Linear Lamp Array for Improved Thermal Uniformity and Profile Control

Abstract

The present disclosure provides methods and apparatuses for an upper reflector assembly for use in a processing chamber. In some embodiments, an upper reflector assembly for use in a processing chamber includes: a reflector mounting ring; and an upper reflector plate coupled to the reflector mounting ring and having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels that extend across the lower surface substantially parallel to each other, and wherein the upper reflector plate includes air cooling slots that extend from the upper surface to the lower surface.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to substrate processing equipment. Background Art

[0002] Some methods of processing substrates (e.g., epitaxial deposition processes) may be sensitive to the temperature in the processing environment of the processing chamber. For example, one or more components that may affect the temperature of the processing environment may be the chamber walls and / or surfaces that may exchange heat with the processing environment. However, a lack of thermal control in an epitaxial deposition chamber can result in non-uniform thickness and concentration of the material deposited on the substrate.

[0003] Accordingly, the inventors provide an improved apparatus for heating and temperature management in a substrate processing system. Summary of the Invention

[0004] Methods and apparatus for an upper reflector assembly for use in a processing chamber are provided herein. In some embodiments, an upper reflector assembly for use in a processing chamber includes: a reflector mounting ring; and an upper reflector plate coupled to the reflector mounting ring and having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes air cooling slots extending from the upper surface to the lower surface.

[0005] In some embodiments, an upper lamp module includes: an upper reflector assembly including a reflector mounting ring coupled to an upper reflector plate having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes air cooling slots extending from the upper surface to the lower surface, and a shroud assembly including a housing body coupled to a lamp mounting ring and a plurality of linear heating lamps coupled to the lamp mounting ring, wherein the lamp mounting ring is removably coupled to the reflector mounting ring, and wherein the plurality of linear heating lamps extend within the plurality of linear channels to reflect heat away from the sidewalls of the plurality of linear channels.

[0006] In some embodiments, an epitaxial chamber includes: a chamber body coupled to an upper dome and a lower dome to define a processing volume of the epitaxial chamber; a support pedestal disposed within an interior volume to support a substrate; an upper reflector plate coupled to the chamber body above the upper dome and having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes air cooling slots extending from the upper surface to the lower surface; and a shroud assembly including a lamp mounting ring and a plurality of linear heating lamps coupled to the lamp mounting ring, wherein the plurality of linear heating lamps extend within the plurality of linear channels to reflect heat away from sidewalls of the plurality of linear channels toward the upper dome.

[0007] Other and further embodiments of the present disclosure are described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The embodiments of the present disclosure outlined briefly above and discussed in more detail below may be understood by reference to the illustrative embodiments of the present disclosure depicted in the drawings. However, the drawings only show typical embodiments of the present disclosure and should not be regarded as limiting the scope, as the present disclosure may admit other equivalent embodiments.

[0009] Figure 1 A schematic side view of a processing chamber in accordance with some embodiments of the present disclosure is depicted.

[0010] Figure 2 A partial schematic side view of a processing chamber in accordance with some embodiments of the present disclosure is depicted.

[0011] Figure 3 An isometric cross-sectional view of a processing chamber in accordance with some embodiments of the present disclosure is depicted.

[0012] Figure 4 An isometric view of a lamp clamping mechanism in accordance with some embodiments of the present disclosure is depicted.

[0013] Figure 5 An isometric view of a lamp clamping mechanism in accordance with some embodiments of the present disclosure is depicted.

[0014] Figure 6 A partial isometric cross-sectional view of an upper lamp module in accordance with some embodiments of the present disclosure is depicted.

[0015] Figure 7 A partial isometric cross-sectional view of an upper lamp module in accordance with some embodiments of the present disclosure is depicted.

[0016] For ease of understanding, the same reference numerals have been used, where possible, to denote like elements common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated into other embodiments without further recitation. Detailed Description

[0017] Embodiments of an upper lamp module for use in a substrate processing chamber are provided herein. The upper lamp module includes an upper reflector assembly having a reflector coupled to a shroud assembly having a plurality of linear heating lamps. The reflector is advantageously shaped to focus energy from the plurality of linear heating lamps to a specific location on the surface of a substrate to be processed to improve thermal uniformity and profile control.

