Display panel and display device

Abstract

Embodiments of the present invention provide a display panel and a display device. The display panel includes a first region and a second region surrounding the first region. The display panel includes a substrate, an array layer, and a display layer, with the display layer located on a side of the array layer away from the substrate. The array layer and the display layer are located in the first region. The display panel also includes a light guide structure located in the second region. The thickness of the light guide structure increases gradually from the first region to the second region in a direction perpendicular to the plane of the substrate. The present invention can reduce the impact of the laser cutting process on circuit components, thereby reducing the risk of display anomalies.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of narrow-border display technology, the distance between the cutting edge of the display panel and the luminous pixels is getting closer and closer. In the existing technology, laser cutting technology is usually used to cut the display panel. The laser energy in the laser cutting process will damage the circuit components close to the cutting edge, resulting in display defects. Summary of the Invention

[0003] Embodiments of the present invention provide a display panel and a display device to reduce the impact of a laser cutting process on circuit elements and reduce the risk of display abnormalities.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, the display panel including a first area and a second area surrounding the first area;

[0005] The display panel includes a substrate, an array layer and a display layer, wherein the display layer is located on a side of the array layer away from the substrate, and the array layer and the display layer are located in the first area;

[0006] The display panel further includes a light guide structure, which is located in the second area. From the first area to the second area, the thickness of the light guide structure in a direction perpendicular to the plane of the substrate gradually increases.

[0007] In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, comprising the display panel provided by any embodiment of the present invention.

[0008] The display panel and display device provided by the embodiments of the present invention have the following beneficial effects: a light-guiding structure is provided in the second region, and the thickness of the light-guiding structure in a direction perpendicular to the plane of the substrate gradually increases in a direction from the first region to the second region. During the laser cutting process, the laser generator can be set on the side of the substrate away from the array layer to cut the panel, which can reduce the heat diffused into the array layer and reduce the impact of laser heat on the characteristics of the transistors in the array layer. Moreover, during the laser cutting process, the laser directed to the light-guiding structure can be emitted in a direction away from the first region after being acted upon by the light-guiding structure, thereby preventing the laser from irradiating the edge of the array layer or the edge of the display layer, thereby reducing the impact of the laser cutting process on circuit components and thereby reducing the risk of display anomalies caused by the laser cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0010] Figure 1 A schematic diagram of a display panel provided by an embodiment of the present invention;

[0011] Figure 2 for Figure 1 A schematic cross-sectional view at the midline AA′;

[0012] Figure 3 A schematic diagram of laser cutting of a display panel;

[0013] Figure 4 Another schematic diagram of laser cutting a display panel;

[0014] Figure 5 for Figure 1 Another cross-sectional view at the midline AA′;

[0015] Figure 6 A partial cross-sectional schematic diagram of another display panel provided by an embodiment of the present invention;

[0016] Figure 7 for Figure 1 Another cross-sectional view at the midline AA′;

[0017] Figure 8 A partial cross-sectional schematic diagram of another display panel provided by an embodiment of the present invention;

[0018] Figure 9 A partial cross-sectional schematic diagram of another display panel provided by an embodiment of the present invention;

[0019] Figure 10 A schematic diagram of another display panel provided by an embodiment of the present invention;

[0020] Figure 11 A schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0022] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "an", "the" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0023] In order to solve the problems existing in the prior art, an embodiment of the present invention provides a display panel, in which a light-guiding structure is arranged at the cutting edge of the display panel, and the light-guiding structure is used to guide the laser in the cutting process away from the displayable area, thereby reducing the impact of the laser cutting process on circuit elements and reducing the risk of display abnormalities.

[0024] Figure 1 A schematic diagram of a display panel provided by an embodiment of the present invention is shown. Figure 2 for Figure 1 A schematic cross-sectional view at the midline AA′.

[0025] like Figure 1 As shown, the display panel includes a first region Q1 and a second region Q2 surrounding the first region Q1. The display panel's displayable area is located in the first region Q1, and a light-emitting device 31 is disposed within the displayable area. The entire first region Q1 is the displayable area, or the area of ​​the first region Q1 is slightly larger than the displayable area. The display panel also includes a light-guiding structure 40 located in the second region Q2.

