Electromagnetic induction heating temperature measurement control method, induction heating device, and storage medium

Abstract

The application relates to a temperature measurement control method, an induction heating device and a readable storage medium. The temperature measurement control method comprises the following steps: obtaining a thermal correlation impedance Z coil of an unloaded induction coil; obtaining a thermal correlation impedance Z set of an inductor assembly after inserting a heat receiving body; wherein the inductor assembly comprises an induction coil and a heat receiving body which is detachably inserted into the induction coil; obtaining a first thermal correlation impedance change amount delta Z according to the thermal correlation impedance Z coil of the unloaded induction coil and the thermal correlation impedance Z set of the inductor assembly; and determining a target heat receiving body temperature according to the first thermal correlation impedance change amount delta Z. The application aims to avoid the connection of a heat generating body with a lead and a circuit board, and reduce the assembly difficulty of an electronic cigarette.

Description

Technical Field

[0001] This invention relates to the field of smoking accessories technology, specifically to an electromagnetic induction heating temperature measurement and control method, an induction heating device, and a readable storage medium. Background Technology

[0002] Electronic cigarette devices typically use a heating element to heat the tobacco and e-liquid. To obtain the temperature of the heating element, a temperature detection circuit (TCR) or a temperature sensor (NTC, thermocouple, etc.) is usually installed on the electronic cigarette device. However, the temperature sensor needs to be placed close to the heating element, and these methods require connecting the heating element to the circuit board via leads, increasing the assembly difficulty of the electronic cigarette device. Summary of the Invention

[0003] To avoid connecting the heating element to leads and circuit boards, and to reduce the assembly difficulty of electronic cigarettes, it is necessary to provide a temperature control method and aerosol generation device for aerosol-generating products. This temperature control method includes:

[0004] Obtain the thermally dependent impedance Z of the unloaded induction coil coil ;

[0005] After inserting the sensing heating element, the thermally dependent impedance Z of the inductor assembly is obtained. set The inductor assembly includes an induction coil and a sensing heating element that is detachably inserted into the induction coil.

[0006] According to the thermal correlation impedance Z of the unloaded induction coil coil and the thermally dependent impedance Z of the inductor assembly set The first thermally related impedance change ΔZ is obtained;

[0007] The temperature of the target sensing heating element is determined based on the first thermally related impedance change ΔZ.

[0008] Alternatively, after inserting the sensing heating element, obtain the thermally dependent impedance Z of the inductor assembly. set The inductor assembly includes an induction coil and a sensing heating element that is detachably inserted into the induction coil.

[0009] Obtain the thermally dependent impedance Z of the inductor assembly again. set ';

[0010] The thermally correlated impedance Z will be obtained again. set 'Thermodependent impedance Z from the previous test' set The difference is used to obtain the second thermally related impedance change ΔZ'.

[0011] The temperature difference ΔT of the sensing heating element in different states is obtained based on the second thermally related impedance change ΔZ'.

[0012] In some embodiments of the present invention, the step of determining the temperature of the sensing heating element based on the first thermally correlated impedance change ΔZ includes:

[0013] Determine whether the relationship between the first thermally related impedance change ΔZ and the temperature of the sensing heating element satisfies the first preset correspondence.

[0014] If so, the temperature of the sensing element is obtained according to the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing element;

[0015] If not, perform transient changes at different frequencies, where the frequency is the operating frequency of the induction coil or the frequency of the electromagnetic field;

[0016] The temperature of the target heat-sensing element is determined based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element.

[0017] In some embodiments of the present invention, the step of confirming the temperature of the target heat-sensing element based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element includes:

[0018] If the temperature of the target sensing heating element cannot be determined, the operating frequency of the induction coil is changed transiently at different frequencies again.

[0019] Obtain multiple different first thermally related impedance changes ΔZ corresponding to multiple different frequencies f;

[0020] The temperature of the target heat-sensing element is determined based on the correspondence between multiple different changes in first thermally related impedance ΔZ and the temperature of the heat-sensing element.

[0021] In some embodiments of the present invention, after the step of confirming the temperature of the sensing element based on the correspondence between multiple different first thermally related impedance changes ΔZ and the temperature of the sensing element, the method further includes:

[0022] If the temperature of the target sensing heating element still cannot be determined;

[0023] The temperature of the sensing heat element is caused to drift by heating or cooling;

[0024] Re-execute based on the thermal correlation impedance Z of the unloaded induction coil coil and the thermally dependent impedance Z of the inductor assembly setThe steps include obtaining the first thermally related impedance change ΔZ, determining the temperature of the sensing heating element based on the first thermally related impedance change ΔZ, and determining the target sensing heating element temperature based on the temperature trend of the sensing heating element after temperature drift.

[0025] In some embodiments of the present invention, the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element includes a correspondence between each of the first thermally related impedance change ΔZ and a temperature of the sensing heating element.

[0026] Alternatively, the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element includes at least two correspondences between the first thermally related impedance change ΔZ and the temperature of the sensing heating element.

[0027] In some embodiments of the present invention, the step of confirming the temperature of the target heat-sensing element based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element includes:

[0028] At a first frequency f1, the first temperature of the induction coil at the first frequency f1 is measured, and the thermally related impedance Z corresponding to the first frequency f1 is calculated. coil，1 Thermally related impedance Z set，1 Determine the first thermally related impedance change ΔZ1, and refer to Table 1, which shows the relationship between ΔZ1 and the first temperature of the induction coil and the temperature of the sensing heating element.

[0029] The first frequency f1 is transiently changed to the second frequency f2. At the second frequency f2, the second temperature of the induction coil is measured. Based on the thermally related impedance Z corresponding to the second frequency f2... coil，2 Thermally related impedance Z set，2 Determine the other first thermally related impedance change ΔZ2, and refer to Table 2, which shows the relationship between ΔZ2 and the second temperature of the induction coil and the temperature of the sensing heating element.

[0030] The target sensing heating element temperature is confirmed based on △Z1, △Z2, Relationship Table 1, and Relationship Table 2.

[0031] In some embodiments of the present invention, the step of confirming the target sensing heating element temperature based on ΔZ1, ΔZ2, relation table one, and relation table two includes:

[0032] The first temperature group is confirmed in the relationship table 1 based on the first thermally related impedance change ΔZ1; wherein, the first temperature group includes at least two different temperature values ​​of the sensing heating element;

[0033] The second temperature group is confirmed in Relationship Table 2 based on the other first thermally related impedance change ΔZ2; wherein the second temperature group includes at least two different temperature values ​​of the sensing heating element;

[0034] The target temperature of the sensing heating element is confirmed to be within the error range in the first temperature group and the second temperature group. The error range is the ratio of the sensing heating element temperature values ​​in the first temperature group and the second temperature group to be between 1 / 10000 and 1 / 10, preferably between 1 / 1000 and 1 / 100.

[0035] In some embodiments of the present invention, the thermally dependent impedance Z of the unloaded induction coil is obtained. coil The steps include:

[0036] A temperature measuring element is set on the induction coil to obtain the dynamic temperature of the induction coil, and the current temperature is obtained by outputting the dynamic temperature.

[0037] The preset thermal correlation resistor R of the induction coil is called according to the current temperature. coil，1 and the preset thermally dependent inductor L coil ;

[0038] According to the preset thermal correlation resistance R of the induction coil coil，1 and the preset thermally dependent inductor L coil The thermally related impedance Z is obtained. coil ;

[0039] Alternatively, voltage and current sensors can be installed in the induction coil;

[0040] The thermally related impedance Z is obtained based on the measurement parameters of the voltage sensor and the current sensor. coil .

[0041] In some embodiments of the present invention, the temperature range of the induction coil is -50°C to 500°C, and preferably, the temperature range of the induction coil is -30°C to 200°C.

[0042] Alternatively, the temperature range of the sensing heating element is -70℃ to 700℃, and preferably, the temperature range of the induction coil is -30℃ to 375℃.

[0043] The present invention also proposes an induction heating device for heating an aerosol-generating product including a heat-sensing element, the induction heating device comprising:

[0044] The outer shell forms a cavity for accommodating at least a portion of the inner surface of the aerosol-generating article;

[0045] An induction coil is arranged around the cavity;

[0046] A microcontroller, electrically connected to the induction coil, is programmed to determine the thermally dependent impedance Z of the unloaded induction coil. coil Thermodependent impedance Z of inductor assembly set The first thermally related impedance change ΔZ is obtained and is also programmed to determine the temperature of the sensing element of the aerosol-generating article during operation using the first thermally related impedance change ΔZ, and / or is also programmed to monitor the change of the first thermally related impedance change ΔZ' to determine the temperature difference ΔT of the sensing element in different states.

[0047] In some embodiments of the present invention, the induction heating device includes a temperature sensor electrically connected to the microcontroller, the temperature sensor being used to detect the temperature of the induction coil.