[0018] Figure 1 A schematic side view of a processing chamber 100 in accordance with some embodiments of the present disclosure is depicted. In some embodiments, the processing chamber 100 may be a suitably modified commercially available processing chamber, such as any epitaxial deposition reactor available from Applied Materials, Inc. of Santa Clara, California (e.g., any of the EPI series products), or any suitable semiconductor processing chamber that uses heating lamps as described herein. Other processing chambers using heating lamp assemblies may also benefit from the teachings provided herein.

[0019] In some embodiments, the processing chamber 100 is an epitaxial deposition chamber. The processing chamber 100 generally may include a chamber body 110, a support system 130, a controller 140, and a power source 150. The chamber body 110 generally includes an upper portion 102, a lower portion 104, and a housing 120. A vacuum system 123 may be coupled to the chamber body 110 to facilitate maintaining a desired pressure within the chamber body 110. In some embodiments, the vacuum system 123 may include a throttle valve (not shown) and a vacuum pump 119 for evacuating the chamber body 110. In some embodiments, the pressure inside the chamber body 110 may be adjusted by adjusting the throttle valve and / or the vacuum pump 119.

[0020] The upper portion 102 is disposed on the lower portion 104 and includes an upper dome 106, a clamping ring 108, a gasket 116, a base plate 112, an upper lamp module 172, and an upper pyrometer 156. The upper lamp module 172 is disposed above the upper dome 106. In some embodiments, the upper dome 106 has a dome-shaped form factor; however, covers having other form factors (e.g., flat or reversely curved covers) may also be contemplated.

[0021] The lower part 104 is coupled to the inlet port 114 and the exhaust port 118, and includes a base plate assembly 121, a lower dome 132, a substrate support 124, a preheating ring 122, a substrate lifting assembly 160, a substrate support assembly 164, a lower heating lamp assembly 152, a lower reflector assembly 154, and a lower pyrometer 158. The upper dome 106 and the lower dome 132 are coupled to the chamber body 110 to define the processing volume 148 of the processing chamber 100. The substrate support 124 is disposed in the processing volume 148 to support the substrate 101. In some embodiments, the substrate 101 may be a semiconductor wafer, such as a 150 mm, 200 mm, 300 mm, 450 mm wafer or the like, or any other substrate type used in film manufacturing processes. In some embodiments, the substrate 101 may be a patterned substrate.

[0022] Although the term "ring" is used to describe certain components of the processing chamber 100, such as the preheating ring 122, the shape of these components need not be circular and may include any shape, including but not limited to, rectangular, polygonal, elliptical, and the like. In some embodiments, the gas supplier 117 may supply one or more processing gases to the processing chamber 100 via the inlet port 114. In such embodiments, a valve or mass flow controller 115 may be coupled to the gas supplier 117 to control the flow rate of the processing gas from the gas supplier 117. The upper dome 106, the clamping ring 108, and the lower dome 132 are formed of quartz; however, other IR-transparent and process-compatible materials may also be used to form these components.

[0023] During processing, the substrate 101 is disposed on the substrate support 124. One or more heating lamp assemblies (e.g., the heating lamp assembly 238, the lower heating lamp assembly 152 described below) that include a plurality of heating lamps are sources of infrared (IR) radiation (e.g., heat) and are used to generate a predetermined temperature profile across the substrate 101. One or more heating lamp assemblies receive power from a power source 150.

[0024] The substrate support assembly 164 generally includes a support bracket 134 having a plurality of support pins 166 coupled to the substrate support 124. The substrate lifting assembly 160 includes a substrate lifting shaft 126 and a plurality of lift pin modules 161 selectively resting on respective pads 127 of the substrate lifting shaft 126. In some embodiments, the lift pin module 161 includes an optional upper portion of a lift pin 128 movably disposed to pass through a first opening 162 in the substrate support 124. In operation, the substrate lifting shaft 126 moves to engage the lift pin 128. When engaged, the lift pin 128 can raise the substrate 101 above the substrate support 124 or lower the substrate 101 onto the substrate support 124.

[0025] The support system 130 includes components for performing and monitoring a predetermined process (e.g., growing an epitaxial film) in the processing chamber 100. Such components typically include various subsystems (e.g., (a) gas panel(s), gas distribution conduits, vacuum and exhaust subsystems, and the like) and devices of the processing chamber 100 (e.g., power supplies, process control instruments, and the like). These components are well known to those skilled in the art and are omitted from the drawings for clarity.

