Method for producing resin molded product, molding die and resin molding device

Abstract

The object of the present invention is to provide a method for manufacturing a resin molded product that can reduce the occurrence of molding defects even when resin molding is performed in a state where a chip is temporarily fixed to a carrier via a temporary fixing sheet. The method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product in which a molding object in which a chip (21) is temporarily fixed to a carrier (11) via a temporary fixing sheet (12) is resin molded by transfer molding, and is characterized in that it includes a resin molding step, using a molding die (1000), resin molding the molding object by transfer molding, and performing the resin molding step in a state where a gap (G) is formed in a manner that the temporary fixing sheet (12) arranged on the molding die (1000) and the opposing surface facing the temporary fixing sheet (12) on the side where the chip (21) is temporarily fixed do not contact each other.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a resin molded product, a molding die and a resin molding device. Background Art

[0002] Electronic components such as ICs and semiconductor chips (hereinafter referred to as "chips") are often used after being sealed with resin (resin molding). More specifically, by sealing the chip with resin, the chip can be used as a resin-sealed electronic component (also referred to as an electronic component as a finished product, or a package, etc. hereinafter referred to as an "electronic component").

[0003] For example, the drawings and description of Patent Document 1 disclose a technique for temporarily fixing a chip 1 on a substrate (carrier) 3 using a heat-resistant adhesive sheet (temporary fixing sheet) 2 for semiconductor device manufacturing, and then peeling the temporary fixing sheet from the resin molded product after resin molding.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2011-129649 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] As described in Patent Document 1, a method for resin molding a molding object in which a chip is temporarily fixed to a carrier via a temporary fixing sheet can be performed, for example, as follows Figure 8 (a) and (b) are performed. Figure 8(a) is a cross-sectional view of the main components of the molding die used for the resin molding method. As shown in the figure, the main components of the molding die are an upper mold 100 and a lower mold 200. The upper mold 100 includes an upper mold main cavity block 100a and an upper mold support base 100b for holding the upper mold main cavity block 100a. The lower mold 200 includes a lower mold main cavity block 200a and a lower mold support base 200b for holding the lower mold main cavity block 200a. In the upper mold main cavity block 100a, a cavity is formed on the surface (lower surface) facing the lower mold main cavity block 200a, and resin molding can be performed in the cavity. As shown in the figure, the lower mold main cavity block 200a can carry a carrier 11 on the surface (upper surface) facing the upper mold main cavity block 100a. As shown in the figure, the carrier 11 can be attached with a temporary fixing sheet 12 on the surface on the opposite side of the side contacting the lower mold main cavity block 200a. In the temporary fixing sheet 12, as shown in the figure, a chip 21 is temporarily fixed on the surface on the opposite side to the side pasted to the carrier 11. That is, as shown in the figure, relative to the carrier 11 pasted with the temporary fixing sheet 12, the chip 21 is pasted on the surface of the temporary fixing sheet 12 on the opposite side of the carrier 11, thereby the chip 21 can be temporarily fixed to the carrier 11 through the temporary fixing sheet 12 (using the temporary fixing sheet 12). As shown in the figure, the upper mold 100 (upper mold main mold cavity block 100a) is brought into contact with and closed with the carrier 11 pasted with the temporary fixing sheet 12, and pressure (clamping) is applied from top to bottom, so that the mold can be closed. On the side of the mold cavity (hereinafter also referred to as "mold cavity") of the upper mold main mold cavity block 100a, as shown in the figure, a pot block 30 and a scrap waste (cull) block 40 are arranged. The space inside the pot block 30 (also called pot body). Figure 8 The tank block 30 is provided with a molten resin (not shown) after the resin material used for resin molding is melted. The waste block 40 is arranged above the tank block 30. The closed space surrounded by the tank block 30 and the waste block 40 is connected to the mold cavity through the runner and the gate. Figure 8 The molten resin contained in the space (tank body) of the tank block 30 is squeezed out from below (not shown). As a result, the molten resin can flow laterally (i.e., transferred from the side of the cavity) through the runner and the gate and supplied to the cavity. The molten resin below the scrap block 40, in the runner, in the gate, and in the cavity is solidified to form the scrap 20a, the runner resin portion 20b, the gate resin portion 20c, and the sealing resin 20, respectively, as shown in the figure. As a result, as shown in the figure, the chip 21 can be resin-molded (resin-sealed) with the sealing resin 20 in a state where the chip 21 is temporarily fixed to the carrier 11 via the temporary fixing sheet 12 (using the temporary fixing sheet 12).

[0009] on the other hand, Figure 8 (b) Yes Figure 8 (a) Cross-sectional view of the flow channel along the AA direction. Figure 8 As shown in (a), when the mold is clamped, Figure 8 As shown by the arrows in (b), the parts other than the runner and gate are subjected to clamping forces (also called clamping loads or clamping pressures) from above and below, but the runner and gate are not subjected to clamping forces. Therefore, in the part where the temporary fixing piece 12 is subjected to the clamping force, the force of the temporary fixing piece 12 extending laterally acts due to the stress caused by the clamping force. Therefore, in the runner and gate parts, as shown in FIG. Figure 8 As shown in (b), the forces pushing inward from both sides of the temporary fixing sheet 12 may cause the temporary fixing sheet 12 to bulge. As a result, molten resin enters between the carrier 11 and the temporary fixing sheet 12 at the bulging portion of the temporary fixing sheet 12, which may cause molding defects.

[0010] Therefore, an object of the present invention is to provide a method for manufacturing a resin molded product, a molding die, and a resin molding device that can reduce the occurrence of molding defects even when resin molding is performed in a state where a chip is temporarily fixed to a carrier via a temporary fixing sheet.

[0011] Problem Solution

[0012] In order to achieve the above object, the method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product by transfer molding, wherein a molding object in which a chip is temporarily fixed on a carrier via a temporary fixing sheet is subjected to resin molding.