[0048] In some embodiments of the present invention, the material of the sensing heat element includes a magnetic induction material, which is formed by heat treatment or cold treatment to meet the aforementioned temperature measurement method.

[0049] The present invention also proposes a computer-readable storage medium, characterized in that the computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the temperature measurement and control method described above.

[0050] It should be noted that the specification of this application contains a large number of technical features distributed across various technical solutions. Listing all possible combinations of technical features (i.e., technical solutions) would make the specification excessively lengthy. To avoid this problem, the various technical features disclosed in the above-described invention, the various technical features disclosed in the following embodiments and examples, and the various technical features disclosed in the accompanying drawings can be freely combined to form various new technical solutions (all of which are considered to have been described in this specification), unless such a combination of technical features is technically infeasible. For example, one example discloses feature A+B+C, and another example discloses feature A+B+D+E. Features C and D are equivalent technical means that serve the same function, and technically only one needs to be used; they cannot be used simultaneously. Feature E can be technically combined with feature C. Therefore, the solution A+B+C+D should not be considered as described because it is technically infeasible, while the solution A+B+C+E should be considered as described.

[0051] In the temperature control method for aerosol-generated products of the present invention, an inductor assembly is formed by inserting a sensing heating element into an induction coil, and the overall thermally dependent impedance Z of the inductor assembly is calculated. setAccording to the thermally dependent impedance Z of the induction coil coil The first thermally correlated impedance change ΔZ is obtained, which is the first thermally correlated impedance change ΔZ caused by the insertion of the sensing heating element. The temperature of the sensing heating element can then be obtained from this first thermally correlated impedance change ΔZ. Generally, there is a certain correlation between the temperature of a material and its thermally correlated resistivity. For example, the thermally correlated resistivity of a lamp filament increases at high temperatures, while ceramic bodies may become superconductors at extremely low temperatures. The first thermally correlated impedance change ΔZ has similar properties to thermally correlated resistance; the material exhibits different inductive reactances with temperature changes. Therefore, the technical solution of this invention does not require a wired connection to the heating element. The temperature of the heating element can be obtained through circuit and program settings, reducing the assembly difficulty of electronic cigarettes. Attached Figure Description

[0052] Figure 1 A schematic diagram of the hardware structure of the induction heating device for the temperature measurement and control method involved in this embodiment of the invention;

[0053] Figure 2 This is a flowchart illustrating an embodiment of the temperature measurement and control method of the present invention;

[0054] Figure 3 This is a schematic flowchart of another embodiment of the temperature measurement and control method of the present invention;

[0055] Figure 4 This is an equivalent circuit diagram of the induction heating device of the present invention;

[0056] Figure 5 This is a schematic diagram of the demodulator structure of the induction heating device of the present invention;

[0057] Figure 6 This is a schematic diagram of the induction heating device of the present invention;

[0058] Figure 7 The DC impedance R0 and permeability μ of the temperature measurement and control method of this invention are... r ZT plot showing the relationship with temperature;

[0059] Figure 8 The coil impedance of the temperature measurement and control method of the present invention is a complex impedance expressed in terms of magnitude and amplitude.

[0060] Explanation of icon numbers:

[0061] label name label name 100 Induction heating device 40 Temperature sensor 10 shell 50 Sensing Channel 11 cavity 60 power supply 20 Induction coil 200 Aerosol-generated products 30 microcontroller 210 Induction heating element Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0063] In this invention, when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is referred to as being "directly on" another element, there is no intervening element. When an element is considered to be "connected" to another element, the elements are interconnected to realize the function of the machine, including both dynamic and static connections. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only. The various objects in the embodiment drawings are drawn to scale for ease of illustration, not to scale of the actual components.

[0064] As one implementation method, induction heating devices can be as follows: Figure 1 As shown.

[0065] The present invention relates to an induction heating device 100, which includes: a processor 1001, such as a CPU, a memory 1002, and a communication bus 1003. The communication bus 1003 is configured to enable communication between these components.

[0066] The memory 1002 can be high-speed RAM (Random Access Memory) or stable memory (non-volatile memory), such as disk storage. Figure 1 As shown, the memory 1003, which serves as a computer storage medium, may include a program; and the processor 1001 may be configured to call the program in the memory 1002 and perform the following operations:

[0067] Obtain the thermally dependent impedance Z of the unloaded induction coil 20 coil ;

[0068] After inserting the sensing heating element 210, the thermally dependent impedance Z of the inductor assembly is obtained. set The inductor assembly includes an induction coil 20 and a sensing heating element 210 detachably inserted into the induction coil 20.

[0069] The first thermally related impedance change ΔZ is obtained based on the thermally related impedance Zcoil of the unloaded induction coil 20 and the thermally related impedance Zset of the inductor assembly.

[0070] The temperature of the target sensing heating element 210 is determined based on the first thermally related impedance change ΔZ.

[0071] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0072] Determine whether the relationship between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210 satisfies the first preset correspondence.

[0073] If so, the temperature of the sensing heating element 210 is obtained according to the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210;

[0074] If not, transient changes at different frequencies are performed, wherein the frequency is the operating frequency of the induction coil 20 or the frequency of the electromagnetic field;

[0075] The temperature of the target heat-sensing element 210 is confirmed based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element 210.

[0076] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0077] If the temperature of the target sensing heating element 210 cannot be determined, the operating frequency of the induction coil 20 is changed transiently at different frequencies again.

[0078] Obtain multiple different first thermally related impedance changes ΔZ corresponding to multiple different frequencies f;

[0079] The temperature of the target heat-sensing element 210 is confirmed based on the correspondence between multiple different changes in first thermally related impedance ΔZ and the temperature of the heat-sensing element 210.

[0080] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0081] If the temperature of the target sensing heating element 210 still cannot be determined;

[0082] The temperature of the sensing heat element 210 is caused to drift by heating or cooling;

[0083] The steps of obtaining the first thermally related impedance change ΔZ based on the thermally related impedance Zcoil of the unloaded induction coil 20 and the thermally related impedance Zset of the inductor assembly, determining the temperature of the sensing heating element 210 based on the first thermally related impedance change ΔZ, and determining the target sensing heating element 210 temperature based on the temperature trend of the sensing heating element 210 after temperature drift are re-executed.

[0084] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0085] At a first frequency f1, the first temperature of the induction coil 20 at the first frequency f1 is measured, and the thermally related impedance Z corresponding to the first frequency f1 is calculated. coil，1 Thermally related impedance Z set，1 Determine the first thermally related impedance change ΔZ1, and refer to Table 1, which shows the relationship between ΔZ1 and the first temperature of the induction coil 20 and the temperature of the sensing heating element 210.

[0086] The first frequency f1 is transiently changed to the second frequency f2. At the second frequency f2, the second temperature of the induction coil 20 is measured. Based on the thermally related impedance Z corresponding to the second frequency f2... coil，2 Thermally related impedance Z set，2 Determine the other first thermally related impedance change ΔZ2, and refer to Table 2, which shows the relationship between ΔZ2 and the second temperature of the induction coil 20 and the temperature of the sensing heating element 210.

[0087] The temperature of the target sensing heating element 210 is confirmed based on △Z1, △Z2, relation table one, and relation table two.

[0088] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0089] The first temperature group is confirmed in the relationship table 1 based on the first thermally related impedance change ΔZ1; wherein, the first temperature group includes at least two different temperature values ​​of the sensing heating element 210;

[0090] The second temperature group is confirmed in relation table two based on the other first thermally related impedance change ΔZ2; wherein the second temperature group includes at least two different temperature values ​​of the sensing heat source 210;

[0091] The temperature values ​​of the sensing heating element 210 in the first temperature group and the second temperature group that are within the error range are confirmed to be the target temperature of the sensing heating element 210, wherein the error range is the ratio of the temperature values ​​of the sensing heating element 210 in the first temperature group and the second temperature group to be between 1 / 1000 and 1 / 10.

[0092] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0093] After the temperature of the inserted heating element 210 changes, the thermal correlation resistance R of the induction coil 20 is obtained. coil，2 The induction coil 20 with and without inserted heating element 210 has a thermally related resistor R. coil，1 The difference △R coil ;

[0094] The thermally dependent inductance L of the inductor assembly is obtained after the temperature of the inserted heating element 210 changes. set Thermocoupled inductor L of induction coil 20 without insertion of heating element 210 coil The difference △L;

[0095] Calculate the inductive reactance based on the given ΔL, and determine the difference ΔR. coil Does the inductive reactance satisfy a preset size relationship?

[0096] If so, the inductive reactance is taken as the first thermally related impedance change ΔZ, and the difference ΔR is ignored. coil ;

[0097] If not, then the inductive reactance and the difference ΔR coil The sum of these values ​​is taken as the first thermally related impedance change ΔZ.

[0098] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0099] Determine the difference △R coil Is the rate of change of relative temperature much smaller than the rate of change of relative temperature of the inductive reactance?

