An infrared calibration device

Abstract

The application discloses an infrared calibration device which is suitable for calibration of an infrared camera, and has the technical scheme that a main plate body is provided with a plurality of first hollow holes so that the main plate body forms a chessboard structure; a first semiconductor refrigerating sheet and a second semiconductor refrigerating sheet are further arranged on the first hollow holes and are alternately arranged, and the current directions of the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet are opposite, and the infrared calibration device belongs to the field of optical equipment instruments.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of optical equipment instruments, and more particularly relates to an infrared calibration device. BACKGROUND

[0002] Infrared thermal imaging technology has been applied more and more widely in recent years, and has high military application value and civil application value. An infrared thermal imager using infrared thermal imaging technology is a camera used for detecting infrared radiation of a target object, and converting a target temperature image into a video image through photoelectric conversion and electrical signal processing.

[0003] A traditional checkerboard calibration plate is only effective for calibration of a visible light camera, and is not suitable for calibration of an infrared thermal imager because it does not have obvious temperature differences. SUMMARY

[0004] The main purpose of the present application is to provide an infrared calibration device suitable for calibration of an infrared camera.

[0005] According to a first aspect of the present application, an infrared calibration device is provided, comprising a main plate body, wherein a plurality of first hollow holes are arranged on the main plate body to form a checkerboard structure; and first and second semiconductor refrigeration plates, which are arranged alternately on the first hollow holes and have opposite current directions.

[0006] In a specific embodiment of the present application, the infrared calibration device further comprises a secondary plate body connected to the main plate body.

[0007] The secondary plate body is provided with second hollow holes, and the second hollow holes are divided into two square sub-holes by a first rod body. The two sub-holes are provided with third and fourth semiconductor refrigeration plates, and the third and fourth semiconductor refrigeration plates have opposite current directions.

[0008] One side of the secondary plate body is a shooting surface, and the substrates of the third and fourth semiconductor refrigeration plates are arranged parallel to the shooting surface. The projection of the first rod body on the shooting surface is a diagonal line.

[0009] In a specific embodiment of the present application, the infrared calibration device further comprises a control device, and the first, second, third and fourth semiconductor refrigeration plates are electrically connected to the control device.

[0010] In one specific embodiment of the present application, a first temperature measuring element is further included, and the first temperature measuring element is in one-to-one correspondence with the first semiconductor refrigeration piece and the second semiconductor refrigeration piece; the first temperature measuring element is electrically connected to the control device, and the control device controls the temperature of the first semiconductor refrigeration piece and the second semiconductor refrigeration piece according to the signal of the first temperature measuring element.

[0011] In one specific embodiment of the present application, a second temperature measuring element in one-to-one correspondence with the third semiconductor refrigeration piece and a third temperature measuring element in one-to-one correspondence with the fourth semiconductor refrigeration piece are further included; the second temperature measuring element and the third temperature measuring element are electrically connected to the control device, and the control device controls the temperature of the third semiconductor refrigeration piece according to the signal of the second temperature measuring element and controls the temperature of the fourth semiconductor refrigeration piece according to the signal of the third temperature measuring element.

[0012] In one specific embodiment of the present application, a third hollow hole is arranged on the main plate body, and the auxiliary plate body is arranged in the third hollow hole and connected to the main plate body through a second rod body.

[0013] In one specific embodiment of the present application, a first wire slot is arranged between the plurality of first hollow holes.

[0014] In one specific embodiment of the present application, a second wire slot is arranged on the second rod body, a third wire slot is arranged on the edge of the auxiliary plate body, and a fourth wire slot is arranged on the first rod body; the first wire slot, the second wire slot, the third wire slot and the fourth wire slot are sequentially connected.

[0015] In one specific embodiment of the present application, the auxiliary plate body is in plurality, and two adjacent auxiliary plate bodies are connected through a third rod body.

[0016] The above technical solution in the present application has at least one of the following advantages or beneficial effects:

[0017] In the present application, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are used as the chessboard target grid unit, wherein the current directions of the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are opposite, so that a temperature difference is generated between the chessboard target grid units, thereby making the infrared calibration device of the present application suitable for the calibration work of the infrared camera.

