Method for processing a quartz product

Abstract

This invention relates to a method for processing quartz products. The product is cut to the required thickness, then ground and cleaned. It is then placed on a support platform composed of multiple graphite pillars, and a laser machine is used to process the outer rectangular, inner rectangular, circular, or small hole contours. The laser-cut product is then annealed. This invention uses a laser machine to replace traditional lathes and machining centers. The simple graphite pillar support and clamping method greatly saves clamping time. The continuous emission of the laser beam reduces tool wear. The negligible beam size perfectly solves the problem of incomplete machining caused by tool radius angles when machining small or even right angles. This method offers the benefits of reduced processing time, increased yield, and reduced processing costs.

Description

Technical Field

[0001] This invention relates to the field of quartz product technology, specifically to a method for processing quartz products. Background Technology

[0002] Quartz is an important semiconductor auxiliary material, widely used in wafer processing. Quartz glass is widely used in semiconductor chip manufacturing due to its excellent properties such as high purity, high temperature resistance, low thermal expansion, and strong chemical stability. The traditional processing of quartz product contours uses lathes, machining centers, etc., but this method has drawbacks such as long production time, high tool wear, and low yield. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for processing quartz products, which uses a laser machine to replace the traditional lathe and machining center processing methods, and the clamping method supported by graphite pillars can save clamping time, and the continuous emission of the laser beam can save tool wear.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a method for processing quartz products, wherein the product is cut to the required thickness, then ground and cleaned, and then placed on a support platform composed of multiple graphite pillars, and the outer rectangular outline, inner rectangular outline, circular outline or small hole is processed by a laser machine, and the laser-cut product is annealed.

[0005] Based on the above scheme, when the laser machine processes the outer rectangular contour, it sets the advance and retraction of the blade to a straight line of 1mm, and the blade advances and retracts in a straight line parallel to the product surface at the corner of the rectangle.

[0006] Based on the above scheme, the laser machine performs circular contour processing for circular contours with a diameter greater than 2mm. This is achieved by setting an arc with an advance and retraction radius of 1mm, allowing the laser machine to advance and retract at any point on the circle.

[0007] Based on the above scheme, the laser machine performs small hole processing to process round holes with a diameter of less than 2mm by spiral cutting from the center to the outline of the round hole.

[0008] Based on the above scheme, the flat grinding process involves first performing double-sided rough grinding on the product, followed by double-sided fine grinding, with the same grinding amount in both rough and fine grinding.

[0009] Based on the above scheme, the flat grinding and cleaning process includes first degreasing and cleaning, followed by rinsing with HF and pure water;

[0010] Degreasing and cleaning: Place the product in a cleaning tank with 5% UTACK powder for 10-15 minutes and clean it. After cleaning, blow it dry.

[0011] HF and pure water washing: Place the product in a washing tank with a hydrofluoric acid concentration of 4-5% for 5-10 minutes. After acid washing, place it in a pure water tank for 5-10 minutes and then blow it dry.

[0012] Based on the above scheme, the product is chamfered after the annealing process.

[0013] Based on the above scheme, after the chamfering process, the product is placed in a washing tank with UTACK powder at a concentration of 5% for 10-15 minutes for cleaning, and then dried after cleaning.

[0014] Compared with existing technologies, the advantages of this invention are as follows: This invention uses a laser machine to replace traditional lathes and machining centers; the simple graphite pillar support clamping method greatly saves clamping time; the continuous emission of the laser beam saves tool wear; and the negligible beam size perfectly solves the problem of incomplete machining caused by tool radius angles when machining small radius angles or even right angles. It offers the benefits of reduced machining time, increased yield, and reduced machining costs. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0016] This embodiment provides a method for processing quartz products, including the following steps:

[0017] S1: Material cutting. The product is cut to the required thickness. The optimal thickness allowance for sawing is 0.8mm. Too much allowance will increase the time of subsequent grinding, while too little allowance will not be conducive to ensuring the flatness of the product. The optimal thickness allowance for water jet cutting is 3mm on each side. Too much allowance will easily lead to excessive accumulation of residual material in subsequent processing, which will scratch and chip the product surface. Too little allowance will easily cause poor contour surface.