[0026] A controller 140 can be provided and the controller 140 can be coupled to the processing chamber 100 for controlling the components of the processing chamber 100. The controller 140 can be any suitable controller for controlling the operation of a substrate processing chamber. The controller 140 typically includes a central processing unit (CPU) 142, a memory 144, and support circuitry 146, and is directly coupled to and controls the processing chamber 100, the support system 130, and the power source 150 (as Figure 1 shown), or alternatively, is coupled via a computer (or controller) associated with the processing chamber and / or the support system.

[0027] The CPU 142 can be any form of general-purpose computer processor that can be used in an industrial environment. The support circuitry 146 is coupled to the CPU 142 and can include a cache, clock circuitry, input / output subsystems, power supplies, and the like. Software routines can be stored in the memory 144 of the controller 140. When executed by the CPU 142, the software routines transform the CPU 142 into a dedicated computer (controller) 140. The software routines can also be stored and / or executed by a second controller (not shown) located remote from the controller 140. Alternatively or in combination, in some embodiments, e.g., where the processing chamber 100 is part of a multi-chamber processing system, each processing chamber of the multi-chamber processing system can have a corresponding controller for controlling a portion of the inventive method disclosed herein that can be performed in that particular processing chamber. In such embodiments, the individual controllers can be configured similar to the controller 140 and can be coupled to the controller 140 to synchronize the operation of the processing chamber 100.

[0028] Figure 2FIG. 0 depicts a partial schematic side view of a processing chamber 100 in accordance with some embodiments of the present disclosure. In some embodiments, the upper lamp module 172 includes a shroud assembly 229 removably coupled to an upper reflector assembly 236. In some embodiments, the shroud assembly 229 includes an outer housing 202 that is coupled to a lamp mounting ring 208 disposed therein. In some embodiments, the lamp mounting ring 208 is coupled to the outer housing 202 via one or more brackets 212. The outer housing 202 is generally an annular body having a central opening 204. In some embodiments, the outer housing 202 may partially define a housing 120. The sidewall of the outer housing 202 includes an exhaust port 214 to provide a gas outlet for any gas (such as air) introduced through the central opening 204.

[0029] The lamp mounting ring 208 is coupled to a heating lamp assembly 238. The heating lamp assembly 238 includes a plurality of linear heating lamps 222 that extend across a central opening of the lamp mounting ring 208. In some embodiments, an annular heat shield 228 is coupled to the lamp mounting ring 208. In some embodiments, the annular heat shield 228 is coupled to a first protrusion 220 in any suitable manner (e.g., via fasteners 226). The annular heat shield 228 advantageously reflects heat from the linear heating lamps 222 towards the upper dome 106. In some embodiments, the annular heat shield 228 is gold-plated.

[0030] The upper reflector assembly 236 includes a reflector mounting ring 206 that is disposed around and coupled to the upper surface 217 of the upper reflector plate 224. The upper reflector plate 224 is disposed above the upper dome 106. The lower surface 248 of the upper reflector plate 224 includes a plurality of linear channels 244 that extend substantially parallel to each other across the lower surface 248. A plurality of linear heating lamps 222 extend within the plurality of linear channels 244 to reflect heat away from the sidewalls of the plurality of linear channels 244 and direct the heat toward the upper dome 106. The plurality of linear channels 244 have different cross-sectional shapes to focus peak radiation at specific locations on the wafer, enabling control of the temperature at these locations. In some embodiments, the plurality of linear channels 244 have at least one of a U-shaped cross-section, a V-shaped cross-section, an oval cross-section, a parabolic cross-section, or a rectangular cross-section. The lower surface 248 of the upper reflector plate 224 can be designed to deliver irradiation peaks at many locations across the substrate 101 to advantageously achieve better thermal profile control. In some embodiments, the plurality of linear channels 244 include up to ten linear channels. In some embodiments, the upper reflector plate is configured to produce as many irradiation peaks as there are lamps in the plurality of linear heating lamps 222. In some embodiments, the upper reflector plate 224 is gold-plated. In some embodiments, the upper reflector plate 224 includes a plurality of portions that are coupled together to form a disk-shaped plate.