[0018] The first semiconductor refrigeration piece and the second semiconductor refrigeration piece in the present application are active heating type devices, and the temperature difference is generated through the first semiconductor refrigeration piece and the second semiconductor refrigeration piece, which is better than the passive heat absorption mode through heat conduction in the prior art, and the temperature uniformity of the chessboard target grid unit of the present application is good.

[0019] Since the semiconductor refrigerating sheet has a cold end and a hot end, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet are installed through the first hollow hole, so that the infrared calibration device of the application forms a double-side calibration scene, and compared with the calibration device with only a single-side calibration scene in the prior art, the infrared calibration device of the application can reduce the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0020] The application will be further described below in combination with the drawings and embodiments.

[0021] Figure 1 is a structural diagram of embodiment 1 of the application;

[0022] Figure 2 is a structural diagram of the main plate body and the auxiliary plate body of embodiment 1 of the application Figure 1 is an enlarged view of D in the middle;

[0023] Figure 3 is a structural diagram of the first wire slot, the second wire slot, the third wire slot and the fourth wire slot of embodiment 1 of the application.

[0024] Figure 4 is a structural diagram of the first wire slot, the second wire slot, the third wire slot and the fourth wire slot of embodiment 1 of the application. DETAILED DESCRIPTION

[0025] The embodiments of the application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the application, and cannot be understood as a limitation of the application.

[0026] Embodiment 1

[0027] Referring to Figures 1 to 4 shown, an infrared calibration device includes a main plate body 1, the main plate body 1 is provided with a plurality of first hollow holes 11 to form a chessboard structure; further including a first semiconductor refrigerating sheet 12 and a second semiconductor refrigerating sheet 13, the first semiconductor refrigerating sheet 12 and the second semiconductor refrigerating sheet 13 are arranged on the first hollow hole 11 and are arranged alternately, and the current directions of the first semiconductor refrigerating sheet 12 and the second semiconductor refrigerating sheet 13 are opposite.

[0028] In the application, the first semiconductor refrigerating sheet 12 and the second semiconductor refrigerating sheet 13 are used as chessboard target grid units, wherein the current directions of the first semiconductor refrigerating sheet 12 and the second semiconductor refrigerating sheet 13 are opposite, so that a temperature difference is generated between the chessboard target grid units, so that the infrared calibration device of the application is suitable for the calibration work of an infrared camera.

[0029] The first semiconductor refrigeration sheet 12 and the second semiconductor refrigeration sheet 13 in the present application are active heating devices. A temperature difference is generated by the first semiconductor refrigeration sheet 12 and the second semiconductor refrigeration sheet 13. Compared with the prior art method of generating a temperature difference by passive heat absorption through heat conduction, the temperature uniformity of the checkerboard target grid unit of the present application is good.

[0030] Since the semiconductor refrigeration plate has a cold end and a hot end, the first semiconductor refrigeration plate 12 and the second semiconductor refrigeration plate 13 can be installed through the first hollow hole 11, so that the infrared calibration device of the present application can form a double-sided calibration scene. Compared with the calibration device in the prior art that only has a single-sided calibration scene, the infrared calibration device of the present application can reduce production costs.

[0031] In the prior art, a semiconductor refrigeration plate includes two substrates, an N-type semiconductor and a P-type semiconductor disposed between the two substrates.

[0032] In this embodiment, a sub-plate body 2 is further included, and the sub-plate body 2 is connected to the main plate body 1; the sub-plate body 2 is provided with a second hollow hole, and the second hollow hole is divided into two square sub-holes 21 by a first rod body A, and the two sub-holes 21 are respectively provided with a third semiconductor cooling plate 22 and a fourth semiconductor cooling plate 23, and the current directions of the third semiconductor cooling plate 22 and the fourth semiconductor cooling plate 23 are opposite;

[0033] One side of the auxiliary plate 2 is a shooting surface, the substrates of the third semiconductor refrigeration plate 22 and the fourth semiconductor refrigeration plate 23 are arranged parallel to the shooting surface, and the projection of the first rod A on the shooting surface is an oblique line;

[0034] The third semiconductor refrigeration plate 22 and the fourth semiconductor refrigeration plate 23 generate a temperature difference when in operation. The temperature difference causes the infrared camera to capture a shooting line that coincides with the oblique line. By analyzing the shooting line, the resolution test of the infrared camera is achieved. That is, through the arrangement of the main plate 1 and the auxiliary plate 2, the present application can be used for both calibration of infrared cameras and resolution test of infrared cameras, making the infrared calibration device of the present application have a wide range of applications and a compact structure.