[0013] Features

[0014] The method comprises the following steps: performing resin molding on the molding object by transfer molding using a molding die,

[0015] The resin molding step is performed in a state where a gap is formed so that the temporary fixing sheet disposed on the molding die does not contact a facing surface facing the temporary fixing sheet on the side where the chip is temporarily fixed.

[0016] The molding die of the present invention is a molding die used for carrying out the method for producing a resin molded product of the present invention.

[0017] Features

[0018] The resin molding step is performed in a state where the gap is formed so that the temporary fixing sheet disposed on the molding die does not contact the facing surface facing the temporary fixing sheet on the side where the chip is temporarily fixed.

[0019] The resin molding apparatus of the present invention includes the molding die of the present invention, and is a resin molding apparatus for carrying out the method for producing a resin molded product of the present invention.

[0020] Effects of the Invention

[0021] The present invention can provide a method for manufacturing a resin molded product, a molding die, and a resin molding device that can reduce the occurrence of molding defects even when resin molding is performed in a state where a chip is temporarily fixed to a carrier via a temporary fixing sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] [ Figure 1 ] Figure 1 This is a cross-sectional view of main parts showing an example of a step of the molding die of the present invention and a method for producing a resin molded product of the present invention using the same.

[0023] [ Figure 2 ] Figure 2 (a) Viewed from the cavity surface Figure 1 A plan view of a lower die and a lower die support base in a molding die. Figure 2 (b) Viewed from the cavity surface Figure 1 A plan view of an upper die and an upper die support base in a molding die.

[0024] [ Figure 3 ] Figure 3 (a) with Figure 2 (a) Similarly, the cavity surface is viewed from the Figure 1 A plan view of a lower die and a lower die support base in a molding die. Figure 3 (b) Yes Figure 2 (a) is a cross-sectional view of the molding die in the AA direction. Figure 3 (c) Yes Figure 2 (a) is a cross-sectional view of the molding die in the BB direction.

[0025] [ Figure 4 ] Figure 4 (a) and (b) are process cross-sectional views showing an example of a process of peeling off the temporary fixing sheet from the resin molded product.

[0026] [ Figure 5 ] Figure 5 This is a cross-sectional view of main parts showing another example of a step of the molding die of the present invention and the method for producing the resin molded product of the present invention using the same.

[0027] [ Figure 6 ] Figure 6 This is a cross-sectional view showing an example of a mechanism for changing the height of the lower mold in the molding die of the present invention.

[0028] [ Figure 7 ] Figure 7 It is a plan view showing an example of the overall structure of the resin molding device of the present invention.

[0029] [ Figure 8 ] Figure 8(a) and (b) are cross-sectional views of main parts showing an example of one step of a molding die and a method for producing a resin molded product using the same according to the present invention. DETAILED DESCRIPTION

[0030] Next, the present invention will be described in detail with examples, but the present invention is not limited to the following description.

[0031] The method for producing a resin molded product of the present invention may further include, for example, a peeling step of peeling the temporary fixing sheet from the resin molded product after the resin molding step.

[0032] The method for producing a resin molded article of the present invention may further include, for example, a gap adjustment step of adjusting the thickness of the gap by moving at least a portion of the molding die.

[0033] In the method for producing a resin molded product of the present invention, for example, the resin molding step may be performed in a state where the facing surface is formed of a release film disposed on the molding die and the gap is formed between the temporary fixing sheet and the release film.

[0034] In the method for manufacturing a resin molded product of the present invention, for example, the resin molding step may be performed in a state where the facing surface is formed of a release film disposed on the molding die and the gap is formed between the temporary fixing sheet and the release film.

[0035] The method further comprises a peeling step of peeling the temporary fixing sheet from the resin molded product after the resin molding step,

[0036] The temporary fixing sheet is a temporary fixing sheet that can be peeled off from the resin molded product by heating,

[0037] The peeling step is performed by heating the temporary fixing sheet and the resin molded product to a temperature higher than that in the resin molding step.

[0038] For the molding die of the present invention, for example,

[0039] In the method for manufacturing the resin molded product, the facing surface is formed of a release film arranged on the molding die, and the resin molding step is performed in a state where the gap is formed between the temporary fixing sheet and the release film.

[0040] The resin molding step is performed in a state where a surface of the molding die facing the temporary fixing sheet is covered with a mold release film and the gap is formed between the temporary fixing sheet and the mold release film.

[0041] The resin molding apparatus of the present invention may further include, for example, a gap adjustment mechanism for adjusting the thickness of the gap by moving at least a portion of the molding die.

[0042] In the present invention, the molding die is not particularly limited, and may be, for example, a metal die or a ceramic die.

[0043] In the present invention, there is no particular limitation on the resin molded product, and for example, it may be an electronic component in which a chip is sealed with resin. In addition, generally speaking, "electronic component" may refer to a chip before resin sealing and a state in which the chip is sealed with resin. However, in the present invention, the chip is also referred to as an "electronic component", and "electronic component" refers to an electronic component in which the chip is sealed with resin (as a finished electronic component). In the present invention, "chip" and "electronic component" have the same meaning. In the present invention, "chip" or "electronic component" refers to a chip before resin sealing, and specifically, for example, IC, semiconductor chip, semiconductor element for controlling electric power, resistor element, capacitor element and other chips can be cited. In addition, "semiconductor element" refers to, for example, a circuit element made of semiconductor as raw material. In the present invention, in order to distinguish it from the electronic component after resin sealing, for convenience, the chip before resin sealing is referred to as "chip" or "electronic component". However, the "chip" or "electronic component" in the present invention can be a chip before resin sealing, without any particular limitation, and may not be in chip shape.