[0031] In some embodiments, the upper reflector assembly 236 includes an inner housing 246 that is coupled to the top surface of the reflector mounting ring 206. A top plate 250 having an air inlet 256 is coupled to the top of the inner housing 246 to define an internal air volume 254 therein. The air inlet 256 is coupled to an air supply conduit 270 and is fluidly coupled to an exhaust port 214. In some embodiments, one or more flow turning vanes 260 are disposed between the top plate 250 and the upper reflector plate 224 to divert the air flow from the air inlet 256 and direct the air flow to various regions of the upper reflector plate 224. In some embodiments, one or more flow turning vanes 260 are coupled to the upper surface 217 of the upper reflector plate 224. In some embodiments, the upper reflector assembly 236 includes a flange 215 that is coupled to the inner housing 246 and extends radially outward to mate with the outer housing 202.

[0032] The upper reflector plate 224 includes air cooling slots 242 extending from the upper surface 217 to the lower surface 248. The upper reflector assembly 236 and the shroud assembly 229 are configured to direct air from the air inlet 256 through the air cooling slots 242 of the upper reflector plate 224 and the annular heat shield 228 to the exhaust port 214. In some embodiments, the air cooling slots 242 include a plurality of first slots 258 configured to direct an air flow toward the plurality of linear heating lamps 222 to cool the plurality of linear heating lamps 222 to maintain a target lamp temperature. In some embodiments, the target lamp temperature is less than 800 degrees Celsius. In some embodiments, the plurality of first slots 258 advantageously extend at an angle less than 90 degrees relative to the upper surface 217 of the upper reflector plate 224 to control the amount of cooling air reaching the plurality of linear heating lamps 222 relative to the cooling air provided to the upper dome 106. In some embodiments, the air cooling slots 242 include a plurality of second slots 262 to advantageously cool the upper dome 106 to maintain a target upper dome temperature. In some embodiments, the target upper dome temperature is from about 200 to about 600 degrees Celsius. In some embodiments, the plurality of first slots 258 are smaller than the plurality of second slots 262. The air cooling slots 242 are sized to provide sufficient backpressure for flow uniformity between slots. In some embodiments, the plurality of second slots 262 extend orthogonally to the upper surface 217 of the upper reflector plate 224.

[0033] In some embodiments, the lamp mounting ring 208 includes a plurality of first protrusions 220 extending radially inwardly from the lamp mounting ring 208. In some embodiments, a plurality of alignment pins 216 are coupled to the lamp mounting ring 208. In some embodiments, each of the plurality of alignment pins 216 is coupled to a respective one of the first protrusions 220. In some embodiments, the plurality of alignment pins 216 are coupled to the first protrusions 220 via fasteners 232. The plurality of alignment pins 216 are configured to extend through openings 218 in the reflector mounting ring 206 to align and removably couple the lamp mounting ring 208 to the reflector mounting ring 206. The lamp mounting ring 208 is removably coupled to the reflector mounting ring 206 such that the reflector mounting ring 206 can be advantageously and easily removed to access the linear heating lamps 222 for replacement and to access the interior of the processing chamber 100 for visual inspection. In some embodiments, the lamp mounting ring 208 includes one or more pins 252 extending from the lower surface of the lamp mounting ring 208 to align the lamp mounting ring 208 with the clamping ring 108.

[0034] A plurality of linear heating lamps 222 are positioned as close as possible to the upper dome 106 to improve radiation efficiency and thermal control, but far enough apart to prevent local cold spots that could cause parasitic deposition on the inner side of the upper dome 106. In some embodiments, the plurality of linear heating lamps 222 are arranged to be approximately 25.0 to approximately 150.0 mm from the upper dome 106. The proximity between the plurality of linear heating lamps 222 and the upper dome 106 advantageously allows for improved radiation efficiency, thus requiring less power to reach the processing temperature. Since the gas flow through the plurality of air-cooling slots 242 impinges directly on the dome, thereby improving convective heat transfer, the close proximity also advantageously enables effective dome cooling.