[0100] Alternatively, determine when the difference ΔR is ignored. coil At that time, the relationship between the inductive reactance and temperature is not affected.

[0101] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0102] After the sensing heating element 210 is inserted, the current temperature of the induction coil 20 is acquired in real time;

[0103] Based on the current temperature, the temperature of induction coil 20 and the thermally related resistance value R of induction coil 20 are retrieved. coil The second preset correspondence yields the current thermally related resistance value R of the induction coil 20.coil，2 ;

[0104] Based on the current temperature, the thermally related resistance value R of induction coil 20 is... coil，2 And the initial induction coil 20 thermally related resistance value R coil，1 The difference ΔR is obtained. coil .

[0105] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0106] Without inserting the sensing heating element 210, establish the first temperature of the induction coil 20 and the inductance value L of the induction coil 20. coil The third pre-defined correspondence;

[0107] After the sensing heating element 210 is inserted and the sensing heating element 210 heats up, the second temperature of the induction coil 20 is acquired in real time and compared with the inductance value L of the inductor assembly. set Establish a fourth pre-defined correspondence;

[0108] According to the fourth preset correspondence, the inductance value L of the inductor assembly set The inductance value L of the induction coil 20 in the third preset correspondence coil The inductance influence factor ΔL is obtained.

[0109] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0110] A temperature measuring element is set in the induction coil 20 to obtain the dynamic temperature of the induction coil 20, and the dynamic temperature is output to obtain the current temperature;

[0111] The preset thermal correlation resistor R of the induction coil 20 is called according to the current temperature. coil，1 and the preset thermally dependent inductor L coil ;

[0112] According to the preset thermal correlation resistance R of the induction coil 20 coil，1 and the preset thermally dependent inductor L coil The thermally related impedance Z is obtained. coil .

[0113] In one embodiment, the processor 1001 may be configured to invoke a determination program stored in the memory 1002 and perform the following operations:

[0114] Obtain the thermally dependent impedance Z of the inductor assembly again. set ';

[0115] The thermally correlated impedance Z will be obtained again.set 'Thermodependent impedance Z from the previous test' set The difference is used to obtain the second thermally related impedance change ΔZ'.

[0116] The temperature difference ΔT of the sensing heating element 210 in different states is obtained based on the second thermally related impedance change ΔZ'.

[0117] In this embodiment, based on the above scheme, an inductor assembly is formed by inserting the heating element 210 into the induction coil 20, and the overall thermal impedance Z of the inductor assembly is calculated. set According to the thermally dependent impedance Z of the induction coil 20 coil The first thermally related impedance change ΔZ is obtained, which is the first thermally related impedance change ΔZ brought about by the insertion of the sensing heating element 210. The temperature of the sensing heating element 210 can then be obtained from this first thermally related impedance change ΔZ. Generally, the temperature of a material has a certain correlation with its thermally related resistivity. For example, the thermally related resistivity of a lamp filament increases at high temperatures, while ceramic bodies may become superconductors at extremely low temperatures. The first thermally related impedance change ΔZ has similar properties to thermally related resistance; the material exhibits different inductive reactances with temperature changes. Thus, the technical solution of this invention does not require a wired connection to the heating element. The temperature of the heating element can be obtained through circuit and program settings, reducing the assembly difficulty of electronic cigarettes.

[0118] Based on the above hardware architecture, an embodiment of the temperature measurement and control method of the present invention is proposed.

[0119] Reference Figures 2 to 4 , Figure 2 In one embodiment of the temperature measurement and control method of the present invention, the temperature measurement and control method includes the following steps:

[0120] Step S10: Obtain the thermally dependent impedance Z of the unloaded induction coil 20. coil The inductor assembly includes an induction coil 20 and a sensing heating element 210 detachably inserted into the induction coil 20. In this embodiment, the execution subject is an induction heating device 100. For ease of description, the device will be referred to as the induction heating device 100 below. The device needs to obtain the thermally dependent impedance Z of the inductor assembly. coil Specifically, it can be obtained directly from the voltage and current relationship in the circuit; the calculation method can refer to existing technology. Alternatively, the thermally related impedance Z... coilThis is the sum of the inductive reactance and the thermally dependent resistance of the inductor coil 20. The inductive reactance can be calculated based on the inductance. To obtain the thermally dependent inductance value of the inductor assembly, a thermally dependent inductance tester can be used to measure the amplitude, phase, and fundamental frequency of the current flowing through it after applying a sinusoidal voltage. Alternatively, it can be used with a capacitor to form an oscillating circuit. Unlike a resonant circuit, the oscillation frequency of the thermally dependent inductance can be calculated based on the change in oscillation frequency. The basic guarantee for the oscillation method is that the oscillation frequency must be relatively stable. We use an 1ABXΔE oscillator because it has a wide frequency range and is relatively stable. We also use a Colpitts oscillator because it has a wide frequency range and is relatively stable. Its fundamental frequency is:

[0121] Assuming c remains constant, let be an undetermined coefficient that becomes a constant;

[0122] have

[0123] Therefore, based on the oscillation frequency f, the corresponding thermally dependent inductance L can be obtained.

[0124] Step S20: After inserting the sensing heating element 210, obtain the thermally dependent impedance Z of the inductor assembly. set The inductor assembly includes an induction coil 20 and a sensing heating element 210 detachably inserted into the induction coil 20; the sensing heating element 210 detachably inserted into the induction coil 20 and the induction coil 20 form an integral whole (approximately an iron-core coil assembly). The impedance can be calculated using the inductance calculation formula for an iron-core coil, and then the inductive reactance can be calculated based on the inductance. The inductive reactance can be represented by Lx, where Lx = 2πfL (f is in Hz, Lx is in Ohms, and the self-inductance coefficient L is in Henlein). It is understood that the inductive reactance obtained in this embodiment is related to the heat-dependent inductance value of the inductor assembly formed by the insertion of the sensing heating element 210 into the induction coil 20. This inductive reactance is not limited to the general inductive reactance calculation formula mentioned above; it can also be obtained by further processing the heat-dependent inductance value of the entire assembly and then calculating the corresponding inductive reactance from the result. The sum of the inductive reactance and the heat-dependent resistance is the heat-dependent impedance Z of the inductor assembly. set Furthermore, the inductive reactance can be calculated using thermally dependent inductance as a parameter, which in turn uses magnetic permeability as a parameter. Since the magnetic permeability of a material changes with temperature, the temperature can be obtained from the inductive reactance through a specific correspondence between the two. This correspondence can be established by mapping inductive reactance to temperature, and then applied after obtaining the inductive reactance.

[0125] Step S30: Obtain the first thermally related impedance change ΔZ based on the thermally related impedance Zcoil of the unloaded induction coil 20 and the thermally related impedance Zset of the inductor assembly; in one embodiment, the thermally related impedance change ΔZ can be obtained by subtraction.

[0126] Step S40: Determine the temperature of the sensing heat source 210 based on the first thermally related impedance change ΔZ. The first thermally related impedance change ΔZ has similar properties to thermally related resistance; the material exhibits different impedances as the temperature changes.

[0127] In one implementation scenario, when the sensing heating element 210 is placed inside the aerosol generating article 200, the aerosol generating article 200 is preferably a substrate capable of releasing a volatile composition that can form an aerosol. The volatile composition is released by heating the aerosol generating article 200. The aerosol generating article 200 can be solid or liquid, or comprise both solid and liquid components. In a preferred embodiment, the aerosol generating article 200 is solid.

[0128] The aerosol-generating article 200 may include nicotine. The nicotine in the aerosol-generating article 200 may be a nicotine salt matrix. The aerosol-generating article 200 may include plant-based materials. The aerosol-generating article 200 may include tobacco, and preferably the tobacco-containing material contains volatile tobacco-scented compounds that are released from the aerosol-generating article 200 upon heating.

[0129] The aerosol-generating article 200 may include homogeneous tobacco material. The homogeneous tobacco material can be formed by condensing particulate tobacco. When present, the homogeneous tobacco material may have an aerosol-forming content equal to or greater than 5% by dry weight, preferably between 5% and 30% by dry weight.

[0130] The aerosol-generating article 200 may alternatively include materials that do not contain tobacco. The aerosol-generating article 200 may include homogeneous plant-based materials.

[0131] The aerosol generating article 200 may include at least one aerosol forming agent. The aerosol forming agent may be any suitably known compound or mixture of compounds that promotes the formation of a thick, stable aerosol during use and is substantially heat-resistant and degradable at the operating temperature of the aerosol generating device. Suitable aerosol forming agents are well known in the art and include, but are not limited to: polyols such as triethylene glycol, 1,3-butanediol, and glycerol; esters of polyols such as mono, di, or triacetin of glycerol; and esters of mono, di, or polycarboxylic acids such as dimethyl dodecanedicarboxylate and dimethyl tetradecenoate. Specifically, preferred aerosol forming agents are polyols or mixtures thereof, such as triethylene glycol, 1,3-butanediol, and more preferably glycerol. The aerosol generating article 200 may include other additives and ingredients, such as flavorings. The aerosol generating article 200 preferably includes nicotine and at least one aerosol forming agent. In a particularly preferred embodiment, the aerosol forming agent is glycerol.

