Electronic atomization assembly convenient to assemble and not easy to leak liquid and manufacturing method thereof

Abstract

The application provides an electronic atomization assembly which is not prone to liquid leakage and is convenient to assemble, comprising a base, a cover, a heating body, a liquid guide and an electrical connecting piece, the base is provided with a groove matched with the liquid guide, the base is an injection molding part, the base is fixed together with the heating body through in-mold injection molding, the heating body is arranged at the bottom of the groove, the fixed part is fixed in the base, the heating part is exposed in the groove, the liquid guide is soft and arranged in the groove and contacts the heating part, the cover covers the groove and is connected with the base and presses the liquid guide. The application also provides a manufacturing method of the electronic atomization assembly. In the application, the electronic atomization assembly adopts the soft liquid guide, has good liquid passing property and good liquid locking capacity, is not prone to liquid leakage, the base and the heating body are fixed together through in-mold injection molding, the heating body has strength and is not prone to deformation, the soft liquid guide is arranged in the groove of the base and fixed through the cover, the structure is stable and convenient for large-scale automatic production and manufacturing.

Description

Technical Field

[0001] This invention relates to the field of electronic atomization technology, and in particular to an electronic atomization component that is easy to assemble and does not easily leak, and its manufacturing method. Background Technology

[0002] Electronic atomization technology uses electrical heating to bring a liquid to its boiling point, producing atomized vapor. Currently, it's widely used in the e-cigarette industry. With the innovative development of atomization technology, it's also being applied to other fields, such as beauty and medicine. The core of atomization technology lies in the electronic atomization component, which mainly consists of a heating element and a liquid guide. Based on the material of the liquid guide, it's mainly divided into hard liquid guide materials like porous ceramics and soft liquid guide materials like cotton cloth. Hard liquid guide materials are used in electronic atomization components, where the heating element and liquid guide material are well integrated, and the porous material provides support for the heating element. This makes them easy to assemble. However, their fixed porous structure shape and size hinder the passage of many large molecules in the e-liquid, and it's difficult to achieve a balance between liquid supply and retention, easily leading to leakage problems. Soft liquid-conducting materials, such as soft liquid-conducting cotton, have good liquid permeability and good liquid-locking ability, making them less prone to leakage. However, due to the poor structural strength of the heating element, they are easily deformed. Combined with the soft liquid-conducting material, assembly is difficult, and mass production requires a lot of manual labor. Therefore, there is a need for a structure and production process that is not prone to leakage, has a stable structure that is not easily deformed, and is convenient for mass production, so that it can be applied on a large scale. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an electronic atomizing component that is easy to assemble and does not easily leak liquid, and a method for manufacturing the same, in view of the above-mentioned defects in the related technology.

[0004] The technical solution adopted by the present invention to solve its technical problem includes: providing an electronic atomizing component that is easy to assemble and does not easily leak, including a base, a cover, a heating element for heating the atomized liquid, a liquid guide for storing the liquid and conducting the liquid to the heating element, and an electrical connector for connecting to an external circuit. The base is provided with a groove that matches the liquid guide. The heating element is a conductive metal part and includes a fixing part, a heating part that heats up when energized and connected to the fixing part, and an electrode part connected to the heating part. The base is an injection molded part, and the base is fixed to the heating element by in-mold injection molding. The heating element is located at the bottom of the groove. The fixing part is fixed in the base and the heating part is exposed in the groove. The liquid guide is soft and is located in the groove, contacting the heating part. The cover covers the groove and is connected to the base, pressing down the liquid guide.

[0005] The substrate or the cover is provided with an inlet hole for the external liquid to contact the liquid guide. The electrical connector is provided on the substrate and electrically connected to the electrode part. The substrate is provided with a vent channel that communicates with the outside and passes through the heating part 41. The airflow in the vent channel carries the atomized liquid generated by the heating element to the outside of the electronic atomization assembly.

[0006] Preferably, the depth direction of the groove is along a first direction, the groove is open on both sides in a second direction, the cover is disposed on one side of the base in the first direction, the liquid guides are located on both sides of the open groove in the second direction, and the first direction is perpendicular to the second direction.

[0007] Preferably, the liquid guiding material has a single-layer structure; or the liquid guiding material has at least two layers stacked along the depth direction of the groove.

[0008] Preferably, the cover is superimposed on the liquid guide along the depth direction of the groove.

[0009] Preferably, the cover is fixed to the substrate by ultrasonic welding.

[0010] Preferably, the base is provided with a first positioning part, and the cover is provided with a second positioning part that cooperates with the first positioning part, so as to realize the positioning of the cover;

[0011] The cover is made of plastic, and the part of the cover that contacts the substrate has multiple protruding ultrasonic welding parts for ultrasonic welding; or the cover is made of metal, the first positioning part is protruding, the second positioning part is perforated, the first positioning part deforms after passing through the second positioning part, and locks the second positioning part to fix the cover.