[0035] Figure 3 A partial isometric cross-sectional view of a processing chamber according to some embodiments of the present disclosure is depicted. In some embodiments, the plurality of linear heating lamps 222 extend through a cutout 302 in the annular thermal shield 228. In some embodiments, the plurality of linear heating lamps 222 are tungsten-halogen lamps. In some embodiments, a first end 308 of each linear heating lamp of the plurality of linear heating lamps 222 is coupled to a lamp mounting ring 208 via a lamp clamping mechanism 306. In some embodiments, each linear heating lamp of the plurality of linear heating lamps 222 is coupled to a power line 310 to supply power to the plurality of linear heating lamps 222. In some embodiments, the plurality of linear heating lamps 222 include up to ten lamps for processing a 300 mm semiconductor substrate. Each lamp of the plurality of linear heating lamps 222 includes a filament 304. The total length of each lamp of the plurality of linear heating lamps 222 is greater than the length of the lit filament to move the first end 308 (which is the weaker part of the structure of the plurality of linear heating lamps 222) having a lamp clamping point (such as, the clamping portion 404) away from the hot region of the processing chamber 100.

[0036] The plurality of linear heating lamps 222 have different sizes to maximize the length of the filaments 304 over the circular-shaped processing volume 148. For example, the length of the lamps of the plurality of linear heating lamps 222 that extend over the central region within the lamp mounting ring 208 is generally longer than the length of the lamps that extend over the peripheral region within the lamp mounting ring 208. The filaments 304 can emit a continuous radiation flux along the axis of each lamp of the plurality of linear heating lamps 222, or the filaments 304 can be contoured to allow the radiation flux to vary along the axis of each lamp of the plurality of linear heating lamps 222. For example, lamp 222A of the plurality of linear heating lamps 222 depicts a contoured filament 304 with gaps between the coil portions of the filament 304 to vary the radiation flux along the axis of lamp 222A. The length of the filaments 304 and the radiation profile of the filaments 304 along the axis are selected to adjust the irradiation profile on the substrate 101.

[0037] Multiple linear heating lamps 222 can be oriented such that the axes of the lamps are parallel or perpendicular to the gas flow path of the processing gas (e.g., from gas supplier 117). As Figure 2 shown, the orientation of the lamps is perpendicular to the gas flow path. In addition to the multiple linear heating lamps 222 being able to control the thermal profile on the substrate 101, the lamps closest to the inlet port 114 can also be used to change the temperature of the preheat ring 122 and / or the substrate support to allow for different amounts of gas preheating. The additional control of the temperature of the preheat ring 122 and / or the substrate support advantageously provides additional tuning points for the thickness and / or concentration uniformity on the substrate 101. When the multiple linear heating lamps 222 are oriented parallel to the flow path, the temperature of the gasket 116 and the preheat ring 122 may be lower at the leading and trailing edges of the gas flow path. The lower temperature of the gasket 116 and the preheat ring 122 at the leading and trailing edges of the gas flow path can advantageously reduce parasitic deposition on the gasket 116 and the preheat ring 122, can advantageously increase the deposition rate, and can advantageously reduce the time for performing in-situ cleaning of the processing chamber 100.

[0038] Figure 4 An isometric view of a lamp clamping mechanism 306 in accordance with some embodiments of the present disclosure is depicted. In some embodiments, the lamp mounting ring 208 includes a plurality of second protrusions 406 that extend radially inwardly from the lamp mounting ring 208. In some embodiments, the lamp clamping mechanism 306 includes a mounting block 402 coupled to the lamp mounting ring 208. In some embodiments, the lamp clamping mechanism 306 is coupled to each of the plurality of second protrusions 406. The mounting block 402 includes a first side 408 and a second side 410 and a slot 414 disposed between the first side 408 and the second side 410. The slot 414 is configured to receive the lamps of the multiple linear heating lamps 222. In some embodiments, the upper surface 418 of the mounting block 402 along the slot 414 is contoured to position each of the multiple linear heating lamps 222. The first end 308 of the multiple linear heating lamps 222 includes a clamping portion 404 where the multiple linear heating lamps 222 have a rectangular cross-sectional profile, as opposed to the circular cross-sectional profile of the remainder of the multiple linear heating lamps 222.

[0039] In some embodiments, the lamp clamping mechanism 306 includes a rear block 430 coupled to the mounting block 402 and disposed in the slot 414. In some embodiments, the rear block 430 has an opening 426 to receive the power line 310. In some embodiments, the rear block 430 includes a slot 424 that extends from the opening 426 to the outer surface of the rear block 430. In some embodiments, the clamping portion 404 is disposed in the slot 424 to prevent rotational movement of each of the multiple linear heating lamps 222 relative to the mounting block 402.