[0044] In the present invention, there are no special restrictions on the resin material before molding and the resin after molding, for example, it can be a thermosetting resin such as epoxy resin or silicone resin, or it can be a thermoplastic resin. In addition, it can also be a composite material containing a portion of thermosetting resin or thermoplastic resin. In the present invention, the form of the resin material before molding can be exemplified by powdered resin (including granular resin), liquid resin, sheet resin, plate resin, etc. In addition, in the present invention, the liquid resin can be liquid at room temperature, and also includes molten resin that becomes liquid after heating and melting. The form of the resin can be any form as long as it can be supplied to the mold cavity or tank body of the molding mold, etc., or it can be other forms.

[0045] The following is a description of specific embodiments of the present invention based on the accompanying drawings. For the convenience of explanation, each drawing is appropriately omitted, exaggerated, and other schematic descriptions.

[0046] [Example 1]

[0047] In this embodiment, an example of the molding die of the present invention, an example of the resin molding device of the present invention using the same, and an example of the method for manufacturing the resin molded product of the present invention using the same are described. In addition, the resin molding method of the present invention is a method for manufacturing a resin molded product by performing resin molding by transfer molding as described above. In addition, the molding die and the resin molding device of the present invention perform resin molding by transfer molding.

[0048] Figure 1 This is a cross-sectional view of the main components of an example of a molding die of the present invention used in the method for manufacturing a resin molded product of the present invention. As shown in the figure, the main components of the molding die 1000 are an upper die 100 and a lower die 200. The upper die 100 includes an upper die main cavity block 100a and an upper die support base 100b that holds the upper die main cavity block 100a. The upper surface and side surfaces of the upper die main cavity block 100a are covered by the upper die support base 100b. The lower die 200 includes a lower die main cavity block 200a and a lower die support base 200b that holds the lower die main cavity block 200a. The lower surface and side surfaces of the lower die main cavity block 200a are covered by the lower die support base 200b. In the upper die main cavity block 100a, a cavity is formed on the surface (lower surface) facing the lower die main cavity block 200a, and resin molding can be performed in the cavity. As shown in the figure, the lower mold main cavity block 200a can be loaded with a carrier 11 on the surface (upper surface) facing the upper mold main cavity block 100a. As shown in the figure, the carrier 11 can be attached with a temporary fixing sheet 12 on the surface opposite to the side contacting the lower mold main cavity block 200a. In the temporary fixing sheet 12, as shown in the figure, a chip 21 is temporarily fixed on the surface opposite to the side attached to the carrier 12. That is, as shown in the figure, with respect to the carrier 11 attached with the temporary fixing sheet 12, the chip 21 is attached to the surface of the temporary fixing sheet 12 on the opposite side of the carrier 11, thereby temporarily fixing the chip 21 to the carrier 11 via the temporary fixing sheet 12 (using the temporary fixing sheet 12). As shown in the figure, the side portion of the upper mold support base 100b (the portion covering the upper mold main cavity block 100a) and the side portion of the lower mold support base 200b (the portion covering the lower mold main cavity block 200a) are brought into contact and closed, and pressure is applied (clamped) from the top and bottom, so that the mold can be closed. At this time, in this embodiment, as described later, the upper mold 100 (upper mold main cavity block 100a) is not in contact with the carrier 11 to which the temporary fixing sheet 12 is attached, but a gap is formed. On the side of the cavity (hereinafter also referred to as "cavity") of the upper mold main cavity block 100a, as shown in the figure, a can block 30 and a scrap block 40 are arranged. The space inside the can block 30 (also referred to as the can, Figure 1 The tank block 30 is provided with a molten resin (not shown) which is formed by melting the resin material for resin molding. The waste block 40 is arranged above the tank block 30. The closed space surrounded by the tank block 30 and the waste block 40 is connected to the mold cavity through the runner and the gate. Figure 1 The molten resin contained in the space (tank body) of the tank block 30 is squeezed out from below (not shown). As a result, the molten resin can flow laterally (i.e., transferred from the side of the cavity) through the runner and the gate and supplied to the cavity. The molten resin below the scrap block 40, in the runner, in the gate, and in the cavity is solidified to form the scrap 20a, the runner resin portion 20b, the gate resin portion 20c, and the sealing resin 20, respectively, as shown in the figure. As a result, as shown in the figure, the chip 21 can be resin-molded (resin-sealed) using the sealing resin 20 in a state where the chip 21 is temporarily fixed to the carrier 11 via the temporary fixing sheet 12 (using the temporary fixing sheet 12).

[0049] Figure 1 As shown in the figure, the molding die 1000 has a gap G formed in such a way that the temporary fixing sheet 12 disposed in the lower mold 200 of the molding die 1000 and the opposing surface of the temporary fixing sheet 12 in the upper mold 100 of the molding die 1000 do not contact each other. And in this state, the molding object in which the chip 21 is temporarily fixed to the carrier 11 via the temporary fixing sheet 12 can be resin molded by transfer molding. Because there is a gap G, using Figure 1 The molding die 1000 does not apply stress to the temporary fixing sheet. Therefore, it is possible to suppress or prevent Figure 8 (b) shows the phenomenon that the temporary fixing piece 12 is bulged. This can reduce the occurrence of molding defects of the resin molded product.

[0050] use Figure 1 There are no special restrictions on the method for manufacturing the resin molded product of the molding die 1000, and for example, it can be the same as or equivalent to conventional transfer molding. For example, there are no special restrictions on the resin molding process of resin molding the molding object by transfer molding, and for example, it can be the same as or equivalent to conventional transfer molding. Specifically, for example, as described above, a plunger can be used to extrude the molten resin contained in the tank from below, and the molten resin can be made to flow laterally (that is, transferred from the side of the mold cavity) through the runner and the gate, and supplied to the mold cavity. In addition, there are no special restrictions on other operations, and for example, as described above, it can be the same as or equivalent to conventional transfer molding. In addition, in Figure 1 The example of using molten resin is described in the above, but it is not limited to this. For example, liquid resin that is liquid at room temperature can be used instead of molten resin. Figure 1In the embodiment, the upper mold 100 has a mold cavity, and a molding object for temporarily fixing the chip 21 on the carrier 11 via the temporary fixing sheet 12 is arranged on the mold surface of the lower mold. However, it is not limited to this, and the configuration of the upper mold and the lower mold can be reversed. That is, the lower mold can have a mold cavity, and a molding object for temporarily fixing the chip 21 on the carrier 11 via the temporary fixing sheet 12 is arranged on the mold surface of the upper mold. At this time, a gap can be formed between the temporary fixing sheet 12 and the surface of the lower mold of the molding mold facing the temporary fixing sheet 12.