[0012] Preferably, the liquid inlet is located on the cover.

[0013] Preferably, the vent is located below the groove and has an opening at the bottom of the groove. The fixing part of the heating element is located around the heating element and is fixed to the base around the opening of the vent at the bottom of the groove. The heating element is located in the opening of the vent at the bottom of the groove, and the liquid guide is located above the heating element, so that the heating element is exposed in the groove and in contact with the liquid guide.

[0014] Preferably, the heating element has a gap, and the atomized gas generated by the heating element enters the ventilation channel through the gap.

[0015] Preferably, the heating element is flat and arranged parallel to the bottom surface of the groove, and the side of the liquid-conducting element that contacts the heating element is also flat; or the bottom surface of the groove is curved, the heating element is curved corresponding to the bottom surface of the groove, and the side of the liquid-conducting element that contacts the heating element is also curved corresponding to the heating element.

[0016] Preferably, the heating element includes multiple first heating lines and multiple second heating lines arranged side by side, each second heating line being connected between two first heating lines, and the number of fixing parts is multiple and disposed at both ends of each first heating line.

[0017] Preferably, the fixing part is bent relative to the heating part.

[0018] Preferably, each of the fixing portions includes a first portion extending outward from the heating portion and a second portion protruding relative to the first portion.

[0019] Preferably, the outer side of the substrate is provided with a straight-deep electrical connector hole, the electrode portion of the heating element is located in the hole, and the electrical connector is inserted into the electrical connector hole to contact the electrode portion.

[0020] Preferably, the electrical connector hole extends to the lower side of the groove and the groove is open, and the electrode portion is bent relative to the heating portion and extends into the electrical connector hole.

[0021] The technical solution adopted by the present invention to solve its technical problem includes: providing a method for manufacturing the above-mentioned easy-to-assemble and leak-proof electronic atomizing component, comprising:

[0022] Step A: Provide a cover, a soft liquid conductor for storing liquid and conducting liquid to the heating element, a heating element for heating the atomized liquid, and an electrical connector for connecting to an external circuit. The heating element is a conductive metal part and includes a fixing part, a heating part connected to the fixing part that heats up when energized, and an electrode part connected to the heating part.

[0023] Step B: The heating element is placed in the injection mold. The substrate is fixed to the heating element by in-mold injection molding. The substrate is provided with a groove that matches the liquid guiding fluid. The heating element is located at the bottom of the groove and the heating part is exposed in the groove. The substrate is provided with a vent for carrying the atomized liquid generated by the heating element to the outside of the electronic atomization component.

[0024] Step C: Install the electrical connector on the substrate and electrically connect it to the electrode portion;

[0025] Step D: Place the conductive liquid in the tank and bring it into contact with the heating element;

[0026] Step E: Cover the groove with the cover and connect it to the base to press down the liquid guide, forming the electronic atomizing assembly. The base or the cover is provided with an inlet hole for external liquid to contact the liquid guide.

[0027] Preferably, the manufacturing method is used to manufacture at least two of the electronic atomizing components;

[0028] In step B: the depth direction of the groove is along the first direction, the groove is open on both sides in the second direction, and the open positions of each of the substrates are aligned;

[0029] In step D: one of the liquid-conducting agents is simultaneously placed in the groove of each of the substrates along the second direction;

[0030] The manufacturing method includes step F: cutting the liquid guide at a position between the two substrates to form at least two of the electronic atomizing components.

[0031] Preferably, the liquid guiding structure is a single layer or a structure of at least two layers stacked along the depth direction of the groove;

[0032] In step E: the cover is superimposed on the liquid guide along the depth direction of the groove.

[0033] Preferably, in step B, the outer side of the substrate is provided with a straight-deep electrical connector hole, and the electrode portion of the heating element is located in the hole; the electrical connector is inserted into the electrical connector hole to contact the electrode portion.

[0034] Preferably, the manufacturing method is used to manufacture at least two of the electronic atomizing components;

[0035] In step A: the metal material is processed into at least two heating elements;

[0036] In step A: the metal material is processed into at least two heating elements and a connecting part that connects each heating element. The heating elements are connected together through the connecting part. Each heating element includes a fixing part, a heating part, and an electrode part.

[0037] In step B: at least two substrates are formed by in-mold injection molding, which are respectively fixed together with each of the heating elements, and the connecting part is outside the substrates, and the substrates are connected together through the connecting part;

[0038] In step E: at least two of the covers are respectively placed over the grooves of each of the bases;

[0039] In step F: the connection between the heating element and the connecting part is cut off, so that the electronic atomizing component is separated from the connecting part.

[0040] The technical solution of the present invention has at least the following beneficial effects: the electronic atomization component uses a soft liquid guide, which has good liquid flowability, good liquid locking ability, and is not easy to leak. Moreover, the substrate and the heating element are solidified together by in-mold injection molding, which makes the heating element strong and not easy to deform. The soft liquid guide is placed in the groove of the substrate and fixed by the cover, which makes the structure stable and easy to manufacture in large-scale automated production. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a perspective view of an electronic atomizing component that is easy to assemble and does not easily leak, according to one embodiment of the present invention.

