Driving substrate and display panel

Abstract

The embodiment of the present application discloses a driving substrate and a display panel, including a display area and a frame area located at least on one side of the display area, including: a substrate, a first pad, a second pad and a wire connection structure. The substrate includes a first surface and a second surface, the first surface and the second surface are arranged opposite to each other; the first pad is arranged on the first surface and corresponds to the frame area; the second pad is arranged on the second surface and corresponds to the frame area; and the wire connection structure corresponds to the frame area, one end of the wire connection structure is welded to the first pad, and the other end of the wire connection structure is welded to the second pad; the problem of high defective rate caused by poor overlap and metal wire short circuit can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a driving substrate and a display panel. Background Art

[0002] Traditional display screens all need to use the module process of COF / FPC binding to input the required signals of the panel into the surface. Due to the limitation of the binding process, the panel design usually needs to first converge the signal lines in the surface through the fan-shaped area, concentrate them into a small binding area, and then bind the COF / FPC to the area to form an electrical connection between the printed circuit board and the glass substrate, so that the edge area width is usually larger.

[0003] The fan-shaped area and the binding area mainly play the role of electrical connection, usually collectively referred to as the edge area. If the edge area is too large, it will affect the appearance of the display screen. If it is used for splicing screens, there will be obvious seams, affecting the effect of splicing display. Since the base material of the cover film / flexible circuit board has good resilience and is not easy to bend, it will also increase the seams and affect the effect of splicing display.

[0004] During the research and practice of the prior art, the inventors of the present application discovered that the existing double-sided process connects the front and back pads of the substrate together through metal wires. However, in this process, since the metal wires are too thin and the metal wire density is relatively high, problems such as poor overlap and metal wire short circuits are easily caused. Summary of the invention

[0005] The embodiments of the present application provide a driving substrate and a display panel, which can effectively reduce the problem of high defective rate caused by poor overlap and metal line short circuit.

[0006] The embodiment of the present application provides a driving substrate, including a display area and a frame area located on at least one side of the display area, and further including:

[0007] A substrate, the substrate comprising a first surface and a second surface, the first surface and the second surface being arranged opposite to each other;

[0008] A first pad, which is disposed on the first surface and corresponds to the frame area;

[0009] a second pad, the second pad being disposed on the second surface and corresponding to the frame area; and

[0010] A wire connection structure, wherein the wire connection structure corresponds to the frame area, one end of the wire connection structure is welded to the first pad, and the other end of the wire connection structure is welded to the second pad.

[0011] Optionally, in some embodiments of the present application, the wire connection structure includes a first wire, a second wire and a connecting pad; the substrate includes a third surface; the third surface connects the first surface and the second surface and is located between the first surface and the second surface; the connecting pad is arranged on the third surface; the first wire is connected to the first pad and the connecting pad; the second wire is connected to the second pad and the connecting pad.

[0012] Optionally, in some embodiments of the present application, the first pad and the second pad are arranged to overlap.

[0013] Optionally, in some embodiments of the present application, the area of ​​the binding surface of the connecting pad is larger than the area of ​​the binding surface of the first pad.

[0014] Optionally, in some embodiments of the present application, the length of the first conductive wire is the same as the length of the second conductive wire.

[0015] Optionally, in some embodiments of the present application, the third surface is concavely provided with a groove, and the connecting pad is arranged in the groove; and the binding surfaces of the first pad and the second pad are both flush with the third surface.

[0016] Optionally, in some embodiments of the present application, the wire connection structure includes a connecting wire; one end of the connecting wire is connected to the first pad, and the other end of the connecting wire is connected to the second pad.

[0017] Optionally, in some embodiments of the present application, the substrate includes a third surface, the third surface connects the first surface and the second surface and is located between the first surface and the second surface; the third surface is concavely provided with a recessed groove, and the connecting wire is arranged in the recessed groove.

[0018] Optionally, in some embodiments of the present application, the driving substrate further includes a protective adhesive layer, and the protective adhesive layer encapsulates the wire connection structure.