[0018] S2: Flat grinding, using the AA standard grinding rule, which means that according to the allowance, the grinding amount of rough grinding and fine grinding is the same. For example, when cutting with the optimal allowance of 0.8mm, the rough grinding uses a 140# grinding head to grind on both sides for a total allowance of 0.4mm, and the fine grinding uses a 325# grinding head to grind on both sides for a total allowance of 0.4mm. The product surface appearance, roughness, flatness, etc. are optimal.

[0019] S3: Degreasing and cleaning. Place the product in a cleaning tank with a 5% concentration of degreasing powder and clean for 10-15 minutes. After cleaning, blow dry with an air gun.

[0020] S4: Clean with hydrofluoric acid and pure water. Place the product in a cleaning tank with a hydrofluoric acid concentration of 4-5% for 5-10 minutes. After acid cleaning, place it in a pure water tank for 5-10 minutes. After cleaning, blow dry with an air gun.

[0021] S5: Product clamping, placing the product on the graphite pillars for cutting; multiple graphite pillars together form a stable support platform;

[0022] S6: When the laser machine processes an external rectangular contour, the external rectangular contour processing settings are as follows:

[0023] (1) Machining coordinate system settings: Set at the lower right corner of the rectangle, with the long side as the X-axis and the short side as the Y-axis. The laser tool setting is 2mm above the product. Based on the laser machine's mechanical coordinate system, the long side is set to X and the short side to Y. The optimal Z-axis setting is 2mm above the product. If the height is lower than 2mm, collisions are likely to occur, and the burn marks will be more obvious when the beam is too close to the product. If the height is set too high, the laser beam will be more dispersed, and the flatness of the product will be poor.

[0024] (2) Tool settings: Set the tool diameter and tool number to 0. The tool radius compensation value is set in the tool half compensation column in the laser machine. In the program, set G41 / G42 (G41 / G42 is the code to retrieve compensation) and DXX (XX represents the compensation column number in the laser machine) to retrieve the compensation value.

[0025] (3) Set the feed and retraction speed to a 1mm straight line, and perform the feed and retraction parallel to the product surface at the corners of the rectangle. When the laser beam first contacts the surface of the quartz product, it easily causes burn marks. When cutting the outline of a rectangular product, by setting the feed and retraction speed to a 1mm straight line and performing the feed and retraction parallel to the product surface at the corners of the rectangle, the resulting feed and retraction marks are less noticeable or even nonexistent. The parameter settings are based on a plate thickness T2 as an example:

[0026] 200 130 0.1 0.03 0 250 140 0.1 0.03 0 300 150 0.1 0.03 0

[0027] When a laser machine processes an inner rectangular contour:

[0028] When cutting the inner rectangular contour of a product, traditional machining center processing methods suffer from incomplete machining at corners due to the tool radius, especially when machining small radius angles or even right angles. The negligible beam size, however, is perfectly solved by the cutting trajectory designed according to the contour when machining small radius angles or even right angles. This reduces production time and improves production efficiency and quality.

[0029] Products that require machining of the inner rectangular contour often also require machining of the outer contour. The product coordinate system is set according to the shape of the outer contour (i.e., when the outer contour is rectangular, the coordinate system described for rectangular contours is used; when the outer contour is circular, the coordinate system described for circular contours is used). By setting the tool entry and exit to a radius R1mm arc, the tool can enter and exit at any point of the inner rectangle using an arc. If the corner of the inner rectangle is rounded, setting the tool entry and exit point at the tangent point of the rounded corner will yield the best results. Other tool parameters are consistent with the rectangular contour machining method.

[0030] When the laser machine processes a circular outline (a circular product larger than φ2mm), the circular outline processing settings are as follows:

[0031] (1) Machining coordinate system setting: Set at the center of the product, with the laser tool setting 2mm above the product; the Z-axis setting is best at 2mm above the product. If it is less than 2mm, collisions are likely to occur and the burn marks will be more obvious when the beam is too close to the product. If the height is set too high, the laser beam will be more dispersed and the flatness of the product will be poor.