[0043] Figure 2 yes Figure 1 Exploded view of the electronic atomization component.

[0044] Figure 3 yes Figure 2 Exploded view of the substrate, heating element and electrical connectors of the electronic atomization component.

[0045] Figure 4 yes Figure 3 A three-dimensional diagram of the heating element.

[0046] Figure 5 yes Figure 4 A magnified view of part A in the middle.

[0047] Figure 6 yes Figure 1 A top view of the electronic atomizing component.

[0048] Figure 7 yes Figure 6 A cross-sectional view at position AA.

[0049] Figure 8 yes Figure 6 A cross-sectional view at position BB in the middle.

[0050] Figure 9 yes Figure 1 A perspective view of the substrate of a first embodiment of an electronic atomizing component.

[0051] Figure 10 yes Figure 1 A perspective view of the cover of the first embodiment of the electronic atomizing component.

[0052] Figure 11 yes Figure 1 A perspective view of the substrate of a second embodiment of the electronic atomization component.

[0053] Figure 12 yes Figure 1 A perspective view of the cover of a second embodiment of the electronic atomizing component.

[0054] Figure 13 This is a schematic diagram of step A of a method for manufacturing an electronic atomizing component that is easy to assemble and does not easily leak, according to one embodiment of the present invention.

[0055] Figure 14 This is a schematic diagram of step B of a method for manufacturing an electronic atomizing component that is easy to assemble and does not easily leak, according to one embodiment of the present invention.

[0056] Figure 15 This is a schematic diagram of step C of a method for manufacturing an electronic atomizing component that is easy to assemble and does not easily leak, according to one embodiment of the present invention.

[0057] Figure 16 This is a schematic diagram of steps D and E of a method for manufacturing an electronic atomizing component that is easy to assemble and does not easily leak, according to one embodiment of the present invention.

[0058] Figure 17 This is a schematic diagram of step F of a method for manufacturing an electronic atomizing component that is easy to assemble and does not easily leak, according to one embodiment of the present invention.

[0059] The labels in the diagram represent: base 1, first positioning part 11, groove 12, vent 13, electrical connector hole 14, cover 2, second positioning part 21, liquid inlet hole 22, ultrasonic welding part 23, liquid guide 3, heating element 4, heating part 41, first heating circuit 411, second heating circuit 412, electrode part 42, fixing part 43, first part 431, second part 432, gap 44, electrical connector 5, connecting part 6, first direction 71, second direction 72, third direction 73, and metal material 8. Detailed Implementation

[0060] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. It should be understood that if terms such as "upper," "lower," "top," "bottom," "inner," or "outer" appear in the text to indicate orientation or positional relationships, this refers to the orientation or positional relationships shown in the accompanying drawings, and the specific orientation in which the device or element is constructed and operated. This is merely for the convenience of describing the technical solution and does not indicate that the device or element referred to must have a specific orientation; therefore, it should not be construed as a limitation of the invention. It should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," "fixing," or "setting" appear in the text and should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements or the interaction between two elements. When an element is referred to as being "upper" or "lower" than another element, the element can be located "directly" or "indirectly" on top of the other element, or there may be one or more intermediary elements. If the terms "first," "second," "third," etc., appear in the text, they are merely for the convenience of describing the technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0061] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0062] See Figure 1-10An embodiment of the present invention provides an easy-to-assemble, leak-proof electronic atomizing component, comprising a base 1, a cover 2, a heating element 4 for heating the atomized liquid, a liquid guide 3 for storing the liquid and conducting the contacted liquid to the heating element 4, and an electrical connector 5 for connecting to an external circuit. The base 1 has a groove 12 that matches the liquid guide 3. The heating element 4 is a conductive metal component and includes a fixing part 43, a heating part 41 that connects to the fixing part 43 and heats up when energized, and a component connecting to the heating part 41. The electrode part 42, the base 1 is an injection molded part, the base 1 is fixed together with the heating element 4 by in-mold injection molding, the heating element 4 is provided at the bottom of the groove 12, the fixing part 43 is fixed in the base 1, the heating part 41 is exposed in the groove 12, the liquid guide 3 is soft and is provided in the groove 12 to position the liquid guide 3, the liquid guide 3 contacts the heating part 41, the cover 2 covers the groove 12 and connects to the base 1 to press the liquid guide 3, the base 1 and the cover 2 are hard to support the liquid guide 3 well;

[0063] The base 1 or cover 2 is provided with an inlet hole 22 for the external liquid to come into contact with the liquid 3. An electrical connector 5 is provided on the base 1 and electrically connected to the electrode part 42 of the heating element 4. The base 1 is provided with a vent 13 that connects to the outside and passes through the heating part 41 of the heating element 4. The airflow of the vent 13 carries the atomized liquid generated by the heating element 4 to the outside of the electronic atomization assembly.