[0040] The mounting block 402 includes a clamp 412 rotatably coupled to a first side 408 of the mounting block 402. In some embodiments, the clamp 412 includes a body 403 coupled to a first end 405 of an arm 407. A second end 420 of the arm 407 includes a pin 422. In use, the second end 420 of the arm 407 swings above each of a plurality of linear heating lamps 222 to a second side 410 such that the pin 422 can enter an opening 428 in the second side 410 to hold each lamp between the arm 407 and an upper surface 418. In some embodiments, the pin 422 is threaded to engage corresponding threads provided in the opening 428.

[0041] Figure 5 An isometric view of a lamp clamping mechanism 306 in accordance with some embodiments of the present disclosure is depicted. The lamps of the plurality of linear heating lamps 222 are omitted from Figure 5 such that details of the lamp clamping mechanism 306 are not obscured. In some embodiments, the lamp clamping mechanism 306 includes a mounting block 502 coupled to a lamp mounting ring 208. In some embodiments, the mounting block 502 is coupled to each of a plurality of second protrusions 406. In some embodiments, the mounting block 502 includes a body 516 and a raised portion 520. The raised portion includes an upper surface 518 that is contoured to position each of the plurality of linear heating lamps 222.

[0042] The mounting block 502 includes a first side 508 and a second side 510. In some embodiments, a clamp 512 is rotatably coupled to the body 516 of the mounting block 502. In some embodiments, the clamp 512 includes a first pin 503 rotatably coupled to the mounting block 502 and an arm 507 coupled to the first pin 503. In some embodiments, a second pin 505 is coupled to the mounting block 502. The arm 507 includes a groove 522 configured to receive the second pin 505 when the arm 507 rotates toward the second pin 505. The second pin 505 is configured to prevent further rotation of the arm 507. In some embodiments, the first pin 503 is disposed near the first side 508, and the second pin 505 is disposed near the second side 510. In some embodiments, the first pin 503 is disposed near the second side 510, and the second pin 505 is disposed near the first side 508. The lamps of the plurality of linear heating lamps 222 are held between the first pin 503 and the second pin 505 and between the arm 507 and the body 516.

[0043] In some embodiments, the lamp clamping mechanism 306 includes a rear block 530 disposed on the lamp mounting ring 208. In some embodiments, the lamp clamping mechanism 306 includes a pin 532 that extends through the rear block 530 and is coupled to the mounting block 502 such that the rear block 530 is laterally movable along the pin 532. A biasing element 534 is disposed around the pin 532 between the head 536 of the pin 532 and the rear block 530 to urge the rear block 530 and each lamp of the plurality of linear heating lamps 222 toward the mounting block 502. The biasing element 534 urges the end opposite the first end 308 of each lamp of the plurality of linear heating lamps 222 toward a fixed position block (not shown) to provide repeatable axial alignment of each lamp relative to the mounting block 502. The rear block 530 can be pushed toward the head 536 to facilitate the installation and removal of each of the plurality of linear heating lamps 222. In some embodiments, the rear block 530 has an opening 526 to receive the power line 310. In some embodiments, the rear block 530 includes a slot 524 that extends from the opening 526 to the outer surface of the rear block 530. In some embodiments, a clamping portion 404 is disposed in the slot 524 to prevent rotational movement of each of the plurality of linear heating lamps 222 relative to the mounting block 502.

[0044] Figure 6 Depicts a partial isometric cross-sectional view of an upper lamp module in accordance with some embodiments of the present disclosure. In some embodiments, the upper reflector plate 224 is cooled to reduce or prevent gold plating layer failure. In some embodiments, the upper surface 217 of the upper reflector plate 224 includes a plurality of coolant channels 604. In some embodiments, the plurality of coolant channels 604 extend parallel to the plurality of linear heating lamps 222. Cooling tubes 606 are disposed in the plurality of coolant channels to circulate coolant therethrough. The cooling tubes 606 are coupled to an inlet 610 at one end and an outlet 612 at the other end. In some embodiments, the number of the plurality of coolant channels 604 corresponds to the number of the plurality of linear channels 244.