[0032] (2) Tool settings: Set the tool diameter and tool number to 0. The tool radius compensation value is set in the tool half compensation column in the laser machine. In the program, set G41 / G42 (G41 / G42 is the code to retrieve compensation) and DXX (XX represents the compensation column number in the laser machine) to retrieve the compensation value.

[0033] (3) By setting the advance and retraction of the tool to an arc with a radius of R1mm, the tool can advance and retract at any point on the circle, resulting in a smooth transition. When the laser beam first contacts the surface of the quartz product, it is easy to cause burn marks. By setting the advance and retraction of the tool to an arc with a radius of R1mm, the tool can advance and retract at any point on the circle, resulting in a smooth transition and the resulting advance and retraction marks are not obvious or even non-existent; the other parameter settings are the same as the rectangular outline settings.

[0034] When laser cutting small holes, especially those smaller than φ2mm, the small size of the hole makes it difficult to remove excess material using conventional circular contour cutting methods. This can lead to defects such as chipped holes and insufficient roundness. Therefore, a spiral cutting method starting from the center and proceeding to the hole contour completely melts away the quartz residue, reducing defective products. For spiral cutting, the coordinate system and tool settings are the same as for circular contour cutting. Before spiral cutting, a hole must first be drilled at the center, allowing excess material to fall towards the center during spiral cutting, resulting in a better hole appearance. The parameters (taking thickness T2 as an example) are as follows:

[0035] perforation 30 0.5 0.35 0.05 2 Spiral cutting 110 20 18 0.05 /

[0036] S7: Annealing: Laser-cut products are placed in an annealing furnace for annealing treatment; the annealing furnace temperature reaches about 1150℃, and the annealing time varies depending on the size of the product.

[0037] S8: Chamfering: Place the product on the grinding disc and chamfer it according to the drawing requirements.

[0038] S9: Degreasing and cleaning: Place the product in a cleaning tank with UTACK powder at a concentration of 5% for 10-15 minutes and clean it. After cleaning, blow it dry with an air gun.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for processing quartz products, wherein the product is cut to the required thickness, then ground and cleaned, characterized in that: Then, the product is placed on a support platform composed of multiple graphite pillars, and a laser machine is used to process the outer rectangular outline, inner rectangular outline, circular outline, or small holes. The laser-cut product is then annealed. The flat grinding process involves first performing double-sided rough grinding on the product, followed by double-sided fine grinding, with the same grinding amount in both processes. The flat grinding and cleaning process includes first degreasing and cleaning, followed by rinsing with HF and pure water; Degreasing and cleaning: Place the product in a cleaning tank with 5% UTACK powder for 10-15 minutes and clean it. After cleaning, blow it dry. Hydrofluoric acid and pure water cleaning: Put the product into a cleaning tank with a hydrofluoric acid concentration of 4-5% for 5-10 minutes. After acid washing, put it into a pure water tank for 5-10 minutes. After cleaning, blow it dry. When the laser machine processes the outer rectangular contour, it sets the advance and retraction of the blade to a straight line of 1mm, and the blade advances and retracts in a straight line parallel to the product surface at the corner of the rectangle. The laser machine performs circular contour processing for circles with a diameter greater than 2mm. It sets an arc with an infeed and retraction radius of 1mm and performs the infeed and retraction of the tool at any point on the circle. The laser machine performs small hole processing to process round holes with a diameter of less than 2mm by spiral cutting from the center to the outline of the round hole. During laser cutting, the output power is 200-300W, the speed is 130-150mmpm, the correction is 0.1mm, the air pressure is 0.03Pa, and the focal point is 0. After the annealing process, the product is chamfered; after the chamfering, the product is placed in a cleaning tank with UTACK powder at a concentration of 5% for 10-15 minutes for cleaning, and then dried after cleaning.