[0064] The electronic atomizing component of the present invention, which is easy to assemble and not prone to leakage, has at least the following beneficial technical effects: the electronic atomizing component uses a soft liquid guide 3, which has good liquid permeability, good liquid locking ability, and is not prone to leakage. Moreover, the substrate 1 and the heating element 4 are fixed together by in-mold injection molding, which gives the heating element 4 strength and makes it not easy to deform. The soft liquid guide 3 is placed in the groove 12 of the substrate 1 and fixed by the cover 2, which makes the structure stable and easy to manufacture in large-scale automated production.

[0065] Among them, the liquid-conducting material 3 can be a porous material. The so-called porous material can also be called a microporous material, which has many micropores distributed in it to realize the absorption and conduction of liquid. Hard porous materials are porous ceramic bodies, and soft porous materials are liquid-conducting cotton.

[0066] The substrate 1 has a groove 12 for accommodating and positioning the conductive liquid 3, a fixing part 43 for fixing the heating element 4, and an electrode part 42 for the flow of current. When the electronic atomizing assembly is in operation, external liquid comes into contact with the conductive liquid 3 through the inlet hole 22. The conductive liquid 3 conducts the contacted liquid to the heating part 41 of the heating element 4. The electrical connector 5 is electrically connected to an external circuit. Current flows through the heating element 4, which heats and atomizes the liquid to produce a mist. The mist is carried out of the electronic atomizing assembly by the airflow through the ventilation channel 13.

[0067] Preferably, the depth direction of the groove 12 is along the first direction 71, and the groove 12 is open on both sides in the second direction 72. The cover 2 is disposed on one side of the substrate 1 in the first direction 71, and the liquid guide 3 is located on both sides of the open sides of the groove 12 in the second direction 72. The first direction 71 is perpendicular to the second direction 72. In this way, during the manufacturing process, the liquid guide 3 can be simultaneously disposed in the grooves 12 of multiple substrates 1 along the second direction 72, and then the liquid guide 3 can be cut at the position between each substrate 1 to form a separate electronic atomization component.

[0068] Preferably, the liquid guide 3 is a single-layer structure with a certain thickness; or the liquid guide 3 is sheet-like, and the liquid guide 3 is a structure of at least two layers superimposed along the depth direction of the groove 12, which can be made of soft fibrous woven fabric or cotton-like liquid guide material.

[0069] The cover 2 is stacked on the liquid guide 3 along the depth direction of the groove 12. The at least two-layer stacked structure of the liquid guide 3 and the stacking arrangement of the cover 2 facilitate automated mass production.

[0070] Preferably, the cover 2 is fixed to the base 1 by ultrasonic welding.

[0071] Preferably, the base 1 is provided with a first positioning part 11, and the cover 2 is provided with a second positioning part 21 that cooperates with the first positioning part 11. The first positioning part 11 and the second positioning part 21 are in concave-convex cooperation to realize the positioning of the cover 2; and the cover 2 is embedded in the base 1 so that the surface of the cover 2 is as flush as possible with the surface of the base 1.

[0072] In some embodiments, see Figure 9-10 Both the cover 2 and the base 1 are made of plastic. The contact area between the cover 2 and the base 1 is provided with multiple protruding linear ultrasonic welding parts 23 for ultrasonic welding. During assembly, the ultrasonic waves cause the ultrasonic welding parts 23 to melt, deform, and then solidify, thereby fixing the cover 2 to the base 1; or in other embodiments, see... Figure 11-12 The base 1 is made of plastic, and the cover 2 is made of metal. The first positioning part 11 is protruding, and the second positioning part 21 is perforated. After the first positioning part 11 passes through the second positioning part 21, it is melted and deformed by ultrasonic welding to lock the second positioning part 21 and fix the cover 2.

[0073] Preferably, the liquid inlet hole 22 is provided on the cover body 2 and penetrates the cover body 2 along the thickness direction of the cover body 2.

[0074] Preferably, the vent 13 is located below the groove 12 and opens at the bottom of the groove 12. The fixing part 43 of the heating element 4 is located around the heating part 41 and is fixed to the base 1 around the opening of the vent 13 at the bottom of the groove 12. The heating part 41 is located in the opening of the vent 13 at the bottom of the groove 12, and the liquid guide 3 is located above the heating part 41, so that the heating part 41 is exposed in the groove 12 and the upper side of the heating part 41 is in contact with the liquid guide 3. The heating part 41 is provided with a gap 44. The heating part 41 includes heating circuits, and the gap 44 is formed between the heating circuits. The atomized gas generated by the heating part 41 enters the vent 13 through the gap 44 and then enters the vent 13.