[0026] like Figure 2As shown, the display panel includes a substrate 10, an array layer 20 and a display layer 30. The display layer 30 is located on the side of the array layer 20 away from the substrate 10, and the array layer 20 and the display layer 30 are located in the first area Q1. The substrate 10 is used to carry the array layer 20, the display layer 30 and other structures located thereon. The substrate 10 includes a portion located in the first area Q1 and a portion located in the second area Q2. The substrate 10 is a rigid substrate, such as a glass substrate. The display layer 30 includes a plurality of light-emitting devices 31, which are light-emitting pixels. The display layer 30 includes at least a red light-emitting device, a blue light-emitting device and a green light-emitting device. Among them, the light-emitting device is an inorganic light-emitting diode or an organic light-emitting diode. Optionally, the light-emitting device is a mini LED (light-emitting diode) or a micro LED. Mini LED is an LED device with a chip size between 50 and 200 μm, and micro LED refers to an LED device on the micron scale. The array layer 20 includes a pixel circuit ( Figure 2 (not shown in the figure), the pixel circuit is coupled to the light-emitting device, and the pixel circuit is used to drive the light-emitting device to emit light.

[0027] like Figure 2 As shown, the thickness of the light guide structure 40 increases gradually in a direction e perpendicular to the plane of the substrate 10, from the first region Q1 to the second region Q2. In other words, the thickness of the light guide structure 40 increases gradually in a direction from the side of the light guide structure 40 close to the first region Q1 to the side away from the first region Q1. That is, the light guide structure 40 has a certain width in the direction x from the first region Q1 to the second region Q2. The closer the light guide structure 40 is to the edge of the second region Q2 away from the first region Q1, the greater the thickness of the light guide structure 40 at that location. The substrate 10 includes a first surface M1 on a side away from the array layer 20; the light guide structure 40 includes a light guide surface Md. The light guide surface Md is the surface of the light guide structure 40 away from the substrate 10; in the direction x from the first region Q1 to the second region Q2, the distance between the light guide surface Md and the first surface M1, in a direction e perpendicular to the plane of the substrate 10, gradually increases. The light guiding surface Md of the light guiding structure 40 has a light guiding function.

[0028] Display panel manufacturing typically begins by fabricating multiple small display units on a large substrate. The panels are then cut along predetermined cutting lines to form independent display panels. In the present invention, the edge of the second region Q2 of the display panel, away from the first region Q1, is the cut edge of the display panel formed along the cutting lines.

[0029] The display panel provided in the embodiments of the present invention can be manufactured using a backside cutting process, wherein the backside cutting process refers to the laser generator being positioned on the side of the substrate 10 away from the array layer 20 during cutting. Accordingly, there is also a frontside cutting process in the prior art, wherein the laser generator and the array layer 20 are positioned on the same side of the substrate 10 during cutting.

[0030] Figure 3 This is a schematic diagram of laser cutting of display panels. Figure 3 As shown, using the design of an embodiment of the present invention, a light-guiding structure 40 is provided at the location of cutting line 01. A laser generator 02 is placed on the side of the substrate 10 away from the array layer 20, and laser light emitted by the laser generator 02 is used to perform cutting along the cutting line 01. In a backside cutting process, the array layer 20 and the laser generator 02 are located on opposite sides of the substrate 10. Therefore, the laser light emitted by the laser generator 02 needs to penetrate the substrate 10 to reach the location of the array layer 20. This can reduce the amount of laser heat that diffuses into the array layer 20, thereby reducing the impact of laser heat on the characteristics of the transistors in the array layer 20 and ensuring the stability of the circuit performance in the array layer 20.

[0031] like Figure 3 As shown, at the cutting line 01, the laser directed toward the light guide structure 40 can be reflected at the interface between the light guide surface Md of the light guide structure 40 and the air. The reflected laser light is emitted in a direction away from the first area Q1 of the display panel. In other words, the reflected laser light is emitted outside the displayable area. This prevents the laser light from irradiating the circuit elements in the first area Q1. For example, laser light irradiating the edge of the array layer 20 may affect the circuit in the array layer 30, and laser light irradiating the edge of the display layer 30 may affect the light-emitting device 31. In this embodiment of the present invention, the light guide structure 40 can reduce the impact of the laser light on the circuit elements during the laser cutting process, reducing the risk of display abnormalities.