[0019] Correspondingly, an embodiment of the present application further provides a display panel, comprising a light-emitting device and the driving substrate, wherein the light-emitting device is arranged on the driving substrate.

[0020] The embodiment of the present application adopts a wire connection structure, which corresponds to the border area, one end of the wire connection structure is welded to the first pad, and the other end of the wire connection structure is welded to the second pad; it can effectively reduce the problem of high defective rate caused by poor overlap and metal wire short circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 is a schematic diagram of the structure of the driving substrate provided in Example 1 of the present application;

[0023] Figure 2 This is a schematic diagram of the structure of a driving substrate of another embodiment provided in the first embodiment of the present application;

[0024] Figure 3 is a schematic diagram of the oblique structural view of the driving substrate provided in the second embodiment of the present application;

[0025] Figure 4 This is a schematic diagram of the structure of the driving substrate provided in the second embodiment of the present application;

[0026] Figure 5 is a schematic diagram of the structure of a display panel provided in Embodiment 3 of the present application;

[0027] Figure 6 This is a schematic diagram of a first display panel manufacturing method provided in Embodiment 4 of the present application;

[0028] Figure 7 This is a schematic diagram of the first display panel structure provided in the fourth embodiment of the present application;

[0029] Figures 7a-7f A schematic diagram of a first display panel preparation process provided in Embodiment 4 of the present application;

[0030] Figure 8 is a schematic diagram of a second display panel manufacturing method provided in Example 5 of the present application;

[0031] Fig. 9 This is a schematic diagram of the second display panel structure provided in Embodiment 5 of the present application;

[0032] Figures 9a-9f A schematic diagram of the second display panel preparation process provided in Example 5 of the present application.

[0033] Description of reference numerals:

[0034] Display panel 300, drive substrate 100, display area AA, frame area NA, substrate 10, first pad 20, second pad 30, wire connection structure 40, first surface 101, second surface 102, third surface 103, first wire 41, second wire 42, connecting pad 43, thin film transistor array layer 50, third pad 60, groove 104, sink 105, connecting wire 401, protective glue layer 70, flip chip film 80, flexible circuit board 90, light emitting device 301, sealing glue layer 302. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0036] The embodiments of the present application provide a driving substrate and a display panel, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0037] Embodiment 1

[0038] See also Figure 1 , this embodiment provides a driving substrate 100, including a display area AA and a frame area NA located on at least one side of the display area AA, including: a substrate 10, a first pad 20, a second pad 30 and a wire connection structure 40. The substrate 10 includes a first surface 101 and a second surface 102, and the first surface 101 and the second surface 102 are arranged opposite to each other. The first pad 20 is arranged on the first surface 101 and corresponds to the frame area NA. The second pad 30 is arranged on the second surface 102 and corresponds to the frame area NA. And the wire connection structure 40 corresponds to the frame area NA, one end of the wire connection structure 40 is welded to the first pad 20, and the other end of the wire connection structure 40 is welded to the second pad 30.

[0039] It can be understood that, in this embodiment, the driving substrate 100 further includes a thin film transistor array layer 50 and a third pad 60. The thin film transistor array layer 50 is disposed on the first surface 101 of the substrate 10 and corresponds to the display area AA. The third pad 60 is disposed on the second surface 102 and is electrically connected to the second pad 30. The wire connection structure 40 corresponds to the frame area NA, one end of the wire connection structure 40 is welded to the first pad 20, and the other end of the wire connection structure 40 is welded to the second pad 30. The problem of high defective rate caused by poor overlap and metal wire short circuit can be effectively reduced.

[0040] Optionally, the wire connection structure 40 includes a first wire 41, a second wire 42 and a connection pad 43. The substrate 10 includes a third surface 103. The third surface 103 connects the first surface 101 and the second surface 102 and is located between the first surface 101 and the second surface 102. The connection pad 43 is arranged on the third surface 103. The first wire 41 is connected to the first pad 20 and the connection pad 43. The second wire 42 is connected to the second pad 30 and the connection pad 43.