[0132] When the heating element 210 is placed inside the induction coil 20, an alternating magnetic field is generated within the coil when current is input. Since the heating element 210 in the center of the coil 20 can be represented as a series of closed circuits in the circumferential direction, and the magnetic flux B in these closed circuits is constantly changing, an induced electromotive force and an induced current are generated in the circumferential direction of the heating element 210. The direction of the current is circular along the circumference of the heating element 210, like concentric vortices. Therefore, this phenomenon of electromagnetic induction generating an induced current within the heating element 210 is called the eddy current phenomenon. The induced current flows within the metal, overcoming its resistance and converting electrical energy into heat energy, thus heating the heating element 210 and forming an aerosol.

[0133] In the technical solution provided in this embodiment, an inductor assembly is formed by inserting the sensing heating element 210 into the induction coil 20, and the overall thermally dependent impedance Z of the inductor assembly is calculated. set According to the thermally dependent impedance Z of induction coil 20 coil The first thermally related impedance change ΔZ is obtained, which is the first thermally related impedance change ΔZ brought about by the insertion of the sensing heating element 210. The temperature of the sensing heating element 210 can then be obtained from this first thermally related impedance change ΔZ. Generally, the temperature of a material has a certain correlation with its thermally related resistivity. For example, the thermally related resistivity of a lamp filament increases at high temperatures, while ceramic bodies may become superconductors at extremely low temperatures. The first thermally related impedance change ΔZ has properties similar to resistance, and the material exhibits different inductive reactances with temperature changes. Thus, the technical solution of this invention does not require a wired connection to the heating element; the temperature of the heating element can be obtained through circuit and program settings, reducing the assembly difficulty of electronic cigarettes.

[0134] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the step of determining the temperature of the sensing heating element 210 according to the first thermally related impedance change ΔZ includes:

[0135] Step S41: Determine whether the relationship between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210 satisfies a first preset correspondence. This first correspondence is either a one-to-one correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210, or a many-to-one relationship between multiple first thermally related impedance changes ΔZ and the temperature of the sensing heating element 210. In either case, the temperature of the sensing heating element 210 can be determined through the first thermally related impedance change ΔZ. In this embodiment, the relationship between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210 can be determined based on the temperature of the sensing heating element 210 being in different temperature ranges. This is because when composite materials or partially magnetic induction materials are used, the permeability of the sensing heating element 210 is non-linear, thus the correspondence displayed at different temperatures is different. For example, in the low temperature range (50-100 degrees Celsius), the relationship between the change in the first thermally related impedance ΔZ and the temperature of the sensing heating element 210 is one-to-one or many-to-one. However, when in the medium-high temperature range (e.g., 100-350 degrees Celsius), the relationship between the change in the first thermally related impedance ΔZ and the temperature of the sensing heating element 210 may not be one-to-one or many-to-one.

[0136] Step S42: If yes, the temperature of the sensing heating element 210 is obtained according to the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210; if the correspondence is satisfied, the determined temperature of the sensing heating element 210 can be obtained according to this correspondence.

[0137] Step S43: If not, perform transient frequency changes at different frequencies, where the frequency is the operating frequency of the induction coil 20 or the frequency of the electromagnetic field. Because the impedance change of different materials of the sensing heating element 210 has different relationships with temperature, the first heat-related impedance change ΔZ may not have a one-to-one correspondence or a many-to-one relationship with the temperature of the sensing heating element 210 (for example, the sensing heating element 210 is made of alloy material or mixed material compared to the sensing heating element 210 made of a single material). If the first heat-related impedance change ΔZ is not a one-to-one correspondence or a many-to-one relationship with the temperature of the sensing heating element 210, then the definite heating temperature of the sensing element cannot be obtained. Therefore, it is necessary to perform transient frequency conversion on the circuit to obtain more of the first heat-related impedance change ΔZ. It should be noted that transient frequency conversion refers to instantaneous frequency conversion within a very short period of time. Under instantaneous frequency conversion, the temperature of the sensing heating element 210 does not have time to change, thus preventing temperature drift of the sensing heating element 210. Therefore, the first thermally related impedance change ΔZ obtained at this time is similar to the relationship between the previous first thermally related impedance change ΔZ and temperature.

[0138] Step S44: Based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the sensing heating element 210, the temperature of the target sensing heating element 210 is confirmed. The inductive reactance is different at different frequencies, so different first thermally related impedance changes ΔZ can be obtained. Since there are multiple first thermally related impedance changes ΔZ, the same temperature corresponding to the multiple first thermally related impedance changes ΔZ and the temperature can be confirmed. This same temperature is the temperature of the sensing heating element 210.

[0139] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the step of confirming the temperature of the target heat sensing element 210 according to the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat sensing element 210 includes:

[0140] Step S45: If the temperature of the target sensing heating element 210 cannot be determined, the operating frequency of the induction coil 20 is changed transiently at different frequencies again, and more transient frequency conversions are performed at different frequencies to obtain more changes in the first thermally related impedance ΔZ.

[0141] Step S46: Obtain multiple different first thermally related impedance changes ΔZ corresponding to multiple different frequencies f;

[0142] Step S47: Based on the correspondence between multiple different first thermally related impedance changes ΔZ and the temperature of the sensing heating element 210, the temperature of the target sensing heating element 210 is confirmed. Since there are multiple first thermally related impedance changes ΔZ, the same temperature corresponding to the multiple first thermally related impedance changes ΔZ and the temperature can be confirmed at this time. This same temperature is the temperature of the target sensing heating element 210.

[0143] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, after the step of confirming the temperature of the sensing heating element 210 according to the correspondence between at least a plurality of different first thermally related impedance changes ΔZ and the temperature of the sensing heating element 210, the method further includes:

[0144] Step S48: If the temperature of the sensing heating element 210 still cannot be determined; when the temperatures obtained from at least three changes in the first thermally related impedance ΔZ are all different, the temperature determined by the sensing heating element 210 cannot be determined at this time.

[0145] Step S49: The temperature of the sensing heating element 210 is shifted by heating or cooling. It is understood that the heating and cooling in this embodiment are to the extent that the temperature of the sensing heating element 210 shifts, that is, the heating or cooling is performed for a relatively long time. Specifically, the duration can be selected from 0.1 seconds to 5 seconds. The cooling method can be by ventilating, and the heating method can be by increasing the output power of the power supply 60, thereby increasing the temperature of the sensing heating element 210.

[0146] Step S491: Re-execute the step of obtaining the first thermally related impedance change ΔZ based on the thermally related impedance Zcoil of the unloaded induction coil 20 and the thermally related impedance Zset of the inductor assembly, and determine the temperature of the sensing heating element 210 based on the first thermally related impedance change ΔZ. Then, determine the temperature of the sensing heating element 210 based on the temperature trend of the sensing heating element 210 after temperature drift. At this time, the temperature of the sensing heating element 210 can be determined based on its temperature trend. Specifically, when temperature drift is achieved by increasing the temperature, under the same conditions, the previous temperature of the sensing heating element 210 should be lower than the subsequent temperature. If the temperature of the sensing heating element 210 decreases or remains unchanged under the same conditions, then the value is determined to be incorrect, and the temperature corresponding to the temperature drift is taken as the heating temperature of the sensing element. When temperature drift is achieved by cooling, under the same conditions, the previous temperature of the sensing heat source 210 should be higher than the next temperature. If the temperature of the sensing heat source 210 increases or remains unchanged under the same conditions, then the value is determined to be incorrect, and the temperature corresponding to the temperature drift is taken as the heating temperature of the sensing body.

[0147] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210 includes a correspondence between each of the first thermally related impedance change ΔZ and one of the temperatures of the sensing heating element 210. In this embodiment, the relationship is a one-to-one correspondence. The target temperature of the sensing heating element 210 can be obtained based on this one-to-one correspondence. Referring to the reference table below, when the temperature of the induction coil 20 is detected to be 25 degrees Celsius, and the obtained first thermally related impedance change ΔZ is 3.317, the temperature of the sensing heating element 210 can be determined to be 60 degrees Celsius. Alternatively, the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element 210 includes at least two correspondences between the first thermally related impedance change ΔZ and one of the temperatures of the sensing heating element 210. In this embodiment, the relationship is a many-to-one correspondence. Since the corresponding target temperature of the sensing heating element 210 is unique, the target temperature of the sensing heating element 210 can be obtained based on this many-to-one correspondence.