[0075] Preferably, the heating element 4 is planar. Specifically, the bottom surface of the groove 12 is planar, the heating part 41 of the heating element 4 is flat and is arranged parallel to the bottom surface of the groove 12, and the lower side of the liquid guide 3 that contacts the heating part 41 is also planar; or the bottom surface of the groove 12 is curved, the heating part 41 is curved corresponding to the bottom surface of the groove 12, and the lower side of the liquid guide 3 that contacts the heating part 41 is also curved corresponding to the heating part 41.

[0076] Preferably, the heating element 41 includes multiple parallel first heating lines 411 and multiple second heating lines 412. The first heating lines 411 are parallel to the third direction 73. Each second heating line 412 is connected between two first heating lines 411. Multiple fixing parts 43 are located at both ends of each first heating line 411 and are fixed to the base 1. This effectively fixes both ends of each first heating line 411, giving it sufficient strength to prevent deformation under stress during the assembly of the electronic atomizing component and the liquid guide 3. The fixing parts 43 surround the second heating lines 412. The second heating lines 412 effectively interrupt the circuit; current flows through the electrode part 42, the first heating lines 411, and the second heating lines 412, but not through the fixing parts 43. Therefore, the fixing parts 43 do not generate heat. The fixing part 43 is bent relative to the heating part 41, and can be bent at 90 degrees. When the heating part 41 is unfolded, the fixing part 43 and the first heating line 411 are on the same straight line. Each fixing part 43 includes a first part 431 extending outward from the heating part 41 and a second part 432 protruding relative to the first part 431. This structure of the fixing part 43 can enhance the bonding strength with the substrate 1.

[0077] Preferably, the outer side of the substrate 1 has a straight, deep electrical connector hole 14, in which the electrode portion 42 of the heating element 4 is located. The electrical connector 5 is rod-shaped and can be a pin. It is inserted into the electrical connector hole 14, pressed tightly, and contacts the electrode portion 42 to achieve electrical connection. With the electrical connector 5, it is unnecessary to solder additional pins to the electronic atomization component for connection with external circuits, and the size and specifications are more standardized and modular.

[0078] Preferably, the electrical connector hole 14 extends to the lower side of the groove 12 and is open to the groove 12. The electrode part 42 is bent relative to the heating part 41, and can be bent at 90 degrees, extending into the electrical connector hole 14 to facilitate contact with the electrical connector 5. Specifically, there are two electrode parts 42, respectively located on both sides of the heating part 41 and bent to the same side. There are also two electrical connector holes 14 and two electrical connectors 5, located below the heating element 4 and on both sides of the vent 13. The two electrode parts 42 are located in the two electrical connector holes 14, and the two electrical connectors 5 are respectively inserted into the two electrical connectors 14, contacting the two electrode parts 42. A portion of the electrical connector 5 protrudes from the base 1 for connection to an external circuit. One electrical connector 5 and electrode are used for current inflow, and the other electrical connector 5 and electrode are used for current outflow. Furthermore, the two electrical connector holes 14 are located on the same side of the base 1 to facilitate connection to an external circuit.

[0079] In summary, the electronic atomizing component of this invention, which is easy to assemble and less prone to leakage, has a stable structure and is easy to manufacture in large-scale automated production.

[0080] 1. The base 1 and the heating element 4 are fixed together by in-mold injection molding, which gives the heating element 4 strength and makes it less prone to deformation;

[0081] 2. The soft liquid guide 3 has good liquid permeability and liquid locking ability, and is not easy to leak. Moreover, the liquid guide 3 is set in the groove 12 of the base 1 and fixed by the cover 2. The liquid guide 3 is a single layer with a certain thickness or a multi-layer structure stacked along the depth direction of the groove 12.

[0082] 3. The electrical connector 5 is inserted into the electrical connector hole 14 of the base 1 and fixed, and makes contact with the motor of the heating element 4 to conduct electricity;

[0083] 4. The cover 2 is superimposed on the liquid guide 3 along the depth direction of the groove 12 and welded to the base 1 by ultrasonic welding.

[0084] See Figure 13-17 A method for manufacturing an electronic atomizing component according to one embodiment of the present invention includes:

[0085] Step A: Provide a cover 2, a soft liquid-conducting material 3 for storing liquid and conducting the contacted liquid to the heating element 4, a heating element 4 for heating the atomized liquid, and an electrical connector 5 for connecting to an external circuit. The heating element 4 is a conductive metal part and includes a fixing part 43, a heating part 41 that heats up when energized and is connected to the fixing part 43, and an electrode part 42 that is connected to the heating part 41.

[0086] Step B: The heating element 4 is placed in the injection mold. The base 1 is fixed to the heating element 4 by in-mold injection molding. The base 1 is provided with a groove 12 that matches the liquid guide 3. The heating element 4 is located at the bottom of the groove 12, and the heating part 41 is exposed in the groove 12. The base 1 is provided with a vent 13 that connects to the outside for carrying the atomized liquid generated by the heating element 4 to the outside of the electronic atomization component. Since the base 1 and the heating element 4 are fixed together, the heating element 4 has strength and is not easily deformed in subsequent automated assembly operations.