[0032] In addition, if Figure 3 As shown in the figure, laser light is refracted at the interface between the light-guiding surface Md and air. By setting the refractive index of the light-guiding structure 40 to be greater than that of air, the refracted light is emitted away from the first region Q1 relative to the incident light, thereby reducing the impact of the laser on circuit components. During the laser cutting process, the light-guiding structure 40 is cut along with the substrate 10. After the cutting process, the edge of the display panel is formed at the cutting line O1, and a portion of the light-guiding structure 40 remains within the second region Q2 of the display panel.

[0033] The display panel provided in an embodiment of the present invention includes a light guide structure 40 disposed within the second region Q2. The thickness of the light guide structure 40 gradually increases in a direction e perpendicular to the plane of the substrate 10, extending from the first region Q1 to the second region Q2. During the laser cutting process, the laser generator can be positioned on a side of the substrate 10 away from the array layer 20 for cutting the panel. This reduces the amount of heat diffused into the array layer 20 and minimizes the effect of laser heat on the characteristics of transistors in the array layer 20. Furthermore, during the laser cutting process, the laser directed toward the light guide structure 40 can be directed away from the first region Q1 after passing through the light guide structure 40, preventing the laser from irradiating the edges of the array layer 20 or the display layer 30. This reduces the impact of the laser cutting process on circuit components and thereby reduces the risk of display anomalies caused by the laser cutting process.

[0034] In addition, in the embodiment of the present invention, the array layer 20 is located in the first region Q1, and the insulating layer in the array layer 20 does not extend to the edge position of the second region Q2 away from the first region Q1. Therefore, the array layer 20 will not be cut during the laser cutting process, thereby preventing the cutting from causing cracks in the insulating layer and affecting the metal circuits in the array layer 20.

[0035] In some embodiments, the refractive index of the light guide structure 40 is set to be close to that of the substrate 10, thereby reducing the reflection of laser light at the interface between the light guide structure 40 and the substrate 10. More laser light reflected at the interface between the light guide structure 40 and the air can be directed back to the substrate 10 and utilized, thereby improving laser utilization.

[0036] In some embodiments, as Figure 2 As shown, the light guide structure 40 and the array layer 20 are located on the same side of the substrate 10. The light guide structure 40 can be fabricated on one side of the substrate 10 and in contact with the surface of the substrate 10. The light guide structure 40 is positioned near the cutting line. During the laser cutting process, the light guide structure 40 and the substrate 10 are cut together along the predetermined cutting line. Laser light that penetrates the substrate 10 and is directed toward the light guide structure 40 is then directed away from the first region Q1 by the light guide structure 40. This prevents the laser light from irradiating the edges of the array layer 20 or the display layer 30, reduces the impact of the laser cutting process on circuit components, and thereby reduces the risk of display anomalies.

[0037] During the production process, a larger light guide structure 40 is first produced at the preset cutting line 01 position, so that the light guide structure 40 has a larger width in the direction x from the first area Q1 to the second area Q2, and the light guide structure 40 overlaps with the cutting line 01. In this way, most of the laser light near the cutting line 01 during the laser cutting process can be acted upon by the light guide structure 40 and then emitted in a direction away from the first area Q1. Figure 3As shown, in the laser cutting process, the light guide structure 40 and the substrate 10 are cut together along the cutting line 01. After cutting, part of the light guide structure 40 remains on the display panel and forms a Figure 2 The structure shown. Figure 2 As shown, the edge of the light guide structure 40 away from the first region Q1 is flush with the edge of the substrate 10 .

[0038] by Figure 2 In the schematic cross-sectional view, the light-guiding surface Md is essentially a plane for illustration. The light-guiding surface Md is inclined relative to the plane of the substrate 10. Thus, an acute angle θ is formed between the light-guiding surface Md and the plane of the substrate 10, directed toward the interior of the light-guiding structure 40. When the distance d0 from the edge of the substrate 10 to the first region Q1 is constant, θ increases as the maximum thickness d2 of the light-guiding structure 40 increases, and decreases as the maximum thickness d2 of the light-guiding structure 40 decreases.