[0148] Reference table:

[0149]

[0150] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the step of confirming the temperature of the target heat sensing element 210 according to the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat sensing element 210 includes:

[0151] Step S441: At the first frequency f1, measure the first temperature of the induction coil 20 at the first frequency f1, and determine the thermally related impedance Z corresponding to the first frequency f1. coil，1 Thermally related impedance Z set，1The first thermally related impedance change ΔZ1 is determined, and the relationship table 1 between ΔZ1 and the first temperature of the induction coil 20 and the temperature of the sensing heating element 210 is retrieved. It can be understood that in this embodiment, the inductive reactance can be represented by Lx, where Lx = 2πfL (f is in Hz, Lx is in Ohms, and the self-inductance coefficient L is in Henlein). Due to the change in frequency, the inductive reactance will change, and since impedance equals the sum of inductive reactance and resistance, the impedance will also change with the frequency. Then, by consulting the impedance-temperature relationship table of the induction coil 20, the temperature of the sensing heating element 210 corresponding to the current impedance change at the current temperature can be obtained. This relationship table 1 can be understood as the relationship table 1 at the first frequency f1. In this embodiment, the temperature gradient of the induction coil 20 and the temperature of the sensing heating element 210 can be pre-tested and pre-stored, and the thermally related impedance change can also be pre-calculated to form the relationship table 1. The temperatures of the aforementioned induction coil 20 and sensing heating element 210 can be measured in advance in the laboratory. Specifically, this can be achieved by setting up an insulation box, placing the sensing heating element 210 and induction coil 20 inside the insulation box, and monitoring their temperatures in real time using a temperature sensor 40.

[0152] In this embodiment, the relationship table shown below can be referred to.

[0153]

[0154]

[0155] Step S442: The first frequency f1 is transiently changed to the second frequency f2. At the second frequency f2, the second temperature of the induction coil 20 is measured. Based on the thermally related impedance Z corresponding to the second frequency f2... coil，2 Thermally related impedance Z set，2Determine another first thermally related impedance change, ΔZ2, and refer to Table 2, which relates ΔZ2 to the second temperature of the induction coil 20 and the temperature of the sensing heating element 210. Similarly, in this embodiment, the inductive reactance can be represented by Lx, where Lx = 2πfL (f is in Hz, Lx is in Ohms, and the self-inductance coefficient L is in Henle H). Due to the change in frequency, the inductive reactance will change, and since impedance is equal to the sum of inductive reactance and resistance, the impedance will also change with the frequency. By referring to the table of impedance and temperature of the induction coil 20, the temperature of the sensing heating element 210 corresponding to the current impedance change at the current temperature can be obtained. This Table 2 can be understood as the table of relationships at the first frequency f2. In this embodiment, the temperature gradient of the induction coil 20 and the temperature of the sensing heating element 210 can be pre-tested and pre-stored, and the thermally related impedance change can also be pre-calculated to form Table 2. The temperatures of the aforementioned induction coil 20 and sensing heating element 210 can also be measured in advance in the laboratory. Specifically, this can be achieved by setting up an insulation box, placing the sensing heating element 210 and induction coil 20 inside the insulation box, and monitoring their temperatures in real time through a temperature sensor 40.

[0156] Relationship Table 2:

[0157]

[0158]

[0159] Step S443: Confirm the temperature of the target sensing heating element 210 based on ΔZ1, ΔZ2, relation table one, and relation table two. By repeatedly measuring the current impedance change, the corresponding sensing element heating temperature can be obtained by looking up the tables, thus confirming the temperature of the target sensing heating element 210.

[0160] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the step of confirming the temperature of the target sensing heating element 210 according to ΔZ1, ΔZ2, relation table one, and relation table two includes:

[0161] Step S4431: Based on the first thermally related impedance change ΔZ1, confirm the first temperature group in Relationship Table 1; wherein, the first temperature group includes at least two different temperature values ​​of the sensing heating element 210; since the thermally related impedance change and the temperature of the sensing heating element 210 are not in a one-to-one or many-to-one relationship, but rather a one-to-many relationship, one thermally related impedance change corresponds to at least two different temperature values ​​of the sensing heating element 210. Referring to the aforementioned Relationship Table 1, for example, when the coil temperature is 30 degrees and ΔZ1 is 3.219, the temperature of the sensing heating element 210 is 50 degrees or 55 degrees.

[0162] Step S4432: Based on the other first thermally related impedance change ΔZ2, confirm the second temperature group in relation table two; wherein, the second temperature group includes at least two different temperature values ​​of the sensing heating element 210; referring to the aforementioned relation table two, for example, when the coil temperature is such that ΔZ2 is 3.219, the temperature of the sensing heating element 210 is 55 degrees or 60 degrees.

[0163] Step S4433: Confirm that the temperature value of the sensing heating element 210 in the first temperature group and the second temperature group that is within the error range is the target temperature of the sensing heating element 210. The error range is the ratio of the temperature values ​​of the sensing heating element 210 in the first temperature group and the second temperature group that is between 1 / 10000 and 1 / 10. Preferably, the ratio of the temperature values ​​is between 1 / 1000 and 1 / 100.

[0164] By confirming that the same temperature of the sensing element 210 is found in both temperature groups, the target temperature of the sensing element 210 is determined. Specifically, if the same temperature of the sensing element 210 is found to be 55 degrees Celsius in both temperature groups, then the temperature of the sensing element 210 is determined to be 55 degrees Celsius. However, it is possible that two temperature groups may contain two identical temperatures (i.e., the higher temperature in one group is the same as the higher temperature in the other group; or the lower temperature in one group is the same as the lower temperature in the other group). In this case, a next transient frequency conversion is performed to obtain more thermally related impedance changes. If the temperature still cannot be determined, the aforementioned step of determining the temperature of the sensing element 210 after at least three frequency conversions is executed.

[0165] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the step of measuring the temperature according to the thermally related impedance Z... coil and the thermally related impedance Z set The steps to obtain the first thermally related impedance change ΔZ include:

[0166] Step S31: When the sensing heating element 210 is not inserted, based on the coil temperature, the thermally related resistor R1 and the thermally related inductor L... coil The thermally related impedance Z is obtained. coil ;

[0167] Step S32: After the sensing heating element 210 is inserted and the sensing heating element 210 heats up, the thermally related resistor R2 and the thermally related inductor L are used to determine the thermally related resistance and inductance. set The thermally related impedance Z is obtained. set ;

[0168] Step S33, the thermally related impedance Z set and the thermally related impedance Z coil The difference is used to obtain the first thermally related impedance change ΔZ.

[0169] It is understandable that, according to Z=R+ωL x j, we can obtain the impedance as the sum of resistance and reactance, and the reactance as the product of inductance and angular frequency. Therefore, the impedance can be obtained by measuring the values ​​of resistance and inductance. Then, by subtracting the impedance of the device from the impedance of the coil after inserting the sensing heating element 210, we can obtain the impedance change caused by the sensing heating element 210.

[0170] In some embodiments of the present invention, the thermally dependent impedance Z is... set and the thermally related impedance Z coil The steps for obtaining the first thermally related impedance change ΔZ by subtraction include:

[0171] Step S331: Obtain the difference ΔR between the thermally related resistance R2 of the induction coil 20 and the thermally related resistance R1 of the induction coil 20 without the induction heating element 210 inserted and heated. coil Specifically, the effect of temperature change on resistance can be obtained from the resistance-temperature relationship curve. By referring to the property tables of different coil materials in existing technology, the relationship between resistivity and temperature can be obtained.

[0172] Step S332: Obtain the thermally dependent inductance L of the inductor assembly after the inserted heating element 210 is heated. set Thermocoupled inductor L of induction coil 20 without insertion of heating element 210 coil The difference △L;

[0173] Step S333: Calculate the inductive reactance based on ΔL, and determine the difference ΔR. coil The inductive reactance is determined by whether it satisfies a preset magnitude relationship. This inductive reactance is closely related to the sensing heat source 210, and the relationship between temperature and the sensing heat source 210 can be confirmed through the relationship between the inductive reactance and temperature. In one embodiment, the inductive reactance Lx has the following equation: ΔLx = 2πfΔL. The relevant parameters of the inductive reactance are obtained by multiplying the difference ΔL by the frequency. Furthermore, in another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the inductive reactance is calculated according to the ΔL, and the difference ΔR is determined. coil The step of determining whether the inductive reactance satisfies a preset magnitude relationship includes: within a temperature range, determining the difference ΔR. coil Whether it is much smaller than the stated inductive reactance; when comparing the two within a temperature range, if the values ​​differ significantly (e.g., 10 to 1000 times, or 50, 100, 200, 300, 400, 500, 600, 700, 800, 900, etc.), then the difference ΔR can be determined.coil The correlation with temperature is not significant, therefore the difference ΔR can be omitted. coil The temperature of the sensing heating element 210 is confirmed. Alternatively, the difference ΔR is determined. coil Is the first rate of change of relative temperature much smaller than the second rate of change of relative temperature of the inductive reactance? By judging the rates of change of these two rates, the closeness of their relationship with temperature can be obtained. When the first rate of change is much smaller than the second rate of change, the difference ΔR can be determined. coil The correlation with temperature is not significant, therefore the difference ΔR can be omitted. coil The temperature of the sensing heating element 210 is confirmed; or, it is determined that the difference ΔR is ignored. coil At that time, the relationship between the inductive reactance and temperature is not affected.