[0087] Step C: Install the electrical connector 5 on the base 1 and electrically connect it to the electrode part 42 of the heating element 4;

[0088] Step D: Place the liquid guide 3 in the tank 12 to position the liquid guide 3, and make the liquid guide 3 contact the heating element 41;

[0089] Step E: Cover the groove 12 with the cover 2 and connect it to the base 1 to press down the liquid guide 3. The base 1 and the cover 2 are rigid to support the liquid guide 3 well and form an electronic atomizing assembly. The base 1 or the cover 2 is provided with an inlet hole 22 for the external liquid to contact the liquid guide 3.

[0090] The manufacturing method of the electronic atomizing component of the present invention, which is easy to assemble and not prone to leakage, has beneficial technical effects: the substrate 1 and the heating element 4 are solidified together by in-mold injection molding, which makes the heating element 4 strong and not easy to deform. The soft liquid guide 3 is placed in the groove 12 of the substrate 1 and fixed by the cover 2, which makes the structure stable and easy to manufacture in large-scale automated production.

[0091] See Figure 14-17 Preferably, the manufacturing method is used to manufacture at least two electronic atomizing components;

[0092] In step B: the depth direction of the groove 12 is along the first direction 71, the groove 12 is open on both sides in the second direction 72 and the open positions of each substrate 1 are aligned;

[0093] In step D: A long strip of liquid-conducting material 3 is simultaneously placed in the groove 12 of each substrate 1 along the second direction 72;

[0094] The manufacturing method includes step F: cutting the liquid guide 3 at a position between two substrates 1 to form at least two electronic atomizing components.

[0095] See Figure 16 Preferably, the liquid guide 3 is a single-layer structure or at least two-layer structures superimposed along the depth direction of the groove 12;

[0096] In step E: the cover 2 is superimposed on the liquid guide 3 along the depth direction of the groove 12 and welded to the base 1 by ultrasonic welding.

[0097] See Figure 14-15 Preferably, in step B, the outer side of the substrate 1 has an electrical connector hole 14 that extends directly into the substrate 1, and the electrode portion 42 of the heating element 4 is located in the hole; the electrical connector 5 is rod-shaped and can be a pin, which is inserted into the electrical connector hole 14 to press and contact the electrode portion 42, thereby achieving electrical connection. With the electrical connector 5, it is unnecessary to solder additional pins to the electronic atomization component for connection with external circuits, and the size and specifications are more standardized and modular.

[0098] See Figure 13-17 Preferably, the manufacturing method is used to manufacture at least two electronic atomizing components;

[0099] In step A: a piece of metal material 8 is processed into at least two heating elements 4. The number of cover 2, heating elements 4 and electrical connectors 5 corresponds to the number of electronic atomizing components manufactured. Specifically, the sheet metal material 8 can be stamped, etched or laser-cut to form the heating circuit of the heating part 41 of the heating element 4. The parts that need to be bent (fixing part 43 and electrode part 42, etc.) are bent by a mold. The heating part 41 is planar or flat, while the heating element 4 as a whole is roughly planar.

[0100] In step A: the sheet metal material 8 is processed into at least two heating elements 4 and a connecting part 6 that connects each heating element 4. Each heating element 4 is connected together through the connecting part 6. The connecting part 6 is located on the same side of each heating element 4. Each heating element 4 includes a fixing part 43, a heating part 41 and an electrode part 42.

[0101] In step B: At least two bases 1 are formed by in-mold injection molding and are respectively fixed together with each heating element 4. The connecting part 6 is outside the base 1 and on the same side of each base 1. The bases 1 are connected together through the connecting part 6.

[0102] In step E: at least two covers 2 are respectively placed on the grooves 12 of each base 1;

[0103] In step F: the connection between the heating element 4 and the connecting part 6 is cut off, so that the electronic atomizing component is separated from the connecting part 6.

[0104] In summary, the manufacturing method of the electronic atomizing component of the present invention, which is easy to assemble and less prone to leakage, is suitable for large-scale automated production.

[0105] 1. The base 1 and the heating element 4 are fixed together by in-mold injection molding, which gives the heating element 4 strength and makes it less prone to deformation;

[0106] 2. The soft liquid guide 3 has good liquid permeability and liquid locking ability, and is not easy to leak. Moreover, the liquid guide 3 is set in the groove 12 of the base 1 and fixed by the cover 2. The liquid guide 3 is a single layer with a certain thickness or a multi-layer structure stacked along the depth direction of the groove 12.

[0107] 3. The electrical connector 5 is inserted into the electrical connector hole 14 of the base 1 and fixed, and makes contact with the motor of the heating element 4 to conduct electricity;

[0108] 4. The cover 2 is superimposed on the liquid guide 3 along the depth direction of the groove 12 and welded to the base 1 by ultrasonic welding.

[0109] The electronic atomization component of the present invention can be applied to electronic cigarettes to heat and atomize e-liquid.