[0051] Through the resin molding process, the method for manufacturing a resin molded product of the present invention can be carried out to manufacture a resin molded product. In addition, the method for manufacturing a resin molded product of the present invention may appropriately include other processes other than the resin molding process, or may not include them. For example, the method for manufacturing a resin molded product of the present invention as described above may further include a peeling process of peeling off the temporary fixing sheet from the resin molded product after the resin molding process. In addition, the method for manufacturing a resin molded product of the present invention may further include an excess resin portion removal process of removing waste materials, excess resin portions such as runner resin portions, etc. from the molded resin. There is no special limitation on the excess resin portion removal process, and for example, it may be the same as or equivalent to conventional transfer molding.

[0052] Figure 4 The process cross-sectional views of (a) and (b) show an example of a peeling step of peeling the temporary fixing sheet from the resin molded product after the resin molding step. Figure 4 (a) is shown in Figure 1 After the resin molding process described above, the excess resin portion (waste 20a, runner resin portion 20b, and gate resin portion 20c) is removed from the molded sealing resin 20 by the excess resin removal process. As shown in the figure, the chip 21 on the temporary fixing sheet 12 is sealed with the sealing resin 20 (resin molding). In addition, resin burrs (also called flash) 20d are attached to the sealing resin 20. The resin burrs 20d are caused by the molten resin flowing into the sealing resin 20. Figure 1 First, after the excess resin removal process, as shown in FIG. Figure 4 As shown in (a), the chip 21, the sealing resin 20 and the burrs 20d are removed from the molding die 1000 together with the carrier 11 and the temporary fixing sheet 12. Figure 4 As shown in (b), Figure 4 In the state of (a), the temporary fixing sheet 12 is peeled off from the resin molded product together with the carrier 11. Then, the burrs 20d are sufficiently thin and can be removed from the sealing resin 20 while being attached to the temporary fixing sheet 12. Thus, a resin molded product 20X in which the chip 21 is sealed by the sealing resin 20 can be manufactured.

[0053] It has always been common knowledge that when resin molding is performed by transfer molding, in order to prevent resin leakage, a gap should be left as small as possible between the temporary fixing sheet and the surface facing the temporary fixing sheet. However, the inventors have found that even if resin leakage occurs from the gap between the temporary fixing sheet and the surface facing the temporary fixing sheet, resulting in excess burrs (flashing), the burrs can be removed together with the temporary fixing sheet by peeling off, so there is no problem. Specifically, if Figure 4 (a) and (b) are exemplified in the process cross-sectional diagrams. In addition, from the perspective of suppressing or preventing the concentration of resin pressure on the gap G between the temporary fixing sheet 12 and the opposing surface of the upper mold 100 facing the temporary fixing sheet 12 and increasing the burr, it is preferred to avoid the state where the gap G is formed in a very narrow range as much as possible and to form the gap G in a larger range. This is also discovered by the inventors.

[0054] The thickness of the gap G between the temporary fixing sheet 12 and the facing surface of the upper mold 100 facing the temporary fixing sheet 12 is not particularly limited and can be appropriately set. The appropriate range of the thickness of the gap G varies depending on the material and thickness of the carrier 11, the material and thickness of the temporary fixing sheet 12, the packaging thickness of the resin molded product (the thickness of the sealing resin 20), etc., but is preferably less than 100 μm, for example, 10-90 μm. From the perspective of suppressing or preventing deformation of the molding die caused by excessive clamping pressure, poor molding of the resin molded product, etc., it is preferred that the thickness of the gap G is not too small. From the perspective of suppressing the thickness of the burrs caused by the resin flowing from the gap G, it is preferred that the thickness of the gap G is not too large. The thickness of the gap G can be, for example, more than 10 μm, more than 20 μm, more than 30 μm, or more than 40 μm, for example, less than 90 μm, less than 80 μm, less than 70 μm, less than 60 μm, or less than 50 μm, for example, about 40 μm.

[0055] exist Figure 1 and 4 In the present invention, the carrier 11 is not particularly limited, and can be the same as or equivalent to the carrier used in conventional transfer molding, such as a plastic film, glass, metal, etc.

[0056] exist Figure 1 and 4In the process, there is no special limitation on the temporary fixing sheet 12, and for example, it can be the same as or equivalent to the temporary fixing sheet used in conventional transfer molding. For example, the temporary fixing sheet 12 can be a temporary fixing sheet that can be peeled off by heating. At this time, for example, as described above, the temporary fixing sheet 12 and the resin molded product can be heated to a temperature higher than the resin molding process, and the peeling process of peeling off the temporary fixing sheet 12 can be performed. There are no special restrictions on the temperature of the resin molding process and the temperature of the peeling process, and they can be set appropriately, but as an example, the temperature of the resin molding process can be set to 145°C, and the temperature of the peeling process can be set to 175°C. The peeling temperature of the temporary fixing sheet 12 varies, for example, depending on the type of adhesive of the temporary fixing sheet 12. For example, the homepage of AJ Co., Ltd. http: / / www.asiajoint.jp / IN_Html / products-PA-06.html (retrieval date: February 1, 2021) discloses temporary fixing sheets (thermal peeling films) with peeling temperatures of 120°C, 140°C, 200°C and 260°C. The temporary fixing sheet 12 may be composed of, for example, a coating material that is coated on the surface of the carrier 11 and can be peeled off from the carrier 11. In addition, for example, if the carrier 11 is a light-transmitting carrier, a temporary fixing sheet 12 that can be peeled off by irradiation with light such as ultraviolet rays may be used. In addition, the temporary fixing sheet may be a "tape" from the perspective that it can be attached to the carrier 11 using its adhesive.