[0045] Figure 7 Depicts a partial isometric cross-sectional view of an upper lamp module in accordance with some embodiments of the present disclosure. In some embodiments, a mounting block 702 is disposed on the top plate 250. In some embodiments, one or more temperature sensors 708 for measuring the temperature of at least one of the upper dome 106 and the substrate 101 are mounted to the mounting block 702. The mounting block 702 and the top plate 250 include an opening 717 to provide an optical path from the one or more temperature sensors 708 to the upper dome 106. In some embodiments, the one or more temperature sensors 708 are pyrometers. In some embodiments, a shield tube 724 extends from the one or more temperature sensors 708 and into the internal air volume 254 to shield the one or more temperature sensors 708 from thermal noise.

[0046] In some embodiments, one or more lasers 706 are mounted to a mounting block 702 to transmit photon energy to a substrate 101 to provide local point heating during processing. The local point heating can increase the deposition rate on a target area of the substrate 101. The mounting block 702 and the top plate 250 include an opening 718 to provide a path for the one or more lasers 706 toward the upper dome 106. In some embodiments, a shield tube 728 extends from the one or more lasers 706 and into the internal air volume 254. In some embodiments, the one or more lasers 706 include alignment features to adjust the laser head so as to precisely position the laser head. In some embodiments, the one or more lasers 706 are positioned between 0.0 mm and 160.0 mm from the center of the upper dome 106. In some embodiments, when the upper portion 102 includes one or more flow turning vanes 260, openings 704 are provided in the one or more flow turning vanes 260 to provide a laser path for the one or more lasers 706 and an optical path for one or more temperature sensors 708 passing through the openings 704.

[0047] In some embodiments, the upper reflector plate 224 includes openings 704 for the laser path of the one or more lasers 706 and the optical path of the one or more temperature sensors 708. In some embodiments, a transparent window 710 is placed above the opening 704 to reduce or prevent local cold spots on the upper dome 106 due to cooling air passing through the opening 704. The transparent window 710 is made of a material suitable for transmitting a signal from at least one of the substrate 101 or the upper dome 106 to the one or more temperature sensors 708. In some embodiments, the transparent window 710 is configured to transmit a signal having a wavelength of from about 2.5 microns to about 5.0 microns. In some embodiments, the transparent window 710 is coated with a suitable material for transmitting a signal having a wavelength of from about 2.5 microns to about 5.0 microns. In some embodiments, the coating on the transparent window 710 is an anti-reflection coating. In some embodiments, the transparent window 710 is made of quartz or calcium fluoride (CaF2). In some embodiments, the transparent window 710 is made of transparent quartz for temperature measurement of the substrate 101. Quartz can be used to minimize signal loss from the substrate 101 to the one or more temperature sensors 708. In some embodiments, the transparent window 710 is made of CaF2 for measurement of the upper dome 106. CaF2 can be used to minimize signal loss from the upper dome 106 to the one or more temperature sensors 708.

[0048] In some embodiments, one or more temperature sensors 708 may be used to calibrate the amount of power delivered to each of the plurality of linear heating lamps 222 to achieve a specific temperature of the substrate 101 for a given temperature set point. In some embodiments, one or more temperature sensors 708 are positioned across the upper reflector plate 224. For example, calibration may be performed periodically or during any lamp replacement.

[0049] Although the foregoing relates to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure.

Claims

1. An upper reflector assembly for use in a processing chamber, comprising: A reflector mounting ring; and An upper reflector plate coupled to the reflector mounting ring and comprising: An upper surface; A lower surface; A plurality of linear channels extending substantially parallel to each other across the lower surface; and A plurality of air-cooling slots extending from the upper surface to the lower surface, the plurality of air-cooling slots including a plurality of first slots and a plurality of second slots, the plurality of first slots being configured to direct an air flow towards a plurality of linear heating lamps, the plurality of second slots being configured to direct an air flow towards an upper dome of the processing chamber, each of the plurality of first slots being smaller than each of the plurality of second slots, the plurality of second slots extending orthogonally to the upper surface, and the plurality of first slots extending at an angle less than 90 degrees relative to the upper surface of the upper reflector plate.

2. The upper reflector assembly according to claim 1, wherein the upper surface includes a plurality of coolant channels.

3. The upper reflector assembly according to claim 1, wherein the plurality of linear channels have different cross-sectional shapes.

4. The upper reflector assembly according to claim 1, wherein the plurality of linear channels have at least one of the following cross-sections: a U-shaped cross-section, a V-shaped cross-section, an oval cross-section, a parabolic cross-section, or a rectangular cross-section.