[0110] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. For those skilled in the art, the present invention can have various modifications, combinations, and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An electronic atomizing component that is easy to assemble and leak-proof, characterized in that, The device includes a base (1), a cover (2), a heating element (4) for heating the atomized liquid, a liquid-conducting part (3) for storing the liquid and conducting the liquid to the heating element (4), and an electrical connector (5) for connecting to an external circuit. The base (1) has a groove (12) that matches the liquid-conducting part (3). The heating element (4) is a conductive metal part and includes a fixing part (43), a heating part (41) that heats up when energized and connects to the fixing part (43), and a connector (42) that connects to the heating part (43). 1) The electrode part (42), the base (1) is an injection molded part, the base (1) is fixed together with the heating element (4) by in-mold injection molding, the heating element (4) is provided at the bottom of the groove (12), the fixing part (43) is fixed in the base (1), the heating part (41) is exposed in the groove (12), the guiding liquid (3) is soft and provided in the groove (12), contacting the heating part (41), the cover (2) covers the groove (12). And connect the base (1) to press down the liquid guide (3); the depth direction of the groove (12) is along the first direction (71), the groove (12) is open on both sides in the second direction (72), the cover (2) is provided on one side of the base (1) in the first direction (71), the two sides of the liquid guide (3) in the second direction (72) are located in the open sides of the groove (12) and extend out of the base (1) along the second direction (72), the first direction (71) is open on both sides of the groove (12) in the second direction (72), the depth direction of the groove (12) is along the first direction (71) to press down the liquid guide (3); ... 1) Perpendicular to the second direction (72); the outer side of the substrate (1) is provided with a straight-deep electrical connector hole (14), the electrical connector hole (14) extends into the lower side of the groove (12) and is open to the groove (12) from the side, the electrode part (42) of the heating element (4) extends into the electrical connector hole (14) from the opening of the electrical connector hole (14), and the electrical connector (5) is inserted into the electrical connector hole (14) to contact the electrode part (42); The substrate (1) or the cover (2) is provided with an inlet hole (22) for the external liquid to contact the liquid (3) from the outside. The electrical connector (5) is provided on the substrate (1) and electrically connected to the electrode part (42). The substrate (1) is provided with a vent (13) that connects to the outside and passes through the heating part (41). The airflow of the vent (13) carries the atomized liquid generated by the heating element (4) to the outside of the electronic atomization assembly.

2. The electronic atomizing component according to claim 1, characterized in that, The liquid guiding (3) is a single-layer structure; or the liquid guiding (3) is a structure of at least two layers superimposed along the depth direction of the groove (12).

3. The electronic atomizing component according to claim 2, characterized in that, The cover (2) is superimposed on the liquid guide (3) along the depth direction of the groove (12).

4. The electronic atomizing component according to claim 1, characterized in that, The cover (2) is fixed to the base (1) by ultrasonic welding.

5. The electronic atomizing component according to claim 4, characterized in that, The base (1) is provided with a first positioning part (11), and the cover (2) is provided with a second positioning part (21) that cooperates with the first positioning part (11) to realize the positioning of the cover (2); The cover (2) is made of plastic, and the part of the cover (2) that contacts the base (1) is provided with multiple protruding ultrasonic welding parts (23) for ultrasonic welding; or the cover (2) is made of metal, the first positioning part (11) is protruding, the second positioning part (21) is perforated, the first positioning part (11) passes through the second positioning part (21) and is melted and deformed by ultrasonic welding to lock the second positioning part (21) and fix the cover (2).

6. The electronic atomizing component according to claim 1, characterized in that, The liquid inlet (22) is located on the cover (2).

7. The electronic atomizing component according to claim 1, characterized in that, The ventilation channel (13) is located below the groove (12) and has an opening at the bottom of the groove (12). The fixing part (43) of the heating element (4) is located around the heating part (41) and is fixed to the base (1) around the opening of the ventilation channel (13) at the bottom of the groove (12). The heating part (41) is located in the opening of the ventilation channel (13) at the bottom of the groove (12). The liquid guide (3) is located above the heating part (41), so that the heating part (41) is exposed in the groove (12) and in contact with the liquid guide (3).

8. The electronic atomizing component according to claim 7, characterized in that, The heating element (41) has a gap (44), and the gas mist generated by the heating element (41) through the gap (44) enters the ventilation channel (13) and then enters the ventilation channel (13).

9. The electronic atomizing component according to claim 1, characterized in that, The heating element (41) is flat and is arranged parallel to the bottom surface of the groove (12). The side of the liquid guide (3) that contacts the heating element (41) is also flat. Alternatively, the bottom surface of the groove (12) is curved, the heating element (41) is curved and corresponds to the bottom surface of the groove (12), and the side of the liquid guide (3) that contacts the heating element (41) is also curved and corresponds to the heating element (41).