[0057] in addition, Figure 2 The plan view shows Figure 1 The overall structure of the molding die 1000. Figure 2 (a) is viewed from the cavity surface (the surface facing the upper mold 100) Figure 1 FIG. 1 is a plan view of a lower mold 200 in a molding mold 1000 . Figure 2 (b) is the view from the cavity surface (the surface facing the lower mold 200) Figure 1 The plan view of the upper mold 100 in the molding mold 1000 is shown in FIG. As shown in the figure, the upper mold main mold cavity block 100a, the upper mold support base 100b, the lower mold main mold cavity block 200a and the lower mold support base 200b are respectively rectangular. Figure 2 As shown in (a), the can block 30 is arranged in the center of the lower mold 200 in a direction parallel to the long side of the rectangle of the lower mold 200 and extending through the entire lower mold 200. The carrier (also called a frame) 202a is arranged on the mold surface (the surface for resin molding) of the lower mold 200 in a manner of clamping both sides of the can block 30. Figure 2 The carrier 202a is shown with Figure 1 Unlike the carrier 11 shown, there is no connection chip 21. A plurality of tanks (spaces within the tank block 30) 20a1 are arranged side by side within the tank block 30. The tanks 20a1 are connected to the lower mold runner portion 20b1. Figure 2As shown in (b), the scrap block 40 is arranged at a position facing the can body block 30 in the center of the upper mold 100 in a manner that vertically extends through the entire upper mold 100. The mold surface of the upper mold 100 (the surface where the resin is molded, forming Figure 1 The surface of the mold cavity shown) is arranged in a manner to clamp both sides of the scrap block 40. In addition, the mold surface of the upper mold 100 is connected to the upper mold gate portion 20c2 and the upper mold runner portion 20b2. When the upper mold 100 and the lower mold 200 are molded together, the lower mold runner portion 20b1 and the upper mold runner portion 20b2 are interlocked to form a runner. Then, the molten resin can flow from the tank body 20a1 through the runner and the upper mold gate portion 20c2 into the mold cavity of the upper mold. In addition, the outer plate 102 is arranged along the two short sides of the rectangle of the upper mold support base 100b in a manner to clamp the upper mold 100. The outer plate 202 is arranged along the two short sides of the rectangle of the lower mold support base 200b in a manner to clamp the lower mold 200. In addition, in Figure 2 In (a) and (b), the clamping area 1001 is indicated by diagonal hatching. The clamping area 1001 is an area where pressure (clamping) can be applied from the top and bottom when the upper mold 100 and the lower mold 200 are closed. As shown in the figure, the clamping area 1001 exists along the rectangular peripheral edge portions (portions along the four sides) of each of the upper mold support base 100b and the lower mold support base 200b and the surfaces of the can body block 30 and the scrap block 40 facing each other. As described above, the outer plates 102 and 202 are arranged on the short sides of the rectangular peripheral portions of each of the upper mold support base 100b and the lower mold support base 200b.

[0058] in addition, Figure 3 Shows Figure 1 and 2 Cross-sectional view of the molding die. Figure 3 (a) with Figure 2 (a) Similarly, it is viewed from the cavity surface Figure 1 FIG. 1 is a plan view of a lower mold 200 in a molding mold 1000 . Figure 3 (b) further comprising an upper mold 100 Figure 2 (a) is a cross-sectional view of the entire molding die 1000 along the AA direction. Figure 3 (c) further comprising an upper mold 100 Figure 2 (a) is a cross-sectional view of the entire molding die 1000 in the BB direction. As shown in the figure, the plunger 31 is arranged in the space (tank) inside the tank block 30. By raising the plunger 31, the molten resin (not shown) inside the tank can be squeezed out of the tank, flows laterally through the runner and the gate (i.e., transfers from the side of the cavity), and is supplied to the cavity of the upper mold 100. In addition, Figure 3 In the cross-sectional views (b) and (c), Figure 2 The clamping area 1001 of (a) and (b) is shown surrounded by a frame line. In addition to the above description, Figure 2 and Figure 3 The composition of the molding die 1000 and Figure 1 However, for simplicity, Figure 3 In the cross-sectional view of FIG. 1 , the gap G between the temporary fixing sheet 12 and the upper mold 100 is omitted. Figure 1 FIG. 2 shows a structure in which the scrap material 20a is formed on the upper mold 100 side. Figure 3 The structure in which the scraps of the residual material are formed on the lower mold 200 side is shown.

[0059] in addition, Figure 5 The process cross-sectional views (a) to (c) show modified examples of the molding die 1000 of the present embodiment and the method for producing a resin molded product using the same. Figure 5 (a) Yes Figure 1 The molding die 1000 and the main parts cross-sectional view of the resin molding process using the same. As shown in the figure, in the resin molding process, the mold surfaces of the upper mold main mold cavity block 100a and the upper mold support base 100b (the surfaces facing the lower mold main mold cavity block 200a and the lower mold support base 200b, and the surfaces facing the temporary fixing sheet 12) are covered with a release film 103. In addition, regarding the chip 21 on the temporary fixing sheet 12, Figure 1 Only one surface (the surface in contact with the temporary fixing sheet 12) is exposed from the sealing resin 20, and Figure 5 In (a), both surfaces (the surface in contact with the temporary fixing sheet 12 and the surface on the opposite side) are exposed from the sealing resin 20. The chip 21 and the sealing resin 20 are in contact with the release film 13 and are separated from the mold surface of the upper mold 100 by the release film 13. Figure 5 In (a), the gap G is formed between the temporary fixing sheet 12 disposed in the lower mold 200 of the molding die 1000 and the opposing surface of the release film 13 disposed in the upper mold 100 of the molding die 1000 that faces the temporary fixing sheet 12. In addition, Figure 5 (a) shows a molding die 1000 and a resin molding process using the same. Figure 1 The thickness of the gap G is also not particularly limited, but can be, for example, Figure 1 same.