[0174] Step S334: If yes, then the inductive reactance is taken as the first thermally related impedance change ΔZ, and the difference ΔR is ignored. coil When the magnitude relationship is satisfied, it can be understood that the difference in inductive reactance ΔL is much larger than the difference ΔR. coil At this point, △R can be considered as coil The correlation with the temperature of the sensing heating element 210 is not significant, therefore ΔR can be ignored. coil ;

[0175] Step S335, if not, then the inductive reactance and the difference ΔR coil The sum of these two values ​​is taken as the first thermally related impedance change ΔZ. When the difference between the two is not significant, the inductive reactance and the difference ΔR are considered to be the sum of the inductive reactance and the difference ΔR. coil The two factors are closely related to the temperature of the sensing heating element 210, so the sum of the two factors is used as the control parameter for obtaining the temperature of the sensing heating element 210.

[0176] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the difference ΔR between the thermally related resistance R2 of the induction coil 20 and the thermally related resistance R1 of the induction coil 20 without the induction coil 20 after the insertion of the heating element 210 and the heating element 210 is heated is obtained. coil The steps include:

[0177] Step S3311: After inserting the sensing heating element 210, the current temperature of the induction coil 20 is acquired in real time;

[0178] Step S3312: Based on the current temperature, the temperature of the induction coil 20 and the thermally related resistance value R of the induction coil 20 are retrieved. coil The second preset correspondence yields the current thermally related resistance value R of the induction coil 20. coil，2 .

[0179] Step S3313: Based on the thermally related resistance value R of the induction coil 20 corresponding to the current temperature. coil，2 And the initial thermally related resistance value R of the induction coil 20 coil，1 The difference ΔR is obtained. coil In this embodiment, by acquiring the temperature and referring to a resistance-temperature property table, the resistance of the induction coil 20 at different temperatures is obtained. The difference ΔR can then be obtained by subtracting the resistance values. coil In this embodiment, by obtaining the thermally related resistance values ​​of the unloaded coil without the insertion of the sensing heating element 210 at different temperatures, the thermally related resistance value of the coil under no-load conditions is used as a correction factor for the impedance influence factor of the inductor assembly as a whole. This allows for a more accurate assessment of the contribution of the sensing heating element 210 to the impedance influence factor relative to the overall inductor assembly, thereby improving the correlation between the impedance influence factor and the sensing heating element 210 and ultimately enhancing the accuracy of temperature measurement for the sensing heating element 210.

[0180] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, the heat-related inductance L of the inductor assembly after the insertion of the heating element 210 is obtained... set Thermocoupled inductor L of induction coil 20 without insertion of heating element 210 coil The steps to calculate the difference ΔL include:

[0181] Step S3321: Before inserting the sensing heating element 210, establish the first temperature of the induction coil 20 and the inductance value L of the induction coil 20. coil The third preset correspondence; In this embodiment, by obtaining the thermally related inductance value of the unloaded coil when the sensing heating element 210 is not inserted at different temperatures, the thermally related inductance value of the coil when unloaded is used as a correction factor for the overall thermally related inductance value of the inductor assembly, thereby obtaining a more accurate contribution of the sensing heating element 210 to the thermally related inductance relative to the overall inductor assembly, thereby obtaining the contribution of the sensing heating element 210 to the inductive reactance, improving the correlation between the inductive reactance and the sensing heating element 210, and thus improving the accuracy of the temperature measurement of the sensing heating element 210.

[0182] Step S3322: After the sensing heating element 210 is inserted and the sensing heating element 210 heats up, the second temperature of the induction coil 20 is acquired in real time and compared with the inductance value L of the inductor assembly. setA fourth preset correspondence is established. In this embodiment, by obtaining the heat-dependent inductance of the inductor assembly after the insertion of the sensing heating element 210, and combining it with the heat-dependent inductance of the induction coil 20 when the sensing heating element 210 is not inserted, the contribution of the sensing heating element 210 to the overall heat-dependent inductance of the inductor assembly can be confirmed, thereby obtaining the contribution of the sensing heating element 210 to the inductive reactance. At this time, the temperature of the induction coil 20 may be affected by the heat transfer of the sensing heating element 210, and the temperature is higher than that when the coil is not inserted. By establishing the relationship between temperature and heat-dependent inductance in this state (e.g., forming a curve), a more suitable overall heat-dependent inductance of the inductor assembly can be obtained from the curve.

[0183] Step S3323: According to the inductance value L of the inductor assembly in the fourth preset correspondence relationship set The inductance value L of the induction coil 20 in the third preset correspondence coil The inductance influence factor ΔL is obtained. In one embodiment, the change in inductive reactance ΔLx (inductive reactance) exists according to the following equation: ΔLx = 2πfΔL. The relevant parameters of the inductive reactance are obtained by multiplying this thermally related inductance influence factor by the frequency. This inductive reactance is the inductive reactance closely related to the sensing and heating element 210. Furthermore, the relationship between temperature and the sensing and heating element 210 can be confirmed by the relationship between the inductive reactance and temperature.

[0184] In another embodiment of the temperature measurement and control method of the present invention, based on the above embodiment, when the sensing heating element 210 is not inserted, the temperature is determined according to the coil temperature, the thermally related resistor R1, and the thermally related inductor L. coil The thermally related impedance Z is obtained. coil The steps include: setting a temperature measuring element in the induction coil 20, acquiring the dynamic temperature of the induction coil 20, and outputting the dynamic temperature to obtain the current temperature; and calling the preset thermally related resistance R of the induction coil 20 according to the current temperature. coil，1 and the preset thermally dependent inductor L coil According to the preset thermal correlation resistance R of the induction coil 20 coil，1 and the preset thermally dependent inductor L coil The thermally related impedance Z is obtained. coil Since the relationships between temperature and resistance, and temperature and inductance, can be pre-measured and set, the resistance and inductance under different conditions can be selected according to different temperatures, thereby directly obtaining the coil impedance at different temperatures.

[0185] Reference Figure 3 In other embodiments of the present invention, the steps of the electromagnetic induction heating temperature measurement and control method include:

[0186] Step S10a: Obtain the thermally dependent impedance Z of the inductor assembly. setThe inductor assembly includes an induction coil 20 and a sensing heating element 210 detachably inserted into the induction coil 20.

[0187] Step S20a, obtain the thermally dependent impedance Z of the inductor assembly again. set ';

[0188] Step S30a, the thermally dependent impedance Z obtained again set 'Thermodependent impedance Z from the previous test' set The difference is used to obtain the second thermally related impedance change ΔZ'.

[0189] In step S40a, the temperature difference ΔT of the sensing heating element 210 in different states is obtained based on the second thermally related impedance change ΔZ'. By judging ΔT, it can be determined whether the sensing heating element 210 is heating up.

[0190] In some embodiments of the present invention, the temperature range of the induction coil 20 is -50°C to 500°C. When the induction heating device 100 is used in winter, the temperature of the induction coil 20 is low, possibly reaching sub-zero temperatures. When the heating element 210 is inserted into the coil, some of the heat from the heating element 210 is transferred to the induction coil 20, thereby increasing the temperature of the induction coil 20. Therefore, the temperature sensing range of the temperature sensor 40 or the temperature measuring element should at least meet the above-mentioned range. By measuring the temperature within this temperature range, referring to the aforementioned steps, the resistance and inductance corresponding to this temperature range are obtained, and then the impedance within this range is obtained. It is understood that the temperature of the induction coil 20 can also be selected from any value among -40°C, -30°C, -20°C, -10°C, 0°C, 10°C, 50°C, 100°C, 150°C, 200°C, 250°C, 300°C, 350°C, and 450°C to form a range. The temperature range of the sensing heating element 210 is -70℃ to 700℃, and preferably, the temperature range of the induction coil 20 is -30℃ to 375℃. The temperature of the sensing heating element 210 can also be selected from any value among -20℃, -10℃, 0℃, 10℃, 50℃, 100℃, 150℃, 200℃, 250℃, 300℃, and 350℃.

[0191] Reference Figure 6 The present invention also discloses an induction heating device 100 for heating an aerosol generating article 200 including a sensing heating element 210, the induction heating device 100 comprising:

[0192] The outer shell 10 forms a cavity 11 for accommodating at least a portion of the inner surface of the aerosol generating article 200;

[0193] An induction coil 20 is arranged around the cavity 11;

[0194] Microcontroller 30, electrically connected to induction coil 20, is programmed to determine the thermally dependent impedance Z of unloaded induction coil 20. coil Thermodependent impedance Z of inductor assembly set The first thermally related impedance change ΔZ is obtained and is also programmed to determine the temperature of the heat-sensing element 210 of the aerosol generating article 200 during operation by means of the first thermally related impedance change ΔZ, and / or is also programmed to monitor the change of the first thermally related impedance change ΔZ' to determine the temperature difference ΔT of the heat-sensing element 210 in different states.

