an integrated radio frequency component packaging structure provided in an embodiment of the present invention, with reference to... Figure 17 The distance between the first molding layer 1057 and the antenna substrate 1051 on the side away from the antenna substrate 1051 is greater than the distance between the functional element 1055 and the antenna substrate 1051 on the side away from the antenna substrate 1051. The functional element 1055 is completely encapsulated within the first molding layer 1057.

[0093] For example, refer to Figure 17 The shielding layer 103 is directly connected to the grounding pad.

[0094] Figure 18 This is a schematic diagram of an integrated radio frequency component packaging structure provided in an embodiment of the present invention, with reference to... Figure 18The second molding layer 104 further includes a third sub-molding layer 1043, which is located on the side of the package structure. The thickness of the third sub-molding layer 1043 is less than that of the second sub-molding layer 1042, reducing the shielding effect of the third sub-molding layer 1043 on radio frequency signals. Furthermore, the third sub-molding layer 1043 does not overlap with the shielding layer 103; that is, the portion of the shielding layer 103 located on the third sub-molding layer 1043 is removed, preventing it from shielding radio frequency signals, improving the penetration capability of radio frequency signals, and enhancing signal strength. In the package structure provided by this embodiment of the invention, the radio frequency component 105 can simultaneously receive and transmit signals from both the top and side.

[0095] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for fabricating an integrated radio frequency component packaging structure, characterized in that, include: Provide antenna substrate; The functional components are mounted on the back side of the antenna substrate; The back side of the antenna substrate is encapsulated to form a first encapsulation layer that encapsulates the functional components. The first molding layer is etched to form a first via that exposes the antenna pads on the back side of the antenna substrate; An electrical connection structure is implanted into the first via, and the electrical connection structure is electrically connected to the antenna pad; The side of the radio frequency component with the electrical connection structure and the functional chip are mounted on the substrate. The front side of the substrate is encapsulated to form a second encapsulation layer that encapsulates the radio frequency components. The second molding layer is etched to form a second via or annular groove that exposes the grounding pad on the front side of the antenna substrate. A shielding layer is formed to encapsulate the second molding layer, and the shielding layer is electrically connected to the grounding pad.

2. The manufacturing method according to claim 1, characterized in that, Before mounting the functional components onto the back side of the antenna substrate, the method further includes: Tin is pre-printed or balls are placed on the grounding pad on the front side of the antenna substrate.

3. The manufacturing method according to claim 1, characterized in that, Before etching the first molding layer to form the first via exposing the antenna pads on the back of the antenna substrate, the process further includes: Thin the first molding layer until it is flush with the functional element.

4. The manufacturing method according to claim 1, characterized in that, The radio frequency component with the electrical connection structure and the functional chip are mounted on the substrate, including: The side of the radio frequency component with the electrical connection structure is connected to the heat dissipation pad on the front side of the substrate by thermally conductive adhesive.

5. The manufacturing method according to claim 1, characterized in that, After forming a shielding layer encapsulating the second molding layer and electrically connecting the shielding layer to the grounding pad, the method further includes: Remove the shielding layer and a portion of the thickness of the second molding layer surrounding the area of ​​the multiple second vias or the annular groove.

6. An integrated radio frequency component packaging structure, characterized in that, The radio frequency components include: Antenna substrate, including antenna pads disposed on the back side of the antenna substrate; Functional components are mounted on the back side of the antenna substrate; A first molding compound layer, located on the back side of the antenna substrate, encapsulates the functional components therein; the first molding compound layer includes a first via exposing the antenna pads; An electrical connection structure is located in the first via and is electrically connected to the antenna pad; Also includes: The substrate has the side of the radio frequency component with an electrical connection structure and the functional chip mounted on the substrate. The second molding layer, located on the front side of the substrate, encapsulates the radio frequency components; the second molding layer includes a second via or annular groove that exposes the ground pad on the front side of the antenna substrate. The shielding layer, which encapsulates the second molding layer, is electrically connected to the grounding pad.

7. The integrated radio frequency component packaging structure according to claim 6, characterized in that, The first molding layer is flush with the side of the functional element that is furthest from the antenna substrate.

8. The integrated radio frequency component packaging structure according to claim 6, characterized in that, The second molding layer includes a first sub-molding layer and a second sub-molding layer, wherein the first sub-molding layer is located within the area surrounded by the plurality of second vias or the annular groove; In a direction perpendicular to the substrate, the vertical distance between the first molding layer and the substrate is less than the vertical distance between the second molding layer and the substrate, and the first sub-molding layer and the shielding layer do not overlap.

9. The integrated radio frequency component packaging structure according to claim 8, characterized in that, The second molding layer further includes a third sub-molding layer, which is located on the side of the encapsulation structure; The thickness of the third sub-molding layer is lower than the thickness of the second sub-molding layer.

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