[0035] By installing the third semiconductor refrigeration plate 22 and the fourth semiconductor refrigeration plate 23 through the second hollow hole, the infrared calibration device of the present application can form a double-sided resolution test scene, which can further reduce the production cost and make the infrared calibration device of the present application more flexible in use. When in use, one side can be used for calibration of the infrared camera, and the other side can be used for resolution testing of the infrared camera, or both sides can be used for calibration or resolution testing of the infrared camera.

[0036] In the embodiment, a control device 3 is further included, the first semiconductor refrigeration piece 12, the second semiconductor refrigeration piece 13, the third semiconductor refrigeration piece 22 and the fourth semiconductor refrigeration piece 23 are electrically connected with the control device 3, and power supply is realized through the control device 3.

[0037] Specifically, a first temperature measuring element 4 is further included, the first temperature measuring element 4 is in one-to-one correspondence with the first semiconductor refrigeration piece 12 and the second semiconductor refrigeration piece 13, and the first temperature measuring element 4 is electrically connected with the control device 3; a second temperature measuring element 5 corresponding to the third semiconductor refrigeration piece 22 and a third temperature measuring element 6 corresponding to the fourth semiconductor refrigeration piece 23 are further included; the second temperature measuring element 5 and the third temperature measuring element 6 are electrically connected with the control device 3, the control device 3 controls the temperature of the first semiconductor refrigeration piece 12 and the second semiconductor refrigeration piece 13 according to the signal of the first temperature measuring element 4, controls the temperature of the third semiconductor refrigeration piece 22 according to the signal of the second temperature measuring element 5, and controls the temperature of the fourth semiconductor refrigeration piece 23 according to the signal of the third temperature measuring element 6, so as to realize temperature control of the first semiconductor refrigeration piece 12, the second semiconductor refrigeration piece 13, the third semiconductor refrigeration piece 22 and the fourth semiconductor refrigeration piece 23, the temperature control response is fast, the target temperature can be quickly reached, the efficiency of infrared camera calibration or resolution test can be improved, and the accuracy of infrared camera calibration or resolution test can be ensured.

[0038] In the embodiment, a third hollow hole 14 is arranged on the main plate body 1, the auxiliary plate body 2 is arranged in the third hollow hole 14 and connected to the main plate body 1 through a second rod body B, and the third hollow hole 14 can play a role of weight reduction.

[0039] As a specific implementation of the embodiment, the third hollow hole 14 is a square hole and arranged in the middle of the main plate body 1, the auxiliary plate body 2 is four, two adjacent auxiliary plate bodies 2 are connected through a third rod body C to improve the stability of the auxiliary plate body 2, and the four auxiliary plate bodies 2 are arranged at four quadrant regions of the third hollow hole 14 respectively, and two second hollow holes are arranged on one auxiliary plate body 2, so that the structure is symmetrical and convenient for calibration or resolution test.

[0040] In the embodiment, a first wire groove a is arranged between the plurality of first hollow holes 11, the first wire groove a is arranged on the main plate body 1, a second wire groove b is arranged on the second rod body B, a third wire groove c is arranged on the edge of the auxiliary plate body 2, and a fourth wire groove d is arranged on the first rod body A; the first wire groove a, the second wire groove b, the third wire groove c and the fourth wire groove d are sequentially connected.

[0041] The inner edge and the outer edge of the main plate body 1 can also be provided with a fifth wire groove, which is not limited in the embodiment.