[0041] It can be understood that, in this embodiment, the connecting pad 43 is provided as a bridge to overlap the first wire 41 and the second wire 42, which reduces the pulling distance between the first wire 41 and the second wire 42 and reduces the risk of breaking the first wire 41 and the second wire 42.

[0042] Optionally, the first pad 20 and the second pad 30 are overlapped.

[0043] It can be understood that, in the present embodiment, the first pad 20 and the second pad 30 are overlapped, which saves the movement space of the equipment and simplifies the process when forming the first conductive line 41 and the second conductive line 42 .

[0044] Optionally, the third surface 103 is provided with a groove 104, and the connecting pad 43 is arranged in the groove 104. The binding surfaces of the first pad 20 and the second pad 30 are both flush with the third surface 103.

[0045] It is understandable that, in this embodiment, the connecting pad 43 is disposed in the groove 104 and the binding surfaces of the first pad 20 and the second pad 30 are on the side, so that the binding surfaces of the first pad 20, the second pad 30 and the connecting pad 43 are on the same plane, and when forming the first wire 41 and the second wire 42, the action of turning the wire drawing structure from the first surface 101 or the second surface 102 to the third surface 103 can be omitted, thereby reducing the difficulty of welding. That is, only the formation and welding process of the first wire 41 and the second wire 42 need to be completed on the third surface 103.

[0046] Optionally, the length of the first conductive wire 41 is the same as the length of the second conductive wire 42 .

[0047] It can be understood that in this embodiment, the first wire 41 and the second wire 42 have the same length, so that the movement trajectory of the device when forming the first wire 41 and the second wire 42 is consistent, which can reduce the difficulty of device action design.

[0048] See also Figure 2 Optionally, in some embodiments, the binding surface of the first pad 20 is set on a side away from the first surface 101, and the binding surface of the second pad 30 is set on a side away from the second surface 102. It can be understood that the binding surface of the first pad 20 is larger than the side surface of the first pad 20, which can greatly reduce the requirements for equipment accuracy.

[0049] See also Figure 2 Optionally, in some embodiments, the connecting pad 43 is arranged on the surface of the third surface 103, that is, the third surface 103 is not provided with a groove. In this case, the binding space of the connecting pad 43 can be increased and the welding difficulty of the connecting pad 43 can be reduced.

[0050] Optionally, the area of ​​the binding surface of the connecting pad 43 is greater than the area of ​​the binding surface of the first pad 20 .

[0051] It can be understood that in this embodiment, the connection pad 43 needs to be bound to the first wire 41 and the second wire 42, so increasing the binding area of ​​the connection pad 43 can reduce the difficulty of connection and binding and improve the binding yield.

[0052] Optionally, the driving substrate 100 further includes a protective adhesive layer 70 , and the protective adhesive layer 70 encapsulates the wire connection structure 40 .

[0053] It can be understood that, in the present embodiment, the wire connection structure 40 is encapsulated by the protective adhesive layer, so as to effectively protect the wire connection structure 40 and avoid a short circuit between the wire connection structures 40 .

[0054] Embodiment 2

[0055] Please combine Figure 3 and Figure 4 The present embodiment provides a driving substrate 100, including a display area AA and a frame area NA located on at least one side of the display area AA, including: a substrate 10, a first pad 20, a second pad 30 and a wire connection structure 40. The substrate 10 includes a first surface 101 and a second surface 102, and the first surface 101 and the second surface 102 are arranged opposite to each other. The first pad 20 is arranged on the first surface 101 and corresponds to the frame area NA. The second pad 30 is arranged on the second surface 102 and corresponds to the frame area NA. The wire connection structure 40 corresponds to the frame area NA, one end of the wire connection structure 40 is welded to the first pad 20, and the other end of the wire connection structure 40 is welded to the second pad 30.