[0195] The induction heating device 100 of the aerosol generating article 200 of the present invention comprises a housing 10 having a cavity 11, and an induction coil 20 surrounding the cavity 11. A microcontroller 30 is electrically connected to the induction coil 20, and the microcontroller 30 is further programmed to adjust the induction coil 20 according to the thermally dependent impedance Z of the unloaded induction coil 20. coil Thermodependent impedance Z of inductor assembly set The first thermally related impedance change ΔZ is obtained, and the device is also programmed to determine the temperature of the sensing element 210 of the aerosol generating article 200 during operation using the first thermally related impedance change ΔZ, and / or, is also programmed to monitor the change of the first thermally related impedance change ΔZ' to determine the temperature difference ΔT of the sensing element 210 in different states. The device is then used to form an inductor assembly by inserting the aerosol generating article 200 with the sensing element 210 into the induction coil 20, and to calculate the overall thermally related impedance Z of the inductor assembly. set According to the thermally dependent impedance Z of the induction coil 20 coil The first thermally related impedance change ΔZ is obtained, which is the first thermally related impedance change ΔZ brought about by the insertion of the sensing heating element 210. The temperature of the sensing heating element 210 can then be obtained from this first thermally related impedance change ΔZ. Generally, the temperature of a material has a certain correlation with its thermally related resistivity. For example, the thermally related resistivity of a lamp filament increases at high temperatures, while ceramic bodies may become superconductors at extremely low temperatures. The first thermally related impedance change ΔZ has similar properties to thermally related resistance; the material exhibits different inductive reactances with temperature changes. Thus, the technical solution of this invention does not require a wired connection to the heating element. The temperature of the heating element can be obtained through circuit and program settings, reducing the assembly difficulty of electronic cigarettes.

[0196] The "induction heating device 100" described in this embodiment of the invention refers to a device used to heat but not burn the aerosol generating product 200 to generate an aerosol, such as a smoking device.

[0197] The induction heating device 100 of this application also includes a DC power supply 60, which may generally include any suitable DC power supply 60, particularly including a power supply 60 unit connected to a mains line, one or more single-purpose batteries, a rechargeable battery, or any other suitable DC power supply 60 capable of providing the required DC supply voltage and the required DC supply current intensity. In one embodiment, the DC supply voltage of the DC power supply 60 is in the range of about 2.5 volts to about 4.5 volts, and the DC supply current intensity is in the range of about 2.5 to about 5 amps (corresponding to a DC supply power range of about 6.25 watts and about 22.5 watts). Preferably, the DC power supply 60 includes a rechargeable battery. Such a battery is generally available, with an acceptable total volume of approximately 1.2-3.5 cubic centimeters. Such a battery may have a substantially cylindrical or rectangular solid shape. Similarly, the DC power supply 60 may include a DC-fed choke coil.

[0198] The induction heating device 100 also includes a DC / AC converter (which can be implemented using a DC / AC inverter) connected to the DC power supply 60. The LC load network of the DC / AC converter is configured to operate under low ohmic load. The term "low ohmic load" should be understood to mean an ohmic load of less than approximately 2 ohms. The LC load network includes a parallel capacitor and a series connection of an inductor with an ohmic resistance. This ohmic resistance of the inductor is a few tenths of an ohm. During operation, the ohmic resistance of the sensing heating element 210 is increased to the ohmic resistance of the inductor and should be greater than the ohmic resistance of the inductor because the supplied electrical power should be converted into heat in the sensing heating element 210, and this heat should be as high as possible to improve the efficiency of the power amplifier, allowing as much heat as possible to be transferred from the sensing heating element 210 to other parts of the aerosol generating article 200 to efficiently produce aerosol.

[0199] In the temperature control method for the aerosol-generating article 200 of the present invention, an inductor assembly is formed by inserting the sensing heating element 210 into the induction coil 20, and the overall thermally dependent impedance Z of the inductor assembly is calculated. set According to the thermally dependent impedance Z of the induction coil 20 coilThe first thermally related impedance change ΔZ is obtained, which is the first thermally related impedance change ΔZ brought about by the insertion of the sensing heating element 210. The temperature of the sensing heating element 210 can then be obtained from this first thermally related impedance change ΔZ. Generally, the temperature of a material has a certain correlation with its thermally related resistivity. For example, the thermally related resistivity of a lamp filament increases at high temperatures, while ceramic bodies may become superconductors at extremely low temperatures. The first thermally related impedance change ΔZ has similar properties to thermally related resistance; the material exhibits different inductive reactances with temperature changes. Thus, the technical solution of this invention does not require a wired connection to the heating element. The temperature of the heating element can be obtained through circuit and program settings, reducing the assembly difficulty of electronic cigarettes.

[0200] In some embodiments of the present invention, the microcontroller 30 is electrically connected to a temperature sensor 40, which is used to detect the temperature of the induction coil 20. This configuration allows the microcontroller 30 to monitor the temperature in real time, facilitating the control of the temperature of the induction coil 20.

[0201] In some embodiments of the present invention, the temperature sensor 40 is also used to measure the ambient temperature. This configuration enables the microcontroller 30 to obtain the temperature parameters of the external environment, thereby eliminating the error caused by the external environment parameters through a preset program, thus making the result of the thermally related impedance change more accurate.

[0202] In some embodiments of the present invention, the microcontroller 30 is configured to determine whether the aerosol generating article 200, including the sensing heating element 210, has entered or left the cavity 11 when the first thermally related impedance change ΔZ changes instantaneously at room temperature. When the aerosol generating article 200 is inserted into the cavity 11, since the sensing heating element 210 is provided inside the aerosol article, it is equivalent to inserting an iron core into an unloaded coil; or, when the aerosol generating article 200 leaves the cavity 11, since the sensing heating element 210 is provided inside the aerosol article, it is equivalent to pulling out an iron core from a coil with an iron core. Therefore, the first thermally related impedance change will experience an instantaneous surge or decrease. Through this surge or decrease, it can be known that the aerosol generating article 200 has entered or left the cavity 11, and thus, based on this information, the system can enter the pre-start state of induction heating or the shutdown state.

[0203] In some embodiments of the present invention, the microcontroller 30 is configured to, when it is confirmed that the cavity 11 has an aerosol generating article 200 containing a sensor heating element inserted therein, determine the type of the aerosol generating article 200 based on the instantaneous increase of the first thermally related impedance change ΔZ at room temperature; and / or, detect one or more of the material, composition, thickness, strength, or shape of the sensor heating element 210.

[0204] At room temperature, the coil impedance is Z0, including the DC resistance Z. DCR and coil inductance Z L It consists of two parts, where the coil reactance is related to the vacuum permeability, area, number of turns, and length.

[0205] Z0 = Z DCR +Z L =R0+jwL0

[0206] L0=μ0SN / l

[0207] After being inserted into a heated body, the magnetic permeability increases to μr, and the inductive reactance increases.

[0208] Z set =Z DCR +Z L =R0+jwL set

[0209] L set =μ r SN / l

[0210] During heating, the temperature dynamically changes as T

[0211] Z set (T)=R0(T)+jwL set (T)

[0212] L set (T)=μ r (T)SN / l

[0213] Reference Figure 7 DC impedance R0 and permeability μ r The relationship with temperature is shown in the ZT graph below. It is assumed that as temperature increases, resistivity increases linearly, and permeability follows a specific relationship with temperature change (related to the 210 material of the sensing heat element).

[0214] In some embodiments of the present invention, the material of the sensing heating element 210 includes a magnetic induction material, formed by heat treatment or cold treatment to meet the aforementioned temperature measurement method. Because different magnetic induction materials have different property curves, heat treatment and cold treatment can also change the material properties to a certain extent. Therefore, by setting a suitable magnetic induction material to meet the aforementioned temperature measurement method, the accuracy of temperature measurement is improved.

[0215] Reference Figure 8 It is understandable that the coil impedance is a complex impedance, which is divided into real and imaginary parts, and can be expressed by the magnitude and the argument.

[0216] Specifically, by measuring the ambient temperature of the coil, using a given frequency voltage U(f) as excitation, measuring the current I(f), the coil impedance Z is obtained, and the real and imaginary parts are decomposed to obtain the DC impedance. The current ambient temperature is obtained through the relationship between the DC impedance and the temperature. Based on the aforementioned steps, the imaginary part of the impedance is calculated, and then the change in permeability is calculated. The temperature of the induction heating element is then calculated using the value of permeability.