[0042] The first wire slot a is in conduction with the first hollow hole 11 through a first through hole, and the first through hole is used for the wire of the first semiconductor refrigeration sheet 12 or the second semiconductor refrigeration sheet 13 or the wire of the first temperature measuring element 4 to enter the first wire slot a; the third wire slot c, the fourth wire slot d and the sub-hole 21 are in conduction through a second through hole, and the second through hole is used for the wire of the third semiconductor refrigeration sheet 22 or the fourth semiconductor refrigeration sheet 23, the wire of the second temperature measuring element 5 or the third temperature measuring element 6 to enter the third wire slot c or the fourth wire slot d.

[0043] The control device 3 further comprises a display module and a communication module, the display module is used for displaying temperature values and setting temperature control temperature through man-machine interaction; and the communication module is used for transmitting temperature data to an external host computer in real time.

[0044] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An infrared calibration device, characterized by The application relates to a semiconductor refrigeration cooling device, which comprises a main plate body (1) and a sub plate body (2), a plurality of first hollow holes (11) are arranged on the main plate body (1) to form a chessboard structure, first semiconductor refrigeration sheets (12) and second semiconductor refrigeration sheets (13) are arranged on the first hollow holes (11) and are alternately arranged, and the current directions of the first semiconductor refrigeration sheets (12) and the second semiconductor refrigeration sheets (13) are opposite. The sub plate body (2) is connected with the main plate body (1). Second hollow holes are arranged on the sub plate body (2), the second hollow holes are divided into four square sub holes (21) by a first rod body (A), third semiconductor refrigeration sheets (22) and fourth semiconductor refrigeration sheets (23) are arranged on two sub holes (21), and the current directions of the third semiconductor refrigeration sheets (22) and the fourth semiconductor refrigeration sheets (23) are opposite. One side of the sub plate body (2) is a shooting surface, the base plates of the third semiconductor refrigeration sheets (22) and the fourth semiconductor refrigeration sheets (23) are arranged in parallel to the shooting surface, and the projection of the first rod body (A) on the shooting surface is an oblique line. Third hollow holes (14) are arranged on the main plate body (1), the sub plate body (2) is arranged in the third hollow holes (14) and is connected to the main plate body (1) through a second rod body (B).

2. The infrared calibration device of claim 1, wherein, A control device (3) is further arranged, and the first semiconductor refrigeration sheets (12), the second semiconductor refrigeration sheets (13), the third semiconductor refrigeration sheets (22) and the fourth semiconductor refrigeration sheets (23) are electrically connected with the control device (3).

3. The infrared calibration device of claim 2, wherein, A plurality of first temperature measuring elements (4) are further arranged, the first temperature measuring elements (4) correspond to the first semiconductor refrigeration sheets (12) and the second semiconductor refrigeration sheets (13) one by one, the first temperature measuring elements (4) are electrically connected with the control device (3), and the control device (3) controls the temperatures of the first semiconductor refrigeration sheets (12) and the second semiconductor refrigeration sheets (13) according to signals of the first temperature measuring elements (4).

4. The infrared calibration device of claim 2, wherein, Second temperature measuring elements (5) corresponding to the third semiconductor refrigeration sheets (22) and third temperature measuring elements (6) corresponding to the fourth semiconductor refrigeration sheets (23) are further arranged, the second temperature measuring elements (5) and the third temperature measuring elements (6) are electrically connected with the control device (3), and the control device (3) controls the temperatures of the third semiconductor refrigeration sheets (22) and the fourth semiconductor refrigeration sheets (23) according to signals of the second temperature measuring elements (5) and the third temperature measuring elements (6).

5. The infrared calibration device of claim 1, wherein, First line grooves (a) are arranged between the plurality of first hollow holes (11).

6. The infrared calibration device of claim 5, wherein, Second line grooves (b) are arranged on the second rod body (B), third line grooves (c) are arranged on the edges of the sub plate body (2), and fourth line grooves (d) are arranged on the first rod body (A); and the first line grooves (a), the second line grooves (b), the third line grooves (c) and the fourth line grooves (d) are sequentially connected.

7. The infrared calibration device of claim 1, wherein, The sub plate body (2) is a plurality of sub plate bodies, and two adjacent sub plate bodies (2) are connected through third rod bodies (C).

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