[0060] Figure 5 In the resin molding process (a), in addition to pre-covering the mold surface of the upper mold 100 (the mold surface of the upper mold main cavity block 100a and the upper mold support base 100b) with a release film 13, Figure 1The same process is performed. There is no particular limitation on the method of pre-covering the mold surface of the upper mold 100 with the release film 13, and for example, it can be the same as or equivalent to a conventional resin molding method. Specifically, for example, the mold surface of the upper mold 100 can be sucked from the inside of the upper mold 100 by a suction mechanism (not shown, such as a vacuum pump, etc.) to adsorb the release film 13. There is no particular limitation on the release film 13, and for example, it can be the same as or equivalent to a conventional resin molding method.

[0061] in addition, Figure 5 (b) and (c) are cross-sectional views showing the process of Figure 5 This is an example of a peeling step of peeling the temporary fixing sheet from the resin molded product after the resin molding step (a). Figure 5 (b) is shown in Figure 4 After the resin molding process, the excess resin portion (the waste material 20a, the runner resin portion 20b and the gate resin portion 20c) is removed from the molded sealing resin 20 by the excess resin removal process, and the release film 13 is further peeled off. The method of peeling off the release film 13 is not particularly limited, and for example, it can be the same as or equivalent to a conventional resin molding method. Figure 5 (b) Except for the two sides of the chip 21 being exposed from the sealing resin 20, Figure 4 (a) The same. From this state, if Figure 5 As shown in (c), the temporary fixing sheet 12 is peeled off from the resin molded product together with the carrier 11. Figure 4 (b) is the same, because the burrs 20d are very thin, they can be removed from the sealing resin 20 while being attached to the temporary fixing sheet 12. Thus, a resin molded product 20Y in which the chip 21 is sealed by the sealing resin 20 can be manufactured. Thus, a resin molded product in which both sides of the chip 21 are exposed from the sealing resin 20 is difficult to manufacture by compression molding, but such a resin molded product 20Y can also be manufactured by the present invention.

[0062] Methods using release films, such as Figure 5 As shown in FIG. 1 , it is suitable for manufacturing a resin molded product in which a chip is exposed from both sides of the sealing resin. However, it is not limited to this. For example, in Figure 1 and Figure 4 As shown in FIG. 1 , the chip 21 is exposed only from one surface of the sealing resin 20 (the surface in contact with the temporary fixing sheet 12), and the Figure 5 A release film 13 was used in the same manner.

[0063] In addition, the method for manufacturing a resin molded product of the present invention as described above may further include a gap adjustment step of adjusting the thickness of the gap by moving at least a portion of the molding die. The resin molding device of the present invention as described above may further include a gap adjustment mechanism of adjusting the thickness of the gap into which the resin can flow by moving at least a portion of the molding die. The gap adjustment mechanism is not particularly limited, and may include, for example, a cotter.

[0064] In the present invention, the wedge member as the gap adjustment mechanism and the method of using the wedge member are not particularly limited, but may be the same as or equivalent to that of a conventional resin molding device, for example. Figure 6 An example of this is shown in the cross-sectional view. Figure 6 Except that the wedge (wedge-shaped member) 301 is arranged below the molding die 1000, and the column 311 is arranged between the wedge 301 and the lower mold main cavity block 200a, Figure 1 The wedge 301 corresponds to a gap adjustment mechanism that adjusts the gap thickness by moving at least a portion of the molding die. As shown in the figure, the wedge 301 is formed by a pair of wedges (wedge-shaped components) of a first wedge (first wedge-shaped component) 301a and a second wedge (second wedge-shaped component) 301b. Figure 6 As shown, in the first wedge 301a and the second wedge 301b, one surface in the thickness direction (the vertical direction in the paper) is an inclined surface. More specifically, as shown in the figure, the upper surface of the first wedge 301a and the lower surface of the second wedge 301b are inclined surfaces. The first wedge 301a and the second wedge 301b are arranged so that their inclined surfaces face each other.

[0065] In addition, if Figure 6 As shown, the wedge 301 is connected to the drive mechanism 302 via the wedge power transmission component 306. And, by sliding the wedge 301 in the oblique direction (left and right direction of the paper) through the drive mechanism 302, the length of the wedge 301 in the thickness direction can be changed. Figure 6 As shown, the first wedge 301a is slid toward its front end direction (left side of the paper), that is, the direction of arrow Y in the figure. As a result, the second wedge 301b slides to the right relative to the first wedge 301a. Then, because the second wedge 301b rises (i.e., moves in the direction of arrow Z in the figure), the length of the wedge 301 in the thickness direction (up and down direction of the paper) becomes longer. Conversely, the first wedge 301a is moved toward the direction opposite to the first wedge 301a. Figure 6 By sliding in the direction opposite to the arrow Y in the figure, the length of the wedge 301 in the thickness direction (the vertical direction of the paper) can be shortened.

[0066] In addition, Figure 6In the example, the first wedge-shaped member (first wedge) 301a on the lower side of the wedge 301 can be slid in the horizontal direction (left and right of the paper) by the driving mechanism 302. However, the present invention is not limited thereto. For example, the second wedge-shaped member (second wedge) 301b on the upper side of the wedge 301 can be slid by the driving mechanism 302, or both the first wedge 301a and the second wedge 301b can be slid. In addition, the driving mechanism 302 is not particularly limited, and for example, a servo motor, a cylinder, etc. can be used.