[0039] Figure 4 Another schematic diagram of laser cutting of display panels, similar to Figure 3 In contrast, Figure 4 The thickness of the light guide structure 40 in the direction perpendicular to the plane of the substrate 10 is relatively small. Figure 4 In the optical path at the location outlined by the dashed circle, the laser light is reflected at the interface between the light-guiding surface Md and the air. The reflected laser light is then reflected again on the first surface M1 of the substrate 10 before being emitted toward the first region Q1. In other words, if the thickness of the light-guiding structure 40 in the direction e perpendicular to the plane of the substrate 10 is too small, the probability of the laser light, after multiple reflections, being emitted again toward the first region Q1 increases.

[0040] In the embodiment of the present invention, Figure 2 As shown, in a direction e perpendicular to the plane of the substrate 10, the thickness of the array layer 20 is d1, and the maximum thickness of the light guide structure 40 is d2; where d2>d1. Setting the maximum thickness of the light guide structure 40 greater than the thickness of the array layer 20 can reduce the probability of laser light re-irradiating the first region Q1 after multiple reflections, thereby reducing the impact of the laser cutting process on circuit components.

[0041] In another embodiment, Figure 5 for Figure 1 Another cross-sectional view at the midline AA′. Figure 5 As shown, the substrate 10 includes a first surface M1 away from the array layer 20 and a second surface M2 close to the array layer 20; a portion of the second surface M2 in the second region Q2 is recessed toward the first surface M1 to form a groove. Figure 5 The slots are not marked, which is understandable. Figure 5The triangular concave position indicated in the middle cross-sectional view is a slot. The substrate 10 at the slot position is reused as a light guide structure 40, and part of the surface in the slot is a light guide surface Md. It can be seen that in the direction x from the first area Q1 to the second area Q2, the distance between the light guide surface Md and the first surface M1 in the direction e perpendicular to the plane of the substrate 10 gradually increases. This embodiment uses the substrate 10 to make the light guide structure 40, for example, the portion of the substrate 10 located in the second area Q2 is etched to form the light guide structure 40. The principle of the light guide structure 40 on the laser light is the same as the above Figure 3 The principles shown are the same and will not be repeated here. In the direction x from the first region Q1 to the second region Q2, the thickness of the light guide structure 40 in the direction e perpendicular to the plane of the substrate 10 gradually increases. In the laser cutting process, the laser generator can be set on the side of the substrate 10 away from the array layer 20 to cut the panel, which can reduce the heat diffused into the array layer 20 and reduce the impact of laser heat on the characteristics of the transistors in the array layer 20. In addition, the laser directed to the light guide structure 40 can be emitted in a direction away from the first region Q1 after being acted upon by the light guide structure 40, which can reduce the impact of the laser cutting process on the circuit components, thereby reducing the risk of display abnormalities.

[0042] In another embodiment, n light guide structures 40 are arranged in sequence in the direction x from the first area Q1 to the second area Q2, where n is an integer and n≥2. Taking n=3 as an example, Figure 6 A partial cross-sectional diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 6 As shown, three light-guiding structures 40 are arranged in sequence in the direction x from the first region Q1 to the second region Q2. During the laser cutting process, multiple light-guiding structures 40 are used to influence the laser light, so that the laser light is emitted away from the first region Q1 after passing through the light-guiding structures 40. This can reduce the impact of the laser cutting process on circuit components, thereby reducing the risk of display anomalies. Furthermore, in this embodiment, the grooves at the locations of each light-guiding structure 40 do not need to be too deep, ensuring the mechanical stability of the substrate 10.

[0043] In some embodiments, as Figure 2 As shown, the light-guiding surface Md is a plane. Optionally, θ is an acute angle, and θ ≥ 10°. This allows the light-guiding surface Md to direct the reflected laser light away from the first region Q1, and reduces the probability of the laser light, after multiple reflections, being re-emitted to the first region Q1, thereby reducing the impact of the laser cutting process on circuit components.

[0044] In another embodiment, Figure 7 for Figure 1 Another cross-sectional view at the midline AA′. Figure 7As shown, the light-guiding surface Md is a curved surface. In the direction x pointing from the first region Q1 to the second region Q2, the distance between the light-guiding surface Md and the first surface M1 in a direction e perpendicular to the plane of the substrate 10 gradually increases. Optionally, the light-guiding surface Md is an arc-shaped curved surface. During the laser cutting process, laser light can be reflected from the curved light-guiding surface Md, and the reflected laser light is emitted in a direction away from the first region Q1, thereby reducing the impact of the laser cutting process on circuit components and reducing the risk of display anomalies.