[0056] It can be understood that, in this embodiment, the driving substrate 100 further includes a thin film transistor array layer 50 and a third pad 60. The thin film transistor array layer 50 is disposed on the first surface 101 of the substrate 10 and corresponds to the display area AA. The third pad 60 is disposed on the second surface 102 and is electrically connected to the second pad 30. The wire connection structure 40 corresponds to the frame area NA, one end of the wire connection structure 40 is welded to the first pad 20, and the other end of the wire connection structure 40 is welded to the second pad 30. The problem of high defective rate caused by poor overlap and metal wire short circuit can be effectively reduced.

[0057] Optionally, the wire connection structure 40 includes a connection wire 401 . One end of the connection wire 401 is connected to the first pad 20 , and the other end is connected to the second pad 30 .

[0058] It can be understood that, in this embodiment, the wire connection structure 40 omits the connection pad, and the first pad 20 and the second pad 30 are directly connected by the connection wire 401, thereby omitting the production of the connection pad and saving the production process.

[0059] Optionally, the substrate 10 includes a third surface 103, which connects the first surface 101 and the second surface 102 and is located between the first surface 101 and the second surface 102. The third surface 103 is provided with a recessed groove 105, and the wire connection structure 40 is disposed in the recessed groove 105.

[0060] It is understandable that as the pixel density increases, the distance between adjacent connecting wires 401 decreases, and short circuits are easily formed between the connecting wires 401. In this embodiment, arranging the connecting wires 401 in the grooves 104 can effectively isolate adjacent connecting wires 401, effectively reducing the risk of short circuits of the connecting wires 401.

[0061] Optionally, the driving substrate 100 further includes a protective adhesive layer 70 , and the protective adhesive layer 70 encapsulates the wire connection structure 40 .

[0062] It can be understood that, in the present embodiment, the wire connection structure 40 is encapsulated by the protective adhesive layer, so as to effectively protect the wire connection structure 40 and avoid a short circuit between the wire connection structures 40 .

[0063] Embodiment 3

[0064] See also Figure 5 and Figure 4 It should be noted that this embodiment adopts Figure 4 The structure of the driving substrate 100 shown in the figure, in fact, the display panel 300 can adopt the driving substrate 100 formed by the technical solution included in the first or second embodiment, a display panel 300, including a light-emitting device 301 and the driving substrate 100 as described in any one of the first or second embodiments, the light-emitting device 301 is arranged on the driving substrate 100.

[0065] Optionally, in this embodiment, the display panel 300 further includes a chip-on-film 80 and a flexible circuit board 90. The chip-on-film 80 is bonded to the third pad 60. The flexible circuit board 90 is bonded to the chip-on-film 80.

[0066] In this embodiment, the display panel 300 further includes a sealing layer 302 , and the sealing layer 302 encapsulates the light emitting device 301 .

[0067] Embodiment 4:

[0068] See also Figure 6 This embodiment also provides a method for preparing the first display panel 300.

[0069] The method for preparing the display panel 300 includes the following steps:

[0070] See also Figure 7 , Figure 7a-7f .

[0071] B1: Provide a substrate 10; the substrate 10 includes a first surface 101, a second surface 102 and a third surface 103. The first surface 101 and the second surface 102 are arranged opposite to each other. The third surface 103 connects the first surface 101 and the second surface 102 and is located between the first surface 101 and the second surface 102. The first pad 20 is arranged on the first surface 101 and corresponds to the frame area NA. The second pad 30 is arranged on the second surface 102 and corresponds to the frame area NA. The third pad 60 is arranged on the second surface 102 and corresponds to the display area AA. The thin film transistor array layer 50 is arranged on the second surface 102 and corresponds to the display area AA.

[0072] B2: A wire connection structure 40 is formed in the frame area NA. The wire connection structure 40 includes a first wire 41, a second wire 42 and a connection pad 43. The connection pad 43 is disposed on the third surface 103. The first wire 41 connects the first pad 20 and the connection pad 43. The second wire 42 connects the second pad 30 and the connection pad 43.

[0073] B3: forming a protective adhesive layer 70 in the frame area NA. The protective adhesive layer 70 encapsulates the wire connection structure 40 to form a driving substrate 100; see Figure 2 , the driving substrate 100 is the driving substrate 100 described in the first embodiment. It can be understood that this embodiment can also adopt the driving substrate 100 described in the first embodiment. Figure 1 The driving substrate 100 is shown.