[0217] In some embodiments of the present invention, the induction heating device 100 further includes a sampling resistor Rs connected to the induction coil 20 and a high-speed sampling module electrically connected to the sampling resistor Rs. The high-speed sampling module is used to sample the voltage signal at high speed, and the microcontroller 30 is configured to sample the voltage signal according to the excitation voltage U. in The impedance Z is obtained by dividing the voltage Us across the sampling resistor Rs by the voltage Us across the sampling resistor. In this embodiment, the high-speed sampling module can be a high-speed sampling circuit or a chip with high-speed sampling function. It performs high-speed sampling of high-frequency voltage signals and then calculates the complex impedance based on the voltage Us across the sampling resistor.

[0218] In some embodiments of the present invention, the induction heating device 100 further includes a demodulation module and a sampling resistor Rs connected to the induction coil 20. The demodulation module includes a multiplier module connected to the induction coil 20 and two low-pass filter modules connected to the multiplier module. The demodulation module is used to calculate the voltage Us and phase difference φ across the sampling resistor Rs. The microcontroller 30 is configured to obtain the impedance Z based on the quotient of the excitation voltage Uin and the voltage Us across the sampling resistor Rs. Using a phase-sensitive detection scheme, Uin and Us are actually multiplied to obtain the real and imaginary parts of Us, i.e., the imaginary part of the real part of the impedance.

[0219] U in =U0 sin(wt)

[0220]

[0221] In the formula, w, Rs, and U0 are known, and the purpose is to obtain Us and the phase difference φ. Using the multiplier module of a phase-sensitive detector, Us and φ can be calculated according to the principle of quadrature demodulation, and further, the complex impedance can be obtained. Since the channel is analog, the channel itself certainly cannot transmit complex signals. The input signal contains two independent I / Q parts, which are often represented in theoretical analysis as I(t) + jQ(t), that is, the I-path signal represents the real part of the complex signal, and the Q-path signal represents the imaginary part of the complex signal. If we also represent the I / Q carriers as complex carriers in a similar way, then the transmitted signal is actually the real part of the complex baseband signal mixed with the complex carrier. Correspondingly, the receiving end needs to use a method such as... Figure 5The structure is shown. Note that the I / Q carriers used by the receiver for demodulation must be consistent with those used by the transmitter; otherwise, demodulation errors will occur.

[0222] The present invention also provides a computer-readable storage medium storing a defined program, which, when executed by a processor, implements the temperature measurement and control method described in the above embodiments.

[0223] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0224] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0225] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is an optional implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, television, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0226] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0227] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for temperature measurement and control of electromagnetic induction heating, characterized in that, Includes the following steps: Obtain the thermally dependent impedance Z of the unloaded induction coil coil ; After inserting the sensing heating element, the thermally dependent impedance Z of the inductor assembly is obtained. set The inductor assembly includes an induction coil and a sensing heating element that is detachably inserted into the induction coil. According to the thermal correlation impedance Z of the unloaded induction coil coil and the thermally dependent impedance Z of the inductor assembly set The first thermally related impedance change ΔZ is obtained; The temperature of the target sensing heating element is determined based on the first thermally correlated impedance change ΔZ. Alternatively, after inserting the sensing heating element, obtain the thermally dependent impedance Z of the inductor assembly. set The inductor assembly includes an induction coil and a sensing heating element that is detachably inserted into the induction coil. Obtain the thermally dependent impedance Z of the inductor assembly again. set '; The thermally correlated impedance Z will be obtained again. set 'Thermodependent impedance Z from the previous test' set The difference is used to obtain the second thermally related impedance change ΔZ'. The temperature difference ΔT of the sensing heating element in different states is obtained based on the second thermally related impedance change ΔZ'. The step of determining the temperature of the sensing heating element based on the first thermally related impedance change ΔZ includes: determining whether the relationship between the first thermally related impedance change ΔZ and the temperature of the sensing heating element satisfies a first preset correspondence. If so, the temperature of the sensing element is obtained according to the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing element; If not, perform transient changes at different frequencies, where the frequency is the operating frequency of the induction coil or the frequency of the electromagnetic field; The temperature of the target heat-sensing element is determined based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element.

2. The temperature measurement and control method according to claim 1, characterized in that, The step of confirming the temperature of the target heat-sensing element based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element includes: If the temperature of the target sensing heating element cannot be determined, the operating frequency of the induction coil is changed transiently at different frequencies again. Obtain multiple different first thermally related impedance changes ΔZ corresponding to multiple different frequencies f; The temperature of the target heat-sensing element is determined based on the correspondence between multiple different changes in first thermally related impedance ΔZ and the temperature of the heat-sensing element.

3. The temperature measurement and control method according to claim 2, characterized in that, After the step of confirming the temperature of the sensing heating element based on the correspondence between multiple different first thermally related impedance changes ΔZ and the temperature of the sensing heating element, the method further includes: If the temperature of the target sensing heating element still cannot be determined; The temperature of the sensing heat element is caused to drift by heating or cooling; Re-execute based on the thermal correlation impedance Z of the unloaded induction coil coil and the thermally dependent impedance Z of the inductor assembly set The steps include obtaining the first thermally related impedance change ΔZ, determining the temperature of the sensing heating element based on the first thermally related impedance change ΔZ, and determining the target sensing heating element temperature based on the temperature trend of the sensing heating element after temperature drift.

4. The temperature measurement and control method according to claim 1, characterized in that, The first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element includes a correspondence between each of the first thermally related impedance change ΔZ and a temperature of the sensing heating element. Alternatively, the first preset correspondence between the first thermally related impedance change ΔZ and the temperature of the sensing heating element includes at least two correspondences between the first thermally related impedance change ΔZ and one temperature of the sensing heating element.

5. The temperature measurement and control method according to claim 1, characterized in that, The step of confirming the temperature of the target heat-sensing element based on the correspondence between at least two different first thermally related impedance changes ΔZ corresponding to at least two different frequencies f and the temperature of the heat-sensing element includes: At a first frequency f1, the first temperature of the induction coil at the first frequency f1 is measured, and the thermally related impedance Z corresponding to the first frequency f1 is calculated. coil，1 Thermally related impedance Z set，1 Determine the first thermally related impedance change ΔZ1, and refer to Table 1, which shows the relationship between ΔZ1 and the first temperature of the induction coil and the temperature of the sensing heating element. The first frequency f1 is transiently changed to the second frequency f2. At the second frequency f2, the second temperature of the induction coil is measured. Based on the thermally related impedance Z corresponding to the second frequency f2... coil，2 Thermally related impedance Z set，2 Determine the other first thermally related impedance change ΔZ2, and refer to Table 2, which shows the relationship between ΔZ2 and the second temperature of the induction coil and the temperature of the sensing heating element. The target sensing heating element temperature is confirmed based on △Z1, △Z2, Relationship Table 1, and Relationship Table 2.

6. The temperature measurement and control method according to claim 5, characterized in that, The step of confirming the target sensing heating element temperature based on △Z1, △Z2, relation table one, and relation table two includes: The first temperature group is confirmed in the relationship table 1 based on the first thermally related impedance change ΔZ1; wherein, the first temperature group includes at least two different temperature values ​​of the sensing heating element; The second temperature group is confirmed in relation table two based on the other first thermally related impedance change ΔZ2, wherein the second temperature group includes at least two different temperature values ​​of the sensing heating element; The target temperature of the sensing element is confirmed to be within the error range in the first temperature group and the second temperature group, wherein the error range is the ratio of the sensing element temperature values ​​in the first temperature group and the second temperature group to be between 1 / 10000 and 1 / 10.

7. The temperature measurement and control method according to claim 6, characterized in that, The ratio of temperature values ​​is between 1 / 1000 and 1 / 100.

8. The temperature measurement and control method according to claim 1, characterized in that, The thermal correlation impedance Z of the unloaded induction coil is obtained. coil The steps include: A temperature measuring element is set on the induction coil to obtain the dynamic temperature of the induction coil, and the current temperature is obtained by outputting the dynamic temperature. The preset thermal correlation resistor R of the induction coil is called according to the current temperature. coil，1 and the preset thermally dependent inductor L coil ; According to the preset thermal correlation resistance R of the induction coil coil，1 and the preset thermally dependent inductor L coil The thermally related impedance Z is obtained. coil ; Alternatively, voltage and current sensors can be installed in the induction coil; The thermally related impedance Z is obtained based on the measurement parameters of the voltage sensor and the current sensor. coil .

9. The temperature measurement and control method according to any one of claims 2 to 8, characterized in that, The temperature range of the induction coil is -50℃ to 500℃; And / or, the temperature range of the heating element is -70℃ to 700℃.

10. The temperature measurement and control method according to claim 9, characterized in that, The temperature range of the induction coil is -30℃ to 200℃; And / or, the temperature range of the sensing heating element is -30℃ to 375℃.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the temperature measurement and control method as described in any one of claims 1 to 10.

Images