[0067] In addition, Figure 6 In the embodiment, the entirety of one surface of each of the first wedge 301a and the second wedge 301b is an inclined surface. However, the wedge used as the gap adjustment mechanism of the present invention is not limited thereto, and for example, at least one wedge-shaped component can slide along the inclined surface. For example, in one or both of the first wedge and the second wedge, only a portion of one surface may be an inclined surface. More specifically, for example, in at least one of the first wedge 301a and the second wedge 301b, only the front end side (thinner side) of one surface is an inclined surface, and the root side (thicker side) may be a horizontal surface.

[0068] Further, if Figure 6 As shown, the gap adjustment mechanism, i.e., the wedge 301, is housed in a mold base 303. The mold base 303 is placed on the upper surface (plane) of a platen 304. That is, the wedge 301 is mounted on the platen 304 via the mold base 303. The drive mechanism 302 is connected to the mold base 303 via a fixing member 305. In addition, the drive mechanism 302 can be connected to the wedge 301 via a wedge power transmission member 306 to drive the wedge 301. In addition, the wedge 301, the drive mechanism 302, and the wedge power transmission member 306 are connected to the mold base 303. Figure 1 and 2 Thus, the drive mechanism 302 is fixedly mounted relative to the pressure plate 304, and the wedge 301 is movably mounted relative to the pressure plate. Thus, the position of the wedge 301 relative to the pressure plate 304 can be adjusted using the drive mechanism 302.

[0069] Furthermore, the column 311 passes through the lower mold support base 200b. The lower surface of the column 311 abuts against the upper surface of the second wedge 301b. The upper surface of the column 311 abuts against the lower surface of the lower mold main cavity block 200a. As described above, when the second wedge 301b moves up and down, the column 311 moves up and down, and the lower mold main cavity block 200a also moves up and down. By moving the lower mold main cavity block 200a up and down, the thickness of the gap G formed between the temporary fixing sheet 12 and the surface of the upper mold 100 facing the temporary fixing sheet 12 can be changed.

[0070] As described above, the resin molding device of the present invention includes the molding die of the present invention and is used to carry out the method for manufacturing the resin molded product of the present invention. The structure of the resin molding device of the present invention is not particularly limited, and for example, except for including the molding die of the present invention, it can be the same as or equivalent to a conventional resin molding device.

[0071] Figure 7 The plan view of FIG. 1 shows an example of the overall structure of the resin molding device of the present invention. As shown in the figure, the resin molding device 1 includes a carrier W before resin sealing (resin molding) (hereinafter referred to as "pre-sealing carrier W") and a supply module 2 for supplying a resin sheet T, two resin molding modules 1000A and 1000B for performing resin molding, and a carry-out module 4 for carrying out the resin molded product as constituent elements. The pre-sealing carrier W is, for example, Figure 1 , Figure 4 or Figure 5 As shown, a temporary fixing sheet 12 is attached to the carrier 11, and a chip 21 is temporarily fixed to the temporary fixing sheet 12. In addition, the supply module 2, the resin molding modules 1000A, 1000B and the unloading module 4 as components are detachable and replaceable relative to each other.

[0072] In addition, the resin molding device 1 includes a conveying mechanism 5 (hereinafter referred to as "loader 5") for conveying the pre-sealing carrier W and the resin sheet T supplied by the supply module 2 to the resin molding modules 1000A and 1000B, and a conveying mechanism 6 (hereinafter referred to as "unloader 6") for conveying the resin molded product after resin molding by the resin molding modules 1000A and 1000B to the unloading module 4. In addition, the resin sheet T can be melted to become a molten resin. In addition, the molten resin can be solidified (hardened) to become Figure 1 , Figure 4 or Figure 5 The sealing resin 20 is shown.

[0073] The supply module 2 of the present embodiment is an integrated structure of a substrate supply module 7 and a resin supply module 8 .

[0074] The substrate supply module 7 includes a substrate delivery unit 71 and a substrate supply unit 72. The substrate delivery unit 71 delivers the pre-sealed carrier W in the magazine to the substrate alignment unit. The substrate supply unit 72 receives the pre-sealed carrier W from the substrate delivery unit 71, aligns the received pre-sealed carrier W in a predetermined direction, and transfers it to the loader 5.

[0075] The resin supply module 8 includes a resin delivery unit 81 and a resin supply unit 82. The resin delivery unit 81 receives the resin sheet T from a stocker 83 described later, and delivers the resin sheet T to the resin supply unit 82. The resin supply unit 82 receives the resin sheet T from the resin delivery unit 81, aligns the received resin sheet T in a predetermined direction, and transfers it to the loader 5.

[0076] The resin molding modules 1000A and 1000B each include a molding die 1000. Each molding die 1000 is as follows: Figure 1-3 As shown, there are a lower mold 200 and an upper mold 100 .

[0077] In addition, a heating unit (not shown) such as a heater may be embedded in the upper mold 100 and the lower mold 200. The upper mold 100 and the lower mold 200 may be heated by the heating unit.

[0078] Figure 7 The operation of the resin molding device 1 is performed as follows. First, the substrate delivery unit 71 delivers the pre-sealed carrier W in the hopper to the substrate supply unit 72. The substrate supply unit 72 aligns the received pre-sealed carrier W in a predetermined direction and transfers it to the loader 5. At the same time, the resin delivery unit 81 delivers the resin sheet T received from the storage hopper 83 to the resin supply unit 82. The resin supply unit 82 delivers the required number ( Figure 7 There are 4 of them) passed to loader 5.

[0079] Next, the loader 5 simultaneously delivers the received two pre-sealing carriers W and four resin sheets T to the molding die 1000 . The loader 5 supplies the pre-sealing carriers W to the mounting portion of the lower die 200 , and supplies the resin sheets T to the inside of the can body formed in the lower die 200 .