[0074] B4: Transferring the light emitting device 301 onto the thin film transistor array layer 50 .

[0075] B5: The sealing layer 302 encapsulates the light emitting device 301 .

[0076] B6: Bind the chip-on-film 80 to the third pad 60 and the flexible circuit board 90 to the chip-on-film 80 .

[0077] The steps of the method for preparing the display panel 300 are described in detail below:

[0078] Please combine Figure 7 and Figure 7a In step B1, a substrate 10 is provided. The substrate 10 includes a first surface 101, a second surface 102 and a third surface 103. The first surface 101 and the second surface 102 are arranged opposite to each other. The third surface 103 connects the first surface 101 and the second surface 102 and is located between the first surface 101 and the second surface 102. The first pad 20 is arranged on the first surface 101 and corresponds to the frame area NA. The second pad 30 is arranged on the second surface 102 and corresponds to the frame area NA. The third pad 60 is arranged on the second surface 102 and corresponds to the display area AA. The thin film transistor array layer 50 is arranged on the second surface 102 and corresponds to the display area AA. Then proceed to step B2.

[0079] Please combine Figure 7 and Figure 7b In step B2, a wire connection structure 40 is formed in the border area NA. The wire connection structure 40 includes a first wire 41, a second wire 42 and a connection pad 43. The connection pad 43 is arranged on the third surface 103. The first wire 41 connects the first pad 20 and the connection pad 43. The second wire 42 connects the second pad 30 and the connection pad 43. In this step, the connection pad 43 is arranged in the middle position of the third surface 103, and the connection pad 43 can be formed by transfer. The first wire 41 and the second wire 42 have the same length.

[0080] In this embodiment, the conductive material is pulled from the side of the first pad 20 away from the substrate 10 to the connecting pad 43 to form a first wire 41, and then the substrate 10 is turned over to form a second wire 42 in the same process. This embodiment can effectively shorten the pulling distance of the conductive material and reduce the risk of conductive material breakage and poor overlap. In addition, the welding method is disassembled from the front and back welding method to the front side welding and the back side welding, which reduces the welding difficulty and improves the welding accuracy. The conductive material includes gold, copper, silver or alloy. In some embodiments, please refer to Figure 1, the third surface 103 is provided with a groove 104, and the connecting pad 43 is arranged in the groove 104. The connecting pad 43 is arranged in the groove 104 and the binding surface of the first pad 20 and the second pad 30 is on the side, so that the binding surfaces of the first pad 20, the second pad 30 and the connecting pad 43 can be in the same plane. When forming the first wire 41 and the second wire 42, the action of turning the wire drawing structure from the first surface 101 or the second surface 102 to the third surface 103 can be omitted, reducing the welding difficulty. That is, it is only necessary to complete the formation and welding process of the first wire 41 and the second wire 42 on the third surface 103. Optionally, the welding process can be selected from ultrasonic hot pressing welding. Then proceed to step B3.

[0081] Please combine Figure 7 and Figure 7c In step B3, a protective adhesive layer 70 is formed in the frame area NA. The protective adhesive layer 70 encapsulates the wire connection structure 40. The material of the protective adhesive layer 70 includes: epoxy resin or silicone. Then, step 4 is performed.

[0082] Please combine Figure 7 and Figure 7d In step B4, the light emitting device 301 is transferred onto the thin film transistor array layer 50. Then, the process proceeds to step B5.

[0083] Please combine Figure 7 and Figure 7e In step B5, the sealing layer 302 encapsulates the light emitting device 301. The material of the sealing layer 302 includes: silica gel or epoxy resin. Then, the process proceeds to step B6.

[0084] Please combine Figure 7 and Figure 7f In step B6 , the chip-on-film 80 is bonded to the third pad 60 ; and the flexible circuit board 90 is bonded to the chip-on-film 80 .