[0045] Figure 7 The light guide surface Md is shown as convex to the outside of the light guide structure 40 to form a curved surface. In some embodiments, the light guide surface Md is concave to the inside of the light guide structure 40 to form a curved surface, which is not shown in the figure here.

[0046] In some embodiments, Figure 8 A partial cross-sectional diagram of another display panel provided by an embodiment of the present invention. Figure 8 As shown, the display panel also includes a reflective layer 50; the reflective layer 50 covers the light-guiding surface Md on the side of the light-guiding structure 40 away from the substrate 10. The reflective layer 50 reflects laser light, increasing its reflectivity on the light-guiding surface Md. This allows more laser light to be emitted away from the first region Q1 after passing through the light-guiding structure 40, further reducing the impact of the laser cutting process on circuit components and the risk of display anomalies. Furthermore, the reflected laser light can be reused for cutting, improving laser utilization.

[0047] Figure 8 In the figure, the light guide surface Md is substantially planar, and the light guide structure 40 and the array layer 20 are located on the same side of the substrate 10. The solution of covering the reflective layer 50 on the side of the light guide surface Md away from the substrate 10 can be applied to any of the above embodiments and is not illustrated here.

[0048] In some embodiments, the reflective layer 50 includes a metal material, such as silver, titanium, aluminum, etc. The reflective layer 50 can be made by reusing the metal layer in the array layer 20, which can simplify the manufacturing process.

[0049] In some embodiments, Figure 9 A partial cross-sectional diagram of another display panel provided by an embodiment of the present invention. Figure 9As shown, the display panel also includes a light-shielding barrier 60 located in the second region Q2. The light-shielding barrier 60 and the array layer 20 are located on the same side of the substrate 10, and the light-shielding barrier 60 is located between the edge of the array layer 20 and the light-guiding structure 40. Laser light refracted at the interface between the light-guiding structure 40 and the air can be blocked by the light-shielding barrier 60, thereby preventing this refracted light from entering the first region Q1 and affecting the circuit components within the first region Q1. The provision of the light-shielding barrier 60 can further reduce the risk of display anomalies.

[0050] Figure 9 In the figure, the light guide surface Md of the light guide structure 40 is substantially planar, and the light guide structure 40 and the array layer 20 are located on the same side of the substrate 10. The solution of providing a light shielding wall 60 between the light guide structure 40 and the array layer 20 can be applied to any of the above embodiments and is not illustrated here.

[0051] like Figure 9 As shown, in the direction e perpendicular to the plane of the substrate 10, the thickness of the array layer 20 is d1, and the thickness of the light shielding wall 60 is d3; wherein d3>d1. In the embodiment of the present invention, the thickness of the light shielding wall 60 is set to be greater than the thickness of the array layer 20. During the laser cutting process, at least part of the laser light refracted at the interface between the light guide structure 40 and the air can be blocked by the light shielding wall 60, thereby preventing the refracted light from entering the array layer 20 and affecting the circuit elements in the array layer 20. Figure 9 As shown, the light-guiding structure 40 and the light-shielding wall 60 are located on the same side of the substrate 10. In a direction e perpendicular to the plane of the substrate 10, the thickness of the light-shielding wall 60 is d3, and the maximum thickness of the light-guiding structure 40 is d2. Where d3>d2. In other words, the height of the light-shielding wall 60 is higher than that of the light-guiding structure 40. During the laser cutting process, the laser light emitted from the light-guiding structure 40 and directed toward the light-shielding wall can be blocked by the light-shielding wall 60, thereby preventing this refracted light from entering the first region Q1 and affecting the circuit components within the first region Q1.

[0052] In some embodiments, as Figure 1 As shown, the light guide structure 40 is an annular structure and is disposed around the first region Q1. During the laser cutting process, the light guide structure 40 can guide the laser light in a direction around the first region Q1 to reduce the impact of the laser on the circuit components in the first region Q1.