10. The electronic atomizing component according to claim 9, characterized in that, The heating element (41) includes multiple parallel first heating lines (411) and multiple second heating lines (412), each second heating line (412) is connected between two first heating lines (411), and the number of fixing parts (43) is multiple and is provided at both ends of each first heating line (411).

11. The electronic atomizing component according to claim 9, characterized in that, The fixing part (43) is bent relative to the heating part (41).

12. The electronic atomizing component according to claim 9, characterized in that, Each of the fixing parts (43) includes a first part (431) extending outward from the heating part (41) and a second part (432) protruding relative to the first part (431).

13. The electronic atomizing component according to any one of claims 1-12, characterized in that, There are two electrode parts (42), which are respectively located on both sides of the heating part (41) and bent to the same side. There are two electrical connector holes (14) and two electrical connectors (5), which are located below the heating element (4) and on both sides of the ventilation channel (13). The two electrode parts (42) are respectively located in the two electrical connector holes (14). The two electrical connectors (5) are respectively inserted into the two electrical connectors (5) and contact the two electrode parts (42). A part of the electrical connector (5) is exposed outside the base (1). The two electrical connector holes (14) are located on the same side of the base (1).

14. The electronic atomizing component according to claim 13, characterized in that, The electrode portion (42) is bent relative to the heating portion (41) and extends into the electrical connector hole (14).

15. A method for manufacturing an electronic atomizing component according to any one of claims 1-14, characterized in that, The manufacturing method is used to manufacture at least two of the electronic atomizing components, and the manufacturing method of the electronic atomizing components includes: Step A: Provide a cover (2), a soft liquid-conducting material (3) for storing liquid and conducting liquid to the heating element (4), a heating element (4) for heating the atomized liquid, and an electrical connector (5) for connecting to an external circuit. The heating element (4) is a conductive metal part and includes a fixing part (43), a heating part (41) that heats up when energized and is connected to the fixing part (43), and an electrode part (42) that is connected to the heating part (41). Step B: Place the heating element (4) in the injection mold. The substrate (1) is fixed to the heating element (4) by in-mold injection molding. The substrate (1) is provided with a groove (12) that matches the liquid guide (3). The heating element (4) is located at the bottom of the groove (12). The heating part (41) is exposed in the groove (12). The outer side of the substrate (1) is provided with a straight-in-depth electrical connector hole (14). The electrical connector hole (14) extends into the lower side of the groove (12) and faces the groove (12) from the side. 2) Open, the electrode part (42) of the heating element (4) extends into the electrical connector hole (14) from the open part of the electrical connector hole (14), and the substrate (1) is provided with a vent (13) for carrying the atomized liquid generated by the heating element (4) to the outside of the electronic atomization assembly; in step B: the depth direction of the groove (12) is along the first direction (71), the groove (12) is open on both sides in the second direction (72) and the open positions of each substrate (1) are aligned; Step C: Install the electrical connector (5) on the substrate (1) and electrically connect it to the electrode part (42); Step D: Place the conductive liquid (3) in the groove (12) and contact the heating element (41) so that the conductive liquid (3) extends along the second direction (72) and is located in the groove (12) of each of the substrates (1); In step D: simultaneously place one of the conductive liquids (3) along the second direction (72) in the groove (12) of each of the substrates (1); Step E: Cover the groove (12) with the cover (2) and connect it to the base (1) to press down the liquid guide (3) and form the electronic atomizing component. The base (1) or the cover (2) is provided with an inlet hole (22) for external liquid to contact the liquid guide (3) from the outside. Step F: Cut the liquid guide (3) at a position between the two substrates (1) to form at least two of the electronic atomizing components.

16. The manufacturing method according to claim 15, characterized in that, The liquid guiding (3) is a single-layer structure or a structure of at least two layers superimposed along the depth direction of the groove (12); In step E: the cover (2) is superimposed on the liquid guide (3) along the depth direction of the groove (12).

17. The manufacturing method according to any one of claims 15-16, characterized in that, In step B, the electrode portion (42) is bent relative to the heating portion (41) and extends into the electrical connector hole (14).

18. The manufacturing method according to any one of claims 15-16, characterized in that, The manufacturing method is used to manufacture at least two of the electronic atomizing components; In step A: the metal material (8) is processed into at least two of the heating elements (4); In step A: the metal material (8) is processed into at least two heating elements (4) and a connecting part (6) that connects each heating element (4). Each heating element (4) is connected together through the connecting part (6). Each heating element (4) includes the fixing part (43), the heating part (41) and the electrode part (42). In step B: at least two substrates (1) are formed by in-mold injection molding and are respectively fixed together with each of the heating elements (4), the connecting part (6) is outside the substrate (1), and the substrates (1) are connected together through the connecting part (6); In step E: at least two of the covers (2) are respectively placed on the grooves (12) of each of the bases (1); The manufacturing method includes step F: cutting off the connection between the heating element (4) and the connecting part (6) to separate the electronic atomizing component from the connecting part (6).

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