[0085] See also Figure 7 , thus the preparation of the display panel 300 is completed.

[0086] Embodiment 5

[0087] See also Figure 8 , Fig. 9 and Figure 9a-9f This embodiment also provides a second method for preparing the display panel 300 .

[0088] The method for preparing the display panel 300 includes the following steps:

[0089] B1: Provide a substrate 10. The substrate 10 includes a first surface 101, a second surface 102 and a third surface 103; the first surface 101 and the second surface 102 are arranged opposite to each other. The third surface 103 connects the first surface 101 and the second surface 102 and is located between the first surface 101 and the second surface 102. The first pad 20 is arranged on the first surface 101 and corresponds to the frame area NA. The second pad 30 is arranged on the second surface 102 and corresponds to the frame area NA. The third pad 60 is arranged on the second surface 102 and corresponds to the display area AA. The thin film transistor array layer 50 is arranged on the second surface 102 and corresponds to the display area AA.

[0090] B2: forming a recess 105 on the third surface 103 of the substrate 10 .

[0091] B3: Transferring the light emitting device 301 onto the thin film transistor array layer 50 .

[0092] B4: Pull the conductive material from the side of the first pad 20 away from the substrate 10 to the side of the second pad 30 away from the substrate 10 to form a wire connection structure 40 / connection wire 401. An electrical connection is formed between the first pad 20 and the second pad 30. The connection wire 401 is set in the sink 105. It should be noted that there is no order in which steps B3 and B4 are performed. Please refer to Figure 3 and Figure 4 In this step, the driving substrate 100 formed is the driving substrate 100 described in the second embodiment.

[0093] B5. Form a protective adhesive layer 70 in the frame area NA. The protective adhesive layer 70 encapsulates the wire connection structure 40.

[0094] B6. Bind the chip-on-film 80 to the third pad 60 . Bind the flexible circuit board 90 to the chip-on-film 80 .

[0095] B7. The sealing glue layer 302 encapsulates the light emitting device 301.

[0096] The steps of the method for preparing the display panel 300 are described in detail below:

[0097] See also Fig. 9 and Figure 9a-9f It should be noted that Figure 9a-9f The second pad is not visible in the figure. Fig. 9 .

[0098] Please combine Fig. 9 and Figure 9aIn step B1, a substrate 10 is provided. The substrate 10 includes a first surface 101, a second surface 102 and a third surface 103. The first surface 101 and the second surface 102 are arranged opposite to each other. The third surface 103 connects the first surface 101 and the second surface 102 and is located between the first surface 101 and the second surface 102. The first pad 20 is arranged on the first surface 101 and corresponds to the frame area NA. The second pad 30 is arranged on the second surface 102 and corresponds to the frame area NA. The third pad 60 is arranged on the second surface 102 and corresponds to the display area AA. The thin film transistor array layer 50 is arranged on the second surface 102 and corresponds to the display area AA. Then proceed to step B2.

[0099] Please combine Fig. 9 and Figure 9b In step B2, a sinking groove 105 is formed on the third surface 103 of the substrate 10. In this step, optionally, the process of forming the sinking groove 105 includes a laser engraving process. Then, the process proceeds to step B3.

[0100] Please combine Fig. 9 and Fig.9c In step B3, the light emitting device 301 is transferred onto the thin film transistor array layer 50. It is understood that the light emitting device 301 may be a micro light emitting diode or a sub-millimeter light emitting diode. Then, the process proceeds to step B4.

[0101] Please combine Fig. 9 and Figure 9d In step B4, the conductive material is pulled from the side of the first pad 20 away from the substrate 10 to the side of the second pad 30 away from the substrate 10 to form a wire connection structure 40 / connecting wire 401. An electrical connection is formed between the first pad 20 and the second pad 30. The connecting wire 401 is arranged in the sink 105. Optionally, in this step, ultrasonic hot pressing is selected to weld the connecting wire 401, the first pad 20 and the second pad 30. It can be understood that as the pixel density increases, the distance between the connecting wires 401 becomes smaller, and there is a risk of short circuit between adjacent connecting wires 401, so there will be higher requirements for the accuracy of the equipment. In this embodiment, the connecting wire 401 is arranged in the sink 105, and the sink 105 can effectively isolate the adjacent connecting wires 401 and reduce the risk of short circuit between adjacent connecting wires 401. Then proceed to step B5.