5. The upper reflector assembly according to claim 1, further comprising: a reflector mounting ring coupled to the upper reflector plate; an inner housing coupled to the reflector mounting ring; and a top plate coupled to the inner housing, wherein the top plate includes an air inlet configured to facilitate air flow through the inner housing and through the air-cooling slots.

6. The upper reflector assembly according to claim 5, further comprising: one or more flow turning vanes disposed between the top plate and the upper reflector plate to direct the air flow from the air inlet to various regions of the upper reflector plate.

7. An upper lamp module, comprising: Upper reflector assembly, the upper reflector assembly comprising: A reflector mounting ring, the reflector mounting ring being coupled to an upper reflector plate having an upper surface and a lower surface, wherein the lower surface includes a plurality of linear channels that extend substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes air cooling slots that extend from the upper surface to the lower surface, wherein the air cooling slots include a plurality of first slots and a plurality of second slots, the plurality of first slots being configured to direct an air flow toward the plurality of linear heating lamps, the plurality of second slots being configured to direct an air flow toward an upper dome of the processing chamber, each of the plurality of first slots being smaller than each of the plurality of second slots, the plurality of second slots extending orthogonally to the upper surface, and the plurality of first slots extending at an angle less than 90 degrees relative to the upper surface of the upper reflector plate; and A shroud assembly, the shroud assembly including: an outer housing and a plurality of linear heating lamps, the outer housing being coupled to a lamp mounting ring, the plurality of linear heating lamps being coupled to the lamp mounting ring, wherein the lamp mounting ring is removably coupled to the reflector mounting ring, and wherein the plurality of linear heating lamps extend within the plurality of linear channels to reflect heat away from sidewalls of the plurality of linear channels.

8. The upper lamp module according to claim 7, wherein the lamp mounting ring includes alignment pins configured to extend through openings in the reflector mounting ring to align and removably couple the lamp mounting ring to the reflector mounting ring.

9. The upper lamp module according to claim 7, wherein each linear lamp of the plurality of linear heating lamps is coupled to the lamp mounting ring at a first end via a lamp clamping mechanism, wherein the lamp clamping mechanism includes a mounting block having a clamp rotatably coupled to the mounting block, and wherein an upper surface of the mounting block is contoured to position each linear lamp.

10. The upper lamp module according to claim 9, further comprising: a rear block having a slot disposed in the mounting block, wherein the first end of the linear lamp is disposed in the slot to prevent rotational movement of the linear lamp relative to the mounting block.

11. The upper lamp module according to claim 7, wherein the upper reflector assembly includes a top plate having an air inlet, and the shroud assembly includes an exhaust port, and wherein the upper reflector assembly and the shroud assembly are configured to direct air from the air inlet through the air cooling slots of the upper reflector plate to the exhaust port.

12. The upper lamp module according to claim 7, wherein the upper reflector plate includes an opening therethrough covered by a transparent window, and the upper reflector assembly includes a temperature sensor or includes a laser, the temperature sensor being configured to measure temperature through the transparent window, the laser being configured to transmit photon energy through the transparent window.

13. An upper reflector plate for use in a processing chamber, comprising: An upper surface; Lower surface; A plurality of linear channels that extend substantially parallel to each other across the lower surface, wherein the plurality of linear channels have at least one of the following cross-sections: a U-shaped cross-section, a V-shaped cross-section, an oval cross-section, a parabolic cross-section, or a rectangular cross-section; A plurality of air-cooling slots that extend from the upper surface to the lower surface, the plurality of air-cooling slots including a plurality of first slots and a plurality of second slots, the plurality of first slots being configured to direct an air flow towards a plurality of linear heating lamps, and the plurality of second slots being configured to direct an air flow towards an upper dome of the processing chamber; and A plurality of coolant channels formed in the upper surface, wherein each of the plurality of first slots is smaller than each of the plurality of second slots, the plurality of second slots extend orthogonally to the upper surface, and the plurality of first slots extend at an angle less than 90 degrees relative to the upper surface of the upper reflector plate.

14. The upper reflector plate according to claim 13, wherein the upper reflector plate includes an opening that extends from the upper surface to the lower surface and is covered by a transparent window.

15. The upper reflector plate according to claim 13, wherein the plurality of linear channels have different cross-sectional shapes.

16. The upper reflector plate according to claim 13, further comprising: a gold plating layer disposed on the upper reflector plate.

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