[0080] After that, the upper mold 100 and the lower mold 200 are molded together. Then, the plunger 31 (refer to Figure 3 ) Press each tank block 30 (refer to Figure 1-3 ) is heated and melted to form a molten resin. As a result, the molten resin passes through the runner (resin channel) and the gate (refer to Figure 2 and Figure 3 ) is injected into the cavity formed in the upper mold 100. Then, the molten resin is heated only for the time required for solidification, thereby solidifying the molten resin to form a solidified resin. As a result, the chip 21 in the upper mold cavity and the temporary fixing sheet 12 around it are sealed in the solidified resin (sealing resin) formed in accordance with the shape of the cavity.

[0081] Next, after the required curing time has passed, the upper mold 100 and the lower mold 200 are opened to demold the resin molded product (not shown). Thereafter, the resin molded product sealed with resin by the molding mold 1000 is accommodated in the substrate accommodation portion 401 of the unloading module 4 using the unloader 6 .

[0082] The overall operation of the resin molding device 1 including the above series of operations is controlled by the control unit 9. Figure 1 In the embodiment, the control unit 9 is provided in the supply module 2, but may be provided in other modules. In addition, the control unit 9 is composed of a dedicated or general-purpose computer having a CPU, an internal memory, an AD converter, an input / output inverter, etc., for example.

[0083] Furthermore, the present invention is not limited to the above-mentioned embodiments, and they can be arbitrarily and appropriately combined, changed or selected for use as needed without departing from the gist of the present invention.

[0084] This application claims priority based on Japanese patent application No. 2021-023804 filed on February 17, 2021, and all contents disclosed in it are incorporated herein.

[0085] Description of Reference Numerals

[0086] 1 Resin molding device

[0087] 2 Supply module

[0088] 4 Remove the module

[0089] 5. Transport mechanism (loader)

[0090] 6. Transport mechanism (unloader)

[0091] 7 Substrate supply module

[0092] 8 Resin supply module

[0093] 9 Control Unit

[0094] 11 Carrier

[0095] 12 Temporary fixing piece

[0096] 13 Release film

[0097] 20 Resin (sealing resin)

[0098] 20a Residual materials and waste

[0099] 20b Runner resin part

[0100] 20c Gate resin part

[0101] 20d Burr (overflow)

[0102] 20a1 Tank

[0103] 20b1 Lower mold runner

[0104] 20b2 Upper mold runner

[0105] 20c2 Upper mold gate

[0106] 20X, 20Y resin molded products

[0107] 21 Chip

[0108] 30 Tank Block

[0109] 31 Plunger

[0110] 40 scrap pieces

[0111] 71 Board delivery section

[0112] 72 substrate supply unit

[0113] 81 Resin delivery unit

[0114] 82 Resin supply unit

[0115] 83 Storage Tank

[0116] 100 upper mold

[0117] 100a Upper mold main cavity block

[0118] 100b Upper die support base

[0119] 102 outer panel

[0120] 200 Lower die

[0121] 200a Lower mold main cavity block

[0122] 200b Lower die support base

[0123] 202 outer panel

[0124] 202a Carrier (frame)

[0125] 301 Wedge (gap adjustment mechanism)

[0126] 301a First wedge member (first wedge-shaped member)

[0127] 301b Second wedge member (second wedge-shaped member)

[0128] 302 drive mechanism

[0129] 303 mold base

[0130] 304 pressure plate (movable pressure plate)

[0131] 305 Fixed parts

[0132] 306 Wedge Power Transmission Parts

[0133] 401 substrate receiving portion

[0134] 1000 Forming die

[0135] 1000A, 1000B Resin molding module

[0136] 1001 Clamping area

[0137] T Resin Sheet

[0138] W Sealed front carrier

[0139] Y, Z arrows

Claims

1. A method for producing a resin molded product, wherein a molding object in which a chip is temporarily fixed to a carrier via a temporary fixing sheet is subjected to resin molding by transfer molding, Features The method comprises the following steps: using a molding die to resin mold the molding object by transfer molding; and a peeling step of peeling the temporary fixing sheet from the resin molded product after the resin molding step, The resin molding step is performed in a state where a gap is formed in a manner that the temporary fixing sheet disposed on the molding die does not contact the facing surface facing the temporary fixing sheet on the side where the chip is temporarily fixed, By peeling off the temporary fixing sheet in the peeling step, resin burrs formed by the resin flowing into the gaps are removed from the resin molded product in a state of being attached to the temporary fixing sheet.

2. The method for producing a resin molded article according to claim 1, wherein The method further includes a gap adjustment step of adjusting the thickness of the gap by moving at least a portion of the molding die.

3. The method for producing a resin molded article according to claim 1 or 2, wherein The resin molding step is performed in a state where the facing surface is constituted by a release film disposed on the molding die and the gap is formed between the temporary fixing sheet and the release film.

4. The method for producing a resin molded article according to claim 3, wherein The temporary fixing sheet is a temporary fixing sheet that can be peeled off from the resin molded product by heating, and the peeling process is performed by heating the temporary fixing sheet and the resin molded product to a temperature higher than that in the resin molding process.

5. A molding die for carrying out the method for producing a resin molded product according to any one of claims 1 to 4, Features The resin molding step may be performed in a state where the gap is formed so that the temporary fixing sheet disposed on the molding die and the facing surface facing the temporary fixing sheet on the side where the chip is temporarily fixed do not contact each other.

6. The molding die according to claim 5, wherein In the method for manufacturing the resin molded product, the resin molding step is performed in a state where the facing surface is formed of a release film arranged on the molding die and the gap is formed between the temporary fixing sheet and the release film. The resin molding step may be performed in a state where a surface of the molding die facing the temporary fixing sheet is covered with a release film and a gap is formed between the temporary fixing sheet and the release film.

7. A resin molding apparatus for carrying out the method for producing a resin molded product according to any one of claims 1 to 4, wherein a molding die is used.

8. The resin molding device according to claim 7, wherein The invention further comprises a gap adjustment mechanism for adjusting the thickness of the gap by moving at least a part of the forming die.

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