[0102] Please combine Fig. 9 and Fig.9e In step B5, a protective adhesive layer 70 is formed in the frame area NA. The protective adhesive layer 70 encapsulates the wire connection structure 40. In this step, the material of the protective adhesive layer 70 includes: epoxy resin, polyurethane or silicone. Then, the process proceeds to step B6.

[0103] Please combine Fig. 9 and Figure 9f In step B6, the chip-on-film 80 is bonded to the third pad 60. The flexible circuit board 90 is bonded to the chip-on-film 80. Then, the process proceeds to step B7.

[0104] See also Fig. 9 In step B7, the sealing layer 302 encapsulates the light emitting device 301. In this step, the material of the sealing layer 302 includes: silica gel or epoxy resin.

[0105] In this way, the preparation of the display panel 300 is completed.

[0106] The above is a detailed introduction to a driving substrate and a display panel provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A driving substrate, comprising a display area and a frame area located on at least one side of the display area, characterized in that: include: A substrate, the substrate comprising a first surface and a second surface, the first surface and the second surface being arranged opposite to each other; A first pad, which is disposed on the first surface and corresponds to the frame area; a second pad, the second pad being disposed on the second surface and corresponding to the frame area; as well as A wire connection structure, wherein the wire connection structure corresponds to the frame area, one end of the wire connection structure is welded to the first pad, and the other end of the wire connection structure is welded to the second pad; The wire connection structure includes a first wire, a second wire and a connecting pad; the substrate includes a third surface; the third surface connects the first surface and the second surface and is located between the first surface and the second surface; the connecting pad is arranged on the third surface; the first wire is connected to the first pad and the connecting pad; the second wire is connected to the second pad and the connecting pad.

2. The driving substrate according to claim 1, characterized in that: The first pad and the second pad are overlapped.

3. The driving substrate according to claim 1, characterized in that: The area of ​​the binding surface of the connecting pad is larger than the area of ​​the binding surface of the first pad.

4. The driving substrate according to claim 3, characterized in that: The length of the first conductive line is the same as the length of the second conductive line.

5. The driving substrate according to claim 4, characterized in that: The third surface is concavely provided with a groove, and the connecting pad is arranged in the groove; the binding surfaces of the first pad and the second pad are both flush with the third surface.

6. The driving substrate according to claim 1, characterized in that: The driving substrate further comprises a protective adhesive layer, and the protective adhesive layer encapsulates the wire connection structure.

7. A driving substrate, comprising a display area and a frame area located at at least one side of the display area, characterized in that: include: A substrate, the substrate comprising a first surface and a second surface, the first surface and the second surface being arranged opposite to each other; A first pad, which is disposed on the first surface and corresponds to the frame area; a second pad, the second pad being disposed on the second surface and corresponding to the frame area; as well as A wire connection structure, wherein the wire connection structure corresponds to the frame area, one end of the wire connection structure is welded to the first pad, and the other end of the wire connection structure is welded to the second pad; The wire connection structure includes a connecting wire; one end of the connecting wire is connected to the first pad, and the other end of the connecting wire is connected to the second pad.

8. The driving substrate according to claim 7, characterized in that: The substrate comprises a third surface, the third surface connects the first surface and the second surface and is located between the first surface and the second surface; the third surface is concavely provided with a recessed groove, and the connecting wire is arranged in the recessed groove.

9. The driving substrate according to claim 7, characterized in that: The driving substrate further comprises a protective adhesive layer, and the protective adhesive layer encapsulates the wire connection structure.

10. A display panel, characterized in that: The invention comprises a light emitting device and a driving substrate as claimed in any one of claims 1 to 9, wherein the light emitting device is arranged on the driving substrate.

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