[0053] In another embodiment, Figure 10 A schematic diagram of another display panel provided by an embodiment of the present invention, such as Figure 10As shown, the boundary between the first region Q1 and the second region Q2 includes a corner boundary Y1 and a straight boundary Y2, and the corner boundary Y1 is located between the two straight boundaries Y2; wherein the straight boundary Y2, that is, the boundary line is basically a straight line, and the corner boundary Y1 is used to connect two straight boundaries Y2 with different extension directions. Figure 10 The light guide structure 40 includes four corner boundaries Y1 and four straight boundaries Y2. The light guide structure 40 includes a first light guide structure 41 and a second light guide structure 42. The first light guide structure 41 is adjacent to the corner boundary Y1; the second light guide structure 42 is adjacent to the straight boundary Y2. Figure 10 As shown in FIG. 1 , first light guide structures 41 are provided at positions adjacent to the four corner boundaries Y1 , and second light guide structures 42 are provided at positions adjacent to the four straight boundaries Y2 .

[0054] In another embodiment, the display panel only includes the first light guide structure 41 , which is disposed adjacent to at least one of the four corner boundaries Y1 .

[0055] In another embodiment, the display panel only includes the second light guide structure 42. The second light guide structure 42 is disposed at a position adjacent to at least one of the four straight line boundaries Y2.

[0056] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Figure 11 A schematic diagram of a display device provided by an embodiment of the present invention, such as Figure 11 As shown, the display device includes a display panel 100 provided by any embodiment of the present invention. The structure of the display panel 100 has been described in the above embodiment and will not be repeated here. The display device provided by the embodiment of the present invention can be any device with a display function, such as a mobile phone, tablet computer, laptop computer, television, smart watch, etc.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that: The display panel includes a first area and a second area surrounding the first area; The display panel includes a substrate, an array layer and a display layer, wherein the display layer is located on a side of the array layer away from the substrate, and the array layer and the display layer are located in the first area; The display panel also includes a light-guiding structure, which is located in the second area. The thickness of the light-guiding structure in a direction perpendicular to the plane of the substrate gradually increases from the first area to the second area, and the light-guiding structure is used to guide light incident from the side of the substrate away from the array layer to a direction away from the first area.

2. The display panel according to claim 1, wherein: The light guide structure and the array layer are located on the same side of the substrate.

3. The display panel according to claim 2, wherein: An edge of the light guide structure away from the first region is flush with an edge of the substrate.

4. The display panel according to claim 2, wherein: In a direction perpendicular to the plane of the substrate, the thickness of the array layer is d1, and the maximum thickness of the light guide structure is d2; wherein d2>d1.

5. The display panel according to claim 1, wherein: The substrate comprises a first surface away from the array layer and a second surface close to the array layer; A portion of the second surface in the second area is recessed toward the first surface to form a groove; and the substrate at the groove position is reused as the light guide structure.

6. The display panel according to claim 5, wherein: In a direction from the first area to the second area, n light guide structures are arranged in sequence, where n is an integer and n≥2.

7. The display panel according to claim 1, wherein: The substrate includes a first surface away from the array layer; the light-guiding structure includes a light-guiding surface; in the direction from the first area to the second area, the distance between the light-guiding surface and the first surface in a direction perpendicular to the plane of the substrate gradually increases; wherein, the light-guiding surface is a plane or a curved surface.

8. The display panel according to claim 7, wherein: The display panel further includes a reflective layer; the reflective layer covers the light guiding surface on a side away from the substrate.

9. The display panel according to claim 1, wherein: The display panel further includes a light-shielding barrier located in the second area. The light-shielding barrier and the array layer are located on the same side of the substrate. The light-shielding barrier is located between an edge of the array layer and the light guide structure.

10. The display panel according to claim 9, wherein: In a direction perpendicular to the plane of the substrate, the thickness of the array layer is d1, and the thickness of the light-shielding wall is d3; wherein d3>d1.

11. The display panel according to claim 9, wherein In a direction perpendicular to the plane of the substrate, the thickness of the light-shielding wall is d3, and the maximum thickness of the light-guiding structure is d2; wherein d3>d2.

12. The display panel according to claim 1, wherein The light guiding structure surrounds the first area.

13. The display panel according to claim 1, wherein The boundary between the first area and the second area includes a corner boundary and a straight line boundary, and the corner boundary is located between two straight line boundaries; The light guide structure includes a first light guide structure, the first light guide structure is adjacent to the corner boundary; and / or the light guide structure includes a second light guide structure, the second light guide structure is adjacent to the straight boundary.

14. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 13.

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